JP7705835B2 - Wafer storage container cleaning equipment - Google Patents

Description

An embodiment of the present invention relates to a wafer storage container cleaning device.

Conventionally, there is a wafer storage container cleaning device that cleans wafer storage containers such as FOUPs (Front Opening Unified Pods) and FOSBs (Front Opening Shipping Boxes) that store (contain) semiconductor wafers. The wafer storage container includes a wafer storage container body that stores semiconductor wafers, and a door that is provided so as to be openable and closable relative to the wafer storage container body. A hole is formed on the side of the door through which a latch for connecting to the wafer storage container body can protrude. In addition, since the latch is provided in a slidable state inside the door, an internal space that communicates with the above-mentioned hole is formed. The latch protruding from the door engages with the wafer storage container body, thereby connecting the door and the wafer storage container body. In addition, the door and the wafer storage container are separated (disassembled) by releasing the engagement between the latch and the wafer storage container body.

JP 2005-109523 A

In the wafer storage container cleaning device, the wafer storage container body and the door are cleaned by discharging a cleaning liquid onto the wafer storage container body and the door while they are separated. This can cause the cleaning liquid to get into the internal space through holes formed in the side of the door, resulting in residual liquid.

The present invention was made to solve the above problems, and its purpose is to provide a wafer storage container cleaning device that can prevent liquid from entering the internal space of the door.

In order to solve the above-mentioned problems and achieve the object, one embodiment of the present invention provides a wafer storage container cleaning apparatus for cleaning a door of a wafer storage container having a key hole on one side that can be locked/unlocked to a wafer storage container body by rotating with a latch key inserted therein, and an extrusion hole through which a latch can protrude when locked, on a side, the apparatus comprising: a door holding part that holds the door; a cleaning liquid nozzle that supplies cleaning liquid to the other side of the door; a gas nozzle that generates a gas flow that inhibits the cleaning liquid from entering through the extrusion hole at least when the cleaning liquid is being supplied to the door from the cleaning liquid nozzle; an opening/closing lid that is provided to be openable and closable with respect to a cleaning tank opening and that has the door holding part; and a cleaning tank body in which a processing space is formed by closing the cleaning tank opening by the opening/closing lid, and the gas nozzle supplies the gas from the one side of the door to a gas supply space formed between the opening/closing lid and the door, including the side, when the door is held by the door holding part .

According to one aspect of the present invention, it is possible to prevent liquid from entering the interior space of the door.

FIG. 1 is a plan view showing an example of a schematic configuration of a wafer container cleaning apparatus according to the first embodiment. FIG. 2 is a schematic diagram of the door according to the first embodiment, showing an example of the configuration of the door. FIG. 3A is a cross-sectional view taken along line AA in FIG. 2 (when locked). FIG. 3B is a cross-sectional view taken along line AA in FIG. 2 (unlocked state). FIG. 4 is a side perspective view that shows a schematic configuration inside the cleaning tank according to the first embodiment. FIG. 5 is a diagram illustrating an example of the configuration of the control unit according to the first embodiment. FIG. 6 is a diagram showing an example of the configuration of the opening/closing cover according to the first embodiment. FIG. 7 is a diagram showing an example of the configuration of the opening/closing cover according to the first embodiment. FIG. 8 is a diagram for explaining an example of an operation during cleaning of a FOUP by the wafer container cleaning apparatus 1 according to the first embodiment. FIG. 9 is a view showing a state in which a door holder of the wafer container cleaning apparatus according to the second embodiment holds the door. FIG. 10 is a cross-sectional view taken along line BB of FIG. 9 in the second embodiment, with the two lids removed from the door holder and gas nozzles inserted into each of the two holes exposed in the door holder. Figure 11 is a cross-sectional view taken along line B-B of Figure 9 in a modified example of the second embodiment, in which the two lids have been removed from the door holding portion and gas nozzles have been inserted into each of the two holes exposed in the door holding portion.

Below, an embodiment of the wafer storage container cleaning device disclosed in the present application will be described in detail with reference to the attached drawings. Note that the wafer storage container cleaning device disclosed in the present application is not limited to the following embodiment. Furthermore, each embodiment and each modified example can be appropriately combined to the extent that no contradiction occurs. Note that in the following embodiment, the wafer storage container to be cleaned is described as a FOUP, but the wafer storage container to be cleaned is not limited to this. For example, the wafer storage container to be cleaned may be a FOSB.

First Embodiment
1 is a plan view showing an example of a schematic configuration of a wafer container cleaning apparatus 1 according to a first embodiment. The wafer container cleaning apparatus 1 is installed in, for example, a factory that manufactures semiconductor wafers, and cleans wafer containers. As shown in FIG. 1, the wafer container cleaning apparatus 1 includes a load port 2, a robot 3, a disassembly/connection stage 4, a cleaning tank 5, a vacuum tank 6, an unload port 7, and a control unit 8.

The robot 3, disassembly/connection stage 4, cleaning tank 5, vacuum tank 6 and control unit 8 are provided inside the casing 1a of the wafer storage container cleaning device 1. On the other hand, the load port 2 and unload port 7 are provided across the inside and outside of the casing 1a of the wafer storage container cleaning device 1.

The load port 2 carries the FOUP 20 to be cleaned, which is placed on the outside of the casing 1a of the load port 2, into the inside of the casing 1a. The FOUP 20 includes a FOUP body (shell) 20a and a door (lid) 20b. The FOUP body 20a has an opening (FOUP body opening) and a storage space for storing semiconductor wafers. The storage space is located inside the FOUP body opening and communicates with the FOUP body opening. The FOUP body 20a is an example of a wafer storage container body, and the FOUP body opening is an example of a container opening. The door 20b can be disassembled/connected to the FOUP body 20a, and when connected to the FOUP body 20a, it is attached in a state where it can be opened and closed relative to the FOUP body opening. In addition, the FOUP body 20a is provided with a flange 20c. The flange 20c is the part that is grasped (held) when the FOUP 20 is transported by an OHT (Overhead Hoist Transport) or a robot 3, etc.

For example, the FOUP 20, which has been transported with its flange 20c gripped by the OHT, is placed on the outside of the casing 1a of the load port 2. For example, as shown in FIG. 1, the FOUP 20 is placed so that the door 20b of the FOUP 20 faces the casing 1a. When the FOUP 20 is placed on the load port 2 in this manner, the shutter 2a provided at the opening 1b of the casing 1a rises. This allows the FOUP 20 to be carried into the casing 1a from the opening 1b. In other words, the FOUP 20 is ready to be carried into the wafer storage container cleaning device 1. The FOUP 20 is then slid in the direction of the arrow 2b by the slide device of the load port 2. This allows the FOUP 20 to be carried into the casing 1a. The slide by the slide device will now be described. For example, a pin provided on the sliding device is inserted into a hole provided on the bottom (mounting surface) of the FOUP 20, and the mounting surface of the FOUP 20 is fixed to the sliding device. In this state, the sliding device is slid in the direction of arrow 2b, causing the FOUP 20 to slide along with it. As a result, the FOUP 20 is placed on a predetermined portion inside the casing 1a of the load port 2. When the FOUP 20 is thus carried into the casing 1a, the shutter 2a descends and the opening 1b of the casing 1a is closed. The sliding device descends together with the pin to a position lower than the lower end of the shutter 2a (the mounting surface of the FOUP 20) and returns to its original position outside the casing 1a.

The robot 3 transports the FOUP 20 to each section while gripping the flange 20c of the FOUP 20. The robot 3 is equipped with a robot arm 3a and a robot hand 3b. The robot 3 transports the FOUP 20 to each section by extending and retracting the robot arm 3a and rotating it while the robot hand 3b grips the flange 20c.

The disassembly/connection stage 4 disassembles the FOUP 20 into the FOUP body 20a and the door 20b, and connects the FOUP body 20a and the door 20b. A latch key 4a is provided on the disassembly/connection stage 4. The latch key 4a is inserted into a key hole formed in the door 20b of the FOUP 20 and rotates to disassemble (separate) the FOUP 20 into the FOUP body 20a and the door 20b, and connects the FOUP body 20a and the door 20b. For example, the FOUP 20 carried into the inside of the casing 1a is transported by the robot 3 to the disassembly/connection stage 4. In this case, the disassembly/connection stage 4 disassembles the FOUP 20 into the FOUP body 20a and the door 20b. Note that disassembly can be rephrased as unlocking, and connection can be rephrased as locking.

Figure 2 is a schematic diagram of the door 20b according to the first embodiment, and is a diagram showing an example of the configuration of the door 20b. Figures 3A and 3B are cross-sectional views taken along the line A-A in Figure 2. Figure 3A shows the door 20b in a locked state, and Figure 3B shows the door 20b in an unlocked state. As shown in Figures 2, 3A, and 3B, two key holes 20e are formed at a predetermined interval on the outer surface 20d of the door 20b. That is, the outer surface 20d is formed with a key hole 20e that can switch between locking and unlocking of the FOUP body 20a and the door 20b by rotating the key hole 20e with the latch key 4a inserted. In addition, a hole (projection hole) 20g through which the latch 20i described later can project is formed on the side surface 20f of the door 20b. No hole is formed on the surface (inner surface) 20m of the door 20b opposite the outer surface 20d. Therefore, there is no opening on the inner surface 20m for communicating with the internal space of the door 20b. The positions at which the two key holes 20e are formed are determined by standards.

Inside the door 20b, a space (latch sliding space) 20k is formed in which a latch mechanism 20j including a key cylinder 20h, a latch 20i, and a connecting portion 20t is provided. The latch sliding space 20k is an internal space of the door 20b. The latch sliding space 20k is connected to the key hole 20e and the projection hole 20g. The key cylinder 20h is provided at a position corresponding to the key hole 20e. Specifically, the key cylinder 20h is provided in the latch sliding space 20k of the door 20b so that the latch key 4a can be inserted into the key cylinder 20h through the key hole 20e.

When the latch key 4a inserted into the key cylinder 20h rotates in a predetermined direction, the key cylinder 20h rotates, and the connecting part 20t connected to the key cylinder 20h pushes out the latch 20i, causing the latch 20i to protrude from the protruding hole 20g of the latch mechanism 20j in the direction of the arrow 20l (see FIG. 3A). In this way, the protruding latch 20i engages with the FOUP body 20a, connecting and locking the FOUP body 20a and the door 20b. A recess is provided at the end of the opening of the FOUP body 20a, and the latch 20i protruding from the protruding hole 20g shown in FIG. 3A is inserted into the recess. In this way, the latch 20i is a member for connecting to the FOUP body 20a. In addition, when the FOUP body 20a and the door 20b are connected, the latch key 4a inserted into the key cylinder 20h rotates in the opposite direction to when locked and returns to its original position, causing the connecting part 20t that pushed out the latch 20i to also return to its original position, and the latch 20i inserted into the recess retracts into the latch sliding space 20k of the door 20b (see FIG. 3B). This causes the FOUP body 20a and the door 20b to disassemble and unlock. That is, inside the door 20b, a latch mechanism 20j is provided that can switch between locking and unlocking the FOUP body 20a and the door 20b by rotating the latch key 4a inserted through the key hole 20e.

The cleaning tank 5 is a tank for cleaning the FOUP 20. FIG. 4 is a side perspective view showing a schematic configuration inside the cleaning tank 5 according to the first embodiment. For example, as shown in FIG. 4, the cleaning tank 5 includes a cleaning tank body 50 and an openable/closable lid (lid portion) 5a. The cleaning tank body 50 has an opening (cleaning tank opening) at the top and a processing space in which the FOUP body 20a is placed. This processing space is located inside the cleaning tank opening and communicates with the cleaning tank opening. The FOUP body 20a is carried into the processing space of the cleaning tank body 50 through the cleaning tank opening. A FOUP body holding portion for holding the carried-in FOUP body 20a is provided in the processing space of the cleaning tank body 50. In this way, the FOUP body holding portion holds the FOUP body 20a, so that the FOUP body 20a is stored in the processing space of the cleaning tank body 50. The openable/closable lid 5a is provided above the cleaning tank body 50. Specifically, the opening/closing lid 5a is provided so as to be openable and closable relative to the opening of the cleaning tank body 50. The opening/closing lid 5a opens and closes relative to the opening of the cleaning tank body 50 by the operation of an air cylinder. A door holder 5e (see FIG. 7) capable of holding the door 20b is provided on the inside of the opening/closing lid 5a. The configuration of the opening/closing lid 5a will be described later.

In addition, a cleaning liquid nozzle 52 is provided inside the cleaning tank body 50 to supply cleaning liquid (liquid) used in cleaning the FOUP body 20a and door 20b. In addition, a rotation unit 53 is provided inside the cleaning tank body 50 to rotate the FOUP body 20a held by the FOUP body holding unit. Furthermore, a rotation unit 5r (see FIG. 7) is provided on the opening and closing lid 5a of the cleaning tank body 50 to rotate the door 20b held by the door holding unit 5e. Cleaning liquid is sprayed from the cleaning liquid nozzle 52 onto the FOUP body 20a and door 20b rotated by the rotation unit 53 and rotation unit 5r, thereby cleaning the FOUP 20. Specifically, while the door 20b is held by the door holder 5e and the opening/closing lid is closed on the cleaning tank opening of the cleaning tank body 50, the cleaning liquid nozzle 52 ejects the cleaning liquid onto the inner surface (inner surface) 20m (see Figures 2, 3A, and 3B) of the FOUP body 20a and the door 20b. The temperature of the ejected cleaning liquid is set to, for example, about 60 degrees to 90 degrees, which is relatively high.

An air blow nozzle (not shown) for spraying gas is provided inside the cleaning tank body 50, and after the cleaning process with liquid, the gas from the air blow nozzle is sprayed onto the FOUP body 20a and door 20b to dry them. Note that even during the drying process with gas from the air blow nozzle, the FOUP body 20a and door 20b are rotated by the rotating parts 53 and 5r. Alternatively, the liquid adhering to the FOUP body 20a and door 20b may be dried by rotation by the rotating parts 53 and 5r without spraying gas from the air blow nozzle. The temperature of the gas sprayed from the air blow nozzle is set to, for example, about 90 degrees to 120 degrees.

In this embodiment, when the FOUP 20 is cleaned in the cleaning tank 5, the robot 3 transports the FOUP body 20a and the door 20b on the disassembly/connection stage 4 separately to the cleaning tank 5. For example, the robot 3 transports the FOUP body 20a from the cleaning tank opening of the cleaning tank body 50 to the inside of the cleaning tank body 50 with the opening of the FOUP body 20a facing downward. Then, the FOUP body holding part holds the FOUP body 20a with the opening of the FOUP body 20a facing downward. In addition, the robot 3 transports the door 20b to the door holding part 5e so that the outer surface 20d of the door 20b is held by the door holding part 5e of the opening/closing lid. When the opening/closing lid is closed, the inner surface (inner surface) 20m of the door 20b (see Figures 2, 3A, and 3B) faces downward. The cleaning liquid nozzle 52 then ejects the liquid onto the inner surface 20m of the door 20b.

When cleaning of the FOUP 20 is completed in the cleaning tank 5, the robot 3 transports the FOUP body 20a and door 20b in the cleaning tank 5 separately to the vacuum tank 6.

The vacuum chamber 6 is a chamber in which the FOUP 20 is vacuum-dried. Inside the vacuum chamber 6, there is a holder that holds the FOUP body 20a and door 20b transported into the vacuum chamber 6, a halogen lamp, and a turbo pump that can evacuate the inside of the vacuum chamber 6. With the FOUP body 20a and door 20b held by the holder, the vacuum chamber 6 heats with the halogen lamp while evacuating the inside of the vacuum chamber 6 with the turbo pump, thereby vacuum-drying the FOUP body 20a and door 20b.

When the vacuum drying of the FOUP 20 is completed in the vacuum chamber 6, the robot 3 transports the FOUP body 20a and the door 20b separately from inside the vacuum chamber 6 onto the disassembly/connection stage 4. The disassembly/connection stage 4 then connects the FOUP body 20a and the door 20b.

The unload port 7 transports the cleaned and vacuum-dried FOUP 20 placed by the robot 3 in the internal portion of the casing 1a of the unload port 7 to the outside of the casing 1a.

For example, after vacuum drying, the FOUP 20, in which the FOUP body 20a and the door 20b are connected at the disassembly/connection stage 4, is transported and placed by the robot 3 in the inside of the casing 1a of the unload port 7. When the FOUP 20 is placed on the unload port 7 in this way, the shutter 7a provided at the opening 1c of the casing 1a rises. This allows the FOUP 20 to be transported from the opening 1c to the outside of the casing 1a. That is, the FOUP 20 is in a state where it can be transported to the outside of the wafer container cleaning device 1. Then, the FOUP 20 is slid in the direction of the arrow 7b by the slide device of the unload port 7 (having a mechanism similar to that of the slide device of the load port 2), and the FOUP 20 is transported to the outside of the casing 1a. When the FOUP 20 is transported to the outside of the casing 1a in this way, the shutter 7a descends and the opening 1c of the casing 1a is closed.

The control unit 8 controls the operation of the entire wafer container cleaning apparatus 1. For example, the control unit 8 controls the load port 2, robot 3, disassembly/connection stage 4, cleaning tank 5, vacuum tank 6, and unload port 7 to operate the load port 2, robot 3, disassembly/connection stage 4, cleaning tank 5, vacuum tank 6, and unload port 7 as described above.

Fig. 5 is a diagram showing an example of the configuration of the control unit 8 according to the first embodiment. As shown in Fig. 5, the control unit 8 includes a CPU (Central Processing Unit) 8a, a ROM (Read Only Memory) 8b, a RAM (Random Access Memory) 8c, a HDD (Hard Disk Drive) 8d, and a communication interface 8e. These are connected via an internal bus.

The CPU 8a executes various processes while using the memory area of the RAM 8c as a temporary storage area for data used in the various processes. The processes executed by the CPU 8a will be described later. The ROM 8b and the HDD 8d store programs for executing the various processes, as well as various databases and tables used when executing the various processes.

The communication interface 8e is an interface for communicating with each of the above-mentioned parts of the wafer storage container cleaning apparatus 1, and also for communicating with external devices connected to the wafer storage container cleaning apparatus 1 via a network. For example, the communication interface 8e is a network interface card.

Next, the configuration of the opening and closing lid of the cleaning tank 5 will be described. Figures 6 and 7 are diagrams showing an example of the configuration of the opening and closing lid 5a according to the first embodiment. Figure 6 shows a state in which the door 20b is held by the door holding part 5e provided on the opening and closing lid 5a. As shown in Figure 6, a cover 5b that covers the outside of the door 20b is attached to the door holding part 5e. The cover 5b is provided so as to be rotatable together with the door holding part 5e by the rotating part 5r. A gap is formed between the opening and closing lid 5a located outside the cover 5b and the wall surface of the cleaning tank main body 50 so that they do not interfere with them during rotation. The cover 5b is a hollow cylindrical member. An opening 5c is formed in the cover 5b so as to cut out a part of the bottom surface on the front side of the paper in Figure 6, and the inner surface 20m, which is the surface to be cleaned of the door 20b, is exposed and held in this opening 5c. Therefore, the opening 5c is formed to fit the shape of the door 20b, and a notch 5d is formed to ensure the space required when the door 20b is gripped by the robot 3. The lower end of the cover 5b (the end on the side of the cleaning tank body 50 when the opening/closing lid 5a is closed) protrudes downward from the lower end of the opening/closing lid 5a (the end on the side of the cleaning tank body 50 when the opening/closing lid 5a is closed). This makes it possible to prevent the cleaning liquid adhering to the opening/closing lid 5a from flowing due to gravity and adhering to the door 20b when the opening/closing lid 5a is opened.

Figure 7 shows the cover 5b and the door holding part 5e as viewed from the opening/closing lid 5a side, with the opening/closing lid 5a omitted. Note that Figure 7 shows the state in which the door 20b is not being held by the door holding part 5e. The door holding part 5e is provided on the inner surface 5f (see Figure 6) of the opening/closing lid 5a. As shown in Figure 7, the door holding part 5e has two suction pads 5g for vacuum-adhering the door 20b. The outer surface 20d of the door 20b is vacuum-adhered by these suction pads 5g, so that the door 20b is held by the door holding part 5e.

The door holder 5e also has four pads 5h, 5i, 5j, and 5k. Of these, two pads, 5i and 5j, are formed with positioning pins. The positioning pins engage with positioning holes formed in the outer surface 20d of the door 20b, thereby positioning the door 20b relative to the door holder 5e. The aforementioned suction pad 5g is the same as these four pads 5h, 5i, 5j, and 5k, and differs only in that it has suction holes to which suction force is applied by a suction source (not shown).

7, the cover 5b is formed with a plurality of holes (purge holes) 5l arranged in a circular pattern. Gas (e.g., _N2 , etc.) is supplied from a gas nozzle 5n (see FIG. 8) through the plurality of holes 5l.

A dispersion plate 5m is provided at a position facing the door holder 5e of the opening/closing lid 5a. The dispersion plate 5m is, for example, a plate-shaped member bent into an L shape. When the gas supplied from the gas nozzle 5n hits the dispersion plate 5m, the direction of the gas flow is dispersed by the dispersion plate 5m.

Next, the operation of the wafer storage container cleaning apparatus 1 according to the first embodiment during cleaning of the FOUP 20 will be described. FIG. 8 is a diagram for explaining an example of the operation of the wafer storage container cleaning apparatus 1 according to the first embodiment during cleaning (cleaning process) of the FOUP 20. FIG. 8 is a schematic diagram of the opening/closing lid 5a, door holder 5e, cover 5b, gas nozzle 5n, door 20b, etc.

As shown in FIG. 8, a gas nozzle 5n is provided on the opening/closing lid 5a, and the gap between the gas nozzle 5n and the opening/closing lid 5a is sealed with a packing or the like. Then, while the cleaning tank 5 is cleaning the FOUP body 20a and the door 20b with the opening/closing lid 5a closed, the gas nozzle 5n supplies gas to the hole 5l. As a result, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5p.

That is, the gas nozzle 5n supplies gas to a small space 20n formed between the door holder 5e and the outer surface 20d of the door 20b. The gas from the gas nozzle 5n is also supplied to a gap 20p communicating with the space 20n. This gap 20p is a gap between a side surface 20f of the door 20b and a surface (opposing surface) 5x of the inner wall surface of the cover 5b facing the side surface 20f. The gap 20p also communicates with the processing space of the cleaning tank body 50. The space 20n and the gap 20p are each an example of a gas supply space.

As a result, the space 20n and the gap 20p are kept at a positive pressure by the gas supplied by the gas nozzle 5n. Also, a gas flow is formed in the gap 20p around the protrusion hole 20g of the door 20b in the direction toward the cleaning tank body 50. Therefore, according to the wafer storage container cleaning device 1 of the first embodiment, it is possible to suppress the cleaning liquid from adhering to the side surface 20f and the outer surface 20d of the door 20b, and to suppress the cleaning liquid from entering the latch sliding space 20k of the door 20b. In other words, the flow of gas from the gas nozzle 5n can prevent the cleaning liquid from the cleaning liquid nozzle 52 from entering through the protrusion hole 20g. Also, by having the cover 5b, it is possible to create the space 20n and the gap 20p, which are gas supply spaces (the space to which the gas should be supplied can be narrowed as much as possible), and this can efficiently prevent the cleaning liquid from entering through the protrusion hole 20g. It is desirable that the lower end of the cover 5b (the end on the side of the cleaning tank body 50 when the opening/closing lid 5a is closed) has an extension portion that extends toward the inside of the cleaning tank 5 as shown in Figure 8. This narrows the area where the gas from the gas nozzle 5n is discharged through the gap 20p, increasing the gas flow rate and more appropriately maintaining a positive pressure state above the lower end of the cover 5b.

As mentioned above, the door 20b is rotated by the rotating part 5r while the cleaning process is performed, so gas from the gas nozzle 5n is not supplied only to specific locations, which causes unevenness in the cleaning process. In addition, the rotation of the door 20b causes gas from the gas nozzle 5n to be supplied to the entire space 20n and gap 20p, which prevents the cleaning liquid from adhering to the side surface 20f and outer surface 20d of the door 20b.

In the first embodiment, after the cleaning tank 5 cleans the FOUP 20, the vacuum tank 6 vacuum dries the FOUP 20. If cleaning liquid adheres to the side surface 20f and outer surface 20d of the door 20b or enters the latch sliding space 20k after cleaning the cleaning tank 5, the presence of the cleaning liquid will lengthen the time required to reduce the pressure in the vacuum tank 6 to the target pressure. However, according to the wafer storage container cleaning device 1 of the first embodiment, the cleaning liquid is prevented from adhering to the side surface 20f and outer surface 20d of the door 20b and from entering the latch sliding space 20k of the door 20b, so that the time required to reduce the pressure in the vacuum tank 6 to the target pressure can be prevented from becoming long.

In addition, by providing a dispersion plate 5m on the opening and closing lid 5a, the gas can more easily reach the entire space of the space 20n and the gap 20p, and a positive pressure state can be more appropriately maintained.

Second Embodiment
Next, a wafer container cleaning apparatus 1 according to a second embodiment will be described. The second embodiment differs from the wafer container cleaning apparatus 1 according to the first embodiment in that a gas nozzle 5n supplies gas to the inside of the door 20b.

Figure 9 shows the state in which the door holder 5e of the wafer container cleaning device 1 according to the second embodiment holds the door 20b, with the cover 5b and the opening/closing lid 5a omitted.

In the first embodiment, key holes 20e are formed in the outer surface 20d of the door 20b at positions facing the two pads 5h, 5k of the door holding portion 5e shown in FIG. 7. In the second embodiment, the two pads 5h, 5k are removed from the door holding portion 5e, and as a result, as shown in FIG. 9, a gas nozzle 5n is inserted into each of the two holes exposed in the door holding portion 5e. The gas nozzle 5n is connected to a gas supply pipe that supplies gas from a gas supply source provided outside the opening/closing lid 5a. One end of this gas supply pipe is connected to the gas nozzle 5n, and the other end is connected to an external gas supply source via a rotary joint.

Figure 10 is a cross-sectional view taken along line B-B of Figure 9 in the second embodiment, in which the two pads 5h and 5k have been removed from the door holding portion 5e and the gas nozzles 5n have been inserted into the two holes exposed in the door holding portion 5e. Figure 10 is a schematic diagram of the door holding portion 5e, the gas nozzles 5n, the door 20b, etc.

As shown in FIG. 10, the gas nozzle 5n is provided at a position facing the key hole 20e and supplies gas to the key hole 20e. As a result, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5s.

That is, the gas supplied to the key hole 20e is supplied to the gap 20p (see FIG. 8) through the protrusion hole 20g via the latch sliding space 20k. As a result, the wafer storage container cleaning device 1 according to the second embodiment can obtain the same effect as the wafer storage container cleaning device 1 according to the first embodiment. Furthermore, since the gas is supplied directly to the latch sliding space 20k, the cleaning liquid can be prevented from entering the latch sliding space 20k more than in the first embodiment. Also, since the door 20b is rotating during cleaning of the FOUP 20, the gas supplied to the key hole 20e is supplied to the space between the cover 5b and the door 20b through the protrusion hole 20g. As a result, the gas supplied by the gas nozzle 5n forms a swirling flow, making it difficult for the cleaning liquid to enter the area above the inner surface 20m of the door 20b.

In this embodiment, gas is supplied from the gas nozzle 5n to the key hole 20e, but in the same manner as in the first embodiment, a gas nozzle 5n may also be provided for the key hole 20e to more reliably prevent the cleaning liquid from entering the protrusion hole 20g of the door 20b and the outer surface 20d of the door 20b.

(Modification of the second embodiment)
Next, a wafer container cleaning apparatus 1 according to a modification of the second embodiment will be described with reference to FIG. 11. In the modification of the second embodiment, the gas nozzle 5n supplies gas to the through hole 5n2 formed in the latch key 5n1, thereby supplying gas to the inside of the door 20b, which is different from the wafer container cleaning apparatus 1 according to the second embodiment. The latch key 5n1 is a latch key having a structure similar to that of the latch key 4a provided on the disassembly/connection stage 4, and in this modification, the latch key 5n1 is inserted into the key cylinder 20h of the door 20b and held by the door holding part 5e. The latch key 5n1 may be attached to the door holding part 5e in advance, or may be attached when the door 20b is transported to the cleaning tank 5. When the latch key 5n1 is attached to the door holding part 5e in advance, the door 20b may be held by the latch key 5n1 instead of the suction pad 5g.

Figure 11 is a cross-sectional view taken along line B-B in Figure 9 in a modified version of the second embodiment, in which the two pads 5h and 5k have been removed from the door holder 5e and the gas nozzles 5n have been inserted into the two holes exposed in the door holder 5e. However, Figure 11 is a schematic diagram of the door holder 5e, the gas nozzles 5n, the door 20b, etc., just like Figure 10.

As shown in FIG. 11, in a modified example of the second embodiment, the door 20b is washed with the latch key 5n1 inserted into the key cylinder 20h. The latch key 5n1 is formed with a through hole 5n2. The key cylinder 20h is also formed with a through hole 20s (latch mechanism hole). The through hole 20s communicates with the latch sliding space 20k. As shown in FIG. 11, when the latch key 5n1 is inserted into the key cylinder 20h, the through hole 20s communicates with the through hole 5n2. The gas nozzle 5n is provided at a position facing the through hole 5n2 of the latch key 5n1, and supplies gas to the through hole 5n2. As a result, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5t.

That is, the gas supplied to the through hole 5n2 formed in the latch key 5n1 passes through the through hole 20s of the key cylinder 20h and the latch sliding space 20k, and is supplied from the projection hole 20g to the gap 20p (see FIG. 8). In addition, since the door 20b rotates during cleaning of the FOUP 20, the gas supplied to the key hole 20e becomes a swirling flow, as in the second embodiment. As a result, the wafer storage container cleaning device 1 according to the modified example of the second embodiment can obtain the same effect as the wafer storage container cleaning device 1 according to the second embodiment. Furthermore, since the gas is directly supplied to the latch sliding space 20k, it is possible to further suppress the cleaning liquid from entering the latch sliding space 20k than in the first embodiment.

(Other Modifications)
In the various embodiments or modified examples described above, the gas nozzle 5n supplies gas during cleaning of the FOUP 20. However, in the various embodiments or modified examples described above, the gas nozzle 5n may supply gas not only during cleaning, but also during the operation of removing the door 20b from the door holder 5e of the cleaning tank 5 after cleaning is completed.

When the opening and closing cover 5a of the cleaning tank 5 is opened, the temperature inside the cleaning tank 5 drops because the cleaning liquid is relatively hot due to the use of the high-temperature cleaning liquid. This causes the mist of cleaning liquid to liquefy, and the liquefied cleaning liquid is more likely to flow into the projection hole 20g formed in the side surface 20f of the door 20b and into the outer surface 20d of the door 20b.

When the door 20b is being removed (at least when the opening/closing cover 5a is opened), the gas nozzle 5n supplies gas, which prevents the liquefied cleaning liquid from flowing into the protrusion hole 20g or the outer surface 20d of the door 20b. It also prevents mist-like cleaning liquid from entering through the protrusion hole 20g. Furthermore, by supplying gas from the gas nozzle 5n, the gas is also sprayed onto the cover 5b, so that even if cleaning liquid is attached to the cover 5b after the cleaning process, the cleaning liquid can be prevented from adhering to the protrusion hole 20g or the outer surface 20d of the door 20b.

The gas nozzle 5n may continue to supply gas from the time the FOUP 20 is being cleaned until the opening and closing lid 5a is opened and the door 20b is removed.

In the various embodiments and modifications described above, the FOUP body 20a and the door 20b are cleaned and dried in the same cleaning tank, but this is not limiting and each may be cleaned at a different time. A dedicated cleaning tank for the door 20b may also be provided.

In the various embodiments and modifications described above, a cleaning tank 5 having a cleaning liquid nozzle 52 and an air blow nozzle has been exemplified, but this is not limiting, and the cleaning liquid and gas may be supplied by switching the supply source of the same nozzle.

In the above-mentioned various embodiments or modifications, the cover 5b is provided with a plurality of holes 5l, but the present invention is not limited to this. Any structure may be used as long as the door holder 5e and the cover 5b are connected and the gas from the gas nozzle 5n passes from the top to the bottom of the cover 5b and reaches the space 20n and the gap 20p. For example, the connection portion of the cover 5b with the door holder 5e does not need to be a surface that is provided over the entire outer periphery of the door holder 5e, and it may be a shape in which only a part of the cover 5b is connected to the four corners of the door holder 5e. In this case, the surface of the cover 5b on the opening/closing lid 5a side is shaped so that four beams are provided. The connection portion does not need to be four places, and it is sufficient that the door holder 5e and the cover 5b are connected, and it may be two or three places.

1 Wafer storage container cleaning device 5 Cleaning tank 5a Opening and closing lid 5n Gas nozzle

Claims (6)

A wafer storage container cleaning device for cleaning a door of a wafer storage container, the door having a key hole on one side of the door that can be switched between locked and unlocked from a wafer storage container body by rotating the door with a latch key inserted therein, and a projection hole on a side of the door through which a latch can project when the door is locked, comprising:
A door holding portion that holds the door;
a cleaning liquid nozzle for supplying cleaning liquid to the other surface of the door;
a gas nozzle that generates a gas flow that inhibits the cleaning liquid from entering through the projection hole at least when the cleaning liquid is being supplied to the door from the cleaning liquid nozzle;
an opening/closing lid provided so as to be openable and closable relative to the cleaning tank opening and having the door holding portion;
a cleaning tank body in which a processing space is formed by closing the cleaning tank opening with the opening/closing lid;
Equipped with
a gas nozzle configured to supply the gas from one side of the door to a gas supply space formed between the opening/closing lid and the door, including the side surface, while the door is held by the door holding portion . 2. The wafer container cleaning apparatus according to claim 1, wherein the wafer container body is placed in the processing space of the cleaning tank body . a cover provided on the door holding portion to cover the door;
3. The wafer container cleaning apparatus according to claim 2, wherein the gas nozzle supplies gas to the gas supply space communicating with a gap between the side surface and an opposing surface of an inner wall surface of the cover that faces the side surface. The wafer container cleaning device according to any one of claims 1 to 3, wherein the gas nozzle supplies the gas to the key hole. The latch key and the key hole have a through hole,
4. The wafer container cleaning apparatus according to claim 1, wherein the gas is supplied from the gas nozzle to the through hole while the latch key is inserted into the door. The wafer storage container cleaning device according to claim 2 or 3, wherein the gas nozzle further supplies the gas when the opening and closing lid is opened after the wafer storage container is cleaned.

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