JP4079643B2

JP4079643B2 - Component supply method and component mounting apparatus

Info

Publication number: JP4079643B2
Application number: JP2002015111A
Authority: JP
Inventors: 浩一矢吹; 敬太森田; 一正奥村; 宗良藤原
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2002-01-24
Filing date: 2002-01-24
Publication date: 2008-04-23
Anticipated expiration: 2022-01-24
Also published as: JP2003218586A

Description

【０００１】
【発明の属する技術分野】
本発明は、主として、回路基板に実装すべき種々の電子部品を連続的に供給する方法および供給される電子部品を回路基板に実装する部品実装装置に関するものである。
【０００２】
【従来の技術】
従来、部品実装装置における電子部品の供給方式としては、テーピング方式、バルク方式およびトレイ方式などが知られているが、高速実装装置には主にテーピング方式が採用されている。テーピング方式により電子部品を供給される部品実装装置は一般に図８に示すような構成になっている。
【０００３】
すなわち、この部品実装装置は、装置本体１の部品供給部２に、部品収納部（テープリール）４を有する複数の部品供給カセット３が並列配置で搭載される。これら部品供給カセット３から電子部品を吸着保持するための吸着ノズル１０を備えた実装ヘッド９は、ＸＹロボットに取り付けられて、Ｘ軸ガイドバー７およびＹ軸ガイドバー８によってＸ軸方向ＸおよびＹ軸方向Ｙに沿ってそれぞれ移動されることにより、所要の電子部品を取り出すべき部品供給カセット３における後述の部品供給口の真上に位置決めされる。位置決めされた実装ヘッド９では、吸着ノズル１０が下降して部品供給カセット３から電子部品を吸着保持して上昇する。そののち、実装ヘッド９は、回路基板１１の上方まで移動されて、その回路基板１１の電子部品を実装すべき位置の真上に位置決め停止され、吸着ノズル１０に吸着保持している電子部品を回路基板１１に実装する。
【０００４】
図９に示すように、上記部品供給カセット３では電子部品１２がテーピング部品１５として取り扱われる。すなわち、テーピング部品１５は、キャリアテープ１３の長手方向に沿って所定間隔で設けられた部品収納凹所１４内に電子部品１２を収納し、且つカバーテープ１７を貼着して部品収納凹所１４を閉塞することにより、電子部品１２が部品収納凹所１４内に封入された形態になっている。キャリアテープ１３には、一側辺に沿って送り用穴１６が一定間隔で穿設されている。
【０００５】
上記テーピング部品１５は、図１０に示すように、リールに巻き取られて上記部品収納部４とされ、部品供給カセット３の支軸１８に回転自在、且つ着脱自在に装着される。この部品供給カセット３に装着されたテーピング部品１５は、図１０ないし図１２に示すように、部品収納部４から引き出されて押さえカバー１９の下面に沿ってガイドされながら部品供給口２０に向け移送され、部品供給口２０に位置した電子部品１２が上記吸着ノズル１０で吸着保持されて取り出される。テーピング部品１５の移送は、図１１にも示すように、移送手段としてのスプロケット２１の送り爪２１ａが図９（ａ）に示した送り用穴１６に嵌まり込んだ状態でスプロケット２１が回転することによって行われる。
【０００６】
上記テーピング部品１５のカバーテープ１７は、上記テーピング部品１５が移送される過程において、図１０および図１２に示すように、押さえカバー１９における部品供給口２０の手前側に設けられた剥離手段としてのスリット２２から引き出されてキャリアテープ１３から剥離して分離されたのちに、図１０に示す巻き取りリール２３に巻き取られていく。巻き取りリール２３は、支軸２４に回転自在に取り付けられて、エアシリンダなどの作動機構２７によって作動されるリンク状レバー２８で押動されることにより、カバーテープ１７の巻き取り方向Ａのみに間欠回転される。また、上記スプロケット２１は、上記リンク状レバー２８を押動する作動機構２７の作動に連動して押動されるフィードレバー２９によって間欠回転される。
【０００７】
すなわち、作動機構２７は、駆動機構を介しスプロケット２１を間欠回転させることによってテーピング部品１５を所定量だけ移送して１個の電子部品１２を部品供給口２０に供給すると同時に、リンク状レバー２８およびラチェット機構を介し巻き取りリール２３を所定角度だけ回転させてカバーテープ１７を所定量だけ巻き取るように作動制御する。これにより、部品供給口２０には、カバーテープ１７が剥離されて部品収納凹所１４内で露呈された状態の電子部品１２が位置決めされ、下降した吸着ノズル１０が部品供給口２０を通じて電子部品１２を吸着保持して部品収納凹所１４から取り出すようになっている。
【０００８】
また、図１１および図１２に示すように、押さえカバー１９には、電子部品１２の部品供給口２０への供給動作に連動して部品供給口２０を開閉することにより、電子部品１２が部品供給口２０から不用意に飛び出すのを防止するためのシャッタ３０が設けられている。このシャッタ３０は、押さえカバー１９の側面に固定された２本のガイドピン３１が自体のガイド長孔３２に挿通されて、図１２の矢印方向に移動自在に設けられている。シャッタ３０は、吸着ノズル１０により電子部品１２を吸着保持して取り出すときのみ、図１２に示すように、切欠き３３が部品供給口２０に合致して部品供給口２０を開放し、それ以外のときに、図１２の位置から右方に移動して蓋部３０ａで部品供給口２０を閉塞するように部品供給動作と連動して作動制御される。
【０００９】
上述のように、部品供給カセット３の部品収納部４の電子部品１２は、部品供給口２０に移送されて吸着ノズル１０で吸着保持されたのち、回路基板１１に実装されていくが、この実装動作に伴って上記部品収納部４に収納されている電子部品１２に部品切れが生じた場合には、作業者が部品切れの生じた部品供給カセット３を部品供給部２から取り外して、その部品供給カセット３に新たな補充用の部品収納部４を交換して取り付けたのち、その部品供給カセット３を部品実装装置の部品供給部２における元の位置に戻して取り付け、続いて、部品実装装置における部品交換スイッチ（図示せず）を押圧操作して、部品収納部４を交換した情報を部品実装装置に入力する。これにより、部品実装装置では、新たな電子部品１２が補充されたことを認識して、その情報に基づいてその後の実装動作を制御する。
【００１０】
【発明が解決しようとする課題】
ところで、近年では、図１３に示すように、部品供給カセット３を部品実装装置の部品供給部２から取り外すことなく部品収納部４を交換することにより、部品実装装置の稼働率を高めることのできる部品供給方法が採用されている。すなわち、同図（ａ）に示すように、部品供給動作を行っている部品供給カセット３の部品収納部４に部品切れが生じていない状態において、同図（ｂ）に示すように、部品供給カセット３の本体部分を部品実装装置の部品供給部２から取り外すことなく、部品収納部４のみを取り外して、その取り外した部品収納部４に取り付けられていたテーピング部品１５の終端部１５ｂと、新たな補充用の部品収納部４のテーピング部品１５の始端部１５ａとを接続して、同図（ｃ）に示すように、補充用の部品収納部４を部品供給カセット３に取り付ける部品供給方法が採用されている。
【００１１】
ところで、電子部品１２が実装済みの回路基板１１の品質を非常に重要視する例えば自動車業界などでは、回路基板１１上に実装済みの電子部品１２のロット管理、つまり部品収納部４に巻き回された１つのテーピング部品１５を単位として電子部品１２を管理することが望まれている。したがって、部品実装装置では、実装動作に使用中の部品収納部４のテーピング部品１５における電子部品１２から補充用のテーピング部品１５の電子部品１２に切り替わった時点を確実、且つ正確に把握して管理することが必要となる。
【００１２】
しかしながら、従来の電子部品１２の供給方法のうちの作業者が部品切れの部品供給カセット３を部品実装装置から取り外して新たな補充用の部品供給カセット３を取り付ける方法では、作業者が部品供給カセット３の交換後に部品交換スイッチを押圧操作して部品交換の情報を入力するので、部品実装装置において補充用のテーピング部品１５に切り替わった時点を正確に把握して容易に管理することが可能であるが、部品実装装置の稼働率が低下する欠点がある。
【００１３】
一方、図１３に示した部品供給方法では、部品実装装置の稼働率を高めることができる利点を有する反面、作業者が補充用の部品収納部４のテーピング部品１５の始端部１５ａを使用中のテーピング部品１５の終端部１５ｂに接続して部品補充するタイミングと、使用中のテーピング部品１５の電子部品１２が補充用の部品収納部４のテーピング部品１５の電子部品１２に実際に切り替わるタイミングとが異なるため、回路基板１１上に実装された電子部品１２を、一つの部品収納部４のテーピング部品１５を単位としてロット管理することができない問題がある。
【００１４】
そこで、本発明は、上記従来の課題に鑑みてなされたもので、部品実装の稼働率の低下を招くことなく、回路基板上に実装された電子部品のロット管理を正確に行うことができる部品供給方法およびその部品供給方法を具現化して適用した部品実装装置を提供することを目的とするものである。
【００１５】
【課題を解決するための手段】
上記目的を達成するために、本発明に係る部品供給方法は、複数個の電子部品が収納された部品収納部を有する部品供給装置が、部品供給部に複数配置され、前記各部品供給装置の各々の前記部品収納部のうちから所要の電子部品を順次供給する部品供給方法であって、前記各部品供給装置のそれぞれにおいて、部品供給に使用中の前記部品収納部が補充用の部品収納部に切り替わるときに、前記使用中の部品収納部の電子部品から前記補充用の部品収納部の電子部品に切り替えて供給される時点の部品切替タイミングを検出し、前記部品切替タイミングに基づき、回路基板上に実装された各電子部品がどの部品収納部から供給されたかを対応付けて記憶し、前記部品収納部の単位毎に回路基板上に実装された各電子部品をロット管理することを特徴としている。
【００１６】
この部品供給方法では、複数の部品供給装置の各々に装備される部品収納部が交換されたときに、その交換された部品収納部の電子部品が実際に供給され始める時点の部品切替タイミングを検出して、この部品切替タイミングに基づき、回路基板上に実装された各電子部品がどの部品収納部から供給されたかを対応付けて記憶し、前記部品収納部の単位毎に回路基板上に実装された各電子部品をロット管理するので、回路基板に実装された電子部品を、各部品供給装置毎に各々の部品収納部を単位として正確にロット管理することができる。
【００１８】
上記発明の部品供給方法において、部品収納部が、キャリアテープの長手方向に沿って一列に配設された多数の部品収納凹所に電子部品がそれぞれ収納されてなるテーピング部品がリールに巻回されてなり、部品供給装置に装着された前記部品収納部の前記テーピング部品の終端部と補充用の部品収納部のテーピング部品の始端部とを接続することによって電子部品の補充を行った際に、前記２つのテーピング部品間の接続部を検出し、前記接続部を検出した検出信号が出力された時点での使用中の部品収納部における電子部品の残り個数を算出し、前記電子部品の残り個数に該当する電子部品が供給されたことを検出することにより部品切り替えタイミングを検出することができる。これにより、部品供給装置を部品実装装置の部品供給部から取り外すことなく部品収納部のみを交換して、部品実装の稼働率の向上を図りながら部品供給を継続しながらも、交換した部品収納部の電子部品が実際に供給され始める部品切替タイミングを、接続部を認識した時点で検出された使用中の部品収納部における電子部品の残り個数に該当する電子部品が供給されたかどうかに基づいて正確に検出することができる。
【００２０】
一方、本発明の部品実装装置は、部品供給部に配置された複数の部品供給装置の各々に備えている部品収納部のうちの所要の部品収納部から電子部品を吸着ノズルで吸着保持して回路基板上まで搬送したのち、前記吸着ノズルに吸着保持した前記電子部品を前記回路基板の所要の実装位置に実装する部品実装装置であって、部品供給に使用中の前記部品収納部が補充用の部品収納部に切り替わったのを検出するセンサ部と、前記センサ部から出力する検出信号に基づいて使用中の前記部品収納部から補充用の部品収納部の電子部品に切り替えて電子部品が供給される時点の部品切替タイミングを判別する部品切替時点判別手段と、前記部品切替時点判別手段の判別信号に基づいて、回路基板上に実装された各電子部品がどの部品収納部から供給されたかを対応付けて記憶し、前記部品収納部の単位毎に回路基板上に実装された各電子部品をロット管理する管理手段とを備えていることを特徴としている。
【００２１】
この部品実装装置では、部品収納部の交換をセンサ部で検出して、そのセンサ部の検出信号に基づいて部品切替時点判別手段が部品切替タイミングを判別し、その判別信号に基づき、回路基板上に実装された各電子部品がどの部品収納部から供給されたかを対応付けて記憶し、前記部品収納部の単位毎に回路基板上に実装された各電子部品を正確にロット管理しながら、電子部品の実装を行うことができる。
【００２６】
【発明の実施の形態】
以下、本発明の好ましい実施の形態について図面を参照しながら説明する。本発明の部品供給方法は、図１３に示したように、部品供給カセット３を部品実装装置の部品供給部２から取り外すことなく、部品供給に使用中の部品供給カセット３における部品収納部４のテーピング部品１５の終端部１５ｂに、補充用の部品収納部４のテーピング部品１５の始端部１５ａを接続して、部品実装の稼働率の低下を招くことなしに電子部品１２の供給を行う。但し、図３に示すように、本発明の部品供給方法では、終端部１５ｂと始端部１５ａとの接続部２５を、部品実装装置の装置本体１の適所に配設した接続部検出用センサ部３３によって検出することを特徴の一つとする。
【００２７】
図１は、本発明の一実施の形態に係る部品供給方法を具現化した部品供給装置を示すブロック構成図である。この部品供給装置は、テーピング部品１５の終端部１５ｂと始端部１５ａとの接続部２５を検出するための上記接続部検出用センサ部３３と、このセンサ部３３からの情報に基づき電子部品１２を１つのテーピング部品１５を単位としてロット管理を行う制御部３４とを備えている。
【００２８】
上記制御部３４は、接続部検出用センサ部３３からの検出信号に基づきテーピング部品１５の接続部２５の判別を行う接続部検出手段３７と、部品供給カセット３に装着されて部品供給に使用中の部品収納部４のテーピング部品１５に残存する電子部品１２の個数を算出する部品残数算出手段３８と、実装ヘッド９の吸着ノズル１０が下降して部品供給口２０から電子部品１２を吸着保持する毎にその動作を検出する部品吸着検出手段３９と、部品残数算出手段３８で算出した部品残数と部品吸着検出手段３９の検出情報とに基づき使用中の部品収納部４における現時点の電子部品１２の残数を演算する部品残数演算手段４０と、使用中の部品収納部４のテーピング部品１５の電子部品１２が零になって補充用のテーピング部品１５の電子部品１２に切り替わって供給される時点を判別する部品切替時点判別手段４１と、補充用のテーピング部品１５の電子部品１２に切り替わって供給された時点である部品切替タイミングの時刻を部品供給カセット３毎に管理して、その時刻の情報を部品実装装置の記憶部であるハードディスクに記憶させる部品切替タイミング管理手段４２とを備えて構成されている。
【００２９】
上記部品供給装置における制御処理の説明に先立って、テーピング部品１５の終端部１５ｂと始端部１５ａとの接続部２５の接続部検出用センサ部３３による検出手段について説明する。図４（ａ）の平面図および（ｂ）の側面図に示すように、使用中のテーピング部品１５の終端部１５ｂと補充用のテーピング部品１５の始端部１５ａとは、互いに突き合わせて、その突き合わせ部分の両側面に接続部材２６を貼り付けることにより接続する。
【００３０】
この接続方法では、上記接続部材２６として、テーピング部品１５のカバーテープ１７と異なる着色が施されたものを用いる。その場合、接続部検出用センサ部３３は、色識別センサを用いて構成し、接続部材２６の色彩の識別に基づき接続部２５を検出する。また、接続部材２６としては、テーピング部品１５のカバーテープ１７とは異なる光反射率を有するものを用いてもよく、その場合、接続部検出用センサ部３３は、投受光素子を用いて構成し、反射光の受光量の相違を判別して接続部２５を検出する。さらに、接続部材２６としては、アルミニウム箔またはその他の金属テープを用いてもよく、その場合、接続部検出用センサ部３３は、磁気検出センサを用いて構成し、検出した磁気量に基づく判別により接続部２５を検出する。なお、接続部２５は、使用中のテーピング部品１５の終端部１５ｂと補充用のテーピング部品１５の始端部１５ａとの突き合わせ部分の一側面にのみ接続部材２６を貼り付けて形成してもよく、その場合、接続部材２６は、接続部検出用センサ部３３が配設される側に設ける必要がある。
【００３１】
一方、他の接続手段としては、図５（ａ）の平面図および（ｂ）の側面図に示すように、使用中のテーピング部品１５の終端部１５ｂと補充用のテーピング部品１５の始端部１５ａとの各々の少なくとも一辺側にそれぞれ切欠き３５，３６を設けるとともに、接続部材２６に、双方の切欠き３５，３６を包含する三角形状の切欠き２６ａを設ける。この場合の接続部検出用センサ部３３としては、形状の相違を認識できるセンサを用いて構成する。例えば、接続部検出用センサ部３３は、投光素子と受光素子とを相対向する配置で設ける構成として、受光素子に光が入射することによって接続部２５を検出する。或いは、接続部検出用センサ部３３は、投受光素子によって構成して、光反射の有無によって接続部２５を検出する。この場合、接続部材２６は如何なる材質で形成してもよい。
【００３２】
つぎに、上記部品供給装置における制御処理について、図２のフローチャートに基づき説明する。部品実装装置では、図９ないし図１２で説明したように、部品供給カセット３における部品供給口２０に順次移送された電子部品１２が、下降してくる吸着ノズル１０で吸着保持されて、回路基板１１まで搬送して実装される（ステップＳ１）。このとき、部品実装装置では、吸着ノズル１０が吸着保持した電子部品１２を回路基板１１まで搬送する過程において、吸着中の電子部品１２の吸着姿勢や種別を識別して（ステップＳ２）、電子部品１２の位置補正を行う。また、部品供給装置の制御部３４における接続部検出手段３７は、接続部検出用センサ部３３からの入力信号に基づき、補充用のテーピング部品１５が使用中のテーピング部品１５に接続されて部品補充されたか否かを監視し続ける（ステップＳ３）。
【００３３】
そして、部品供給に使用中の部品供給カセット３の何れかのテーピング部品１５の電子部品１２の残数が少なくなった場合には、作業者が図１３で説明した手順により、使用中のテーピング部品１５の終端部１５ｂと補充用のテーピング部品１５の始端部１５ａとを、図４または図５で示した接続手段によって接続する。これにより、部品実装装置では、部品供給カセット３を取り外すことなく電子部品１２の供給が継続される。その二つのテーピング部品１５の接続部２５が接続部検出用センサ部３３により検出されたときには、制御部３４の接続部検出手段３７が、接続部検出用センサ部３３から入力される検出信号に基づき接続部２５が所定位置に達したと判別して（ステップＳ３）、部品残数算出手段３８に対し判別信号を出力する。
【００３４】
部品残数算出手段３８は、接続部検出手段３７から判別信号を受けたときに、その判別した部品供給カセット３の部品収納部４のテーピング部品１５に収納されている電子部品１２の種別および接続部検出用センサ部３３と部品供給口２０との間隔とに基づいて、現在使用中のテーピング部品１５における電子部品１２の残り個数を算出する（ステップＳ４）。つぎに、この残り個数の算出について、図６を参照しながら説明する。
【００３５】
図６において、吸着ノズル１０は、部品実装装置の部品供給部２に装着されている部品供給カセット３における部品供給口２０の真上位置に位置決め停止され、接続部検出用センサ部３３は、上記部品供給口２０に対し所定の距離Ｌだけ離れた位置に設置されているが、上記距離Ｌは部品残数算出手段３８に内蔵のメモリに予め記憶登録されている。また、部品残数算出手段３８に内蔵のメモリには、部品供給部２の各装着箇所にそれぞれ装着される各部品供給カセット３の種別、つまりこの部品供給カセット３に収納されているテーピング部品１５の種別も予め記憶登録されている。
【００３６】
そこで、部品残数算出手段３８は、先ず、部品供給カセット３に装着のテーピング部品１５の種別から一義的に決まるテーピング部品１５の各部品収納凹所１４の配設ピッチＰを求めて、Ｌ／Ｐの演算を行うことにより、使用中のテーピング部品１５における電子部品１２の残り個数を算出する。ここで、電子部品１２の残り個数は整数であるから、上記演算による算出結果の少数点以下の数値は無視されて、整数を残り個数とされる。この算出した残り個数の情報は、制御部３４の部品残数演算手段４０に対し出力される。
【００３７】
図２に戻って、上記部品残数演算手段４０は、部品残数算出手段３８から入力された残り個数の情報を自体に内蔵のメモリに一次記憶したのちに、吸着ノズル１０が電子部品１２を吸着保持したのを部品吸着検出手段３９が検出して検出信号を出力したか否かを監視する（ステップＳ５）。部品残数演算手段４０は、部品吸着検出手段３９からの信号に基づき吸着ノズル１０が電子部品１２を吸着保持して取り出したと判別する毎に、メモリに記憶している残り個数から「１」を減算して現時点での残り個数を新たに算出し（ステップＳ６）、その算出した残り個数の情報を、メモリに更新記憶するとともに部品切替時点判別手段４１に対し出力する。部品切替時点判別手段４１は、入力された残り個数が「０」であるか否かを判別する（ステップＳ７）。「０」でない場合には、ステップＳ５にリターンして、部品切替時点判別手段４１が「０」であると判別するまで、上述と同様の制御処理が繰り返される。
【００３８】
部品切替時点判別手段４１が部品残数演算手段４０からの入力情報に基づいて残り個数が「０」であると判別したときには、部品供給口２０に供給される電子部品１２が使用中のテーピング部品１５から補充用のテーピング部品１５に切り替わったことを示す情報を部品切替タイミング管理手段４２に対し出力する。これにより、部品切替タイミング管理手段４２は、部品供給口２０に供給される電子部品１２が使用中のテーピング部品１５から補充用のテーピング部品１５に切り替わった時点での時刻を自体に内蔵のタイマ回路から求めて、その時刻情報と部品供給カセット３毎に予め設定されている番号とを部品実装装置のハードディスクに記憶させ（ステップＳ８）たのち、部品実装の稼働の終了であると判別（ステップＳ９）するまで、ステップＳ１にリターンして、上述と同様の制御処理を繰り返す。
【００３９】
したがって、部品実装装置のハードディスクには、図７に示すように、各部品供給カセット３毎に、その部品供給カセット３において補充用のテーピング部品１５の電子部品１２に切り替えて部品供給口２０に電子部品１２の供給が開始される時点での日時と時刻の情報が、部品切替タイミング管理手段４２の管理の下に順次記憶されていく。また、部品切替タイミング管理手段４２は、上記ハードディスクに記憶された情報を基にして、生産済みの部品実装回路基板上にどの部品供給カセット３の電子部品１２が実装されたかを、各部品供給カセット３に装着される１つのテーピング部品１５を単位としてロット管理する。これにより、上記部品供給装置を搭載した部品実装装置では、回路部品１１への電子部品１２の実装動作の稼働率の向上を図りながらも、生産済みの部品実装回路基板上に実装された電子部品のロット管理を正確に行うことができる。
【００４０】
なお、上記実施の形態では、接続部検出用センサ部３３を部品供給口２０から所定の距離Ｌだけ離間した位置に配設した場合について説明しているが、部品供給口２０において接続部２５を検出できる位置に接続部検出用センサ部３３を配設できる場合には、接続部検出用センサ部３３が接続部２５を検出した時点が補充用のテーピング部品１５の電子部品１２に切り替えられる時点となるから、図１の部品残数算出手段３８や部品残数演算手段４０などが不要となり、制御処理を簡略化できる。
【００４１】
【発明の効果】
以上のように本発明の部品供給方法によれば、複数の部品供給装置の各々に装備される部品収納部が交換されたときに、その交換された部品収納部の電子部品が実際に供給され始める時点の部品切替タイミングを検出して、この部品切替タイミングに基づき、回路基板上に実装された各電子部品がどの部品収納部から供給されたかを対応付けて記憶し、前記部品収納部の単位毎に回路基板上に実装された各電子部品をロットするので、回路基板に実装された電子部品を、各部品供給装置毎に各々の部品収納部を単位として正確にロット管理することができる。
【００４２】
また、本発明の部品実装装置によれば、部品収納部の交換をセンサ部で検出して、そのセンサ部の検出信号に基づいて部品切替時点判別手段が部品切替タイミングを判別し、その判別信号に基づいて、回路基板上に実装された各電子部品がどの部品収納部から供給されたかを対応付けて記憶し、前記部品収納部の単位毎に回路基板上に実装された各電子部品を正確にロット管理しながら、電子部品の実装を行うことができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態に係る部品供給方法を具現化した部品供給装置を示すブロック構成図。
【図２】同上の部品供給装置の制御処理を示すフローチャート。
【図３】同上の部品供給装置を搭載した部品実装装置の概略側面図。
【図４】（ａ），（ｂ）は同上の実施の形態における二つのテーピング部品の接続手段を示す平面図および側面図。
【図５】（ａ），（ｂ）は同上の実施の形態における二つのテーピング部品の他の接続手段を示す平面図および側面図。
【図６】同上の実施の形態における電子部品の残り個数を演算する工程の説明図。
【図７】同上の実施の形態において得られた電子部品の切り替えタイミング情報の説明図。
【図８】同上の部品供給装置を適用して電子部品の実装を行える部品実装装置の概略構成を示す斜視図。
【図９】（ａ），（ｂ）は同上の実施の形態に用いられるテーピング部品の平面図および切断側面図。
【図１０】同上の実施の形態に用いられる部品供給カセットの斜視図。
【図１１】同上の部品供給カセットの一部を拡大して示した斜視図。
【図１２】同上の部品供給カセットの一部の斜視図。
【図１３】（ａ）〜（ｃ）は従来の部品供給方法における電子部品を切り替える過程を工程順に示した側面図。
【符号の説明】
２部品供給部
４部品収納部
３部品供給カセット（部品供給装置）
１０吸着ノズル
１１回路基板
１２電子部品
１３キャリアテープ
１４部品収納凹所
１５テーピング部品
１５ａ始端部
１５ｂ終端部
２５接続部
３３接続部検出用センサ部（センサ部）
３８部品残数算出手段
３９部品吸着検出手段
４０部品残数演算手段
４１部品切替時点判別手段
４２部品切替タイミング管理手段[0001]
BACKGROUND OF THE INVENTION
The present invention mainly relates to a method for continuously supplying various electronic components to be mounted on a circuit board and a component mounting apparatus for mounting the supplied electronic components on the circuit board.
[0002]
[Prior art]
Conventionally, a taping method, a bulk method, a tray method, and the like are known as electronic component supply methods in a component mounting apparatus, but a taping method is mainly employed in high-speed mounting apparatuses. A component mounting apparatus to which electronic components are supplied by a taping method is generally configured as shown in FIG.
[0003]
That is, in this component mounting apparatus, a plurality of component supply cassettes 3 having component storage units (tape reels) 4 are mounted in parallel on the component supply unit 2 of the apparatus body 1. A mounting head 9 including a suction nozzle 10 for sucking and holding electronic components from these component supply cassettes 3 is attached to an XY robot, and X and Y directions are X and Y by an X axis guide bar 7 and a Y axis guide bar 8. By being moved along the axial direction Y, it is positioned right above a component supply port (to be described later) in the component supply cassette 3 from which a required electronic component is to be taken out. In the mounted mounting head 9, the suction nozzle 10 descends and ascends and holds electronic components from the component supply cassette 3. After that, the mounting head 9 is moved to above the circuit board 11, the positioning of the electronic component on the circuit board 11 is stopped just above the position where the electronic component is to be mounted, and the electronic component sucked and held by the suction nozzle 10 is held. Mounted on the circuit board 11.
[0004]
As shown in FIG. 9, the electronic component 12 is handled as a taping component 15 in the component supply cassette 3. That is, the taping component 15 stores the electronic component 12 in the component storage recess 14 provided at a predetermined interval along the longitudinal direction of the carrier tape 13, and the cover tape 17 is attached to the component storage recess 14. As a result, the electronic component 12 is sealed in the component housing recess 14. The carrier tape 13 is provided with feed holes 16 at regular intervals along one side.
[0005]
As shown in FIG. 10, the taping component 15 is wound around a reel to form the component storage portion 4, and is rotatably mounted on and removed from the support shaft 18 of the component supply cassette 3. As shown in FIGS. 10 to 12, the taping component 15 mounted on the component supply cassette 3 is pulled out from the component storage portion 4 and transferred to the component supply port 20 while being guided along the lower surface of the holding cover 19. Then, the electronic component 12 positioned at the component supply port 20 is sucked and held by the suction nozzle 10 and taken out. As shown in FIG. 11, the taping component 15 is transferred as the sprocket 21 rotates in a state in which the feed claw 21a of the sprocket 21 serving as a transfer means is fitted in the feed hole 16 shown in FIG. Is done by.
[0006]
The cover tape 17 of the taping component 15 serves as a peeling means provided on the front side of the component supply port 20 in the pressing cover 19 as shown in FIGS. 10 and 12 in the process of transferring the taping component 15. After being pulled out from the slit 22 and separated from the carrier tape 13 and separated, it is taken up by the take-up reel 23 shown in FIG. The take-up reel 23 is rotatably attached to the support shaft 24 and is pushed by a link lever 28 operated by an operating mechanism 27 such as an air cylinder, so that only the take-up direction A of the cover tape 17 is taken. It is intermittently rotated. The sprocket 21 is intermittently rotated by a feed lever 29 that is pushed in conjunction with the actuation of an actuation mechanism 27 that pushes the link lever 28.
[0007]
That is, the actuating mechanism 27 intermittently rotates the sprocket 21 via the drive mechanism to move the taping component 15 by a predetermined amount to supply one electronic component 12 to the component supply port 20, and at the same time, the link lever 28 and The operation is controlled such that the take-up reel 23 is rotated by a predetermined angle via the ratchet mechanism and the cover tape 17 is taken up by a predetermined amount. As a result, the electronic component 12 in a state where the cover tape 17 is peeled off and exposed in the component housing recess 14 is positioned at the component supply port 20, and the lowered suction nozzle 10 passes through the component supply port 20. Is sucked and held and taken out from the component housing recess 14.
[0008]
Further, as shown in FIGS. 11 and 12, the electronic cover 12 is supplied to the holding cover 19 by opening and closing the component supply port 20 in conjunction with the supply operation of the electronic component 12 to the component supply port 20. A shutter 30 is provided to prevent inadvertent jumping out of the mouth 20. The shutter 30 is provided such that two guide pins 31 fixed to the side surface of the presser cover 19 are inserted into the guide long holes 32 thereof and are movable in the direction of the arrow in FIG. Only when the electronic component 12 is sucked and held by the suction nozzle 10 by the suction nozzle 10, the shutter 30 opens the component supply port 20 with the notch 33 matching the component supply port 20, as shown in FIG. Sometimes, the operation is controlled in conjunction with the component supply operation so as to move rightward from the position of FIG. 12 and close the component supply port 20 with the lid portion 30a.
[0009]
As described above, the electronic component 12 of the component storage unit 4 of the component supply cassette 3 is transferred to the component supply port 20 and is sucked and held by the suction nozzle 10 and then mounted on the circuit board 11. In the event that the electronic component 12 stored in the component storage unit 4 is out of operation as a result of operation, the operator removes the component supply cassette 3 from which the component has been disconnected from the component supply unit 2, and the component is removed. After replacing and attaching a new replenishment component storage unit 4 to the supply cassette 3, the component supply cassette 3 is attached back to the original position in the component supply unit 2 of the component mounting apparatus, and then the component mounting apparatus A component replacement switch (not shown) is pressed to input information regarding replacement of the component storage unit 4 to the component mounting apparatus. Thereby, the component mounting apparatus recognizes that a new electronic component 12 has been replenished, and controls the subsequent mounting operation based on the information.
[0010]
[Problems to be solved by the invention]
By the way, in recent years, as shown in FIG. 13, by replacing the component storage unit 4 without removing the component supply cassette 3 from the component supply unit 2 of the component mounting apparatus, the operating rate of the component mounting apparatus can be increased. The parts supply method is adopted. That is, as shown in FIG. 5B, in the state where no parts are cut out in the component storage section 4 of the component supply cassette 3 performing the parts supply operation, as shown in FIG. Without removing the main body portion of the cassette 3 from the component supply unit 2 of the component mounting apparatus, only the component storage unit 4 is removed, and the end portion 15b of the taping component 15 attached to the removed component storage unit 4 is newly added. There is a component supply method in which the replenishment component storage unit 4 is connected to the component supply cassette 3 by connecting the start end portion 15a of the taping component 15 of the replenishment component storage unit 4 to the component supply cassette 3 as shown in FIG. It has been adopted.
[0011]
By the way, in the automobile industry or the like where the quality of the circuit board 11 on which the electronic component 12 is mounted is very important, for example, the lot management of the electronic component 12 mounted on the circuit board 11, that is, the part is wound around the component storage unit 4. It is desired to manage the electronic component 12 with only one taping component 15 as a unit. Therefore, in the component mounting apparatus, the time when the electronic component 12 in the taping component 15 of the component storage unit 4 being used for the mounting operation is switched to the electronic component 12 of the supplemental taping component 15 is reliably and accurately grasped and managed. It is necessary to do.
[0012]
However, in the conventional method of supplying the electronic component 12, the worker removes the component supply cassette 3 out of the component from the component mounting apparatus and attaches a new component supply cassette 3 for replenishment. Since the part replacement information is input by pressing the part replacement switch after the replacement of 3, it is possible to accurately grasp and easily manage the point in time when the part mounting apparatus is switched to the supplemental taping part 15. However, there is a drawback that the operating rate of the component mounting apparatus is lowered.
[0013]
On the other hand, the component supply method shown in FIG. 13 has an advantage that the operating rate of the component mounting apparatus can be increased, but the operator is using the start end portion 15a of the taping component 15 of the component storage portion 4 for replenishment. There is a timing at which the electronic component 12 of the taping component 15 in use is actually switched to the electronic component 12 of the taping component 15 of the component storage unit 4 for replenishment. Because of the difference, there is a problem that the electronic component 12 mounted on the circuit board 11 cannot be managed in lots with the taping component 15 of one component storage unit 4 as a unit.
[0014]
Accordingly, the present invention has been made in view of the above-described conventional problems, and is a component that can accurately perform lot management of electronic components mounted on a circuit board without causing a reduction in the operation rate of component mounting. It is an object of the present invention to provide a component mounting apparatus in which the supply method and the component supply method are embodied and applied.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, according to the component supply method of the present invention, a plurality of component supply devices each having a component storage unit in which a plurality of electronic components are stored are arranged in the component supply unit. A component supply method for sequentially supplying required electronic components from each of the component storage units, wherein the component storage unit being used for component supply is a replenishment component storage unit in each of the component supply devices. When switching to the electronic component of the component storage unit in use, the component switching timing at the time of switching to be supplied from the electronic component of the component storage unit for replenishment is detected, and based on the component switching timing, From which component storage unit each electronic component mounted above was supplied Match Memory And each electronic component mounted on the circuit board for each unit of the component storage unit. It is characterized by management.
[0016]
In this component supply method, when the component storage unit installed in each of the plurality of component supply devices is replaced, the component switching timing at the time when the electronic component of the replaced component storage unit actually starts to be supplied is detected. Based on this component switching timing, it is determined from which component storage unit each electronic component mounted on the circuit board is supplied. Match Remember , Each electronic component mounted on the circuit board for each unit of the component storage unit Since management is performed, it is possible to accurately manage lots of electronic components mounted on a circuit board in units of each component storage unit for each component supply device.
[0018]
In the component supply method of the present invention, the component storage section is wound around a reel with taping components each storing electronic components in a number of component storage recesses arranged in a line along the longitudinal direction of the carrier tape. When the electronic component is replenished by connecting the end portion of the taping component of the component storage unit mounted on the component supply device and the starting end portion of the taping component of the component storage portion for replenishment, Connection between the two taping parts The remaining number of electronic components in the component storage unit in use at the time when the detection signal for detecting the connection portion is output is calculated, and an electronic component corresponding to the remaining number of electronic components is supplied. By detecting that Component switching timing can be detected. As a result, it is possible to replace only the component storage unit without removing the component supply device from the component supply unit of the component mounting device, and to continue the component supply while improving the operation rate of component mounting. Recognize the connection switching timing of the component switching timing at which the electronic components actually begin to be supplied Whether or not an electronic component corresponding to the remaining number of electronic components in the used component storage unit detected at the time of supply has been supplied Can be detected accurately.
[0020]
On the other hand, the component mounting apparatus of the present invention sucks and holds an electronic component from a required component storage portion among the component storage portions provided in each of the plurality of component supply devices arranged in the component supply portion by the suction nozzle. A component mounting apparatus for mounting the electronic component sucked and held by the suction nozzle to a required mounting position of the circuit board after being transported onto the circuit board, wherein the component storage unit in use for supplying the component is for replenishment A sensor unit that detects the switching to the component storage unit, and the electronic component is switched from the component storage unit in use to the electronic component of the component storage unit for replenishment based on a detection signal output from the sensor unit. From which component storage unit each electronic component mounted on the circuit board is supplied based on the component switching time determining means for determining the component switching timing at the time when the electronic component is mounted, and the determination signal of the component switching time determining means. Or it has been Match Memory And each electronic component mounted on the circuit board for each unit of the component storage unit. And a management means for managing.
[0021]
In this component mounting apparatus, the replacement of the component storage unit is detected by the sensor unit, and the component switching time determination unit determines the component switching timing based on the detection signal of the sensor unit, and on the circuit board based on the determination signal. From which component storage unit each electronic component mounted on Match Remember , Each electronic component mounted on the circuit board for each unit of the component storage unit While managing, electronic components can be mounted.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the component supply method of the present invention, as shown in FIG. 13, without removing the component supply cassette 3 from the component supply unit 2 of the component mounting apparatus, the component storage unit 4 in the component supply cassette 3 being used for component supply is used. The starting end portion 15a of the taping component 15 of the replenishing component storage portion 4 is connected to the terminal end portion 15b of the taping component 15, and the electronic component 12 is supplied without causing a reduction in the operation rate of component mounting. However, as shown in FIG. 3, in the component supply method of the present invention, the connection portion detection sensor portion in which the connection portion 25 between the terminal end portion 15b and the start end portion 15a is disposed at an appropriate position of the apparatus main body 1 of the component mounting apparatus. One of the features is that detection is performed by 33.
[0027]
FIG. 1 is a block diagram showing a component supply apparatus that embodies a component supply method according to an embodiment of the present invention. The component supply device is configured to detect the connection part 25 for detecting the connection part 25 between the terminal part 15b and the start part 15a of the taping part 15 and the electronic part 12 based on information from the sensor part 33. And a control unit 34 that performs lot management with one taping component 15 as a unit.
[0028]
The control unit 34 is connected to the connection unit detection unit 37 for determining the connection unit 25 of the taping component 15 based on the detection signal from the connection unit detection sensor unit 33, and is used for component supply by being mounted on the component supply cassette 3. The component remaining number calculating means 38 for calculating the number of electronic components 12 remaining in the taping component 15 of the component storage unit 4 and the suction nozzle 10 of the mounting head 9 descend to hold the electronic component 12 from the component supply port 20 by suction. Each time, the component suction detection means 39 that detects the operation, the remaining number of parts calculated by the component remaining number calculation means 38, and the detection information of the component suction detection means 39, the current electronic in the component storage unit 4 in use The remaining component number calculating means 40 for calculating the remaining number of components 12 and the electronic component 12 of the taping component 15 of the component storage unit 4 in use become zero and the electronic component of the taping component 15 for replenishment For each of the component supply cassettes 3, the component switching time discriminating means 41 for discriminating the time point of supply after switching to 12 and the component switching timing time at which the electronic component 12 of the replenishing taping component 15 is switched and supplied. And a component switching timing management means 42 for managing and storing the time information in a hard disk as a storage unit of the component mounting apparatus.
[0029]
Prior to the description of the control processing in the component supply device, a detection means by the connection portion detection sensor unit 33 of the connection portion 25 between the end portion 15b and the start end portion 15a of the taping component 15 will be described. As shown in the plan view of FIG. 4A and the side view of FIG. 4B, the end portion 15b of the taping component 15 in use and the start end portion 15a of the replenishing taping component 15 abut each other, and the abutment. The connection is made by pasting connection members 26 on both side surfaces of the portion.
[0030]
In this connection method, the connection member 26 is colored with a color different from that of the cover tape 17 of the taping component 15. In that case, the sensor part 33 for connection part detection is comprised using a color identification sensor, and detects the connection part 25 based on the identification of the color of the connection member 26. FIG. Further, as the connection member 26, a member having a light reflectance different from that of the cover tape 17 of the taping component 15 may be used. In this case, the connection portion detection sensor portion 33 is configured using a light projecting / receiving element. The connection portion 25 is detected by discriminating the difference in the amount of reflected light received. Furthermore, as the connection member 26, an aluminum foil or other metal tape may be used. In that case, the connection part detection sensor part 33 is configured by using a magnetic detection sensor, and is determined based on the detected magnetic quantity. The connection unit 25 is detected. The connecting portion 25 may be formed by attaching the connecting member 26 only on one side of the abutting portion between the end portion 15b of the taping component 15 in use and the starting end portion 15a of the supplemental taping component 15, In this case, the connection member 26 needs to be provided on the side where the connection portion detection sensor unit 33 is disposed.
[0031]
On the other hand, as other connecting means, as shown in the plan view of FIG. 5A and the side view of FIG. 5B, the end portion 15b of the taping component 15 in use and the start end portion 15a of the taping component 15 for replenishment are used. Notches 35 and 36 are provided on at least one side of each, and the connection member 26 is provided with a triangular notch 26a including both the notches 35 and 36. In this case, the connection portion detection sensor unit 33 is configured using a sensor that can recognize the difference in shape. For example, the sensor part 33 for connection part detection detects the connection part 25 when light injects into a light receiving element as a structure which provides a light projecting element and a light receiving element in the mutually opposing arrangement | positioning. Or the sensor part 33 for connection part detection is comprised by a light projection / reception element, and detects the connection part 25 by the presence or absence of light reflection. In this case, the connecting member 26 may be formed of any material.
[0032]
Next, control processing in the component supply apparatus will be described based on the flowchart of FIG. In the component mounting apparatus, as described with reference to FIGS. 9 to 12, the electronic components 12 sequentially transferred to the component supply port 20 in the component supply cassette 3 are sucked and held by the lowering suction nozzle 10, and the circuit board is mounted. 11 is carried and mounted (step S1). At this time, in the component mounting apparatus, in the process of transporting the electronic component 12 sucked and held by the suction nozzle 10 to the circuit board 11, the suction posture and type of the electronic component 12 being sucked are identified (step S2), and the electronic component 12 position correction is performed. Further, the connection part detection means 37 in the control unit 34 of the component supply apparatus is based on the input signal from the connection part detection sensor part 33 so that the supplemental taping part 15 is connected to the taping part 15 in use and the part is supplemented. It is continuously monitored whether or not it has been done (step S3).
[0033]
Then, when the remaining number of electronic components 12 of any taping component 15 in the component supply cassette 3 being used for component supply decreases, the operator uses the taping component in use according to the procedure described in FIG. The 15 end portions 15b and the start end portion 15a of the supplemental taping component 15 are connected by the connecting means shown in FIG. 4 or FIG. Thereby, in the component mounting apparatus, the supply of the electronic component 12 is continued without removing the component supply cassette 3. When the connection part 25 of the two taping components 15 is detected by the connection part detection sensor part 33, the connection part detection means 37 of the control part 34 is based on the detection signal input from the connection part detection sensor part 33. It is determined that the connecting portion 25 has reached a predetermined position (step S3), and a determination signal is output to the remaining component number calculating means 38.
[0034]
When the component remaining number calculating means 38 receives the determination signal from the connecting portion detecting means 37, the type and connection of the electronic component 12 stored in the taping component 15 of the component storing section 4 of the component supply cassette 3 determined. Based on the interval between the part detection sensor unit 33 and the component supply port 20, the remaining number of electronic components 12 in the taping component 15 currently in use is calculated (step S4). Next, the calculation of the remaining number will be described with reference to FIG.
[0035]
In FIG. 6, the suction nozzle 10 is positioned and stopped at a position directly above the component supply port 20 in the component supply cassette 3 mounted on the component supply unit 2 of the component mounting apparatus. The distance L is set at a predetermined distance L from the component supply port 20, and the distance L is stored and registered in advance in a memory built in the component remaining number calculation means 38. Further, in the memory built in the component remaining number calculating means 38, the type of each component supply cassette 3 mounted at each mounting location of the component supply unit 2, that is, the taping component 15 accommodated in this component supply cassette 3 is stored. Is also stored and registered in advance.
[0036]
Therefore, the component remaining number calculating means 38 first obtains the arrangement pitch P of each component storage recess 14 of the taping component 15 that is uniquely determined from the type of the taping component 15 mounted in the component supply cassette 3, and calculates L / By calculating P, the remaining number of electronic components 12 in the taping component 15 in use is calculated. Here, since the remaining number of the electronic components 12 is an integer, the numerical value after the decimal point in the calculation result by the above calculation is ignored, and the integer is set as the remaining number. The calculated remaining number information is output to the remaining component number calculating means 40 of the control unit 34.
[0037]
Returning to FIG. 2, the component remaining number calculation means 40 primarily stores the information on the remaining number input from the component remaining number calculation means 38 in its own built-in memory, and then the suction nozzle 10 causes the electronic component 12 to be stored. It is monitored whether the component suction detection means 39 detects that the suction has been held and outputs a detection signal (step S5). The component remaining number calculation means 40 calculates “1” from the remaining number stored in the memory every time it is determined that the suction nozzle 10 picks up and holds the electronic component 12 based on the signal from the component suction detection means 39. Subtraction is performed to newly calculate the remaining number at the present time (step S6), and the information on the calculated remaining number is updated and stored in the memory and output to the component switching point determination unit 41. The part switching time determination means 41 determines whether or not the input remaining number is “0” (step S7). If it is not “0”, the process returns to step S5, and the same control process as described above is repeated until the component switching point determination means 41 determines that it is “0”.
[0038]
When the component switching time determination means 41 determines that the remaining number is “0” based on the input information from the component remaining number calculation means 40, the taping component in use by the electronic component 12 supplied to the component supply port 20 is used. Information indicating that the taping component 15 has been switched from 15 to 15 is output to the component switching timing management means 42. Thereby, the component switching timing management means 42 has a built-in timer circuit with the time when the electronic component 12 supplied to the component supply port 20 is switched from the taping component 15 in use to the supplemental taping component 15. The time information and the number preset for each component supply cassette 3 are stored in the hard disk of the component mounting apparatus (step S8), and then it is determined that the operation of component mounting is completed (step S9). ), The process returns to step S1 and repeats the same control process as described above.
[0039]
Therefore, in the hard disk of the component mounting apparatus, as shown in FIG. 7, each component supply cassette 3 is switched to the electronic component 12 of the taping component 15 for replenishment in the component supply cassette 3, and the electronic is supplied to the component supply port 20. Date and time information at the time when the supply of the component 12 is started is sequentially stored under the management of the component switching timing management means 42. Further, the component switching timing management means 42 indicates which component supply cassette 3 has been mounted on the produced component mounting circuit board based on the information stored in the hard disk. Lot management is performed with one taping component 15 mounted on 3 as a unit. As a result, in the component mounting apparatus equipped with the component supply apparatus, the electronic component mounted on the produced component mounting circuit board while improving the operation rate of the mounting operation of the electronic component 12 on the circuit component 11 is achieved. Lot management can be performed accurately.
[0040]
In the above-described embodiment, the case where the connection portion detection sensor unit 33 is disposed at a position separated by a predetermined distance L from the component supply port 20 is described. However, the connection unit 25 is provided at the component supply port 20. When the connection part detection sensor unit 33 can be disposed at a position where detection is possible, the point in time when the connection part detection sensor unit 33 detects the connection part 25 is switched to the electronic component 12 of the taping component 15 for replenishment. Therefore, the remaining component number calculating unit 38 and the remaining component number calculating unit 40 in FIG. 1 are not necessary, and the control process can be simplified.
[0041]
【The invention's effect】
As described above, according to the component supply method of the present invention, when the component storage unit installed in each of the plurality of component supply devices is replaced, the electronic component in the replaced component storage unit is actually supplied. The component switching timing at the start time is detected, and based on this component switching timing, from which component storage unit each electronic component mounted on the circuit board is supplied Match Remember , Each electronic component mounted on the circuit board for each unit of the component storage unit Therefore, it is possible to accurately manage lots of electronic components mounted on the circuit board in units of each component storage unit for each component supply device.
[0042]
Further, according to the component mounting apparatus of the present invention, the replacement of the component storage unit is detected by the sensor unit, the component switching time determination unit determines the component switching timing based on the detection signal of the sensor unit, and the determination signal From which component storage unit each electronic component mounted on the circuit board is supplied Match Remember , Each electronic component mounted on the circuit board for each unit of the component storage unit While managing, electronic components can be mounted.
[Brief description of the drawings]
FIG. 1 is a block diagram showing a component supply apparatus that embodies a component supply method according to an embodiment of the present invention.
FIG. 2 is a flowchart showing a control process of the component supply apparatus of the above.
FIG. 3 is a schematic side view of a component mounting apparatus on which the component supply apparatus is mounted.
FIGS. 4A and 4B are a plan view and a side view showing a connecting means for two taping components in the embodiment.
FIGS. 5A and 5B are a plan view and a side view showing another connection means of two taping components in the embodiment.
FIG. 6 is an explanatory diagram of a process of calculating the remaining number of electronic components in the embodiment.
FIG. 7 is an explanatory diagram of electronic component switching timing information obtained in the embodiment.
FIG. 8 is a perspective view showing a schematic configuration of a component mounting apparatus that can mount an electronic component by applying the component supply apparatus according to the embodiment.
FIGS. 9A and 9B are a plan view and a cut side view of a taping component used in the embodiment described above. FIGS.
FIG. 10 is a perspective view of a component supply cassette used in the embodiment.
FIG. 11 is an enlarged perspective view of a part of the component supply cassette.
FIG. 12 is a perspective view of a part of the component supply cassette.
FIGS. 13A to 13C are side views showing a process of switching electronic components in a conventional component supply method in the order of steps.
[Explanation of symbols]
2 Parts supply section
4 Parts storage
3 Component supply cassette (component supply device)
10 Suction nozzle
11 Circuit board
12 Electronic parts
13 Carrier tape
14 Parts storage recess
15 Taping parts
15a Start end
15b Termination
25 connections
33 Sensor part for detecting a connection part (sensor part)
38 Parts remaining number calculation means
39 Component adsorption detection means
40 Parts remaining number calculation means
41 Component switching point discrimination means
42 Parts switching timing management means

Claims

A plurality of component supply devices each having a component storage unit in which a plurality of electronic components are stored are arranged in the component supply unit and sequentially supply required electronic components from among the component storage units of each of the component supply devices. A method for supplying parts,
In each of the component supply devices, when the component storage unit being used for component supply is switched to the replenishment component storage unit, the electronic component of the component storage unit being used is changed to the replenishment component storage unit. Detect the component switching timing at the time of switching to electronic components and supply
Each component mounted on the circuit board is stored in association with which component storage unit each electronic component mounted on the circuit board is supplied based on the component switching timing. A part supply method characterized by lot management of parts.

Taping parts, each of which stores electronic parts in a large number of parts storage recesses arranged in a line along the longitudinal direction of the carrier tape, are wound around a reel.
When replenishing the electronic component by connecting the terminal portion of the taping component of the component storage unit mounted on the component supply device and the starting end portion of the taping component of the component storage unit for replenishment,
Detecting a connection between the two taping components;
Calculate the remaining number of electronic components in the component storage unit in use at the time when the detection signal that detected the connection is output,
The component supply method according to claim 1, wherein a component switching timing is detected by detecting that an electronic component corresponding to the remaining number of electronic components is supplied.

The electronic component is sucked and held by a suction nozzle from a required component storage portion of the component storage portions provided in each of the plurality of component supply devices arranged in the component supply portion, and then transported to the circuit board. A component mounting apparatus for mounting the electronic component sucked and held by a nozzle at a required mounting position of the circuit board,
A sensor unit for detecting that the component storage unit being used for component supply has been switched to a replenishment component storage unit;
A component switching time discriminating means for discriminating a component switching timing at the time when the electronic component is supplied by switching from the component housing portion in use to the electronic component in the replenishing component housing portion based on a detection signal output from the sensor unit When,
Based on the determination signal of the component switching time determining means, the electronic component mounted on the circuit board is stored in association with which component storage unit is supplied, and the unit of each component storage unit is stored on the circuit board. A component mounting apparatus comprising: management means for managing lots of each electronic component mounted on the device.