JP3973447B2

JP3973447B2 - Electronic component mounting apparatus and method

Info

Publication number: JP3973447B2
Application number: JP2002043258A
Authority: JP
Inventors: 健之川瀬; 遵恵清水; 隆矢澤; 宏内山; 典晃吉田
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2002-02-20
Filing date: 2002-02-20
Publication date: 2007-09-12
Anticipated expiration: 2022-02-20
Also published as: JP2003243889A

Description

【０００１】
【発明の属する技術分野】
本発明は、部品供給装置から電子部品を取り出して回路基板に実装する部品保持部材の交換が可能な電子部品実装装置、及び該電子部品実装装置にて実行される電子部品実装方法に関する。
【０００２】
【従来の技術】
電子部品を保持する吸着ノズルを有する部品装着ヘッドと、上記吸着ノズルの交換を行うためのノズル交換部とを備えた電子部品実装装置では、従来、吸着ノズルによる電子部品の吸着状態に基づいて上記吸着ノズルの良否を判断していた。そして吸着ノズルが不良であると判断されたときには、該吸着ノズルを上記ノズル交換部に備えた予備の正常な吸着ノズルと交換することにより、回路基板への実装動作を続行させていた。以下に具体的に説明する。
【０００３】
図１０に示す従来の電子部品実装装置２０において、部品装着ヘッド９はＸＹ平面上を移動自在で、搭載した８本の吸着ノズル１〜８を個別に、その軸方向へ昇降、及び軸周りに回転可能に構成されている。このような部品装着ヘッド９は、部品供給装置１１から供給される電子部品を上記吸着ノズル１〜８にて吸着し、部品認識装置１０にて認識された各電子部品の吸着姿勢に基づいて姿勢補正を行う。一方、プリント基板は、移送装置１２にて当該電子部品実装装置２０に搬入され位置決めされる。上記姿勢補正後、部品装着ヘッド９は、上記プリント基板の実装位置に、吸着している電子部品を順次、実装する。
又、部品装着ヘッド９に装填されている吸着ノズルでは実装できない電子部品がある場合には、当該電子部品実装装置２０に備えたノズル交換部１３にて、部品装着ヘッド９に装填済の吸着ノズルを、電子部品に適合した吸着ノズルに交換することにより実装動作を続行する。
【０００４】
尚、特開平１０−１６３６８９号公報には、部品装着ヘッドにて部品供給装置から電子部品の吸着を行う際に、ある吸着ノズルが連続して設定回数以上連続して吸着ミスを起こしたときには、該吸着ノズルを不良と判断し、予備の正常な吸着ノズルに交換して実装動作を続行する技術が開示されている。
【０００５】
【発明が解決しようとする課題】
しかしながら、上述したような従来の電子部品実装装置による実装動作では、上述したように吸着ノズルの交換作業が発生した場合、ノズル交換の動作が実装プログラムと違う動作をすることにより、生産性が悪化するという問題があった。例えば、図１１に示すノズル交換部において、ＳＴ１〜ＳＴ８、及びＳＴ１７〜ＳＴ２４を使用して、ノズル交換を１回行って実装動作を行うプログラムがある場合において、ＳＴ８の吸着ノズルが不良となったと仮定する。この場合、当該電子部品実装装置は、不良となったＳＴ８に等価である代替ノズルをノズル交換部にて探す。その結果、ＳＴ９〜ＳＴ１６が代替ノズルとして使用可能であれば、ＳＴ９〜ＳＴ１６の任意の一つとノズル交換して実装動作を行う。したがって、ノズル交換動作は、上記実装動作プログラムに元々含まれる１回のノズル交換と、上記不良となった吸着ノズルの交換との合わせて２回となり、生産性が低下していた。
本発明は、このような問題点を解決するためになされたもので、不良の部品保持部材が発生してその交換動作を行った場合でも、基板の生産性の向上が可能な電子部品実装装置、及び電子部品実装方法を提供することを目的とする。
【０００６】
【課題を解決するための手段】
上記目的を達成するため、本発明は以下のように構成する。
即ち、本発明の第１態様の電子部品実装装置は、複数の部品保持部材を着脱可能に装填し該部品保持部材にて保持した電子部品を回路基板へ実装する部品実装ヘッドと、
上記部品保持部材と交換可能であって上記電子部品を保持可能でかつ上記部品実装ヘッドにおける上記部品保持部材の数を超える数の交換用部品保持部材を有する交換ステーションと、
上記部品実装ヘッドの動作制御を行い、かつ上記部品実装ヘッドに装填されている上記部品保持部材の種類及び配列に関する主パターンに一致する副パターンが上記交換ステーションにおける上記交換用部品保持部材の配置に含まれるか否かを検索し、該検索結果に基づいて上記部品実装ヘッドに装填されている上記主パターンの上記部品保持部材を上記副パターンの上記交換用部品保持部材に交換可能か否かを判断する制御装置と、
を備えたことを特徴とする。
【０００７】
又、上記制御装置は、不具合の生じた不良部品保持部材、及び該不良部品保持部材と交換可能な交換用部品保持部材の、上記交換ステーション内における配置換えを上記部品実装ヘッドに行わせる動作制御を行うことができる。
【０００８】
又、上記交換ステーションに備わる上記交換用部品保持部材の配置換えを行う保持部材交換装置をさらに備え、
上記制御装置は、不具合の生じた不良部品保持部材、及び該不良部品保持部材と交換可能な交換用部品保持部材の、上記交換ステーション内における配置換えを上記保持部材交換装置に行わせる動作制御を行うことができる。
【０００９】
又、上記交換ステーションは、上記交換用部品保持部材を一列状に配列しかつ上記部品実装ヘッドにおける上記主パターンを構成する上記部品保持部材との交換場所である交換部分と、列状に配置された上記交換用部品保持部材を移動させて、上記交換部分にて上記副パターンを形成する保持部材移動装置と、を有することができる。
【００１０】
又、上記検索の結果、上記主パターンに一致する上記副パターンが上記交換ステーションに存在しないとき、上記制御装置は、上記部品実装ヘッドに装填されている上記部品保持部材の種類に類似しかつ上記電子部品を保持可能な、上記交換用部品保持部材に含まれる等価交換用部品保持部材をも含めて上記主パターンに類似する類似副パターンの有無を検索することができる。
さらに、本発明の他の態様における電子部品実装装置は、複数の部品保持部材を着脱可能に装填し該部品保持部材にて保持した電子部品を回路基板へ実装する部品実装ヘッドと、
上記部品保持部材と交換可能であって上記電子部品を保持可能でかつ上記部品実装ヘッドにおける上記部品保持部材の数を超える数の交換用部品保持部材を有する交換ステーションと、
上記部品保持部材が不良となり交換を要するとき、該不良部品保持部材のみならず、上記不良部品保持部材以外の正常部品保持部材をも交換の対象とし、上記部品実装ヘッドにおける部品保持部材の交換回数が最小になるように、上記部品実装ヘッドにおける部品保持部材の種類及び配列に関する主パターンに一致する交換用部品保持部材の種類及び配列に関する副パターンを交換ステーションに配置されている上記交換用部品保持部材から検索し、一致する配置が確認されたときには、上記部品実装ヘッドにおける上記主パターンにて構成される上記部品保持部材を上記副パターンにて構成される上記交換用部品保持部材に入れ換えて電子部品実装を行うように制御する制御装置と
を備えたことを特徴とする。
【００１１】
本発明の第２態様の電子部品実装方法は、複数の部品保持部材を有する部品実装ヘッドによって上記部品保持部材で保持した電子部品を回路基板へ実装する電子部品実装方法であって、
上記部品保持部材が不良となり交換を要するとき、該不良部品保持部材のみならず、上記不良部品保持部材以外の正常部品保持部材をも交換の対象とし、上記部品実装ヘッドにおける部品保持部材の交換回数が最小になるように、上記部品実装ヘッドにおける部品保持部材の種類及び配列に関する主パターンに一致する交換用部品保持部材の種類及び配列に関する副パターンを交換ステーションに配置されている上記交換用部品保持部材から検索し、一致する配置が確認されたときには、上記部品実装ヘッドにおける上記主パターンにて構成される上記部品保持部材を上記副パターンにて構成される上記交換用部品保持部材に入れ換えて電子部品実装を行う、
ことを特徴とする。
【００１２】
上記第２態様において、上記交換ステーションの上記交換用部品保持部材に不良が生じたとき、上記副パターンの検索を行う前に、上記副パターンを形成するように上記交換用部品保持部材の配置換えを行うようにしてもよい。
【００１３】
上記第２態様において、上記検索の結果、上記主パターンに一致する上記副パターンが上記交換ステーションに存在しないとき、上記部品実装ヘッドに装填されている上記部品保持部材が保持すべき上記電子部品を保持可能な、上記交換用部品保持部材に含まれる等価交換用部品保持部材をも含めて上記主パターン若しくは上記主パターンに類似する類似副パターンの有無を検索するようにしてもよい。
【００１４】
【発明の実施の形態】
本発明の実施形態である電子部品実装装置及び方法について、図を参照しながら以下に説明する。ここで、上記電子部品実装方法は、上記電子部品実装装置にて実行される。又、各図において、同じ構成部分については同じ符号を付している。又、電子部品を実装する回路基板の種類が変化すれば当然に上記電子部品を保持するための部品保持部材の交換が発生することから、以下の実施形態は、同一種類の回路基板へ電子部品を実装するときにおける部品保持部材の交換の場合に関するものである。
図１に示す本実施形態の電子部品実装装置１０１は、部品供給装置１１１と、部品実装ヘッド１２１と、ヘッド移動装置１３１と、基板搬送装置１４１と、部品認識装置１５１と、交換ステーション１６１と、制御装置１８１とを備える。
上記部品供給装置１１１は、上記基板搬送装置１４１にて当該電子部品実装装置１０１へ搬入されてくる回路基板１９１へ実装する電子部品１９２の供給を行う装置であり、当該電子部品実装装置１０１では、電子部品１９２を収納したテープを巻回したリールを装填して部品供給を行ういわゆるパーツカセット形態の第１供給装置１１１−１と、電子部品１９２を載置したトレイにて部品供給を行ういわゆるトレイ形態の第２供給装置１１１−２とを有する。
【００１５】
上記部品実装ヘッド１２１は、上記電子部品１９２を保持する部品保持部材１２２を複数有する。当該電子部品実装装置１０１では、上記部品保持部材１２２は、吸引装置１２３による吸引動作にて電子部品１９２を吸着するノズル形態にてなり、図示するＸ軸方向に沿って一列に、部品保持部材１２２−１〜１２２−８の８本を有し、保持する電子部品１９２の形状、サイズ等に応じた形状及び大きさにてなる。尚、部品保持部材１２２は、上記ノズル形態に限定されるものではなく例えば電子部品１９２を挟持するチャック形態等であってもよく、さらにその数も上記８本に限定されるものではない。又、部品保持部材１２２−１〜１２２−８は、着脱構造１２５により、部品実装ヘッド１２１の本体部１２４に対してそれぞれ独立して着脱可能である。上記着脱構造１２５としては、例えば図４に示すように、上記本体部１２４に取り付けられ先端にボールを進退可能に設けたボールプランジャ１２５−１と、上記部品保持部材１２２に形成され上記ボールが嵌合される溝部１２５−２とを有する構造である。該構造によれば、上記本体部１２４に部品保持部材１２２を挿入することで、ボールプランジャ１２５−１の上記ボールが上記溝部１２５−２に嵌合し、部品保持部材１２２が本体部１２４に固定され、一方、部品保持部材１２２を引っ張ることで、上記溝部１２５−２から上記ボールが外れ、本体部１２４から部品保持部材１２２を引き抜くことができる。
さらに又、部品保持部材１２２のそれぞれは、上記部品実装ヘッド１２１に備わる駆動装置にて上記本体部１２４とともに軸周りに回転可能であり、かつ軸方向に昇降移動可能である。
【００１６】
ヘッド移動装置１３１は、上述の部品実装ヘッド１２１をＸ，Ｙ方向へ移動させる装置であり、当該部品実装装置１０１では、図１に示すようにＹ方向に延在し、それぞれボールネジ機構を有する一対のＹ駆動部１３１−１と、Ｘ方向に延在しボールネジ機構を有するＸ駆動部１３１−２とを有する。又、Ｘ駆動部１３１−２には上記部品実装ヘッド１２１が取り付けられ、かつＸ駆動部１３１−２は上記一対のＹ駆動部１３１−１に懸架されＹ駆動部１３１−１にてＹ方向に移動可能である。よって、Ｙ駆動部１３１−１及びＸ駆動部１３１−２の動作により、部品実装ヘッド１２１は、Ｘ及びＹ方向へ自由に移動可能である。
【００１７】
上記基板搬送装置１４１は、当該電子部品実装装置１０１に対する回路基板１９１の搬入及び搬出を行う装置である。上記部品認識装置１５１は、上記部品実装ヘッド１２１の部品保持部材１２２に保持された電子部品１９２の保持姿勢を撮像する装置であり、撮像情報を上記制御装置１８１へ送出する。上記撮像情報は、部品保持部材１２２の良否判断の材料とされる。
【００１８】
上記交換ステーション１６１は、上記部品実装ヘッド１２１に対して着脱可能に装填されている上記部品保持部材１２２と交換可能であって電子部品１９２を保持しかつ部品実装ヘッド１２１における部品保持部材１２２の数を超える数の交換用部品保持部材１６２を有する。該交換用部品保持部材１６２は、機能的、及び上述の溝部１２５−２に関する構造において上記部品保持部材１２２と変わるものではなく、サイズや形状等が異なる種々の電子部品１９２を保持可能なように、部品保持部材１２２と比べて電子部品１９２に接触する部分等のサイズ等が異なる部材である。尚、交換ステーション１６１に備わる交換用部品保持部材１６２の全てが部品保持部材１２２と異なる部材であることはなく、一部は同一である。又、本実施形態では上述のように部品実装ヘッド１２１は一列状に８本の部品保持部材１２２−１〜１２２−８を配列している。よって、詳細後述するが、これら部品保持部材１２２−１〜１２２−８が一度に交換可能なように、部品保持部材１２２の配列に対応して図７に示すように、交換ステーション１６１には８本の交換用部品保持部材１６２が一列に配置されている。尚、本実施形態では、交換ステーション１６１には、図５に示すように、交換用部品保持部材１６２を収納する装填部分１６３が３行８列にて配列されている。又、部品保持部材１２２を交換するとき、部品実装ヘッド１２１に装填されている部品保持部材１２２を交換ステーション１６１に退避させる必要があることから、図７に示すように例えば装填部分１６３−１〜１６３−８には交換用部品保持部材１６２が存在しない。
【００１９】
さらに又、上記部品実装ヘッド１２１に装填されている部品保持部材１２２と、交換ステーション１６１に設けられている交換用部品保持部材１６２との交換動作を、詳細後述するように制御装置１８１の制御により自動的に実行可能とするため、交換ステーション１６１には、図４及び図６に示すような保持機構１６４が備わる。種々の構造が考えられるが、本実施形態における上記保持機構１６４は、くさび形のカム１６４−１がシリンダ１６４−２にて昇、降することに対応して、一対の開閉レバー１６４−３が開、閉する機構であり、上記装填部分１６３の各行毎、つまり装填部分１６３−１〜１６３−８、装填部分１６３−９〜１６３−１６、及び装填部分１６３−１７〜１６３−２４に対応してそれぞれ設けられている。又、上記シリンダ１６４−２の動作は、制御装置１３０にて制御される。
【００２０】
このような保持機構１６４は以下のように動作する。即ち、通常、上記カム１６４−１は、上昇位置にあり開閉レバー１６４−３は図６に示すように開いている。一方、部品保持部材１２２の交換のため、部品保持部材１２２が交換ステーション１６１の上記装填部分１６３に装填された後、上記シリンダ１６４−２にてカム１６４−１を下降させて、一対の開閉レバー１６４−３を閉じる。これにより、図４に示すように、開閉レバー１６４−３は、上記装填されている部品保持部材１２２に形成されている溝１２６の部分に係合し溝１２６部分を挟持する。よって、該挟持状態にて、上記本体部１２４における上記部品保持部材１２２の保持部分を上昇させることで、上記ボールプランジャ１２５−１と、部品保持部材１２２の溝１２５−２との係合が外れ、上記装填部分１６３に部品保持部材１２２を収納した状態で本体部１２４のみが上昇可能である。
【００２１】
上記制御装置１８１は、当該電子部品実装装置１０１の動作制御を行う装置であり、具体的には、上述した、部品供給装置１１１、部品実装ヘッド１２１、吸引装置１２３、ヘッド移動装置１３１、基板搬送装置１４１、部品認識装置１５１、及び交換ステーション１６１の保持機構１６４等の動作制御を行い、かつ以下に述べる部品保持部材１２２の交換動作に関する動作制御を行う。又、制御装置１８１に備わる記憶部１８２には、回路基板１９１の搬入から、当該回路基板１９１への電子部品１９２の実装動作を経て、実装済回路基板の搬出までの動作に関して必要なプログラムが格納されている。よって以下に述べる、部品保持部材１２２の自動交換動作に関する動作制御も、制御装置１８１は、上記プログラムに従い実行する。従って、上記実装動作及び上記交換動作に関して、制御装置１８１は、部品実装ヘッド１２１に装填されている各部品保持部材１２２の種類及び装填位置を理解しており、かつ交換ステーション１６１に配置されている各交換用部品保持部材１６２の種類及び装填位置を理解している。
【００２２】
以上説明した構成を有する本実施形態の電子部品実装装置１０１にて実行される電子部品実装方法について以下に説明する。尚、回路基板１９１の搬入及び搬出動作、回路基板１９１への電子部品１９２の実装に関する動作については、公知の電子部品実装装置にて実行される動作に同じであるので、ここでの説明は省略する。よって以下には、部品実装ヘッド１２１に装填されている部品保持部材１２２と、交換ステーション１６１に備わる交換用部品保持部材１６２との交換動作を主として説明を行う。
【００２３】
本実施形態における部品実装方法に含まれる部品保持部材１２２の交換動作では、実装動作における生産性の低下を防ぐため、上記交換動作が最小回数で済むように交換方法が行われる。よって、従来では、不良となった部品保持部材１２２のみを交換の対象としていたが、本実施形態では、交換動作が最小回数で済むのであれば不良の部品保持部材１２２のみならず正常である部品保持部材１２２についても交換の対象とする。
尚、上記部品実装ヘッド１２１に備わる部品保持部材１２２が不良となり交換を要すると制御装置１８１が判断する方法として、本実施形態においても従来の場合と同様に、部品認識装置１５１にて撮像された、各部品保持部材１２２における電子部品１９２の吸着姿勢の撮像情報に基づき、設定回数以上、連続して吸着ミスを生じた部品保持部材１２２について、制御装置１８１は不良と判断する。
上記交換動作について、さらに具体的に以下に説明する。
【００２４】
例えば、部品実装ヘッド１２１に装填されている部品保持部材１２２−１〜１２２−８、及び図７に示すように、交換ステーション１６１に配置されている交換用部品保持部材１６２−１７〜１６２−２４を使用して実装動作を行うプログラムがある場合を想定する。尚、ここでは、図７に示す、交換用部品保持部材１６２−９〜１６２−１６のノズル種類は「Ｓ」であり、交換用部品保持部材１６２−１７〜１６２−２４のノズル種類は「Ｍ」であるとする。又、部品実装ヘッド１２１に備わる部品保持部材１２２−１〜１２２−８のノズル種類は「Ｓ」であるとする。
実装動作中に、部品保持部材１２２−８が不良になった場合、他の部品保持部材１２２−１〜１２２−７の内から部品保持部材１２２−８の代用可能な部品保持部材を使用して、実装中の回路基板１９１に対する部品実装動作を完了させる。そして次の回路基板１９１に対する部品実装動作を開始する前に、図２に示すステップ１にて以下の動作を行う。即ち、上述したように、制御装置１８１は、部品保持部材１２２−１〜１２２−８の各保持部材について、その種類及びこれらの配列に関する情報を有し、かつ交換ステーション１６１における交換用部品保持部材１６２の種類及び配列に関する情報を有する。そこで、制御装置１８１は、ステップ１にて、現在、部品実装ヘッド１２１に装填されている部品保持部材１２２−１〜１２２−８の種類及び配列に関する情報を抽出する。尚、抽出された上記種類及び配列に関する情報を主パターンとする。
【００２５】
次のステップ２では、制御装置１８１は、上記主パターンに一致する副パターンを、交換用部品保持部材１６２の種類及び配列に関する情報から検索する。検索方法としては、不良が発生しない場合において上記プログラムにて実行される保持部材の交換回数以下の回数にて、交換対象である部品保持部材を交換可能となるパターンを検索する。この場合、８本のノズル種類「Ｓ」にてなる部品保持部材１２２−１〜１２２−８を１回で交換できるパターンを検索する。
次のステップ３では、制御装置１８１は、上記副パターンを抽出したか否かを判断する。該判断の結果、本例では上述のように図７に示す交換用部品保持部材１６２−９〜１６２−１６がノズル種類「Ｓ」であり保持部材の並び方も一致すると仮定すると、交換用部品保持部材１６２−９〜１６２−１６が抽出される。抽出された場合にはステップ４へ進み、生産に使用する保持部材を、上記部品保持部材１２２−１〜１２２−８から交換用部品保持部材１６２−９〜１６２−１６に変更する。つまり、制御装置１８１の動作制御により、まず一旦、部品実装ヘッド１２１に装填されている部品保持部材１２２−１〜１２２−８を交換ステーション１６１における空の装填部分１６３−１〜１６３−８へ、上述した保持機構１６４を動作させて収納する。その後、部品実装ヘッド１２１を交換用部品保持部材１６２−９〜１６２−１６の上方へ移動させて、部品実装ヘッド１２１に交換用部品保持部材１６２−９〜１６２−１６を装填させる。このように本実施形態では、不良の部品保持部材１２２だけでなく正常な部品保持部材１２２も含めて全ての部品保持部材１２２を交換用部品保持部材１６２に交換する。そして、該交換用部品保持部材１６２−９〜１６２−１６にて実装動作を開始する。
【００２６】
上述のように本実施形態によれば、例とした上記プログラムの実行中に部品保持部材１２２−８が不良になったと仮定したとき、（１）部品保持部材１２２−１〜１２２−８のすべてを返却し、（２）交換用部品保持部材１６２−９〜１６２−１６を保持し、上記プログラムに従い、（３）交換用部品保持部材１６２−９〜１６２−１６を返却し、（４）交換用部品保持部材１６２−１７〜１６２−２４を保持するというノズル交換動作になる。このように、本実施形態によれば、ノズル交換に要する動作回数は、４回となる。一方、従来では、部品保持部材１２２−８が不良になった時点で、（１）部品保持部材１２２−８を返却し、（２）部品保持部材１２２−８の代わりをなす例えば交換用部品保持部材１６２−１６を保持させる。そして、交換用部品保持部材１６２−１７〜１６２−２４への交換時には、まず、（３）部品保持部材１２２−１〜７を返却し、（４）交換用部品保持部材１６２−１６の返却を行い、そして（５）交換用部品保持部材１６２−１７〜１６２−２４を保持するというノズル交換動作になる。よって従来では、ノズル交換に要する動作回数は、５回となる。このように、本実施形態によれば、従来に比べて、ノズル交換に要する動作回数を減少することができ、生産性の向上に寄与することができる。
【００２７】
一方、ステップ３にて、抽出不可と判断されたときにはステップ５に進む。ステップ５では、不良となった部品保持部材１２２−８の種類に類似する種類にてなる等価交換用部品保持部材まで検索範囲を広げて検索動作を行う。ここで、上記等価交換用部品保持部材とは、上記交換用部品保持部材１６２に含まれる部材であり、不良の部品保持部材の種類に類似しかつ不良部品保持部材が保持すべき電子部品１９２を保持可能な保持部材である。以下に具体的に説明する。
図３は、保持する部品に対する適性ノズルの選択を示した表であり、記憶部１８２に記憶させることができる。吸着する電子部品１９２は、その体積に応じて吸着に適切な部品保持部材１２２が決まっており、操作者による選択、又は上記プログラムにより図３の表に基づいて自動的に選択される。しかし、電子部品１９２の大きさによっては、２種類以上の部品保持部材１２２にて吸着可能な場合がある。このようなときには、吸着可能な予備ノズル、つまり上記等価交換用部品保持部材として、上記記憶部１８２に記憶しておくことにより、吸着可能な部品保持部材の本数を増やすことができる。即ち、上記等価交換用部品保持部材を用いることで、ノズル交換の回数を減らすことができ、生産性を向上させることができる。
【００２８】
具体的に説明すると、図３に示すように、体積１０〜６０ｃｍ^３の電子部品１９２を吸着する場合、上記等価交換用部品保持部材を使用しないときには、体積１０〜３０ｃｍ^３の電子部品１９２は、ノズル種類「Ｓ」の部品保持部材１２２にて、体積３０〜６０ｃｍ^３の電子部品１９２はノズル種類「Ｍ」の部品保持部材１２２にて吸着する必要がある。よって、ノズル種類「Ｓ」の部品保持部材１２２が部品装着ヘッド１２１に装填されているとき、体積３０〜６０ｃｍ^３の電子部品１９２を保持するためには、部品保持部材１２２の交換が必要となる。一方、上記等価交換用部品保持部材として、ノズル種類「Ｍ」の部品保持部材１２２を部品装着ヘッド１２１に装填しておくことで、１０〜６０ｃｍ^３の電子部品１９２の全てを保持することが可能となり、ノズル交換が不要となり、生産性の向上を図ることができる。
【００２９】
上述の例の場合、不良となった部品保持部材１２２−８の種類は「Ｓ」であるので、種類「Ｍ」が種類「Ｓ」に類似すると仮定したとき、上記ステップ５では、上記主パターンに類似する類似副パターンが上記交換ステーション１６１における交換用部品保持部材１６２の配置内から検索される。上述のように、上記等価交換用部品保持部材として交換用部品保持部材１６２−１７〜１６２−２４が該当することから、上記検索では、交換用部品保持部材１６２−９〜１６２−２４内から、上記主パターンに類似する類似副パターンが検索される。
【００３０】
次のステップ６では、上記類似副パターンが抽出されたか否かが判断される。抽出された場合は、ステップ７へ進み、基板生産に使用する、部品実装ヘッド１２１における上記主パターンの部品保持部材１２２から上記類似副パターンの交換用部品保持部材１６２に交換する。具体的な交換方法は、上記ステップ４における場合と同様である。
一方、上記ステップ６にて上記類似副パターンが抽出されない場合には、上記不良部品保持部材１２２を含む上記主パターンに類似する上記類似副パターンも存在しないことになるので、不良部品保持部材１２２のみを個別に交換することにより生産を継続させる。
【００３１】
上述の説明では、交換ステーション１６１に装填されている交換用部品保持部材１６２−９〜１６２−２４の配列状態は変更することなく、上記副パターン及び上記類似副パターンの検索を行った。よって、上記ステップ６では、上記類似副パターンも抽出されない場合が生じることもある。しかしながら、上記副パターン及び上記類似副パターンが抽出されない場合であっても、交換ステーション１６１内で、一部の交換用部品保持部材１６２の配置を変更することで、上記副パターン及び上記類似副パターンが形成される場合もある。以下に説明する各構成例は、この点に着目したものである。つまり、上述したように制御装置１８１は、交換ステーション１６１に装填されている全ての交換用部品保持部材１６２の種類及び配置位置を把握していることから、上記副パターン及び上記類似副パターンが抽出されない場合には、上記副パターン及び上記類似副パターンの少なくとも一方を生成可能なように、交換用部品保持部材１６２の配置の変更を演算することが可能である。
【００３２】
上記配置変更用の演算の結果、上記副パターン及び上記類似副パターンの少なくとも一方が生成されたときには、制御装置１８１は、部品実装ヘッド１２１及び上記保持機構１６４の動作制御を行い、部品実装ヘッド１２１及び上記保持機構１６４を用いて交換用部品保持部材１６２の配置換えを行う。該動作は、交換用部品保持部材１６２の配置換えに部品実装ヘッド１２１を利用することから、ある回路基板１９１への実装動作が終了した後に行う。例えば部品保持部材１２２−８が不良になった場合を例に採ると、上記実装動作の終了後、部品実装ヘッド１２１の部品保持部材１２２−１〜１２２−８の全てを、交換ステーション１６１の空の装填部分１６３−１〜１６３−８へ返却する。次に制御装置１８１の動作制御により、上記装填部分１６３−８に存在する上記部品保持部材１２２−８、及び上記部品保持部材１２２−８と同一であり正常であり装填部分１６３−１６に存在する交換用部品保持部材１６２−１６を部品実装ヘッド１２１に取り付ける。次に、制御装置１８１の動作制御により、上記部品保持部材１２２−８を、上記装填部分１６３−１６へ返却する。次に、制御装置１８１の動作制御により、上記交換用部品保持部材１６２−１６を上記装填部分１６３−８に装填する。これにて両者の配置が変更される。
このようにして、交換ステーション１６１における交換用部品保持部材１６２の配置を調整し、以後、上述したステップ１〜７の動作を行う。従って、部品保持部材の無駄な交換回数を減らすことができ基板生産の効率を向上させることができる。
【００３３】
上述した、交換ステーション１６１における交換用部品保持部材１６２の配置換え動作では、上記部品実装ヘッド１２１を利用して上記配置換えを行ったが、該形態に限定されるものではない。例えば図８に示すように、交換ステーション１６１に保持部材交換装置１６５をさらに備えた第２交換ステーション１６６を設け、制御装置１８１にて保持部材交換装置１６５の動作制御を行い上記配置換えを行うようにすることもできる。上記保持部材交換装置１６５は、部材保持部１６５−１と、該部材保持部１６５−１が取り付けられ部材保持部１６５−１をＹ方向に移動させるＹ駆動部１６５−３と、該Ｙ駆動部１６５−３が取り付けられＹ駆動部１６５−３をＸ方向に移動させるＸ駆動部１６５−２とを有する。上記Ｘ駆動部１６５−２及びＹ駆動部１６５−３は、例えばボールネジ機構を有し、制御装置１８１の制御にて、部材保持部１６５−１をＸ，Ｙ方向へ自在に移動する。
【００３４】
交換ステーション１６１に上記保持部材交換装置１６５をさらに備えることで、制御装置１８１の動作制御により、部品実装ヘッド１２１、及び保持部材交換装置１６５をそれぞれ独立して動作させることができる。
上記不良部品保持部材１２２が発生したときには、部品実装ヘッド１２１に存在する不良部品保持部材、例えば部品保持部材１２２−８を、交換ステーション１６１の、空の装填部分１６３−８に返却し、正常なノズルに相当し装填部分１６３−１６に存在する交換用部品保持部材１６２−１６を部品実装ヘッド１２１に取り付け、生産を行う。一方、該生産が行われている間に、保持部材交換装置１６５は、上記装填部分１６３−８に装填した不良部品保持部材１６２−８を、上記保持部材交換装置１６５の部材保持部１６５−１にて保持して、装填部分１６３−１６へ移動する。該移動後、部品実装ヘッド１２１は、上記交換用部品保持部材１６２−１６を装填部分１６３−８に装填する。そして、装填部分１６３−１７〜１６３−２４に装填されている交換用部品保持部材１６２−１７〜１６２−２４を使用するとき、部品実装ヘッド１２１に取り付けられている部品保持部材１２２−１〜１２２−７は、装填部分１６３−１〜１６３−７に返却される。
以上の動作により部品保持部材１２２−１〜１２２−８を全て正常な交換用部品保持部材１６２−１７〜１６２−２４に交換することにより、上述の、部品実装ヘッド１２１を利用して保持部材の交換を行う場合に比べて、回路基板１９１の生産が終了した時点での保持部材の交換動作を削減することができる。よって、部品実装ヘッド１２１の動作終了を待つ必要がないことから、さらに生産効率を上げることができる。
【００３５】
さらに又、図８に示す第２交換ステーション１６６では、交換ステーション１６１内の交換用部品保持部材１６２の配置換えを行う装置として、上記保持部材交換装置１６５を設けたが、上記配置換えを行う方法として、さらに図９に示す第３交換ステーション１６７の形態を採ることもできる。該第３交換ステーション１６７は、上記交換用部品保持部材１６２を一列状に配列しかつ上記部品実装ヘッド１２１における上記主パターンを構成する上記部品保持部材１２２−１〜１２２−８との交換場所である交換部分１６７−１と、列状に配置された上記交換用部品保持部材１６２を移動させて、上記交換部分１６７−１にて上記副パターンを形成する保持部材移動装置１６７−２と、を有する。尚、上記交換部分１６７−１は、上記保持機構１６４を有する。図９に示す例では、上記保持部材移動装置１６７−２による交換用部品保持部材１６２の移動経路を楕円状とし、直線部分が上記交換部分１６７−１に該当する形態を採っている。しかしながら上記移動経路は、上記楕円形に限定されるものではなく、例えば上記交換部分１６７−１を含む直線状であってもよい。
尚、上記第３交換ステーション１６７では、装填部分１６３−１〜１６３−８は交換用部品保持部材が存在しない空きの状態である。又、交換用部品保持部材１６２−９〜１６２−２６のノズル種類は全て「Ｓ」としているが、勿論これに限定するものではない。又、上述の各例と同様に、制御装置１８１は、交換用部品保持部材１６２−９〜１６２−２６の配列状態を把握している。
【００３６】
上記第３交換ステーション１６７によれば、上述の例と同様に、部品実装ヘッド１２１の部品保持部材１２２−８が不良になった場合、まず、部品実装ヘッド１２１に取りつけられている部品保持部材１２２−１〜１２２−８を第３交換ステーション１６７の装填部分１６３−１〜１６３−８に返却する。そして、保持部材移動装置１６７−２を動作させ、列状に配置された上記交換用部品保持部材１６２−９〜１６２−２６を、例えば反時計方向に回転させる。該回転の移動量は、上記副パターン及び上記類似副パターンの少なくとも一方が上記交換部分１６７−１にて形成されるような移動量である。ここでは、正常な交換用部品保持部材１６２−２６が交換部分１６７−１における装填部分１６３−１に位置するように回転させる。これにて不良部品保持部材１２２−８は、交換部分１６７−１から外れ、装填部分１６３−９に位置する。よって、交換部分１６７−１には、正常な保持部材が配列されることから、交換部分１６７−１に配列されている交換用部品保持部材１６２−２６、及び部品保持部材１２２−１〜１２２−７の８本が部品実装ヘッド１２１に装填される。
【００３７】
このように上記第３交換ステーション１６７では、図８に示す第２交換ステーション１６６の構成と比較すると、交換ステーション１６１の上方にて移動する保持部材交換装置１６５を省略することができることから、よりコンパクトな装置構成にて交換ステーション１６１内の交換用部品保持部材１６２の配置換えを行うことができる。
【００３８】
さらに又、上記第３交換ステーション１６７に上記保持部材交換装置１６５を追加した構成を採ることもできる。該構成によれば、上記移動経路に配列される交換用部品保持部材１６２の配列順を、保持部材交換装置１６５を使用して変更することができる。よって、図８に示す第２交換ステーション１６６が奏する、部品実装ヘッド１２１の動作終了を待つ必要がなく、さらに生産効率を上げることができるという効果を得ることができる。
【００３９】
尚、上述した実施形態では、上記主パターンにて構成される部品保持部材１２２−１〜１２２−８の全てを一度に交換用部品保持部材１６２と交換した。しかしながら、該形態に限定されるものではなく、不良部品保持部材、例えば不良部品保持部材１２２−８を含む複数の部品保持部材、例えば部品保持部材１２２−５〜１２２−８における種類及び配列に対応する配置が交換ステーション１６１内の交換用部品保持部材１６２の配置に存在するときには、上記部品保持部材１２２−５〜１２２−８のみを交換してもよい。
尚、上述の説明では、不良ノズルの交換時期を、一つの基板の生産が終了した後、同種の次の基板の生産開始までの間としましたが、これに限定されることなく、例えば不良ノズルが発生した時点で交換を行うこともできる。
【００４０】
【発明の効果】
以上詳述したように本発明の第１態様における電子部品実装装置、及び第２態様の電子部品実装方法によれば、部品実装ヘッド、交換ステーション、及び制御装置を備え、部品実装ヘッドに装填されている部品保持部材に関する主パターンに一致する副パターンが交換ステーションに備わる交換用部品保持部材の配置に存在するか否かを判断するようにした。よって、上記副パターンが存在すると判断されたときであって、不良となった部品保持部材のみならず正常な部品保持部材も含めて上記主パターンにてなる部品保持部材の全てを上記副パターンにてなる交換用部品保持部材に交換した方が、不良部品保持部材のみを交換する場合に比べて交換回数が減るときには、上記主パターンにてなる部品保持部材の全てを上記副パターンにてなる交換用部品保持部材に交換することができる。よって、該交換動作を行ったときには、従来に比べて回路基板の生産性を向上させることができる。
【００４１】
又、上記第１態様では、上記交換ステーションに配置される交換用部品保持部材の配列について部品実装ヘッドを使用して変更することで、上記副パターンを形成できる場合も生じる。このようにして副パターンを形成できた場合には、上述の生産性の向上を図ることができる。
【００４２】
又、上記第１態様では、上記交換ステーションに配置される交換用部品保持部材の配列について、新たに設けた保持部材交換装置を使用して変更することで、上記副パターンを形成できる場合も生じる。このようにして副パターンを形成できた場合には、上述の生産性の向上を図ることができるとともに、部品実装ヘッドを使用して変更する場合に比べて実装動作と並行して交換用部品保持部材の配置換えが行える。よって、さらに生産性の向上を図ることができる。
【００４３】
又、上記第１態様では、交換ステーションにおいて、交換部分と保持部材移動装置とを備えた形態を採ることで、上記保持部材交換装置を設けた場合に比べて、コンパクトな装置構成にて交換用部品保持部材の配置換えを行うことができる。
【００４４】
さらに又、上記副パターンが上記交換ステーションに存在しないとき、部品保持部材の種類に類似しかつ電子部品を保持可能な等価交換用部品保持部材をも含めて主パターンに類似する類似副パターンの有無を検索することで、検索範囲が広がる。よって、さらに生産性の向上を図ることができる。
【００４５】
又、上記第２態様では、上記交換ステーションに配置される交換用部品保持部材の配置内に、上記副パターン及び上記類似副パターンが存在しないときには、これらが形成可能なように交換用部品保持部材の配置を変更してもよい。該変更により、上述の生産性の向上を図ることができる。
【図面の簡単な説明】
【図１】本発明の実施形態における電子部品実装装置の斜視図である。
【図２】図１に示す電子部品実装装置にて実行される電子部品実装方法における動作を表すフローチャートである。
【図３】図１に示す電子部品実装装置に格納され、等価交換用部品保持部材の検索に使用される情報を説明するための図である。
【図４】図１に示す電子部品実装装置に備わる交換ステーションの構造を説明するための図である。
【図５】図１に示す電子部品実装装置に備わる交換ステーションにおける装填部分の配列状態を示す図である。
【図６】図１に示す電子部品実装装置に備わる交換ステーションの構造を説明するための図である。
【図７】図１に示す電子部品実装装置に備わる交換ステーションに備わる交換用部品保持部材の配置を説明するための図である。
【図８】図１に示す電子部品実装装置に備わる交換ステーションの変形例を示す斜視図である。
【図９】図１に示す電子部品実装装置に備わる交換ステーションの別の変形例を示す斜視図である。
【図１０】従来の電子部品実装装置の斜視図である。
【図１１】図１０に示す電子部品実装装置に備わるノズル交換部におけるノズルの配置状態を説明するための図である。
【符号の説明】
１２１…部品実装ヘッド、１２２…部品保持部材、
１６２…交換用部品保持部材、１６１…交換ステーション、
１６５…保持部材交換装置、１６７−１…交換部分、
１６７−２…保持部材移動装置、１８１…制御装置、１９１…回路基板、
１９２…電子部品。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus capable of exchanging a component holding member that takes out an electronic component from a component supply apparatus and mounts the electronic component on a circuit board, and an electronic component mounting method executed by the electronic component mounting apparatus.
[0002]
[Prior art]
In an electronic component mounting apparatus provided with a component mounting head having a suction nozzle for holding an electronic component and a nozzle replacement unit for replacing the suction nozzle, conventionally, the above-described method is performed based on the suction state of the electronic component by the suction nozzle. The quality of the suction nozzle was judged. When it is determined that the suction nozzle is defective, the mounting operation to the circuit board is continued by replacing the suction nozzle with a spare normal suction nozzle provided in the nozzle replacement section. This will be specifically described below.
[0003]
In the conventional electronic component mounting apparatus 20 shown in FIG. 10, the component mounting head 9 is movable on the XY plane, and the eight suction nozzles 1 to 8 are individually moved up and down in the axial direction and around the axis. It is configured to be rotatable. Such a component mounting head 9 sucks the electronic components supplied from the component supply device 11 by the suction nozzles 1 to 8, and is based on the suction posture of each electronic component recognized by the component recognition device 10. Make corrections. On the other hand, the printed circuit board is carried into the electronic component mounting apparatus 20 and positioned by the transfer device 12. After the posture correction, the component mounting head 9 sequentially mounts the sucked electronic components on the mounting position of the printed circuit board.
If there is an electronic component that cannot be mounted by the suction nozzle loaded in the component mounting head 9, the suction nozzle already loaded in the component mounting head 9 is used by the nozzle replacement unit 13 provided in the electronic component mounting apparatus 20. Is replaced with a suction nozzle suitable for an electronic component to continue the mounting operation.
[0004]
In Japanese Patent Laid-Open No. 10-16389, when an electronic component is sucked from a component supply device by a component mounting head, when a suction nozzle continuously causes a suction error more than a set number of times, A technique is disclosed in which the suction nozzle is determined to be defective and replaced with a normal spare suction nozzle to continue the mounting operation.
[0005]
[Problems to be solved by the invention]
However, in the mounting operation by the conventional electronic component mounting apparatus as described above, when the suction nozzle replacement work occurs as described above, the nozzle replacement operation is different from the mounting program, thereby deteriorating the productivity. There was a problem to do. For example, in the nozzle replacement section shown in FIG. 11, when there is a program for performing mounting operation by performing nozzle replacement once using ST1 to ST8 and ST17 to ST24, the suction nozzle of ST8 becomes defective. Assume. In this case, the electronic component mounting apparatus searches the nozzle replacement unit for an alternative nozzle equivalent to the defective ST8. As a result, if ST9 to ST16 can be used as an alternative nozzle, the nozzle is replaced with any one of ST9 to ST16, and the mounting operation is performed. Therefore, the nozzle replacement operation is performed twice, including one nozzle replacement originally included in the mounting operation program and replacement of the defective suction nozzle, and productivity is reduced.
The present invention has been made to solve such problems, and an electronic component mounting apparatus capable of improving the productivity of a substrate even when a defective component holding member is generated and replaced. And an electronic component mounting method.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows.
That is, the electronic component mounting apparatus according to the first aspect of the present invention includes a component mounting head for detachably loading a plurality of component holding members and mounting the electronic components held by the component holding members on a circuit board;
An exchange station that is replaceable with the component holding member and can hold the electronic component and has a number of replacement component holding members that exceeds the number of the component holding members in the component mounting head;
The sub-pattern that controls the operation of the component mounting head and matches the main pattern related to the type and arrangement of the component holding members loaded in the component mounting head is the arrangement of the replacement component holding members in the replacement station. And whether or not the component holding member of the main pattern loaded in the component mounting head can be replaced with the replacement component holding member of the sub pattern based on the search result. A control device to judge;
It is provided with.
[0007]
The control device controls the operation of causing the component mounting head to rearrange the defective component holding member in which the defect has occurred and the replacement component holding member replaceable with the defective component holding member within the replacement station. It can be performed.
[0008]
The apparatus further comprises a holding member exchanging device for rearranging the replacement part holding member provided in the exchange station,
The control device performs operation control for causing the holding member exchanging device to rearrange the defective component holding member in which the defect has occurred and the replacement component holding member exchangeable with the defective component holding member in the exchange station. It can be carried out.
[0009]
In addition, the replacement station is arranged in a row with replacement parts that are arranged in a row with the replacement component holding members and are replacement places with the component holding members constituting the main pattern in the component mounting head. And a holding member moving device that moves the replacement part holding member to form the sub-pattern at the replacement portion.
[0010]
  Further, when the sub-pattern matching the main pattern does not exist in the replacement station as a result of the search, the control device is similar to the type of the component holding member loaded in the component mounting head and It is possible to search for the presence or absence of a similar sub-pattern similar to the main pattern including the equivalent replacement component holding member included in the replacement component holding member capable of holding an electronic component.
  Furthermore, an electronic component mounting apparatus according to another aspect of the present invention includes a component mounting head for detachably loading a plurality of component holding members and mounting the electronic components held by the component holding members on a circuit board,
An exchange station that is replaceable with the component holding member and can hold the electronic component and has a number of replacement component holding members that exceeds the number of the component holding members in the component mounting head;
When the component holding member becomes defective and needs to be replaced, not only the defective component holding member but also the normal component holding member other than the defective component holding member is to be replaced, and the number of replacements of the component holding member in the component mounting head The replacement component holder is arranged in the replacement station so that the sub-pattern related to the type and arrangement of the replacement component holding members that matches the main pattern related to the type and arrangement of the component holding members in the component mounting head is minimized. When a matching arrangement is confirmed by searching from the member, the component holding member constituted by the main pattern in the component mounting head is replaced with the replacement component holding member constituted by the sub pattern, and electronic A control device that controls to perform component mounting;
It is provided with.
[0011]
An electronic component mounting method according to a second aspect of the present invention is an electronic component mounting method for mounting an electronic component held by the component holding member on a circuit board by a component mounting head having a plurality of component holding members.
When the component holding member becomes defective and needs to be replaced, not only the defective component holding member but also the normal component holding member other than the defective component holding member is to be replaced, and the number of replacements of the component holding member in the component mounting head The replacement component holder is arranged in the replacement station so that the sub-pattern related to the type and arrangement of the replacement component holding members that matches the main pattern related to the type and arrangement of the component holding members in the component mounting head is minimized. When a matching arrangement is confirmed by searching from the member, the component holding member constituted by the main pattern in the component mounting head is replaced with the replacement component holding member constituted by the sub pattern, and electronic Component mounting,
It is characterized by that.
[0012]
In the second aspect, when the replacement part holding member of the replacement station is defective, the replacement part holding member is rearranged so as to form the sub pattern before searching for the sub pattern. May be performed.
[0013]
  In the second aspect, as a result of the search, the component holding member loaded in the component mounting head when the sub-pattern that matches the main pattern does not exist in the replacement station.Should holdThe main pattern or a similar sub-pattern similar to the main pattern may be searched for including the equivalent replacement component holding member included in the replacement component holding member capable of holding the electronic component. .
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An electronic component mounting apparatus and method according to an embodiment of the present invention will be described below with reference to the drawings. Here, the electronic component mounting method is executed by the electronic component mounting apparatus. Moreover, in each figure, the same code | symbol is attached | subjected about the same component. In addition, if the type of the circuit board on which the electronic component is mounted is changed, the component holding member for holding the electronic component is naturally replaced. Therefore, in the following embodiments, the electronic component is transferred to the same type of circuit board. The present invention relates to the case of replacement of the component holding member when mounting.
An electronic component mounting apparatus 101 according to the present embodiment shown in FIG. 1 includes a component supply apparatus 111, a component mounting head 121, a head moving apparatus 131, a board transfer apparatus 141, a component recognition apparatus 151, an exchange station 161, And a control device 181.
The component supply device 111 is a device that supplies the electronic component 192 to be mounted on the circuit board 191 that is carried into the electronic component mounting apparatus 101 by the substrate transfer device 141. In the electronic component mounting apparatus 101, A first supply device 111-1 in the form of a so-called parts cassette that supplies a component by loading a reel on which a tape containing electronic components 192 is wound, and a so-called tray that supplies the component in a tray on which the electronic component 192 is placed The second supply device 111-2.
[0015]
The component mounting head 121 has a plurality of component holding members 122 that hold the electronic component 192. In the electronic component mounting apparatus 101, the component holding member 122 is in the form of a nozzle that sucks the electronic component 192 by a suction operation by the suction device 123, and is arranged in a row along the X-axis direction shown in the figure. It has eight pieces of −1 to 122-8, and has a shape and size corresponding to the shape and size of the electronic component 192 to be held. Note that the component holding member 122 is not limited to the above-described nozzle shape, and may be, for example, a chuck shape that sandwiches the electronic component 192, and the number is not limited to the above eight. In addition, the component holding members 122-1 to 122-8 can be independently attached to and detached from the main body 124 of the component mounting head 121 by the attachment / detachment structure 125. For example, as shown in FIG. 4, the attachment / detachment structure 125 includes a ball plunger 125-1 attached to the main body portion 124 so that a ball can be moved forward and backward, and a ball holding member 122 formed on the component holding member 122. This is a structure having a groove 125-2 to be joined. According to this structure, by inserting the component holding member 122 into the main body portion 124, the ball of the ball plunger 125-1 is fitted into the groove portion 125-2, and the component holding member 122 is fixed to the main body portion 124. On the other hand, by pulling the component holding member 122, the ball is detached from the groove portion 125-2 and the component holding member 122 can be pulled out from the main body portion 124.
Furthermore, each of the component holding members 122 can be rotated around the axis together with the main body 124 by a driving device provided in the component mounting head 121 and can be moved up and down in the axial direction.
[0016]
The head moving device 131 is a device that moves the above-described component mounting head 121 in the X and Y directions. In the component mounting device 101, as shown in FIG. 1, each pair extends in the Y direction and has a ball screw mechanism. Y drive unit 131-1 and an X drive unit 131-2 extending in the X direction and having a ball screw mechanism. Further, the component mounting head 121 is attached to the X drive unit 131-2, and the X drive unit 131-2 is suspended by the pair of Y drive units 131-1 and is moved in the Y direction by the Y drive unit 131-1. It is movable. Therefore, the component mounting head 121 can freely move in the X and Y directions by the operations of the Y driving unit 131-1 and the X driving unit 131-2.
[0017]
The board transfer device 141 is a device that carries the circuit board 191 into and out of the electronic component mounting apparatus 101. The component recognition device 151 is a device that images the holding posture of the electronic component 192 held by the component holding member 122 of the component mounting head 121, and sends imaging information to the control device 181. The imaging information is used as a material for determining the quality of the component holding member 122.
[0018]
The replacement station 161 is replaceable with the component holding member 122 that is detachably mounted on the component mounting head 121, holds the electronic component 192, and the number of the component holding members 122 in the component mounting head 121. The number of replacement part holding members 162 is greater than. The replacement component holding member 162 is not different from the component holding member 122 in terms of the function and the structure related to the groove 125-2, and can hold various electronic components 192 having different sizes and shapes. Compared with the component holding member 122, the size of the part etc. which contact the electronic component 192 differs. It should be noted that all of the replacement component holding members 162 provided in the replacement station 161 are not different members from the component holding member 122, and some of them are the same. In the present embodiment, as described above, the component mounting head 121 has eight component holding members 122-1 to 122-8 arranged in a line. Therefore, as will be described in detail later, as shown in FIG. 7 corresponding to the arrangement of the component holding members 122, the replacement station 161 has 8 in order to exchange these component holding members 122-1 to 122-8 at a time. The replacement part holding members 162 for books are arranged in a row. In the present embodiment, as shown in FIG. 5, loading parts 163 for storing replacement part holding members 162 are arranged in 3 rows and 8 columns in the exchange station 161. Further, when the component holding member 122 is replaced, it is necessary to retract the component holding member 122 loaded in the component mounting head 121 to the replacement station 161. For example, as shown in FIG. There is no replacement part holding member 162 in 163-8.
[0019]
Furthermore, the replacement operation of the component holding member 122 loaded in the component mounting head 121 and the replacement component holding member 162 provided in the replacement station 161 is controlled by the control device 181 as will be described in detail later. In order to enable automatic execution, the exchange station 161 is provided with a holding mechanism 164 as shown in FIGS. Although various structures are conceivable, the holding mechanism 164 in the present embodiment has a pair of opening / closing levers 164-3 corresponding to the rising and lowering of the wedge-shaped cam 164-1 by the cylinder 164-2. This mechanism opens and closes, and corresponds to each row of the loading portion 163, that is, the loading portions 163-1 to 163-8, the loading portions 163-9 to 163-16, and the loading portions 163-17 to 163-24. Are provided respectively. The operation of the cylinder 164-2 is controlled by the control device 130.
[0020]
Such a holding mechanism 164 operates as follows. That is, normally, the cam 164-1 is in the raised position, and the open / close lever 164-3 is open as shown in FIG. On the other hand, in order to replace the component holding member 122, after the component holding member 122 is loaded into the loading portion 163 of the replacement station 161, the cam 164-1 is lowered by the cylinder 164-2, and a pair of opening / closing levers are placed. Close 164-3. As a result, as shown in FIG. 4, the opening / closing lever 164-3 is engaged with the portion of the groove 126 formed in the loaded component holding member 122 and sandwiches the groove 126 portion. Therefore, in the clamped state, by raising the holding portion of the component holding member 122 in the main body portion 124, the engagement between the ball plunger 125-1 and the groove 125-2 of the component holding member 122 is released. In the state where the component holding member 122 is housed in the loading portion 163, only the main body 124 can be raised.
[0021]
The control device 181 is a device that controls the operation of the electronic component mounting apparatus 101. Specifically, the component supply apparatus 111, the component mounting head 121, the suction device 123, the head moving device 131, and the substrate transfer described above. Operation control of the device 141, the component recognition device 151, the holding mechanism 164 of the exchange station 161, and the like, and operation control related to the replacement operation of the component holding member 122 described below are performed. The storage unit 182 provided in the control device 181 stores a program necessary for operations from loading of the circuit board 191 to mounting of the electronic circuit board 192 on the circuit board 191 and unloading of the mounted circuit board. Has been. Therefore, the control device 181 also executes operation control related to the automatic replacement operation of the component holding member 122 described below according to the program. Therefore, regarding the mounting operation and the replacement operation, the control device 181 understands the type and loading position of each component holding member 122 loaded on the component mounting head 121 and is disposed in the replacement station 161. Understand the type and loading position of each replacement component holding member 162.
[0022]
An electronic component mounting method executed by the electronic component mounting apparatus 101 of the present embodiment having the above-described configuration will be described below. The operations relating to the loading and unloading of the circuit board 191 and the mounting of the electronic component 192 on the circuit board 191 are the same as the operations executed by a known electronic component mounting apparatus, and thus the description thereof is omitted here. To do. Therefore, in the following, the replacement operation between the component holding member 122 loaded in the component mounting head 121 and the replacement component holding member 162 provided in the replacement station 161 will be mainly described.
[0023]
In the replacement operation of the component holding member 122 included in the component mounting method in the present embodiment, the replacement method is performed so that the replacement operation can be performed a minimum number of times in order to prevent a decrease in productivity in the mounting operation. Therefore, conventionally, only the defective component holding member 122 is to be replaced, but in the present embodiment, not only the defective component holding member 122 but also a normal component if the replacement operation can be performed a minimum number of times. The holding member 122 is also subject to replacement.
As a method for the control device 181 to determine that the component holding member 122 provided in the component mounting head 121 is defective and needs to be replaced, the image is picked up by the component recognition device 151 in this embodiment as well as the conventional case. Based on the imaging information of the suction posture of the electronic component 192 in each component holding member 122, the control device 181 determines that the component holding member 122 that has caused suction mistakes continuously for a set number of times or more is defective.
The above replacement operation will be described more specifically below.
[0024]
For example, the component holding members 122-1 to 122-8 loaded in the component mounting head 121 and the replacement component holding members 162-17 to 162-24 arranged in the replacement station 161 as shown in FIG. Suppose that there is a program that performs mounting operation using. Here, the nozzle type of the replacement component holding members 162-9 to 162-16 shown in FIG. 7 is “S”, and the nozzle type of the replacement component holding members 162-17 to 162-24 is “M”. ”. Further, it is assumed that the nozzle type of the component holding members 122-1 to 122-8 provided in the component mounting head 121 is “S”.
If the component holding member 122-8 becomes defective during the mounting operation, use a component holding member that can substitute for the component holding member 122-8 from among the other component holding members 122-1 to 122-7. Then, the component mounting operation for the circuit board 191 being mounted is completed. Then, before starting the component mounting operation for the next circuit board 191, the following operation is performed in step 1 shown in FIG. That is, as described above, the control device 181 has information on the types and arrangement of the holding members of the component holding members 122-1 to 122-8, and the replacement component holding member in the exchange station 161. It has information on 162 types and sequences. Therefore, in step 1, the control device 181 extracts information regarding the types and arrangement of the component holding members 122-1 to 122-8 currently loaded in the component mounting head 121. Note that the extracted information on the type and arrangement is the main pattern.
[0025]
In the next step 2, the control device 181 searches the information related to the type and arrangement of the replacement component holding member 162 for a sub-pattern that matches the main pattern. As a search method, when a defect does not occur, a pattern that enables replacement of the component holding member to be replaced is searched for the number of times equal to or less than the number of times of holding member replacement executed by the program. In this case, a pattern that can replace the component holding members 122-1 to 122-8 of the eight nozzle types “S” at once is searched.
In the next step 3, the control device 181 determines whether or not the sub-pattern has been extracted. As a result of the determination, in this example, assuming that the replacement part holding members 162-9 to 162-16 shown in FIG. 7 are the nozzle type “S” and the arrangement of the holding members is the same as described above, The members 162-9 to 162-16 are extracted. If it has been extracted, the process proceeds to step 4, and the holding member used for production is changed from the component holding member 122-1 to 122-8 to the replacement component holding member 162-9 to 162-16. That is, by the operation control of the control device 181, first, the component holding members 122-1 to 122-8 once loaded on the component mounting head 121 are transferred to empty loading portions 163-1 to 163-8 in the exchange station 161. The holding mechanism 164 described above is operated and stored. Thereafter, the component mounting head 121 is moved above the replacement component holding members 162-9 to 162-16, and the replacement component holding members 162-9 to 162-16 are loaded on the component mounting head 121. As described above, in this embodiment, not only the defective component holding member 122 but also all the normal component holding members 122 are replaced with the replacement component holding member 162. Then, the mounting operation is started by the replacement component holding members 162-9 to 162-16.
[0026]
As described above, according to the present embodiment, when it is assumed that the component holding member 122-8 becomes defective during the execution of the above-described program, (1) all of the component holding members 122-1 to 122-8 are used. (2) The replacement component holding members 162-9 to 162-16 are held, and (3) the replacement component holding members 162-9 to 162-16 are returned according to the program, and (4) the replacement The nozzle replacement operation is to hold the component holding members 162-17 to 162-24. Thus, according to this embodiment, the number of operations required for nozzle replacement is four. On the other hand, conventionally, when the component holding member 122-8 becomes defective, (1) the component holding member 122-8 is returned, and (2) a replacement component holding that replaces the component holding member 122-8, for example. The members 162-16 are held. When replacing the replacement component holding members 162-17 to 162-24, first, (3) the component holding members 122-1 to 12-7 are returned, and (4) the replacement component holding member 162-16 is returned. And (5) a nozzle replacement operation of holding the replacement component holding members 162-17 to 162-24. Therefore, conventionally, the number of operations required for nozzle replacement is five. Thus, according to the present embodiment, the number of operations required for nozzle replacement can be reduced as compared with the conventional case, which can contribute to the improvement of productivity.
[0027]
On the other hand, if it is determined in step 3 that extraction is impossible, the process proceeds to step 5. In step 5, a search operation is performed with the search range expanded to an equivalent replacement component holding member of a type similar to the type of the component holding member 122-8 that has become defective. Here, the equivalent replacement component holding member is a member included in the replacement component holding member 162, and is similar to the type of the defective component holding member, and the electronic component 192 to be held by the defective component holding member. It is a holding member that can be held. This will be specifically described below.
FIG. 3 is a table showing selection of appropriate nozzles for the components to be held, and can be stored in the storage unit 182. The electronic component 192 to be adsorbed has a component holding member 122 suitable for adsorbing according to its volume, and is automatically selected based on the table shown in FIG. 3 by the operator or the program. However, depending on the size of the electronic component 192, there are cases where it can be adsorbed by two or more types of component holding members 122. In such a case, it is possible to increase the number of suckable component holding members by storing them in the storage unit 182 as spare nozzles that can be sucked, that is, the equivalent replacement component holding members. That is, by using the equivalent replacement component holding member, the number of nozzle replacements can be reduced, and productivity can be improved.
[0028]
Specifically, as shown in FIG. 3, the volume is 10 to 60 cm.³When adsorbing the electronic component 192, when the equivalent replacement component holding member is not used, the volume is 10 to 30 cm.³The electronic component 192 has a volume of 30 to 60 cm at the component holding member 122 of the nozzle type “S”.³The electronic component 192 needs to be sucked by the component holding member 122 of the nozzle type “M”. Therefore, when the component holding member 122 of the nozzle type “S” is loaded in the component mounting head 121, the volume is 30 to 60 cm.³In order to hold the electronic component 192, it is necessary to replace the component holding member 122. On the other hand, by mounting the component holding member 122 of the nozzle type “M” on the component mounting head 121 as the equivalent replacement component holding member, 10 to 60 cm.³It is possible to hold all of the electronic components 192, and it becomes unnecessary to replace the nozzles, so that productivity can be improved.
[0029]
In the case of the above example, since the type of the component holding member 122-8 that has become defective is “S”, when it is assumed that the type “M” is similar to the type “S”, in step 5, the main pattern A similar sub-pattern similar to the above is retrieved from the arrangement of the replacement component holding member 162 in the replacement station 161. As described above, since the replacement part holding members 162-17 to 162-24 correspond to the equivalent replacement part holding member, in the above search, from within the replacement part holding members 162-9 to 162-24, A similar sub-pattern similar to the main pattern is searched.
[0030]
In the next step 6, it is determined whether or not the similar sub-pattern has been extracted. If it has been extracted, the process proceeds to step 7 where the component holding member 122 of the main pattern in the component mounting head 121 used for board production is replaced with the replacement component holding member 162 of the similar sub pattern. A specific exchange method is the same as that in step 4 above.
On the other hand, if the similar sub-pattern is not extracted in step 6, the similar sub-pattern similar to the main pattern including the defective component holding member 122 does not exist, so only the defective component holding member 122 is present. Production is continued by exchanging them individually.
[0031]
In the above description, the sub-pattern and the similar sub-pattern are searched without changing the arrangement state of the replacement component holding members 162-9 to 162-24 loaded in the replacement station 161. Therefore, in the above step 6, the similar sub pattern may not be extracted. However, even if the sub-pattern and the similar sub-pattern are not extracted, the sub-pattern and the similar sub-pattern can be changed by changing the arrangement of some of the replacement component holding members 162 in the replacement station 161. May be formed. Each configuration example described below pays attention to this point. That is, as described above, the control device 181 grasps the types and arrangement positions of all the replacement part holding members 162 loaded in the replacement station 161, and therefore extracts the sub-pattern and the similar sub-pattern. If not, it is possible to calculate a change in the arrangement of the replacement component holding member 162 so that at least one of the sub-pattern and the similar sub-pattern can be generated.
[0032]
When at least one of the sub-pattern and the similar sub-pattern is generated as a result of the calculation for changing the arrangement, the control device 181 controls the operation of the component mounting head 121 and the holding mechanism 164, and the component mounting head 121. And the replacement part holding member 162 is rearranged by using the holding mechanism 164. Since the component mounting head 121 is used for rearranging the replacement component holding member 162, the operation is performed after the mounting operation on a certain circuit board 191 is completed. For example, when the case where the component holding member 122-8 becomes defective is taken as an example, after completion of the mounting operation, all of the component holding members 122-1 to 122-8 of the component mounting head 121 are emptied in the replacement station 161. To the loading parts 163-1 to 163-8. Next, by the operation control of the control device 181, the component holding member 122-8 existing in the loading portion 163-8 is the same as the component holding member 122-8 and normal and is present in the loading portion 163-16. The replacement component holding member 162-16 is attached to the component mounting head 121. Next, the component holding member 122-8 is returned to the loading portion 163-16 by the operation control of the control device 181. Next, the replacement part holding member 162-16 is loaded into the loading portion 163-8 by operation control of the control device 181. This changes the arrangement of both.
In this manner, the arrangement of the replacement component holding member 162 in the replacement station 161 is adjusted, and thereafter, the operations of Steps 1 to 7 described above are performed. Accordingly, it is possible to reduce the number of useless replacements of the component holding member and to improve the efficiency of board production.
[0033]
In the replacement operation of the replacement component holding member 162 at the replacement station 161 described above, the replacement is performed using the component mounting head 121. However, the present invention is not limited to this configuration. For example, as shown in FIG. 8, the exchange station 161 is provided with a second exchange station 166 further provided with a holding member exchange device 165, and the control device 181 controls the operation of the holding member exchange device 165 so as to perform the above rearrangement. It can also be. The holding member exchanging device 165 includes a member holding unit 165-1, a Y driving unit 165-3 to which the member holding unit 165-1 is attached and moves the member holding unit 165-1 in the Y direction, and the Y driving unit. 165-3 is attached and it has an X drive unit 165-2 that moves the Y drive unit 165-3 in the X direction. The X driving unit 165-2 and the Y driving unit 165-3 have, for example, a ball screw mechanism, and freely move the member holding unit 165-1 in the X and Y directions under the control of the control device 181.
[0034]
By further providing the holding member exchanging device 165 in the exchanging station 161, the component mounting head 121 and the holding member exchanging device 165 can be independently operated by the operation control of the control device 181.
When the defective component holding member 122 occurs, the defective component holding member existing in the component mounting head 121, for example, the component holding member 122-8 is returned to the empty loading portion 163-8 of the exchange station 161, and the A replacement component holding member 162-16 corresponding to a nozzle and present in the loading portion 163-16 is attached to the component mounting head 121 for production. On the other hand, during the production, the holding member replacement device 165 replaces the defective part holding member 162-8 loaded in the loading portion 163-8 with the member holding portion 165-1 of the holding member replacement device 165. And move to the loading portion 163-16. After the movement, the component mounting head 121 loads the replacement component holding member 162-16 on the loading portion 163-8. When the replacement component holding members 162-17 to 162-24 loaded in the loading portions 163-17 to 163-24 are used, the component holding members 122-1 to 122-122 attached to the component mounting head 121 are used. -7 is returned to the loading parts 163-1 to 163-7.
By replacing all the component holding members 122-1 to 122-8 with normal replacement component holding members 162-17 to 162-24 by the above operation, the above-described component mounting head 121 is used to replace the holding members. Compared to the case where the replacement is performed, the replacement operation of the holding member at the time when the production of the circuit board 191 is completed can be reduced. Therefore, it is not necessary to wait for the operation of the component mounting head 121 to end, and the production efficiency can be further increased.
[0035]
Furthermore, in the second replacement station 166 shown in FIG. 8, the holding member replacement device 165 is provided as a device for rearranging the replacement part holding member 162 in the replacement station 161. As a further alternative, the third exchange station 167 shown in FIG. The third replacement station 167 is a place where the replacement component holding members 162 are arranged in a line and exchanged with the component holding members 122-1 to 122-8 constituting the main pattern in the component mounting head 121. A replacement part 167-1 and a holding member moving device 167-2 that moves the replacement part holding members 162 arranged in a row and forms the sub-pattern in the replacement part 167-1. Have. The replacement part 167-1 has the holding mechanism 164. In the example shown in FIG. 9, the moving path of the replacement component holding member 162 by the holding member moving device 167-2 is elliptical, and the linear portion corresponds to the replacement portion 167-1. However, the movement path is not limited to the elliptical shape, and may be, for example, a straight line including the exchange portion 167-1.
In the third replacement station 167, the loading parts 163-1 to 163-8 are in an empty state in which there is no replacement part holding member. In addition, the nozzle types of the replacement component holding members 162-9 to 162-26 are all “S”, but it is of course not limited to this. As in the above examples, the control device 181 grasps the arrangement state of the replacement component holding members 162-9 to 162-26.
[0036]
According to the third replacement station 167, as in the above example, when the component holding member 122-8 of the component mounting head 121 becomes defective, first, the component holding member 122 attached to the component mounting head 121 is used. -1 to 122-8 are returned to the loading parts 163-1 to 163-8 of the third exchange station 167. Then, the holding member moving device 167-2 is operated, and the replacement part holding members 162-9 to 162-26 arranged in a row are rotated, for example, counterclockwise. The movement amount of the rotation is such a movement amount that at least one of the sub-pattern and the similar sub-pattern is formed in the replacement portion 167-1. Here, the normal replacement component holding member 162-26 is rotated so as to be positioned at the loading portion 163-1 in the replacement portion 167-1. As a result, the defective component holding member 122-8 is detached from the replacement portion 167-1 and is positioned in the loading portion 163-9. Therefore, since the normal holding members are arranged in the replacement part 167-1, the replacement part holding members 162-26 and the part holding members 122-1 to 122- arranged in the replacement part 167-1 are arranged. 7 are loaded on the component mounting head 121.
[0037]
As described above, in the third exchange station 167, the holding member exchanging device 165 moving above the exchange station 161 can be omitted as compared with the configuration of the second exchange station 166 shown in FIG. The replacement part holding member 162 in the replacement station 161 can be rearranged with a simple apparatus configuration.
[0038]
Furthermore, a configuration in which the holding member exchanging device 165 is added to the third exchanging station 167 may be employed. According to this configuration, the arrangement order of the replacement component holding members 162 arranged on the moving path can be changed using the holding member changing device 165. Therefore, there is no need to wait for the operation of the component mounting head 121, which is performed by the second exchange station 166 shown in FIG. 8, and the effect that the production efficiency can be further improved can be obtained.
[0039]
In the above-described embodiment, all of the component holding members 122-1 to 122-8 configured by the main pattern are replaced with the replacement component holding member 162 at a time. However, the present invention is not limited to this configuration, and corresponds to types and arrangements of defective component holding members, for example, a plurality of component holding members including defective component holding members 122-8, for example, component holding members 122-5 to 122-8. When the arrangement to be performed exists in the arrangement of the replacement component holding member 162 in the replacement station 161, only the component holding members 122-5 to 122-8 may be replaced.
In the above description, the replacement period of the defective nozzle is the period from the end of the production of one substrate to the start of the production of the next substrate of the same type. Exchange can also be performed at the time of occurrence.
[0040]
【The invention's effect】
As described above in detail, the electronic component mounting apparatus according to the first aspect of the present invention and the electronic component mounting method according to the second aspect include the component mounting head, the exchange station, and the control device, and are loaded into the component mounting head. It is determined whether or not a sub-pattern that matches the main pattern related to the component holding member that is present exists in the arrangement of the replacement component holding member provided in the exchange station. Therefore, when it is determined that the sub pattern exists, not only the defective component holding member but also the normal component holding member, all the component holding members of the main pattern are converted into the sub pattern. When the number of replacements is less when replacing the defective component holding member than when replacing only the defective component holding member, all of the component holding members of the main pattern are replaced by the sub pattern. It can be replaced with a component holding member. Therefore, when the replacement operation is performed, the productivity of the circuit board can be improved as compared with the conventional case.
[0041]
In the first aspect, the sub-pattern may be formed by changing the arrangement of the replacement component holding members arranged in the replacement station using a component mounting head. When the sub-pattern can be formed in this way, the above-described productivity can be improved.
[0042]
In the first aspect, the sub-pattern may be formed by changing the arrangement of the replacement component holding members arranged in the replacement station using a newly provided holding member replacement device. . If the sub-pattern can be formed in this way, the above-described productivity can be improved, and replacement parts can be held in parallel with the mounting operation as compared with the case of changing using the component mounting head. The members can be rearranged. Therefore, productivity can be further improved.
[0043]
Moreover, in the said 1st aspect, it is for exchange by a compact apparatus structure compared with the case where the said holding member replacement | exchange apparatus is provided by taking the form provided with the replacement part and the holding member moving apparatus in the replacement | exchange station. The rearrangement of the component holding member can be performed.
[0044]
In addition, when the sub-pattern does not exist in the replacement station, the presence / absence of a similar sub-pattern similar to the main pattern including the equivalent replacement component holding member that is similar to the type of the component holding member and can hold the electronic component The search range is expanded by searching for. Therefore, productivity can be further improved.
[0045]
In the second aspect, when the sub-pattern and the similar sub-pattern do not exist in the arrangement of the replacement-component holding member disposed at the replacement station, the replacement-component holding member is formed so that these can be formed. The arrangement may be changed. By the change, the above-described productivity can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a flowchart showing an operation in an electronic component mounting method executed by the electronic component mounting apparatus shown in FIG.
FIG. 3 is a diagram for explaining information stored in the electronic component mounting apparatus shown in FIG. 1 and used for searching for an equivalent replacement component holding member;
4 is a diagram for explaining the structure of an exchange station provided in the electronic component mounting apparatus shown in FIG. 1; FIG.
FIG. 5 is a diagram showing an arrangement state of loaded portions in an exchange station provided in the electronic component mounting apparatus shown in FIG. 1;
6 is a view for explaining the structure of an exchange station provided in the electronic component mounting apparatus shown in FIG. 1; FIG.
7 is a view for explaining the arrangement of replacement component holding members provided in an exchange station provided in the electronic component mounting apparatus shown in FIG. 1; FIG.
FIG. 8 is a perspective view showing a modification of the exchange station provided in the electronic component mounting apparatus shown in FIG. 1;
FIG. 9 is a perspective view showing another modification example of the exchange station provided in the electronic component mounting apparatus shown in FIG. 1;
FIG. 10 is a perspective view of a conventional electronic component mounting apparatus.
11 is a diagram for explaining a nozzle arrangement state in a nozzle replacement unit provided in the electronic component mounting apparatus shown in FIG. 10;
[Explanation of symbols]
121 ... component mounting head, 122 ... component holding member,
162 ... replacement part holding member, 161 ... exchange station,
165 ... Holding member exchanging device, 167-1 ... Exchange part,
167-2 ... Holding member moving device, 181 ... Control device, 191 ... Circuit board,
192: Electronic component.

Claims

An electronic component mounting method for mounting an electronic component held by the component holding member on a circuit board by a component mounting head having a plurality of component holding members,
When the component holding member becomes defective and needs to be replaced, not only the defective component holding member but also the normal component holding member other than the defective component holding member is to be replaced, and the number of replacements of the component holding member in the component mounting head The replacement component holder is arranged in the replacement station so that the sub-pattern related to the type and arrangement of the replacement component holding members that matches the main pattern related to the type and arrangement of the component holding members in the component mounting head is minimized. When a matching arrangement is confirmed by searching from the member, the component holding member constituted by the main pattern in the component mounting head is replaced with the replacement component holding member constituted by the sub pattern, and electronic Component mounting,
An electronic component mounting method characterized by the above.

The replacement part holding member is rearranged so as to form the sub-pattern before the sub-pattern is searched when a defect occurs in the replacement part holding member of the exchange station. The electronic component mounting method described.

As a result of the search, when the sub-pattern that matches the main pattern does not exist in the replacement station, the replacement can hold the electronic component to be held by the component holding member loaded in the component mounting head. 3. The electronic component mounting method according to claim 1, wherein presence / absence of the main pattern or a similar sub-pattern similar to the main pattern is searched including the equivalent replacement component holding member included in the component holding member.

A component mounting head for detachably loading a plurality of component holding members and mounting electronic components held by the component holding members on a circuit board;
An exchange station that is replaceable with the component holding member and can hold the electronic component and has a number of replacement component holding members that exceeds the number of the component holding members in the component mounting head;
When the component holding member becomes defective and needs to be replaced, not only the defective component holding member but also the normal component holding member other than the defective component holding member is to be replaced, and the number of replacements of the component holding member in the component mounting head The replacement component holder is arranged in the replacement station so that the sub-pattern related to the type and arrangement of the replacement component holding members that matches the main pattern related to the type and arrangement of the component holding members in the component mounting head is minimized. When a matching arrangement is confirmed by searching from the member, the component holding member constituted by the main pattern in the component mounting head is replaced with the replacement component holding member constituted by the sub pattern, and electronic A control device that controls to perform component mounting;
An electronic component mounting apparatus comprising: