JP4028537B2 - How to manage parts - Google Patents

Description

  The present invention relates to a component management method for managing components mounted on a board.

  A component mounter for mounting an electronic component on a printed circuit board includes a reel around which a component tape for holding an electronic component is wound, and taking out the electronic component held on the component tape while pulling out the component tape from the reel. The electronic component is mounted on a printed circuit board (see, for example, Patent Documents 1 to 3).

FIG. 11 is an external view showing an external appearance of a reel around which a component tape used in the component mounting machine of Patent Document 2 or 3 is wound.
The reel 903 has a shaft core that is integrally formed by connecting the centers of two disks, and a component tape 900 is wound around the shaft core.

The component tape 900 includes a carrier tape 901 on which the electronic component 1 is placed and a cover tape 902 attached to the carrier tape 901.
The carrier tape 901 is made of a thin resin molded product or paper, and the plurality of electronic components 1 are placed on the carrier tape 901 at substantially equal intervals. The cover tape 902 is made of, for example, a light-transmitting synthetic resin, and is affixed to the carrier tape 901 so as to sandwich the electronic component 1 so that the electronic component 1 is not detached from the carrier tape 901.

  Further, the carrier tape 901 of Patent Document 2 is provided with a plurality of barcodes indicating information related to the electronic component 1 at regular intervals in the longitudinal direction. The carrier tape 901 of Patent Document 3 is attached to the carrier tape 901 of Patent Document 3. A bar code indicating information on the electronic component 1 is attached to each part where the electronic component 1 is placed.

  On the other hand, the component tape used for the component mounting machine of the said patent document 1 comprises the two strip | belt-shaped tapes which hold | maintain the both ends of an electronic component. In the same manner as described above, a plurality of barcodes indicating information related to electronic components are attached to the belt-like tape at regular intervals in the longitudinal direction.

The component mounting machines of Patent Documents 1 to 3 are provided with a barcode reader, and while taking out the electronic component while pulling out the component tape as described above, from the barcode attached to the carrier tape 901 or the strip tape, Information on electronic parts is read with a barcode reader. The component mounter then mounts the component while determining whether or not the extracted component is correct based on the content of the information.
Japanese Patent Laid-Open No. 5-21995 Japanese Patent Laid-Open No. 5-198968 JP-A-7-76364

  However, when trying to manage what each electronic component mounted on the substrate using the component mounting machines described in Patent Documents 1 to 3 above, information about the electronic component cannot always be read out. Therefore, there is a problem that management of the electronic component becomes difficult. That is, since the position of the barcode on the component tape is fixed, when the component tape is pulled out, the barcode moves accordingly. Therefore, the component mounting machines disclosed in Patent Documents 1 to 3 can read information from the barcode only when the barcode enters a position where the barcode reader can read, and read the information at other times. I can't. This makes it difficult to manage electronic components. Moreover, many barcodes must be affixed to the component tape used in the component mounting machines disclosed in Patent Documents 1 to 3, and the component tape is expensive due to the cost of the barcode and the cost required for affixing the barcode. turn into. Despite the use of such an expensive component tape, information about electronic components cannot be easily read out at a desired timing.

  Therefore, the present invention has been made in view of such a problem, and an object thereof is to provide a component management method for easily managing components such as electronic components mounted on a substrate.

  In order to achieve the above object, a component management method according to the present invention is a component management method for managing components that are taken out from a component tape holding a plurality of components by a component mounter and mounted on a board. The component tape is attached with an attachment member that remains in a predetermined position when viewed from the component mounter even when the component mounter is feeding the component tape to take out the component. Is attached with storage means for preliminarily storing part information relating to the plurality of parts, and the part management method includes a read step of reading the part information from the storage means attached to the accessory member; A mounting step in which the component is taken out from the component tape and mounted on the substrate, and the component read in the lead step with respect to the component mounted in the mounting step. Characterized in that it comprises a management information generating step of generating management information based on the broadcast. For example, the accessory member is attached to the component tape so as to be movable along the longitudinal direction of the component tape. When the component tape is sent out by a component mounter, the accessory member is locked to a component of the component mounter. Thus, the component information is read out from the storage means on the attached member that is locked to the component member of the component mounting machine.

  Thus, after the component information is read from the storage means and the components are mounted, management information for associating the component information with the components and the board is created. Therefore, each component mounted on the board is assigned to each board. It can be managed reliably. In addition, even when the component tape is being sent out, the accessory information having the storage means remains in a certain position, so that the component information can be easily read, and as a result, the management of the component is simplified. It can be carried out.

  Here, in the lead step, the lot number of the part, the serial number of the part, the information indicating the manufacturer of the part, the information indicating the shape of the part, the date of manufacture of the part, and the state of the part are sealed from the storage unit. It is also possible to read at least one of the date and time indicating when the package is opened and the number of components held on the component tape as the component information.

  This makes it possible to know the lot number, manufacturer, date of manufacture, etc. for the parts on the board from the management information even after the board on which the part is mounted has been distributed to the market, and reliably manage the part. can do.

Preferably, in the read step, the component information is read from the storage means configured as an IC (Integrated Circuit) tag.
Thereby, reading from a memory | storage means can be easily performed by non-contact communication. Further, since the IC tag can store more part information than the barcode, the part information can be read out and the parts can be managed reliably.

  The component information indicates the number of components held on the component tape, and the component management method further includes subtracting the number of components extracted in the mounting step from the number of components. The method may include a remaining number writing step of writing the number into the storage unit.

  Thus, since the remaining number of parts held on the in-process component tape is written in the storage means, the remaining number can be easily managed by reading the remaining number of parts from the storage means. .

  The component management method may further include a board writing step of writing the management information created in the management information creation step to an IC tag on the board mounted in the mounting step.

  As a result, since the management information is written in the IC tag of the board, the person who owns the board can easily obtain the component information for each component on the board by reading the management information from the IC tag of the board. I can know.

  The component mounter according to the present invention is a component mounter that takes out the component from a component tape that holds a plurality of components and mounts the component on a substrate. The component tape includes component information on the plurality of components. An attachment member having storage means stored in advance is attached so as to be movable along the longitudinal direction of the component tape, and the component mounter is fed out of the component tape for taking out the component. Sometimes, the latching means for latching the accessory member with the accessory member so that the accessory member stays in a predetermined position when viewed from the component mounter; and the lead means for reading the component information from the memory means of the accessory member; A mounting unit that takes out the component from the component tape and mounts it on the substrate, and a component mounted by the mounting unit is managed based on the component information read by the reading unit Characterized in that it comprises a management information creating means for creating a multi-address.

  As a result, even when the component tape is being sent out, the accessory member stays in a predetermined position by the locking device, so that the read device can always easily read the component information from the storage device in the accessory member. As a result, parts can be easily managed.

  Here, the mounting unit may mount the component on the board in a manner corresponding to the component information read by the read unit. For example, the mounting means includes a head that sucks a component from the component tape and places it on a substrate, and a driving means that drives the head, and the driving means reads the component read by the read means. The suction mode of the head is changed according to the information.

  As a result, the component is mounted on the substrate in a manner corresponding to the component information, and thus erroneous mounting of the component can be prevented. Further, since the suction mode of the head changes according to the component information, it is possible to prevent the component from being damaged by appropriately handling the component.

  The component holder according to the present invention is a component holder that holds a plurality of components, the component tape holding the plurality of components arranged in a line, and a longitudinal direction of the component tape. And an attachment member attached to the component tape, and a storage means attached to the attachment member and preliminarily storing component information relating to the plurality of components. For example, the part information includes the lot number, serial number, information indicating the manufacturer, information indicating the shape, date of manufacture, date of opening, and information of the part held on the part tape. Indicates at least one of the numbers.

  As a result, since the accessory member is movably attached to the component tape, even when the component tape is being sent out, the accessory member can be slid with respect to the component tape to remain in a fixed position. Can be made. As a result, the component information stored in the storage means of the attached member can be easily read by, for example, a component mounter, and the management of the component using, for example, the component information such as the lot number can be facilitated. it can.

Preferably, the storage means comprises an IC (Integrated Circuit) tag.
As a result, a larger amount of component information can be written in the storage means than, for example, a barcode, and the component information can be easily notified to the component mounter by non-contact communication.

  The present invention can be realized not only as a component management method as described above, but also as a component management device, a component mounter, a component mounting method, a component management method program, and a memory for storing the program. It can also be realized as a medium.

  The component management method of the present invention has an effect of easily managing components mounted on a substrate.

Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a configuration diagram showing a configuration of a component mounting system according to the present embodiment.

  This component mounting system includes component mounters 100 and 200 that mount electronic components 3 on a printed circuit board 2, and a control device 300 that controls these component mounters 100 and 200, and is mounted on the printed circuit board 2. In addition, management of the individual electronic components 3 is performed reliably and easily.

  The component mounters 100 and 200 each include a component supply unit 102 in which a plurality of reels 101 are disposed. Then, the component mounting machines 100 and 200 pull out the component tape 103 from the reel 101 in the component supply unit 102, take out the electronic component 3 stored in the component tape 103, and electronically place it on the printed circuit board 2 that has been put in. The component 3 is mounted.

  Here, a tape IC (Integrated Circuit) tag 104 as a storage means is attached to the component tape 103, and the tape IC tag 104 stores the contents related to the electronic component 3 stored in the component tape 103. The part data 105 shown is stored in advance.

  Further, an IC (Integrated Circuit) tag 106 is attached on the printed circuit board 2, and the IC tag 106 for the board has a content indicating the electronic component 3 mounted on the board 2 and the result of the mounting operation. An area for storing management data 107 is provided.

  Such IC tags 104 and 106 for tape and substrate perform non-contact communication using so-called RFID (Radio Frequency Identification) technology, and store or store information by the communication. Or send information.

  That is, the component mounting machines 100 and 200 according to the present embodiment read the component data 105 of the electronic component 3 stored in the component tape 103 from the IC tag 104 for tape, and performed the mounting operation when the mounting operation is completed. The contents related to the mounted electronic component 3 and the contents indicating the mounting work result are written as management data 107 to the board IC tag 106 of the printed board 2. In other words, the component mounters 100 and 200 according to the present embodiment include a component management apparatus that creates the management data 107. Furthermore, the component mounters 100 and 200 in the present embodiment change the mounting operation in accordance with the content of the read component data 105 (details will be described later).

  Further, the control device 300 acquires management data 107 written to the board IC tag 106 by the component mounting machines 100 and 200 from the component mounting machines 100 and 200 and stores them collectively.

FIG. 2 is an explanatory diagram for explaining the component tape 103 according to the present embodiment.
The component tape 103 in this embodiment is wound around a reel 101 and includes a carrier tape 103b on which the electronic component 3 is placed and a cover tape 103a attached to the carrier tape 103b. The component tape 103 according to the present embodiment is attached with a slide member 103d, which is an attached member that is slidable along the longitudinal direction of the component tape 103, and the above-mentioned tape IC tag 104 is attached to the slide member 103d. Is attached. In this embodiment, the component holder is constituted by the component tape 103, the reel 101, the slide member 103d, and the IC tag 104 for tape.

  The carrier tape 103b is made of a thin resin molded product, paper, or the like, and the plurality of electronic components 3 are stored in storage recesses 103c formed on the carrier tape 103b at substantially equal intervals.

  The cover tape 103a is made of, for example, translucent synthetic resin, and is affixed to the carrier tape 103b so that the electronic component 3 does not come off from the storage recess 103c of the carrier tape 103b, that is, closes each storage recess 103c. .

  The slide member 103d is engaged with the carrier tape 103b and the cover tape 103a so as to hold the cover tape 103a while the cover tape 103a is attached to the carrier tape 103b. In other words, the slide member 103 d is attached to the component tape 103 so as to sandwich both end portions in the width direction of the component tape 103. When such a slide member 103d receives a force along the longitudinal direction of the carrier tape 103b and the cover tape 103a, it slides in the direction of the force. Since the slide member 103d is slidably attached to both the tapes 103a and 103b as described above, even if the cover tape 103a is peeled off from the carrier tape 103b, the cover member 103d can be covered by placing the slide member 103d on the peeled portion. The tape 103a covers the storage recess 103c of the carrier tape 103b, and the electronic component 3 can be prevented from jumping out of the storage recess 103c. Note that the slide member 103d is not necessarily limited to the above-described form, that is, the form capable of preventing the electronic component 3 from jumping out, as long as it can slide along the longitudinal direction of the component tape 103. It is not a thing and what kind of form may be sufficient.

  The IC tag 104 for tape is attached to the slide member 103d, and the component data 105 stored therein includes information indicating the lot or manufacturer of the electronic component 3.

  For example, as shown in FIG. 2, the component data 105 includes a serial number column A <b> 1 in which the serial number of each electronic component 3 stored in the component tape 103 is stored, and the electronic component 3 stored in the component tape 103. A lot number column A2 for storing the lot number, a component name column A3 for storing the component name of the electronic component 3, a vendor column A4 for storing a vendor code indicating the manufacturer of the electronic component 3, A shape column A5 in which a shape code indicating the shape of the electronic component 3 is stored, a dimension column A6 in which content indicating the dimensions of the electronic component 3 is stored, and a date of manufacture of the electronic component 3 are stored. The manufacturing column A7, the opening column A8 that stores the date when the electronic component 3 was opened after manufacturing, and the number of electronic components 3 stored in the component tape 103 are stored. A Number field A9 who is, there is a pitch column A10 to spacing between each of the electronic component 3 is accommodated is stored.

  Specifically, “ser0001,..., Ser0500” indicating the serial number of each electronic component 3 is stored in the serial number column A1, and the lot number “lot0002” of the electronic component 3 is stored in the lot number column A2. The name column A3 stores the component name “1005CR” of the electronic component 3, and the vendor column A4 stores the vendor code “ven0003” indicating the manufacturer of the electronic component 3. Note that the serial numbers of the electronic components 3 are stored in the order in which the electronic components 3 are arranged on the component tape 103, for example.

  The shape column A5 stores a shape code “123” indicating the shape of the electronic component 3, and the dimension column A6 stores the width “10 mm”, the depth “5 mm”, and the height “2 mm” of the electronic component 3. Is stored.

  Further, the date of manufacture of the electronic component 3 “January 31, 2002” is stored in the manufacture column A7, and the date “February 1, 2003” when the electronic component 3 was opened is stored in the opening column A8. And the number “500” of electronic components 3 housed in the component tape 103 is stored in the number field A9. In the pitch column A10, the interval between the electronic components 3 stored in the component tape 103 is stored as the number of times of withdrawal (for example, “10”). A plurality of holes arranged along the longitudinal direction are formed in the carrier tape 103b of the component tape 103, and the component mounters 100 and 200 pull out the component tape 103 at intervals of the respective holes. The number of times this withdrawal is performed is the number of withdrawals described above. For example, when the component mounters 100 and 200 take out the electronic component 3 at the tip of the component tape 103 at a predetermined position and pull out the component tape 103 by the above-mentioned number of times of withdrawal (10 times), The electronic component 3 is arranged at the predetermined position.

FIG. 3 is a block diagram showing an internal configuration of the component mounter 100 in the present embodiment. The component mounter 200 has the same configuration as the component mounter 100.
The component mounter 100 includes a component RW unit 111, a head 112, a head drive unit 113, a board RW unit 118, a data storage unit 115, a communication unit 116, and a control unit 117 that controls these components. And.

  The component RW units 111 are provided in a number corresponding to the number of component tapes 103 to be mounted on the component mounter 100. The component RW unit 111 detects the IC tag 104 for tape attached to the component tape 103, performs non-contact communication with the IC tag 104 for tape, and stores the component data 105 stored in the IC tag 104 for tape. Or the component data 105 of the IC tag 104 for tape is updated.

  The head 112 sucks the electronic component 3 stored in the component tape 103 and places it on the printed circuit board 2, and includes a suction nozzle 112 a that sucks the electronic component 3 at the tip.

The head drive unit 113 drives the head 112 in accordance with control from the control unit 117.
The board RW unit 118 performs non-contact communication with the board IC tag 106 attached on the printed board 2, reads the management data 107 stored in the board IC tag 106, or newly updates the management data 107. Data 107 is written to the IC tag 106 for substrates.

The data storage unit 115 stores management data 107 and component data 105 in accordance with control from the control unit 117.
The communication unit 116 transmits the management data 107 and the component data 105 stored in the data storage unit 115 to the control device 300 in accordance with the control from the control unit 117.

In addition, the component supply unit 102 of the component mounting machine 100 includes a plurality of component cassettes (feeders) corresponding to the component tapes 103.
FIG. 4 is an explanatory diagram for explaining the component cassette.

  The component cassette 114 pulls out the component tape 103 from the reel 101 and sends out the electronic components 3 stored in the component tape 103 one by one to the component suction positions of the component mounting machines 100 and 200. A drawer mechanism (not shown) for drawing out the cassette, and a cassette housing 114a for holding the mechanism. Such component cassettes 114 are mounted on the component mounter 100 so that a plurality of such component cassettes 114 are arranged along the Z axis.

  The component tape 103 is fed into the cassette housing 114a from the take-in port 114c of the cassette housing 114a by the drawing mechanism of the component cassette 114. Each electronic component 3 of the component tape 103 sent into the inside thereof is sequentially arranged at a position facing the suction port 114b of the cassette housing 114a, that is, the above-described component suction position.

  The suction nozzle 112a of the head 112 provided in the component mounting machines 100 and 200 has its tip inserted into the cassette housing 114a from the suction port 114b of the cassette housing 114a, and the electronic component at the component suction position of the component cassette 114. 3 is sucked and taken out of the cassette casing 114a. Then, the suction nozzle 112 a mounts the sucked electronic component 3 on the printed board 2.

FIG. 5 is an explanatory diagram for explaining the state of the component tape 103 fed into the cassette housing 114 a of the component cassette 114.
As described above, the component tape 103 is fed into the cassette housing 114a from the intake port 114c of the component cassette 114, but only the component tape 103, that is, the carrier tape 103b and the cover tape 103a, is fed into the slide member 103d. Is locked around the inlet 114c of the cassette housing 114a. That is, the carrier tape 103b and the cover tape 103a are fed into the cassette casing 114a by the drawing mechanism of the component cassette 114, while the slide member 103d is locked to the cassette casing 114a. To the position around the intake port 114c.

  Further, the component RW unit 111 is disposed in the vicinity of each component cassette 114 and is in a position where it can communicate with the tape IC tag 104 of the slide member 103d staying around the intake port 114c as described above.

FIG. 6 is an explanatory diagram for explaining how the component tape 103 is sent out in the cassette casing 114a.
As shown in FIG. 6, the carrier tape 103b and the cover tape 103a of the component tape 103 are fed into the cassette casing 114a from the intake port 114c of the cassette casing 114a, while the slide member 103d is inserted into the cassette casing 114a. It stops around the intake port 114c and stays there. Thus, the component RW unit 111 can always communicate with the tape IC tag 104 on the slide member 103d even when the component tape 103 is pulled out, that is, in a state where the component is mounted. it can.

  Further, the cover tape 103a fed into the cassette housing 114a is peeled off from the carrier tape 103b and wound around the cover tape reel 119. When the storage recess 103c of the carrier tape 103b from which the cover tape 103a has been peeled reaches the component suction position, the electronic component 3 stored in the storage recess 103c is suctioned by the suction nozzle 112a of the head 112.

  The management data 107 includes work result information 107a indicating the work result of each facility (component mounting machine or the like) that has performed the mounting operation on the printed circuit board 2, and content regarding the electronic component 3 mounted on each facility. Mounting component information 107b shown.

FIG. 7 is an information content display diagram showing the contents of the work result information 107a.
The work result information 107a includes a board ID (for example, “PB01ID”) assigned to identify the printed circuit board 2 and a lot number (for example, “PB01Rt”) of the printed circuit board 2.

  Further, the work result information 107a stores the equipment name column B1 in which the name of the equipment that has worked on the printed circuit board 2 (equipment name), and the date and time when the printed circuit board 2 was inserted into the equipment. The input date and time field B2, the tact field B3 in which the time (tact) required for the work in the facility is stored, and the PG field B4 in which the name of the program executed by the facility on the printed circuit board 2 is stored. When an error occurs during the execution of the program, there are an error column B5 in which contents relating to the error are stored, and an index column B6 in which an index indicating the mounted component information 107b related to the work of the facility is stored. Here, by including an index in the work result information 107a, the work result information 107a is associated with the mounted component information 107b for each facility.

  For example, the equipment name “CM402” of the component mounting machine 100 is stored in the equipment name column B1, and the date and time “2003/01/06 11 when the printed circuit board 2 is inserted into the component mounting machine 100 is stored in the input date and time column B2. : 16:34 ”is stored, the time“ 35 seconds ”required for the mounting work by the component mounting machine 100 is stored in the tact column B3, and the printed circuit board 2 is stored in the PG column B4 by the component mounting machine 100. The name “PTEST” of the program executed for the electronic component 3 is stored, and the index “Idx01” of the mounting component information 107b related to the electronic component 3 mounted by the component mounting machine 100 is stored in the index B6 column. In the error column B5, for example, an error occurrence date “2003/01/06 11:16:55” generated when the program is executed, an error code “MC0005” of the error, and an error are generated. The stored step “100” is stored.

FIG. 8 is an information content display diagram showing the content of the mounted component information 107b.
The mounting component information 107b is assigned the above-mentioned index for each facility, and each mounting component information 107b is identified by the index.

For example, the mounting component information 107 b with the index “Idx01” includes the component name and serial number of each electronic component 3 mounted on the component mounter 100.
That is, the mounting component information 107b includes a position column C1 in which the position (mounting point) on the printed circuit board 2 is stored, and a component name column C2 in which the component name of the electronic component 3 mounted at that position is stored. A serial number column C3 storing the serial number of the electronic component 3, a lot number column C4 storing the lot number of the electronic component 3, and a reel 101 (component cassette 114) of the electronic component 3 are arranged. There is a Z-axis column C5 in which the stored location (Z-axis position) is stored.

  For example, the position column C1 stores the position “X1, Y1” of the mounted electronic component 3 on the printed circuit board 2, and the component name column C2 stores the component name “1005CR” of the electronic component 3. The serial number column C3 stores the serial number “ser0001” of the electronic component 3, the lot number column C4 stores the lot number “rot0002” of the electronic component 3, and the Z-axis column C5 stores the electronic component. The Z-axis position “10” on which the three reels 101 are arranged is stored. The Z axis refers to the arrangement direction of the plurality of reels 101 arranged in the component supply unit 102 of the component mounter 100.

  When the reel 101 is attached to the component cassette 114, or when the component cassette 114 to which the reel 101 is attached is attached to the component mounter 100, the control unit 117 of the component mounter 100 in the present embodiment The component data 105 is read by the component RW unit 111 from the tape IC tag 104 of the component tape 103 wound around the 101, and the component data 105 is stored in the data storage unit 115. Here, when the component data 105 is stored in the data storage unit 115, the control unit 117 specifies the position of the Z axis of the component cassette 114 (reel 101) corresponding to the component RW unit 111 that has read the component data 105. The component data 105 is stored in the data storage unit 115 in association with the position of the Z axis. The control unit 117 specifies the position of the Z-axis of the component cassette 114 when the component RW unit 111 notifies the control unit 117 of information indicating that, for example, Z (Z-axis position) = 1.

  In addition, when the printed circuit board 2 is inserted into the component mounting machine 100, the control unit 117 controls the substrate RW unit 118 to control the management data 107 from the IC tag 106 for the board attached to the printed circuit board 2. Is stored in the data storage unit 115.

  When the mounting operation for the printed circuit board 2 is completed, the control unit 117 writes the mounting operation result in the management data 107 stored in the data storage unit 115 to update it, and the circuit board RW unit 118 again. And the updated management data 107 is written into the substrate IC tag 106.

  When updating the management data 107, the control unit 117 writes the name of the facility that performed the work, the date and time of loading the printed circuit board 2 in the work result information 107 a, updates the data, and also updates the mounted electronic component 3. Corresponding component data 105 is read from the data storage unit 115, and the mounted component information 107b is updated based on the content. Specifically, when mounting each electronic component 3, the control unit 117 mounts the Z-axis position and mounting point (the position where the electronic component 3 is mounted on the printed circuit board 2) of the component cassette 114 from which each electronic component 3 has been taken out. ) And the component data 105 associated with the stored Z-axis position is read from the data storage unit 115 when the mounted component information 107b of the management data 107 is updated. The control unit 117 writes each content such as the component name and serial number included in the read component data 105, the Z-axis position and the mounting point in the corresponding column of the mounted component information 107b.

  As a result, as shown in FIG. 8, the IC tag 106 for the board attached to the printed circuit board 2 has the serial number, lot number, and mounting for each electronic component 3 mounted on the printed circuit board 2 for each facility. A point etc. will be shown.

  The control unit 117 of the component mounter 100 updates the number stored in the tape IC tag 104 of the component tape 103 every time the electronic component 3 is taken out from the component tape 103 of the component cassette 114. That is, when one electronic component 3 of the component tape 103 is sucked by the suction nozzle 112a of the head 112, the control unit 117 counts the number of component data 105 corresponding to the component tape 103 stored in the data storage unit 115. Is decremented by one. Then, the control unit 117 controls the component RW unit 111 so that the decremented number (remaining number) is written in the component data 105 of the tape IC tag 104. Such writing to the tape IC tag 104 may be performed when the component cassette 114 or the reel 101 corresponding to the tape IC tag 104 is removed from the component mounter 100.

  Thus, in the present embodiment, even when the in-process component tape 103 is removed from the component mounter 100 or the component cassette 114 together with the reel 101, the number of electronic components 3 stored in the component tape 103 (remaining number) ) Is recorded on the IC tag 104 for tape, inventory management of the electronic component 3 can be facilitated. Further, in the present embodiment, by sliding the slide member 103d, the electronic component 3 is prevented from being detached from the component tape 103 even when the in-process component tape 103 is removed from the component cassette 114. Can do. That is, the cover tape 103a is peeled off from the carrier tape 103b at the front end side of the in-process component tape 103, and if there is no slide member 103d, the electronic component 3 may jump out of the housing recess 103c. However, in this embodiment, since the slide member 103d is slidably attached to the cover tape 103a and the carrier tape 103b, if the slide member 103d is slid to the front end side of the component tape 103, the peeled cover is removed. The tape 103a is in close contact with the carrier tape 103b, and as a result, the electronic component 3 cannot jump out.

  Further, the control unit 117 specifies the shape or size of the electronic component 3 of the component tape 103 based on the component data 105 read by the component RW unit 111, and the head 112 according to the shape or the like of the electronic component 3. The head driving unit 113 is controlled so that the suction mode changes.

  For example, when the control unit 117 determines that the height of the electronic component 3 is low, the control unit 117 controls the head driving unit 113 so that the suction nozzle 112a of the head 112 is lowered according to the height. Thereby, it is possible to prevent the electronic component 3 from being absorbed and to mount the electronic component 3 reliably and safely without damaging the electronic component 3.

  For example, when the control unit 117 determines that the electronic component 3 on the component tape 103 is different from the electronic component to be mounted on the printed circuit board 2, the control unit 117 controls the head driving unit 113 to stop the suction operation of the head 112. . Thereby, erroneous mounting of the electronic component 3 can be prevented.

FIG. 9 is a flowchart showing the operation of the component mounter 100 in the present embodiment.
First, the component mounter 100 reads the component data 105 from the tape IC tag 104 attached to the component tape 103 (step S100), and further receives the management data 107 from the substrate IC tag 106 of the input printed circuit board 2. Reading (step S102), the component data 105 and management data 107 are stored.

  Next, the component mounter 100 starts mounting the electronic component 3 accommodated therein on the printed circuit board 2 while pulling out the component tape 103 (step S104). Here, when mounting the electronic component 3, the component mounter 100 changes the suction mode based on the shape and dimensions of the component data 105 read in step S <b> 100 and performs mounting reliably and safely.

  The component mounter 100 then loads the component tape 103 on the component tape 103 based on the number of electronic components 3 indicated by the component data 105 read in step S100 and the number of electronic components 3 taken out from the component tape 103. The number of electronic components 3 is specified, and the number of component data 105 held by itself is updated to the specified number (step S106). Further, the component mounter 100 communicates with the tape IC tag 104 to update the number of component data 105 stored in the tape IC tag 104 to the specified number.

  Further, the component mounter 100 updates the management data 107 based on the component mounting work result in step S104 and the component data 105 read in step S100 (step S108).

  As described above, in the management method of the electronic component 3 performed by the component mounting machines 100 and 200 according to the present embodiment, the management data 107 so that the content of the component data 105 related to the electronic component 3 is associated with the electronic component 3 mounted on the board. Therefore, the mounted electronic component 3 can be reliably managed. Further, since the component data 105 is read out from the tape IC tag 104 on the slide member 103d that stays in the vicinity of the intake port 114c of the cassette housing 114a, the component data 105 can be easily read out at any time. The electronic component 3 mounted on can be easily managed. In addition, for example, the component tape 103 that has been removed from the component mounting machines 100 and 200 and stored in the in-process state (a state in which the electronic component 3 has been partially removed) is mounted on the component mounting machines 100 and 200 again. Even when component mounting is performed, the component data 105 can be read from the tape IC tag 104 of the component tape 103 at any time.

Further, in this electronic component 3 management method, the component data 105 can be easily read in a non-contact manner by reading the component data 105 from the tape IC tag 104.
Also, in this electronic component 3 management method, the contents related to all the electronic components 3 mounted on the printed circuit board 2 are stored as management data 107 in the IC tag 106 for the circuit board. If the management data 107 is read from the board IC tag 106, the lot of each electronic component 3 mounted on the printed board 2 can be specified.

  Thus, since the slide member 103d having the tape IC tag 104 is attached to the component tape 103 in this embodiment, the component data 105 stored in the tape IC tag 104 is always mounted on the component tape 103. It can be made easy for the machines 100 and 200 to read.

Further, in the present embodiment, since the control device 300 communicates with each of the component mounting machines 100 and 200 and collectively holds the management data 107, the operator has to bother from the board IC tag 106 of each printed board 2. Without reading the management data 107, the contents related to the electronic components 3 mounted on each printed circuit board 2 and the contents indicating the work results can be managed in a unified manner.
(Modification 1)
Here, the modification regarding the identification method of the Z-axis position of the component cassette 114 in the said this Embodiment is demonstrated.

In the present embodiment, the component RW unit 111 is provided for each component cassette 114, and the Z-axis position of the component cassette 114 is specified by identifying these component RW units 111.
In this modification, only one or two component RW units 111 are provided, and the Z-axis position of each component cassette 114 is specified based on the communication status between the component RW unit 111 and the tape IC tag 104.

  The one or two component RW units 111 specify the Z-axis position of the component cassette 114 corresponding to each tape IC tag 104 based on the direction of the radio wave received from each tape IC tag 104.

FIG. 10 is an explanatory diagram for explaining how one component RW unit 111 specifies the Z-axis position of the component cassette 114.
For example, the component mounter 100 includes one component RW unit 111 and an antenna 111 a disposed from the component RW unit 111 to the vicinity of the IC tag 104 for tape of each component cassette 114 in the component supply unit 102. .

  As described above, since the antenna 111 a is close to each tape IC tag 104, the component RW unit 111 can reliably receive the radio wave of the tape IC tag 104. That is, the component RW unit 111 can accurately specify the position of each tape IC tag 104 based on the radio wave intensity and the reception direction of each tape IC tag 104 that is the reception result. Further, the component RW unit 111 can accurately specify the Z-axis position of the component cassette 114 from the position.

  Further, an antenna extending to the vicinity of each tape IC tag 104 may be installed so as to be switchable for each tape IC tag 104. In this case, since each antenna corresponds to each Z-axis position (Z = 1, 2,...), The component RW unit 111 is switched by switching and acquiring the output of each antenna. The Z-axis position of the tape IC tag 104 (component cassette 114) corresponding to the antenna is specified, and the component data 105 is acquired from the tape IC tag 104.

That is, each antenna is provided with a switch. When the switch is turned on, an output from the antenna corresponding to the switch is acquired by the component RW unit 111. The component RW unit 111 turns on only the antenna switch corresponding to Z = 1 from the switches corresponding to each antenna, and then turns on only the antenna switch corresponding to Z = 2. By switching on in order, the output of each antenna is switched and acquired.
(Modification 2)
Next, a modified example regarding the update timing of the management data 107 in the present embodiment will be described.

  In the present embodiment, the component mounter 100 updates the management data 107 after all the electronic components 3 are mounted on the printed circuit board 2, but the component mounter 100 according to the present modification has other cases. Also, the management data 107 is updated.

  For example, the component mounting machine 100 updates the mounting component information 107b of the management data 107 at the timing when the printed circuit board 2 is inserted into the component mounting machine 100 and the management data 107 is read from the board IC tag 106 of the printed circuit board 2. To do.

  That is, when the printed circuit board 2 is inserted, the component mounter 100 has already stored the component data 105 of the mounted component tape 103, and the component tape at any Z-axis position on the printed circuit board 2 is stored. The electronic component 3 is taken out from 103 and it is recognized in which position the electronic component 3 is mounted. As a result, when the printed circuit board 2 is inserted and the management data 107 is read, the component mounting machine reads the contents of the component data 105 stored in association with the Z-axis position as the mounting component information of the management data 107. Write in each column 107b to update the mounted component information 107b.

Further, the component mounter 100 may update the mounted component information 107b of the management data 107 as needed at the timing when each electronic component 3 is mounted on the printed circuit board 2.
For example, when the component mounting machine 100 takes out the electronic component 3 from the component tape 103 at the Z-axis position (Z = 1) and mounts the electronic component 3 on the printed circuit board 2, the Z-axis of Z = 1. The contents of the component data 105 stored in association with the position are written in each column of the mounting component information 107b of the management data 107, and the mounting component information 107b is updated.

As described above, the present invention has been described using the embodiment and the modified examples, but the present invention is not limited thereto.
For example, in the present embodiment and modification, the component name, serial number, and lot number are stored in the mounting component information 107b of the management data 107, but the vendor code, shape, and manufacturing date included in the component data 105 are also included. Date, date of opening, etc. may be stored. By storing these, the electronic component 3 mounted on the printed circuit board 2 can be managed by a vendor code, an opening date, and the like.

  In the present embodiment and the modification, the management data 107 is written to the board IC tag 106. However, if the management data 107 is stored in the control device 300, the management data 107 does not necessarily have to be written to the board IC tag 106. .

  In this embodiment and the modification, the tape IC tag 104 is attached to the component tape 103, but other storage means may be used as long as the component data 105 can be stored. Furthermore, in the present embodiment and the modification, the slide member 103d is attached to the component tape 103, but other accessory members may be used as long as they remain in a predetermined position when viewed from the component mounters 100 and 200. .

  In the present embodiment and the modification, the component mounters 100 and 200 include the component management device. However, the control device 300 may include the component management device and create the management data 107.

  The component management method of the present invention has an effect that it is possible to reliably manage electronic components mounted on a substrate, and can be applied to the electronic equipment manufacturing industry and the like.

It is a block diagram which shows the structure of the component mounting system in embodiment of this invention. It is explanatory drawing for demonstrating a component tape same as the above. It is a block diagram which shows the internal structure of a component mounting machine same as the above. It is explanatory drawing for demonstrating a component cassette same as the above. It is explanatory drawing for demonstrating the mode of the component tape sent in the cassette housing | casing of a component cassette same as the above. It is explanatory drawing for demonstrating a mode that a component tape is sent out in a cassette housing | casing same as the above. It is an information content display figure which shows the content of work result information same as the above. It is an information content display figure which shows the content of the mounting component information same as the above. It is a flowchart which shows operation | movement of a component mounting machine same as the above. It is explanatory drawing for demonstrating a mode that one component RW part which concerns on a modification same as the above specifies the Z-axis position of a component cassette. It is an external view which shows the external appearance of the reel around which the conventional component tape was wound.

Explanation of symbols

2 substrate 3 electronic component 100 component mounting machine 101 reel 102 component supply unit 103 component tape 103d slide member 104 IC tag for tape 105 component data 106 IC tag for substrate 107 management data 200 component mounter 300 control device

Claims (10)

A component management method for managing components taken out from a component tape holding a plurality of components by a component mounter and mounted on a board,
The component tape has an attachment member that stays in a predetermined position when viewed from the component mounter even when the component mounter sends out the component tape to take out the component, in the longitudinal direction of the component tape. along movably mounted, wherein the accessory member is is attached storing means stores in advance the part information relating to the plurality of components,
The part management method is as follows:
A reading step of reading out the component information from the storage means attached to the attachment member;
A mounting step of taking out a component from the component tape and mounting it on a substrate;
A component management method comprising: a management information creation step of creating management information for the component mounted in the mounting step based on the component information read in the read step. When the component tape is sent out by the component mounter, the accessory member remains in the predetermined position by being locked to the component member of the component mounter,
In the lead step,
The component management method according to claim 1, wherein the component information is read out from a storage unit on an attached member that is locked to a component member of the component mounter. In the lead step,
From the storage means, the lot number of the part, the serial number of the part, the information indicating the manufacturer of the part, the information indicating the shape of the part, the date of manufacture of the part, and the year when the part is opened from the sealed state The part management method according to claim 1, wherein at least one of the date and the number of parts held on the part tape is read as the part information. The component information indicates the number of components held on the component tape,
The part management method further includes:
From Number of the components, the remaining number by subtracting the number of components extracted in the mounting step, to any one of claim 1 to 3, characterized in that it comprises a remaining number of write step of writing to said storage means How to manage the listed parts.   The part management method further includes:
  A board writing step of writing the management information created in the management information creating step into an IC tag on the board mounted in the mounting step
  The component management method according to any one of claims 1 to 3, wherein: A component management device that manages components that are taken out from a component tape that holds a plurality of components by a component mounter and mounted on a board,
The component tape has an attachment member that stays in a predetermined position when viewed from the component mounter even when the component mounter sends out the component tape to take out the component, in the longitudinal direction of the component tape. along movably mounted, wherein the accessory member is is attached storing means stores in advance the part information relating to the plurality of components,
The parts management device
Read means for reading out the component information from the storage means attached to the accessory member;
Management information creating means for creating management information based on the component information read out by the reading means for the components taken out from the component tape by the component mounting machine and mounted on the substrate; apparatus.   A component mounting method for taking out the component from a component tape holding a plurality of components and mounting the component on a substrate,
  In the component tape, an attachment member having storage means for storing component information related to the plurality of components in advance is attached movably along the longitudinal direction of the component tape,
  The component mounting method includes:
  When the component tape is being sent out for taking out the component, the latching means latches with the accessory member so that the accessory member remains in a predetermined position when viewed from the component mounter. Steps,
  A reading step of reading out the component information from the storage means of the accessory member;
  A mounting step of taking out a component from the component tape and mounting it on a substrate;
  A management information creation step for creating management information based on the component information read in the read step for the components mounted in the mounting step;
  A component mounting method comprising:   A component mounter that takes out the component from a component tape that holds a plurality of components and mounts the component on a substrate,
  In the component tape, an attachment member having storage means for storing component information related to the plurality of components in advance is attached movably along the longitudinal direction of the component tape,
  The component mounter is
  When the component tape is being sent out for taking out a component, by locking with the accessory member, the locking means for retaining the accessory member in a predetermined position when viewed from the component mounter;
  Read means for reading out the component information from the storage means of the accessory member;
  Mounting means for taking out components from the component tape and mounting them on a substrate;
  Management information creating means for creating management information based on the component information read by the reading means for the parts mounted by the mounting means;
  A component mounting machine comprising:   A component holder for holding a plurality of components,
  A component tape that holds the plurality of components in a line; and
  An accessory member attached to the component tape, movably along the longitudinal direction of the component tape,
  Storage means attached to the attachment member and pre-stored with component information relating to the plurality of components;
  A component holder comprising: A program for causing a computer to execute the steps included in the part management method according to any one of claims 1 to 5 .

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