JP4095722B2 - Semiconductor wafer pod cleaning system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technology for a semiconductor manufacturing apparatus, and more particularly to a pod cleaning apparatus for storing and transporting a semiconductor wafer between manufacturing apparatuses.
[0002]
[Prior art]
In the manufacture of semiconductor components, a clean working atmosphere is required to protect the semiconductor wafer from dust and the like, and the construction of a clean room is essential. On the other hand, since it is not economical to maintain the cleanliness of the entire clean room uniformly at a high level, a so-called SMIF system has been proposed in order to enable the manufacture of semiconductor components with a cleanliness level as low as possible. Yes. ◆
The SMIF system is a system in which a semiconductor wafer is accommodated and transported in a hermetically sealed container called a pod (SMIF pod) when the semiconductor wafer is transported between the apparatuses. According to this system, since the cleanliness of the external atmosphere does not affect the semiconductor wafer as long as it is accommodated in the pod, a high-quality product can be obtained even in a clean room with a low cleanliness.
[0003]
FIG. 18 is a diagram schematically showing the structure of the pod 100 used in the SMIF system. The pod 100 includes a hollow pod main body 101, a pod lid 102 that is detachably engaged with the pod main body 101, and a cassette 103 that supports a semiconductor wafer. The pod lid portion 102 includes an engagement mechanism 102 a, and thereby detachably engages with the opening end portion of the pod main body portion 101. When the pod lid portion 102 is engaged with the pod main body portion 101, the inside of the pod 100 is sealed from the outside to prevent intrusion of dust. Further, the engagement mechanism 102a is linked to an operation unit 102b provided on the back surface of the pod cover unit 102. When the pod 100 is taken into each processing apparatus, the pod cover unit 102 is connected via the operation unit 102b. Is released, and the semiconductor wafer to be accommodated is taken out and re-accommodated.
[0004]
On the other hand, as described above, since the cleanliness in the pod directly affects the semiconductor wafer, at least the inner peripheral surface 101a of the pod main body 101 and the bottom surface 102c of the pod lid 102 that form the internal space of the pod are used. It is necessary to clean and maintain high cleanliness every time. ◆
Conventionally, the pod main body 101 is attached by being immersed in a cleaning liquid such as pure water in a predetermined cleaning chamber and rounded or by spraying the cleaning liquid onto the inner peripheral surface 101a in the container. The current situation is washing away the dust.
[0005]
[Problems to be solved by the invention]
However, since the pod lid 102 is provided with an engagement mechanism 102a for engaging with the pod main body 101, if this is cleaned by the same method as the pod main body 101, the cleaning liquid flows into the mechanism. Cause failure. Moreover, since lubricating oil or the like permeates into the engagement mechanism 102a, when the cleaning liquid flows in, it flows out to the outside of the mechanism, and the cleaning chamber as well as the pod lid 102 is contaminated. ◆
For this reason, conventionally, with respect to the cleaning of the pod lid portion 102, the bottom surface 102c that requires the minimum cleaning is manually wiped, and the operation is extremely complicated, and the entire pod cleaning operation can be automated. It was also a hindrance.
[0006]
Accordingly, it is an object of the present invention to provide a semiconductor wafer pod cleaning apparatus that can efficiently clean a semiconductor wafer pod and can be automated.
[0007]
[Means for Solving the Problems]
According to the present invention, there is provided a cleaning device for separating and cleaning a pod of a semiconductor wafer comprising a pod main body and a pod lid provided with an engagement mechanism with the pod main body. A cleaning chamber having means for cleaning an object, the pod main body portion being housed and cleaned in the cleaning chamber, the pod lid portion being disposed outside the cleaning chamber, and one of the cleaning chambers A semiconductor wafer pod cleaning apparatus is provided in which only a portion exposed to the inside of the pod is exposed and cleaned in the cleaning chamber through an opening provided in the section (Claim 1). .
[0008]
According to this means, the pod main body portion is accommodated in the cleaning chamber, and the pod lid portion is disposed outside the cleaning chamber and separated and cleaned. In this case, since the pod main body is housed in the cleaning chamber, the entire pod body is cleaned evenly, but the pod lid is formed through the opening provided in a part of the cleaning chamber. Since only the portion exposed to the inside of the pod that needs to be cleaned (for example, the bottom surface 102c in the conventional example) is exposed in the cleaning chamber, only this portion is cleaned and the other portions are not cleaned. ◆
Therefore, even if cleaning is performed by immersing or spraying the cleaning liquid in the cleaning chamber, the cleaning liquid does not enter the engaging mechanism of the pod lid portion, and only the portion that needs to be cleaned can be accurately cleaned. . In addition, the pod main body and the pod lid can be cleaned at the same time, and the pod needs to be cleaned efficiently.
[0009]
In the present invention, the part of the cleaning chamber means a part of a peripheral wall, a top plate, a bottom plate and the like that partition the cleaning chamber. In addition, through the opening, the portion of the pod lid that is exposed to the inside of the pod at the time of assembly is exactly matched to the opening, and only the exposed portion is exposed to the cleaning chamber. In addition, a case where a spacer or a sealing material for preventing leakage of the cleaning liquid is used together to match the opening and only the exposed portion of the pod lid is exposed in the cleaning chamber is also included. ◆
Means for cleaning the contents include a cleaning liquid ejector and a cleaning liquid stirrer in the case of dobbing cleaning, but may further include a means for ejecting drying air. ◆
The present invention can be applied to any pod composed of a pod main body and a pod lid provided with an engagement mechanism with the pod main body. For example, the SMIF pod described above and other standards It can also be applied to pods called boxes.
[0010]
Further, according to the present invention, there is provided a cleaning device for separating and cleaning a pod of a semiconductor wafer comprising a pod body and a pod lid having an engagement mechanism with the pod body. A cleaning chamber having means for cleaning the contents, and a lid for detachably locking the pod lid and sealing the cleaning chamber, wherein the pod main body includes the cleaning It is housed and cleaned in the room, and the pod cover part is exposed and cleaned only in the cleaning room through the opening provided in the cover body. A semiconductor wafer pod cleaning apparatus is provided.
[0011]
According to this means, the pod main body is accommodated in the cleaning chamber, and the pod lid is locked to the lid of the cleaning chamber and separated and cleaned. In this case, since the pod main body is housed in the cleaning chamber, the entire pod main body is cleaned evenly, but the pod lid is inserted through the opening provided in the lid to be locked. Only the portion exposed to the inside of the pod that needs cleaning is exposed in the cleaning chamber, so that only this portion is cleaned and the other portions are not cleaned. ◆
Therefore, the cleaning liquid does not enter the pod lid engaging mechanism or the like, and only the portion requiring cleaning can be cleaned accurately and efficiently. In addition, since the pod lid portion can be detachably locked to the lid body, it is easy to fully automate the cleaning apparatus. ◆
In the present invention, the lid is for liquid-tightly closing the opening of the cleaning chamber for accommodating the pod main body in the cleaning chamber, such as a door-shaped one, a sliding one, etc. The form and shape are not asked.
[0012]
Here, the above-described cleaning device of the present invention may be provided with a sensor for measuring the amount of dust in the waste liquid generated by the cleaning process of the pod. ◆
In this means, the degree of cleaning of the pod can be identified by measuring the amount of dust in the waste liquid with a sensor. That is, if the amount of dust in the waste liquid is large, the cleaning is not yet sufficient, and if it is small, the cleaning may be terminated, and the cleaning time and the like can be optimized. ◆
The waste liquid is a cleaning liquid containing dust and the like generated by cleaning the pod. As the sensor, there is a particle counter used for measuring the cleanliness of a clean room. This particle counter measures the amount of dust per unit volume.
[0013]
Next, according to the present invention, there is provided a cleaning apparatus for separating and cleaning a pod of a semiconductor wafer comprising a pod main body and a pod lid provided with an engagement mechanism for the pod main body. The pod main body is attached so that the opening side end face thereof is in contact with the first cleaning base for cleaning the pod main body and the pod lid has a partition member having a predetermined opening. And a second cleaning base for cleaning the pod so that a portion exposed to the inside of the pod is matched with the opening, and the first cleaning base is attached to the opening. A first cleaning means for cleaning the inner peripheral surface of the pod main body portion, wherein the second cleaning base is a first cleaning portion for cleaning a part of the pod lid portion exposed from the opening. Characterized by comprising two cleaning means Pod cleaning device is provided for the conductor wafer (claim 6).
[0014]
According to this means, the pod main body portion is attached to the first cleaning base, and the pod lid portion is attached to the second cleaning base and separated and cleaned. ◆
In this case, the pod main body can be cleaned only on its inner peripheral surface by the first cleaning means, and cleaning of the outer peripheral surface having a high degree of contamination is substantially unnecessary. In addition, efficient cleaning can be performed. In addition, the pod lid portion is cleaned only by the second cleaning means through the opening provided in the partition member, and the other portions are not cleaned by the second cleaning means. . Therefore, the cleaning liquid does not enter the pod lid engaging mechanism or the like, and only the portion requiring cleaning can be cleaned accurately and efficiently.
[0015]
According to the present invention, the second cleaning group includes a cleaning chamber for storing and cleaning a cassette for supporting the semiconductor wafer of the pod, and the partition member is exposed from the opening. A portion of the pod lid that is exposed to the cleaning chamber, and the second cleaning means is disposed to clean a portion of the pod lid exposed from the cassette and the opening. A semiconductor wafer pod cleaning apparatus is provided (claim 7). ◆
In this means, a cleaning chamber for cleaning the cassette of the pod is provided in the second cleaning base, and the cassette and the pod lid can be cleaned together.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. ◆
FIG. 1A is an external view showing a pod cleaning apparatus 1 of the present invention corresponding to claim 1 or 2, and FIG. 1B is a structural diagram showing a cleaning mode of the pod cleaning apparatus 1.
[0017]
The pod cleaning apparatus 1 includes a cleaning container 2, a lid 3, and a hinge 4 that connects the cleaning container 2 and the lid 3 so as to be openable and closable.
[0018]
The cleaning container 2 includes a cleaning chamber 2a that is a cylindrical cavity having an open upper surface. In the cleaning chamber 2a, an elevating stage 2b on which the pod main body 101 is mounted and attached, and a plurality of cleaning liquid jets And a container 2c. ◆
Each corner of the inner periphery of the cleaning chamber 2a is formed into a smooth curved surface, whereby dust and the like after cleaning are circulated and discharged without collecting in the corner, and the cleaning chamber 2a itself is kept clean. Can do. The elevating stage 2b is a retractable actuator that can elevate and lower the pod main body 101 during cleaning, and can clean this evenly. Further, the elevating stage 2b includes a turntable 2b '. By rotating the lift table 2b', the ejector 2c 'mounted therein rotates around the pod main body 101, so that the cleaning liquid can be uniformly sprayed on the inner peripheral surface.
[0019]
The ejectors 2c and 2c ′ eject the cleaning liquid such as pumped pure water in four directions or in one predetermined direction to wash away dust and the like adhering to the pod. You may inject the compressed air which circulates the washing | cleaning liquid with which it filled in 2a. Further, the ejectors 2c and 2c ′ can eject dry air, and can eject the air after washing to dry the pod.
[0020]
The lid 3 includes an opening 3a that penetrates and an engagement portion 3b on the surface. ◆
When the pod lid 102 is placed on the surface of the lid 3 and the opening 3a closes the cleaning chamber 2a by the lid 3, only the bottom surface 102c of the placed pod lid 102 is the washing chamber. It has a size exposed to 2a. If necessary to prevent water leakage to the pod lid 102 other than the bottom surface 102c, the opening 3a may be provided with a separate sealing material or the like.
[0021]
When the opening 3a is larger than the bottom surface 102c and a part other than the bottom surface 102c is exposed to the cleaning chamber 2a, the pod lid 102 is placed via the spacer 5 as shown in FIG. You can also The spacer 5 is a frame having a hole 5a having a size that exposes only the bottom surface 102c and an outer periphery 5b that matches the opening 3a. The spacer 5 is attached to the opening 3a of the lid 3 in a state where the bottom surface 102c of the pod lid 102 is inserted into the hole 5a, whereby only the bottom surface 102c can be exposed to the cleaning chamber 2a. ◆
The engaging portion 3 b is for engaging with the engaging mechanism 102 a of the pod lid portion 102 to place the pod lid portion 102 placed on the surface of the lid body 3 at an appropriate position.
[0022]
Next, the operation of the cleaning apparatus 1 having such a configuration will be described.
[0023]
In the cleaning apparatus 1, the pod main body 101 is accommodated in the cleaning chamber 2a with the lid 3 being opened first, and is mounted on the lifting stage 2b. Next, the lid 3 is closed, and the pod lid 102 is placed on the lid 3 together with the opening 3a. Then, the pod lid portion 102 is engaged with the engagement portion 3 b by the engagement mechanism 102 a and fixed on the lid body 3.
[0024]
In this state, when the cleaning liquid is ejected from each of the ejectors 2c or 2c ′, dust or the like attached to the surfaces of the pod main body 101 and the pod lid 102 is washed away by the cleaning liquid. At this time, since only the bottom surface 102c of the pod lid 102 is exposed to the cleaning chamber 2a, only the bottom surface 102c is cleaned, and the cleaning liquid is prevented from flowing into the engagement mechanism 102a and the like. Further, the pod main body 101 is evenly cleaned by being moved up and down by the lifting stage 2b. ◆
After cleaning, the cleaning liquid is drained from the cleaning chamber 2a, and the pod main body 101 and the pod lid 102 are dried by drying air being sent from each of the ejectors 2c or 2c ′.
[0025]
In the cleaning apparatus 1, the pod lid 102 is attached to the lid 3 for cleaning, but it is not always necessary to attach the pod lid 102 to the lid 3, and an opening 3a is provided on the peripheral wall of the cleaning container 2 or the like. It may be configured to be mounted and cleaned there.
[0026]
Next, another embodiment of the present invention will be described. ◆
FIG. 3 is a structural diagram showing a cleaning mode of the pod cleaning apparatus 21 of the present invention corresponding to claim 6. ◆
The pod cleaning device 21 includes a first cleaning base 22 and a second cleaning base 23. In FIG. 3, the first cleaning base 22 and the second cleaning base 23 (corresponding to claim 10) are fixed on the pedestal 21a, but they are arranged separately. May be.
[0027]
The first cleaning base 22 includes a mounting base 22 a to which the pod main body 101 is attached, and a cleaning device 22 b for cleaning the pod main body 101. The pod main body 101 is placed so that its opening-side end surface (end surface on which the pod lid portion 102 is engaged) abuts the mounting base 22a, and is detachably attached by appropriate means. ◆
The central portion of the mounting base 22a has a hole corresponding to the opening of the pod main body 101, and the cleaner 22b is arranged so as to protrude upward from the hole. Therefore, in a state where the pod main body 101 is attached to the mounting base 22a, the ejector 22b ′ of the cleaning device 22b is positioned inside the pod main body 101. The cleaning device 22b jets pure water or the like or dry air from the jetting device 22b 'to clean or dry the inner peripheral surface of the pod main body 101, and itself rotates as indicated by an arrow. In other words, the cleaning liquid or the like can be sprayed uniformly on the inner peripheral surface of the pod main body 101.
[0028]
The second cleaning base 23 is mounted on a mounting base 23a (corresponding to a partition member in claims) to which the pod lid 102 is attached, and a cleaning for cleaning the pod lid 102 is arranged below the mounting base 23a. And a container 23b. The mounting base 23a includes an opening 23a ′ and an engaging portion 23a ″.
The opening 23a ′ has such a size that only the bottom surface 102c of the pod lid 102 is exposed to the cleaning device 22b, and the bottom surface 102c of the pod lid 102 matches the opening 23a ′. In this way, it is placed on the mounting base 23a and detachably attached to the mounting base 23a by engaging the engaging portion 23a "with the engaging mechanism 102a.
When the opening 23a ′ is larger than the bottom surface 102c, the above-described spacer 5 in FIG. 2 may be interposed. Further, the attachment of the pod lid 102 and the mounting base 23a does not necessarily require the use of the engaging mechanism 102a, and may be attached by other appropriate means.
[0029]
The washer 23b ejects pure water or the like or dried air from the ejector 23b ′ to clean or dry the bottom surface 102c of the pod lid 102 exposed from the opening 23a ′. Can rotate as indicated by the arrow, and the cleaning liquid or the like can be sprayed evenly onto the bottom surface 102c of the pod lid 102.
[0030]
Next, the operation of the cleaning device 21 having such a configuration will be described. ◆
In the cleaning device 21, the pod body 101 and the pod lid 102 are separated from each other. The pod body 101 is attached to the mounting base 22 a of the first cleaning base 22, and the pod lid 102 is connected to the second cleaning base. It attaches to 23 attachment bases 23a. ◆
In this state, in the first cleaning base 22, when the cleaning liquid is ejected by the cleaning device 22b, dust or the like attached to the inner peripheral surface of the pod main body 101 is washed away by the cleaning liquid. In particular, the inner peripheral surface of the pod body 101 is evenly cleaned by rotating the cleaner 22b as shown by an arrow.
[0031]
On the other hand, in the second cleaning base 23, when the cleaning liquid is ejected by the cleaning device 23b, dust or the like attached to the surface of the pot lid 102 is washed away by the cleaning liquid. At this time, since only the bottom surface 102c of the pod lid 102 is exposed to the cleaning device 23b, only the bottom surface 102c is cleaned, and the cleaning liquid is prevented from flowing into the engagement mechanism 102a and the like. .
[0032]
Here, the cleanliness of the outer peripheral surface of the pod main body 101 has little relation to the cleanliness of the semiconductor wafer accommodated in the pod 100, so that there is little need to clean it every time. Further, since the outer peripheral surface is in contact with the external atmosphere, the degree of contamination is high, and when the pod main body 101 and the pot lid 102 are washed together as in the above-described cleaning device 1, the cleaning waste liquid having a high degree of contamination is obtained. In some cases, the cleaning operation may be delayed. ◆
In this regard, the cleaning device 21 can clean only the inner peripheral surface of the pod main body 101, so that necessary cleaning can be performed efficiently. In addition, since the pot body 101 and the pot lid 102 are cleaned separately, a quick cleaning operation can be performed.
[0033]
Next, still another embodiment of the present invention will be described. ◆
FIG. 4 is a structural diagram showing a cleaning mode of the pod cleaning apparatus 31 according to the present invention corresponding to claim 7 or 8. ◆
The pot cleaning device 31 includes a first cleaning base 32 and a second cleaning base 33. In FIG. 4, the first cleaning base 32 and the second cleaning base 33 are fixed on the pedestal 31a, but they may be arranged separately.
[0034]
The first cleaning base 32 has the same configuration as the first cleaning base 22 in the pod cleaning apparatus 21 of FIG. 3 described above, and includes a mounting base 32a to which the pod main body 101 is attached, and the pod main body 101. And a washer 32b.
[0035]
The pod main body 101 is placed so that its opening-side end surface (end surface on which the pod lid 102 is engaged) abuts the mounting base 32a, and is detachably attached by appropriate means. The central portion of the mounting base 32a has a hole corresponding to the opening of the pod main body 101, and the cleaning device 32b is disposed so as to protrude upward from the hole. Therefore, in a state where the pod main body 101 is attached to the mounting base 32a, the ejector 32b ′ of the cleaning device 32b is positioned inside the pod main body 101.
[0036]
The cleaning device 32b jets pure water or dry air from the jetting device 32b 'to clean or dry the inner peripheral surface of the pod main body 101, and itself rotates as indicated by an arrow. Therefore, the cleaning liquid or the like can be sprayed evenly on the inner peripheral surface of the pod main body 101.
[0037]
The second cleaning base 33 is attached to a cleaning chamber 34 having a space for cleaning the cassette 103 of the pod 100 and an upper surface opening of the cleaning chamber 34 through a hinge 33a so that the cleaning chamber 34 is sealed. A lid 35 (corresponding to a partition member in claims), a lift stage 34a provided at a lower portion in the cleaning chamber 34, on which the cassette 103 is placed and mounted, and a cleaning chamber 34. And a cleaning device 34b for cleaning the bottom surface 102c of the cassette 103 or the pod lid 102.
[0038]
The lid 35 includes an opening 35a that penetrates and an engagement portion 35b on the surface. The opening 35 a has such a size that only the bottom surface 102 c of the pod lid 102 is exposed in the cleaning chamber 34 when the lid 35 is closed. The pod lid portion 102 is placed on the surface of the lid body 35 so that the bottom surface 102c of the pod lid portion 102a matches the opening 35a, and is detachably attached by engaging the engaging portion 35b and the engaging mechanism 102a. It is done. ◆
The opening 35a may be provided with a separate sealing material or the like if necessary to prevent water leakage to the pod lid 102 other than the bottom surface 102c. ◆
Further, when the opening 35a is larger than the bottom surface 102c, the above-described spacer 5 in FIG. 2 may be interposed, and the pod lid 102 and the lid 35 are not necessarily attached. It is not necessary to use the combination mechanism 102a, and it may be attached by other appropriate means.
[0039]
The cleaning device 34b jets pure water or the like that has been pumped from the ejector 34b ′ or dry air to clean the bottom surface 102c of the pod lid 102 exposed from the cassette 103 or the opening 35a on the elevating stage 34a. It is something to dry. ◆
The elevating stage 34a is a telescopic actuator, and has a turntable 34a 'on the upper part thereof. The cassette 103 is mounted on the turntable 34a ′ and can be moved up and down in the cleaning chamber 34. At the time of the cleaning process or the drying process, the turntable 34a rotates to rotate the cassette 103. The washing or drying of 103 can be performed uniformly.
[0040]
The second cleaning base 33 includes a particle counter 36 for measuring the degree of cleaning of the cassette 103 (corresponding to claim 3 or 9). The particle counter 36 is in the cleaning waste liquid (cleaning liquid containing dust after cleaning) sucked by the pump 36 b from the suction port 36 a provided in the cleaning chamber 34 at a position substantially symmetrical to the cleaning device 34 b with respect to the cassette 103. Thus, it is possible to identify whether or not the cassette 103 has been sufficiently cleaned based on the amount of dust. In the example of FIG. 4, the particle counter 36 is provided only in the second cleaning base 33, but is not limited thereto, and is provided in the first cleaning base 32 or the cleaning apparatus according to another embodiment of the present invention. May be.
[0041]
Here, another form of the second cleaning group 33 will be described. FIG. 5 is a structural diagram showing a cleaning mode of the second cleaning group 33 of the other form. ◆
In addition to the configuration described above, the second cleaning base 33 in FIG. 5 has a partition frame 37 connected to the lower surface of the lid 35 so as to partition the cleaning space of the cassette 103 and the cleaning space of the pod lid 102. It is.
[0042]
The partition frame 37 is for preventing vapor or cleaning waste liquid generated by cleaning the cassette 103 from coming into contact with the pod lid 102. The pod lid 102 may be provided with a micro hole 102d for degassing the pod 100 in order to facilitate separation of the pod main body 101 and the pod lid 102 (see FIG. 18). ), A filter 102d ′ for preventing dust from entering from the outside is further provided in the middle of the micro hole 102d. When the filter 102d ′ is wetted by steam or the like, its function as a filter is reduced. ◆
Therefore, in such cleaning of the pod lid 102, it is necessary to adjust the spraying direction of the cleaning liquid so that the cleaning liquid does not adhere to the filter 102d ′. It is also necessary not to adhere to the filter 102d '.
[0043]
Therefore, in the embodiment of FIG. 5, by providing the partition frame 37, it is possible to prevent the vapor generated by cleaning the cassette 103 from adhering to the filter 102d ′. The partition frame 37 is provided with a cleaning liquid discharge port 37a, from which the cleaning waste liquid of the pod lid 102 is discharged. In addition, when it is ensured that vapor generated by cleaning the cassette 103 does not enter the pod lid portion 102 from the discharge port 37a, the pressure in the cleaning chamber 34 ′ defined by the partition frame 37 is further increased. It is also conceivable to set the pressure higher than the pressure in the lower cleaning chamber 34.
[0044]
Next, the operation of the cleaning device 31 having such a configuration will be described. ◆
In the cleaning device 31, the pod main body 101 and the pod lid 102 are separated from each other, the pod main body 101 is attached to the mounting base 32 a of the first cleaning base 32, and the pod cover 102 is connected to the second cleaning base 33. Each is attached on the surface of the lid 35. ◆
On the other hand, the cassette 103 is accommodated in the cleaning chamber 34 with the lid 35 of the second cleaning base 33 being opened, and is further mounted on the elevating stage 34a. The elevating stage 34 a can be extended to the vicinity of the lid 35, thereby facilitating attachment of the cassette 103.
[0045]
In this state, in the first cleaning base 32, when cleaning liquid is ejected by the cleaning device 32b, dust or the like attached to the inner peripheral surface of the pod main body 101 is washed away by the cleaning liquid. In particular, the inner peripheral surface of the pod main body 101 is evenly cleaned by rotating the cleaner 32b as shown by an arrow.
[0046]
On the other hand, in the second cleaning base 33, when the cleaning liquid is ejected by the cleaning device 34b, dust or the like attached to the surfaces of the cassette 103 and the pot lid 102 is washed away by the cleaning liquid. At this time, since only the bottom surface 102c of the pod lid portion 102 is exposed to the cleaning chamber 34, only the bottom surface 102c is cleaned, and the cleaning liquid is prevented from flowing into the engagement mechanism 102a and the like.
[0047]
Further, in the cleaning device 31, as with the cleaning device 21 described above, the pod main body 101 can be cleaned only on the inner peripheral surface thereof, so that the necessary cleaning can be performed efficiently and the pot main body. Since the part 101 and the pot lid part 102 are cleaned separately, a quick cleaning operation is possible. ◆
In the cleaning device 31, since the particle counter 36 is provided on the second cleaning base 33, the cleaning condition of the cassette 103 can be identified by measuring the amount of dust in the cleaning waste liquid, and based on the measurement result. The cleaning time can be made most appropriate. Furthermore, in the cleaning device 31, when the partition frame 37 as shown in FIG. 5 is provided, the cleaning process can be performed while protecting the filter 102d ′ of the pod lid 102 from steam or the like.
[0048]
Next, another embodiment of the present invention will be described. ◆
6 to 11 are schematic views of the automatic cleaning apparatus 10 according to the present invention corresponding to claim 4 or 5, and each process of the apparatus is shown. ◆
The automatic cleaning apparatus 10 includes a placement unit 11 on which a pod 100 to be cleaned is placed, a cleaning unit 12 for cleaning the pod 100, and a transport unit 13 for transporting the pod main body 101. Placed in a small clean room with a suitable cleaning atmosphere.
[0049]
The placement unit 11 includes a turntable 11a including means for detachably locking only the pod lid 102 among the placed pods 100, for example, a vacuum suction device (corresponding to the upper lid of the claims). And an operation mechanism 11b for separating and assembling the placed pod 100. ◆
The turntable 11a is rotatable around the hinge 11c. The operation mechanism 11b separates and assembles the pod 100 by automatically and directly operating the operation unit 102b of the pod lid unit 102.
[0050]
The cleaning unit 12 has the same configuration and function as the above-described cleaning device 1 of the present invention, and includes a cleaning chamber 12a and a lid 12b (corresponding to the lower lid in the claims). Thus, the lid body 12b can automatically open and close the opening of the cleaning chamber 12a. ◆
The lid 12b includes an opening 12b ′ having a size of the bottom surface 102c of the pod lid 102, and the cleaning chamber 12a includes an elevating stage 12a ′ on which the pod main body 101 is placed.
[0051]
The transport unit 13 includes a gripper 13 a that can hold and suspend the pod body 101 and can be moved up and down, and a slider 13 b that moves the entire transport unit 13 in the direction of the cleaning unit 12.
[0052]
The operation of the automatic cleaning apparatus 10 having such a configuration will be described with reference to FIGS. ◆
In FIG. 6, the pod 100 to be cleaned is transported to the mounting portion 11 by a transport means (not shown) or a person and placed on the turntable 11a. At this time, the pod lid 102 is locked to the turntable 11a. ◆
The pod 100 placed is disengaged from the pod main body 101 and the pod lid 102 by the operation mechanism 11b from the back surface of the turntable 11a (FIG. 7).
[0053]
Next, the transport unit 13 is moved by the slider 13b until it is positioned directly above the pod 100. At this time, the gripper 13a is once lowered, grips the pod main body 101, and rises again (FIG. 8). Further, the slider 13b moves to the cleaning unit 12, and the gripper 13a holding the pod main body 101 descends and conveys it onto the lifting stage 12a ′. After the conveyance, the conveyance unit 13 returns to the original position (FIG. 9).
And as for the washing | cleaning part 12 which accommodated the pod main-body part 101, the cover body 12b automatically closes the washing | cleaning chamber 12a (FIG. 10). Further, following the lid 12b, the turntable 11a automatically rotates around the hinge 11c with the pod lid 102 locked, and overlaps with the lid 12b to close the cleaning chamber 12a. (FIG. 11). That is, the cleaning chamber 12a is closed by the lid 12b and the turntable 11a in a so-called double lid form. At this time, the lid 12b and the turntable 11a overlap with each other in a state where the bottom surface 102c of the pod lid 102 just matches the opening 12b ′ of the lid 12b, and the pod lid 102 only has its bottom surface 102c. Is exposed in the cleaning chamber 12a, which is the same mode as the cleaning device 1 in FIG.
[0054]
Thereafter, a cleaning operation is performed in the cleaning chamber 12a, and dust and the like attached to the bottom surface 102c of the pod main body 101 and the pod lid 102 are removed. When the cleaning and drying of the pod 100 are completed, the automatic cleaning device 10 returns the cleaned pod 100 to the original position by performing processing in the reverse order of the above-described processing. ◆
That is, from the aspect of FIG. 8, the turntable 11a returns to its original position, and the lid 12b of the cleaning unit 12 is opened. The conveyance part 13 takes out the pod main body part 101 in the washing | cleaning part 12, and conveys and mounts it on the pod cover part 102 of the turntable 11a. Then, the pod 100 is assembled by the operation mechanism 11b, and the process ends. As described above, the automatic cleaning apparatus 10 automatically achieves a series of cleaning processes only by placing the pod 100 on the mounting portion 11.
[0055]
Next, an automatic cleaning device 50 using a plurality of the cleaning devices 21 shown in FIG. 3 will be described. 12 to 17 are schematic views of the automatic cleaning apparatus 50, and each process of the apparatus is shown. ◆
Referring to FIG. 12, in automatic cleaning apparatus 50, storage unit 51 in which pod 100 to be cleaned is stored and pod 100 before cleaning is mounted, and a first mounting for disassembling the pod. Part 52, the cleaned pod 100 is placed, a second placement part 53 for assembling the pods, and a first clean chamber 54 for washing the pod body part 101 of the pods 100. And a second clean chamber 55 for cleaning the pod lid portion 102 and a transport portion 56 for transporting the pod main body portion 101.
[0056]
The first placement unit 52 operates an engagement mechanism 102 a of the pod 100 to separate the pod 100 (not shown), and the first placement unit 52 and the second clean chamber 55. And a turntable 52a that is rotatable between the two. The second placement unit 53 includes an operation mechanism (not shown) for operating the assembled pod lid unit 102 and the engagement mechanism 102a of the pod body unit 101 to assemble them, and a second placement unit. A turntable 53 a that is rotatable between the placement unit 53 and the second clean chamber 55 is provided.
[0057]
The first clean chamber 54 is provided with a plurality of the first cleaning bases 22 of the above-described cleaning device 21 arranged in a row. The second clean chamber 55 is provided with a plurality of the second cleaning bases 23 of the above-described cleaning device 21 and arranged in a row, and in particular, a pod between the second cleaning bases 23. A slide mechanism (not shown) for transferring the lid 102 is provided.
[0058]
The transport unit 56 performs processing for transporting the pod main body 101 between the first mounting unit 52 or the second mounting unit 53 and the first clean chamber 54, and the first clean chamber 54. A process of transporting the pod main body 101 between the first cleaning bases 22 is performed.
[0059]
The operation of the automatic cleaning apparatus 50 having such a configuration will be described with reference to FIGS. ◆
First, one of the pods 100 in the storage unit 51 is transported and placed on the first placement unit 52 by an appropriate means, and the pod engagement mechanism 102a is released (FIG. 13). Among the pods 100 that can be separated, the pod main body 101 is transported by the transport unit 56 to the first cleaning base 22 located at the left end of the first clean chamber 54, and as shown in FIG. (FIG. 14). ◆
In parallel with the conveyance of the pod main body 101, the turntable 52a rotates toward the second cleaning base 23 located at the left end of the second clean chamber 55 while supporting the pod lid 102 (FIG. 14). See arrow). After the rotation, the pod lid 102 is attached to the mounting base 23a as shown in FIG. 3 (FIG. 14).
[0060]
The pod body 101 and the pod lid 102 are cleaned by the first cleaning base 22 and the second cleaning base 23, respectively. After cleaning, the pod main body 101 is transferred by the transfer unit 56 to the first cleaning base 22 located on the right side. Further, the pod lid 102 is transferred to the second cleaning base located on the right side by the above-described slide mechanism. The pod main body 101 and the pod lid 102 are again cleaned by the first cleaning base 22 and the second cleaning base 23 after moving. After the cleaning, the first cleaning base 22 and the second cleaning base 23 located on the right side are moved again to the first cleaning base 22 and the second cleaning base 23. It moves to the cleaning base (22, 23) located at the right end of the second clean chamber 55 (FIG. 15).
[0061]
On the other hand, new pods 100 transported from the storage unit 51 are transported and attached one after another through the above-described procedure to the first cleaning base 22 and the second cleaning base 23 that have become empty. It is dried (FIG. 15). ◆
In this manner, the pod body 101 is transferred from the left end to the right end of the first clean chamber 54, and the pod cover 102 is successively cleaned while being transferred from the left end to the right end of the second clean chamber 55. Or dried.
[0062]
Then, when the processing by each cleaning base (22, 23) located at the right end of each clean chamber (54, 55) is completed, the turntable 53a first rotates to the second clean chamber 55 side, and the pod lid 102 is supported. Next, the pod lid portion 102 is placed on the second placement portion 53 by rotating again to the original position. In parallel with the transfer of the pod lid 102, the pod main body 101 is transported by the transport unit 56 and placed on the pod lid 102 placed on the second placement unit 53 (FIG. 16). ). The second placement unit 53 is assembled with the pod body unit 101 and the pod lid unit 102 by the operation mechanism, and all the cleaning processes are completed. The assembled pod 100 is transported to a required position by the transport unit 56 (FIG. 17).
[Brief description of the drawings]
FIG. 1 (a) is an external view showing a pod cleaning apparatus 1 according to the present invention. (B) It is a structural diagram showing the washing | cleaning aspect of the pod washing | cleaning apparatus 1 which concerns on this invention.
FIG. 2 is a view showing a mode in which a spacer 5 is attached to a pod lid 102. FIG.
FIG. 3 is a structural diagram showing a cleaning mode of another pod cleaning apparatus 21 according to the present invention.
FIG. 4 is a structural diagram showing a cleaning aspect of still another pod cleaning device 31 according to the present invention.
5 is a structural diagram showing another embodiment of the second cleaning group 33 of FIG.
FIG. 6 is a schematic view of an automatic cleaning device 10 according to the present invention.
FIG. 7 is a view showing a mode of disassembling the pod 100. FIG.
FIG. 8 is a diagram illustrating a mode in which a pod main body 101 is transported by a transport unit 13;
FIG. 9 is a diagram illustrating a state in which a pod main body 101 is conveyed into a cleaning unit 12;
10 is a view showing a state in which a lid 12b of the cleaning unit 12 is closed. FIG.
FIG. 11 is a view showing a state in which a cleaning chamber 12a is closed by stacking a turntable 11a on a lid body 12b.
12 is a schematic view of an automatic cleaning device 50. FIG.
13 is a diagram showing a mode in which the pod 100 is placed on the first placement unit 52 and disassembled. FIG.
14 is a view showing a mode in which the pod main body 101 is transferred to the first clean chamber 54 and the pod lid 102 is transferred to the second clean chamber 55. FIG.
FIG. 15 is a diagram showing a mode in which a plurality of pods 100 are washed or dried.
FIG. 16 is a diagram showing an aspect in which the pod main body 101 and the pod lid 102 after the cleaning / drying processing are placed on the second placement portion 53 and assembled.
FIG. 17 is a diagram illustrating a mode in which the pod 100 after the cleaning / drying process is transported.
18 is a structural diagram of the pod 100. FIG.
[Explanation of symbols]
1 Cleaning device
2 Cleaning container
2a Cleaning room
3 lid
3a opening
4 Hinge
10 Automatic cleaning equipment
11 Placement section
11b Operation mechanism
12 Cleaning section
13 Transport section
21 Cleaning equipment
22 First cleaning group
23 Second cleaning group
31 Cleaning device
32 First cleaning group
33 Second cleaning group
100 pods
101 Pod body
102 Pod lid

Claims (10)

A cleaning device for separating and cleaning the pods of a semiconductor wafer each comprising a pod body part and a pod lid part having an engagement mechanism with the pod body part,
A cleaning chamber having means for cleaning the contents;
The pod main body is housed in the cleaning chamber and cleaned,
The pod lid is disposed outside the cleaning chamber, and only the portion exposed to the inside of the pod is exposed and cleaned through the opening provided in a part of the cleaning chamber. A pod cleaning apparatus for semiconductor wafers. A cleaning device for separating and cleaning the pods of a semiconductor wafer each comprising a pod body part and a pod lid part having an engagement mechanism with the pod body part,
A cleaning chamber having means for cleaning the contents, and a lid for detachably locking the pod lid and sealing the cleaning chamber;
The pod main body is housed in the cleaning chamber and cleaned,
A pod cleaning apparatus for a semiconductor wafer, wherein only a portion exposed to the inside of the pod is exposed and cleaned in the cleaning chamber through an opening provided in the lid. 3. The pod cleaning apparatus for a semiconductor wafer according to claim 1, further comprising a sensor for measuring an amount of dust in the waste liquid generated by the pod cleaning process. The lid body has a two-layer structure including a lower lid and an upper lid that automatically rotate independently of the cleaning chamber, the lower lid includes the opening, and the upper lid is the pod lid. 3. The pod cleaning apparatus for a semiconductor wafer according to claim 2, further comprising locking means for detachably locking the portion. A transport unit that transports only the pod main body portion of the pod placed on the upper lid into the cleaning chamber when the upper lid is opened;
The lower lid is automatically rotated after transport by the transport unit to close the cleaning chamber,
5. The semiconductor according to claim 4, wherein the upper lid is automatically rotated after the lower lid is rotated in a state where the pod lid portion is locked by the locking means to close the cleaning chamber. Wafer pod cleaning equipment. A cleaning device for separating and cleaning the pods of a semiconductor wafer each comprising a pod body part and a pod lid part having an engagement mechanism with the pod body part,
The pod main body is attached so that the opening-side end surface is in contact with the first pod, and a first cleaning base for cleaning the first pod,
The pod lid is attached via a partition member having a predetermined opening so that a portion exposed to the inside of the pod matches the opening, and a second cleaning is performed for cleaning the same. And consists of
The first cleaning group includes first cleaning means for cleaning the inner peripheral surface of the attached pod main body,
The semiconductor wafer pod cleaning apparatus, wherein the second cleaning base includes a second cleaning means for cleaning a part of the pod lid exposed from the opening. The second cleaning group includes a cleaning chamber for storing and cleaning a cassette for supporting the semiconductor wafer of the pod, and the partition member is a part of the pod lid portion exposed from the opening. Is disposed so as to be exposed to the cleaning chamber, and the second cleaning means is disposed so as to clean a part of the pod lid exposed from the cassette and the opening. Item 7. A semiconductor wafer pod cleaning apparatus according to Item 6. 8. The semiconductor wafer pod cleaning apparatus according to claim 7, wherein the partition member is formed as a lid for sealing the cleaning chamber. 9. The semiconductor wafer pod cleaning apparatus according to claim 6, further comprising a sensor for measuring an amount of dust in the waste liquid generated by the pod cleaning process. A pod main body and a pod lid provided with an engagement mechanism with the pod main body, and a pod of a semiconductor wafer each comprising a cleaning device for cleaning the pod lid, in particular,
A partition member having a predetermined opening, and a cleaning means for cleaning a portion exposed from the opening,
The semiconductor wafer pod cleaning apparatus, wherein the pod lid is attached to the partition member so that a portion exposed to the inside of the pod matches the opening.

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