JP5083300B2 - Wiring substrate for semiconductor device and semiconductor device using the same - Google Patents

Description

  The present invention relates to a wiring board for a semiconductor device used as one of components constituting, for example, a liquid crystal display device and a semiconductor device using the same.

  In general, a wiring board for a semiconductor device called a COF tape, a TCP tape, or the like is connected to an electrode terminal of a semiconductor element 3 on a substrate 2 made of polyimide tape or the like (see FIG. 6). (Not shown) and a wiring 5 having a connection terminal 4 connected to an external device such as a liquid crystal display device is formed. COF is an abbreviation for Chip On Film, and TCP is an abbreviation for Tape Carrier Package. Both are commonly used to describe the structure or form of a semiconductor device.

  In addition, the wiring of wiring boards for semiconductor devices is becoming increasingly finer (finer) in conjunction with higher functionality and higher integration of semiconductor elements. In general, a method of forming a wiring by photoetching a copper foil previously provided on a substrate (photoetching method) is employed.

  With regard to miniaturization (fineness) of wiring, since the wiring width becomes smaller and the wiring pitch becomes smaller, defects on the wiring that are likely to cause disconnection and short circuit (electrical short circuit) are likely to occur. It has been a problem. Therefore, it is necessary to pay close attention to the presence of such disconnections and wiring defects. Further, since the pitch between the terminals of the connection terminals provided in each wiring is also reduced, for example, it is naturally difficult to join the electrode pads of the semiconductor element and the connection terminals. In particular, it becomes difficult to join the two in the correct position.

  In consideration of this point, in the wiring board 1 for a semiconductor device shown in FIG. 6, the test pad 7 is formed by drawing the wiring 5 to the area outside the product area 6, and this test pad 7 is used in the manufacturing process. Thus, the wiring 5 of the semiconductor device wiring board 1 is configured to be inspected for the disconnection or the presence or absence of defects. The product area 6 is an area on the semiconductor device wiring substrate 1 which is partitioned so as to obtain individual semiconductor devices for each piece by finally cutting along the cutting line 8. . The test pad 7 is formed in a relatively large area corresponding to the size of a probe (inspection contact needle) of an inspection apparatus described later. This also means that the width of the original wiring 5 drawn to form the test pad 7 is so small. In addition, the surface of the wiring 5 in the product area 6 is generally provided with a solder resist (SR) insulating film 9 made of an insulating organic material in a region excluding the connection terminal portion for the purpose of insulating and protecting the wiring. Is painted and formed.

  Here, the above-described inspection for the wiring board 1 for a semiconductor device is performed by first using the test pad 7 in the state of the wiring board 1 for the semiconductor device before bonding and mounting the semiconductor element 3 in FIG. An electrical inspection (OS test) is performed in which a probe (inspection contact needle) of an inspection apparatus (not shown) is inspected for the presence or absence of disconnection or short circuit. Next, in the state of FIG. 6 in which the semiconductor element 3 is bonded and mounted on the wiring board 1 for semiconductor device, whether the semiconductor element 3 is correctly bonded in the same manner using the test pad 7 (semiconductor element 3 Conduct an electrical sorting test (final test) to check whether or not is functioning normally.

  Then, after finishing the OS test and the final test, respectively, at the final stage, the semiconductor device wiring board 1 is cut along the cutting line 8 of the product area 6 by using a punching means such as a press. Individual semiconductor devices are obtained for each piece. In this individualized semiconductor device, an external device such as a liquid crystal display device is connected to the connection terminal 4 of the right wiring having a small wiring width (in FIG. 6). Further, another printed circuit board (PCB) on which an electronic circuit such as a power source is mounted is connected to the connection terminal 13 of the left wiring (in FIG. 6) having a relatively large wiring width. FIG. 7 is an enlarged view of part A in FIG.

  On the other hand, in Patent Document 1 which is a prior art document, although the expression is somewhat different, a connection terminal connected to an electrode terminal of a semiconductor element and a connection terminal connected to an external device such as a liquid crystal display device are provided on a substrate. A wiring board for a semiconductor device formed by forming the wiring provided is described. This wiring board for a semiconductor device uses an adhesive film containing an anisotropic conductive material or an adhesive paste containing an anisotropic conductive material to bond and mount a semiconductor element on a connection terminal connected to the electrode terminal of the semiconductor element. In addition, such an adhesive is provided only in a region inside a planned cutting line indicating a product area of the wiring board for a semiconductor device. Further, in this Patent Document 1, since the adhesive is limited and provided, the adhesive is not provided on the planned cutting line indicating the product area. Therefore, for the semiconductor device along the planned cutting line. It is described that when a wiring board is cut, there are no problems such as peeling of the wiring due to the presence of an adhesive or bending of the cut portion as in the conventional case.

JP 2005-93535 A

  According to the conventional wiring board for a semiconductor device, after completing the OS test and the final test, in order to obtain a semiconductor device that is individualized for each piece in the final stage, the semiconductor along the cutting line in the product area The device wiring board is cut, and at the time of the cutting, a part of the wiring drawn to the area outside the product area in order to form the test pad is cut at the same time. As a result, there is a problem that metal burrs are generated from the cut ends of the wiring, and metal foreign matter is generated due to peeling of the metal burrs. Needless to say, metallic foreign objects are easily scattered. As a result, there is a problem that a short circuit occurs between adjacent wires due to metal burrs or metal foreign objects. In addition, the positional deviation (displacement in the width direction of the wiring) at the time of joining and mounting between the wiring of the wiring board for the semiconductor device and the wiring of the external device such as a liquid crystal display device, which are connected to each other, Therefore, there is a problem that the occurrence of a short circuit due to a metal burr or a metal foreign object is promoted. In addition, when an anisotropic conductive film (ACF) containing conductive particles is used as a bonding material for bonding / mounting, there is a problem that a metal burr or a metal foreign object induces a short circuit through the conductive particles. is there.

  FIG. 8 shows an embodiment of a metal burr generated at the cut end of the wiring. According to this figure, it can be seen that when the metal burr 14 is generated, a short circuit due to the metal burr 14 is likely to occur between the adjacent wirings 5. As a countermeasure, as shown in FIG. 9, a so-called constriction 12 is formed, in which the portion 10 of the wiring 5 of the semiconductor device wiring substrate 1 that intersects the cutting line 8 of the product area 6 is locally narrowed. There is a method of forming. However, according to this method, if the width of the original wiring 5 is small, the width of the wiring 5 is further reduced by forming the constriction 12, and therefore when the wiring 5 of the constriction 12 portion is cut, FIG. As shown in FIG. 10, another problem occurs that the end 15 of the cut wiring 5 is easily rolled up and peeled off. As a result, the end 15 of the wiring 5 acts in the same manner as the metal burr 14, thereby causing a problem that a short circuit is likely to occur between adjacent wirings 5. After all, the method of forming this constriction 12 is insufficient as a countermeasure against a short circuit.

  On the other hand, the semiconductor device wiring board described in Patent Document 1 is due to the presence of an adhesive that is easily sticky when the semiconductor device wiring board is cut along a planned cutting line indicating a product area. In order to prevent the occurrence of problems such as peeling of the wiring or bending of the cut portion, such an adhesive is provided only in the region inside the planned cutting line. . In other words, the semiconductor device wiring board is cut cleanly along the planned cutting line. Patent Document 1 only describes the problems and countermeasures of such an adhesive.

  Therefore, the object of the present invention is to suppress the generation of metal burrs and metal foreign objects from the cut end of the wiring when cutting the wiring board for the conductor device along the cutting line of the product area. An object of the present invention is to provide a wiring board for a semiconductor device and a semiconductor device using the same which can suppress occurrence of a short circuit between adjacent wirings.

In order to achieve the above object, the invention according to claim 1 forms a wiring having a connection terminal connected to an electrode terminal of a semiconductor element and a connection terminal connected to an external device such as a liquid crystal display device on a substrate. A wiring board for a semiconductor device having a product area partitioned so as to obtain an individual semiconductor device by cutting along the cutting line, and the wiring to an area outside the product area And forming a test pad, and forming a solder resist film made of an organic material on the wiring at a portion intersecting with the cutting line in the product area. I will provide a.

  According to this wiring board for a semiconductor device, by adopting the above configuration, in particular, the wiring is drawn out to an area outside the product area to form a test pad, and at the portion intersecting the cutting line in the product area By forming a film made of an organic material on the wiring, metal burrs and foreign objects are generated from the cut end of the wiring when cutting the wiring board for the conductor device along the cutting line in the product area. It can suppress, and it can suppress that a short circuit generate | occur | produces between adjacent wiring by this.

  According to a second aspect of the present invention, there is provided the wiring board for a semiconductor device according to the first aspect, wherein the film is also formed on the substrate between the wirings at a portion intersecting the cutting line. To do.

  According to this wiring board for a semiconductor device, in addition to the above effects, the film can be formed as a continuous film in the form of stripes by adopting the above-described configuration. An apparatus wiring board can be advantageously manufactured.

  According to this wiring board for a semiconductor device, in addition to the above-described effect, the above-described suppression effect can be achieved by adopting the above-described configuration, that is, by using a solder resist generally used for insulating and protecting the wiring as the film. Can be definitely obtained. Further, since the film can be formed simultaneously with the formation of a solder resist film generally used for insulating and protecting the wiring, from this point of view, it is advantageous to manufacture a wiring substrate for a semiconductor device. Can do.

According to a third aspect of the present invention, there is provided the wiring board for a semiconductor device according to the first or second aspect, wherein the wiring at a portion intersecting with the cutting line of the product area is locally thinned. provide.

  According to this wiring board for a semiconductor device, in addition to the above effect, the same effect can be obtained even when a so-called constriction is formed by adopting the above configuration. In addition, since the interval between adjacent wires is widened at the constricted portion, it is difficult to cause a short circuit due to a metal burr or a metal foreign object. Therefore, by devising the degree of the constriction, that is, the end of the cut wire is curled. The above-described effect can be further improved by preventing the material from rising or peeling off.

According to a fourth aspect of the present invention, there is provided a semiconductor device comprising a semiconductor element mounted on the semiconductor device wiring substrate according to any one of the first to third aspects, and cut along the cutting line.

  According to this semiconductor device, in addition to the above-described effects, a semiconductor device in which electrical failure due to a short circuit hardly occurs is obtained by adopting the above-described configuration, that is, by using a wiring board for a conductor device in which the occurrence of a short circuit is suppressed. be able to.

  According to the wiring board for a semiconductor device and the semiconductor device using the same according to the present invention, when the wiring board for a conductor device is cut along the cutting line in the product area, a metal burr or a metal foreign matter is generated from the cut end of the wiring. This can suppress the occurrence of a short circuit between adjacent wirings. In addition, by using a semiconductor device wiring board in which occurrence of a short circuit is suppressed, a semiconductor device in which an electrical failure due to a short circuit hardly occurs can be obtained.

It is explanatory drawing of the wiring board for semiconductor devices which concerns on one embodiment of this invention. It is the figure which expanded the A section (elliptical dotted line part) of FIG. In FIG. 2, it is explanatory drawing which shows the state which cut | disconnected the wiring board for semiconductor devices along the cutting line of a product area. It is explanatory drawing about the wiring board for semiconductor devices which concerns on other embodiment of this invention, Comprising: It is an enlarged view equivalent to FIG. In FIG. 4, it is explanatory drawing which shows the state which cut | disconnected the wiring board for semiconductor devices along the cutting line of a product area. It is explanatory drawing of the conventional wiring board for semiconductor devices. It is the figure which expanded the A section (elliptical dotted line part) of FIG. In FIG. 7, it is explanatory drawing which shows the state which cut | disconnected the wiring board for semiconductor devices along the cutting line of a product area. It is explanatory drawing which concerns on the other conventional wiring board for semiconductor devices, Comprising: It is the A section enlarged view of FIG. In FIG. 9, it is explanatory drawing which shows the state which cut | disconnected the wiring board for semiconductor devices along the cutting line of a product area.

  Hereinafter, preferred embodiments of the present invention will be described with reference to FIGS. Note that members and parts having the same names as those of the conventional technology will be described with the same reference numerals.

  As described above, FIG. 1 is an explanatory diagram of a wiring board for a semiconductor device according to an embodiment of the present invention. The basic configuration of the semiconductor device wiring substrate 1 is the same as that shown in FIG. That is, the semiconductor device wiring substrate 1 is connected to a connection terminal (not shown) connected to the electrode terminal of the semiconductor element 3 and an external device such as a liquid crystal display device on a substrate 2 made of, for example, polyimide tape. The wiring 5 provided with the connection terminal 4 is formed and configured. Further, the semiconductor device wiring board 1 forms a test pad 7 by drawing the wiring 5 to an area outside the product area 6, and uses the test pad 7 in the manufacturing process to make the semiconductor device wiring board 1. The wiring 5 is configured to be inspected for the disconnection, the presence or absence of defects, and the like. The pitch of the wiring 5 is about 30 μm, and the width of the wiring 5 is formed smaller than that.

  The product area 6 is an area on the semiconductor device wiring substrate 1 which is partitioned so as to obtain individual semiconductor devices for each piece by finally cutting along the cutting line 8. . The test pad 7 is formed in a relatively large area corresponding to the size of a probe (inspection contact needle) of an inspection apparatus (not shown). Further, on the surface of the wiring 5 in the product area 6, a solder resist (SR) insulating film 9 made of an insulating organic material is provided in an area excluding the connection terminal portion for the purpose of insulating and protecting the wiring. Painted and formed by printing.

  Here, in the wiring substrate 1 for a semiconductor device according to the present embodiment, a solder resist (SR) made of the same material as the insulating film 9 is formed on the wiring 5 in the portion 10 intersecting the cutting line 8 in the product area 6. The coating 11 is applied and formed by printing at the same time as the formation of the insulating film 9. Further, the coating 11 is formed in a stripe shape with a certain length along the cutting line 8 so as to continue the portion 10 of the plurality of wirings 5. By doing in this way, the membrane | film | coat 11 can be formed efficiently. In this embodiment, the solder resist (SR) is used as the film 11 for forming the film 11, but instead of this, a polyimide film which is usually used as a cover film for electronic parts can also be used. .

  FIG. 2 is an enlarged view of part A of FIG. FIG. 3 is an explanatory diagram showing a state in which the wiring board for a semiconductor device is cut along the cutting line in the product area in FIG. In FIG. 2, when the semiconductor device wiring board 1 is cut, punching means such as a press (not shown) is used. 3, according to the present embodiment, when the wiring board 1 for a conductor device is cut along the cutting line 8 in the product area 6, metal burrs and metal foreign matter are generated from the cut end of the wiring 5. It can be seen that the occurrence of a short circuit between adjacent wirings 5 can be suppressed.

  Next, FIG. 4 is an explanatory view of a wiring board for a semiconductor device according to another embodiment of the present invention, and is an enlarged view of part A of FIG. FIG. 5 is an explanatory view showing a state in which the semiconductor device wiring board is cut along the cutting line in the product area in FIG. In the semiconductor device wiring substrate 1 of this embodiment, the wiring 5 of the portion 10 intersecting with the cutting line 8 of the product area 6 is locally narrowed to form a so-called constriction 12. The rest of the configuration is the same as in the first embodiment. When the semiconductor device wiring board 1 is cut along the cutting line 8 in the product area 6, a punching means such as a press is also used. According to FIG. 5, it can be seen that according to this embodiment, the same effect as described above can be obtained even when the so-called constriction 12 is formed.

  Needless to say, the present invention is not limited to the above-described embodiments, and various embodiments can be adopted within the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Wiring board for semiconductor devices 2 Board | substrate 3 Semiconductor element 4, 13 Connection terminal 5 Wiring 6 Product area 7 Test pad 8 Cutting line 9 Insulating film 10 Part 11 Film 12 Constriction 14 Metal burr
15 edge

Claims (4)

A wiring board for a semiconductor device, wherein a wiring having a connection terminal connected to an electrode terminal of a semiconductor element and a connection terminal connected to an external device such as a liquid crystal display device is formed on the substrate. A product area which is partitioned so as to obtain individual semiconductor devices by cutting along a cutting line, and the wiring is drawn to an area outside the product area to form a test pad; A wiring board for a semiconductor device, wherein a solder resist film made of an organic material is formed on the wiring at a portion intersecting with the cutting line.   The wiring substrate for a semiconductor device according to claim 1, wherein the film is also formed on the substrate between the wirings at a portion intersecting the cutting line. Wherein the wiring portion intersecting the cutting line, the wiring substrate for a semiconductor device according to claim 1 or 2, characterized by being locally formed thinner in the product area. In any of the semiconductor device wiring board according to claim 1 to 3, a semiconductor element mounted, and wherein a formed by cutting along the cutting line.

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