JP4023743B2 - Novel acrylic or methacrylic acid ester and polymer or copolymer thereof - Google Patents
Novel acrylic or methacrylic acid ester and polymer or copolymer thereof Download PDFInfo
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- JP4023743B2 JP4023743B2 JP2004100511A JP2004100511A JP4023743B2 JP 4023743 B2 JP4023743 B2 JP 4023743B2 JP 2004100511 A JP2004100511 A JP 2004100511A JP 2004100511 A JP2004100511 A JP 2004100511A JP 4023743 B2 JP4023743 B2 JP 4023743B2
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- Prior art keywords
- acrylic
- formula
- methacrylic acid
- group
- residue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims description 59
- 229920001577 copolymer Polymers 0.000 title claims description 37
- 125000005397 methacrylic acid ester group Chemical group 0.000 title claims description 26
- 229920000642 polymer Polymers 0.000 title claims description 20
- -1 lactone compounds Chemical class 0.000 claims description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical group O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000004429 atom Chemical group 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical group O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 239000000178 monomer Substances 0.000 description 29
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 239000002253 acid Substances 0.000 description 12
- 238000001312 dry etching Methods 0.000 description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 9
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000035945 sensitivity Effects 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 239000003513 alkali Substances 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 150000002596 lactones Chemical group 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical class [H]O* 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- DLDWUFCUUXXYTB-UHFFFAOYSA-N (2-oxo-1,2-diphenylethyl) 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OC(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 DLDWUFCUUXXYTB-UHFFFAOYSA-N 0.000 description 2
- FIDRAVVQGKNYQK-UHFFFAOYSA-N 1,2,3,4-tetrahydrotriazine Chemical compound C1NNNC=C1 FIDRAVVQGKNYQK-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- MRKRYJCLLIBGKG-UHFFFAOYSA-N 4-hydroxy-4,6,6-trimethylbicyclo[3.1.1]heptan-3-one;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.C1C2C(C)(C)C1CC(=O)C2(O)C MRKRYJCLLIBGKG-UHFFFAOYSA-N 0.000 description 2
- JYVXNLLUYHCIIH-UHFFFAOYSA-N 4-hydroxy-4-methyl-2-oxanone Chemical compound CC1(O)CCOC(=O)C1 JYVXNLLUYHCIIH-UHFFFAOYSA-N 0.000 description 2
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- VGZKCAUAQHHGDK-UHFFFAOYSA-M bis(4-tert-butylphenyl)iodanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 VGZKCAUAQHHGDK-UHFFFAOYSA-M 0.000 description 2
- 125000002915 carbonyl group Chemical class [*:2]C([*:1])=O 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N p-toluenesulfonic acid Substances CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 229940079877 pyrogallol Drugs 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 2
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LBHPSYROQDMVBS-UHFFFAOYSA-N (1-methylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C)CCCCC1 LBHPSYROQDMVBS-UHFFFAOYSA-N 0.000 description 1
- MWYSWCQLTATFER-UHFFFAOYSA-N (3-oxocyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCC(=O)C1 MWYSWCQLTATFER-UHFFFAOYSA-N 0.000 description 1
- CVBASHMCALKFME-UHFFFAOYSA-N (4-methoxyphenyl)-diphenylsulfanium Chemical compound C1=CC(OC)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 CVBASHMCALKFME-UHFFFAOYSA-N 0.000 description 1
- YXSLFXLNXREQFW-UHFFFAOYSA-M (4-methoxyphenyl)-phenyliodanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(OC)=CC=C1[I+]C1=CC=CC=C1 YXSLFXLNXREQFW-UHFFFAOYSA-M 0.000 description 1
- RLAWXWSZTKMPQQ-UHFFFAOYSA-M (4-tert-butylphenyl)-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 RLAWXWSZTKMPQQ-UHFFFAOYSA-M 0.000 description 1
- NZUPFZNVGSWLQC-UHFFFAOYSA-N 1,3,5-tris(2,3-dibromopropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound BrCC(Br)CN1C(=O)N(CC(Br)CBr)C(=O)N(CC(Br)CBr)C1=O NZUPFZNVGSWLQC-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- OESYNCIYSBWEQV-UHFFFAOYSA-N 1-[diazo-(2,4-dimethylphenyl)sulfonylmethyl]sulfonyl-2,4-dimethylbenzene Chemical compound CC1=CC(C)=CC=C1S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C1=CC=C(C)C=C1C OESYNCIYSBWEQV-UHFFFAOYSA-N 0.000 description 1
- GYQQFWWMZYBCIB-UHFFFAOYSA-N 1-[diazo-(4-methylphenyl)sulfonylmethyl]sulfonyl-4-methylbenzene Chemical compound C1=CC(C)=CC=C1S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C1=CC=C(C)C=C1 GYQQFWWMZYBCIB-UHFFFAOYSA-N 0.000 description 1
- MZVABYGYVXBZDP-UHFFFAOYSA-N 1-adamantyl 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C(=C)C)C3 MZVABYGYVXBZDP-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- BVBUVHZVGAXBJX-UHFFFAOYSA-N 2,4,6-tris(2,3-dibromopropyl)-1,3,5-triazine Chemical compound BrCC(Br)CC1=NC(CC(Br)CBr)=NC(CC(Br)CBr)=N1 BVBUVHZVGAXBJX-UHFFFAOYSA-N 0.000 description 1
- DAPJDRIDTLHDKU-UHFFFAOYSA-N 2,4,6-tris(3,3-dibromopropyl)-1,3,5-triazine Chemical compound BrC(Br)CCC1=NC(CCC(Br)Br)=NC(CCC(Br)Br)=N1 DAPJDRIDTLHDKU-UHFFFAOYSA-N 0.000 description 1
- XXXFZKQPYACQLD-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl acetate Chemical compound CC(=O)OCCOCCO XXXFZKQPYACQLD-UHFFFAOYSA-N 0.000 description 1
- ZJRNXDIVAGHETA-UHFFFAOYSA-N 2-[2-(3,4-dimethoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=C(OC)C(OC)=CC=C1C=CC1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 ZJRNXDIVAGHETA-UHFFFAOYSA-N 0.000 description 1
- XOPKKHCDIAYUSK-UHFFFAOYSA-N 2-[2-(5-methylfuran-2-yl)ethenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound O1C(C)=CC=C1C=CC1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 XOPKKHCDIAYUSK-UHFFFAOYSA-N 0.000 description 1
- SAFWZKVQMVOANB-UHFFFAOYSA-N 2-[tert-butylsulfonyl(diazo)methyl]sulfonyl-2-methylpropane Chemical compound CC(C)(C)S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C(C)(C)C SAFWZKVQMVOANB-UHFFFAOYSA-N 0.000 description 1
- SFPNZPQIIAJXGL-UHFFFAOYSA-N 2-ethoxyethyl 2-methylprop-2-enoate Chemical compound CCOCCOC(=O)C(C)=C SFPNZPQIIAJXGL-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- 125000002941 2-furyl group Chemical group O1C([*])=C([H])C([H])=C1[H] 0.000 description 1
- GGXVWQGJAWFVRI-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one;4-methylbenzenesulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1.C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 GGXVWQGJAWFVRI-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- PPPFYBPQAPISCT-UHFFFAOYSA-N 2-hydroxypropyl acetate Chemical compound CC(O)COC(C)=O PPPFYBPQAPISCT-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GDWQNWXRAPFIKB-UHFFFAOYSA-N 3-methoxypropyl 2-methylprop-2-enoate Chemical compound COCCCOC(=O)C(C)=C GDWQNWXRAPFIKB-UHFFFAOYSA-N 0.000 description 1
- FEZAQYCRLLDDBS-UHFFFAOYSA-N 4-bicyclo[2.2.1]heptanyl 2-methylprop-2-enoate Chemical compound C1CC2CCC1(OC(=O)C(=C)C)C2 FEZAQYCRLLDDBS-UHFFFAOYSA-N 0.000 description 1
- VZRRCQOUNSHSGB-UHFFFAOYSA-N 4-hydroxy-4,6,6-trimethylbicyclo[3.1.1]heptan-3-one Chemical compound C1C2C(C)(C)C1CC(=O)C2(O)C VZRRCQOUNSHSGB-UHFFFAOYSA-N 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- SERHXTVXHNVDKA-UHFFFAOYSA-N CC(C)(COC1=O)C1O Chemical compound CC(C)(COC1=O)C1O SERHXTVXHNVDKA-UHFFFAOYSA-N 0.000 description 1
- RGWBYLBMKXRDLI-UHFFFAOYSA-N CC(C1)C(N)OC1=O Chemical compound CC(C1)C(N)OC1=O RGWBYLBMKXRDLI-UHFFFAOYSA-N 0.000 description 1
- XVQNGICOIZBDTJ-UHFFFAOYSA-N CC(CCO1)(C1=O)O Chemical compound CC(CCO1)(C1=O)O XVQNGICOIZBDTJ-UHFFFAOYSA-N 0.000 description 1
- GFPAFTLIWBGZMF-UHFFFAOYSA-N CC(COC1=O)C1O Chemical compound CC(COC1=O)C1O GFPAFTLIWBGZMF-UHFFFAOYSA-N 0.000 description 1
- VOYDEHILKLSVNN-UHFFFAOYSA-N COC(CO1)=CC1=O Chemical compound COC(CO1)=CC1=O VOYDEHILKLSVNN-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- FWIBCWKHNZBDLS-UHFFFAOYSA-N OC(CCO1)C1=O Chemical compound OC(CCO1)C1=O FWIBCWKHNZBDLS-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- LFJLNVUGIWJQCX-UHFFFAOYSA-N [[(4-bromophenyl)-cyanomethylidene]amino] methanesulfonate Chemical compound CS(=O)(=O)ON=C(C#N)C1=CC=C(Br)C=C1 LFJLNVUGIWJQCX-UHFFFAOYSA-N 0.000 description 1
- LMBCUZJGJVCPSD-UHFFFAOYSA-N [[cyano(phenyl)methylidene]amino] 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)ON=C(C#N)C1=CC=CC=C1 LMBCUZJGJVCPSD-UHFFFAOYSA-N 0.000 description 1
- XDHUWCBFSRIEEC-UHFFFAOYSA-N [[cyano(phenyl)methylidene]amino] methanesulfonate Chemical compound CS(=O)(=O)ON=C(C#N)C1=CC=CC=C1 XDHUWCBFSRIEEC-UHFFFAOYSA-N 0.000 description 1
- PEJLVNJVORRJOP-UHFFFAOYSA-N [[cyano(phenyl)methylidene]amino] trifluoromethanesulfonate Chemical compound FC(F)(F)S(=O)(=O)ON=C(C#N)C1=CC=CC=C1 PEJLVNJVORRJOP-UHFFFAOYSA-N 0.000 description 1
- UPXATANHGSYTNL-UHFFFAOYSA-N [[cyano-(4-methoxyphenyl)methylidene]amino] ethanesulfonate Chemical compound CCS(=O)(=O)ON=C(C#N)C1=CC=C(OC)C=C1 UPXATANHGSYTNL-UHFFFAOYSA-N 0.000 description 1
- BADIYTSGNBSILF-UHFFFAOYSA-N [[cyano-(4-methoxyphenyl)methylidene]amino] methanesulfonate Chemical compound COC1=CC=C(C(=NOS(C)(=O)=O)C#N)C=C1 BADIYTSGNBSILF-UHFFFAOYSA-N 0.000 description 1
- ZMIGBWNVUSOGIL-UHFFFAOYSA-N [[cyano-(4-methoxyphenyl)methylidene]amino] trifluoromethanesulfonate Chemical compound COC1=CC=C(C(=NOS(=O)(=O)C(F)(F)F)C#N)C=C1 ZMIGBWNVUSOGIL-UHFFFAOYSA-N 0.000 description 1
- WVCAZSUCPKYBCC-UHFFFAOYSA-N [[cyano-(4-methylphenyl)methylidene]amino] propane-1-sulfonate Chemical compound CCCS(=O)(=O)ON=C(C#N)C1=CC=C(C)C=C1 WVCAZSUCPKYBCC-UHFFFAOYSA-N 0.000 description 1
- GLGXSTXZLFQYKJ-UHFFFAOYSA-N [cyclohexylsulfonyl(diazo)methyl]sulfonylcyclohexane Chemical compound C1CCCCC1S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C1CCCCC1 GLGXSTXZLFQYKJ-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-WFGJKAKNSA-N acetone d6 Chemical compound [2H]C([2H])([2H])C(=O)C([2H])([2H])[2H] CSCPPACGZOOCGX-WFGJKAKNSA-N 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- VQFAIAKCILWQPZ-UHFFFAOYSA-N bromoacetone Chemical compound CC(=O)CBr VQFAIAKCILWQPZ-UHFFFAOYSA-N 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004440 column chromatography Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- QUPDWYMUPZLYJZ-UHFFFAOYSA-N ethyl Chemical compound C[CH2] QUPDWYMUPZLYJZ-UHFFFAOYSA-N 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N methyl 2-hydroxypropionate Chemical group COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- YWTJTYXQYJSKNB-UHFFFAOYSA-N methyl propaneperoxoate Chemical compound CCC(=O)OOC YWTJTYXQYJSKNB-UHFFFAOYSA-N 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006502 nitrobenzyl group Chemical group 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- QHGUPRQTQITEPO-UHFFFAOYSA-N oxan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCO1 QHGUPRQTQITEPO-UHFFFAOYSA-N 0.000 description 1
- CSVRUJBOWHSVMA-UHFFFAOYSA-N oxolan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCO1 CSVRUJBOWHSVMA-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 125000006239 protecting group Chemical group 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
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Description
本発明は新規なアクリル又はメタクリル酸エステル及びその重合体又は共重合体に関するものである。 The present invention relates to a novel acrylic or methacrylic acid ester and a polymer or copolymer thereof.
これまで、化学増幅型レジストの樹脂成分としては、KrFエキシマレーザー光(248nm)に対し高い透明性を有するポリヒドロキシスチレンやこのヒドロキシル基を酸解離性の溶解抑制基で保護したものが主に用いられてきた。
しかしながら、近年半導体素子の微細化に対する要求はますます高まり、その光源もKrFエキシマレーザー光からより短波長のArFエキシマレーザー光(193nm)を用いるプロセスに移行しつつある。
Conventionally, the resin component of the chemically amplified resist has mainly been polyhydroxystyrene having high transparency with respect to KrF excimer laser light (248 nm) and those obtained by protecting this hydroxyl group with an acid dissociable, dissolution inhibiting group. Has been.
However, in recent years, the demand for miniaturization of semiconductor elements is increasing, and the light source is also shifting from KrF excimer laser light to a process using ArF excimer laser light (193 nm) having a shorter wavelength.
ところで、ArFエキシマレーザー光(193nm)を光源とするプロセスにおいては、従来用いていたポリヒドロキシスチレンのような芳香族環をもつ樹脂では、このArFエキシマレーザー光に対する透明性が不十分で使用できないため、これに代わるものとして芳香族環をもたないアクリル系樹脂が注目されるようになってきたが、このアクリル系樹脂は、耐ドライエッチング性が低いという欠点を有している。 By the way, in a process using ArF excimer laser light (193 nm) as a light source, a resin having an aromatic ring such as polyhydroxystyrene, which has been conventionally used, is insufficient in transparency to ArF excimer laser light and cannot be used. As an alternative, acrylic resins having no aromatic ring have attracted attention. However, this acrylic resin has a drawback of low dry etching resistance.
このような欠点を改善したものとして、透明性と耐ドライエッチング性を共に兼ね備えたアクリル系樹脂、例えばエステル部にアダマンタン骨格をもつアクリル酸エステルの重合体(特許文献1参照)や、エステル部にアダマンタン骨格をもつアクリル酸エステルとアクリル酸テトラヒドロピラニルエステルとの共重合体(特許文献2参照)などが提案されているが、このようなアダマンタン骨格を有するアクリル酸エステルを構成単位として導入するには、特別な原料を用いなければならないので、コスト高になるのを免れない上に、これらのものは感度が低く、しかもレジストパターン形状も良好でないという欠点があるため、工業化するのは難しい。 As an improvement of such drawbacks, an acrylic resin having both transparency and dry etching resistance, such as a polymer of an acrylate ester having an adamantane skeleton in the ester portion (see Patent Document 1), and an ester portion A copolymer of an acrylate ester having an adamantane skeleton and a tetrahydropyranyl acrylate ester (see Patent Document 2) has been proposed. To introduce an acrylate ester having an adamantane skeleton as a constituent unit Since special raw materials have to be used, the cost is unavoidable, and these have the disadvantages of low sensitivity and poor resist pattern shape, making it difficult to industrialize.
一方、ArFエキシマレーザー光を用いるプロセスにおいては、0.2μm以下の超微細パターンを解像性よく形成させることが重要な目的となっているが、このような超微細パターンを形成させる場合、これまでのホトレジストでは基板とレジスト層との密着性が不足し、パターン倒れを生じる。 On the other hand, in the process using ArF excimer laser light, it is an important purpose to form an ultrafine pattern of 0.2 μm or less with good resolution. In the photoresists up to this point, the adhesion between the substrate and the resist layer is insufficient, and pattern collapse occurs.
このため、アクリル酸の3‐オキソシクロヘキシルエステル(特許文献3参照)や、γ‐ブチロラクトン(特許文献4参照)のような含酸素複素環基をもつアクリル酸エステルを構成単位として導入したものが提案されているが、このような含酸素複素環基をもつアクリル酸エステル単位を導入したアクリル系樹脂は、密着性の点では幾分改善が認められるものの、製造工程が煩雑であって、量産に不適である上、現像液として用いられるアルカリ水溶液に対する親和性が不十分で、半導体素子製造の主流となっているパドル現像においては、忠実なレジストパターンが形成できない。このため、基板に対する密着性が優れ、しかもパドル現像可能なアルカリ水溶液に対する親和性を有するArFエキシマレーザー光用レジストの出現が、この分野において要望されている。 For this reason, the introduction of an acrylic acid ester having an oxygen-containing heterocyclic group such as 3-oxocyclohexyl ester of acrylic acid (see Patent Document 3) and γ-butyrolactone (see Patent Document 4) as a structural unit is proposed. However, the acrylic resin introduced with an acrylate ester unit having such an oxygen-containing heterocyclic group is somewhat improved in terms of adhesion, but the production process is complicated and mass production is difficult. In addition, in the paddle development which is the mainstream of semiconductor device manufacturing, a faithful resist pattern cannot be formed because the affinity for an aqueous alkali solution used as a developer is insufficient. For this reason, the advent of an ArF excimer laser light resist having excellent adhesion to a substrate and having an affinity for an aqueous alkali solution capable of paddle development is desired in this field.
そのほか、メバロニックラクトンのようなラクトン環中のβ位でアクリル酸とのエステルを形成し、かつこのβ位の炭素にアルキル基を導入することにより脱離性を高めたアクリル酸エステルを構成単位とするものも知られているが(特許文献5参照)、このものは、露光部と未露光部のコントラストが十分でないため、感度、解像度共に満足しうるものではない。 In addition, it forms an ester with acrylic acid at the β-position in the lactone ring, such as mevalonic lactone, and an acrylate ester with improved detachability by introducing an alkyl group into the β-position carbon. Although what is made into a unit is also known (refer patent document 5), since this does not have sufficient contrast of an exposure part and an unexposed part, neither sensitivity nor resolution is satisfactory.
本発明は、このような事情のもとで、ArFエキシマレーザー光に対する透明性が高く、高感度で高解像度を有し、かつアルカリに対して親和性が高く、パドル現像により、パターン形状、耐ドライエッチング性、密着性の良好なパターンが得られるポジ型ホトレジスト組成物に用いるのに好適な新規なアクリル又はメタクリル酸エステルとその重合体及び共重合体を提供することを目的としてなされたものである。 Under such circumstances, the present invention is highly transparent to ArF excimer laser light, has high sensitivity and high resolution, and has high affinity for alkali. It was made for the purpose of providing a novel acrylic or methacrylic acid ester suitable for use in a positive photoresist composition capable of obtaining a pattern with good dry etching and adhesion, and a polymer and copolymer thereof. is there.
本発明者らは、ArFエキシマレーザー用のポジ型ホトレジスト組成物を開発すべく鋭意研究を重ねた結果、エステル部に、ラクトン化合物が結合した分枝状アルキル基、特にイソプロピル基を有する新規なアクリル酸エステル若しくはメタクリル酸エステルの重合体又は共重合体がArFエキシマレーザー光に対する透明性が高く、高感度、高解像性を有し、かつ優れた物性のパターンを形成するポジ型ホトレジスト組成物を与えることを見出し、この知見に基づいて本発明を完成するに至った。 The present inventors have made intensive studies to develop a positive photoresist composition for ArF excimer laser, the ester moiety, a branched alkyl group lactone compound is bonded, novel acrylic especially isopropyl A positive photoresist composition in which a polymer or copolymer of an acid ester or methacrylic acid ester is highly transparent to ArF excimer laser light, has high sensitivity, high resolution, and forms an excellent physical property pattern And the present invention has been completed based on this finding.
すなわち、本発明の第1の目的は下記一般式
で表わされるアクリル若しくはメタクリル酸エステルを提供することである。
That is, the first object of the present invention is the following general formula.
An acrylic or methacrylic acid ester represented by:
前記一般式(I)において、R2及びR3で示される炭素数1〜4の低級アルキル基は、直鎖状又は分枝状のいずれでもよく、具体的にはメチル基、エチル基、n‐プロピル基、イソプロピル基、n‐ブチル基、イソブチル基、sec‐ブチル基、tert‐ブチル基などが挙げられる。 In formula (I), lower alkyl group having 1 to 4 carbon atoms represented by R 2 and R 3 may be linear or branched, for example, methyl, ethyl radical, n -Propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group and the like.
本発明においては、このR2及びR3がともに炭素数1〜4の低級アルキル基であることが必要であり、これらのどちらかあるいは両方が水素原子では本発明の目的が達せられない。R2及びR3は、ともに上記低級アルキル基であればよく、制限されるものではないが、共にメチル基であるものが入手の容易さから好ましい。 In the present invention, both R 2 and R 3 are required to be a lower alkyl group having 1 to 4 carbon atoms , and if either or both of them are hydrogen atoms, the object of the present invention cannot be achieved. R 2 and R 3 may be any of the above lower alkyl groups, and are not limited. However, those that are both methyl groups are preferred from the standpoint of availability.
一方、R4のうちのラクトン化合物の炭素原子に結合した水素原子1個を除いて形成される残基としては、γ‐ブチロラクトン残基、δ‐バレロラクトン残基及びこれらの誘導体残基などが挙げられる。ここで誘導体としては、メチル基やエチル基などの炭素数1又は2の低級アルキル置換体、メトキシ基、エトキシ基などの炭素数1又は2の低級アルコキシ置換体、ラクトン環上に酸素原子を複数有するもの、ラクトン環にメトキシカルボニル基やアシル基が結合したものなどが挙げられる。これらの中でγ‐ブチロラクトン残基及び上記の低級アルキル基又は低級アルコキシ基をもつγ‐ブチロラクトン残基が好ましい。 On the other hand, the residues formed by removing one hydrogen atom bonded to the carbon atom of the lactone compound of R 4 include γ-butyrolactone residue, δ-valerolactone residue, and derivatives thereof. Can be mentioned. Here, examples of the derivative include a lower alkyl substituent having 1 or 2 carbon atoms such as a methyl group and an ethyl group, a lower alkoxy substituted having 1 or 2 carbon atoms such as a methoxy group and an ethoxy group, and a plurality of oxygen atoms on a lactone ring. And those having a lactone ring bonded to a methoxycarbonyl group or an acyl group. Among these, a γ-butyrolactone residue and a γ-butyrolactone residue having the above lower alkyl group or lower alkoxy group are preferred.
前記一般式(I)で表わされるアクリル酸エステル又はメタクリル酸エステルにおいて、前記ラクトン化合物残基をもつアルコール成分としては、例えば、
本発明の第2の目的は、一般式
で表わされるアクリル又はメタクリル酸エステルを提供することである。
The second object of the present invention is to formula
An acrylic or methacrylic acid ester represented by:
本発明の第3の目的は、一般式
で表わされる構成単位を含むアクリル若しくはメタクリル系重合体又は共重合体を提供することである。
The third object of the present invention is to provide a general formula
An acrylic or methacrylic polymer or copolymer containing a structural unit represented by:
本発明の第4の目的は、一般式
で表わされる構成単位を含むアクリル系若しくはメタクリル系重合体又は共重合体を提供することである。
The fourth object of the present invention is to formula
To provide an acrylic or methacrylic polymer or copolymer comprising a structural unit represented in.
そして、本発明の一般式(II)で表わされるアクリル酸若しくはメタクリル酸エステルは、アクリル酸又はメタクリル酸を相当するアルコールでエステル化することにより得られ、安価で、かつ容易に製造可能であり、量産性に適している。 The acrylic acid or methacrylic acid ester represented by the general formula (II) of the present invention is obtained by esterifying acrylic acid or methacrylic acid with a corresponding alcohol, and can be produced inexpensively and easily. Suitable for mass production.
次に、本発明の重合体は、一般式(I)又は(II)で表わされるモノマーを単独で重合させることにより得られる。本発明の共重合体は、一般式(I)又は(II)で表わされるモノマーの中の2種を共重合させてもよいし、またこのモノマーと他のモノマーとを共重合させてもよい。 Next, the polymer of the present invention can be obtained by polymerizing the monomer represented by the general formula (I) or (II) alone. In the copolymer of the present invention, two of the monomers represented by the general formula (I) or (II) may be copolymerized, or this monomer and another monomer may be copolymerized. .
この際、共重合させる他のモノマーとしては、例えば(a−1)従来、化学増幅型ポジ型ホトレジストに用いられている公知の耐ドライエッチング性向上基又は酸解離性基などの保護基を有するアクリル若しくはメタクリル酸誘導体、(a−2)アクリル若しくはメタクリル酸、マレイン酸、フマル酸などのアルカリ可溶性とするためのエチレン性二重結合を有するカルボン酸、(a−3)アクリル樹脂として公知のモノマー成分及び(a−4)その他の酸素含有環状基を有するアクリル系モノマーなどが挙げられる。これらのほかのモノマーは適宜組み合わせて用いてもよい。 In this case, the other monomer to be copolymerized has, for example, (a-1) a protective group such as a known dry etching resistance improving group or acid dissociable group conventionally used in chemically amplified positive photoresists. Acrylic or methacrylic acid derivative, (a-2) carboxylic acid having an ethylenic double bond for alkali solubility such as acrylic or methacrylic acid, maleic acid, fumaric acid, (a-3) a monomer known as an acrylic resin Examples thereof include acrylic monomers having components and (a-4) other oxygen-containing cyclic groups. These other monomers may be used in appropriate combination.
前記(a−1)モノマーとしては例えば、アクリル若しくはメタクリル酸tert‐ブチル、アクリル若しくはメタクリル酸テトラヒドロピラニル、アクリル若しくはメタクリル酸テトラヒドロフラニル、アクリル若しくはメタクリル酸1‐メチルシクロヘキシル、アクリル若しくはメタクリル酸2‐メチルアダマンチル、アクリル若しくはメタクリル酸エトキシエチル、アクリル若しくはメタクリル酸メトキシプロピル、アクリル若しくはメタクリル酸と2‐ヒドロキシ‐3‐ピナノンのエステルなどのカルボキシル基の水酸基を酸解離性置換基で保護したアクリル若しくはメタクリル酸エステル、又はアクリル若しくはメタクリル酸アダマンチル、アクリル若しくはメタクリル酸シクロヘキシル、アクリル若しくはメタクリル酸ナフチル、アクリル若しくはメタクリル酸ベンジル、アクリル若しくはメタクリル酸3‐オキソシクロヘキシル、アクリル若しくはメタクリル酸ビシクロ[2,2,1]ヘプチル、アクリル若しくはメタクリル酸トリシクロデカニル、アクリル若しくはメタクリル酸とテルピネオールとのエステル、アクリル若しくはメタクリル酸と3‐ブロモアセトンとのエステルなどのカルボキシル基の水酸基を酸非解離性置換基で保護したものなどが挙げられる。 Examples of the monomer (a-1) include tert-butyl acrylate or methacrylate, acrylic or tetrahydropyranyl methacrylate, acrylic or tetrahydrofuranyl methacrylate, acrylic or 1-methylcyclohexyl methacrylate, acrylic or 2-methyl methacrylate. Acrylic or methacrylic acid ester in which the hydroxyl group of the carboxyl group such as adamantyl, acrylic or ethoxyethyl methacrylate, acrylic or methoxypropyl methacrylate, acrylic or methacrylic acid and 2-hydroxy-3-pinanone ester is protected with an acid-dissociable substituent Or acrylic or adamantyl methacrylate, acrylic or cyclohexyl methacrylate, acrylic or naphthyl methacrylate Acrylic or benzyl methacrylate, acrylic or 3-oxocyclohexyl methacrylate, acrylic or bicyclo [2,2,1] heptyl methacrylate, acrylic or tricyclodecanyl methacrylate, acrylic or ester of methacrylic acid and terpineol, acrylic or Examples thereof include those in which the hydroxyl group of a carboxyl group such as an ester of methacrylic acid and 3-bromoacetone is protected with an acid non-dissociable substituent.
このような(a−1)モノマーは、例えば一般式
で表わすことができる。
Such a monomer (a-1) has, for example, the general formula
It can be expressed as
また(a−2)モノマーとしては、例えばアクリル若しくはメタクリル酸、マレイン酸、フマル酸などが挙げられるが、これらの中でアクリル若しくはメタクリル酸が好ましい。
さらに、(a−3)モノマーとしては、例えば(イ)アクリル若しくはメタクリル酸メチル、アクリル若しくはメタクリル酸エチル、アクリル若しくはメタクリル酸プロピル、アクリル若しくはメタクリル酸イソプロピル、アクリル若しくはメタクリル酸n‐ブチル、アクリル若しくはメタクリル酸イソブチル、アクリル若しくはメタクリル酸n‐ヘキシル、アクリル若しくはメタクリル酸オクチル、アクリル若しくはメタクリル酸2‐エチルヘキシル、アクリル若しくはメタクリル酸ラウリル、アクリル若しくはメタクリル酸2‐ヒドロキシエチル、アクリル若しくはメタクリル酸2‐ヒドロキシプロピルなどのアルキルエステル、(ロ)アクリル若しくはメタクリルアミド、N‐メチロールアクリル若しくはメタクリルアミド、ジアセトンアクリルアミドなどのアミド、(ハ)アクリロニトリル、メタクリロニトリル、塩化ビニル、エチルビニルエーテルなどを挙げることができる。
Examples of the monomer (a-2) include acrylic or methacrylic acid, maleic acid, and fumaric acid. Among these, acrylic or methacrylic acid is preferable.
Further, (a-3) monomers include, for example, (a) acrylic or methyl methacrylate, acrylic or ethyl methacrylate, acrylic or propyl methacrylate, acrylic or isopropyl methacrylate, acrylic or n-butyl methacrylate, acrylic or methacrylic Isobutyl acid, acrylic or n-hexyl methacrylate, acrylic or octyl methacrylate, acrylic or 2-ethylhexyl methacrylate, acrylic or lauryl methacrylate, acrylic or 2-hydroxyethyl methacrylate, acrylic or 2-hydroxypropyl methacrylate, etc. Alkyl esters, (b) acrylic or methacrylamide, N-methylolacrylic or methacrylamide, diacetate Amides such as acrylamide, mention may be made of (c) acrylonitrile, methacrylonitrile, vinyl chloride, and ethyl vinyl ether.
(a−4)のその他の酸素含有環状基を有するアクリル系モノマーとしては、(ニ)一般式
で表わされるアクリル若しくはメタクリル酸エステルが用いられる。このアクリル若しくはメタクリル酸エステルのアルコール成分を形成するアルコール又はエチレン性二重結合化合物として、例えば式
この一般式(VI)で表わされるアクリル若しくはメタクリル酸エステルのうち、nが1でR6及びR7がともにメチル基であるもの、またnが1でR8が水素原子であるものがアルカリに対する親和性に特に優れ、パドル現像に好適であるので特に好ましい。
Examples of the acrylic monomer having another oxygen-containing cyclic group (a-4) include (d) general formula
An acrylic or methacrylic acid ester represented by As an alcohol or an ethylenic double bond compound that forms the alcohol component of the acrylic or methacrylic acid ester, for example, the formula
Among the acrylic or methacrylic acid esters represented by the general formula ( VI ), those in which n is 1 and R 6 and R 7 are both methyl groups, and those in which n is 1 and R 8 is a hydrogen atom are for alkali. It is particularly preferable because it is particularly excellent in affinity and suitable for paddle development.
また、(ホ)一般式
で表わされるアクリル若しくはメタクリル酸エステルも用いることができる。このアクリル若しくはメタクリル酸エステルのアルコール部分を形成するエチレン性二重結合含有化合物としては、例えば、式
An acrylic or methacrylic acid ester represented by the formula can also be used. Examples of the ethylenic double bond-containing compound that forms the alcohol part of the acrylic or methacrylic acid ester include, for example, the formula
さらに(ヘ)一般式
で表わされるアクリル若しくはメタクリル酸エステルも用いることができる。このアクリル若しくはメタクリル酸エステルのアルコール部分を形成するエチレン性二重結合含有化合物として、例えば、式
An acrylic or methacrylic acid ester represented by the formula can also be used. Examples of the ethylenic double bond-containing compound that forms the alcohol portion of the acrylic or methacrylic acid ester include, for example, the formula
本発明における共重合体としては、一般式(II)で表わされるモノマーと、前記(a−1)、(a−2)、(a−3)及び(a−4)のモノマーの中から選ばれた少なくとも1種とを重合させて得られた共重合体が好ましいが、中でも一般式(II)で表わされるモノマーと、(a−1)及び(a−4)の中から選ばれた少なくとも1種、特に一般式(VI)で表わされるアクリル若しくはメタクリル酸エステル又は2‐ヒドロキシ‐3‐ピナノンのアクリル若しくはメタクリル酸エステルとを重合させて得られた共重合体が好適である。 The copolymer in the present invention is selected from the monomer represented by the general formula (II) and the monomers (a-1), (a-2), (a-3) and (a-4). Preferred is a copolymer obtained by polymerizing at least one selected from the group consisting of a monomer represented by general formula (II) and at least selected from (a-1) and (a-4). A copolymer obtained by polymerizing one kind, particularly an acrylic or methacrylic acid ester represented by the general formula ( VI ) or an acrylic or methacrylic acid ester of 2-hydroxy-3-pinanone is preferred.
共重合体の中で、モノマーの単位20〜80モル%、好ましくは40〜70モル%と(a−1)及び(a−4)の中から選ばれた少なくとも1種のモノマーの単位80〜20モル%、好ましくは60〜30モル%とから成る共重合体は、耐ドライエッチング性、密着性、未露光部と露光部のコントラストが優れるポジ型ホトレジストを与える。 In the copolymer, monomer units of 20 to 80 mol%, preferably 40 to 70 mol%, and at least one monomer unit selected from (a-1) and (a-4) 80 to A copolymer comprising 20 mol%, preferably 60 to 30 mol%, gives a positive photoresist having excellent dry etching resistance, adhesion, and contrast between the unexposed and exposed areas.
ポジ型ホトレジストを調製する場合、本発明の重合体又は共重合体は、放射線照射により酸を発生する酸発生剤と共に用いられる。
この酸発生剤としては、これまで化学増幅型レジストの酸発生剤として知られている化合物の中から任意に選んで用いることができる。
このような化合物としては、例えば次に示すものを挙げることができる。
When preparing a positive photoresist, the polymer or copolymer of the present invention is used together with an acid generator that generates an acid upon irradiation.
The acid generator can be arbitrarily selected from compounds known so far as acid generators for chemically amplified resists.
Examples of such compounds include the following.
(i)ビススルホニルジアゾメタン;
ビス(p‐トルエンスルホニル)ジアゾメタン、ビス(1,1‐ジメチルエチルスルホニル)ジアゾメタン、ビス(シクロヘキシルスルホニル)ジアゾメタン、ビス(2,4‐ジメチルフェニルスルホニル)ジアゾメタンなど。
(I) bissulfonyldiazomethane;
Bis (p-toluenesulfonyl) diazomethane, bis (1,1-dimethylethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (2,4-dimethylphenylsulfonyl) diazomethane, and the like.
(ii)ニトロベンジル誘導体;
p‐トルエンスルホン酸2‐ニトロベンジル、p‐トルエンスルホン酸2,6‐ジニトロベンジルなど。
(Ii) a nitrobenzyl derivative;
p-toluenesulfonic acid 2-nitrobenzyl, p-toluenesulfonic acid 2,6-dinitrobenzyl and the like.
(iii)スルホン酸エステル;
ピロガロールトリメシレート、ピロガロールトリトシレートなど。
(Iii) sulfonate esters;
Pyrogallol trimesylate, pyrogallol tritosylate, etc.
(iv)オニウム塩;
ジフェニルヨードニウムヘキサフルオロフェスフェート、(4‐メトキシフェニル)フェニルヨードニウムトリフルオロメタンスルホネート、ビス(p‐tert‐ブチルフェニル)ヨードニウムトリフルオロメタンスルホネート、トリフェニルスルホニウムヘキサフルオロフェスフェート、(4‐メトキシフェニル)ジフェニルスルホニウムトリフルオロメタンスルホネート、(p‐tert‐ブチルフェニル)ジフェニルスルホニウムトリフルオロメタンスルホネート、トリフェニルスルホニウムトリフルオロメタンスルホネートなど。
(Iv) Onium salts;
Diphenyliodonium hexafluorophosphate, (4-methoxyphenyl) phenyliodonium trifluoromethanesulfonate, bis (p-tert-butylphenyl) iodonium trifluoromethanesulfonate, triphenylsulfonium hexafluorophosphate, (4-methoxyphenyl) diphenylsulfonium trifluoro Lomethanesulfonate, (p-tert-butylphenyl) diphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium trifluoromethanesulfonate, and the like.
(v)ベンゾイントシレート及びそのアルキル置換体;
ベンゾイントシレート、α‐メチルベンゾイントシレートなど。
(V) benzoin tosylate and alkyl-substituted products thereof;
Benzoin tosylate, α-methylbenzoin tosylate, etc.
(vi)ハロゲン含有トリアジン化合物;
2‐(4‐メトキシフェニル)‐4,6‐(ビストリクロロメチル)‐1,3,5‐トリアジン、2‐(4‐メトキシナフチル)‐4,6‐(ビストリクロロメチル)‐1,3,5‐トリアジン、2‐[2‐(2‐フリル)エテニル]‐4,6‐(ビストリクロロメチル)‐1,3,5‐トリアジン、2‐[2‐(5‐メチル‐2‐フリル)エテニル]‐4,6‐ビス(トリクロロメチル)‐1,3,5‐トリアジン、2‐[2‐(3,5‐ジメトキシフェニル)エテニル]‐4,6‐ビス(トリクロロメチル)‐1,3,5‐トリアジン、2‐[2‐(3,4‐ジメトキシフェニル)エテニル]‐4,6‐ビス(トリクロロメチル)‐1,3,5‐トリアジン、2‐(3,4‐メチレンジオキシフェニル)‐4,6‐ビス(トリクロロメチル)‐1,3,5‐トリアジン、2,4,6‐トリス(ジブロモプロピル)‐1,3,5‐トリアジン、トリス(2,3‐ジブロモプロピル)‐1,3,5‐トリアジン、トリス(2,3‐ジブロモプロピル)イソシアヌレートなど。
(Vi) a halogen-containing triazine compound;
2- (4-Methoxyphenyl) -4,6- (bistrichloromethyl) -1,3,5-triazine, 2- (4-methoxynaphthyl) -4,6- (bistrichloromethyl) -1,3 5-triazine, 2- [2- (2-furyl) ethenyl] -4,6- (bistrichloromethyl) -1,3,5-triazine, 2- [2- (5-methyl-2-furyl) ethenyl ] -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- [2- (3,5-dimethoxyphenyl) ethenyl] -4,6-bis (trichloromethyl) -1,3 5-triazine, 2- [2- (3,4-dimethoxyphenyl) ethenyl] -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (3,4-methylenedioxyphenyl) -4,6-bis (trichloromethyl) ) -1,3,5-triazine, 2,4,6-tris (dibromopropyl) -1,3,5-triazine, tris (2,3-dibromopropyl) -1,3,5-triazine, tris ( 2,3-dibromopropyl) isocyanurate and the like.
(vii)シアノ基を有するオキシムスルホネート;
α‐(メチルスルホニルオキシイミノ)‐フェニルアセトニトリル、α‐(メチルスルホニルオキシイミノ)‐4‐メトキシフェニルアセトニトリル、α‐(トリフルオロメチルスルホニルオキシイミノ)‐フェニルアセトニトリル、α‐(トリフルオロメチルスルホニルオキシイミノ)‐4‐メトキシフェニルアセトニトリル、α‐(エチルスルホニルオキシイミノ)‐4‐メトキシフェニルアセトニトリル、α‐(プロピルスルホニルオキシイミノ)‐4‐メチルフェニルアセトニトリル、α‐(メチルスルホニルオキシイミノ)‐4‐ブロモフェニルアセトニトリル、α‐(メチルスルホニルオキシイミノ)‐1‐シクロペンテニルアセトニトリル、α‐[1‐(又は2‐)ナフチルスルホニルオキシイミノ]‐4‐メトキシベンジルシアニド、α‐(10‐カンファースルホニルオキシイミノ)‐4‐メトキシベンジルシアニド、α‐(p‐トルエンスルホニルオキシイミノ)‐フェニルアセトニトリル、α‐フェニルスルホニルオキシイミノ‐p‐メトキシフェニルアセトニトリルなど。
(Vii) an oxime sulfonate having a cyano group;
α- (Methylsulfonyloxyimino) -phenylacetonitrile, α- (methylsulfonyloxyimino) -4-methoxyphenylacetonitrile, α- (trifluoromethylsulfonyloxyimino) -phenylacetonitrile, α- (trifluoromethylsulfonyloxyimino ) -4-Methoxyphenylacetonitrile, α- (ethylsulfonyloxyimino) -4-methoxyphenylacetonitrile, α- (propylsulfonyloxyimino) -4-methylphenylacetonitrile, α- (methylsulfonyloxyimino) -4-bromo Phenylacetonitrile, α- (methylsulfonyloxyimino) -1-cyclopentenylacetonitrile, α- [1- (or 2-) naphthylsulfonyloxyimino] -4-methoxybenzylcani , Alpha-(10- camphorsulfonyl) -4-methoxybenzyl cyanide, alpha-(p-toluenesulfonyloxy imino) - phenylacetonitrile, alpha-phenylsulfonyl such oxyimino -p- methoxyphenyl acetonitrile.
これらの酸発生剤の中で特に好ましいのは、オニウム塩及びシアノ基を有するオキシムスルホネートである。本発明の重合体又は共重合体と酸発生剤との配合割合は、前者100重量部に対し、通常後者0.5〜30重量部、好ましくは、1〜10重量部である。この範囲よりも少なくなると像形成ができにくいし、多くなると、均一な溶液とならず、保存安定性が低下する。 Particularly preferred among these acid generators are onium salts and oxime sulfonates having a cyano group. The blending ratio of the polymer or copolymer of the present invention and the acid generator is usually 0.5 to 30 parts by weight, preferably 1 to 10 parts by weight with respect to 100 parts by weight of the former. If the amount is less than this range, it is difficult to form an image.
このポジ型ホトレジストには、所望に応じ、本発明の重合体又は共重合体及び酸発生剤に加えて、通常の化学増幅型ホトレジストに慣用されている添加成分、例えば、ハレーション防止剤、酸化防止剤、熱安定剤、密着性向上剤、可塑剤、着色剤、界面活性剤、付加的樹脂、有機カルボン酸、アミン類などを本発明組成物の特性が阻害されない範囲の量で配合することができる。 In addition to the polymer or copolymer of the present invention and an acid generator, the positive type photoresist includes, as desired, additive components commonly used in ordinary chemically amplified photoresists, such as antihalation agents, antioxidants, and the like. An agent, a heat stabilizer, an adhesion improver, a plasticizer, a colorant, a surfactant, an additional resin, an organic carboxylic acid, an amine, and the like may be added in an amount that does not impair the properties of the composition of the present invention. it can.
このようにして調製されたポジ型ホトレジストは、その使用に当たっては上記各成分を溶剤に溶解した溶液の形で用いるのが好ましい。このような溶剤の例としては、アセトン、メチルエチルケトン、シクロヘキサノン、メチルイソアミルケトン、2‐ヘプタノンなどのケトン類や、エチレングリコール、エチレングリコールモノアセテート、ジエチレングリコール、ジエチレングリコールモノアセテート、プロピレングリコール、プロピレングリコールモノアセテート、ジプロピレングリコール、又はジプロピレングリコールモノアセテートのモノメチルエーテル、モノエチルエーテル、モノプロピルエーテル、モノブチルエーテル又はモノフェニルエーテルなどの多価アルコール類及びその誘導体や、ジオキサンのような環式エーテル類や、乳酸メチル、乳酸エチル、酢酸メチル、酢酸エチル、酢酸ブチル、ピルビン酸メチル、ピルビン酸エチル、メトキシプロピオン酸メチル、エトキシプロピオン酸エチルなどのエステル類を挙げることができる。これらは単独で用いてもよいし、2種以上混合して用いてもよい。 The positive photoresist prepared in this manner is preferably used in the form of a solution in which the above components are dissolved in a solvent. Examples of such solvents include ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl isoamyl ketone, 2-heptanone, ethylene glycol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monoacetate, propylene glycol, propylene glycol monoacetate, Polypropylene and its derivatives such as dipropylene glycol or dipropylene glycol monoacetate monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether or monophenyl ether, cyclic ethers such as dioxane, lactic acid Methyl, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methoxypropionate Can be exemplified Le, esters such as ethyl ethoxypropionate. These may be used alone or in combination of two or more.
このポジ型ホトレジストを用いれば、例えば次のようにしてパターン形成することができる。すなわち、このホトレジストを、シリコンウエーハなどの基板上に塗布し、70〜150℃で30〜150秒間プリベイクを行い、レジスト層を形成したのち、マスクを介してArFエキシマレーザー光などの放射線を照射し、70〜150℃程度の加熱を30秒から150秒行い、次いで現像を行う。レジストの現像液としては、アルカリ性水溶液を用いることができ現像により、露光部がアルカリ性水溶液に溶解し、ポジ型のパターンが得られる。アルカリ性水溶液としては例えばテトラメチルアンモニウムヒドロキシド、コリンなどの水溶液を用いることができる。 If this positive photoresist is used, a pattern can be formed as follows, for example. That is, this photoresist is applied on a substrate such as a silicon wafer, pre-baked at 70 to 150 ° C. for 30 to 150 seconds to form a resist layer, and then irradiated with radiation such as ArF excimer laser light through a mask. , Heating at about 70 to 150 ° C. is performed for 30 seconds to 150 seconds, and then development is performed. As the resist developer, an alkaline aqueous solution can be used. By development, the exposed portion is dissolved in the alkaline aqueous solution, and a positive pattern is obtained. As the alkaline aqueous solution, for example, an aqueous solution of tetramethylammonium hydroxide, choline, or the like can be used.
本発明の重合体又は共重合体を用いたポジ型ホトレジストは、ArFエキシマレーザー光に対する透明性が高く、高感度で高解像度を有し、かつアルカリに対して親和性が高く、パドル現像により、パターン形状、耐ドライエッチング性、密着性の良好なレジストパターンを与えることができる。 The positive photoresist using the polymer or copolymer of the present invention has high transparency to ArF excimer laser light, high sensitivity and high resolution, and high affinity for alkali. A resist pattern having good pattern shape, dry etching resistance and adhesion can be provided.
次に、実施例により本発明を実施するための最良の形態を詳細に説明するが、本発明は、これらの例によってなんら限定されるものではない。 Next, the best mode for carrying out the present invention will be described in detail by way of examples, but the present invention is not limited to these examples.
モノマーIの製造
式
次いで、25℃にて24時間反応させたのち、反応液をろ過した。そのろ液の溶媒を留去し、残存生成物をジエチルエーテル300ミリリットルに溶解し、10重量%水酸化ナトリウム水溶液で10回洗浄した。次いで、n‐ヘプタンを溶媒としてカラムクロマトグラフィーにより精製し、無色の液体として、上記アルコールのメタクリル酸エステル(モノマーI)を得た。
この生成物の1H−NMR(溶媒:アセトン−d6)を測定した結果、0.99、1.19、1.4〜2.7、2.80、4.55、5.50、6.00ppmにピークが認められた。
また赤外吸収スペクトルによる分析の結果、1755、1777cm-1にカルボニルに由来するピークが認められた。
Monomer I production formula
Subsequently, after making it react at 25 degreeC for 24 hours, the reaction liquid was filtered. The solvent of the filtrate was distilled off, and the remaining product was dissolved in 300 ml of diethyl ether and washed 10 times with a 10 wt% aqueous sodium hydroxide solution. Subsequently, it was purified by column chromatography using n-heptane as a solvent to obtain a methacrylic acid ester (monomer I ) of the alcohol as a colorless liquid.
As a result of measuring 1 H-NMR (solvent: acetone-d6) of this product, 0.99, 1.19, 1.4 to 2.7, 2.80, 4.55, 5.50, 6. A peak was observed at 00 ppm.
As a result of analysis by infrared absorption spectrum, peaks derived from carbonyl were observed at 1755 and 1777 cm −1 .
共重合体A−1の製造
実施例1で得たモノマーI 15.1g(0.0625モル、全モノマーに対し、50モル%)及び式
共重合体A−2の製造
実施例1で得たモノマーI 15.1g(0.0625モル、全モノマーに対し、50モル%)及び式
共重合体A−3の製造
実施例2において、前記式(X)で示されるメタクリル酸エステル11.5gの代わりに、2‐ヒドロキシ‐3‐ピナノンのメタクリル酸エステル14.8g(0.0625モル、全モノマーに対し、50モル%)を用い、溶媒をテトラヒドロフラン150gからジオキサン100gに代えた以外は、実施例2と同様にして、モノマーIと2‐ヒドロキシ‐3‐ピナノンのメタクリル酸エステルの共重合体(共重合体A−3)16.3gを得た。このものの重量平均分子量は9,200であり、分散度は2.6であった。
Production of Copolymer A- 3 In Example 2 , instead of 11.5 g of the methacrylic acid ester represented by the formula ( X ), 14.8 g (0.0625 mol) of 2-hydroxy-3-pinanone methacrylic acid ester In the same manner as in Example 2 , except that the solvent was changed from 150 g of tetrahydrofuran to 100 g of dioxane, the monomer I was co-polymerized with monomer I and 2-hydroxy-3-pinanone methacrylate. 16.3 g of a polymer (copolymer A- 3 ) was obtained. This had a weight average molecular weight of 9,200 and a dispersity of 2.6.
参考例1
実施例2で得た共重合体(A−1)100重量部、ビス(p‐tert‐ブチルフェニル)ヨードニウムトリフルオロメタンスルホネート2重量部をプロピレングリコールモノメチルエーテルアセテート680重量部に溶解してポジ型ホトレジスト溶液を得た。
次いで、このホトレジスト溶液をスピンナーを用いてシリコンウエーハ上に塗布し、ホットプレート上で100℃で90秒間乾燥することにより、膜厚0.5μmのレジスト層を形成した。次いで、ArF露光装置(ニコン社製)により、ArFエキシマレーザー光(193nm)を選択的に照射したのち、110℃,90秒間加熱処理し、次いで2.38重量%テトラメチルアンモニウムヒドロキシド水溶液で65秒間パドル現像し、30秒間水洗して乾燥した。
このような操作で形成された0.30μmのラインアンドスペースが1:1に形成される露光時間を感度としてmJ/cm2(エネルギー量)単位で測定したところ、11.0mJ/cm2であった。
また、このようにして形成された0.25μmのレジストパターンの断面形状をSEM(走査型電子顕微鏡)写真により、観察したところ、基板に対して垂直な矩形のレジストパターンであった。
また、このような操作で0.20μmのレジストパターンまで解像され、パターン倒れはなかった。
次いで、テトラフルオロメタンガスをエッチングガスとして、エッチング装置OAPM−406(東京応化工業株式会社製)でドライエッチング処理し、耐ドライエッチング性を単位時間当たりの膜減り量で評価し、ポリヒドロキシスチレンを1.0とした場合、1.08であった。
Reference example 1
100 parts by weight of copolymer (A-1) obtained in Example 2 and 2 parts by weight of bis (p-tert-butylphenyl) iodonium trifluoromethanesulfonate were dissolved in 680 parts by weight of propylene glycol monomethyl ether acetate to form a positive photoresist. A solution was obtained.
Next, this photoresist solution was applied on a silicon wafer using a spinner and dried on a hot plate at 100 ° C. for 90 seconds to form a resist layer having a thickness of 0.5 μm. Next, after selectively irradiating ArF excimer laser light (193 nm) with an ArF exposure apparatus (manufactured by Nikon Corporation), heat treatment was performed at 110 ° C. for 90 seconds, and then with a 2.38 wt% tetramethylammonium hydroxide aqueous solution. Paddle development was performed for 2 seconds, followed by washing with water for 30 seconds and drying.
When the exposure time in which the 0.30 μm line and space formed by such an operation is formed at 1: 1 is measured in mJ / cm 2 (energy amount) unit as a sensitivity, it is 11.0 mJ / cm 2 . there were.
Further, when the cross-sectional shape of the 0.25 μm resist pattern formed in this way was observed with an SEM (scanning electron microscope) photograph, it was a rectangular resist pattern perpendicular to the substrate.
Further, by such an operation, a resist pattern of 0.20 μm was resolved, and there was no pattern collapse.
Next, using tetrafluoromethane gas as an etching gas, dry etching treatment is performed with an etching apparatus OAPM-406 (manufactured by Tokyo Ohka Kogyo Co., Ltd.), and the dry etching resistance is evaluated by the amount of film reduction per unit time. 0.0, it was 1.08 .
参考例2
参考例1において、共重合体A−1の代わりに、実施例3で得た共重合体A−2を用いた以外は、参考例1と同様にして、ポジ型ホトレジスト溶液を調製し、次いで参考例1と同様な条件でレジストパターンを形成した。
その際の参考例1と同様にして測定した感度は、6mJ/cm2であり、形成された0.25μmのレジストパターンの断面形状をSEM(走査型電子顕微鏡)写真により、観察したところ、基板に対して垂直な矩形のレジストパターンであった。
また、このような操作で0.20μmのレジストパターンまで解像され、パターン倒れはなかった。
また、参考例1と同様にして耐ドライエッチング性を調べたところ、0.95であった。
Reference example 2
In Reference Example 1, a positive photoresist solution was prepared in the same manner as in Reference Example 1, except that the copolymer A- 2 obtained in Example 3 was used instead of the copolymer A-1. A resist pattern was formed under the same conditions as in Reference Example 1.
The sensitivity measured in the same manner as in Reference Example 1 was 6 mJ / cm 2 , and the cross-sectional shape of the formed 0.25 μm resist pattern was observed with a SEM (scanning electron microscope) photograph. It was a rectangular resist pattern perpendicular to.
Further, by such an operation, a resist pattern of 0.20 μm was resolved, and there was no pattern collapse.
Further, when the dry etching resistance was examined in the same manner as in Reference Example 1, it was 0.95.
参考例3
実施例4で得た共重合体(A−3)100重量部、トリフェニルスルホニウムトリフルオロメタンスルホネート2重量部をプロピレングリコールモノメチルエーテルアセテート680重量部に溶解してポジ型ホトレジスト溶液を得た。
次いで、このホトレジスト溶液をスピンナーを用いてシリコンウエーハ上に塗布し、ホットプレート上で100℃で90秒間乾燥することにより、膜厚0.5μmのレジスト層を形成した。次いで、ArF露光装置(ニコン社製)により、ArFエキシマレーザー光(193nm)を選択的に照射したのち、110℃,90秒間加熱処理し、次いで2.38重量%テトラメチルアンモニウムヒドロキシド水溶液で65秒間パドル現像し、30秒間水洗して乾燥した。
このような操作で形成された0.30μmのラインアンドスペースが1:1に形成される露光時間を感度としてmJ/cm2(エネルギー量)単位で測定したところ、12mJ/cm2であった。
また、このようにして形成された0.25μmのレジストパターンの断面形状をSEM(走査型電子顕微鏡)写真により、観察したところ、基板に対して垂直な矩形のレジストパターンであった。
また、このような操作で0.18μmのレジストパターンまで解像され、パターン倒れはなかった。
次いで、テトラフルオロメタンガスをエッチングガスとして、エッチング装置OAPM−406(東京応化工業株式会社製)でドライエッチング処理し、耐ドライエッチング性を単位時間当たりの膜減り量で評価し、ポリヒドロキシスチレンを1.0とした場合、1.1であった。
Reference example 3
100 parts by weight of the copolymer (A- 3 ) obtained in Example 4 and 2 parts by weight of triphenylsulfonium trifluoromethanesulfonate were dissolved in 680 parts by weight of propylene glycol monomethyl ether acetate to obtain a positive photoresist solution.
Next, this photoresist solution was applied on a silicon wafer using a spinner and dried on a hot plate at 100 ° C. for 90 seconds to form a resist layer having a thickness of 0.5 μm. Next, after selectively irradiating ArF excimer laser light (193 nm) with an ArF exposure apparatus (manufactured by Nikon), heat treatment was performed at 110 ° C. for 90 seconds, and then with a 2.38 wt% tetramethylammonium hydroxide aqueous solution. Paddle development was performed for 2 seconds, followed by washing with water for 30 seconds and drying.
It was 12 mJ / cm 2 when the exposure time when a 0.30 μm line and space formed by such an operation was formed as a sensitivity was measured in mJ / cm 2 (energy amount) unit. .
Further, when the cross-sectional shape of the 0.25 μm resist pattern formed in this way was observed with an SEM (scanning electron microscope) photograph, it was a rectangular resist pattern perpendicular to the substrate.
Further, by such an operation, a resist pattern of 0.18 μm was resolved, and there was no pattern collapse.
Next, using tetrafluoromethane gas as an etching gas, dry etching treatment is performed with an etching apparatus OAPM-406 (manufactured by Tokyo Ohka Kogyo Co., Ltd.), and the dry etching resistance is evaluated by the amount of film reduction per unit time. 0.0, it was 1.1.
本発明の重合体及び共重合体は、化学増幅型レジストの樹脂成分として好適に使用される。 The polymer and copolymer of the present invention are suitably used as a resin component of a chemically amplified resist.
Claims (9)
で表されるアクリル若しくはメタクリル酸エステル。 General formula
An acrylic or methacrylic acid ester represented by
で表わされる請求項1記載のアクリル又はメタクリル酸エステル。 General formula
The acrylic or methacrylic acid ester of Claim 1 represented by these.
で表わされる構成単位を含むアクリル若しくはメタクリル系重合体又は共重合体。 General formula
An acrylic or methacrylic polymer or copolymer containing a structural unit represented by:
で表わされる構成単位を含む請求項5記載のアクリル系若しくはメタクリル系重合体又は共重合体。 General formula
The acrylic or methacrylic polymer or copolymer according to claim 5 comprising a structural unit represented by:
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