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JP4045656B2 - Method for manufacturing electroluminescent element - Google Patents
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JP4045656B2 - Method for manufacturing electroluminescent element - Google Patents

Method for manufacturing electroluminescent element Download PDF

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Publication number
JP4045656B2
JP4045656B2 JP21989798A JP21989798A JP4045656B2 JP 4045656 B2 JP4045656 B2 JP 4045656B2 JP 21989798 A JP21989798 A JP 21989798A JP 21989798 A JP21989798 A JP 21989798A JP 4045656 B2 JP4045656 B2 JP 4045656B2
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Japan
Prior art keywords
layer
back electrode
film
transport layer
electroluminescent
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JP21989798A
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Japanese (ja)
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JP2000040593A (en
Inventor
均 山本
友之 白嵜
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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Description

【0001】
【発明の属する技術分野】
この発明は電界発光素子製造方法に関し、さらに詳しくは、有機エレクトロルミネッセンス(以下、有機ELという)材料を用いる電界発光素子製造方法に係わる。
【0002】
【従来の技術】
従来の電界発光素子として、ガラス基板の上にアノード電極が形成され、その上に、例えば、正孔輸送層と発光層と電子輸送層との3層からなる有機層が形成され、この電子輸送層の上に、例えばフッ化リチウム(LiF)でなる極薄い膜厚の絶縁膜が蒸着法により堆積され、この絶縁膜の上に低仕事関数金属でなるカソード電極が形成された構造の電界発光素子がある。このような電界発光素子においては、バイアス電圧を積極的に印加することで電子注入効率を向上させ、絶縁膜を介在しない構造の電界発光素子に比較して発光開始電圧や発光効率を向上させることが知られている。
【0003】
本発明は、容易に電界発光素子を製造する製造方法を提供することを目的としている。
【0004】
【課題を解決するための手段】
請求項1記載の発明は、透明電極の上に電界発光層を形成する工程と、前記電界発光層に酸素又はオゾンを吸着させる工程と、前記電界発光層の上に対向電極を形成する工程と、前記対向電極と前記透明電極との間に前記電界発光層の発光する電界と逆方向の電界を印加することによって前記対向電極の前記電界発光層と接合する界面を酸化して絶縁薄膜を形成する工程と、を備えることを特徴としている。
【0011】
従って、請求項記載の発明では、一旦電界発光層に吸着させた酸素やオゾンを対向電極界面と電気的に化学反応させるだけでよいため、特別に絶縁薄膜を堆積させる工程を要せず工程数の増加を避けることができる。また、酸素やオゾンの吸着量で絶縁薄膜の膜厚を制御することが可能となり、極薄い膜厚の絶縁薄膜の形成を可能にする。さらに、絶縁薄膜は前記対向電極の前記電界発光層と接合する界面を酸化させているので、絶縁薄膜と対向電極との界面の接合性が良好なため高いキャリア注入性を得ることができる。
【0012】
【発明の実施の形態】
以下、この発明に係る電界発光素子及びその製造方法の詳細を図面に示す実施形態に基づいて説明する。
【0013】
(実施形態1)
図1〜図3は、本発明に係る電界発光素子の実施形態1を示している。まず、本実施形態の製造方法について図1〜図3を用いて説明する。図1に示すように、ガラス基板1の上に、ITO(indium tin oxide)又はIn23(ZnO)m(但しm>0)でなる、アノード電極としての透明電極2が所定の電極パターンに形成する。なお、この透明電極2のパターニングは、上記導電膜を堆積させた後、フォトリソグラフィー技術及びエッチング(ドライエッチング又はウェットエッチング)技術を用いて行うことができる。
【0014】
その後、同図に示すように、透明電極2上に、順次、正孔輸送層3、発光層4、電子輸送層5を積層する。本実施形態では、電子輸送層5がトリス(8-ヒドロキシキノリン)アルミニウムで形成されている。また、発光層4は、96重量%の4,4'-ビス(2,2-ジフェニルビニレン)ビフェニル及び4重量%の4,4'-ビス(2-カルバゾールビニレン)ビフェニルからなる。さらに、正孔輸送層5は、N,N'-ジ(α-ナフチル)-N,N'-ジフェニル-1,1'-ビフェニル-4,4'-ジアミンで形成されている。これら正孔輸送層3、発光層4、及び電子輸送層5の3層で有機EL層6が構成されている。なお、これらの積層構造の有機EL層6では、電圧が印加されることにより青色波長域の光を発生する。
【0015】
次に、図1に示すように、電子輸送層5の上に低仕事関数金属のMgAgでなる10nm以下の膜厚の金属膜7を蒸着させる。なお、この金属膜7の蒸着に際しては、所望の電極パターンが形成されたハードマスクを用いる。
【0016】
続いて、図2に示すように、金属膜7にオゾン(O3)及び/又は酸素ガスを接触させて金属膜7の酸化を行って、MgO:Ag2Oでなる絶縁膜7Aに変化させる。
【0017】
その後、再度、ハードマスクを用いて、MgAgを所定の膜厚になるまで蒸着を行ってカソード電極としての背面電極7Bを形成することにより、本実施形態の電界発光素子8が完成する。
【0018】
本実施形態では、絶縁膜7Aが酸化される前の材料が背面電極7Bと同一のMgAgであるため、背面電極7Bと絶縁膜7Aとの密着性が極めて高く界面に酸素や水分の侵入を抑制する効果が高くなる。また、カソード電極としての背面電極7Bと電子輸送層5との間に極薄い(10nm以下)膜厚の絶縁膜7Aを介在させたことにより、背面電極7Bから電子輸送層5への電子注入効率を向上させ、絶縁膜を介在しない構造の電界発光素子に比較して発光開始電圧や発光効率を向上させることが可能となる。
【0019】
(実施形態2)
図4は、本発明に係る電界発光素子の実施形態2を示す要部断面図である。本実施形態では、上記した実施形態1と同様にガラス基板1の上に透明電極2を形成した後、正孔輸送層3、発光層4、及び電子輸送層5を積層して有機EL層6を形成する。その後、本実施形態2では、有機EL層6に酸素(O2)ガス及びオゾン(O3)ガスを接触させて有機EL層6中にO2とO3を吸着させる。
【0020】
次に、電子輸送層5の上に、MgAgを蒸着して背面電極材料膜9をパターン形成する。その後、図4に示すように、透明電極2と背面電極材料膜9との間に逆バイアス電圧を印加する。この逆バイアスの印加によって、比較的ポーラスな有機EL層6中の双極子モーメントを有するO2、O3が背面電極材料膜9の電子輸送層5との界面に集まる。逆バイアス状態では背面電極材料膜9の電子のポテンシャルがO2、O3の最外殻の電子のポテンシャルより低くなるため、酸素原子が容易に背面電極材料膜9と共有結合し、背面電極材料膜9は、背面電極9Bとその下面に酸化された10nm以下の薄い絶縁膜9Aとになる。このようにして、背面電極9Bと電子輸送層5との間に極薄い絶縁膜9Aが介在された電界発光素子8が完成する。
【0021】
本実施形態2では、有機EL層6中へのO2やO3の吸着量により酸化して形成される絶縁膜9Aの膜厚を制御することが可能であり、極薄い膜厚の絶縁膜を面内で均一に形成することが可能となる。特に、本実施形態においては、絶縁膜9Aと背面電極9Bとが連続的に形成されたものであるため、外部から界面に酸素や水分が侵入するのを防止することができる。また、カソード電極としての背面電極9Bと電子輸送層5との間に、均一で極薄い(10nm以下)膜厚の絶縁膜9Aを介在させたことにより、背面電極7Bから電子輸送層5への電子注入効率を向上させ、絶縁膜を介在しない構造の電界発光素子に比較して発光開始電圧や発光効率を向上させることが可能となる。
【0022】
以上、実施形態1及び実施形態2について説明したが、本発明はこれらに限定されるものではなく、構成の要旨に付随する各種の変更が可能である。例えば、上記した実施形態1及び実施形態2では、背面電極7B、背面電極材料膜9の材料としてMgAgを用いたが、この他にLi、Ca、Mg、Yなどを含む導電性材料や、Ag、Al、AlLi(アルミリチウム)などのように酸化物を形成できる金属であればこれに限らない。また、上記した実施形態では、ガラス基板1上に透明電極2を形成したが、ガラス基板1上に背面電極7B、背面電極材料膜9を形成する構成としてもよい。この場合、背面電極7B、背面電極材料膜9を上記した材料で形成した後、酸素又はオゾン雰囲気下で電子輸送層5をその上に蒸着することで背面電極7Bと電子輸送層5との界面に絶縁膜7Aを形成することができる。さらに、上記した実施形態では、3層構造の有機EL層6を用いたが、単層や3層以上の多層構造のものを用いてもよい。また、上記した実施形態では、金属膜7、背面電極7B、及び背面電極材料膜9は蒸着により形成されたが、スパッタリング或いはイオンプレーティングにより形成されてもよい。
【0023】
【発明の効果】
以上の説明から明らかなように、この発明によれば、発光開始電圧や発光効率が向上した電界発光素子を実現することができる。
【図面の簡単な説明】
【図1】本発明に係る電界発光素子の実施形態1の製造工程を示す要部断面図。
【図2】実施形態1の製造工程を示す要部断面図。
【図3】実施形態1の電界発光素子の要部断面図。
【図4】本発明に係る電界発光素子の実施形態2の製造工程を示す要部断面図。
【図5】実施形態2の製造工程を示す要部断面図。
【符号の説明】
1 ガラス基板
2 透明導電膜
3 正孔輸送層
4 発光層
5 電子輸送層
6 有機EL層
7 金属膜
7A 絶縁膜
7B 背面電極
8 電界発光素子
9 背面電極材料膜
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method of an electroluminescent device, and more particularly, an organic electroluminescence (hereinafter, organic EL hereinafter) according to the method of manufacturing the light emitting device using the material.
[0002]
[Prior art]
As a conventional electroluminescent device, an anode electrode is formed on a glass substrate, and, for example, an organic layer composed of three layers of a hole transport layer, a light emitting layer, and an electron transport layer is formed thereon. An electroluminescent structure in which a very thin insulating film made of, for example, lithium fluoride (LiF) is deposited on the layer by vapor deposition, and a cathode electrode made of a low work function metal is formed on the insulating film. There are elements. In such an electroluminescent device, by applying a bias voltage positively, the electron injection efficiency is improved, and the light emission starting voltage and the luminous efficiency are improved as compared with an electroluminescent device having a structure without an insulating film. It has been known.
[0003]
An object of the present invention is to provide a manufacturing method for easily manufacturing an electroluminescent element.
[0004]
[Means for Solving the Problems]
The invention described in claim 1 includes a step of forming an electroluminescent layer on a transparent electrode, a step of adsorbing oxygen or ozone on the electroluminescent layer, and a step of forming a counter electrode on the electroluminescent layer. Applying an electric field in a direction opposite to the electric field emitted from the electroluminescent layer between the counter electrode and the transparent electrode to oxidize the interface of the counter electrode joined to the electroluminescent layer to form an insulating thin film And a step of performing.
[0011]
Therefore, in the first aspect of the present invention, oxygen and ozone once adsorbed to the electroluminescent layer need only be electrically chemically reacted with the interface of the counter electrode. An increase in the number can be avoided. In addition, the film thickness of the insulating thin film can be controlled by the amount of oxygen and ozone adsorbed, and an insulating thin film having a very thin film thickness can be formed. Further, since the insulating thin film oxidizes the interface of the counter electrode bonded to the electroluminescent layer, the bonding property of the interface between the insulating thin film and the counter electrode is good, so that a high carrier injection property can be obtained.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the details of the electroluminescent device and the method for manufacturing the same according to the present invention will be described based on embodiments shown in the drawings.
[0013]
(Embodiment 1)
1 to 3 show Embodiment 1 of an electroluminescent element according to the present invention. First, the manufacturing method of this embodiment is demonstrated using FIGS. As shown in FIG. 1, a transparent electrode 2 made of ITO (indium tin oxide) or In 2 O 3 (ZnO) m (where m> 0) is formed on a glass substrate 1 as a predetermined electrode pattern. To form. The patterning of the transparent electrode 2 can be performed using a photolithography technique and an etching (dry etching or wet etching) technique after the conductive film is deposited.
[0014]
Thereafter, as shown in the figure, a hole transport layer 3, a light emitting layer 4, and an electron transport layer 5 are sequentially laminated on the transparent electrode 2. In the present embodiment, the electron transport layer 5 is formed of tris (8-hydroxyquinoline) aluminum. The light emitting layer 4 is composed of 96% by weight of 4,4′-bis (2,2-diphenylvinylene) biphenyl and 4% by weight of 4,4′-bis (2-carbazolvinylene) biphenyl. Further, the hole transport layer 5 is formed of N, N′-di (α-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine. The organic EL layer 6 is constituted by the three layers of the hole transport layer 3, the light emitting layer 4, and the electron transport layer 5. In addition, in the organic EL layer 6 of these laminated structures, light in a blue wavelength region is generated when a voltage is applied.
[0015]
Next, as shown in FIG. 1, a metal film 7 having a thickness of 10 nm or less made of MgAg which is a low work function metal is deposited on the electron transport layer 5. In the vapor deposition of the metal film 7, a hard mask on which a desired electrode pattern is formed is used.
[0016]
Subsequently, as shown in FIG. 2, the metal film 7 is oxidized by bringing the metal film 7 into contact with ozone (O 3 ) and / or oxygen gas, thereby changing to an insulating film 7 A made of MgO: Ag 2 O. .
[0017]
Thereafter, using a hard mask again, MgAg is vapor-deposited to a predetermined thickness to form a back electrode 7B as a cathode electrode, thereby completing the electroluminescent element 8 of the present embodiment.
[0018]
In this embodiment, since the material before the insulating film 7A is oxidized is the same MgAg as that of the back electrode 7B, the adhesion between the back electrode 7B and the insulating film 7A is extremely high, and oxygen and moisture are prevented from entering the interface. The effect to do becomes high. Further, by interposing an extremely thin (10 nm or less) insulating film 7A between the back electrode 7B as the cathode electrode and the electron transport layer 5, the electron injection efficiency from the back electrode 7B to the electron transport layer 5 is improved. As a result, it is possible to improve the light emission starting voltage and the light emission efficiency as compared with an electroluminescent device having a structure without an insulating film.
[0019]
(Embodiment 2)
FIG. 4 is a cross-sectional view of the main part showing Embodiment 2 of the electroluminescent element according to the present invention. In the present embodiment, the transparent electrode 2 is formed on the glass substrate 1 in the same manner as in the first embodiment, and then the hole transport layer 3, the light emitting layer 4, and the electron transport layer 5 are stacked to form the organic EL layer 6. Form. Thereafter, in the second embodiment, oxygen (O 2 ) gas and ozone (O 3 ) gas are brought into contact with the organic EL layer 6 to adsorb O 2 and O 3 into the organic EL layer 6.
[0020]
Next, MgAg is vapor-deposited on the electron transport layer 5 to pattern the back electrode material film 9. Thereafter, as shown in FIG. 4, a reverse bias voltage is applied between the transparent electrode 2 and the back electrode material film 9. By applying this reverse bias, O 2 and O 3 having a dipole moment in the relatively porous organic EL layer 6 gather at the interface of the back electrode material film 9 with the electron transport layer 5. In the reverse bias state, the electron potential of the back electrode material film 9 is lower than the potential of the outermost electrons of O 2 and O 3 , so that oxygen atoms are easily covalently bonded to the back electrode material film 9 and the back electrode material. The film 9 becomes a back electrode 9B and a thin insulating film 9A of 10 nm or less oxidized on the lower surface thereof. In this way, the electroluminescent element 8 in which the very thin insulating film 9A is interposed between the back electrode 9B and the electron transport layer 5 is completed.
[0021]
In the second embodiment, the film thickness of the insulating film 9A formed by oxidation can be controlled by the amount of O 2 or O 3 adsorbed in the organic EL layer 6, and the insulating film having an extremely thin film thickness can be controlled. Can be formed uniformly in the plane. In particular, in this embodiment, since the insulating film 9A and the back electrode 9B are continuously formed, it is possible to prevent oxygen and moisture from entering the interface from the outside. Further, the insulating film 9A having a uniform and extremely thin (10 nm or less) film thickness is interposed between the back electrode 9B serving as the cathode electrode and the electron transport layer 5, so that the back electrode 7B is transferred to the electron transport layer 5. The electron injection efficiency can be improved, and the light emission starting voltage and the light emission efficiency can be improved as compared with an electroluminescent device having a structure without an insulating film.
[0022]
As mentioned above, although Embodiment 1 and Embodiment 2 were demonstrated, this invention is not limited to these, The various change accompanying the summary of a structure is possible. For example, in Embodiment 1 and Embodiment 2 described above, MgAg is used as the material of the back electrode 7B and the back electrode material film 9, but in addition to this, a conductive material containing Li, Ca, Mg, Y, etc., Ag Any metal that can form an oxide, such as Al, AlLi (aluminum lithium), is not limited thereto. In the above-described embodiment, the transparent electrode 2 is formed on the glass substrate 1. However, the back electrode 7 </ b> B and the back electrode material film 9 may be formed on the glass substrate 1. In this case, after the back electrode 7B and the back electrode material film 9 are formed of the above-described materials, the electron transport layer 5 is vapor-deposited thereon under an oxygen or ozone atmosphere to thereby provide an interface between the back electrode 7B and the electron transport layer 5. An insulating film 7A can be formed. Furthermore, in the above-described embodiment, the organic EL layer 6 having a three-layer structure is used. However, a single-layer structure or a multilayer structure having three or more layers may be used. In the above-described embodiment, the metal film 7, the back electrode 7B, and the back electrode material film 9 are formed by vapor deposition, but may be formed by sputtering or ion plating.
[0023]
【The invention's effect】
As is apparent from the above description, according to the present invention, an electroluminescent element with improved light emission starting voltage and light emission efficiency can be realized.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a principal part showing a manufacturing process of Embodiment 1 of an electroluminescent element according to the present invention.
2 is a cross-sectional view of main parts showing a manufacturing process of Embodiment 1. FIG.
3 is a cross-sectional view of a main part of the electroluminescent element of Embodiment 1. FIG.
FIG. 4 is a cross-sectional view showing a main part of a manufacturing process of Embodiment 2 of the electroluminescent element according to the present invention.
5 is a cross-sectional view of main parts showing a manufacturing process of Embodiment 2. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Transparent electrically conductive film 3 Hole transport layer 4 Light emitting layer 5 Electron transport layer 6 Organic EL layer 7 Metal film 7A Insulating film 7B Back electrode 8 Electroluminescent element 9 Back electrode material film

Claims (1)

透明電極の上に電界発光層を形成する工程と、前記電界発光層に酸素又はオゾンを吸着させる工程と、前記電界発光層の上に対向電極を形成する工程と、前記対向電極と前記透明電極との間に前記電界発光層の発光する電界と逆方向の電界を印加することによって前記対向電極の前記電界発光層と接合する界面を酸化して絶縁薄膜を形成する工程と、を備えることを特徴とする電界発光素子の製造方法。Forming an electroluminescent layer on the transparent electrode; adsorbing oxygen or ozone to the electroluminescent layer; forming a counter electrode on the electroluminescent layer; the counter electrode and the transparent electrode Forming an insulating thin film by oxidizing an interface of the counter electrode joined to the electroluminescent layer by applying an electric field in a direction opposite to the electric field emitted from the electroluminescent layer. A method for manufacturing an electroluminescent element.
JP21989798A 1998-07-21 1998-07-21 Method for manufacturing electroluminescent element Expired - Lifetime JP4045656B2 (en)

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