JP4079093B2 - Micro relay - Google Patents

Description

  The present invention relates to a microrelay formed using a semiconductor microfabrication technique.

2. Description of the Related Art Conventionally, some microrelays formed using a semiconductor microfabrication technique include a body including an electromagnet device and an armature block joined to the body via a spacer. The armature block integrally includes an armature substrate that includes a magnetic body and constitutes the armature, and a frame that surrounds the entire circumference of the armature substrate and supports the armature substrate in a swingable manner. The armature substrate has a longitudinal center on both sides in the width direction connected to the frame by a pair of elastic pieces, and performs a seesaw operation with the elastic pieces as axes. (For example, refer to Patent Document 1).
JP-A-5-114347 (paragraph numbers [0013] to [0023], FIG. 1, FIG. 2, FIG. 5)

  The micro relay is configured by joining the magnetic body to the armature substrate to form an armature. A phenomenon occurs in which the armature block is deformed due to warpage or distortion due to thermal stress (thermal strain) caused by a difference in thermal expansion coefficient from the magnetic material. That is, depending on the temperature environment at the time of manufacture and use, the armature block may be deformed, and there is a problem that the joint between the armature substrate and the magnetic body cannot be maintained.

  The present invention has been made in view of the above reasons, and its purpose is to suppress the deformation of the armature block regardless of the temperature environment at the time of manufacture and the temperature environment at the time of use and to bond the armature substrate and the magnetic body. It is to provide a micro relay that can be held.

According to the first aspect of the present invention, there is provided a body having an electromagnet device, a rectangular armature substrate formed of silicon and having a rectangular plate-like magnetic body and constituting an armature, and surrounding the entire circumference of the armature substrate. An armature block integrally provided with a frame for swingably supporting the board; and a contact mechanism for contacting and separating the fixed contact and the movable contact by the swinging of the armature. Corners connected to the four corners of the main body through meandering parts meandering on the same plane as the main body, and the corners can be displaced in accordance with the expansion and contraction of the meandering part. The body is arranged so as to overlap the main body and the corners, and the armature substrate and the magnetic body are joined only at the corners .

According to the present invention absorbs temperature changes due to a difference in thermal expansion coefficient between A Machua substrate and the magnetic material and the heat stress generated during a high temperature in a serpentine portion, warpage of the armature block, deformation or distortion or the like, the junction It is possible to prevent breakage by preventing the breakage of the armature substrate and the magnetic body during heating in the manufacturing process, when the ambient temperature changes during use, and at high temperatures .

As described above, in the present invention, the thermal stress is absorbed by the meandering portion , so that the armature block can be prevented from warping and deformation, such as distortion, and can be prevented from being damaged. It is possible to maintain the bonding between the armature substrate and the magnetic body when the ambient temperature changes in the state and when the temperature is high. Therefore, there is an effect that it is possible to maintain the bonding between the armature substrate and the magnetic body by suppressing the deformation of the armature block regardless of the temperature environment at the time of manufacture and the temperature environment at the time of use.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

( Reference Example 1 )
FIG. 2 shows a reference example of a micro relay . This micro relay includes a body 1, an electromagnet device 2, an armature block 3, and a cover 4.

  The body 1 has a rectangular plate shape made of glass, and through holes 10A, 10B, 10C, and 10D penetrating the upper and lower surfaces of the body 1 are formed in the vicinity of the four corners. Electric paths 11A to 11D for electrically connecting an electric circuit (not shown) of a printed board on which the micro relay is mounted and a fixed contact described later are formed on the inner peripheral surfaces of the through holes 10A to 10D. . Each of the electric paths 11A to 11D is made of chromium, titanium, platinum, cobalt, nickel, copper, gold, an alloy of gold and cobalt, or an alloy of these, and is formed by plating, vapor deposition, sputtering, or the like. Lands 12 that are electrically connected to the electrical paths 11A to 11D are formed on the peripheral edges of the openings at both ends of the through holes 10A to 10D. As shown in FIG. 3, bumps 13 made of a conductive material such as gold, silver, copper, and solder are placed on the land 12 on the lower surface side of the body 1 so as to block the lower surface openings of the through holes 10A to 10D. In addition, it is tightly bonded by heat or the like.

  Two pairs of fixed contacts 14A, 14B, 15A, 15B are formed on the upper surface of the body 1. Each fixed contact 14A, 14B, 15A, 15B has at least the surface thereof formed of chromium, titanium, platinum, cobalt, nickel, copper, gold, an alloy of gold and cobalt, or an alloy thereof. The fixed contacts 14A and 14B are arranged side by side so as to be sandwiched between the two through holes 10A and 10B. One fixed contact 14A is electrically connected to the land 12 of the through hole 10A, and the other fixed contact 14B is electrically connected to the land 12 of the through hole 10B. Similarly, the fixed contacts 15A and 15B are arranged in parallel so as to be sandwiched between the two through holes 10C and 10D. One fixed contact 15A is electrically connected to the land 12 of the through hole 10C, and the other fixed contact 15B. Is electrically connected to the land 12 of the through hole 10D.

  A cross-shaped through hole 16 penetrating the upper and lower surfaces of the body 1 is provided at the center of the body 1, and the thin film 17 is tightly bonded to the body 1 so as to close the through hole 16 on the upper surface side of the body 1. Thereby, the accommodation recessed part 18 which accommodates the electromagnet apparatus 2 in the lower surface side of the body 1 is formed (refer FIG. 3). The thin film 17 is formed of silicon or glass, and is formed to a thickness of about 5 to 50 μm, preferably about 20 μm, by performing processing such as etching or polishing. The through-hole 16 is formed in a tapered shape having a sectional area that gradually decreases from the lower surface to the upper surface of the body 1, thereby making it easier to accommodate the electromagnet device 2.

  The electromagnet device 2 includes a yoke 20, a permanent magnet 21, coils 22 </ b> A and 22 </ b> B, and a substrate 23. The yoke 20 is formed in a shape in which rectangular plate-like leg pieces 20B and 20C are raised from both ends of the rectangular plate-like central piece 20A by bending or forging an iron plate such as electromagnetic soft iron. The permanent magnet 21 has a rectangular parallelepiped shape and is magnetized so that the back-to-back magnetic pole surfaces 21A and 21B (the magnetic pole surface 21B is not shown) have different polarities. The permanent magnet 21 is attached to the yoke 20 such that one magnetic pole surface 21B is in contact with the center of the central piece 20A of the yoke 20 and the other magnetic pole surface 21A is at the same height as the tips of the leg pieces 20B and 20C. ing. The coil 22A is directly wound around the central piece 20A between the leg piece 20B and the permanent magnet 21, and its end face is in contact with the leg piece 20B and the permanent magnet 21, so that the movement in the left-right direction is restricted. Similarly, the coil 22B is wound directly around the central piece 20A between the leg piece 20C and the permanent magnet 21, and its end face is in contact with the leg piece 20C and the permanent magnet 21, so that movement in the left-right direction is restricted. . The substrate 23 has a rectangular shape and is joined to the lower surface of the central piece 20A of the yoke 20 so as to be orthogonal to the central piece 20A. The substrate 23 has a conductive portion 23A on the lower surface (see FIG. 3), and the tip of the coil 22 is electrically connected to the conductive portion 23A. The conductive portion 23A is provided with a bump 24 that electrically connects an electric circuit (not shown) of a printed board on which the micro relay is mounted and the coil 22.

  The armature block 3 is formed by etching a silicon substrate having a thickness of about 50 to 300 μm, preferably about 200 μm, and surrounds the armature substrate 30 and the entire circumference of the armature substrate 30 so that the armature substrate 30 can swing freely. A supporting frame 31 is integrally provided. As shown in FIG. 4, a rectangular plate-like magnetic body 32 is joined to the lower surface of the armature substrate 30 to constitute an armature 300.

  As shown in FIGS. 4 and 5, the armature substrate 30 includes a rectangular magnetic body holding portion 30A to which the magnetic body 32 is bonded to the lower surface and a movable contact portion 30B to which the movable contacts 33A and 33B are fixed to the lower surface. Become. The movable contact portion 30B is supported on the magnetic body holding portion 30A by hinge pieces 34 that can be elastically deformed on both sides in the longitudinal direction of the magnetic body holding portion 30A.

  Both sides in the width direction of the magnetic body holding portion 30A are supported by the frame 31 by elastic pieces 35 that can be elastically deformed. Four elastic pieces 35 are provided in line symmetry with the axis X of the seesaw operation of the armature substrate 30 as the center. Each elastic piece 35 has one end integrally formed and coupled to the magnetic body holding portion 30A and the other end integrally formed and coupled to the frame 31, and is identical to the frame 31 between the one end and the other end. A plurality of meandering portions 35A meandering in a U shape on the plane are formed. By providing the meandering portion 35A, the elastic piece 35 can be formed long, and the spring constant of the spring force generated when the elastic piece 35 is twisted when the armature substrate 30 performs a seesaw operation can be appropriately reduced. The stress applied to the elastic piece 35 can also be dispersed. The elastic piece 35 is formed with a thickness smaller than the thickness of the frame 31 and with a width smaller than the thickness.

  Further, the magnetic body holding portion 30A has extended pieces 36 formed at the center portions on both sides in the width direction. A protruding portion 36A is provided at a portion of the extending piece 36 that faces the frame 31, and an extending piece 37 having a recessed portion 37A is provided on the inner peripheral surface of the frame 31 that faces the protruding portion 36A. The convex portion 36A and the concave portion 37A constitute a movement restricting portion 301 that restricts the movement of the armature substrate 30 in the horizontal direction by fitting the concave and convex portions on the same plane as the frame 31. Further, as shown in FIG. 4, a protrusion 36 </ b> B serving as a fulcrum for the seesaw operation of the armature substrate 30 is formed on the lower surface of the extended piece 36.

  Further, second extending pieces 38 are formed at the four corners of the magnetic body holding portion 30A. On the lower surface of the second extending piece 38, a second protrusion 38A serving as a stopper for the seesaw operation of the armature substrate 30 is formed. The second protrusion 38A is formed to have a predetermined distance from the upper surface of the body 1 facing when the armature substrate 30 is leveled.

  The magnetic body 32 is formed by machining a magnetic material such as electromagnetic soft iron, electromagnetic stainless steel, permalloy, or ferrite, and is joined to the magnetic body holding portion 30A. By forming the magnetic body 32 by machining, the thickness can be increased and the attractive force can be improved.

  The thickness of the armature substrate 30 is smaller than the thickness of the frame 31, and the lower surface of the armature 300 with respect to the lower surface of the frame 31 (that is, the lower surface of the magnetic body 32 and the lower surfaces of the movable contacts 33A and 33B). The armature substrate 30 is held on the upper side of the frame 31 so as to be recessed. Thus, as will be described later, when the frame 31 is joined to the body 1, a space for accommodating the swing of the armature 300 is formed between the lower surface of the armature 300 and the body 1.

  The cover 4 is formed in a rectangular plate shape using heat-resistant glass such as Pyrex (registered trademark), and a recess for accommodating the swing of the armature 300 is provided on the lower surface.

  The body 1, the armature block 3, and the cover 4 configured as described above are such that the frame 31 of the armature block 3 is anodic bonded to the peripheral edge 19 of the body 1 and the peripheral edge 42 of the cover 4 over the entire periphery. Are joined directly.

And in this reference example , as shown in FIG. 1, the magnetic body 32 is joined to the magnetic body holding | maintenance part 30A of the armature board | substrate 30 through the low melting glass a. The low melting point glass a is heated between the armature substrate 30 and the magnetic body 32 to melt the low melting point glass a, and then cooled, so that the magnetic body 32 passes through the low melting point glass a. Bonded to the armature substrate 30. At this time, the low melting point glass a has a low melting temperature, so that the thermal stress during heating can be reduced, and the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32. Can be absorbed by the low melting point glass a to prevent the armature block 3 from being warped and deformed to prevent breakage, and can be prevented from being damaged. It can be heated during the manufacturing process or when the ambient temperature changes during use. At times, the joint between the armature substrate 30 and the magnetic body 32 can be maintained.

  Next, the operation of this micro relay will be described.

  When the coils 22A and 22B are energized from one direction, the magnetic body 32 is attracted to the one leg piece 20B, and the armature 300 performs a seesaw operation with the apex of the protrusion 36B as a fulcrum. The seesaw operation of the armature 300 stops when the second protrusion 38 </ b> A serving as a stopper provided on the lower surface of the second extending piece 38 contacts the upper surface of the body 1. Providing the second protrusion 38A prevents the magnetic body 32 and the thin film 17 from directly colliding with each other and preventing the magnetic body 32 and / or the thin film 17 from being damaged. At this time, the movable contact 33A provided on the lower surface of the movable contact portion 30B comes into contact with the pair of opposed fixed contacts 14A and 14B, and closes between the fixed contacts 14A and 14B. The movable contact 33 </ b> A obtains an appropriate contact pressure due to the elasticity of the hinge piece 34. By adjusting the distance between the second protrusion 38A and the body 1, the amount of pressing of the movable contacts 33A and 33B can be adjusted. Even when the energization of the coils 22A and 22B is stopped, the armature 300 maintains the same state by the magnetic flux generated from the permanent magnet 21 and passing through the closed magnetic path of the magnetic body 32 → the leg piece 20B → the permanent magnet 21.

Next, when the energizing directions of the coils 22A and 22B are reversed, the magnetic body 32 is attracted to the other leg piece 20C, and the torsional restoring force of the elastic piece 35 is also applied, so that the armature 300 uses the apex of the protrusion 36B as a fulcrum. Execute the seesaw operation in the opposite direction. At this time, the movable contact 33B provided on the lower surface of the movable contact portion 30B comes into contact with the pair of opposed fixed contacts 15A and 15B, and closes between the fixed contacts 15A and 15B. The movable contact 33 </ b> B obtains an appropriate contact pressure due to the elasticity of the hinge piece 34. Even when the energization of the coils 22A and 22B is stopped, the armature 300 maintains the same state by the magnetic flux generated from the permanent magnet 21 and passing through the closed magnetic path of the magnetic body 32 → the leg piece 20C → the permanent magnet 21. That is, the micro relay of this reference example is configured as a latching type relay having a pair of normally open contacts and normally closed contacts.

( Reference Example 2 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In the present reference example , as shown in FIG. 6, a high density energy is irradiated by a laser L to the boundary between the armature substrate 30 and the magnetic body 32 in a state where the magnetic body 32 is placed on the armature substrate 30. The fillet welding is performed, and as shown in FIG. 7, the magnetic body 32 is joined to the armature substrate 30 by the welded portions b formed at a total of six corners of the magnetic body 32 and approximately the center of the long side. In this way, by partially welding and joining the magnetic body 32 to the armature substrate 30, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is welded. It is generated only in the vicinity of b. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high.

  In addition, the number of the welding parts b is not limited to six places, but a sufficient joining effect should just be acquired.

( Reference Example 3 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 8, a metal layer 30C is formed on the lower surface of the armature substrate 30, a metal layer 32A is formed on the upper surface of the magnetic body 32, and the metal layer 30C and the metal layer 32A are pressed together. By doing so, the magnetic body 32 is bonded to the armature substrate 30. In this way, by joining the magnetic body 32 to the armature substrate 30 via the metal layer 30C and the metal layer 32A that are in pressure contact with each other, a difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 causes a change in temperature and a high temperature. The metal layer 30C and the metal layer 32A that are pressed against thermal stress that occurs at times can be absorbed to prevent deformation of the armature block 3 such as warping and distortion, and can be prevented from being damaged. It is possible to maintain the bonding between the armature substrate 30 and the magnetic body 32 when the ambient temperature changes in the state and when the temperature is high.

( Reference Example 4 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 9A, circular holes 30D are formed in two locations in the armature substrate 30, and cylindrical protrusions 32B are opposed to the holes 30D on the upper surface of the magnetic body 32. As shown in FIG. 9B, the protrusion 32B protrudes above the hole 30D in a state where the protrusion 32B is inserted into the hole 30D and the magnetic body 32 is superimposed on the armature substrate 30. The magnetic body 32 is bonded to the armature substrate 30 by caulking the protrusions 32B by applying heat, load, or both heat and load to the top. In this way, by joining only the vicinity of the hole 30D of the armature substrate 30 to the protrusion 32B of the magnetic body 32, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32. Is generated only in the vicinity of the hole 30D and the vicinity of the protrusion 32B. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high.

( Reference Example 5 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 10 (a), a wall 32D is protruded from the periphery of the upper surface of the magnetic body 32 to form a recess 32C surrounded by the wall 32D. The armature substrate 30 is placed on the bottom surface of. Then, as shown in FIG. 10 (b), heat, load, or both heat and load is applied to the upper end of the wall portion 32D to deform the wall portion 32D into an inverted L shape projecting inward, and the armature substrate. The peripheral portion of 30 is engaged with the wall portion 32D protruding inward, so that the peripheral portion of the armature substrate 30 and the upper end of the wall portion 32D deformed in an inverted L shape are joined. In this way, by joining only the peripheral edge portion of the armature substrate 30 to the upper end of the wall portion 32D, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is obtained. It is generated only in the vicinity of the peripheral portion of 30 and the vicinity of the upper end of the wall portion 32D. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high.

( Reference Example 6 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 11 (a), an armature substrate 30 having a circular hole 30E formed substantially at the center is placed on the upper surface of the magnetic body 32, and the magnetic body 32 opens below the hole 30E. The gold ball c is supplied into the hole 30E. Then, as shown in FIG. 11B, the gold ball c is heated by a laser and melted in the hole 30E, so that the gold ball c is joined to the magnetic body 32, and the molten gold ball c is further armature substrate 30. The gold ball c is joined to the armature substrate 30 by covering the upper opening of the hole 30E. That is, the magnetic body 32 is joined to the armature substrate 30 via the molten gold ball c. As described above, by bonding only the vicinity of the hole 30E of the armature substrate 30 to the magnetic body 32, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is generated in the vicinity of the hole 30E. Is only generated. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high.

( Reference Example 7 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 12A, a concave portion 30F is formed in the approximate center of the upper surface of the armature substrate 30, a circular hole 30L is formed in the approximate center of the concave portion 30F, and the magnetic body 32 A rivet is formed in a state in which a concave portion 32E is formed in the approximate center of the lower surface, a circular hole 32F is formed in the approximate center of the concave portion 32E, and the armature substrate 30 and the magnetic body 32 are overlapped so that the hole 30L faces the hole 32F. d is inserted into the holes 30L and 32F. And as shown in FIG.12 (b), the magnetic body 32 is joined to the armature board | substrate 30 by crimping the both ends of the rivet d. In this way, by bonding the magnetic body 32 to the armature substrate 30 only in the vicinity of the rivet d, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 can be reduced. It is generated only in the vicinity of 32F. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high.

( Reference Example 8 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 13, the magnetic body 32 is bonded to the armature substrate 30 by brazing with wax e. Thus, by joining the magnetic body 32 to the armature substrate 30 by brazing, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is absorbed by the wax e. Therefore, the armature block 3 can be prevented from being deformed by suppressing warping, distortion, and the like, and the armature substrate 30 and the magnetism can be prevented from being damaged when heated in the manufacturing process, when the ambient temperature changes in use, and when the temperature is high. The joint with the body 32 can be maintained.

( Reference Example 9 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 14 (a), an armature substrate 30 having a circular hole 30G formed substantially at the center is sandwiched by a magnetic body 32 and a magnetic body 39 from both sides, and an upper opening of the hole 30G is opened. Is welded by irradiating the magnetic body 39 with a high-density energy with the laser L in a state where the lower opening of the hole 30G is covered with the magnetic body 32. And as shown in FIG.14 (b), the armature board | substrate 30 is clamped by the magnetic bodies 32 and 39 by producing | generating the welding part 39A which passes the inside of the hole 30G, and welding the magnetic body 39 to the magnetic body 32, The magnetic body 32 is bonded to the armature substrate 30. As described above, by bonding only the vicinity of the hole 30G of the armature substrate 30 to the magnetic body 32, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is generated in the vicinity of the hole 30G. Is only generated. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high. Further, a metal plate may be used instead of the magnetic body 39.

( Reference Example 10 )
As shown in FIGS. 15A and 15B, the microrelay of this reference example has a recess 30H formed in the approximate center of the top surface of the armature substrate 30 of reference example 9 , and a magnetic body 39 is accommodated in the recess 30H. A circular hole 30G is formed in the approximate center of the bottom surface of the recess 30H. Compared to the reference example 9 , the height of the armature block 3 can be reduced, and further, the distance between the magnetic body 32 and the magnetic body 39 can be shortened, so that laser welding is facilitated. Further, a metal plate may be used instead of the magnetic body 39.

( Reference Example 11 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 16 (a), an armature substrate 30 having a circular hole 30G formed substantially at the center is placed on the upper surface of the magnetic body 32, and the magnetic body 32 opens below the hole 30G. In a state of covering the surface, spherical gold (Au) e is supplied into the hole 30E. A magnetic body 39 is disposed on the upper end of the gold e. Then, as shown in FIG. 15B, by applying heat, load, or both heat and load to the magnetic bodies 32 and 39 to melt or deform the gold e in the hole 30G, the magnetic body 32 becomes And bonded to the magnetic body 39 through the gold e in the hole 30G. In this way, by bonding only the vicinity of the hole 30G of the armature substrate 30 to the magnetic body 39, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is increased in the vicinity of the hole 30G. Is only generated. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high. Further, gold / tin alloy (Au—Sn) may be used instead of gold e.

( Reference Example 12 )
As shown in FIGS. 17A and 17B, the microrelay of this reference example has a recess 30H formed at the approximate center of the top surface of the armature substrate 30 of reference example 11 , and the magnetic body 39 is accommodated in the recess 30H. A circular hole 30G is formed in the approximate center of the bottom surface of the recess 30H. Compared to the reference example 11 , the height of the armature block 3 can be reduced, and further, the distance between the magnetic body 32 and the magnetic body 39 can be shortened, so that the volume of gold e to be supplied can be reduced. Further, gold / tin alloy (Au—Sn) may be used instead of gold e.

( Reference Example 13 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 18A, the armature substrate 30 is sandwiched between the magnetic body 32 and the magnetic body 39 from both sides. Here, the magnetic body 32 is larger than the lower surface of the facing armature substrate 30, and the magnetic body 39 is larger than the upper surface of the facing armature substrate 30. Then, by irradiating the peripheral portion 32G of the magnetic body 32 and the peripheral portion 39B of the magnetic body 39 with high density energy by the laser L (in FIG. 18A, laser irradiation to the peripheral portion 32G of the magnetic body 32 is performed. 18 (b), as shown in FIG. 18B, the peripheral edge portion 32G of the magnetic body 32 and the peripheral edge portion 39B of the magnetic body 39 are joined at the side end portion of the armature substrate 30, and the peripheral edge portion 32G The peripheral edge 39B is joined to the side end face of the armature substrate 30. In this way, by bonding only the side end surface of the armature substrate 30 to the peripheral portions 32G and 39B of the magnetic bodies 32 and 39, due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32, when the temperature changes and when the temperature is high. The generated thermal stress is generated only in the vicinity of the side end face of the armature substrate 30 and in the vicinity of the peripheral portions 32G and 39B of the magnetic bodies 32 and 39. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high.

( Reference Example 14 )
The microrelay of this reference example is different from the reference example 1 in the structure of the armature substrate 30 and the joining structure of the armature substrate 30 and the magnetic body 32, and the description of the same configuration as in the reference example 1 is omitted.

In this reference example , as shown in FIG. 19A, the four corner portions 30I of the rectangular armature substrate 30 are connected to the armature substrate 30 via L-shaped elastic portions 30J. The part 30I can be displaced in accordance with the expansion and contraction of the elastic part 30J. Then, as shown in FIG. 19B, the magnetic body 32 is joined to the joint portion f provided at each corner portion 30I of the armature substrate 30, and the elastic portion 30J expands and contracts according to the displacement of the magnetic body 32, The part 30I is also displaced. Therefore, the elastic part 30J absorbs the thermal stress generated at the time of temperature change and high temperature due to the difference in the thermal expansion coefficient between the armature substrate 30 and the magnetic body 32, and the armature block 3 is deformed such as warp, distortion, etc. The breakage can be suppressed and the breakage can be prevented, and the bonding between the armature substrate 30 and the magnetic body 32 can be maintained at the time of heating in the manufacturing process, at the time of ambient temperature change during use, and at a high temperature.

( Embodiment 1 )
The microrelay of this embodiment is different from the reference example 1 in the structure of the armature substrate 30 and the joining structure of the armature substrate 30 and the magnetic body 32, and the description of the same configuration as in the reference example 1 is omitted.

  In the present embodiment, as shown in FIG. 20A, the four corners 30I of the rectangular armature substrate 30 are arranged via meandering portions 30K meandering in a U-shape on the same plane as the armature substrate 30. The corner portion 30I is displaceable in accordance with the expansion and contraction of the meandering portion 30K, and the extensionable distance is increased by providing the meandering portion 30K. Then, as shown in FIG. 20B, the magnetic body 32 is joined to the joint portion f provided at each corner portion 30I of the armature substrate 30, and the meandering portion 30K expands and contracts in accordance with the displacement of the magnetic body 32. The part 30I is also displaced. Therefore, the heat stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is absorbed by the meandering portion 30K, and deformation of the armature block 3 such as warpage, distortion, etc. The breakage can be suppressed and the breakage can be prevented, and the bonding between the armature substrate 30 and the magnetic body 32 can be maintained at the time of heating in the manufacturing process, at the time of changing the ambient temperature in use, and at a high temperature.

( Reference Example 15 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 21, the armature substrate 30 and the magnetic body 32 are overlapped, and the side ends thereof are sandwiched vertically by the U-shaped sandwiching means g. The thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient with the magnetic body 32 is generated independently on the armature substrate 30 and the magnetic body 32, so that the armature block 3 is prevented from warping, deformation and the like. Thus, the breakage can be prevented, and the bonding between the armature substrate 30 and the magnetic body 32 can be maintained at the time of heating in the manufacturing process, at the time of ambient temperature change in use condition, and at a high temperature.

( Reference Example 16 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 22, a plurality of metal layers 30M are partially formed on the lower surface of the armature substrate 30 by plating or sputtering, and the lower surfaces of the metal layers 30M are overlaid on the upper surface of the magnetic body 32. In this state, the magnetic body 32 is joined to the armature substrate 30 by irradiating a laser on the lower surface of the magnetic body 32 facing the metal layer 30M and welding the metal layer 30M and the magnetic body 32. In this way, by welding the magnetic body 32 to the armature substrate 30, the metal layer 30M absorbs thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32, The armature block 3 and the magnetic body 32 can be prevented from being deformed by suppressing deformation such as warping and distortion of the armature block 3, and during heating in the manufacturing process, and when the ambient temperature changes in use and at high temperatures. Can hold the joint.

  In addition, since the metal layer 30M is partially formed on the lower surface of the armature substrate 30, the influence of heat stress is less than when the metal layer 30M is formed entirely, and deformation of the armature block 3 is further suppressed. be able to.

( Reference Example 17 )
The microrelay of this reference example is different from the reference example 1 only in the junction structure between the armature substrate 30 and the magnetic body 32, and the description of the same configuration as that of the reference example 1 is omitted.

In this reference example , as shown in FIG. 23A, a plurality of metal layers 30N are partially formed on the upper surface of the armature substrate 30, and the lower surface of the armature substrate 30 is disposed on the upper surface of the magnetic body 32. Then, by irradiating each metal layer 30N with high-density energy from above by the laser L, as shown in FIG. 23B, a melt-bonded portion extending from the metal layer 30N to the magnetic body 32 via the armature substrate 30. h is generated, and the armature substrate 30 and the magnetic body 32 are joined by overlap welding. In this way, by bonding only each fusion bonding portion h to the upper surface of the magnetic body 32, the thermal stress generated at the time of temperature change and high temperature due to the difference in thermal expansion coefficient between the armature substrate 30 and the magnetic body 32 is melted. It is generated only in the vicinity of h. That is, by generating only a part of the thermal stress, it is possible to prevent the armature block 3 from being deformed, such as warping and distortion, thereby preventing the damage. The junction between the armature substrate 30 and the magnetic body 32 can be maintained when the temperature changes and when the temperature is high.

  In addition, since each metal layer 30N is formed at substantially the same height as the upper surface of the armature substrate 30, that is, the frame 31, the forming operation of each metal layer 30N is facilitated. Furthermore, since the energy for welding is irradiated from the upper surface side of the armature substrate 30, damage to the magnetic body 32 disposed on the lower surface side of the armature substrate 30 can be suppressed to a minimum.

It is a figure which shows the junction structure of the armature board | substrate and magnetic body of the micro relay of the reference example 1 of this invention. It is a disassembled perspective view which shows the structure of a micro relay same as the above. It is the perspective view which looked at the micro relay same as the above from the lower side. It is the disassembled perspective view which looked at the armature block same as the above from the lower side. It is the figure which looked at the armature block same as the above from the upper side. It is a perspective view which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 2 of this invention. It is the figure which looked at the armature block same as the above from the lower side. It is a figure which shows the junction structure of the armature board | substrate and magnetic body of the micro relay of the reference example 3 of this invention. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 4 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate of the micro relay of the reference example 5 of this invention, and a magnetic body, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 6 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 7 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the junction structure of the armature board | substrate and magnetic body of the micro relay of the reference example 8 of this invention. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 9 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 10 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 11 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 12 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 13 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 14 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of Embodiment 1 of this invention, (a) shows the state before joining, (b) shows the state after joining. It is a figure which shows the junction structure of the armature board | substrate and magnetic body of the micro relay of the reference example 15 of this invention. It is a figure which shows the joining structure of the armature board | substrate and magnetic body of the micro relay of the reference example 16 of this invention. It is a figure which shows the junction structure of the armature board | substrate and magnetic body of the micro relay of the reference example 17 of this invention, (a) is a general view, (b) shows a partially expanded view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Body 2 Electromagnet apparatus 3 Armature block 4 Cover 30 Armature board 32 Magnetic body a Low melting glass

Claims (1)

A body with an electromagnet device;
An armature integrally formed with a rectangular armature substrate formed of silicon and having a rectangular plate-like magnetic body and constituting the armature, and a frame surrounding the entire circumference of the armature substrate and supporting the armature substrate in a swingable manner Block,
A contact mechanism in which the fixed contact and the movable contact are contacted and separated by the swing of the armature;
The armature substrate has a main body portion and corner portions connected to the four corners of the main body portion via meandering portions meandering on the same plane as the main body portion, and the corner portions correspond to expansion and contraction of the meandering portion. The position can be displaced,
The magnetic relay is disposed so as to overlap the main body and the corners, and the armature substrate and the magnetic body are joined only at the corners .

Images