JP3960071B2 - Electronic equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device including a wiring substrate and a case, and more particularly to an electronic device including a wiring substrate including a parallel substrate portion and a vertical substrate portion.
[0002]
[Prior art]
Conventionally, a wiring board has been used as a mounting board for electronic components in an electronic device. An example of the arrangement structure of the wiring board in the case is shown in FIG.
[0003]
FIG. 2 is a cross-sectional view showing the structure of the substrate 1 arranged in the case 2.
[0004]
The substrate 1 includes two wiring substrates 104 and 105 disposed on the bottom surface 21 of the case 2, and various electronic components 10, 11, and 15 are mounted on the upper surfaces of the wiring substrates 104 and 105. Has been. The two wiring boards 104 and 105 are connected to each other by a wire 70 by wire bonding via connection electrodes 8 and 9 arranged on the surfaces thereof. Further, the connector 3 is disposed on the side surface 23 of the case 2 for input / output connection between an external electrical circuit and the electrical circuit formed on the substrate 1 disposed in the case 2. A connection electrode 5 arranged on the substrate 1 and a connection electrode 6 arranged on the connector 3 are connected by a wire 7 by wire bonding.
[0005]
[Problems to be solved by the invention]
In the arrangement structure of the substrate 1 shown in FIG. 2, since all the wiring substrates 104 and 105 constituting the substrate 1 are arranged on the case bottom surface 21, the electronic components 10, 11, and 15 It can be mounted only on the upper surface which is one side of 105. Therefore, when the circuit scale is increased, the substrate 1 and the case 2 for mounting the substrate 1 are increased in size, and the occupied area is increased.
[0006]
Further, not only electronic components 10 that are short like chip components but also electronic components 11 and 15 that are tall like electric field capacitors are mounted on the substrate 1. Therefore, the height of the case 2 needs to be higher than the tall electronic components 11 and 15. In such a case, the substrate 1 disposed on the bottom surface 21 of the case 2 and the top surface of the case 2 are required. Most of the space between 22 becomes useless space.
[0007]
Further, it is necessary to arrange the connector 3 in the case 2 in order to connect the substrate 1 and an external electric circuit, but in order to connect the connection electrode 5 of the substrate 1 and the connection electrode 6 of the connector 3 with the wire 7, the connector 3 Is disposed on the side surface 23 of the case, the occupied area of the entire unit including the case 2 and the connector 3 which is a large component is large as shown in FIG.
[0008]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device in which a useless space in a case is reduced and the mounting and arrangement density of electronic components and a wiring board are increased.
[0009]
[Means for Solving the Problems]
The invention according to claim 1 includes a wiring board on which an electronic component is mounted and a case for housing the wiring board, and the wiring board is arranged in parallel to the bottom surface of the case, and it was closed and a vertical plate portion extending in a direction perpendicular to the parallel substrate portion, the connection electrode formed on an end portion of the vertical plate portion, a connecting electrode of the connector disposed on the upper face of the case, fitting It is characterized by being connected by .
[0010]
The configuration of the wiring board is not a planar configuration including only parallel substrate portions arranged in parallel to the bottom surface of the case, but a three-dimensional configuration having a vertical substrate portion extending in a direction perpendicular to the parallel substrate portion. Yes. In this way, by introducing the vertical substrate portion arranged perpendicular to the bottom surface of the case, the space in the case is used not only by tall electronic components but also by the vertical substrate portion. It can be used without waste. As a result, even if the circuit scale of the wiring board is increased, it is possible to suppress an increase in the size of the case.
In addition, since the vertical substrate portion arranged perpendicular to the bottom surface of the case is arranged so that one end protrudes into the space in the case, by disposing a connection electrode on the surface of the end, It can be used as a plug. Therefore, a connector used for connection to an external electric circuit can be disposed on the upper surface of the case, the connector and the end of the vertical substrate portion can be fitted, and the connection electrodes of both can be press-contacted. In such a configuration, since the connector, which is a large component, is arranged on the upper surface of the case, the occupied area of the entire unit including the case and the connector can be suppressed to the same as the occupied area of the case.
[0011]
The invention according to claim 2 is characterized in that the parallel substrate portion and the vertical substrate portion are integrally formed together with the wiring formed on the substrate portion. By integrally forming the wiring board in this way, it is not necessary to fix the vertical board part to the case or the like. Further, since the wiring in the wiring board is also integrally formed, the number of wiring connection steps between the parallel board portion and the vertical board portion can be reduced, and consequently the manufacturing cost of the wiring board can be reduced.
[0012]
The invention described in claim 3 is characterized in that the insulating material constituting the integrally formed substrate portion is ceramics or thermoplastic resin. Thereby, the parallel substrate portion and the vertical substrate portion can be formed integrally with the wiring.
[0013]
The invention described in claim 4 is characterized in that the connection electrode disposed on the surface of the parallel substrate portion and the connection electrode disposed on the surface of the vertical substrate portion are connected by wire bonding.
[0014]
In wire bonding, adjacent electrodes are connected by a thin wire, so that the area occupied by the connection portion can be reduced as compared with other electrical connection methods. Accordingly, by applying wire bonding to the electrical connection between the parallel substrate portion and the vertical substrate portion, both the parallel substrate portion and the vertical substrate portion that are not integrally formed can be reduced so that the area occupied by the connection portion is reduced. Both can be electrically connected in a state where the substrate portions are arranged close to each other.
[0016]
The invention according to claim 5 is characterized in that an electronic component is arranged on the vertical substrate portion. In addition to wiring and connection electrodes, electronic components can be mounted on the vertical substrate portion. In the vertical substrate portion, even if the number of electronic components to be mounted increases and the area of the substrate portion increases, the occupied area with respect to the case bottom surface does not increase because of the vertical arrangement on the case bottom surface.
[0017]
The invention described in claim 6 is characterized in that electronic components are arranged on both surfaces of the vertical substrate portion. Since the vertical board | substrate part arrange | positioned perpendicularly | vertically to the bottom face of a case will be protruded and arrange | positioned in the space in a case, an electronic component can be mounted in the both surfaces. Therefore, the mounting density of electronic components can be further increased without changing the sizes of the wiring board and the case.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0019]
FIG. 1 is a cross-sectional view illustrating an electronic device including a wiring board disposed in a case according to the present invention. In addition, the same code | symbol is attached | subjected about the part similar to the example of the arrangement structure to the case of the conventional wiring board shown in FIG. 2, and the description is abbreviate | omitted.
[0020]
The wiring board 1 shown in FIG. 1 includes parallel substrate portions 101, 102, and 103 that are parallel to the bottom surface 21 of the case 2, and vertical substrate portions 201 and 202 that extend in a direction perpendicular to the parallel substrate portion.
[0021]
In the arrangement structure of the wiring substrate 1 shown in FIG. 1, the vertical substrate portions 201 and 202 of the wiring substrate 1 are perpendicular to the case bottom surface 21 and are three-dimensionally arranged without interfering with each other. For this reason, the arrangement structure shown in FIG. 1 according to the present invention occupies the area occupied by the wiring board 1 on the bottom surface of the case as compared with the arrangement structure shown in FIG. Can be reduced.
[0022]
In the wiring substrate 1 shown in FIG. 1, the parallel substrate portion 102 and the vertical substrate portions 201 and 202 are integrally formed with the wiring formed on each substrate portion.
[0023]
When ceramics is used as an insulating material constituting the wiring board 1, an integrally formed wiring board having board portions 102, 201, 201 that are perpendicular to each other is formed as follows. First, a wiring pattern is formed on an unfired ceramic sheet made of resin and ceramics by printing a conductive paste or the like. Next, a required number of ceramic sheets on which wiring patterns are formed are stacked and bent at a right angle with a molding die to form a ceramic sheet into a required shape. The molded body thus obtained is placed in a holder for holding the molded body so as not to be deformed during firing, and the ceramic constituting the molded body is fired together with the wiring pattern to be integrally formed.
[0024]
Further, when a thermoplastic resin is used as an insulating material constituting the wiring substrate 1, an integrally formed wiring substrate having substrate portions 102, 201, 201 that are perpendicular to each other is formed as follows. First, a conductor foil is attached to a film made of a thermoplastic resin, and a conductor pattern to be a wiring is formed by etching the conductor foil. Next, a necessary number of conductor pattern films on which conductor patterns are formed are laminated, bent at right angles with a molding die while being heated and pressurized, and thermocompression bonded, and integrally formed while being molded into a required shape.
[0025]
Although FIG. 1 shows a wiring substrate in which the substrate portions 102, 201, and 201 that are perpendicular to each other are integrated, the vertical substrate portion of the wiring substrate 1 is separated from the parallel substrate portion and a case using a fixing member. You may arrange | position perpendicular | vertical to the bottom face 21. FIG. However, by integrating the vertical substrate portions 201 and 202 and the parallel substrate portion 102 as described above, the vertical substrate portions 201 and 202 do not need to be independently fixed to the case 2. Assembling work becomes easier. Further, since the wiring of the board portions 102, 201, 201 is also integrally formed, the number of wiring connections between the board portions 102, 201, 201 can be reduced, and the wiring housed in the case 2 can be reduced. The manufacturing cost of the substrate 1 as a whole can be reduced.
[0026]
In the wiring substrate 1 shown in FIG. 1, the parallel substrate portions 101 and 103 are configured as separate bodies. Connection electrodes 51 and 52 are respectively arranged on the surfaces of the parallel substrate parts 101 and 103 formed separately, and the connection electrodes 53 and 54 arranged on the surfaces of the vertical substrate parts 201 and 202, and wire bonding. Are connected by wires 71 and 72.
[0027]
Wire bonding between the substrate portions 101 and 201 which are perpendicular to each other is performed as follows. With the case side surface 23 and the upper surface 22 removed, the case bottom surface 21 is disposed horizontally, and one end of the wire 71 is connected to the connection electrode 51 of the parallel substrate portion 101. Next, the wire 71 is drawn out, the wiring board to be bonded is rotated by 90 degrees together with the case, the connection electrodes 53 of the vertical board portion 201 are horizontally arranged, and the wires 71 are connected with an appropriate length. The wire 72 between the board portions 103 and 202 is also connected in the same manner.
[0028]
In wire bonding, since adjacent electrodes are connected by thin wires 71 and 72, the area occupied by the connection portion can be reduced as compared with other electrical connection methods. By applying the wire bonding method, even if the substrate portions 101 and 201 or 103 and 202 that are not integrally formed with each other are perpendicular to each other, both the substrate portions 101 and 102 In the state where 201 or 103 and 202 are arranged close to each other, they can be electrically connected.
[0029]
In the arrangement structure of FIG. 1, the connector 4 is arranged on the upper surface 22 of the case 2, and the distal end portion of the connector 4 and the distal end portion of the vertical substrate portion 201 are fitted. Due to the fitting of both, the connection electrode 55 formed on the front surface of the vertical substrate 201 and the connection electrode 61 formed on the front surface of the connector are connected.
[0030]
Thus, since the front-end | tip part protrudes and arrange | positions in the space in a case, the vertical board | substrate part 201 is utilized as an insertion plug to the connector 4 by arrange | positioning the connection electrode 55 on the surface of a front-end | tip part. can do. Therefore, the connector 4 is disposed on the upper surface 22 of the case, the connector 4 and the tip of the vertical substrate portion 201 are fitted, and the connection electrodes 55 and 61 can be press-connected. By adopting such a configuration, the connector 4 which is a large component is arranged on the upper surface 22 of the case, and the occupied area of the entire unit including the case 2 and the connector 4 can be kept at the occupied area of the bottom surface 21 of the case. it can.
[0031]
In the arrangement structure of FIG. 1, not only the tall electronic component 11 but also the vertical substrate parts 201 and 202 are arranged in a space formed above the case 2. Further, in the arrangement structure of FIG. 1, not only the electronic components 10 and 11 are mounted on the parallel substrate portion 102, but also the electronic components 12, 13 and 14 are arranged on the vertical substrate portions 201 and 202. In particular, since the vertical substrate portions 201 and 202 are disposed so as to protrude into the upper space in the case 2, they can be mounted on both surfaces of the vertical substrate portion 202 like the electronic components 13 and 14.
[0032]
As described above, in the arrangement structure of the wiring board 1 in FIG. 1, the space in the case 2 is used without waste. In particular, even if a large number of electronic components are mounted, it can be dealt with by mounting a large number of electronic components on both sides of the vertical substrate portions 201 and 202. These vertical substrate portions are arranged perpendicularly to the bottom surface of the case. Does not increase the occupied area. Therefore, the mounting density of electronic components can be further increased without changing the occupation area of the wiring board 1 with respect to the case 2.
[0033]
As described above, according to the present invention, it is possible to provide an electronic device that reduces the useless space in the case and increases the mounting and arrangement density of the electronic components and the wiring board, which contributes to downsizing of the electronic device. is there.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an electronic device including a wiring board disposed in a case according to the present invention.
FIG. 2 is a cross-sectional view showing the structure of a substrate disposed in a conventional case.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wiring board 101,102,103 Parallel board part 201,202 Vertical board | substrate part 2 Case 3,4 Connector 5,6,8,9,51,52,53,54,55,61 Connection electrode 7,70,71, 72 Wire 10, 11, 12, 13, 14, 15 Electronic component

Claims (6)

A wiring board for mounting electronic components, and a case for housing the wiring board,
A parallel substrate portion in which the wiring substrate is disposed in parallel to the bottom surface of the case;
It was closed and a vertical plate portion extending in a direction perpendicular to the parallel plate portion,
An electronic device comprising: a connection electrode formed at an end of the vertical substrate portion and a connection electrode of a connector disposed on an upper surface of the case connected by fitting .   The electronic device according to claim 1, wherein the parallel substrate portion and the vertical substrate portion are integrally formed together with wiring formed on the substrate portion.   The electronic device according to claim 2, wherein the insulating material constituting the integrally formed substrate portion is ceramics or a thermoplastic resin.   4. The connection electrode disposed on the surface of the parallel substrate portion and the connection electrode disposed on the surface of the vertical substrate portion are connected by wire bonding. 5. Electronic equipment. The electronic device according to claim 1, wherein an electronic component is disposed on the vertical substrate portion . The electronic device according to claim 5 , wherein electronic components are arranged on both surfaces of the vertical substrate portion .

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