JP4040341B2 - Method for manufacturing RF-ID media - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an RF-ID medium capable of writing and reading information in a non-contact state.
[0002]
[Prior art]
In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag.
[0003]
In such information management using a card, label, or tag, a non-contact type IC equipped with an IC capable of writing and reading information in a non-contact state with respect to the card, label, or tag. Cards, non-contact type IC labels, and non-contact type IC tags are rapidly spreading due to their excellent convenience.
[0004]
5A and 5B are diagrams showing an example of the structure of a general non-contact type IC tag. FIG. 5A is a diagram showing an internal structure, and FIG. 5B is a cross-sectional view taken along the line AA ′ shown in FIG. It is.
[0005]
As shown in FIG. 5, the non-contact type IC tag in this conventional example has an IC module 511 that can write and read information from the outside on a resin sheet 515 via an adhesive 516 and is connected to the non-contact type IC tag. A current is supplied to the IC module 511 by electromagnetic induction from an information writing / reading device (not shown) provided outside and connected to the IC module 511 via the terminal 514, and information is written to and read from the IC module 511. Are stacked on the surface of the inlet 510 on which the IC module 511 is mounted via the adhesive layer 550, and the IC module 511 and the antenna 512 are stacked. And a top sheet 520 on which information is printed. To have.
[0006]
In the non-contact type IC tag 500 configured as described above, the IC module 511 is connected from the antenna 512 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Is supplied to the IC module 511 from the information writing / reading device, and the information written in the IC module 511 is read by the information writing / reading device in a non-contact state. .
[0007]
A method for manufacturing the non-contact type IC tag 500 as described above will be described below.
[0008]
FIG. 6 is a diagram for explaining a method of manufacturing the non-contact type IC tag 500 shown in FIG.
[0009]
First, the coil-shaped antenna 512 is formed on the resin sheet 515 by etching, printing, or the like (FIG. 6A).
[0010]
Next, the IC module 511 is mounted on the resin sheet 515 via the adhesive 516 containing conductive particles so that the connection terminal 514 of the IC module 511 contacts the connection portion of the antenna 512 with the IC module 511. (FIG. 6B).
[0011]
Next, by heating the IC module 511 while applying a predetermined pressure, the IC module 511 and the resin sheet 515 are bonded by the adhesive 516, and the connection terminal 514 provided on the back surface of the IC module 511 is attached. Then, the antenna 512 and the IC module 511 are electrically connected to complete the inlet 510 (FIG. 6C). Here, the adhesive 516 includes minute conductive particles, and the adhesive 516 alone does not have conductivity, and only those in contact with each other through the conductive particles conduct. Therefore, the antenna 512 and the connection terminal 514 are brought into conduction.
[0012]
Thereafter, the top sheet 520 is laminated on the inlet 510 via the adhesive layer 550 to complete the non-contact type IC tag 500 (FIG. 6D).
[0013]
[Problems to be solved by the invention]
In general, in an RF-ID medium in which an IC module is mounted on a resin sheet on which an antenna is formed so as to be connected to the antenna via a connection terminal, as in the non-contact type IC tag described above, When the lower surface of the IC module comes into contact with the IC module, the insulating film provided on the lower surface of the IC module may be destroyed, or the circuit portion in the IC module may come into contact with the antenna and short-circuit. Therefore, when an IC module is mounted on a resin sheet, it is necessary to form a predetermined gap between the IC module and the resin sheet.
[0014]
In the conventional non-contact type IC tag manufacturing method as described above, a predetermined pressure is applied between the IC module and the resin sheet by controlling the pressure applied to the IC module in order to connect the IC module and the antenna. However, since the pressure applied to the IC module in that case is as small as several tens to hundreds of grams, it is difficult to control the pressure. is there. For example, when the IC module and the antenna are connected using a mounting head that applies a predetermined pressure to the IC module from the surface opposite to the surface facing the resin sheet of the IC module, the friction of the driving portion of the mounting head Pressure control must be performed in consideration of resistance and the like. Here, when a pressure exceeding a predetermined value is applied to the IC module, a gap is not formed between the IC module and the resin sheet, and the IC module may be destroyed.
[0015]
In addition, the connection terminal of the IC module is displaced in shape so as to be crushed when pressure is applied to the IC module and connected to the antenna. However, the height and shape of the connection terminal vary from IC module to IC module. Therefore, if the pressure control for the IC module is kept constant, the amount of the gap formed between the IC module and the resin sheet cannot be made constant, which may cause mounting failure. .
[0016]
Also, a manufacturing method is used in which a predetermined amount of gap is formed between the IC module and the resin sheet by controlling the stop position of the mounting head when pressure is applied to the IC module using the mounting head. However, in the manufacturing method, if the flatness of the base plate on which the resin sheet is mounted is not excellent when manufacturing the RF-ID media, the gap between the mounting head stop position and the base plate varies. As a result, the amount of the gap formed between the IC module and the resin sheet cannot be made constant, and there is a possibility that a mounting failure may occur.
[0017]
The present invention has been made in view of the problems of the prior art as described above, and an IC module is connected to an antenna via a connection terminal on a base substrate on which the antenna is formed. An object of the present invention is to provide a method for manufacturing an RF-ID medium in which a certain amount of gap can be easily formed between a base substrate and an IC module.
[0018]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides:
By mounting an IC module capable of writing and reading information in a non-contact state via the antenna on a base substrate on which the antenna is formed so as to be connected to the antenna by pressing, an RF-ID medium An RF-ID media manufacturing method for manufacturing
Mounting the IC module on the base substrate so as to contact the antenna;
The IC module has a height equivalent to the height of the IC module relative to the surface of the base substrate when mounted in a state of being connected to the antenna on the base substrate, and contacts the IC module. A mounting head having a convex portion formed in a shape surrounding the IC module on a surface is disposed so that the IC module enters a space formed by the convex portion of the mounting head, and the convex portion is And a step of contacting the base substrate and pressing it with a predetermined pressure .
[0021]
(Function)
In the present invention configured as described above, an IC module that enables writing and reading of information in a non-contact state via the antenna is connected to the antenna by pressing on the base substrate on which the antenna is formed. When the RF-ID media is manufactured by mounting in such a manner, the mounting head is pressed against the area where the IC module is not mounted on the surface of the base substrate on which the IC module is mounted, The IC module is pressed onto the base substrate by the pressure generated between the mounting head and the IC module and the antenna are connected.
[0022]
Specifically, the mounting module has a height equivalent to the height of the IC module relative to the surface of the base substrate when the IC module is mounted in a state of being connected to the antenna on the base substrate. A mounting head having a convex portion formed in a shape surrounding the IC module on a surface in contact with the IC module is used, and the convex portion is provided in a predetermined area in a region where the IC module is not mounted on the surface on which the IC module of the base substrate is mounted. The IC module is pressed onto the base substrate by the pressure generated by the pressure, and the pressure generated between the IC module and the mounting head with the pressure, and the IC module and the antenna are connected.
[0023]
Also, the mounting head and a regulating member that regulates the distance between the contact surface of the mounting head with the IC module of the mounting head and the surface of the base substrate, and the IC module of the surfaces on which the IC module of the base substrate is mounted. The mounting head is pressed against the regulating member with a predetermined pressure, and the IC module is pressed onto the base substrate by the pressure generated between the IC module and the mounting head according to the pressure. Connect the module and antenna.
[0024]
Thus, since the target of the pressure applied to connect the IC module to the antenna on the base substrate is not the IC module but the base substrate or the regulating member, the IC module is mounted on the base substrate. The value of the pressure applied to connect to can be increased, and pressure control becomes easy.
[0025]
In addition, the height of the IC module with respect to the base substrate surface in a state where the IC module is mounted on the base substrate connected to the antenna is determined by the mounting head or the regulating member. The amount of the gap formed between the IC module and the base substrate when mounted in a state connected to the antenna on the substrate can be made constant.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0027]
FIG. 1 is a diagram showing an embodiment of a non-contact type IC tag manufactured by an RF-ID media manufacturing method according to the present invention, where (a) is a diagram showing an internal structure, and (b) is (a) It is sectional drawing in the AA 'part shown to).
[0028]
As shown in FIG. 1, the non-contact type IC tag in this embodiment has an IC module 111 capable of writing and reading information from the outside on a resin sheet 115 via an adhesive 116 and a connection terminal. The IC module 111 is connected to the IC module 111 via 114, current is supplied to the IC module 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and information is written to and read from the IC module 111. An IC module is formed by laminating an inlet 110, which is a base substrate on which a conductive antenna 112 is formed in a non-contact state, and an IC module 111 mounted on the inlet 110 via an adhesive layer 150. 111 and the front surface sheet 12 on which information is printed on the surface while protecting the antenna 112 and the antenna 112 It is composed of a.
[0029]
In the non-contact type IC tag 100 configured as described above, the IC module 111 is connected from the antenna 112 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Is supplied to the IC module 111 from the information writing / reading device, and the information writing / reading device is read by the information writing / reading device in a non-contact state. .
[0030]
Hereinafter, a method for manufacturing the non-contact type IC tag 100 as described above will be described.
[0031]
FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC tag 100 shown in FIG.
[0032]
First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching or printing (FIG. 2A).
[0033]
Next, the IC module 111 is mounted on the resin sheet 115 through the adhesive 116 containing conductive particles so that the connection terminal 114 of the IC module 111 abuts the connection portion of the antenna 112 with the IC module 111. (FIG. 2 (b)).
[0034]
Next, by heating the IC module 111 while applying pressure, the IC module 111 and the resin sheet 115 are bonded to each other with the adhesive 116, and via the connection terminals 114 provided on the back surface of the IC module 111. The antenna 112 and the IC module 111 are electrically connected to complete the inlet 110 (FIG. 2C). Note that the adhesive 116 includes minute conductive particles, and the adhesive 116 alone does not have conductivity, and only those that come in contact through the conductive particles conduct. The antenna 112 and the connection terminal 114 are electrically connected.
[0035]
Here, a process for applying pressure to the IC module 111 will be described in detail.
[0036]
FIG. 3 is a diagram for explaining an example of a process when pressure is applied to the IC module 111 in the manufacturing process of the non-contact type IC label 100 shown in FIG.
[0037]
First, in a state where the IC module 111 is mounted on the resin sheet 115 via the conductive adhesive 116, the mounting head 130 for heating the IC module 111 while applying pressure is opposed to the resin sheet 115. The IC module 111 is lowered at a position where it is surrounded by the convex 131 formed on the surface (FIG. 3A). Here, in the mounting head 130, as shown in FIG. 3A, a convex portion 131 having a shape surrounding the IC module 111 is formed on the surface facing the resin sheet 115, and this convex portion 131 is formed. The mounting head 130 is lowered so that the IC module 111 enters the space formed by the above.
[0038]
When the mounting head 130 is lowered, first, an area surrounded by the convex portion 131 formed on the mounting head 130 comes into contact with the IC module 111, and then the IC module 111 is moved along with the lowering of the mounting head 130. Pushing in the direction approaching the resin sheet 115, the shape of the connection terminal 114 of the IC module 111 is displaced, so that the IC module 111 and the antenna 112 are electrically connected via the connection terminal 114. Become.
[0039]
Thereafter, when the convex portion 131 formed on the mounting head 130 comes into contact with the resin sheet 115 and the pressing force of the mounting head 130 against the resin sheet 115 reaches a predetermined value (FIG. 3B), the mounting head 130 moves to the resin sheet 115. In this manner, the inlet 110 as shown in FIG. 2C is completed (FIG. 3C).
[0040]
Here, in the protrusion 131 formed on the mounting head 130, when the IC module 111 is connected to the antenna 112 via the connection terminal 114, a predetermined gap is provided between the IC module 111 and the resin sheet 115. It has a height equivalent to the height from the surface of the resin sheet 115 to the upper surface of the IC module 111 in the formed state, and a gap formed between the IC module 111 and the resin sheet 115 by this height. Since the amount is controlled, the amount of the gap formed between the IC module 111 and the resin sheet 115 becomes constant, and the IC module 111 and the resin sheet 115 depend on the height and shape of the connection terminal of the IC module 111. The amount of gaps formed between the two does not vary.
[0041]
Further, when the convex portion 131 formed on the mounting head 130 contacts the resin sheet 115 and the pressing force of the mounting head 130 against the resin sheet 115 reaches a predetermined value, the mounting head 130 moves away from the resin sheet 115. Therefore, the object to which the pressure controlled by the mounting head 130 is applied is not the IC module 111 but the resin sheet 115, and the value of the pressure applied by the mounting head 130 can be increased. Can be easily performed.
[0042]
Further, since the amount of the gap formed between the IC module 111 and the resin sheet 115 is controlled by the height of the convex portion 131 formed on the mounting head 130, the base on which the resin sheet 115 is mounted. Even when the flatness of the plate (not shown) is not excellent, the amount of the gap formed between the IC module 111 and the resin sheet 115 can be made constant.
[0043]
Thereafter, the surface sheet 120 is laminated on the inlet 110 via the adhesive layer 150 to complete the non-contact type IC tag 100 (FIG. 2D).
[0044]
Below, the manufacturing method using the mounting head in which the convex part 131 as mentioned above is not formed is demonstrated.
[0045]
FIG. 4 is a diagram for explaining another example of a process when pressure is applied to the IC module 111 in the manufacturing process of the non-contact type IC label 100 shown in FIG.
[0046]
First, in a state in which the IC module 111 is mounted on the resin sheet 115 via the conductive adhesive 116, the spacer 240, which is a restriction member having a hole into which the IC module 111 enters, is inserted into the hole. It mounts on the resin sheet 115 so that it may enter (FIG. 4A).
[0047]
Next, the mounting head 230 for heating the IC module 111 while applying a predetermined pressure is lowered with respect to the resin sheet 115.
[0048]
When the mounting head 230 is lowered with respect to the resin sheet 115, first, a portion of the mounting head 230 that faces the IC module 111 comes into contact with the IC module 111, and then, along with the lowering of the mounting head 230, the IC module 111 is pushed in a direction approaching the resin sheet 115, whereby the shape of the connection terminal 114 of the IC module 111 is displaced, and the IC module 111 and the antenna 112 are electrically connected via the connection terminal 114. It becomes like this.
[0049]
Thereafter, the portion of the mounting head 230 that faces the spacer 240 comes into contact with the spacer 240, and when the pressing force of the mounting head 230 against the spacer 240 reaches a predetermined value (FIG. 4B), the mounting head 230 moves away from the resin sheet 115. In the direction, the inlet 110 as shown in FIG. 2C is completed (FIG. 4C).
[0050]
Here, in the spacer 240 mounted on the resin sheet 115, when the IC module 111 is connected to the antenna 112 through the connection terminal 114, there is a predetermined gap between the IC module 111 and the resin sheet 115. It has a height equivalent to the height from the surface of the resin sheet 115 to the upper surface of the IC module 111 in the formed state, and a gap formed between the IC module 111 and the resin sheet 115 by this height. Since the amount is controlled, the amount of the gap formed between the IC module 111 and the resin sheet 115 becomes constant, and the IC module 111 and the resin sheet 115 depend on the height and shape of the connection terminal of the IC module 111. The amount of gaps formed between the two does not vary.
[0051]
Further, since the mounting head 230 moves in a direction away from the resin sheet 115 when the mounting head 230 comes into contact with the spacer 240 and the pressing force of the mounting head 230 against the spacer 240 reaches a predetermined value, the mounting head 230 moves. The object to which the pressure controlled by the pressure is applied is not the IC module 111 but the spacer 240, and the value of the pressure applied by the mounting head 230 can be increased, whereby the pressure control can be easily performed. .
[0052]
Further, since the amount of the gap formed between the IC module 111 and the resin sheet 115 is controlled by the height of the spacer 240 mounted on the resin sheet 115, the base on which the resin sheet 115 is mounted. Even when the flatness of the plate (not shown) is not excellent, the amount of the gap formed between the IC module 111 and the resin sheet 115 can be made constant.
[0053]
In addition, as the spacer 240, it is possible to use the processed material of resin films, such as metals, such as SUS, and a polyimide which has heat resistance, for example.
[0054]
Further, in the above-described embodiments, the non-contact type IC tag has been described as an example of the RF-ID medium capable of writing and reading information in a non-contact state. Not only tags, but non-contact type IC labels, non-contact type IC cards, etc., as long as the IC module is configured to include an inlet mounted so as to be connected to an antenna via a connection terminal. Can do.
[0055]
【The invention's effect】
As described above, in the present invention, an IC module capable of writing and reading information in a non-contact state via the antenna is connected to the antenna by pressing on the base substrate on which the antenna is formed. In the RF-ID media manufacturing method for manufacturing the RF-ID media by mounting, the pressing to the IC module is accompanied by the pressing to the area where the IC module is not mounted on the surface of the base substrate on which the IC module is mounted. Since the configuration is performed by the generated pressure, the target of pressure applied to connect the IC module to the antenna on the base substrate is not the IC module but the base substrate, and the IC module is mounted on the base substrate. Pressure control to connect and mount , It can be the amount of clearance IC module is formed between the IC module and the base material when mounted in a state of being connected to the antenna on the base substrate constant.
[Brief description of the drawings]
1A and 1B are diagrams showing an embodiment of a non-contact type IC tag manufactured by an RF-ID media manufacturing method of the present invention, in which FIG. 1A is a diagram showing an internal structure, and FIG. It is sectional drawing in the AA 'part shown to).
2 is a diagram for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
FIG. 3 is a view for explaining an example of a process when pressure is applied to the IC module in the manufacturing process of the non-contact type IC label shown in FIG. 1;
4 is a diagram for explaining another example of a process when pressure is applied to the IC module in the manufacturing process of the non-contact type IC label shown in FIG. 1. FIG.
5A and 5B are diagrams showing an example of the structure of a general non-contact type IC tag. FIG. 5A is a diagram showing an internal structure, and FIG. 5B is a cross-sectional view taken along the line AA ′ shown in FIG. It is.
6 is a view for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
[Explanation of symbols]
100 Non-contact type IC tag 110 Inlet 111 IC module 112 Antenna 114 Connection terminal 115 Resin sheet 116 Adhesive 120 Surface sheet 130, 230 Mounting head 131 Protruding part 150 Adhesive layer 240 Spacer

Claims (1)

By mounting an IC module capable of writing and reading information in a non-contact state via the antenna on a base substrate on which the antenna is formed so as to be connected to the antenna by pressing, an RF-ID medium An RF-ID media manufacturing method for manufacturing
Mounting the IC module on the base substrate so as to contact the antenna;
The IC module has a height equivalent to the height of the IC module with respect to the surface of the base substrate when mounted in a state of being connected to the antenna on the base substrate, and is in contact with the IC module A mounting head having a convex portion formed in a shape surrounding the IC module on a surface is arranged so that the IC module enters a space formed by the convex portion of the mounting head, and the convex portion is A method of manufacturing an RF-ID medium, comprising a step of contacting a base substrate and pressing the base substrate with a predetermined pressure.

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