JP4096249B2 - LCD substrate inspection equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a liquid crystal substrate inspection used for inspection of a liquid crystal substrate used for a liquid crystal display, an organic EL display, and the like, and more particularly to a prober used for substrate inspection.
[0002]
[Prior art]
A liquid crystal substrate or a thin film transistor array substrate (TFT array substrate) includes thin film transistors arranged in a matrix and signal electrodes that supply drive signals to the thin film transistors.
[0003]
A plurality of TFT arrays are provided on a substrate formed of a glass substrate or the like, and each TFT array is provided with a plurality of thin film transistors arranged in a matrix, and this thin film transistor is determined by signals from scanning signal electrode terminals and video signal electrode terminals. Driven.
[0004]
As a device for inspecting a TFT array formed on a substrate, a substrate inspection device such as a TFT array inspection device or a liquid crystal substrate inspection device is known. The substrate inspection apparatus includes an inspection prober and an inspection circuit that are electrically connected to the scanning signal electrode terminal and the video signal electrode terminal. The inspection circuit applies a predetermined voltage to the inspection prober, detects a current flowing by the application, and examines a gate-source short circuit, a point defect, a disconnection, and the like.
[0005]
The TFT array formed on the liquid crystal substrate has various sizes and specifications, the layouts thereof are different, and the driving electrodes formed on the liquid crystal substrate are also different for each layout.
[0006]
For this reason, a substrate inspection apparatus for inspecting a liquid crystal substrate also has a prober electrode position set in accordance with the layout of the TFT array, and is replaced and inspected according to the liquid crystal substrate to be inspected. ing.
[0007]
[Problems to be solved by the invention]
When inspecting the liquid crystal substrate, the prober frame is placed from above the liquid crystal substrate, and the probe pins arranged downward on the prober frame are brought into contact with the electrodes formed on the liquid crystal substrate, so that the liquid crystal substrate and the prober There is an electrical connection between the two. At this time, the frame material constituting the prober frame is distorted due to the weight of the prober frame itself, the reaction force of the probe pin, the processing strain, and the like.
[0008]
Even if the total amount of distortion of the frame material is within the range of the probe pin stroke, all the probe pins included in the prober frame can be brought into contact with all the electrodes of the liquid crystal substrate. When the stroke range is exceeded, some probe pins cannot contact the electrode on the liquid crystal substrate side.
[0009]
6 and 7 are cross-sectional views for explaining a non-contact state between the probe pin and the electrode on the liquid crystal substrate side due to distortion of the frame material.
[0010]
In FIG. 6, the prober frame 2 constituting the prober 1 has a strain of δ between the center portion and the end portion due to its own weight or the like. When the prober frame 2 in a distorted state is placed on the substrate 3, the probe pin 1b in the center portion (portion A in the figure) of the prober frame 2 is an electrode (shown in FIG. 6) formed on the substrate 3. Not). FIG. 7A shows a contact state between the probe pin 1b and the electrode 3a. A contact 1 d at the tip of the probe pin 1 held in the probe pin support 1 c with a predetermined stroke is in contact with an electrode 3 a formed on the substrate 3.
[0011]
On the other hand, when the strain δ exceeds the stroke of the probe pin 1b, the probe pin 1b at the end of the prober frame 2 (portion B in the figure) is an electrode (not shown in FIG. 6) formed on the substrate 3. Not contact with). FIG. 7B shows a non-contact state between the probe pin 1b and the electrode 3a. The contact 1d at the tip of the probe pin 1 cannot contact the electrode 3a formed on the substrate 3 due to the strain δ.
[0012]
Therefore, the conventional board inspection apparatus has a problem that electrical contact between the probe pin and the board-side electrode becomes defective due to distortion of the prober frame. This problem occurs more frequently as the substrate becomes larger (for example, 1100 mm × 1300 mm).
[0013]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described conventional problems, to reduce the prober frame distortion, and to eliminate the contact failure of the probe pins with respect to all the electrodes of the liquid crystal substrate.
[0014]
[Means for Solving the Problems]
The present invention reduces the distortion of the prober frame by generating a bending moment in the prober frame distorted by its own weight and lifting the bent portion of the prober frame upward, thereby reducing the distortion of the prober frame. The parallelism between the liquid crystal substrate and the prober frame is increased so that the probe pins are in good contact with all the electrodes of the liquid crystal substrate.
[0015]
The liquid crystal substrate inspection apparatus of the present invention is a liquid crystal substrate inspection device that inspects a liquid crystal substrate using a prober, and adjusts the deflection of the prober frame by generating a bending moment in the prober frame for attaching the prober frame and the prober frame. The bending mechanism is configured to generate a bending moment in the prober frame and adjust the deflection of the prober.
[0016]
The first form of the bending mechanism includes a support portion that supports the prober frame in the prober mounting frame, and first urging means that applies force to the end portion of the prober frame. The first biasing means applies a force to the prober frame to generate a bending moment in the prober frame with the support portion as a fulcrum, and adjusts the deflection of the prober frame by this bending moment. The adjustment amount can be adjusted by the applying force by the first urging means.
[0017]
This first urging means can be a screw mechanism for tightening a bolt into the prober mounting frame, and the adjustment amount of the deflection of the prober frame can be adjusted by the tightening amount of the bolt. In addition, the screw mechanism may include a scale plate that represents the tightening amount of the bolt. This scale plate represents the amount of bolt tightening by the rotation angle of the bolt, and the bolt tightening amount read from this scale plate at the time of adjustment is used as a guide for the deflection adjustment amount of the prober frame. The bolt tightening amount may be read in advance, and the bolt tightening amount may be used as a reference value in the subsequent adjustment.
[0018]
The second form of the bending mechanism is configured to include second urging means for pressing the prober mounting frame to the prober frame. When the prober mounting frame is pressed against the prober frame by the second urging means, a bending moment is generated in the prober frame due to a reaction from the prober mounting frame. The bending of the prober frame is adjusted by this bending moment.
[0019]
The second urging means may be configured to include an eccentric cam, and the prober mounting frame is pressed against the prober frame by rotating the eccentric cam. Further, the eccentric cam constitutes a linear lock together with a set screw for fixing the prober frame to the prober mounting frame. The prober frame is fixed to the prober mounting frame by pressing the prober frame with an eccentric cam and holding this state with a set screw.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0021]
FIG. 1 is a schematic diagram showing the components separated for explaining the liquid crystal substrate inspection apparatus of the present invention.
[0022]
The liquid crystal substrate 3 is an inspection object to be inspected by the liquid crystal substrate inspection apparatus 1, and a TFT array 3a is formed on the substrate. The layout of the TFT array 3a formed on the liquid crystal substrate 3 is variously set according to the size and specifications of the liquid crystal panel, for example. Thin film transistors are formed in a matrix on the TFT array 3a on the liquid crystal substrate 3, and signal electrode terminals (for example, scanning signal electrode terminals and video signal electrode terminals) for driving the thin film transistors are formed. Further, an electrode 3b for electrically connecting to the outside of the liquid crystal substrate is formed outside the array 3a of the liquid crystal substrate 3.
[0023]
The liquid crystal substrate inspection apparatus 1 of the present invention includes a prober 1 for performing an inspection by being electrically connected to the electrode 3b of the liquid crystal substrate 3. The prober 1 includes a prober frame 1 a and probe pins 1 b that are electrically connected to the electrodes 3 b of the liquid crystal substrate 3. The number and arrangement of the probe pins 1 b are provided corresponding to the electrodes 3 b of the liquid crystal substrate 3.
[0024]
The liquid crystal substrate 3 is disposed on the pallet 7, and the prober frame 1 a is disposed on the liquid crystal substrate 3. Between the liquid crystal substrate 3 and the prober frame 1a, electrical contact is made between the electrode 3b and the probe pin 1b, and between the prober frame 1a and the pallet 7, connectors provided on the prober frame 1a and the pallet 7 are used. 7a. In FIG. 1, only the pallet-side connector 7a provided on the pallet 7 is shown, and the connector on the prober frame 1a side is omitted.
[0025]
Further, the pallet 7 is placed on the stage 8 and can be moved freely. Between the pallet 7 and the stage 8, a pallet side connector 7b provided on the pallet 7 side and a stage side connector 8a provided on the stage 8 side are used.
[0026]
FIG. 2 is a cross-sectional view for explaining a prober frame by the liquid crystal substrate inspection apparatus of the present invention. By adjusting the strain of the frame material of the bending mechanism, good contact is obtained between the probe pin and the electrode on the liquid crystal substrate side. Shows the state.
[0027]
In FIG. 2, the prober frame 1 a is supported by the prober mounting frame 2 at the outer portion. The prober mounting frame 2 can be formed by a frame having an opening for supporting the prober frame 1a on the inside, and the prober mounting frame 2 is supported by the outer peripheral portion of the frame. A bending mechanism 4 is provided on the outer periphery of the prober frame 1a and the outer periphery of the prober mounting frame 2 that supports the prober frame 1a.
[0028]
The bending mechanism 4 generates a bending moment in the prober frame 1 a and fixes the prober frame 1 a to the prober mounting frame 2. Due to this bending moment, a force is applied to the central portion of the prober frame 1a in the upward pulling direction to adjust the strain of the prober frame 1a. The bending mechanism 4 can change the adjustment amount of the strain.
[0029]
By adjusting the strain of the prober frame 1a, the probe pin 1b provided with the prober frame 1a is not only a central part but also an electrode on the substrate 3 side (not shown in FIG. 2) at the end. Can be brought into electrical contact.
[0030]
The bending mechanism 4 can be arranged at any position on the outer peripheral portion of the prober frame 1a and the prober mounting frame 2, but when the prober frame 1a has a crosspiece portion, it is arranged at both end positions of the crosspiece portion. By doing so, a higher effect can be obtained.
[0031]
Hereinafter, the bending mechanism provided in the liquid crystal substrate inspection apparatus of the present invention will be described with reference to FIGS. 3 is a cross-sectional view and a plan view for explaining a first configuration example of the bending mechanism, and FIGS. 4 and 5 are a cross-sectional view and a plan view for explaining a second configuration example of the bending mechanism. is there.
[0032]
First, a first configuration example of the bending mechanism will be described. FIG. 3A shows a state in which the prober frame distortion is not adjusted by the bending mechanism, and FIG. 3B shows a state in which the prober frame distortion is adjusted by the bending mechanism.
[0033]
The first configuration example of the bending mechanism 4 includes a support portion 2a formed on the prober mounting frame 2 side, and first urging means 5 that applies force to the end portion of the prober frame 1a of the prober 1.
[0034]
The support portion 2a is formed at the end of the prober frame 1a so as to protrude toward the lower surface of the prober frame 1a. When the prober frame 1a is disposed on the prober mounting frame 2, a part of the lower surface of the prober frame 1a The prober frame 1a is supported by using the contact point as a fulcrum.
[0035]
The first urging means 5 applies a force to the end portion of the prober frame 1a at an outer position with respect to the support portion 2a, thereby giving a bending moment to the prober frame 1a with the support portion 2a as a fulcrum. To do. The first urging means 5 includes a support portion 2a serving as a fulcrum and a screw mechanism of bolts 5a and bolt holes 1b and 2b. In the screw mechanism, the bolt hole 1b is formed on the prober frame 1a side, and the bolt hole 2b is formed on the prober mounting frame 2 side. By tightening the bolt 5a into the bolt holes 1b and 2b, the end portion of the prober frame 1a which is on the outer side with respect to the support portion 2a is pushed downward. As a result, a bending moment is generated in the prober frame 1a, and the central portion of the prober frame 1a that is inside the support portion 2a is pulled upward (in the direction of the arrow in FIG. 3B).
[0036]
The adjustment amount of the strain adjustment by the bending mechanism 4 is related to the tightening amount by the bolt 5a of the screw mechanism, and can be expressed by the rotation angle of the bolt 5a.
[0037]
The bending mechanism 4 of the present invention is configured to display the adjustment amount of the strain adjustment. In the first urging means 5, the bolt 5a can be a holed bolt, for example, and the marker 5b indicating the reference position at the upper end. And a scale plate 5c is provided on the outer peripheral portion of the bolt 5a on the upper surface of the prober frame 1a. The position of the marker 5b with respect to the scale plate 5c represents the rotational position of the bolt 5a. From this position, the degree of tightening of the bolt 5a can be known, and the amount of strain adjustment can be known.
[0038]
As a usage of the marker 5b and the scale plate 5c, for example, in the strain adjustment operation, in addition to confirming the adjustment amount of the currently performed strain, the adjustment amount data obtained by the adjustment performed in advance is recorded, In the subsequent strain adjustment, the adjustment amount data can be read as a reference value for adjustment.
[0039]
Next, a second configuration example of the bending mechanism will be described. FIG. 4A shows a state in which the prober frame distortion is not adjusted by the bending mechanism, and FIG. 4B shows a state in which the prober frame distortion is adjusted by the bending mechanism. 5A and 5C are views of the bending mechanism as viewed from above or below, and FIG. 5B is a cross-sectional view of the bending mechanism. 4 and 5 also show a second configuration example of the bending mechanism shown in FIG.
[0040]
The second configuration example of the bending mechanism 4 includes second urging means 6 formed on the prober frame 1a side.
[0041]
The second urging means 6 applies a force from the prober frame 1a side to the end of the prober mounting frame 2 (arrow P1 in FIG. 4B), thereby causing the prober to react by reaction from the prober mounting frame 2 side. A pressing force toward the center of the frame 1a is applied to the prober frame 1a (arrow P2 in FIG. 4B). This pushing force acts in the direction of increasing the acting force for pulling the prober frame 1a upward by the first configuration of the bending mechanism 4 (arrow P3 in FIG. 4C).
[0042]
The second urging means 6 includes an eccentric cam 6b, a screw 6a for rotating the eccentric cam 6b, and a set screw 6c for maintaining the positional relationship between the prober frame 1a and the prober mounting frame 2. The eccentric cam 6b constitutes a mechanism called a linear lock. As shown in FIG. 5C, the end of the prober mounting frame 2 is pushed outward by rotating the screw 6a. Since the prober mounting frame 2 is fixed by a configuration (not shown), the prober frame 1a receives a reaction from the prober mounting frame 2 side.
[0043]
This reaction becomes a pressing force toward the central portion of the prober frame 1a (arrow P2 in FIG. 4B). In the prober frame 1a, an acting force is exerted in such a direction that the central portion of the prober frame 1a is pulled upward by the first urging means 5, so that the reaction force pulls the central portion of the prober frame 1a upward. Work in the direction of increasing the power of.
[0044]
The second urging means 6 fixes the prober frame 1a at an arbitrary tightening position and maintains the strain adjustment state.
[0045]
In the above description, the example in which the second urging means 6 is formed on the prober frame 1a side is shown, but a configuration may be adopted in which the second urging means 6 is formed on the prober mounting frame 2 side. In this case, the prober frame 1a side is pressed from the prober mounting frame 2 side, and the prober frame 1a is pushed upward to adjust the strain.
[0046]
【The invention's effect】
As described above, according to the present invention, it is possible to reduce the distortion of the prober frame and eliminate the contact failure of the probe pins with respect to all the electrodes of the liquid crystal substrate.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic view showing components separately for explaining a liquid crystal substrate inspection apparatus of the present invention.
FIG. 2 is a cross-sectional view for explaining a prober frame by the liquid crystal substrate inspection apparatus of the present invention.
FIG. 3 is a cross-sectional view and a plan view for explaining a first configuration example of a bending mechanism.
FIG. 4 is a cross-sectional view for explaining first and second configuration examples of a bending mechanism.
FIGS. 5A and 5B are a cross-sectional view and a plan view for explaining first and second configuration examples of the bending mechanism. FIGS.
FIG. 6 is a cross-sectional view for explaining a non-contact state between a probe pin and an electrode on a liquid crystal substrate side due to distortion of a frame material.
FIG. 7 is a cross-sectional view for explaining a non-contact state between a probe pin and an electrode on a liquid crystal substrate side due to distortion of a frame material.
[Explanation of symbols]
1 ... prober, 1a ... prober frame, 1b ... probe pin, 2 ... prober mounting frame, 2a ... support, 2b ... bolt hole, 3 ... substrate, 3a ... TFT array, 3b ... electrode, 4 ... bending mechanism, 5 ... 1st urging means, 5a ... bolt, 5b ... marker, 5c ... scale plate, 6 ... second urging means, 6a ... screw, 6b ... eccentric cam, 7 ... pallet, 7a, 7b ... pallet side connector, 8 ... Stage, 8a ... stage side connector, 10 ... liquid crystal substrate inspection apparatus.

Claims (4)

In a liquid crystal substrate inspection apparatus that inspects a liquid crystal substrate using a prober,
A prober mounting frame for mounting the prober;
A bending mechanism that adjusts the deflection of the prober frame by generating a bending moment in the prober frame of the prober;
The bending mechanism is
A support portion for supporting the prober frame in the prober mounting frame;
First biasing means for applying a force to the end of the prober,
The support portion has a protrusion that contacts the lower surface of the end portion of the prober frame and supports the contact point as a fulcrum.
The first biasing means applies a downward force to the end portion of the prober frame at the outer position of the support portion,
An apparatus for inspecting a liquid crystal substrate, wherein a bending moment is generated in a prober frame with the support portion as a fulcrum by the force of the first urging means, and the bending of the prober frame is corrected by the bending moment.   The liquid crystal substrate inspection apparatus according to claim 1, wherein the first urging unit includes a screw mechanism that tightens a bolt into the prober mounting frame, and a scale plate that represents a tightening amount of the bolt. In a liquid crystal substrate inspection apparatus that inspects a liquid crystal substrate using a prober,
A prober mounting frame for mounting the prober;
A bending mechanism that adjusts the deflection of the prober frame by generating a bending moment in the prober frame of the prober;
The bending mechanism is
A second urging means for pressing the prober mounting frame on the prober frame;
The second urging means applies a pressing force to the end of the prober mounting frame from the prober frame side, and applies a force toward the center to the prober frame by a reaction from the prober mounting frame due to the pressing, An apparatus for inspecting a liquid crystal substrate, wherein a bending moment is generated by generating an actuating force for pulling upward and a bending of the prober frame is corrected by the bending moment. The second biasing means comprises an eccentric cam;
The liquid crystal substrate inspection apparatus according to claim 3, wherein the eccentric cam fixes the prober frame together with a set screw for fixing the prober frame to the prober mounting frame.

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