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JP4097231B2 - socket - Google Patents
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JP4097231B2 - socket - Google Patents

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JP4097231B2
JP4097231B2 JP2004264824A JP2004264824A JP4097231B2 JP 4097231 B2 JP4097231 B2 JP 4097231B2 JP 2004264824 A JP2004264824 A JP 2004264824A JP 2004264824 A JP2004264824 A JP 2004264824A JP 4097231 B2 JP4097231 B2 JP 4097231B2
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plug
board
socket
contact
fitting
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JP2006080014A (en
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薫 神田
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SMK Corp
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Description

本発明は、例えば照明用LED等のモジュール基板を接続するソケットに関する。   The present invention relates to a socket for connecting a module substrate such as an LED for illumination.

近年、発光ダイオード(LED:Light Emitting Diode)の高密度配置に関する技術開発が進んでいて照明用LEDモジュール基板の実用化が図られつつある。
そのような高密度基板を接続するためのソケットの例を図5に示す。
図5(イ)は、複数の発光ダイオードを面状に配置した高密度基板実装の照明用LEDモジュール基板101及びソケット110を示す。
図5(ロ)は基板101を嵌合し、配線用ワイヤ150を接続した状態を示し、F−F線断面図を図5(ハ)に示す。
図5(ハ)に示すように、ソケット110と基板101の接続部101aとはコンタクト140がバネ力により押圧接続して導通し、コンタクト端子部142に対しては接続する配線用ワイヤー150を半田付けで接続していた。
しかし、コンタクト140の端子部142の強度は比較的弱く、しかも多数の端子部142を挟ピッチで高密度に並設しているため、半田付け作業時に誤って端子部142を変形させてしまったり、隣接するコンタクト端子とブリッジ接続してしまい端子間ショートさせてしまう恐れが高く、半田付けの作業性及び品質に問題があった。
特開2004−192877号公報には、半田付けをすることなくLEDとプリント基板とを接続する技術が開示されている。
しかし、端子を一対しか備えていないLEDを直接筐体状のインシュレータに嵌め込み、コンタクトを介してプリント基板に導通させる構造であって、照明用LED等のモジュール基板をソケットに嵌合することで、基板に多数設けている接続部と配線用ワイヤとを、挟ピッチで接続する構造とは異なっており、基板の接続用としては不十分であった。
In recent years, technological development relating to high-density arrangement of light emitting diodes (LEDs) has progressed, and the LED module substrate for illumination is being put to practical use.
An example of a socket for connecting such a high-density substrate is shown in FIG.
FIG. 5A shows a lighting LED module substrate 101 and a socket 110 mounted on a high-density board in which a plurality of light emitting diodes are arranged in a planar shape.
FIG. 5B shows a state in which the substrate 101 is fitted and the wiring wire 150 is connected, and a cross-sectional view taken along line FF is shown in FIG.
As shown in FIG. 5 (c), the contact 140 is pressed and connected to the connection part 101 a of the socket 110 and the substrate 101 by a spring force, and the wiring wire 150 to be connected to the contact terminal part 142 is soldered. It was connected with the date.
However, the strength of the terminal portion 142 of the contact 140 is relatively weak, and a large number of the terminal portions 142 are arranged at a high density at a narrow pitch, so that the terminal portion 142 may be deformed by mistake during the soldering operation. There is a high risk of shorting between terminals due to bridge connection with adjacent contact terminals, and there is a problem in soldering workability and quality.
Japanese Patent Application Laid-Open No. 2004-192877 discloses a technique for connecting an LED and a printed circuit board without soldering.
However, it is a structure in which an LED having only a pair of terminals is directly fitted into a housing-like insulator and is connected to a printed circuit board through a contact, and a module board such as an illumination LED is fitted into a socket, This is different from a structure in which a large number of connection portions provided on the substrate and wiring wires are connected at a narrow pitch, which is insufficient for connecting the substrate.

特開2004−192877号公報JP 2004-192877 A

本発明は上記技術的課題に鑑みて、組付け作業性が良く、配線ワイヤの接続品質に優れたソケットを提供することを目的とする。   In view of the above technical problem, an object of the present invention is to provide a socket with good assembly workability and excellent connection quality of wiring wires.

本発明の技術的要旨は、複数の発光ダイオードを面状に配置した基板実装の照明用LEDモジュール基板を接続するためのソケットであって、ソケットは、ソケットベース部とプラグ部からなり、ソケットベース部は、一方に基板嵌合部、他方にプラグ嵌合部及び基板嵌合部からプラグ嵌合部に亘ってコンタクトを備え、プラグ部には、先端に弾性接続部を有し且つ後端に配線用ワイヤを圧着した圧着ターミナルを嵌着してあり、コンタクトは、基板嵌合部側にLEDモジュール基板の接続部と弾性接続するバネ接点部を有し、かつ、プラグ嵌合部側に板状の端子部を有し、当該基板嵌合部に当該LEDモジュール基板を嵌合装着すると基板の接続部にバネ接点部が弾性接続し、当該プラグ嵌合部にプラグ部を嵌合装着すると圧着ターミナルの弾性接続部にコンタクトの端子部が挿入接続することを特徴とするTechnical gist of the present invention is a socket for connecting the LED lighting module substrate board mounting in which a plurality of light emitting diodes in a planar, sockets, made from the socket base and the plug portion, the socket base The part includes a board fitting part on one side, a plug fitting part and a contact extending from the board fitting part to the plug fitting part on the other side, and the plug part has an elastic connection part at the front end and a rear end. A crimping terminal to which a wiring wire is crimped is fitted, and the contact has a spring contact part that elastically connects with the connection part of the LED module board on the board fitting part side, and a plate on the plug fitting part side If the LED module board is fitted and mounted on the board fitting part, the spring contact part is elastically connected to the connection part of the board, and the plug part is crimped and fitted on the plug fitting part. terminal Wherein the terminal portions of the contacts are inserted and connected to the elastic connection.

ここで、ソケットベース部には、一方に基板嵌合部、他方にプラグ嵌合部を備えとは、ソケット(ホルダ)のソケットベース部に、基板の接続部側を嵌着する基板嵌合部と、プラグ部を嵌着するプラグ嵌合部とを設けた趣旨である。
プラグ部には配線用ワイヤを圧着した圧着ターミナルを嵌着し、とは一端に配線用ワイヤを圧着したターミナルをプラグ部に嵌着できるようにした趣旨である。
これにより、圧着ターミナルをプラグ部へ挿入接続することで配線用ワイヤと接続でき、半田付け工程が不要となる。
そしてこれにより、ソケットベース部に基板とプラグ部とを嵌着すると、基板の接続部と圧着ターミナルの接続部とが、コンタクトにより接続する。
ここでコンタクトの構造としては、例えば線バネ材や板バネ材より形成して、基板嵌合部側にバネ接点部を設け、プラグ嵌合部側に板状の端子部を設ける等が例として挙げられる。
このようにすると、基板嵌合部に基板を嵌着すれば、バネ接点部を基板の接続部へバネ力により押圧接続できる。
一方、一端に配線用ワイヤを圧着した圧着ターミナル他端側にバネ性の弾性接続部を設けると、コンタクトの端子部に向けてプラグ部を挿入嵌着するだけで配線ワイヤとソケットの接続が可能になる。
Here, the socket base portion includes a board fitting portion on one side and a plug fitting portion on the other side. The board fitting portion for fitting the connection portion side of the board to the socket base portion of the socket (holder). And a plug fitting portion for fitting the plug portion.
The plug part is fitted with a crimping terminal to which a wiring wire is crimped, which means that a terminal to which a wiring wire is crimped at one end can be fitted into the plug part.
Accordingly, the crimping terminal can be connected to the wiring wire by inserting and connecting to the plug portion, and a soldering process is not necessary.
Thus, when the substrate and the plug portion are fitted to the socket base portion, the connection portion of the substrate and the connection portion of the crimp terminal are connected by the contact.
Here, as an example of the contact structure, for example, a wire spring material or a leaf spring material is used, a spring contact portion is provided on the board fitting portion side, and a plate-like terminal portion is provided on the plug fitting portion side. Can be mentioned.
If it carries out like this, if a board | substrate is fitted to a board | substrate fitting part, a spring contact part can be press-connected by the spring force to the connection part of a board | substrate.
On the other hand, if a spring-like elastic connection part is provided on the other end of the crimping terminal with a wiring wire crimped on one end, the wiring wire and socket can be connected simply by inserting and fitting the plug part toward the terminal part of the contact become.

本発明に係るソケットにおいては、ソケットをソケットベース部とプラグ部とを組み合わせて構成して、ソケットベース部のコンタクト端子部への配線用ワイヤの接続を、配線用ワイヤに圧着した圧着ターミナルをプラグ部に配設し、プラグ部をソケットベース部に嵌着する構造にしたので、コンタクト端子を挟ピッチに設けている場合であっても、半田付けを行った場合に発生する恐れのある、コンタクト端子を誤って曲げてしまう不良や、コンタクト端子間のブリッジ不良の発生を防止出来る。
そして、配線用ワイヤは半田付けの場合に比べて格段に効率よく取り付けることが出来る。
In the socket according to the present invention, the socket is configured by combining the socket base portion and the plug portion, and the connection of the wiring wire to the contact terminal portion of the socket base portion is plugged with the crimping terminal crimped to the wiring wire. Contact, which may occur when soldering, even when contact terminals are provided at a narrow pitch, because the plug part is fitted to the socket base part. It is possible to prevent the occurrence of defects that cause the terminals to be bent accidentally and the bridging defects between the contact terminals.
The wiring wire can be attached much more efficiently than in the case of soldering.

本発明に係るソケットを、照明用LED基板用ソケットに適用した実施例について図を用いて説明する。
図1(イ)は、ソケット10に照明用LEDモジュール基板1(以下、基板と称する)を嵌合させた斜視図を示し、図1(ロ)はソケット10から、基板1とプラグ部30とを取り外した状態の斜視図を示す。
ソケット10は、ソケットベース部20と、プラグ部30とを備えている。
ソケットベース部20には、基板1を嵌着する基板嵌合部22と、プラグ部30を嵌着するプラグ嵌合部21とを備えている。
図1(ロ)に示すように、基板は接続部(接続用パターン部)1a側を矢印D方向に差し入れて基板嵌合部22に嵌着し、プラグ部30は矢印E方向に差し入れて挿入部31をプラグ嵌合部21へに嵌着することで、基板の接続部1aと配線用ワイヤ50とを接続する。
配線用ワイヤ50とコンタクト40は、接続部1aの必要な回路に対応して接続することになる。
図3(ハ)はプラグ部30の平面図を示し、左側面図を図3(ロ)に示し、裏面図を図3(イ)に示す。
また、E−E線断面図を図3(ニ)に示す。
また、このプラグ部に圧着ターミナルを取り付けた配線用ワイヤを挿し込む状態を図4に示す。
圧着ターミナル51と配線用ワイヤ50はわかりやすくするために側面を描いている。
図4に示すように、配線用ワイヤ50の導体部50aを圧着した圧着ターミナル51は、断面4角形の筒状の導体部51b内にバネ部51cを備えて、バネ部51cと導体部51bとの間の弾性接続部51aにコンタクトの板状端子部を挿入接続する構造となっている。
その弾性接続部51a部分を、プラグ部30の圧着ターミナル挿入口32bからコンタクト通し口32aへ向けて挿入し、係止爪51dを図3(イ)に示す係止弾性片32cに係止させて装着する。
すると、図3(ロ)に示すようにコンタクト通し口32a内側に弾性接続部51aが配置される。
このように、配線用ワイヤ50を圧着ターミナル51を用いてプラグ部30へ挿入接続することで、半田付け工程が不要となる。
An embodiment in which a socket according to the present invention is applied to a socket for an LED board for illumination will be described with reference to the drawings.
FIG. 1A shows a perspective view in which a lighting LED module substrate 1 (hereinafter referred to as a substrate) is fitted to a socket 10, and FIG. 1B shows from the socket 10 the substrate 1 and the plug portion 30. The perspective view of the state which removed is shown.
The socket 10 includes a socket base portion 20 and a plug portion 30.
The socket base part 20 includes a board fitting part 22 for fitting the board 1 and a plug fitting part 21 for fitting the plug part 30.
As shown in FIG. 1B, the board is inserted into the board fitting part 22 by inserting the connection part (connection pattern part) 1a side in the arrow D direction, and the plug part 30 is inserted in the arrow E direction. By fitting the part 31 to the plug fitting part 21, the connection part 1 a of the substrate and the wiring wire 50 are connected.
The wiring wire 50 and the contact 40 are connected to correspond to a necessary circuit of the connecting portion 1a.
FIG. 3 (c) shows a plan view of the plug portion 30, a left side view is shown in FIG. 3 (b), and a rear view is shown in FIG. 3 (a).
A cross-sectional view taken along line EE is shown in FIG.
Moreover, the state which inserts the wire for wiring which attached the crimping terminal to this plug part is shown in FIG.
The crimp terminal 51 and the wiring wire 50 are drawn on the sides for easy understanding.
As shown in FIG. 4, a crimp terminal 51 to which a conductor portion 50a of a wiring wire 50 is crimped includes a spring portion 51c in a cylindrical conductor portion 51b having a quadrangular cross section, and the spring portion 51c, the conductor portion 51b, The plate-like terminal portion of the contact is inserted and connected to the elastic connection portion 51a between the two.
The elastic connecting portion 51a is inserted from the crimp terminal insertion port 32b of the plug portion 30 toward the contact through port 32a, and the locking claw 51d is locked to the locking elastic piece 32c shown in FIG. Installing.
Then, as shown in FIG. 3B, the elastic connection portion 51a is arranged inside the contact through hole 32a.
In this manner, the wiring wire 50 is inserted and connected to the plug portion 30 using the crimp terminal 51, so that a soldering process is not necessary.

図1におけるA−A線断面図を図2(イ)に示し、B−B線断面図を図2(ロ)に示す。
図2(ロ)に示すように、ソケットベース部20には基板嵌合部22からプラグ嵌合部21にかけて連通する貫通孔23を形成して、この貫通孔23内にコンタクト40を備えている。
図2(ロ)に示す、プラグ部30と基板1がソケットベース部20に未嵌合の状態から、まずプラグ部30をその挿入部31をプラグ嵌合部21へ挿入嵌合してソケット10を組み立てる。
その際に、コンタクト端子部42をコンタクト通し口32aに通し、コンタクト端子部42を圧着ターミナルの導体部51bとバネ部51cの間の弾性接続部51aに挿入して接続する。
ここで、バネ部51cはわかりやすくするため透視して描いてある。
そして、基板嵌合部22に基板1の接続部1a側を挿入嵌合した状態を図2(イ)に示す。
コンタクトバネ接点部41は基板1上に乗りあがり、基板接続部1aに押圧接続する。
ここで基板の接続部1aはわかりやすくするため極端に厚く描いてある。
コンタクト40は、基板嵌合部22からソケットベース部貫通孔23を通り、コンタクト通し口32aを通り、基板接続部1aと圧着ターミナルの弾性接続部51aとを互いに導通接続させ、基板1と配線用ワイヤ50とを中継接続する。
このように、配線用ワイヤ50に圧着ターミナルを取り付け、プラグ部を用いてソケットベース部に取り付けると半田付け作業が不要で、この基板用ソケットへの配線用ワイヤの接続作業が簡単に効率良く行えることから、ソケット組立の生産性を向上させることが出来る。
A cross-sectional view taken along line AA in FIG. 1 is shown in FIG. 2 (a), and a cross-sectional view taken along line BB is shown in FIG. 2 (b).
As shown in FIG. 2 (b), the socket base portion 20 is formed with a through hole 23 communicating from the board fitting portion 22 to the plug fitting portion 21, and a contact 40 is provided in the through hole 23. .
2 (B), from the state in which the plug portion 30 and the substrate 1 are not fitted to the socket base portion 20, first, the plug portion 30 is inserted and fitted into the plug fitting portion 21 so that the socket 10 is inserted. Assemble.
At that time, the contact terminal portion 42 is passed through the contact passage 32a, and the contact terminal portion 42 is inserted and connected to the elastic connection portion 51a between the conductor portion 51b and the spring portion 51c of the crimp terminal.
Here, the spring portion 51c is shown in a perspective manner for easy understanding.
And the state which inserted and fitted the connection part 1a side of the board | substrate 1 to the board | substrate fitting part 22 is shown to FIG.
The contact spring contact portion 41 rides on the substrate 1 and is press-connected to the substrate connection portion 1a.
Here, the connecting portion 1a of the substrate is drawn extremely thick for easy understanding.
The contact 40 passes from the board fitting part 22 through the socket base part through hole 23, through the contact through hole 32a, and electrically connects the board connection part 1a and the elastic connection part 51a of the crimping terminal to each other. The wire 50 is relay-connected.
Thus, when a crimping terminal is attached to the wiring wire 50 and attached to the socket base portion using the plug portion, soldering work is unnecessary, and the wiring wire can be easily and efficiently connected to the board socket. Therefore, the productivity of socket assembly can be improved.

本発明に係るソケットを照明用LEDモジュール基板用ソケットに適用した実施例の斜視図を示す。The perspective view of the Example which applied the socket based on this invention to the socket for LED module boards for illumination is shown. (イ)はA−A線断面図を示し、(ロ)はB−B線断面図を示す。(A) shows a cross-sectional view along line AA, and (B) shows a cross-sectional view along line BB. プラグ部の(イ)は裏面図を示し、(ロ)は左側面図を示し、(ハ)は平面図を示し、(ニ)はE−E線断面図を示す。(A) of a plug part shows a back view, (b) shows a left side view, (c) shows a plan view, and (d) shows a cross-sectional view taken along the line EE. 配線用ワイヤに取り付けた圧着ターミナルをプラグ部へ挿入する説明図を示す。Explanatory drawing which inserts the crimp terminal attached to the wire for wiring into a plug part is shown. 従来のソケット例を示す。An example of a conventional socket is shown.

符号の説明Explanation of symbols

1 基板(照明用LEDモジュール基板)
1a 基板接続部(基板接続用パターン部)
10 ソケット
20 ソケットベース部
21 ソケットベース部のプラグ嵌合部
22 ソケットベース部の基板嵌合部
23 ソケットベース部の貫通孔
23a ソケットベース部貫通孔のプラグ部側開口部
23b ソケットベース部貫通孔の基板側開口部
30 プラグ部
31 プラグ部の挿入部
32 プラグ部の圧着ターミナル嵌合部
32a プラグ部のコンタクト通し口
32b プラグ部の圧着ターミナル挿入口
32c 係止弾性片
40 コンタクト
41 コンタクトのバネ接点部
42 コンタクトの端子部
50 配線用ワイヤ
50a 配線用ワイヤ導体部
51 圧着ターミナル
51a 圧着ターミナルの弾性接続部
51b 圧着ターミナルの導体部
51c 圧着ターミナルのバネ部
51d 圧着ターミナルの係止爪
1 Substrate (LED module substrate for lighting)
1a Board connection part (Pattern part for board connection)
DESCRIPTION OF SYMBOLS 10 Socket 20 Socket base part 21 Plug fitting part 22 of socket base part Board fitting part 23 of socket base part Through hole 23a of socket base part Plug part side opening part 23b of socket base part through hole Board side opening 30 Plug portion 31 Plug portion insertion portion 32 Plug portion crimping terminal fitting portion 32a Plug portion contact passage 32b Plug portion crimping terminal insertion port 32c Locking elastic piece 40 Contact 41 Contact spring contact portion 42 Contact Terminal Portion 50 Wiring Wire 50a Wiring Wire Conductor 51 Crimping Terminal 51a Crimping Terminal Elastic Connection 51b Crimping Terminal Conductor 51c Crimping Terminal Spring 51d Crimping Terminal Claw

Claims (1)

複数の発光ダイオードを面状に配置した基板実装の照明用LEDモジュール基板を接続するためのソケットであって
ソケットは、ソケットベース部とプラグ部からなり、
ソケットベース部は、一方に基板嵌合部、他方にプラグ嵌合部及び基板嵌合部からプラグ嵌合部に亘ってコンタクトを備え、
プラグ部には、先端に弾性接続部を有し且つ後端に配線用ワイヤを圧着した圧着ターミナルを嵌着してあり、
コンタクトは、基板嵌合部側にLEDモジュール基板の接続部と弾性接続するバネ接点部を有し、かつ、プラグ嵌合部側に板状の端子部を有し、
当該基板嵌合部に当該LEDモジュール基板を嵌合装着すると基板の接続部にバネ接点部が弾性接続し、当該プラグ嵌合部にプラグ部を嵌合装着すると圧着ターミナルの弾性接続部にコンタクトの端子部が挿入接続することを特徴とするLEDモジュール基板接続用ソケット。
A socket for connecting the LED lighting module substrate board mounting in which a plurality of light emitting diodes in a planar shape,
A socket consists of a socket base and a plug.
The socket base part includes a contact extending from the board fitting part on one side and the plug fitting part and the board fitting part to the plug fitting part on the other side .
The plug part is fitted with a crimping terminal having an elastic connection part at the front end and a wiring wire crimped at the rear end ,
The contact has a spring contact portion elastically connected to the connection portion of the LED module substrate on the board fitting portion side, and a plate-like terminal portion on the plug fitting portion side,
When the LED module substrate is fitted and attached to the board fitting portion, the spring contact portion is elastically connected to the connecting portion of the substrate, and when the plug portion is fitted and attached to the plug fitting portion, the elastic connection portion of the crimp terminal is contacted. A socket for connecting an LED module board, wherein the terminal portion is inserted and connected.
JP2004264824A 2004-09-13 2004-09-13 socket Expired - Lifetime JP4097231B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004264824A JP4097231B2 (en) 2004-09-13 2004-09-13 socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004264824A JP4097231B2 (en) 2004-09-13 2004-09-13 socket

Publications (2)

Publication Number Publication Date
JP2006080014A JP2006080014A (en) 2006-03-23
JP4097231B2 true JP4097231B2 (en) 2008-06-11

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Family Applications (1)

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JP2004264824A Expired - Lifetime JP4097231B2 (en) 2004-09-13 2004-09-13 socket

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012056761A1 (en) 2010-10-28 2012-05-03 日本航空電子工業株式会社 Illumination device and connector
JP2012094519A (en) * 2011-11-08 2012-05-17 Japan Aviation Electronics Industry Ltd Connector

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012056761A1 (en) 2010-10-28 2012-05-03 日本航空電子工業株式会社 Illumination device and connector
EP2607783A4 (en) * 2010-10-28 2014-04-09 Japan Aviation Electron LIGHTING DEVICE AND CONNECTOR
EP2818788A1 (en) 2010-10-28 2014-12-31 Japan Aviation Electronics Industry Limited Illumination device and connector
EP2835875A1 (en) 2010-10-28 2015-02-11 Japan Aviation Electronics Industry Limited Illumination device and connector
US9373922B2 (en) 2010-10-28 2016-06-21 Japan Aviation Electronics Industry, Limited LED illumination device with edge connector
JP2012094519A (en) * 2011-11-08 2012-05-17 Japan Aviation Electronics Industry Ltd Connector

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