JP4094567B2 - Wiring board using aligned conductive wires - Google Patents

Description

  The present invention relates to a wiring board using aligned conductive wires that can cope with electronic components such as electronic devices becoming lighter, thinner and smaller year by year, and accordingly, a wiring pattern is becoming finer.

A conventional wiring pattern is formed by an etching method or a plating method.
In addition, the wiring in which the wiring pattern is formed of the conductive paste is improved by reducing the increase in pitch, so that the wiring can be reduced. A conductive pattern formed by printing, a wire, and a thread-like material, the wire is formed of a conductive wire, and the wire and the thread-like material are stitched to the film-like base material, There exists a flexible wiring board (see Patent Document 1) characterized in that the wiring is formed by the above method.
Japanese Patent Publication No. 2002-252432 (paragraphs {0003}, {0004} {0011} to {0024}, FIG. 1 and FIG. 3 in the claims and detailed description of the invention)

However, when the wiring pattern is formed by an etching method or a plating method, the finer the wiring, the more the etching, the application of a photosensitive agent as a plating resist, exposure, development, and the pattern formation process by the etching method or the plating method Becomes complicated and difficult. Moreover, what was shown by the said patent publication 2002-252432 which is the said prior art is the flexible wiring board which formed the wiring by the wire material and the thread-like material which were formed with the lead wire, and was sewn on the film-like base material. is there. However, this conventional flexible wiring board is formed of an insulating thread-like material that is more flexible than the wire, and can be sewn to the film-like substrate without difficulty, making the wire less difficult to break. There is a problem in that it is indispensable to sew together, requires many steps to produce, and is difficult.
On the other hand, the wiring board using the aligned conductive wire according to the present invention is formed by aligning the conductive lines or changing the pitch by curving the whole, and mounting the electronic component, Do not use chemicals. Moreover, there is no short circuit problem if the coated wire is used as the conductive wire. Since the conductive wire uses a reel winding, disconnection can be prevented. When electronic components are mounted on the aligned conductive wires, ultrasonic waves are directly applied to the conductive wires, and metal bonding between the conductive wires and the contacts of the electronic components can be performed. In addition, soldering and bonding with conductive paste can be connected by entangled conductive wires, so that the connection is strong, and in the case of conductive wires, such as copper wires, the wire diameter is 20 to 35 μm ^φ. Even if the resin is applied, the wire diameter is 30 to 50 μm ^φ , which is the same as the thickness of a general substrate insulator. In addition, since the alignment of the conductive wires is very flexible, it is extremely easy to manufacture, and the support of the wires aligned with the conductive wires is spaced to provide insulation that is hardly affected by the support. A wiring board using aligned conductive wires is provided.

A first invention of the present invention for solving the above-described problems is a wiring board using aligned conductive wires as described in claim 1, and is as follows.
The conductive wire of a wire diameter 20～35Myuemu ^phi is one single draw aligned with a single line parallel to the support entwined with the photosensitive agent is an insulating material, and further exposure and development, the exposed and developed to connect external conductive In this configuration, the formed opening is formed so as to penetrate vertically, and a wiring pattern is formed.

Since the wiring board using the aligned conductive wires according to the present invention is configured as described above, the following effects can be obtained.
(1) By using the argument can align conductive lines in parallel, etching, without the resist photosensitive agent used in the processing of plating, reliable wiring pattern can be easily formed.
(2) Since the conductive wiring board is formed by aligning the conductive wires or changing the pitch by curving the whole and mounting the electronic components, no chemicals are used, so it is environmentally friendly with no pollution. is there.
(3) If the coated wire is used as the conductive wire, there is no problem of short circuit, and since the conductive wire uses the reel winding, disconnection can be prevented in advance. As a result, the inspection is simplified.
(4) When electronic components are mounted on the aligned conductive wires, ultrasonic waves are directly applied to the conductive wires, and metal bonding between the conductive wires and the contacts of the electronic components can be performed. Also, soldering and joining with conductive paste are strong because they can be connected by entangled conductive wires.
(5) conductive lines, in the case of, for example, copper wire, a wire diameter 20～35Myuemu ^phi, the epoxy resin also wire diameter 30 to 50 [mu] m ^phi is applied thereto, similarly to the thickness of the common substrate of the insulator It is. In addition, the alignment of the conductive wires is very flexible and therefore very easy to manufacture.
(6) The insulating support that is hardly affected by the support can be obtained by spacing the support of the aligned conductive wires.

  Conductive lines are aligned in parallel, or the entire line is curved and the pitch is changed, exposing and developing a photosensitive agent that is an insulator, forming openings that are conductively connected to the outside, forming a wiring pattern, A wiring board is formed by mounting electronic components.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a first embodiment of a wiring board using aligned conductive lines according to the present invention. FIG. 2 is a plan view of a wiring board formed with an insulator, and FIG. 2 shows the aligned conductive lines. (A) Plan view, (b) Front view, (c) Side view of a wiring board on which an IC chip showing a second embodiment of the used wiring board is mounted, FIG. 3 shows a multi-contact IC of the third embodiment. 4 is a plan view showing a wiring board on which a chip is mounted. FIG. 4 is a plan view showing a rigid-flexible board using a wiring board using aligned conductive wires in the fourth embodiment. FIG. 5 is a front view showing an embodiment in which the aligned conductive wires are formed in two layers, and FIG. 6 is a plan view showing a wiring board using the conductive wires aligned in parallel connected to the printed wiring board. Fig. 7 shows a circular (bent) shape, with the tip and tip being shifted and connected, (A) Plan view, (B) Direct connection diagram showing wiring board using electric wires, FIG. 8 shows that electronic parts are mounted on conductive wires arranged in parallel formed in a state where various connections are made with an IC chip. 9 is a plan view of a wiring board. FIG. 9 is an enlarged view of an IC chip having connection bumps with external wiring, in which a wiring pattern is formed by aligning conductive lines arranged in parallel with the shape of a chip such as an IC chip on a silicon wafer. FIG. 10 is a schematic perspective view showing an embodiment of a manufacturing apparatus for forming conductive wires arranged in parallel.

Hereinafter, based on FIGS. 1-3, a detail is demonstrated concretely about the 1st Example of the wiring board using the alignment conductive line.
First, the application of the present invention will be described. A wiring board using aligned conductive wires is a substitute for a conventional printed wiring board. Examples that can make use of the characteristics include rigid / flexible boards, rigid / flexible / rigid boards, inner layers of multilayer wiring boards, antenna windings, coil windings, chip-mounted antennas, wiring boards for conductivity testing, interposer chip-mounted interposers, jumpers Wiring board, flat cable wiring for substituting bonding wire and lead frame, photovoltaic panel wiring, wiring board with built-in components, wiring board for package, pitch changing expansion wiring board, 3D antenna / coil winding, BGA (ball grid array) Connection wiring, connection wiring for multistage BGA (ball grid array), anisotropic conductive connection substrate, elastic substrate for inspection, COF (chip on film), COG (chip on glass), ACF (laminated and sliced anisotropic conductivity) Film) and the like.

  Next, the wires of the aligned conductive wires are mainly copper / aluminum wires. Depending on the application, the metal wire is plated with tin, silver, gold, etc. and subjected to surface treatment by plasma processing. By performing processing such as metal surface treatment for imparting electrical conductivity to chemical fibers, plating, etc., flexible aligned conductive wires can be formed.

The fixed conductive wires can be fixed using copper wire as the warp, mesh type woven with chemical fibers that are non-conductive to the weft, or non-conductive resin and paste instead of the weft. Also, it is fixed by applying, exposing and developing using photosensitive epoxy resin and imide resin. A non-conductive resin is formed by screen printing, ink-jet, forming a pattern on the alignment line, and fixing with a pattern. There is also a method of forming a fine pattern with a photosensitive resin and fixing it. Furthermore, you may affix on a non-conductive board | substrate with a double-sided tape or an adhesive agent.
Note that the alignment line can be a three-dimensional wiring instead of a flat wiring. It is conceivable that non-conducting wires are inserted for reinforcement / insulation at some intervals in the aligned conductive wires. In addition, the aligned conductive wires can be changed or expanded in pitch using claws and ribs, or can be attached to a mount in a curved line.

Conductive connection between the aligned conductive wire and the IC chip / printed circuit board is a method using ACF (anisotropic conductive film), conductive adhesive, solder paste, tin / copper alloy plating on the aligned wire, laser light There are also melting connections, gold plating, and ultrasonic connection between metals. Then, a screen printing / photosensitive agent pattern is formed on the aligned conductive lines, and an exposed portion of the aligned lines is plated to form a conductive pattern.
In addition, various types, such as a dry film type, a liquid type, a permanent resist type, a peeling type, a negative type, and a positive type, can be used as the photosensitive agent according to the application.

  As for those using aligned conductive lines, anisotropic conductive patterns using aligned conductive lines are elastic and can be used for BGA (ball grid array) and substrate connection and BGA (ball grid array) electrical inspection. Use. In addition, the aligned conductive wires are overlapped in the parallel direction and the perpendicular direction and used as a multilayer wiring board. In addition, a plating resist is formed with a photosensitive agent which is an insulator 2 on the upper and lower sides of each alignment line on each alignment conductive line, bumps are formed by plating, and flexible printed circuit boards and electronic parts Can be used for connection.

Here, specific examples will be described sequentially from FIG.
The embodiment shown in FIG. 1 is a wiring board in which a pattern is formed of an insulator. Reference numeral 1 is a line in which conductive lines such as copper wires are arranged in parallel, and an epoxy that maintains the arrangement of the arranged lines 1. A wiring board in which a pattern is formed by the insulator 2 by forming an opening 2 corresponding to the wiring pattern and an insulator 2 such as a resin.
The embodiment shown in FIGS. 2 (a), (b), and (c) is a wiring board on which an IC chip is mounted, and the IC chip 5 is joined to an external pattern on a line 1 in which conductive wires such as copper wires are arranged in parallel. A portion 4 is joined by a portion 6, and a cut portion 4 is formed on a line 1 that is aligned with two joint portions 6 sandwiched between two external patterns. In addition, 7 shows various connection parts, such as solder, a conductive agent, and an ultrasonic wave.
The embodiment shown in FIG. 3 is a wiring board on which a multi-contact IC chip 15 is mounted, and the line 1 aligned as in the embodiment described with reference to FIG. A wiring board on which a multi-contact IC chip is mounted is formed by bonding at the portion 7.
The embodiment shown in FIG. 4 shows a rigid flexible substrate in which a rigid substrate 16 is connected to both ends of a wire 1 in which conductive wires are arranged in parallel via a fixing insulator (insulating film) 26. .
The embodiment shown in FIG. 5 shows a line 1 in which conductive lines are arranged in parallel to form two layers through an insulating layer 17.
The embodiment shown in FIG. 6 shows a structure in which a printed wiring board is connected to a wiring board in which conductive wires are arranged in parallel and fixed with a fixing paste 12 which is an insulator 2.
In the embodiment shown in FIGS. 7 (a) and 7 (b), the conductive wire is formed in a substantially circular shape (there is no need for a circular shape since all the bent portions are present), and the tip and the tip are arranged as shown in the figure. The wiring board connected by shifting this line is shown.
In the embodiment shown in FIG. 8, the line 1 obtained by arranging the conductive wires formed in a state where the IC chip 5 and various connections are combined in parallel is cut by the cutting portion 4 and connected by the various connecting portions 7. A wiring board on which a plurality of IC chips 5 are mounted is shown.
In addition, the line 1 which aligned the line 1 with the fixing paste 12 which is the insulator 2 is maintaining the parallel state.
The embodiment shown in FIG. 9 has a connection bump 19 with an external wiring in which a wiring pattern is formed by matching the line 1 in which conductive lines are arranged in parallel with the shape of the IC chip 5 on the silicon wafer 18. Show.
What was shown in FIG. 10 is one Example of the manufacturing apparatus which forms the conductive wire arranged in parallel of this invention. The embodiment will be described. In order to align the metal wires in parallel, the metal wires are drawn out from the metal wire roll 20 in which the conductive wires are wound in a roll shape through a guide or the like so as to be parallel and parallel. It is made to be able to. The metal wire drawn from the metal wire roll 20 is covered with a dry film 21 and fixed in a state of being aligned in parallel by a laminating unit 22, and then paralleled through an exposure unit 23, a developing unit 24, and an outer shape processing unit 25. A wiring pattern is formed with the conductive wires aligned to each other.

  It can be used for various wiring boards, and can also be used for flat and three-dimensional ones.

It is a top view which shows the wiring board which formed the pattern with the insulator which shows the 1st Example of the wiring board using the alignment conductive wire which concerns on this invention. It is (a) top view, (b) front view, and (c) side view showing a wiring board on which an IC chip showing a second embodiment of a wiring board using aligned conductive wires is mounted. It is a top view which shows the wiring board carrying the multi-contact IC chip of 3rd Example. It is the (a) top view and (b) front view which show a rigid flexible board | substrate using the wiring board using the alignment conductive line of 4th Example. It is sectional drawing which shows the Example which made the drawn line into 2 layers. It is a wiring board figure using the line which arranged the conductive line connected with the printed wiring board in parallel. FIG. 2A is a plan view and FIG. 2B is a direct connection diagram showing a wiring board using a circular shape (bent shape) and using wires in which conductive wires connecting the tips are arranged in parallel. It is a top view of the wiring board which mounted the electronic component in the line | wire which arranged the conductive wire formed in the state which compounded the IC chip and various connections in parallel. It is a top view which expands and shows the IC chip which has a connection pattern with the external wiring which formed the wiring pattern according to the shape of chips, such as an IC chip on a silicon wafer, and the conductive line arranged in parallel. It is a schematic perspective view which shows one Example of the manufacturing apparatus which forms the conductive wire arranged in parallel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 .... Alignment line 2 .... Insulator 3 .... Opening part 4 .... Cutting part 5 .... IC chip 6 .... Joint part 7 .... Various types Connection part 8... Extended alignment line 9... Connection part 10... Printed wiring board 11. Wire 14 ... Direct connection 15 ... Multi-contact IC chip 16 ... Rigid substrate 17 ... Insulating layer 18 ... Silicon wafer 19 ... Connection bump 20 ... ····································································································· Development portion

Claims (1)

The conductive wire of a wire diameter 20～35Myuemu ^phi is one single draw aligned with a single line parallel to the support entwined with the photosensitive agent is an insulating material, and further exposure and development, the exposed and developed to connect external conductive A wiring board characterized in that a wiring pattern is formed by forming openings formed vertically through the formed wiring.

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