JP4084276B2 - Gas leak alarm and flow method during manufacture - Google Patents

Description

The present invention relates to a fluidized process in the manufacture of a gas leak alarms Utsuwa及 patron driven by the commercial power supply.

There are many types of gas leak alarms that are driven by a commercial power source. Since this type of gas leak alarm has a power cord portion to which a plug is attached, there are various problems associated with this. This problem will be described below with reference to the drawings. 6 and 7 are diagrams showing a basic configuration of this type of conventional gas leak alarm. 6 and 7 correspond to the cross-sectional shape of the gas leak alarm.

  The outer shape of the gas leak alarm 8 shown in FIG. 6 has a box shape, and is basically composed of a main body case 811 side and a power cord portion 12 side. Various electronic components such as the gas sensor S and the microcomputer M are mounted on the mounting surface (the lower surface in the drawing) of the substrate 814 accommodated in the main body case 811. The terminals of each electronic component pass through the substrate 814 and are soldered 815 on the pattern surface (upper surface in the drawing) of the substrate 814 on which solder lands and wiring patterns are printed. On this pattern surface, a conductive wire 121a of a power cord 121 for supplying power to various electronic components is soldered 815.

  The power cord 121 is lead-through from the mounting surface of the substrate 814 to the pattern surface and soldered as described above, and is fixed to the bush fixing wall 812 on the main body case 811 side via the bush 123 and led out to the outside. Has been. One end of the plug 122 is electrically connected to a commercial power source. Such a portion related to the power cord 121 is referred to as a power cord portion 12.

  As is well known, electronic devices such as a gas leak alarm are manufactured and shipped through an inspection process and an adjustment process. This inspection process and adjustment process must be performed as close to the shipped product as possible. That is, it is necessary to perform inspection and adjustment in a state where a substrate 814 on which electronic components are mounted as shown in FIG. In particular, in a gas leak alarm device, in order to give an alarm accurately during operation, it is necessary to inspect and adjust the gas concentration in a state where the sensor S is accommodated in the main body case 811.

  For this reason, at the time of manufacture, the alarm device flows in other processes including an inspection process and an adjustment process with the power cord portion 12 as shown in FIG. 6 attached, and workability is not preferable. It was. Therefore, as shown in FIG. 7, a gas leak alarm 9 in which the power cord unit 12 can be attached at the final stage has been proposed.

  The outer shape of the gas leak alarm 9 shown in FIG. 7 is also box-shaped, and is basically composed of a main body case 911 side and a power cord portion 12 side. As in the conventional example of FIG. 6, various electronic components such as the gas sensor S and the microcomputer M are mounted on the mounting surface of the substrate 914 accommodated in the main body case 911, and their terminals penetrate the substrate 914 and are soldered. Solder 915 is applied on the pattern surface on which lands and wiring patterns are printed. On the pattern surface, the terminals 912a of the female power connector 912 are also soldered 915.

  A male power connector 124 that can be fitted to the female power connector 912 is attached to the power cord 121 so that the power cord portion 12 can be flowed until the final stage.

  However, the conventional example of FIG. 7 causes an increase in the number of parts, a complicated configuration, an increase in the size of the housing, and a high cost associated therewith. That is, as apparent from the comparison of the conventional example of FIG. 7 with the conventional example of FIG. 6, it can be seen that the housing is increased in size and complicated by the added connectors 912 and 124.

Therefore, in view of the present situation described above, the present invention can easily attach the power cord portion at the final stage without using additional components such as connectors, and can greatly improve the workability at the time of manufacture. It is an object to provide a gas leak alarm and a flow method thereof.

The gas leak alarm device according to claim 1, wherein the gas leak alarm device is driven by a commercial power source, and various electronic parts such as a gas sensor and a microcomputer are mounted on a mounting surface. Solder lands and wiring patterns to which the terminals of the electronic component are soldered are printed, and a plug connected to an outlet to which commercial power is supplied is provided at one end and a power cord for supplying power to the electronic component A substrate on which a solder land for a power cord to which an end conductor is to be soldered is formed; a main body case that exposes and holds the substrate with the pattern surface side exposed; A cover integrated with the main body case so as to cover, and soldering the power cord conductor to the power cord solder land on the substrate At the same time, positioning means functioning at least for positioning the conductor is provided, and various electronic components such as the gas sensor and the microcomputer before the conductor of the power cord is soldered to the power cord solder land are mounted. In the inspection process and adjustment process in which the substrate is held and accommodated in the main body case and the cover is not integrated with the main body case, the power supply pin is mounted on the inspection tray. A power supply land for contacting and temporarily supplying a 100-volt test power supply to the electronic component is formed .

According to the first aspect of the present invention, the portion of the main body case on which the solder lands of the conductors of the power cord are formed is exposed. The substrate is provided with positioning means that functions to position the conductor when the conductor is soldered to the solder land. The cover is configured to be integrated with the main body case so as to cover an upper portion of the exposed portion of the substrate. Thus, until the cover is attached, the portion of the main body case where the solder lands of the conductors are formed is exposed, and the substrate is provided with positioning means that function for positioning the conductors. In the final stage of manufacturing the gas leak alarm, only the power cord can be easily attached by soldering.

In addition, detection density adjustment and inspection work essential for gas leak alarms are performed by temporarily supplying test power from the power supply land to the electronic components while mounting components such as sensors on the body case. In addition, the power cord for supplying commercial power in the final stage can be easily attached by soldering.

Flow process at the time of manufacturing of 2 Symbol placement of the gas leak alarm claim has been made to solve the above-mentioned problems is a flow process at the time of manufacture of the gas leak alarm device according to claim 1 Symbol placement, the cord A first assembling step for performing a series of assembling operations relating to the gas leak alarm , leaving the operation for attaching the cover to the main body case and the operation for attaching the cover to the main body case, and after completion of the first assembling step, The power supply land is brought into contact with the power supply pin, and a test power of 100 volts is temporarily supplied from the power supply land to the electronic component to check and adjust the gas concentration related to the gas leak alarm. An inspection adjustment step to be performed; and subsequent to the inspection adjustment step, the power cord is soldered to the solder land using the positioning means. A second assembling step of attaching the serial body case, subsequent to the second assembly step, characterized in that it comprises a third assembly step of attaching the cover to the main case.

According to the invention of claim 2 Symbol placement, in the inspection adjustment step, after the end of the first assembly step, the inspection of the gas concentration for the gas leak alarm by the test power from the power supply land temporarily supplied to the electronic component In the second assembly step following the inspection and adjustment step, the power cord is attached to the main body case by soldering the conductive wire to the solder land using the positioning means, and in the third assembly step following this, the cover is covered. Is attached to the main unit case. Accordingly, it is possible to flow the product in a cordless state in the inspection adjustment process or the like while maintaining the attachment of the power cord by soldering.

According to the first aspect of the present invention, until the cover is attached, the portion of the main body case where the solder lands of the conductive wires are formed is exposed, and the positioning means that functions as a conductive wire for positioning on the substrate. Therefore, only the power cord can be easily attached by soldering at the final stage of manufacturing the gas leak alarm . That is, the product can be flowed in a cordless state until the final stage, and the power cord can be attached by soldering in the final stage. Therefore, it is possible to flow the product in a cordless state while maintaining the installation of the power cord by soldering, so that the gas leak alarm is not enlarged and complicated, and the workability at the time of production is greatly increased. Can be improved.

In addition, detection density adjustment and inspection work essential for gas leak alarms can be performed accurately by temporarily supplying test power from the power supply land to the electronic components while mounting components such as sensors on the body case. In addition, the power cord for supplying commercial power can be easily attached by soldering in the final stage. Thus, at the gas leakage alarm driven by a commercial power source, it is possible to accurately detect the density adjustment and inspection, it is possible to improve the workability at the time of manufacture.

According to the invention of claim 2 Symbol placement, in the inspection adjustment step, after the end of the first assembly step, the inspection of the gas concentration for the gas leak alarm by the test power from the power supply land temporarily supplied to the electronic component In the second assembly step following the inspection and adjustment step, the power cord is attached to the main body case by soldering the conductive wire to the solder land using the positioning means, and in the third assembly step following this, the cover is covered. Is attached to the main unit case. Therefore, while maintaining the installation of the power cord by soldering, it is possible to flow the product in a cordless state in the inspection adjustment process, etc., so that the gas leak alarm is not enlarged and complicated, and at the time of manufacture Workability can be greatly improved.

[First embodiment]
1 and 2 relate to a first embodiment of the present invention. FIG. 1 (A) is a perspective view showing a state of a gas leak alarm before the power cord is attached, and FIG. It is a front view which shows the solder land vicinity of FIG. 1 (A). FIG. 2A is a perspective view showing a state of the gas leak alarm after the power cord portion is attached, and FIG. 2B is a front view showing the vicinity of the solder land in FIG.

As shown in FIG. 1 (A), the outer shape of the gas leak alarm 1 is box-shaped, and basically includes a main body case 111 side and a power cord portion 12 side. A bush fixing wall 112 provided with a bush fixing portion 112 a having a shape corresponding to the bush 123 attached to the power cord portion 12 is erected inside the main body case 111. Also, as shown in the figure, a plurality of locking claws 113 are formed integrally on the inner wall of the main body case 111 so that the pattern surface side is exposed and the substrate 114 is held and accommodated in the main body case 111 and fixed to a predetermined portion. Has been.

Various electronic components such as a gas sensor and a microcomputer (not shown) are mounted on the mounting surface (lower surface in the drawing) of the substrate 114. The terminals of each electronic component penetrate through the substrate 114 and are soldered on the pattern surface (upper surface in the drawing) of the substrate 114 on which solder lands and wiring patterns are printed. On this pattern surface, a power cord solder land (hereinafter abbreviated as a solder land) 114d and the like to which the conductor 121a of the power cord 121 of the power cord section for supplying power to various electronic components is soldered are formed. Has been. On the pattern surface, a power supply land 114e for temporarily supplying a test power is formed in an inspection process and an adjustment process before the power cord portion 12 is attached.

  On the substrate 114 in the vicinity of the solder land 114d, as shown in FIG. 1B, a rectangular cutout 114a, a conductive hole 114c formed in the center of the solder land 114d, and a conductive hole 114c and a conductor passage slit 114b formed between one side of the notch 114a (corresponding to the edge of the substrate of claim 2). Supplementally, the circular conductive wire hole 114c is slightly larger than the outer diameter of the conductive wire 121a, and the solder land 114d is formed in an annular shape around the conductive wire hole 114c. However, both the conductor hole 114c and the solder land 114d are cut into a slit shape where the conductor passage slit 114b is formed. The conducting wire passage slit 114b is narrower than the diameter of the conducting wire hole 114c, but is set to a width that allows the conducting wire 121a to pass therethrough. In addition, the conducting wire passage slit 114b and the conducting wire hole 114c correspond to the positioning means in the claims.

  The solder lands 114d are advantageously formed in an annular shape during soldering, but may have other shapes. Further, the notch 114a is advantageous in improving space efficiency or when the power cord portion 12 is attached, but is not necessarily required and is not necessarily rectangular. Although not shown, a cover having substantially the same shape as the opening surface is covered on the opening surface of the main body case 111. Needless to say, as shown in FIG. 1A, this cover is integrated with the main body case 111 so as to cover the exposed portion near the solder land 114d, and at the same time, the bush fixing wall 112 is integrated. The bush 123 fitted to is clamped from above.

  The power cord 12 includes a power cord 121, a plug 122, and a bush 123. Plug 122 is connected to an outlet to which commercial power is supplied. A bush 123 attached in the middle of the power cord 121 is for fixing the power cord portion 12 to the main body case 111 side. As is well known, the power cord 121 is composed of a conductive wire 121a and an insulating covering portion covering the conductive wire 121a. One end of the power cord 121 on the side where the plug 122 is not attached is in a state where the conducting wire 121a is exposed for soldering to the solder land 114d.

  When the inspection and adjustment are finished and the final stage is entered and the power cord portion 12 is attached to the main body case 111 side, the lead wire 121a at the tip of the power cord 121 is moved in the direction of the arrow in FIG. The conductor 123a is guided to the conductor hole 114c through the conductor passage slit 114b, and at the same time, the bush 123 is fitted to the bush fixing portion 112a. In order to facilitate this work, the power cord 121 is bent so that both the conductors 121a face upward, the width of both the conductors 121a is adjusted to the width of both the conductor holes 114c, and the bush 123 is fixed to the bush fixing wall. It is preferable to attach in advance to a predetermined position based on the distance from 112 to the conductor hole 114c.

  After conducting the conductive wire 121a to the conductive wire hole 114c, the conductive wire 121a is slightly bent along the solder land 114d. Then, as shown in FIGS. 2A and 2B, the bent conducting wire 121a is soldered 115 to the solder land 114d. Finally, a cover (not shown) is placed on the opening surface of the main body case 111.

[Second Embodiment]
3 and 4 relate to the second embodiment of the present invention. FIG. 3A is a cross-sectional view showing the state of the gas leak alarm before the power cord is attached, and FIG. FIG. 4 is a perspective view showing the vicinity of a solder land in FIG. FIG. 4A is a cross-sectional view showing the state of the gas leak alarm after the power cord portion is attached, and FIG. 4B is a perspective view showing the vicinity of the solder land in FIG. 4A.

  The outer shape of the gas leak alarm 2 shown in FIG. 3A is box-shaped, and is basically composed of a main body case 211 side and a power cord portion 12 side. Various electronic components such as the gas sensor S and the microcomputer M are mounted on the mounting surface (the lower surface in the drawing) of the substrate 214 attached to the main body case 211. The terminals of each electronic component penetrate through the substrate 214 and are soldered 215 on the pattern surface (upper surface in the drawing) of the substrate 214 on which the wiring pattern is printed. In addition, the lead 121a of the power cord 121 for supplying power to various electronic components is soldered to the solder land 214d formed on the pattern surface side. Although not shown, a power supply land for temporarily supplying a test power supply is also formed on the pattern surface in a test process and an adjustment process before the power cord unit 12 is attached.

  On the substrate 214 in the vicinity of the solder land 214d, as shown in FIG. 3B, a fixing bracket 214a of a type for crimping and crimping the covering portion of the power cord 121 is attached. Specifically, the fixing bracket 214a is attached to a substantially intermediate portion between the edge of the substrate 214 and the solder land 214d. The fixing fitting 214a is, for example, subjected to copper base solder plating, and a plurality of barrels 214a and 214b for crimping and crimping the power cord are erected. The distance between the barrels 214a and 214b is preferably selected to be slightly wider than the diameter of the wire to be crimped. The solder land 214d is formed in a square shape here, but may have other shapes. The fixing bracket 214a also has a function of fixing the power cord, but also has a function of accurately positioning the power cord in the initial stage of attachment, and corresponds to the positioning means in the claims.

  The power cord 12 is the same as that of the first embodiment shown in FIG. One end of the power cord 121 on the side where the plug 122 is not attached is also in a state where the conductive wire 121a is exposed for soldering to the solder land 214d. The lower case 216 is attached to the main body case 211 before the power cord portion 12 is attached to the main body case 211 side. In this state, inspection and adjustment are performed. This is because the inspection and adjustment are preferably performed as close to the shipped product as possible. However, the portion for attaching the power cord portion 12 is still exposed without attaching the cover 217.

  When the inspection and adjustment are completed and the final stage is entered and the power cord portion 12 is attached to the main body case 211 side, the tip of the power cord 121 is moved in the direction of the arrow in FIG. The barrels 214a and 214b are used as positioning means, that is, the conductor 121a is made to run along the solder lands 214d while the covering portion of the power cord 121 is passed between the barrels 214a and 214b. At the same time, the bush 123 is fitted into the bush fixing portion 212a. In order to facilitate this work, the widths of both the conductors 121a are matched to the widths of both the solder lands 214d, and the bush 123 is previously attached at a predetermined position based on the distance from the bush fixing wall 212 to the solder land 214d. It is preferable.

  After the conductor 121a is placed along the predetermined solder land 214d, the power cord is crimped and crimped by the barrels 214a and 214b as shown in FIG. 4B. Then, the lead wire 121a is soldered 215 to the solder land 214d. Finally, the cover 217 is covered with the main body case 211.

[Third embodiment]
Next, a flow method at the time of manufacturing the gas leak alarms 1 and 2 having the above-described configuration will be described. FIG. 5 is a flowchart illustrating a flow method in manufacturing a gas leak alarm according to the third embodiment of the present invention. In the first assembly step of step S1, the gas leak alarm is assembled up to the state of cordless and coverless products. That is, as shown in FIG. 1 and FIG. 3 described above, a series of assembling operations relating to the gas leak alarm are performed with the work of attaching the power cord portion and the governor to the main body case. In this state, the gas leak alarm is in a state of operating in the same manner as a shipped product as long as power is supplied.

  Subsequently, the process proceeds to an inspection process in step S2 and an adjustment process in step S3. In these processes, a 100-volt test power supply is temporarily supplied to the power supply land, and a test relating to a gas leak alarm, a gas concentration adjustment, and the like are performed. At this time, for example, a gas leak alarm in a state as shown in FIG. 1 is mounted on an inspection tray to which a test power of 100 volts is supplied so that the pattern surface side faces downward. The power supply pin comes into contact with. At this time, since the power cord portion is not yet attached, it is very easy to perform work related to inspection and adjustment. In addition, since the product is in the same state as the shipped product except that the cover is not attached, it is possible to perform an accurate density inspection and adjustment assuming the shipped product. Steps S2 and S3 correspond to the inspection adjustment process in the claims.

  Subsequently, the process proceeds to the second assembly process in step S4. In this step, as described above, the power cord portion 12 is attached to the board mounted on the main body case by soldering. That is, in the configuration of the first embodiment, the conductor is led to the conductor hole through the conductor passage slit and soldered, and in the configuration of the second embodiment, the power cord is crimped and crimped by the barrel and soldered. Attached. At this time, since the pattern surface of the substrate (the side opposite to the mounting surface) is exposed, soldering is very easy. Supplementally, electronic components including the power cord portion are usually mounted from the mounting surface side so that their conductors and terminals penetrate through the substrate, and then soldered on the pattern surface side. In order to retrofit the power cord portion to be soldered, it is necessary to expose both the mounting surface and the pattern surface of the substrate. However, only the pattern surface side needs to be exposed by the positioning means as shown in FIGS. As a result, the power cord portion can be easily attached and the inspection and adjustment can be performed in a state closer to the shipped product.

  And it transfers to the 3rd assembly process of step S5, and a cover is attached to a main body case. Specifically, before covering the cover, the lower side of the bush 123 attached to the power cord is fitted into the bush fixing portion on the main body case side. Then, the cover is attached so that the upper side of the bush 123 is sandwiched between the cover and the bush fixing portion. Thereby, a series of assembly operations of the desired gas leak alarm are completed.

[Modification]
In the first embodiment and the second embodiment, the cover may be either a one-piece type or a two-piece type. However, it is preferable from the viewpoint of accuracy of inspection and adjustment that the cover is made as small as possible while leaving an exposed portion for attaching the power cord portion. Instead of soldering the conducting wire, a round crimp terminal may be attached to the conducting wire and screwed to the substrate in the second assembly step. Alternatively, a U-shaped clip pin may be attached to the conductor and soldered to the substrate side in the second assembly step, or a male pin (female pin) may be attached to the conductor. You may make it insert in the female type pin (male type pin) attached to the board | substrate side at the 2nd assembly process .

Thus, according to this embodiment, as shown in the conventional example of FIG. 7, the power cord can be easily attached to the main body case side at the final stage without using additional components such as connectors. Become. Therefore, workability at the time of manufacturing the gas leak alarm can be greatly improved .

FIG. 1A is a perspective view showing a state of the gas leak alarm before the power cord portion is attached, and FIG. 1B is a front view showing the vicinity of the solder land in FIG. FIG. 2A is a perspective view showing a state of the gas leak alarm after the power cord portion is attached, and FIG. 2B is a front view showing the vicinity of the solder land in FIG. FIG. 3A is a cross-sectional view showing the state of the gas leak alarm before the power cord is attached, and FIG. 3B is a perspective view showing the vicinity of the solder land in FIG. FIG. 4A is a cross-sectional view showing the state of the gas leak alarm after the power cord portion is attached, and FIG. 4B is a perspective view showing the vicinity of the solder land in FIG. 4A. It is a flowchart which illustrates the flow method at the time of manufacture of a gas leak alarm. It is a figure which shows the structure of this kind of conventional gas leak alarm device. It is a figure which shows the structure of the other conventional gas leak alarm of this kind.

Explanation of symbols

1, 2 Gas leak alarm (electronic equipment)
11, 21 Body portion 12 Power cord portion 111, 211 Body case 112, 212 Bush fixing wall 113, 213 Locking claw 114, 214 Substrate 115, 215 Solder 214a Fixing bracket 114d, 214d Solder land 121 Cord 122 Plug 123 Bush

Claims (2)

In a gas leak alarm driven by commercial power,
Various electronic components such as gas sensors and microcomputers are mounted on the mounting surface, and solder lands and wiring patterns are printed on the pattern surface to which the terminals of the electronic components are soldered, and connected to an outlet to which commercial power is supplied A board on which a power cord solder land for soldering a lead wire at the other end of the power cord for supplying power to the electronic component having a plug at one end is formed;
A main body case that holds and accommodates the substrate by exposing the pattern surface side ;
A cover integrated with the main body case so as to cover the upper part of the substrate held and accommodated in the main body case ,
On the substrate, the positioning means serves at least for the positioning of the conductors is provided when soldering the lead of the power cord to the solder lands for the cord, for the conductor the power cord of the cord Inspection and adjustment of gas concentration in a state where the substrate on which various electronic parts such as the gas sensor and microcomputer are mounted before being soldered to the solder land is held in the main body case and the cover is not integrated with the main body case. In the inspection process and adjustment process, the power supply pins are contacted to form a power supply land for temporarily supplying a 100-volt test power to the electronic component when mounted on the inspection tray. A gas leak alarm characterized by that . A flow process in the manufacture of gas leak alarm device according to claim 1 Symbol placement,
A first assembling step for performing a series of assembling operations relating to the gas leakage alarm device , leaving an operation of attaching the power cord to the main body case and an operation of attaching the cover to the main body case;
After the first assembly step is completed, by contacting the power supply land is mounted on the inspection tray power supply pin, the gas 100 volts the test power is temporarily supplied to the electronic component from the power supply land An inspection adjustment process for inspecting and adjusting the gas concentration of the leak alarm ; and
Subsequent to the inspection adjustment step, a second assembly step of attaching the power cord to the main body case by soldering the conductive wire to the solder land using the positioning means;
Subsequent to the second assembly step, a third assembly step of attaching the cover to the body case;
A flow method at the time of manufacture of a gas leak alarm device , comprising:

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