JP4092305B2 - Method for manufacturing stamper of optical information recording medium - Google Patents

Description

  The present invention relates to a method for manufacturing a stamper for an optical information recording medium.

  In general, an optical information recording medium such as an optical disk is manufactured by a molding process such as injection molding using a stamper having a predetermined uneven pattern. Hereinafter, an example of a conventional method for manufacturing a stamper for an optical information recording medium will be described with reference to FIGS.

  In the conventional stamper manufacturing process, first, as shown in FIG. 7A, recording light 104 such as laser light or electron beam is applied to a recording master 103 in which a resist 102 is formed in a thin film on a substrate 101. The desired pattern such as guide grooves and information pits is formed as a latent image 105 by the exposure according to the above.

  Subsequently, as shown in FIG. 7B, a development pattern is applied to the recording master 103 after exposure so that a desired pattern recorded as the latent image 105 has a concavo-convex pattern formed as a convex portion or a concave portion. A master 106 is produced. In addition, exposure with an ultraviolet laser and development with an alkaline solution are widely used in the production of a DVD and a master for the next generation optical information recording medium.

  Next, as shown in FIG. 7C, a conductive film 107 is formed over the master 106 by sputtering or electroless plating. Subsequently, as shown in FIG. 7D, a metal layer 108 is formed by plating using the conductive film 107 as an electrode. After that, as shown in FIG. 7E, only the metal layer 108 or the metal layer 108 with the conductive film 107 is peeled off from the master 106, and the metal layer 108 is subjected to shaping such as backside polishing or punching. Apply. Thereby, the stamper 109a without the conductive film 107 or the stamper 109b with the conductive film 107 is completed. Alternatively, in some cases, the metal layer 108 peeled from the master 106 is further subjected to plating or 2P method or the like once or more, thereby obtaining a stamper to which the uneven pattern on the metal layer 108 is transferred.

  The disk substrate of the optical information recording medium is manufactured by injection molding or the like using the stamper 109a or 109b manufactured as described above. Here, a case where a positive type photoresist (a photoresist from which a latent image is removed by development) is used is described. However, even when a negative type photoresist is used, the unevenness on the master is reversed. Except for this point, the stamper is manufactured as described above. As another method, the metal layer 108 peeled from the master 106 is further subjected to plating or 2P method or the like once or more, thereby obtaining a stamper to which the uneven pattern on the metal layer 108 is transferred, and this is used as an optical information recording medium. It may be used for the manufacture of

  In the manufacture of the stamper of the conventional optical information recording medium described with reference to FIG. 7, a photoresist made of an organic material is generally used as the resist 102. However, when a photoresist is used as the resist 102, the amount of exposure continuously changes at the boundary between the exposed portion and the non-exposed portion, not in a step shape, so the photoresist is also removed in an inclined manner instead of a step shape. The This makes it difficult to form a fine uneven pattern using a photoresist. Accordingly, it has been proposed to form the resist 102 with a heat-sensitive inorganic material such as a phase change material. Specifically, the master material having a concavo-convex pattern is manufactured by increasing the temperature of the heat-sensitive material by heat to change the phase, and performing etching with different etching rates between the phase-changed portion and the portion where the phase has not changed. It has been proposed. In a resist formed of a heat-sensitive phase change material, the phase change occurs at the part where the temperature is raised above a certain temperature by exposure, so the boundary between the part where the phase has changed and the part where the phase has not changed is clearer. Become. Therefore, if a resist using a heat-sensitive material is used, a finer pattern can be formed for recording light having the same wavelength as compared with the case where a photoresist is used (see, for example, Patent Document 1).

JP-A-10-97738 (paragraph [0021], FIG. 1)

  As described above, by using a heat-sensitive material as a resist, it becomes possible to manufacture a stamper having a fine uneven pattern. However, it has been found that the following inconvenience arises when a stamper is manufactured by a conventional method using a master disk having a heat-sensitive material as a resist. Conventionally, a photoresist widely used for manufacturing a stamper of an optical information recording medium is made of an organic material such as a novolak resin and PMMA. Such a photoresist is generally relatively stable even when a metal layer is formed by plating. Have sex. On the other hand, heat-sensitive materials such as phase change materials are generally inorganic materials. When forming a metal layer by plating, the inorganic material tends to react with the conductive film or the metal layer formed by plating, and tends to be electrically decomposed. The reaction between the inorganic material and another substance causes a loss of the uneven pattern formed on the master, and results in the desired uneven pattern not being imparted to the metal layer. As described above, when a master using an inorganic material as a resist is used, there is a problem in that formation of a metal layer (that is, plating) accompanied by energization cannot be satisfactorily performed.

  The present invention has been made in view of the above circumstances, and even when an inorganic material such as a phase change material is used as a resist, the inorganic material is formed into a conductive film and a metal layer when the metal layer is formed by plating or the like. To provide a method for manufacturing a stamper of an optical information recording medium, which can be prevented from reacting with each other as well as being electrically decomposed, thereby enabling a metal layer to be well formed by plating. Objective.

  The present invention provides a first method for producing a stamper of an optical information recording medium (sometimes referred to simply as a “stamper”). (I) A recording master in which a resist made of an inorganic material is formed on a substrate; Producing a master having a concavo-convex pattern by performing exposure and development, (ii) forming an organic layer on the concavo-convex pattern of the master, (iii) forming a conductive film on the organic layer, (Iv) A method including forming a metal layer on a conductive film, and (v) peeling only the metal layer or the metal layer and the conductive film from the master is provided.

  This stamper manufacturing method is characterized in that an organic layer is formed between a resist and a conductive film. Here, the “organic layer” refers to a layer containing an organic material as a main component. This organic layer plays a role of physically separating the resist and the conductive film, thereby suppressing a chemical reaction between the resist and the conductive film. Furthermore, since organic materials are generally low in electrical conductivity, the organic layer also serves to electrically isolate (insulate) the resist and the conductive film, thereby electrically promoting the resist of the resist. The decomposition reaction and the reaction between the resist and the conductive film are suppressed.

  The present invention is the first manufacturing method as the second manufacturing method, wherein the inorganic material used for manufacturing the recording master is a heat-sensitive material whose state changes due to a temperature change caused by exposure. Provide a method. Here, the heat-sensitive material is a material whose state changes due to a temperature change (specifically, a temperature rise) due to exposure. Here, “state change” refers to a change in the chemical and / or physical properties of the heat-sensitive material. The “state-changed portion” is, for example, a phase-changed portion or a thermally crosslinked portion. In this specification, “exposure” is used to mean not only light irradiation but also electron beam irradiation.

  The present invention provides, as a third manufacturing method, the first or second manufacturing method described above, wherein the metal layer is formed by plating. The manufacturing method of the present invention aims to solve the problems that occur particularly in plating in the conventional stamper manufacturing method. Therefore, the manufacturing method of the present invention is particularly preferably applied when the metal layer is formed by plating.

  The present invention provides, as a fourth manufacturing method, any one of the first to third manufacturing methods, wherein the organic layer is formed by a spin coating method. By employing the spin coating method, a layer containing an organic material can be efficiently formed. When the organic layer is formed by a spin coating method, the organic layer preferably includes, for example, a phenol resin, an acrylic resin, a styrene resin, or the like. Or you may comprise an organic layer with the photoresist which has a phenol resin or an acrylic resin etc. as a main component. When an organic layer is formed by spin coating using these resins or photoresist materials, the thickness of the organic layer is preferably 5 nm or more and 60 nm or less, and more preferably 15 nm or more and 40 nm or less. When the thickness of the organic layer is less than 5 nm, it is difficult to physically and electrically separate the resist and the conductive film. If the thickness of the organic layer exceeds 60 nm, the organic layer may not be uniformly formed over the entire master, and the resulting uneven pattern on the stamper surface may be non-uniform.

  The present invention provides, as a fifth manufacturing method, any one of the first to third manufacturing methods, wherein the organic layer is formed by a vacuum process. As the vacuum process, for example, a vacuum deposition method or a sputtering method can be used. The vacuum process is preferably used because the degree of flattening of the concavo-convex pattern resulting from the formation of the organic layer can be further reduced. When the vacuum deposition method is employed as the vacuum process, the organic layer preferably includes, for example, a phenol resin, an acrylic resin, a styrene resin, polyamide, polyimide, polyurea, or polyurethane. When an organic layer is formed by vacuum deposition using any of these resins, the thickness of the organic layer is preferably 5 nm to 60 nm, and more preferably 15 nm to 60 nm. Problems caused by the organic layer being too small or too large are as described above in connection with forming the organic layer by spin coating.

  In the fifth manufacturing method, a vapor deposition polymerization method may be used as the vacuum vapor deposition method. In this case, the organic layer preferably comprises, for example, polyimide, polyurea or polyurethane. The vapor deposition polymerization method is preferably used because the degree of flattening of the concavo-convex pattern resulting from the formation of the organic layer can be further reduced. When an organic layer containing any of these resins is formed by a vapor deposition polymerization method, the thickness of the organic layer is preferably 3 nm or more and 100 nm or less, and more preferably 10 nm or more and 100 nm or less. Problems caused by the organic layer being too small or too large are as described above in connection with forming the organic layer by spin coating.

  The present invention provides a sixth production method according to any one of the first to fifth methods, wherein the inorganic material constituting the resist is an element such as germanium, tellurium, antimony, selenium, molybdenum, and the like. And a mixture containing these elements, and a production method comprising at least one material selected from the group consisting of a compound of these elements and a mixture containing two or more of these compounds as a main component. Here, specifically, the compound is an oxide, nitride, sulfide or the like of these elements, and preferably an oxide. When these materials are heated, a state change (for example, phase change) occurs, and therefore, an inorganic material containing these materials is preferably used as a heat-sensitive material. The resist may further include at least one inorganic material selected from gold, platinum, copper, silver, palladium, silicon, and the like.

  The present invention provides the seventh manufacturing method according to any one of the first to sixth methods, wherein the height of the concavo-convex pattern formed on the stamper is 12 nm or more and 85 nm or less. Provide a method. Here, the height of the concavo-convex pattern refers to a distance between a plane parallel to the main surface passing through the bottom of the concave portion and a plane parallel to the main surface passing through the top of the convex portion. In the case where there are a plurality of recesses having different depths, the average of them is defined as the depth (that is, the bottom) of the recess serving as a reference for determining the height of the uneven pattern. Similarly, when there are a plurality of convex portions having different heights, the average height of them is set as the height (that is, the top) of the convex portion serving as a reference for determining the height of the concave / convex pattern. . The average of the depths of the plurality of recesses can be obtained, for example, by measuring the depth of each recess in a cross section obtained by cutting the stamper in the radial direction, or located within an arbitrary range (for example, 1 cm square). You may obtain | require by measuring the depth of each recessed part. The average of the heights of the plurality of convex portions is obtained in the same manner. More specifically, the height of the concavo-convex pattern corresponds to the height of the protrusion formed on the stamper in a stamper manufactured using a positive resist, and is manufactured using a negative resist. This stamper corresponds to the depth of the recess formed in the stamper. According to the manufacturing method of the present invention, by appropriately combining the height of the uneven pattern formed on the master before forming the organic layer and the method and thickness of the organic layer, It is possible to control the height of the concavo-convex pattern within this range. Therefore, according to the manufacturing method of the present invention, it is possible to obtain a stamper that makes it possible to form a concavo-convex pattern having a desired shape (including height) on the substrate of the optical information recording medium.

  The present invention provides, as an eighth manufacturing method, any one of the first to seventh methods, wherein the conductive film is formed by electroless plating. Electroless plating is preferably used as a method for forming a conductive film on the surface of an organic layer having low conductivity. In addition, the conductive film formed by electroless plating adheres to the organic layer with lower adhesion strength than conductive films formed by sputtering and vacuum deposition. Therefore, when electroless plating is used, an organic layer residue hardly remains in the conductive film in the stamper obtained by peeling the metal layer together with the conductive film.

  According to the stamper manufacturing method of the present invention, even when an inorganic material is used as a resist, the organic layer protects the resist, and during plating, the inorganic material reacts with the conductive film and the metal layer or is electrically decomposed. Is prevented, thereby achieving good plating. Therefore, the manufacturing method of the present invention makes it possible to manufacture a stamper by plating without destroying the concave / convex pattern from a master disk using, for example, a heat-sensitive material suitable for forming a fine concave / convex pattern as a resist. To do.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the master and stamper of the optical information recording medium may be simply referred to as “master” and “stamper”, respectively. In addition, forming a portion of a resist whose state has changed due to a temperature change due to exposure as a latent image in a predetermined manner may be referred to as “recording”.

(Embodiment 1)
As a first embodiment, a stamper manufacturing method including forming an organic layer on the surface of a master by a spin coating method will be described with reference to FIGS. First, an outline of a stamper manufacturing method according to the first embodiment of the present invention will be described with reference to FIGS.

  First, as shown in FIG. 1A, a recording master 3 in which a resist 2 is formed in a thin film on a substrate 1 is exposed using recording light 4 such as a laser beam or an electron beam, and guide grooves and information are recorded. A desired pattern such as pits is formed as the latent image 5 (exposure process). Here, the resist 2 includes an inorganic material that undergoes a phase change due to a temperature rise due to exposure. Subsequently, as shown in FIG. 1 (B), fine irregularities in which a desired pattern recorded as a latent image 5 is formed as a convex portion or a concave portion by performing development processing on the recording master 3 after exposure. A master 6 having a pattern is manufactured (development process). Specifically, the development process is an etching performed under different conditions of the etching rate between the phase-changed portion and the phase-changed portion.

  Next, as shown in FIG. 1C, the organic layer 7 is formed on the surface of the master 6 on which the concave / convex pattern is formed (organic layer forming step). Subsequently, as shown in FIG. 1D, a conductive film 8 is formed on the organic layer 7 by an electroless plating method (conductive film forming step). The conductive film 8 may be formed by sputtering.

  Next, as shown in FIG. 1E, a metal layer 9 is formed over the conductive film 8 (metal layer forming step). The metal layer 9 is formed, for example, by plating using the conductive film 8 as an electrode. Thereafter, as shown in FIG. 1 (F), only the metal layer 9 or the metal layer 9 and the conductive film 8 are peeled off from the master 6 as a whole, and the metal layer 9 is subjected to shaping processing such as back surface polishing and punching. (Peeling process). As a result, the concavo-convex pattern of the master 6 is transferred (that is, has a concavo-convex pattern complementary to the concavo-convex pattern of the master 6), or the stamper 10 a without the conductive film 8 or the stamper 10 b with the conductive film 8. Is completed.

  Hereinafter, the manufacturing method of the stamper concerning Embodiment 1 of the present invention is explained more concretely. As the substrate 1 of the recording master 3, for example, a substrate made of glass, silicon, resin, or the like is used. The thickness in particular of the board | substrate 1 is not restrict | limited, For example, it selects from the range of 0.4-10.0 mm.

As described above, the resist 2 formed on the substrate 1 preferably includes an inorganic material that changes its state due to a temperature rise caused by exposure. The state change is, for example, a phase change. As the inorganic material of the resist 2, for example, a material containing Ge, Te, Sb, Se, Mo, Sn, a mixture of these elements, a compound of these elements or a mixture of these compounds as a main component is used. . The mixture of elements constituting the resist 2 is, for example, Sb—Te and Ge—Sb—Te. The compound constituting the resist 2 is an oxide, nitride, sulfide or the like, and is preferably an oxide. The oxide is represented by, for example, MO _x (where M is one or more elements selected from Ge, Te, Sb, Se, Mo, and Sn, and 0.3 <X <1.7). It is an oxide. The inorganic material containing the specific element or elements or compounds of the element or elements described above is further one or more metals selected from noble metals such as Au, Pt, Cu, Ag and Pd, and / or Si may be included. Here, the resist 2 made of an inorganic material is formed by, for example, a sputtering method, a vacuum evaporation method, a spin coating method, or the like. As long as the resist 2 includes an inorganic material, the recording master 3 may include components other than those described above, such as an interface layer and a reflective layer.

  Next, an exposure method of the recording master 3, that is, a method of recording a pattern on the recording master 3 will be described with reference to FIG. As shown in FIG. 2, the recording master 3 is placed on the turntable 11 and rotated together with the turntable 11. The recording light 4 emitted from the light source 12 is condensed on the surface of the recording master 3 by the lens 14. If necessary, the recording light 4 may be modulated and / or deflected in the light source 12. During recording, the recording head 15 and the turntable 11 are translated relative to each other as indicated by an arrow A. As a result, recording is performed so that the changed state is sequentially formed on the recording master 3 in a spiral shape, and a desired pattern is formed as the latent image 5. As the recording light 4, laser light, an electron beam bundle or the like can be used.

  In the recording master 3 in which a desired pattern is formed as the latent image 5, a portion whose state has changed due to a temperature rise due to exposure (for example, a portion that has undergone a phase change) and a portion that has not changed its state are different from each other. It has an etching rate. Therefore, in the developing step (see FIG. 1B), the recording master 3 is developed by etching using this etching rate difference. Examples of etching include dry etching such as reactive ion etching, wet etching with acid or alkali, and the like. However, the etching may be performed by any method as long as the etching can be performed under the condition where the etching rate is different between the portion where the state has changed and the portion where the state has not changed. The master 6 is manufactured by such development processing.

  In Embodiment Mode 1, a spin coating method is employed in the organic layer forming step (see FIG. 1C). In the spin coating method, a coating liquid is prepared by dissolving or dispersing an organic material (for example, resin) constituting a coating film in an appropriate solvent, and this coating liquid is a rotating object (master in the present invention). This is a coating method in which a coating film is obtained by evaporating a solvent after coating by dropping onto the top. According to this method, a thin organic layer can be formed efficiently. For example, a phenol resin such as a novolac resin, an acrylic resin such as PMMA, and a styrene resin such as polystyrene and a styrene copolymer are suitable for application on the master 6 by a spin coating method. Alternatively, the organic layer may be formed by a spin coating method using a coating solution in which a photoresist mainly containing a phenol resin or an acrylic resin is dissolved or dispersed in a solvent. As a solvent for preparing a coating solution for spin coating, for example, an organic solvent such as ketone, ester, or hydrocarbon can be used.

  The solvent in the coating solution is evaporated using an oven or the like, if necessary, thereby forming the organic layer 7 that is located between the conductive film 8 and the resist 2. Before applying the coating solution, it is preferable to apply a coupling agent such as a silane coupling agent to the surface of the master 6 by, for example, vapor deposition or spin coating because the coating solution can be uniformly applied.

  The optimum operating conditions for spin coating vary depending on the viscosity of the coating solution to be applied and the concentration or dilution of the resin in the coating solution, and are therefore selected accordingly. The operation conditions for spin coating are not particularly limited as long as an organic layer having a desired thickness can be formed substantially uniformly.

  The material constituting the organic layer formed by the spin coating method is not limited to the above-described resin as long as the thickness of the preferable organic layer 7 described later can be realized. May be used. However, when the organic layer 7 needs to insulate the resist 2 and the conductive film 8, the organic layer 7 needs to be made of an insulating material. (Most organic materials are insulating materials).

  In particular, when a novolak resin or PMMA used as a base material in a commercially available photoresist is used, it is easy to realize the thickness of the organic layer 7 described later. When using a photoresist, for example, a resist thinner can be used as a solvent for preparing a coating solution. A photoresist is also preferably used as a material for the organic layer 7 because the residue of the organic layer 7 is easily removed when the residue of the organic layer 7 remains on the stamper 10b with the conductive film. The organic layer 7 is preferably made of a material that is soluble in a solvent that does not attack the metal layer, since it may need to be removed if it remains in the stamper 10b. Since the photoresist is originally prepared so that it can be removed by some method, even if it remains as a residue on the stamper 10b, the residue can be easily removed using a normal photoresist removal processing method. Can do. Thus, in the manufacturing method according to the first embodiment of the present invention, the photoresist is suitable for constituting the organic layer.

The thickness of the organic layer 7 needs to be selected so as to satisfy the following two conditions.
(First Condition) When the metal layer 9 is plated, the decomposition of the resist 2 and the chemical reaction between the resist 2 and the conductive film 8 and the metal layer 9 are suppressed.
(Second Condition) After the organic layer 7 is formed, a desired height or shape uneven pattern is formed on the surface of the master 6.

  That is, when the thickness of the organic layer 7 is small, a large number of voids are present in the layer, and the resist 2 and the conductive film are not sufficiently separated from each other, and both communicate with each other and interact. In order to avoid such inconvenience, it is necessary to form the organic layer sufficiently thick. On the other hand, when the organic layer 7 is formed, the organic layer 7 tends to be formed thicker in the concave portions of the concave / convex pattern formed on the surface of the master 6, so that the concave / convex pattern formed on the surface of the organic layer 7 is more It is flattened, that is, the height of the concavo-convex pattern becomes smaller. The degree of flattening of the uneven pattern increases as the organic layer 7 becomes thicker. Therefore, it is necessary to select the thickness of the organic layer 7 within a range where the degree of flattening of the uneven pattern of the master 6 is small. Therefore, an experiment was performed as follows to determine a thickness range in which these conditions are satisfied when the organic layer 7 is formed by spin coating.

First, a procedure for determining a thickness range that satisfies the first condition will be described. Here, as shown in Table 1, two types of organic layers 7 and two types of resists 2 were combined, and four types of combinations were used. Here, as the resist 2, two types of resists A (TeO _1.5 ) and resist B (TeO _1.0 ) made of Te oxide having low stability when plating the metal layer 9 were used. As the material of the organic layer 7, novolac resin and PMMA were used. The organic layer 7 was formed by spin coating using a coating solution prepared by dissolving novolak resin or PMMA in a thinner for photoresist. For each combination, six types of laminates (24 types in total) with different thicknesses of the organic layer 7 were manufactured, and a conductive film 8 (Ni, 50 nm) and a metal layer 9 were formed on each laminate. A stamper having a conductive film 8 was manufactured by peeling off the metal layer 9 integrally, and the good plating rate was measured. The metal layer 9 was formed by plating and was a layer made of Ni and having a thickness of 300 μm. In addition, the non-defective plating rate is the highest of the line segments connecting the two points of the contour by forming a metal layer by plating 10 times for each laminate and passing it to the release surface of the stamper (that is, the exposed surface of the conductive film 8). A long line segment) having a defect of 100 μm or more was regarded as a defective product, and expressed by the number of non-defective products in 10 stampers. It can be said that the higher the number of non-defective products, the more the plating resistance of the resist 2 is improved by the organic layer 7. The results are shown in Table 1.

  As is apparent from Table 1, in any combination, if the thickness of the organic layer 7 is 5 nm or more, the presence of the organic layer 7 surely improves the plating resistance of the resist 2, and if it is 15 nm or more, the resist 2 The plating resistance is particularly high.

Next, a procedure for determining a thickness range that satisfies the second condition will be described. By forming a row of pits having a width of 130 nm and a shortest pit length of about 100 nm on the resist 2 in a spiral shape with a track pitch of 320 nm, a master 6 on which an uneven pattern was formed was produced. As shown in Table 2, here, two types of masters 6 having a concavo-convex pattern height of 35 nm and 90 nm, respectively, were prepared. Six types of laminates (12 types in total) with different thicknesses of the organic layer 7 were produced using each master 6, and the height of the concavo-convex pattern formed on the surface of the organic layer 7 of each laminate was measured. The results are shown in Table 2. Here, the organic layer 7 was formed by spin coating using a coating solution prepared by dissolving a novolak resin in a thinner for photoresist. Further, as described above, the height of the concavo-convex pattern is a distance between a surface parallel to the main surface of the master passing through the bottom of the concave portion and a surface parallel to the main surface of the master passing through the top of the convex portion. . FIG. 3 schematically shows the height of the concavo-convex pattern. In FIG. 3, h ₁ indicates the height of the uneven pattern of the organic layer 7, and h ₂ indicates the height of the uneven pattern of the master 6.

  As is clear from Table 2, the greater the thickness of the organic layer 7, the smaller the height of the concavo-convex pattern, the greater the degree of flattening of the concavo-convex pattern, and the thickness of the organic layer 7 is 80 nm or less. It was found that the uneven pattern on the master 6 was reflected on the surface of the organic layer 7. However, when the thickness of the organic layer 7 is 80 nm, the unevenness pattern uniformity may be slightly worse on the surface of the organic layer 7. Therefore, the thickness of the organic layer 7 is more preferably 60 nm or less. Further, in order to obtain a more uniform uneven pattern, the thickness of the organic layer 7 is a range in which the height of the uneven pattern of the organic layer 7 is relatively constant without depending on the thickness of the organic layer, A range of 10 nm to 40 nm is preferable.

  According to the above measurement results, when the organic layer is formed using the spin coating method, the thickness of the organic layer 7 is preferably 5 nm or more and 60 nm or less, and more preferably 15 nm or more and 40 nm or less. Further, according to the results shown in Table 2, the height of the concavo-convex pattern on the surface of the organic layer 7 is at least in the range of 12 nm or more and 25 nm or less by appropriately selecting the height of the concavo-convex pattern formed on the master 6. Or it is controllable in the range of 36 nm or more and 53 nm or less.

  Then, the process after forming the organic layer 7 is demonstrated. In the conductive film forming step (see FIG. 1D), a conductive film 8 made of, for example, Ni or Au is formed by electroless plating on the master 6 on which the organic layer 7 is formed. Alternatively, the conductive film 8 may be formed by a sputtering method, a vacuum deposition method, or the like. When electroless plating is used to form the conductive film 8, the adhesion between the resist 2 and the conductive film 8 becomes lower than when sputtering or vacuum deposition is used. Therefore, when forming the stamper 10b with the conductive film as described later, it is possible to suppress the residue of the organic layer from remaining on the stamper 10b by forming the conductive film by the electroless plating method. The thickness of the conductive film 8 is selected from the range of 10 to 100 nm, for example. The conductive film 8 is used as an electrode when the metal layer 9 is formed by plating in the metal layer forming step.

  In the metal layer forming step (see FIG. 1E), for example, plating such as Ni electroforming is performed to form the metal layer 9 on the master 6. The thickness of the metal layer 9 is selected from a range of 200 to 500 μm, for example.

  In the peeling step (see FIG. 1F), only the metal layer 9 or the metal layer 9 is peeled from the master 6 together with the conductive film 8, and then the back surface (the surface opposite to the peeling surface) is polished and Performs shaping such as punching. Thereby, the stamper 10a or 10b is completed. As described above, when the metal layer 9 is peeled from the master 6 together with the conductive film 8, a residue of the organic layer 7 may remain on the surface of the conductive film 8 exposed by the peeling. When such a residue becomes a problem, the residue of the organic layer 7 may be dissolved and removed with a solvent that does not attack the conductive film 8 and the metal layer 9, or the organic material is selectively selected by plasma etching or the like. May be removed. For example, when the organic layer 7 is formed of a novolac resin or an acrylic resin, the residue can be removed with an organic solvent such as 2-heptanone or a strong alkaline aqueous solution. Other organic materials can also be removed by a solvent that does not attack the conductive film 8 and the metal layer 9. Such solvents are, for example, organic solvents such as ketones and esters and strong alkaline aqueous solutions.

  As described above, according to the first embodiment of the present invention, it is possible to use an inorganic material as a resist, which has conventionally made it difficult or impossible to form a metal layer by plating. Thereby, for example, it is possible to manufacture a master disk using the property that the inorganic material changes at a certain temperature or higher. In Embodiment 1, the organic layer is formed by spin coating. The spin coating method is advantageous in that the selection range of the organic material is wider than the vacuum deposition method employed in the second embodiment or the third embodiment described later, and the height of the uneven pattern is compared. This makes it possible to manufacture a low stamper.

(Embodiment 2)
As a second embodiment, a stamper manufacturing method including forming an organic layer on the surface of a master by a vacuum deposition method will be described. The manufacturing method of the second embodiment is the same as the manufacturing method of the first embodiment except for the method of forming the organic layer. Therefore, in the following description, in order to avoid duplication of description, differences from Embodiment 1 will be mainly described with reference to FIGS. 1A to 1F as appropriate.

  In the second embodiment, the exposure process and the development process are the same as those in the first embodiment. Therefore, the same master as the master 6 manufactured in the first embodiment is manufactured.

  In the organic layer forming step (see FIG. 1C), the organic layer 7 is formed on the master 6 by vacuum deposition. When the vacuum deposition method is used, the uneven pattern on the master 6 can be more faithfully formed on the surface of the organic layer 7 than when the spin coating method is used. In other words, the degree of flattening of the concavo-convex pattern can be further reduced by employing the vacuum deposition method. An organic material suitable for forming the organic layer 7 by a vacuum deposition method is, for example, a phenol resin, an acrylic resin, a styrene resin, polyamide, polyimide, polyurea, or polyurethane. As described above, novolak resin, PMMA, and the like are preferably used because they can be removed very easily using a photoresist removal treatment technique when they remain as residues on the stamper.

  The film forming conditions of the vacuum deposition method are not particularly limited as long as a preferable thickness of the organic layer 7 described later can be realized substantially uniformly within the surface of the master 6. In order to avoid destruction of the organic material, it is preferable to use a resistance heating method as an evaporation method of the organic material rather than the electron beam irradiation method.

  The material constituting the organic layer formed by the vacuum vapor deposition method is not limited to the above-described resin as long as the thickness of the preferable organic layer 7 described later can be realized. May be used. However, when the organic layer 7 needs to insulate the resist 2 and the conductive film 8, the organic layer 7 needs to be made of an insulating material (most organic materials satisfy this condition).

  Also when the organic layer 7 is formed by the vacuum evaporation method, the thickness of the organic layer 7 needs to satisfy the first condition and the second condition described in the first embodiment. Therefore, when the organic layer is formed by the vacuum evaporation method, the thickness range in which these conditions are satisfied was determined.

  First, a procedure for determining a thickness range that satisfies the first condition will be described. As shown in Table 3, two masters having different resist 2 types were prepared. For each master, six types of laminates (12 types in total) with different thicknesses of the organic layer 7 are manufactured, and a conductive film 8 and a metal layer 9 are formed on each laminate, and the conductive film 8 and the metal layer 9 are formed. The stamper which peeled integrally and produced the electrically conductive film 8 was manufactured, and the plating non-defective rate of each stamper was measured. Here, as the resist 2, the same resists A and B as the resist used in the first embodiment were used. PMMA was used as the material of the organic layer 7 and was deposited on the surface of the master 6. The method for forming the conductive film 8 and the metal layer 9 and the method for measuring the plating good product rate are as described in connection with the first embodiment. The results are shown in Table 3. As is apparent from Table 3, the plating resistance of any resist is reliably improved when the thickness of the organic layer 7 is 5 nm or more, and the plating resistance is particularly high when the thickness is 15 nm or more.

  Next, a thickness range satisfying the second condition was determined. Here, in the same manner as in the first embodiment, two types of masters 6 having a concavo-convex pattern height of 35 nm and 90 nm, respectively, are prepared, and six types of organic layers 7 having different thicknesses are prepared using each master 6. Laminated bodies (12 types in total) were manufactured, and the height of the uneven pattern of the organic layer 7 of each laminated body was measured. The results are shown in Table 4. Here, PMMA is used as the material of the organic layer 7.

  As is clear from Table 4, as the thickness of the organic layer 7 is larger, the height of the concave / convex pattern is reduced, the degree of flattening of the concave / convex pattern is increased, and the thickness of the organic layer 7 is 80 nm or less. It was found that the uneven pattern on the master 6 was reflected on the surface of the organic layer 7 and that the degree of flattening of the uneven pattern was smaller than that in the first embodiment. However, when the thickness of the organic layer 7 is 80 nm, the unevenness pattern uniformity may be slightly worse on the surface of the organic layer. Therefore, the thickness of the organic layer 7 is preferably 60 nm or less. When the thickness of the organic layer 7 was 60 nm or less, the height of the uneven pattern on the surface of the organic layer 7 did not greatly depend on the thickness of the organic layer and was at a level with no particular problem.

  According to the above measurement results, when the organic layer is formed using the vacuum deposition method, the thickness of the organic layer 7 is preferably 5 nm to 60 nm, and more preferably 15 nm to 60 nm. Further, according to the results shown in Table 4, the height of the concavo-convex pattern on the surface of the organic layer 7 is at least in the range of 22 nm or more and 35 nm or less by appropriately selecting the height of the concavo-convex pattern formed on the master 6. Or it is controllable in the range of 58 nm or more and 82 nm or less.

  The conductive film forming step, the metal layer forming step, and the peeling step after forming the organic layer are performed in the same manner as in the first embodiment, and the stamper 10a or 10b is completed through these steps.

As described above, according to the second embodiment of the present invention, conventionally, the formation of the metal layer by plating has been difficult or impossible, it is possible to use an inorganic material as a resist. Thereby, for example, it is possible to manufacture a master disk using the property that the inorganic material changes at a certain temperature or higher. Further, by forming the organic layer by a vacuum deposition method, it is possible to manufacture a stamper having a higher concavo-convex pattern than the stamper obtained by the manufacturing method of the first embodiment that employs the spin coating method. It becomes.

(Embodiment 3)
As a third embodiment, a stamper manufacturing method including forming an organic layer on the surface of a master by a vapor deposition polymerization method will be described. The manufacturing method of the third embodiment is the same as the manufacturing method of the first and second embodiments except for the method of forming the organic layer. Therefore, in the following description, in order to avoid duplication of description, differences from Embodiments 1 and 2 will be mainly described with reference to FIGS. 1A to 1F as appropriate.

  In the third embodiment, the exposure process and the development process are the same as those in the first and second embodiments. Therefore, the same master as the master 6 manufactured in the first and second embodiments is manufactured.

  In the organic layer forming step (see FIG. 1C), the organic layer 7 is formed on the master 6 by vapor deposition polymerization. Here, the vapor deposition polymerization method is a kind of vacuum vapor deposition method, and means a method in which one or plural kinds of monomers are vapor-deposited on an object and polymerized at the same time. When multiple types of monomers are co-evaporated, a copolymer layer is formed. The vapor deposition polymerization method makes it possible to form a high-quality polymer thin film, which has been difficult with a normal vacuum vapor deposition method. Therefore, when the organic layer 7 is formed using the vapor deposition polymerization method, the uneven pattern on the master 6 is more faithfully formed on the surface of the organic layer 7 as compared with the normal vacuum vapor deposition method employed in the second embodiment. be able to. In addition, the organic layer formed by the vapor deposition polymerization method is denser than the organic layer formed by the spin coating method and the normal vacuum vapor deposition method, so that the organic layer 7 can be thinned by the vapor deposition polymerization method. The organic material used when the vapor deposition polymerization method is employed is a monomer that produces, for example, polyurea, polyimide, or polyurethane by polymerization.

  The film forming conditions of the vapor deposition polymerization method are not particularly limited as long as a preferable thickness of the organic layer 7 described later can be realized substantially uniformly within the surface of the master 6. The material for vapor deposition polymerization is not limited to the above materials as long as the thickness of the organic layer 7 to be described later can be realized, and another polymer is obtained by selecting an appropriate monomer. You may do it. However, when the organic layer 7 needs to insulate the resist 2 and the conductive film 8, the organic layer needs to be made of an insulating material (most organic materials satisfy this condition). Since the technique for forming the thin film containing polyurea, polyimide, or polyurethane by vapor deposition polymerization has been extensively studied and put into practical use, even in the manufacturing method of Embodiment 3, a layer containing these polymers is not provided. Preferably formed. In particular, polyurea has a relatively slow film formation rate, so that it is easy to form a thin film, and since a polymerization reaction at room temperature is possible, it has a low aggressiveness to resist 2, so a polyurea layer is deposited. Forming by polymerization is particularly suitable for the manufacturing method of the third embodiment.

  Even when the organic layer is formed by vapor deposition polymerization, the thickness of the organic layer 7 needs to satisfy the first condition and the second condition described in the first embodiment. Therefore, when the organic layer was formed by the vapor deposition polymerization method, the thickness range in which these conditions were satisfied was measured.

  First, a procedure for determining a thickness range that satisfies the first condition will be described. As shown in Table 5, two masters having different resist 2 types were prepared. For each master, six types of laminates (12 types in total) with different thicknesses of the organic layer 7 are manufactured, and a conductive film 8 and a metal layer 9 are formed on each laminate, and the conductive film 8 and the metal layer 9 are formed. The stamper which peeled integrally and produced the electrically conductive film 8 was manufactured, and the plating non-defective rate of each stamper was measured. Here, as the resist 2, the same resists A and B as the resist used in the first embodiment were used. In addition, hexamethylene diisocyanate and tetramethylene diamine were co-evaporated and polymerized on the surface of the master 6 so that a layer made of polyurea was formed as the organic layer 7. The method for forming the conductive film 8 and the metal layer 9 and the method for measuring the plating good product rate are as described in connection with the first embodiment. The results are shown in Table 5. As is apparent from Table 5, the plating resistance of any resist is reliably improved when the thickness of the organic layer 7 is 3 nm or more, and the plating resistance is particularly high when the thickness is 10 nm or more.

Next, a thickness range satisfying the second condition was determined. Here, in the same manner as in the first embodiment, two types of masters 6 having a concavo-convex pattern height of 35 nm and 90 nm are prepared, and seven types of organic layers 7 having different thicknesses are prepared using each master 6. Laminated bodies (14 types in total) were manufactured, and the height of the uneven pattern of the organic layer 7 of each laminated body was measured. The results are shown in Table 6. Here, as in the case where the thickness range satisfying the first condition is determined, the organic layer 7 made of polyurea is formed by the vapor deposition polymerization method.

  As is clear from Table 6, the height of the concave / convex pattern decreases as the thickness of the organic layer 7 increases, and the degree of flattening of the concave / convex pattern increases. However, the degree is the same as in the first and second embodiments. It was found to be very small compared. Specifically, it was found that when the thickness of the organic layer was 100 nm or less, the uneven pattern on the master 6 was reflected on the surface of the organic layer 7 and a level with no problem with respect to uniformity was obtained. Further, the height of the uneven pattern on the surface of the organic layer was at a level with no particular problem without depending greatly on the thickness of the organic layer when the thickness of the organic layer 7 was 100 nm or less. Furthermore, from the observation at the visual level, in the organic layer 7 formed by the vapor deposition polymerization method, it is recognized that the uneven pattern of the master 6 is reflected more faithfully not only in the height of the uneven pattern, but also in the uneven shape. It was.

  According to the above measurement results, when the organic layer is formed using the vapor deposition polymerization method, the thickness of the organic layer 7 is preferably 3 nm or more and 100 nm or less, and more preferably 10 nm or more and 100 nm or less. Further, according to the results shown in Table 6, the height of the concavo-convex pattern on the surface of the organic layer 7 is at least in the range of 27 nm to 34 nm by appropriately selecting the height of the concavo-convex pattern formed on the master 6. Alternatively, it can be controlled in the range of 65 nm to 85 nm.

  The conductive film forming step, the metal layer forming step, and the peeling step after forming the organic layer are performed in the same manner as in the first embodiment, and the stamper 10a or 10b is completed through these steps. In general, an organic thin film formed by vapor deposition polymerization is difficult to dissolve in a solvent or the like. If the residue of the organic layer 7 becomes a problem in the stamper 10b with the conductive film, it may be removed by plasma etching or under vacuum. It may be removed by a method of performing a solvent treatment after depolymerization by heat treatment or the like. Further, as described above, the residue of the organic layer 7 can be eliminated or reduced by forming the conductive film 8 by electroless plating.

  As described above, according to the third embodiment of the present invention, it is possible to use an inorganic material as a resist, which has conventionally made it difficult or impossible to form a metal layer by plating. Thereby, for example, it is possible to manufacture a master disk using the property that the inorganic material changes at a certain temperature or higher. Further, by forming the organic layer by the vapor deposition polymerization method, it is possible to manufacture a stamper having a higher concavo-convex pattern than the first and second embodiments.

  The manufacturing method of the present invention may be performed using a recording master other than the configuration shown in FIG. For example, as shown in FIG. 4A, a recording master 20 having a configuration in which a recording auxiliary layer 22 made of a material different from the material constituting the resist 2 is formed between the resist 2 and the substrate 1 is used. You can do it. The recording auxiliary layer 22 is a cross-sectional shape in the thickness direction of a latent image formed on the resist when the resist is made of an inorganic material whose state changes due to a temperature change due to exposure (the cross-sectional shape in this direction is simply referred to as “cross-sectional shape”). To control). The cross-sectional shape of the latent image is controlled by selecting the thermal conductivity of the material constituting the recording auxiliary layer and the thickness of the recording auxiliary layer. A specific cross-section control method will be described with reference to the drawings.

4 (B) to 4 (D), the resist 2 changes its state due to temperature rise when the recording auxiliary layer 22 is formed using a material having a different thermal conductivity with the recording auxiliary layer 22 having a constant thickness. A section, that is, a cross-sectional shape of the latent image 5 is schematically shown. The thermal conductivity of the material constituting the recording auxiliary layer 22 is higher in the order of FIG. 4 (B)> FIG. 4 (C)> FIG. 4 (D). 4B to 4D, it can be seen that the cross-sectional shape of the latent image 5 changes depending on the thermal conductivity of the material constituting the recording auxiliary layer 22. In a recording master in which the recording auxiliary layer is located between the resist and the substrate, when only the thermal conductivity of the material constituting the recording auxiliary layer is changed, the smaller the thermal conductivity, the more the resist is released from the substrate side surface. The amount of heat becomes smaller. That is, as the thermal conductivity of the recording auxiliary layer is smaller, it becomes possible to raise the temperature of the deeper part from the resist surface, so that the state changes from the state changed portion 5 as shown in FIG. The boundary with the unexposed portion has a steeper slope.

  FIGS. 4E and 4F show resists by changing the thickness of the recording auxiliary layer 22 when the recording auxiliary layer 22 is formed of a material whose thermal conductivity is lower than that of the material constituting the substrate 1. 2 schematically shows how the cross-sectional shape of the second latent image 5 changes. In the recording master shown in FIG. 4 (E), the thickness of the recording auxiliary layer 22 is larger, so that the release of heat from the resist 2 to the substrate 1 side is further suppressed, and the state changes from the changed state. The slope of the boundary between the unexposed parts becomes larger. 4 (G) and 4 (H) show the case where the thickness of the recording auxiliary layer 22 is changed when the recording auxiliary layer 22 is formed of a material having a thermal conductivity larger than that of the material constituting the substrate 1. It shows schematically how the image 5 changes. By making the thermal conductivity of the recording auxiliary layer 22 larger than the thermal conductivity of the substrate 1, the inclination of the boundary between the portion where the state has changed and the portion where the state has not changed, compared to the case where the recording auxiliary layer is not provided. Becomes more gradual. Further, the greater the thickness of the recording auxiliary layer 22, the smaller the slope of the boundary between the portion that has changed state and the portion that has not changed state. Note that FIGS. 4B to 4H are schematic views showing a tendency of how the thermal conductivity and thickness of the recording auxiliary layer affect the cross-sectional shape of the latent image of the resist. I want to be. The cross-sectional shape actually obtained is the specific value of the thermal conductivity of the material composing the substrate, the difference between this value and the specific value of the thermal conductivity of the material composing the recording auxiliary layer, the actual recording auxiliary layer It is determined by the thickness etc.

  Alternatively, in the manufacturing method of the present invention, as shown in FIG. 5A, a recording master 30 having a configuration in which the recording auxiliary layer 24 is formed on the resist surface may be used. The cross-sectional shape of the latent image can also be controlled by using the recording master having this configuration. When the recording master having this configuration is used, the recording auxiliary layer 24 is removed after the latent image is formed. In FIG. 5A, reference numeral 26 denotes an external medium (that is, an atmosphere during exposure), which is generally air.

  5B to 5D show the cross-sectional shape of the latent image 5 of the resist 2 in the case where the recording auxiliary layer is formed using a material having different thermal conductivity while the thickness of the recording auxiliary layer 24 is constant. This is shown schematically. The thermal conductivity of the material constituting the recording auxiliary layer 24 is higher in the order of FIG. 5 (B)> FIG. 5 (C)> FIG. 5 (D). 5B to 5D, it can be seen that the cross-sectional shape of the latent image 5 changes depending on the thermal conductivity of the material constituting the recording auxiliary layer 24. If only the thermal conductivity of the material constituting the recording auxiliary layer is changed in the recording master in which the recording auxiliary layer is located on the resist, the heat is more likely to accumulate near the surface of the resist as the thermal conductivity is smaller. That is, the smaller the thermal conductivity of the recording auxiliary layer, the more difficult it is to raise the temperature at a deeper portion from the resist surface. Therefore, as shown in FIG. The boundary will have a gentler slope.

  FIGS. 5E and 5F show that when the recording auxiliary layer 24 is formed of a material whose thermal conductivity is smaller than the thermal conductivity of the external medium 26, the thickness of the recording auxiliary layer 24 is changed. It schematically shows how the cross-sectional shape of the latent image 5 of the resist 2 changes. In the recording master shown in FIG. 5 (E), the thickness of the recording auxiliary layer 24 is larger, so that the release of heat from the surface of the resist 2 is further suppressed, and the state is not changed from the changed portion. The slope of the boundary between the parts becomes smaller.

  FIGS. 5G and 5H show the latent image 5 by changing the thickness of the recording auxiliary layer 24 when the recording auxiliary layer 24 is formed of a material having a thermal conductivity larger than that of the external medium 26. It shows schematically how the cross-sectional shape changes. By making the thermal conductivity of the recording auxiliary layer 24 larger than the thermal conductivity of the external medium 26, the boundary between the portion where the state has changed and the portion where the state has not changed is compared with the case where the recording auxiliary layer is not provided. The slope becomes larger. Further, the greater the thickness of the recording auxiliary layer 24, the larger the slope of the boundary between the part that has changed state and the part that has not changed state.

  In general, the external medium 26 to which the resist 2 is exposed is air having a very low thermal conductivity compared to a solid or liquid. In this case, since it is generally difficult to make the thermal conductivity of the recording auxiliary layer 24 smaller than that of the external medium, the control of the cross-sectional shape of the latent image is realized as shown in FIGS. The However, when a liquid is used as the external medium 26, such as original recording by an LIL (immersion lens method), the control of the cross-sectional shape of the latent image 5 is shown in any of FIGS. Is also feasible. As described above, even when the recording auxiliary layer is provided on the resist, the distribution of the portion 5 whose state has changed due to the temperature rise during recording can be changed by changing the thickness of the recording auxiliary layer 24. I understand. 5B to 5H are schematic diagrams showing the tendency of how the thermal conductivity and thickness of the recording auxiliary layer affect the cross-sectional shape of the latent image of the resist. Please note that. The actual cross-sectional shape is the specific value of the thermal conductivity of the material constituting the external medium, the difference between this value and the specific value of the thermal conductivity of the material constituting the recording auxiliary layer, It is determined by the actual thickness.

  Alternatively, in the manufacturing method of the present invention, as shown in FIG. 6, a recording master 40 having a configuration in which recording auxiliary layers 22 and 24 are formed on both sides of the resist 2 may be used. The cross-sectional shape of the latent image can also be controlled by using the recording master having this configuration. Also in the case of using the recording master having this configuration, the recording auxiliary layer 24 is removed after the latent image is formed.

4 to 6, the recording auxiliary layers 22 and 24 include, for example, selenides such as ZnSe, Si—O, Ge—O, Al—O, Zn—O, YO, La, and the like. —O, Ti—O, Zr—O, Hf—O, Nb—O, Ta—O, Cr—O, Mo—O, W—O, Sn—O, In—O, Sb—O, and Bi— O oxide, Si-N, Ge-N, Al-N, Zn-N, Ti-N, Zr-N, Hf-N, Nb-N, Ta-N, Cr-N, Mo-N, Nitrides such as W-N, Sn-N, and In-N, Si-O-N, Ge-ON, Al-O-N, Ti-ON, Zr-ON, Hf-O Nitrogen oxides such as —N, Nb—O—N, Ta—O—N, Cr—O—N, Mo—O—N, W—O—N, Sn—O—N, and In—O—N , Ge-C, Cr-C, S -C, Al-C, Ti-C, Zr-C, and carbides such as Ta-C, Si-F, Al-F, Mg-F, Ca-F, and fluorides such as LaF, and ZnS and SiO One or a plurality of materials selected from the group consisting of ₂ or a mixture thereof may be formed by forming a film using a sputtering method or a vapor deposition method. Alternatively, the recording auxiliary layer may be formed of an organic material, for example, a layer made of an acrylic resin, an epoxy resin, or a mixture thereof. The recording auxiliary layer made of a resin material is formed, for example, by a method of forming a film by spin coating. 5 and FIG. 6, the recording auxiliary layer formed on the resist may be a liquid. Specifically, the cross-sectional shape of the latent image can also be controlled by performing exposure in a state where a liquid serving as a recording auxiliary layer is disposed (for example, applied) or in a state where the recording master is immersed in the liquid. Can do.

  4 to 6, the recording auxiliary layers 22 and 24 may serve to increase the light absorption rate at the wavelength of light used for resist exposure. Specifically, in consideration of optical effects (for example, reflection and interference effects) between the substrate, the recording auxiliary layer, and the resist, the optical constants of the materials constituting the recording auxiliary layer and the thickness of the recording auxiliary layer By selecting, the light absorption rate of the resist can be improved.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments. It should be understood that these forms may be appropriately changed without departing from the scope of the present invention.

  The stamper manufacturing method of the present invention makes it possible to form a metal layer by plating using a master having a resist made of an inorganic material. A resist made of an inorganic material has a property of changing a phase by, for example, a temperature rise caused by exposure, and thus is suitable for forming a fine uneven pattern on a master. Therefore, the stamper manufactured by the method is required to have a fine uneven pattern, for example, an optical information recording medium for recording and / or reproducing a signal using light having a short wavelength such as blue laser light. Suitable for manufacturing.

(A)-(F) are the elevational sectional views of the stamper of the optical information recording medium or its material, and show the stamper manufacturing method of the optical information recording medium according to the present invention. FIG. 2 is a schematic elevation view of an exposure apparatus that exposes a recording master with recording light. It is an elevational sectional view of a master in which an organic layer is formed on a concavo-convex pattern. (A) is sectional drawing of an example of the recording original disc used with the stamper manufacturing method of this invention, (B)-(H) is sectional drawing of the recording original disc after exposure, respectively. (A) is sectional drawing of the other example of the recording original disc used with the stamper manufacturing method of this invention, (B)-(H) is sectional drawing of the recording original disc after exposure, respectively. It is sectional drawing of another example of the recording original disc used with the stamper manufacturing method of this invention. (A) to (E) are elevational sectional views of a stamper of an optical information recording medium or a material thereof, and show a conventional method for manufacturing a stamper of an optical information recording medium.

Explanation of symbols

1 substrate, 2 resist, 3 recording master, 4 recording light, 5 latent image, 6 master, 7 organic layer, 8 conductive film, 9 metal layer, 10a stamper, 10b stamper, 11 turntable, 12 light source, 14 lens, 15 Recording head, 20 recording master, 22 recording auxiliary layer, 24 recording auxiliary layer, 26 external medium, 30 recording master, 40 recording master, 101 substrate, 102 resist, 103 recording master, 104 recording light, 105 latent image, 106 master, 107 conductive film, 108 metal layer, 109a stamper, 109b stamper.

Claims (6)

Look-containing inorganic material is a heat sensitive material which changes state by a temperature change due to exposure, the resist layer formed on a substrate, by exposure and development, a first step of producing a master having a concavo-convex pattern,
A second step of forming an organic layer having a thickness of 5 nm to 60 nm on the concavo-convex pattern by a spin coating method ;
A third step of forming a conductive film on the organic layer ;
A fourth step of forming a metal layer on the conductive film by plating ;
The metal layer alone, or method of a stamper for an optical information recording medium having a concavo-convex pattern comprising a fifth step of removing the metal layer and the conductive film from the master. 2. The method for producing a stamper for an optical information recording medium according to claim 1 , wherein the organic layer comprises a phenol resin, an acrylic resin, or a styrene resin. The organic layer is a stamper manufacturing method of the optical information recording medium according to claim 1 or 2, characterized in that a photoresist whose main component is a phenolic resin or an acrylic resin. Method for producing a stamper of an optical information recording medium according to any one of claims 1 to 3, characterized in that a thickness of 15nm or more 40nm or less of the organic layer. Method for producing a stamper of an optical information recording medium according to any one of claims 1 to 4, characterized in that the height of the concavo-convex pattern with 12nm or 85nm or less of the stamper. Method for producing a stamper of an optical information recording medium according to any one of claims 1 to 5, characterized in that formed by electroless plating the conductive film.

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