JP3936217B2 - RF-ID media and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an RF-ID medium capable of writing and reading information in a non-contact state and a manufacturing method thereof.
[0002]
[Prior art]
In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag.
[0003]
In such information management using a card, label, or tag, a non-contact type IC equipped with an IC capable of writing and reading information in a non-contact state with respect to the card, label, or tag. Cards, non-contact type IC labels, and non-contact type IC tags are rapidly spreading due to their excellent convenience.
[0004]
6A and 6B are diagrams showing an example of the structure of a general non-contact type IC tag. FIG. 6A is a diagram showing an internal structure, and FIG. 6B is a cross-sectional view taken along the line AA ′ shown in FIG. It is.
[0005]
As shown in FIG. 6, the non-contact type IC tag in this conventional example has an IC module 511 that can write and read information from the outside on a resin sheet 515 via an adhesive 516 and is connected to the non-contact type IC tag. A current is supplied to the IC module 511 by electromagnetic induction from an information writing / reading device (not shown) provided outside and connected to the IC module 511 via the terminal 514, and information is written to and read from the IC module 511. Are stacked on the surface of the inlet 510 on which the IC module 511 is mounted via an adhesive layer 550, and the IC module 511 and the antenna 512 are stacked. And a top sheet 520 on which information is printed. To have.
[0006]
In the non-contact type IC tag 500 configured as described above, the IC module 511 is connected from the antenna 512 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Is supplied to the IC module 511 from the information writing / reading device, and the information written in the IC module 511 is read by the information writing / reading device in a non-contact state. .
[0007]
A method for manufacturing the non-contact type IC tag 500 as described above will be described below.
[0008]
FIG. 7 is a diagram for explaining a method of manufacturing the non-contact type IC tag 500 shown in FIG.
[0009]
First, the coil-shaped antenna 512 is formed on the resin sheet 515 by etching, printing, or the like (FIG. 7A).
[0010]
Next, the IC module 511 is mounted on the resin sheet 515 via the adhesive 516 containing conductive particles so that the connection terminal 514 of the IC module 511 contacts the connection portion of the antenna 512 with the IC module 511. (FIG. 7B).
[0011]
Next, by heating the IC module 511 while applying a predetermined pressure, the IC module 511 and the resin sheet 515 are bonded by the adhesive 516, and the connection terminal 514 provided on the back surface of the IC module 511 is attached. Then, the antenna 512 and the IC module 511 are electrically connected to complete the inlet 510 (FIG. 7C). Here, the adhesive 516 includes minute conductive particles, and the adhesive 516 alone does not have conductivity, and only those in contact with each other through the conductive particles conduct. Therefore, the antenna 512 and the connection terminal 514 are brought into conduction.
[0012]
Thereafter, the top sheet 520 is laminated on the inlet 510 via the adhesive layer 550 to complete the non-contact type IC tag 500 (FIG. 7D).
[0013]
[Problems to be solved by the invention]
In general, in an RF-ID medium in which an IC module is mounted on a resin sheet on which an antenna is formed so as to be connected to the antenna via a connection terminal, as in the non-contact type IC tag described above, When the lower surface of the IC module comes into contact with the IC module, the insulating film provided on the lower surface of the IC module may be destroyed, or the circuit portion in the IC module may come into contact with the antenna and short-circuit. Therefore, when an IC module is mounted on a resin sheet, it is necessary to form a predetermined gap between the IC module and the resin sheet.
[0014]
In the conventional non-contact type IC tag manufacturing method as described above, a predetermined pressure is applied between the IC module and the resin sheet by controlling the pressure applied to the IC module in order to connect the IC module and the antenna. However, since the pressure applied to the IC module in that case is as small as several tens to hundreds of grams, it is difficult to control the pressure. is there. For example, when the IC module and the antenna are connected using a mounting head that applies a predetermined pressure to the IC module from the surface opposite to the surface facing the resin sheet of the IC module, the friction of the driving portion of the mounting head Pressure control must be performed in consideration of resistance and the like. Here, when a pressure exceeding a predetermined value is applied to the IC module, a gap is not formed between the IC module and the resin sheet, and the IC module may be destroyed.
[0015]
In addition, the connection terminal of the IC module is displaced in shape so as to be crushed when pressure is applied to the IC module and connected to the antenna. However, the height and shape of the connection terminal vary from IC module to IC module. Therefore, if the pressure control for the IC module is kept constant, the amount of the gap formed between the IC module and the resin sheet cannot be made constant, which may cause mounting failure. .
[0016]
Also, a manufacturing method is used in which a predetermined amount of gap is formed between the IC module and the resin sheet by controlling the stop position of the mounting head when pressure is applied to the IC module using the mounting head. However, in the manufacturing method, if the flatness of the base plate on which the resin sheet is mounted is not excellent when manufacturing the RF-ID media, the gap between the mounting head stop position and the base plate varies. As a result, the amount of the gap formed between the IC module and the resin sheet cannot be made constant, and there is a possibility that a mounting failure may occur.
[0017]
In addition, even when a predetermined amount of gap is formed between the IC module and the resin sheet, an external force is applied to the IC module, so that the antenna and the lower surface of the IC module come into contact with each other, and are provided on the lower surface of the IC module. There is a possibility that the formed insulating film may be destroyed, or a circuit portion in the IC module may come into contact with the antenna and be short-circuited.
[0018]
The present invention has been made in view of the problems of the prior art as described above, and an IC module is connected to an antenna via a connection terminal on a base substrate on which the antenna is formed. In the RF-ID media on which the IC module is mounted, a certain amount of gap can be easily formed between the base substrate and the IC module, and even when an external force is applied on the IC module, To provide an RF-ID medium capable of preventing an insulating film provided on a lower surface from being broken or a circuit portion in an IC module from being short-circuited by contact with an antenna, and a method for manufacturing the same. With the goal.
[0019]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides:
An electrically conductive antenna is formed on the base sheet, and an IC module having a connection terminal for connecting to the antenna and capable of writing and reading information is connected to the antenna through the connection terminal. Base substrate that is mounted on the base sheet And the interposition between the IC module and the base sheet in a region where the connection terminal and the antenna are not provided, and is thicker than the antenna, and the thickness of the antenna and the length of the connection terminal A regulating member having a thickness thinner than the sum of Comprising at least The IC module and the regulating member are bonded to the base sheet with an adhesive, In the RF-ID media in which information is written to and read from the IC module via the antenna in a non-contact state,
A hole is formed in a region of the base sheet that contacts the restriction member, or a surface of the restriction member that contacts the base sheet. It is characterized by that.
[0020]
Also, The adhesive has conductive particles. ,
The regulating member has a thickness greater than the sum of the thickness of the antenna and the diameter of the conductive particles.
[0021]
The restricting member may have a shape that covers the entire area of the base sheet where the IC module is mounted, where the antenna is not provided.
[0022]
Also, a method for manufacturing the RF-ID media,
Attaching the regulating member to the mounting surface of the IC module with respect to the base sheet;
A step of mounting the IC module to which the restriction member is attached on the base sheet;
Connecting the connection member and the antenna by applying pressure in a direction toward the base sheet to the IC module mounted on the base sheet.
[0023]
Also, a method for manufacturing the RF-ID media,
Mounting the restriction member on the mounting surface of the IC module of the base sheet;
Mounting the IC module on a base sheet on which the regulating member is mounted;
Connecting the connection member and the antenna by applying pressure in a direction toward the base sheet to the IC module mounted on the base sheet.
[0024]
Further, the step of attaching the restriction member to the mounting surface of the IC module with respect to the base sheet is performed when the IC module is attached to a wafer on which a plurality of the IC modules are arranged and the surface on which the connection terminals of the wafer are provided. A regulating member sheet having an opening that exposes the connection terminal is bonded to the surface on which the connection terminal is provided, and the bonded wafer sheet and the regulating member sheet are attached to each IC module. It is characterized by being performed by cutting.
[0025]
(Function)
In the present invention configured as described above, in order to connect the connecting member of the IC module mounted on the base sheet and the antenna formed on the base sheet, in the direction toward the base sheet with respect to the IC module. When pressure is applied, the shape of the connection terminal is deformed, and the distance between the IC module and the base sheet is reduced accordingly. However, a connection terminal and an antenna are provided between the IC module and the base sheet. Since a regulating member having a thickness that is thicker than the antenna and thinner than the sum of the antenna thickness and the length of the connection terminal is interposed in the area not provided, the distance between the IC module and the base sheet However, the connection member and the antenna are connected to each other, and the IC module and the antenna are restricted to a certain distance so as not to contact each other.
[0026]
In addition, when an external force is applied to the IC module, the displacement of the IC module toward the base sheet is restricted by the regulating member. Therefore, even when an external force is applied to the IC module, the IC module is provided on the lower surface of the IC module. It is possible to prevent the formed insulating film from being broken or the circuit portion in the IC module from coming into contact with the antenna and being short-circuited.
[0027]
Further, when the IC module is bonded to the base sheet with an adhesive having conductive particles, if the thickness of the regulating member is thicker than the sum of the antenna thickness and the diameter of the conductive particles, the IC Even when conductive particles enter between the module and the base sheet, the circuit in the IC module and the antenna are not short-circuited.
[0028]
Further, if the restricting member has a shape that covers the entire area of the base sheet where the IC module is mounted, the area where the antenna is not provided, the IC module can be more reliably damaged or the circuit can be short-circuited. To be prevented.
[0029]
In addition, when the restriction member is attached to the mounting surface of the base sheet of the IC module, the connection terminal is attached when the IC module is attached to a surface on which a plurality of IC modules are arranged and the connection terminal of the wafer. If the regulation member sheet having an opening that is exposed is bonded to the surface provided with the connection terminals, and the bonded wafer and the regulation member sheet are cut for each IC module, the IC is obtained. The restriction member can be easily attached to the module.
[0030]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0031]
FIG. 1 is a diagram showing an example of a non-contact type IC tag which is an embodiment of the RF-ID media of the present invention, (a) is a diagram showing the internal structure, and (b) is shown in (a). It is AA 'sectional drawing.
[0032]
In this embodiment, as shown in FIG. 1, an IC module 111 capable of writing and reading information from the outside is mounted on a resin sheet 115 as a base sheet via an adhesive 116, and a connection terminal 114 is provided. The IC module 111 is connected to the IC module 111 through an electromagnetic induction from an information writing / reading device (not shown) provided outside, and current is supplied to the IC module 111 to read and write information to and from the IC module 111 in a non-contact manner. An inlet 110, which is a base substrate on which a conductive antenna 112 for performing in a state is formed, and a surface of the inlet 110 on which the IC module 111 is mounted are stacked via an adhesive layer 150, and the IC module 111 and A top sheet 120 that protects the antenna 112 and has information printed on its surface. It is configured. Further, the surface of the IC module 111 facing the resin sheet 115 is a region where the connection terminals 114 are not provided, and a region where the IC module 111 is mounted on the resin sheet 115 and does not face the antenna 112. A spacer 113 is provided as a regulating member that regulates the distance between the IC module 111 and the resin sheet 115, and the spacer 113 comes into contact with the surface of the resin sheet 115, whereby the distance between the IC module 111 and the resin sheet 115. Is regulated.
[0033]
In the non-contact type IC tag 100 configured as described above, the IC module 111 is connected to the IC module 111 from the antenna 112 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Is supplied to the IC module 111 from the information writing / reading device, and the information writing / reading device is read by the information writing / reading device in a non-contact state. .
[0034]
Hereinafter, a method for manufacturing the non-contact type IC tag 100 as described above will be described.
[0035]
FIG. 2 is a diagram for explaining an example of a manufacturing method of the non-contact type IC tag 100 shown in FIG.
[0036]
First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching or printing (FIG. 2A).
[0037]
Next, the IC module 111 is mounted on the resin sheet 115 through the adhesive 116 containing conductive particles so that the connection terminal 114 of the IC module 111 abuts the connection portion of the antenna 112 with the IC module 111. (FIG. 2 (b)).
[0038]
Here, the IC module 111 is configured by cutting a wafer composed of a plurality of IC modules 111, and the spacer 113 provided on the surface of the IC module 111 facing the resin sheet is an IC module. 111 is affixed to the IC module 111 in a pre-process for cutting from the wafer.
[0039]
FIGS. 3A and 3B are diagrams for explaining a process of attaching the spacer 113 to the IC module 111 shown in FIG. 1. FIG. 3A is a view showing a wafer composed of a plurality of IC modules 111, and FIG. The figure which shows the spacer sheet affixed on the wafer shown to (c), the figure which shows the state which affixed the spacer sheet shown to (b) to the wafer shown to (a), (d) to (c) It is a figure which shows the state where the shown wafer was cut | disconnected for every IC module 111. FIG.
[0040]
In this embodiment, first, a spacer sheet 103 as shown in FIG. 3B is provided on the surface on which the connection terminals 114 of the wafer 101 composed of a plurality of IC modules 111 as shown in FIG. Affix it. Here, in the spacer sheet 103, an opening 104 is formed so that the connection terminal 114 is exposed when the spacer sheet 103 is affixed to the wafer 101, whereby the connection of the wafer 101 as shown in FIG. When the spacer sheet 103 as shown in FIG. 3B is attached to the surface on which the terminals 114 are provided, the connection terminals 114 provided on the wafer 101 are connected to the spacer sheet 103 as shown in FIG. It is exposed from the opening 104.
[0041]
Thereafter, when the wafer 101 with the spacer sheet 103 attached is cut by a dicing cutter or the like for each IC module 111, the connection terminals 114 are provided on the surface provided with the connection terminals 114 as shown in FIG. The IC module 111 in which the spacer 113 is pasted in the area that is not formed is completed.
[0042]
Next, when pressure is applied to the IC module 111 in a heated state, the shape of the connection terminal 114 provided on the back surface of the IC module 111 is displaced, and the antenna 112 and the IC module are connected via the connection terminal 114. 111 is electrically connected, and the IC module 111 and the resin sheet 115 are bonded together by the adhesive 116 to complete the inlet 110 (FIG. 2C). Here, when pressure is applied to the IC module 111, the distance between the IC module 111 and the resin sheet 115 becomes narrow with the displacement of the shape of the connection terminal 114. Thereafter, when the spacer 113 affixed to the back surface of the IC module 111 comes into contact with the resin sheet 115 and the pressing force on the IC module 111 reaches a predetermined value, the pressing on the IC chip 111 is terminated. As a result, the distance between the IC module 111 and the resin sheet 115 is regulated by the thickness of the spacer 113.
[0043]
The spacer 113 has such a shape that its thickness is larger than the thickness of the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. Therefore, the interval between the IC module 111 and the resin sheet 115 regulated by the spacer 113 is such that the lower surface of the IC module 111 is not in contact with the antenna 112 and the connection terminal 114 can be connected to the antenna 112. Become. The material of the spacer 113 is preferably a polyimide film or the like that does not adversely affect the dicing cutter or the like when the spacer sheet 103 is cut, and has no thermal expansion or thermoplasticity.
[0044]
In addition, the adhesive 116 includes minute conductive particles, and the adhesive 116 alone does not have conductivity, and only those that come in contact through the conductive particles conduct. The antenna 112 and the connection terminal 114 are electrically connected. For this reason, when conductive particles enter between the lower surface of the IC module 111 and the antenna 112, the circuit in the IC module 111 and the antenna 112 may be short-circuited. Therefore, if the thickness of the spacer 113 is made larger than the sum of the thickness of the antenna 112 and the diameter of the conductive particles, even when the conductive particles enter between the lower surface of the IC module 111 and the antenna 112, the IC module The circuit in 111 and the antenna 112 are not short-circuited. As the conductive particles, for example, particles having a diameter of 5 μm are used. In this case, the thickness of the spacer 113 may be larger than the thickness of the antenna 112 plus 5 μm.
[0045]
Thereafter, the surface sheet 120 is laminated on the inlet 110 via the adhesive layer 150 to complete the non-contact type IC tag 100 (FIG. 2D).
[0046]
In the non-contact type IC tag 100 manufactured by the above-described manufacturing method, the thickness is thicker than the thickness of the antenna 112 and is thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. Since the gap between the IC module 111 and the resin sheet 115 is regulated by the spacer 113 having a simple shape, the gap between the IC module 111 and the resin sheet 115 is constant regardless of the pressing force on the IC module 111, The distance between the IC module 111 and the resin sheet 115 does not vary depending on the height and shape of the connection terminal 114 of the IC module 111.
[0047]
Further, since the distance between the IC module 111 and the resin sheet 115 is regulated by the thickness of the spacer 113, even when the flatness of the base plate (not shown) on which the resin sheet 115 is mounted is not excellent. The interval between the IC module 111 and the resin sheet 115 can be made constant.
[0048]
Further, when an external force is applied to the IC module 111, the displacement of the IC module 111 toward the resin sheet 115 is restricted by the spacer 113. Therefore, even when an external force is applied to the IC module 111, the IC module It is possible to prevent the insulating film provided on the lower surface of 111 from being broken or the circuit portion in the IC module 111 from coming into contact with the antenna 112 and being short-circuited.
[0049]
In the manufacturing method described above, the spacer 113 is pasted on the back surface of the IC module 111 and the IC module 111 on which the spacer 113 is pasted is mounted on the resin sheet 115. It is also conceivable that the IC module 111 is mounted on the resin sheet 115 on which the spacer 113 is mounted after the 113 is mounted.
[0050]
FIG. 4 is a diagram for explaining another example of the method of manufacturing the non-contact type IC tag 100 shown in FIG.
[0051]
First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching or printing (FIG. 4A).
[0052]
Next, the spacer 113 is mounted on the resin sheet 115 in the region where the IC module 111 is mounted and the region where the antenna 112 is not formed via the adhesive 116 containing conductive particles (see FIG. 4 (b)).
[0053]
Next, the IC module 111 is mounted on the resin sheet 115 so that the connection terminal 114 of the IC module 111 comes into contact with the connection portion of the antenna 112 with the IC module 111 (FIG. 4C).
[0054]
Next, when pressure is applied to the IC module 111 in a heated state, the shape of the connection terminal 114 provided on the back surface of the IC module 111 is displaced, and the antenna 112 and the IC module are connected via the connection terminal 114. 111 is electrically connected, and the IC module 111 and the resin sheet 115 are bonded together by the adhesive 116 to complete the inlet 110 (FIG. 4D). Here, when pressure is applied to the IC module 111, the distance between the IC module 111 and the resin sheet 115 becomes narrow with the displacement of the shape of the connection terminal 114. Thereafter, when the spacer 113 mounted on the resin sheet 115 comes into contact with the lower surface of the IC module 111 and the pressing force on the IC module 111 reaches a predetermined value, the pressing on the IC chip 111 is terminated. As a result, the distance between the IC module 111 and the resin sheet 115 is regulated by the thickness of the spacer 113.
[0055]
The spacer 113 has such a shape that its thickness is larger than the thickness of the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. Therefore, the interval between the IC module 111 and the resin sheet 115 regulated by the spacer 113 is such that the lower surface of the IC module 111 is not in contact with the antenna 112 and the connection terminal 114 can be connected to the antenna 112. Become.
[0056]
Thereafter, the surface sheet 120 is laminated on the inlet 110 via the adhesive layer 150 to complete the non-contact type IC tag 100 (FIG. 4E).
[0057]
Also in the non-contact type IC tag 100 manufactured by the above-described manufacturing method, the thickness thereof is thicker than the thickness of the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. Since the gap between the IC module 111 and the resin sheet 115 is regulated by the spacer 113 having a simple shape, the gap between the IC module 111 and the resin sheet 115 is constant regardless of the pressing force on the IC module 111, The distance between the IC module 111 and the resin sheet 115 does not vary depending on the height and shape of the connection terminal 114 of the IC module 111.
[0058]
Further, since the distance between the IC module 111 and the resin sheet 115 is regulated by the thickness of the spacer 113, even when the flatness of the base plate (not shown) on which the resin sheet 115 is mounted is not excellent. The interval between the IC module 111 and the resin sheet 115 can be made constant.
[0059]
Further, when an external force is applied to the IC module 111, the displacement of the IC module 111 toward the resin sheet 115 is restricted by the spacer 113. Therefore, even when an external force is applied to the IC module 111, the IC module It is possible to prevent the insulating film provided on the lower surface of 111 from being broken or the circuit portion in the IC module 111 from coming into contact with the antenna 112 and being short-circuited.
[0060]
(Other embodiments)
FIG. 5 is a diagram showing an example of a non-contact type IC tag which is another embodiment of the RF-ID medium of the present invention, where (a) is a diagram showing an internal structure, and (b) is a diagram in (a). It is AA 'sectional drawing shown.
[0061]
In this embodiment, as shown in FIG. 5, an IC module 211 capable of writing and reading information from the outside is mounted on a resin sheet 215 as a base sheet via an adhesive 216, and a connection terminal 214 is provided. The IC module 211 is connected to the IC module 211 through an electromagnetic induction from an information writing / reading device (not shown) provided outside, and current is supplied to the IC module 211 in a non-contact manner. An inlet 210 which is a base substrate on which a conductive antenna 212 for performing in a state is formed, and an IC module 211 of the inlet 210 are stacked on the surface on which the IC module 211 is mounted via an adhesive layer 250, and the IC module 211 and A top sheet 220 that protects the antenna 212 and has information printed on its surface. It is configured. Further, the surface of the IC module 211 that faces the resin sheet 215 is a region where the connection terminal 214 is not provided, and the entire region that does not face the antenna 212 when the IC module 211 is mounted on the resin sheet 215. In addition, a spacer 213 that is a regulating member that regulates the distance between the IC module 211 and the resin sheet 215 is provided. When the spacer 213 comes into contact with the surface of the resin sheet 215, the IC module 211 and the resin sheet 215 are separated from each other. Spacing is regulated. Note that the spacer 213 has a shape that is thicker than the antenna 212 and thinner than the sum of the thickness of the antenna 212 and the length of the connection terminal 214.
[0062]
In the non-contact type IC tag 200 configured as described above, the IC module 211 is connected from the antenna 212 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Is supplied to the IC module 211 from the information writing / reading device, and the information writing / reading device is read by the information writing / reading device in a non-contact state. .
[0063]
Since the non-contact type IC tag 200 in this embodiment is also manufactured by the manufacturing method having the steps as shown in FIG. 2 or FIG. 4, the thickness thereof is larger than the thickness of the antenna 212 and the antenna 212. The distance between the IC module 211 and the resin sheet 215 is regulated by the spacer 213 having a shape that is thinner than the sum of the thickness of the connection terminal 214 and the length of the connection terminal 214. The distance between the IC module 211 and the resin sheet 215 does not vary depending on the height and shape of the connection terminal 214 of the IC module 211.
[0064]
Further, since the distance between the IC module 211 and the resin sheet 215 is regulated by the thickness of the spacer 213, even when the flatness of the base plate (not shown) on which the resin sheet 215 is mounted is not excellent. The interval between the IC module 211 and the resin sheet 215 can be made constant.
[0065]
Further, when an external force is applied to the IC module 211, the displacement of the IC module 211 toward the resin sheet 215 is restricted by the spacer 213. Therefore, even when an external force is applied to the IC module 211, the IC module It is possible to prevent the insulating film provided on the lower surface of 211 from being broken or the circuit portion in the IC module 211 from coming into contact with the antenna 212 and being short-circuited.
[0066]
In the adhesives 116 and 216 for bonding the IC modules 111 and 211 and the resin sheets 115 and 215 described above, the spacers 113 and 213 and the resin sheets 115 and 215 need to be bonded. , 213 are preferable.
[0067]
In addition, if at least one, preferably a plurality of fine holes are formed in a region of the resin sheets 115 and 215 that contacts the spacers 113 and 213 or a surface of the spacers 113 and 213 that contacts the resin sheets 115 and 215. When the spacers 113 and 213 are mounted on the resin sheets 115 and 215, the adhesives 116 and 216 interposed between the spacers 113 and 213 and the resin sheets 115 and 215 are guided to the holes, thereby The adhesion between the spacers 113 and 213 and the resin sheets 115 and 215 can be enhanced.
[0068]
In the above-described embodiment, a non-contact IC tag has been described as an example of an RF-ID medium that can write and read information in a non-contact state. Not only tags, but non-contact type IC labels, non-contact type IC cards, etc., as long as the IC module is configured to include an inlet mounted so as to be connected to an antenna via a connection terminal. Can do.
[0069]
【The invention's effect】
As described above, in the present invention, there is provided an IC module in which an antenna having conductivity is formed on a base sheet, and has a connection terminal for connecting to the antenna, and can write and read information. RF-ID comprising at least a base substrate mounted on a base sheet so as to be connected to an antenna by a connection terminal, and writing and reading information to and from an IC module through the antenna in a non-contact state In the media, the area between the IC module and the base sheet where the connection terminal and the antenna are not provided is thicker than the antenna thickness and thinner than the sum of the antenna thickness and the connection terminal length. Since the restricting member having a gap is interposed between the IC module and the base sheet, the connecting member The distance between the IC module and the base sheet is made constant regardless of the pressing force on the IC module. In addition, even when an external force is applied to the IC module, the insulating film provided on the lower surface of the IC module may be destroyed, or the circuit part in the IC module may be in contact with the antenna and short-circuited. It can be prevented from being trapped.
[0070]
Further, in the case where the IC module is bonded to the base sheet with an adhesive having conductive particles, and the thickness of the regulating member is larger than the sum of the antenna thickness and the diameter of the conductive particles, the IC module and the base sheet Even when conductive particles enter between the two, the circuit in the IC module and the antenna are not short-circuited.
[0071]
Further, in the case where the shape of the regulating member is such that the entire surface of the area where the IC module of the base sheet is mounted is not provided with the antenna, the IC module is further damaged or the circuit is short-circuited. It can be surely prevented.
[0072]
In addition, when the restriction member is attached to the mounting surface of the base sheet of the IC module, the connection terminal is attached when the IC module is attached to a surface on which a plurality of IC modules are arranged and the connection terminal of the wafer. In what is performed by pasting the regulating member sheet having an opening that is exposed on the surface provided with the connection terminals, and cutting the bonded wafer and the regulating member sheet for each IC module The regulation member can be easily attached to the IC module.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of a non-contact type IC tag which is an embodiment of an RF-ID media of the present invention, (a) is a diagram showing an internal structure, and (b) is shown in (a). It is AA 'sectional drawing.
FIG. 2 is a diagram for explaining an example of a manufacturing method of the non-contact type IC tag shown in FIG.
3A and 3B are diagrams for explaining a spacer attaching process to the IC module shown in FIG. 1, wherein FIG. 3A is a view showing a wafer composed of a plurality of IC modules, and FIG. 3B is a view shown in FIG. The figure which shows the spacer sheet affixed on a wafer, (c) is the figure which shows the state which affixed the spacer sheet shown in (b) to the wafer shown in (a), (d) is the wafer shown in (c) It is a figure which shows the state cut | disconnected for every IC module.
4 is a view for explaining another example of the method for manufacturing the non-contact type IC tag shown in FIG. 1. FIG.
FIGS. 5A and 5B are diagrams showing an example of a non-contact type IC tag according to another embodiment of the RF-ID medium of the present invention, FIG. 5A is a diagram showing an internal structure, and FIG. It is AA 'sectional drawing shown.
6A and 6B are diagrams showing an example of the structure of a general non-contact type IC tag, where FIG. 6A is a diagram showing an internal structure, and FIG. 6B is a cross-sectional view taken along the line AA ′ shown in FIG. It is.
7 is a view for explaining a method of manufacturing the non-contact type IC tag shown in FIG. 6. FIG.
[Explanation of symbols]
101 wafers
103 Spacer sheet
104 opening
100,200 Non-contact IC tag
110,210 Inlet
111, 211 IC module
112, 212 Antenna
113,213 Spacer
114, 214 connection terminal
115,215 resin sheet
116,216 Adhesive
120,220 Surface sheet
150,250 Adhesive layer

Claims (7)

An electrically conductive antenna is formed on the base sheet, and an IC module having a connection terminal for connecting to the antenna and capable of writing and reading information is connected to the antenna through the connection terminal. The base substrate mounted on the base sheet, and the interposition between the IC module and the base sheet in the region where the connection terminal and the antenna are not provided, the thickness of the antenna And at least a regulating member having a thickness smaller than the sum of the thickness of the antenna and the length of the connection terminal, and the IC module and the regulating member are bonded to the base sheet with an adhesive. is, writing and reading of information for the IC module via the antenna performed in a non-contact state In the RF-ID media that,
An RF-ID medium , wherein a hole is formed in a region of the base sheet in contact with the restriction member or a surface of the restriction member in contact with the base sheet . The RF-ID medium according to claim 1,
The adhesive has conductive particles ,
The RF-ID medium according to claim 1, wherein the regulating member has a thickness greater than a sum of a thickness of the antenna and a diameter of the conductive particles. In the RF-ID media according to claim 1 or 2,
The RF-ID medium, wherein the regulating member has a shape that covers the entire area of the base sheet where the IC module is mounted, where the antenna is not provided. It is a manufacturing method of RF-ID media given in any 1 paragraph of Claims 1 thru / or 3,
Attaching the regulating member to the mounting surface of the IC module with respect to the base sheet;
A step of mounting the IC module to which the restriction member is attached on the base sheet;
An RF-ID medium comprising: a step of connecting the connection member and the antenna by applying pressure in a direction toward the base sheet to the IC module mounted on the base sheet. Production method. It is a manufacturing method of RF-ID media given in any 1 paragraph of Claims 1 thru / or 3,
Mounting the restriction member on the mounting surface of the IC module of the base sheet;
Mounting the IC module on a base sheet on which the regulating member is mounted;
An RF-ID medium comprising: a step of connecting the connection member and the antenna by applying pressure in a direction toward the base sheet to the IC module mounted on the base sheet. Production method. In the manufacturing method of RF-ID media of Claim 4,
The step of attaching the regulating member to the mounting surface of the IC module with respect to the base sheet is performed when the IC module is attached to a surface on which a plurality of the IC modules are arranged and the surface on which the connection terminals of the wafer are provided. A regulating member sheet having an opening that exposes the connection terminal is bonded to the surface on which the connection terminal is provided, and the bonded wafer sheet and the regulating member sheet are cut for each IC module. A method for producing an RF-ID medium, characterized in that An electrically conductive antenna is formed on the base sheet, and an IC module having a connection terminal for connecting to the antenna and capable of writing and reading information is connected to the antenna through the connection terminal. The base substrate mounted on the base sheet, and the interposition between the IC module and the base sheet in the region where the connection terminal and the antenna are not provided, the thickness of the antenna And at least a regulating member having a thickness smaller than the sum of the thickness of the antenna and the length of the connection terminal, and writing / reading of information to / from the IC module via the antenna is not performed. In the manufacturing method of RF-ID media performed in a contact state There,
  Attaching the regulating member to the mounting surface of the IC module with respect to the base sheet;
  A step of mounting the IC module to which the restriction member is attached on the base sheet;
  Connecting the connection member and the antenna by applying pressure in a direction toward the base sheet to the IC module mounted on the base sheet;
  The step of attaching the regulating member to the mounting surface of the IC module with respect to the base sheet is performed when the IC module is attached to a surface on which a plurality of the IC modules are arranged and the surface on which the connection terminals of the wafer are provided. A regulating member sheet having an opening that exposes the connection terminal is bonded to the surface on which the connection terminal is provided, and the bonded wafer sheet and the regulating member sheet are cut for each IC module. A method for producing an RF-ID medium, characterized in that

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