JP4100018B2 - Manufacturing method of chip-type components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-type component having a vertically long component body or a chip-type component having a coil having a winding axis.
[0002]
[Prior art]
For example, there is an inductor as a chip-type component in which a component body having a vertically long shape is incorporated. This inductor includes a coil that is vertically long in the winding axis direction.
[0003]
A conventional manufacturing method for this inductor will be described below.
[0004]
A molding material is injected into a mold and a lower plate having a required shape for mounting a coil is formed. The lower plate thus molded is removed from the mold. A plurality of coils are arranged in a lying state on the removed lower plate and fixed with an adhesive or the like. Here, the recumbent state means a state in which the coil is mounted on the mounting surface in a state in which the winding axis direction is parallel to the coil mounting surface of the lower plate.
[0005]
Next, the molded body of the plurality of coils is molded by placing the molded body of the lower plate in a molding die and adding and molding the molding material.
[0006]
After this molded body is fired, both sides thereof are polished to obtain a thickness of the fired body. After this polishing, a plurality of chip type inductors are manufactured by cutting out both sides of the fired body for each predetermined size.
[0007]
[Problems to be solved by the invention]
By the way, in the conventional manufacturing method, since the vertically long coils are arranged in a state lying on the lower plate in the winding axis direction, the mounting area on the lower plate for one coil is large. For this reason, the coil mounting density is low due to restrictions on the coil mounting area, and as a result, the number of inductors that can be obtained by molding a single lower plate is limited, improving productivity. There is still room for improvement.
[0008]
Therefore, the present invention has a common problem to be solved by increasing the number of inductors that can be produced from one lower plate and improving the productivity.
[0009]
The present invention also eliminates the need for troubles and maintenance in the process by omitting the process of bonding with an adhesive or the like when mounting the coil on the lower plate, and the number of personnel required in the process can be reduced. And improving productivity is another issue to be solved.
[0010]
Still another object of the present invention is to improve the mounting accuracy of the coil on the lower plate while being a simple mounting operation.
[0011]
Still another object of the present invention is to make it possible to reliably mount the coil on the lower plate while accurately positioning the coil with respect to the lower plate in a simple mounting operation.
[0012]
[Means for Solving the Problems]
  A method for manufacturing a chip-type component according to the present invention is a method for manufacturing a chip-type component incorporating a component body having a vertically long shape,Put slurry for wet press into moldLower platepressA primary molding step of molding, a component arrangement step of arranging a plurality of component bodies on the lower plate, and a molding die loaded with the lower plateSlurries for wet pressA molded body in which a plurality of the component bodies are incorporated.pressSecondary molding process to mold,A firing step of firing the molded body;In the part arranging step,By forming a plurality of slots into which the component element body can be inserted in an upright posture on the lower plate, and storing the component element body in an upright position with respect to each of the plurality of slots,Each of the plurality of component bodies is juxtaposed with the lower plate in a vertically standing posture.
[0013]
According to this manufacturing method, since the component bodies are arranged in a state of standing in the horizontal direction in a standing posture along the vertical direction, the density of the component bodies in the horizontal direction has been arranged on the lower plate in a lying posture. Therefore, the number of component bodies contained in the molded product can be increased.
[0014]
  Therefore, since the number of chip parts that can be cut out from a single molded product is increased as compared with the conventional one, the number of moldings is reduced with respect to the number of parts to improve the production efficiency.Whenbecome.
  In this way, the component element body can be held with respect to the lower plate in a standing posture simply by being inserted into the slot, so that the component element body with respect to the lower plate can be compared to the conventional arrangement in the lying position. Adhesion can be reduced. Furthermore, by forming the position of the slot with high accuracy, the positional accuracy of the component body inserted therein is also high, and the component after firing can be cut out with high accuracy.
[0015]
Moreover, it is preferable that the shaping | molding pressure in a secondary shaping | molding process is given along the vertical direction of the said component element | base_body.
[0016]
In this way, the molding pressure acting on the component body is molded with the shape such as the coil diameter being suppressed in the case of a coil, for example. Compared to the above, deterioration of characteristics such as inductance can be avoided.
[0019]
The component body is preferably a coil having a winding axis in the longitudinal direction.
[0020]
  Furthermore, the chip type component manufacturing method according to the present invention is a method of manufacturing a chip type component having a vertically long component element body, wherein the protrusion is provided in parallel on the upper surface of the molding die. On the other hand, a component arranging step for holding the component element body in a vertically upright posture, and the molding die that has undergone the component arranging step mounted on a molding machine on the molding dieSlurries for wet pressAfter fillingpressA first molding step for forming a lower plate by molding, removing the lower plate from the first mold, turning it upside down, and mounting it on a molding machine;Slurries for wet pressA molded body in which a plurality of the component bodies are incorporated.pressA second molding step for molding;A firing step of firing the molded body;It is characterized by including.
[0021]
According to this chip type component manufacturing method, the component element body is held against the protrusions, so that the posture of the component element body is stably maintained, and molding is performed in that state. Even during the molding, since the component element body is held by the protrusions, it is easy to avoid improperly applying the molding pressure to the component element body. Then, the lower plate including the component element body can be removed from the molding die having the protrusions only by allowing the component element body to be removed from the protrusions.
[0022]
Moreover, it is preferable that the molding pressure in the second molding step is given along the longitudinal direction of the component body.
[0023]
In this way, the molding pressure acting on the component body is molded in a state where deformation in the radial direction of the coil is suppressed in the case of a coil, for example, so that Compared to the above, deterioration of characteristics such as inductance can be avoided.
[0024]
In addition, the component element body has a hollow portion in the longitudinal direction, and in the component arranging step, the component element body is inserted in the longitudinal direction by inserting the hollow portion of the component element body into the protrusion. It is preferable to hold in an upright posture.
[0025]
In this way, the component element body can be held in a standing posture by a simple operation of inserting the component element body into the protrusion, and workability is good.
[0026]
The component body is preferably a coil having a winding axis in the longitudinal direction.
[0027]
In the component arranging step, the component element body is preferably held in a vertically long posture by being sandwiched between the protrusions.
[0028]
In this way, the component element body is held in a state of being sandwiched between the protrusions so as not to be laterally displaced. Therefore, even if the component element body is not a hollow structure that can be inserted into the protrusions, the posture is maintained. Can be performed sufficiently, and can be highly versatile.
[0029]
Further, the protrusion provided on the molding die is a conical body or columnar body with a narrowed top, so that the upright holding can be satisfactorily performed corresponding to various component bodies.
[0030]
The molding die includes a lower die having the projection and a through hole through which the projection penetrates, and the mold can be loaded on the lower die with the projection protruding above the through hole. It is preferable that the component element body be held in a vertically long posture with respect to the protrusion above the end of the through hole of the upper mold.
[0031]
In this way, in a state where the lower mold and the upper mold are overlapped, the component element body is held in a standing posture with respect to the protrusion protruding upward from the upper mold, and after molding, By lifting the upper mold away from the lower mold, the protrusion and the molded lower plate can be detached, and at that time, the through hole of the upper mold can also guide the protrusion. Further, it is possible to avoid the case where the lower plate is unduly broken when the protrusion is removed from the lower plate.
[0032]
  The present invention is a method of manufacturing a chip-type component incorporating a coil having a winding axis,Put slurry for wet press into moldLower platepressA primary molding step of molding, a component arrangement step of arranging a plurality of coils on the lower plate, and a molding die loaded with the lower plateSlurries for wet pressA molded body in which the plurality of coils are incorporated.pressSecondary molding process to mold,A firing step of firing the molded body;In the part arranging step,By forming a plurality of slots into which the coil can be inserted in a standing posture on the lower plate, and storing the coils in a standing posture with respect to each of the plurality of slots,It is preferable that the plurality of coils are juxtaposed with each other in a posture standing in the winding axis direction with respect to the lower plate.
[0033]
In this case, the coil sits better on the placement surface than the case where the winding shaft is placed sideways and placed on the lower plate and subjected to secondary molding, that is, the coil is in a stable posture that is difficult to roll. By performing secondary molding in this state, the coil can be built in the molded body without undue bias.
[0034]
DETAILED DESCRIPTION OF THE INVENTION
The details of the present invention will be described below based on the embodiment shown in FIGS.
[0035]
First, an example of the embodiment will be described with reference to FIGS. This embodiment is applied to the inductor 1 as a chip-type component to be manufactured. The inductor 1 includes a rectangular parallelepiped exterior body 2 made of a ceramic magnetic material, and a coil 3 incorporated therein.
[0036]
As shown in FIGS. 1 and 2, the coil 3 is formed by winding a silver winding 5 as an example of a component body so as to have a winding axis in the longitudinal direction. Both end portions of the winding 5 in the coil 3 extend in the axial direction and are electrically connected to input / output electrodes 6 formed on end surfaces facing each other of the exterior body 2.
[0037]
The process for manufacturing such an inductor 1 includes a coil manufacturing process, a lower plate forming process, a lower plate processing process, a coil arranging process, a molded body forming process, a molded body firing process, a polishing process, a cutting process, and an input / output electrode connecting process. Have
[0038]
(Coil manufacturing process)
In this process, the coil 3 is manufactured by winding a winding 5 made of a thin silver wire.
[0039]
(Lower plate forming process (primary forming process))
This will be described with reference to FIGS. In this step, the prepared wet press slurry 7 is poured into a mold 8. The mold 8 includes a main body mold member 9, a pressing mold member 10, and a closing mold member 11. The slurry 7 is poured into a recess 12 formed by the main body mold member 9 and the pressing mold member 10. When the pouring operation of the slurry 7 is completed, the opening of the concave portion 12 is covered with a filter 13 that filters only moisture, and then the sealing member 11 is packed so that the slurry 7 does not leak.
[0040]
For the preparation of the slurry 7, a raw material powder having a particle size of 0.8 μm and a specific surface area of 2.25 m²/ G NiCuZn ferrite is prepared. Next, raw powder, water, a dispersant (polyoxyalkylene glycol), an antifoaming agent (polyether antifoaming agent) and a binder (acrylic binder) are respectively charged into the pot in predetermined parts by weight and ball milled for 17 hours. Mix to prepare slurry 7.
[0041]
Next, the pressing die member 10 is moved in the direction indicated by the arrow a, and a required pressing pressure is applied to the slurry 7 for a predetermined time. As a result, the slurry 7 is drained through the drain hole provided in the closing member 11 via the filter 13.
[0042]
As a result, the lower plate 14 as shown in FIGS. 5 and 6 is obtained.
[0043]
(Lower plate processing process)
This will be described with reference to FIG. A plurality of slots 16a and 16b are formed in the coil mounting surface 15 of the lower plate 14 by machining. 16a is a coil positioning hole, and 16b is a marker positioning hole. Note that this lower plate processing step is included in the component arranging step because it is a processing step for arranging components, but it is the next step that substantially arranges the components.
[0044]
The lower plate 14 is installed on a processing table of a processing apparatus with an NC function, and the coil positioning hole 16a and the marker positioning hole 16b are processed by a ball end mill or a drill attached to the apparatus.
[0045]
The coil positioning hole 16a has a cross-sectional shape that allows the coil 3 to be stored and held in an upright posture in the longitudinal direction.
[0046]
The coil positioning holes 16a are formed in a state of being arranged in a plurality of rows in the vertical and horizontal directions in plan view.
[0047]
The marker positioning holes 16b are holes for forming the markers 19 that serve as reference positions for cutting in a subsequent cutting process, and are formed at a predetermined number of predetermined positions.
[0048]
The depth of the coil positioning hole 16a may be set so that almost the entire coil 3 is inserted vertically, but is set shallower than that, for example, about half the longitudinal length of the coil 3. good.
[0049]
The marker positioning hole 16b is deeper than the coil positioning hole 16a and is provided beyond the polishing line KL.
[0050]
(Coil arrangement process (part arrangement process))
This will be described with reference to FIG. In this step, the coil 3 is inserted into each of the coil positioning holes 16 a provided in the lower plate 14. This insertion is automatically performed using a mounting device (not shown).
[0051]
When the insertion of the coil 3 into each coil positioning hole 16a is completed, the coil 3 is inserted into the coil positioning hole using a paste made of the same material as the lower plate 14 or an adhesive made of a material that does not affect the quality by firing. Adhering and fixing to 16a. In addition, when only the coil 3 is inserted into the coil positioning hole 16a and the posture stability can be obtained with high accuracy, the fixing with the adhesive may not be performed.
[0052]
On the other hand, the marker positioning hole 16b is filled with a marker material such as silver, palladium, tungsten, or chromium that can be distinguished from the surface of the molded body fired in the firing step described later in solid, powder, or paste form. Thus, the marker 19 is formed.
[0053]
Note that the significance of the identification is that when a molded body after firing is cut out with a cutting edge of a dicing apparatus in a cutting step described later, a computer control unit that controls the cutting edge and a monitoring camera that monitors the molded body (may be an image sensor). When the computer control unit performs image processing on the image of the molded body imaged by the monitoring camera, the computer control unit identifies the marker formation region and the other region by color recognition and follows the identified marker formation region. Cuts by controlling the cutting edge. Instead of color recognition, identification by a black-and-white contrast ratio between the marker formation region and other regions may be performed.
[0054]
(Molded body forming process (secondary forming process))
This will be described with reference to FIGS. When the lower plate 14 provided with the coil 3 is molded through the above steps, the lower plate 14 is loaded into the molding die 8 described above. Then, the wet press slurry 7 is poured into the mold 8. Next, the opening of the mold 8 is covered with a filter 13 that allows only moisture to pass through, and then sealed with the closing mold member 11 so that the wet press slurry 7 does not leak. Next, by moving the pressing die member 10 in the direction of the arrow a, the moisture of the wet press slurry 7 is removed through the drain hole provided in the closing die member 11 through the filter 13, as shown in FIGS. 12 and 13. Thus, a molded body 20 incorporating a plurality of coils 3 is obtained. This pressing direction coincides with the longitudinal direction of the coil 3 arranged in the longitudinal direction, that is, the longitudinal direction of the coil 3. 11 is a cross-sectional view at the position where the marker 19 is formed, and FIGS. 9, 10 and 12 are cross-sectional views where the marker 19 is not formed.
[0055]
(Molded body firing process)
The molded body 20 is dried at a predetermined temperature (for example, 35 ° C.) for a predetermined time (for example, 48 hours), then placed in an alumina sheath and fired at a high temperature (for example, 910 ° C.) for a predetermined time.
[0056]
(Polishing process)
This will be described with reference to FIGS. 14 and 15. In this step, the upper and lower surfaces of the molded body 20 are polished by, for example, a belt polishing machine or the like in order to obtain the thickness of the molded body along the polishing line KL.
[0057]
In this case, since the arrangement of the coils 3 is parallel to the polishing line KL, the coils 3 are not cut by this polishing.
[0058]
During this polishing, the marker positioning holes 16b are also cut and exposed on both surfaces of the molded body 20 (see FIG. 15). By this polishing, the molded body 20 corresponds to the longitudinal length of the inductor as a product.
[0059]
(Cut out process)
This will be described with reference to FIG. In this step, the marker 19 on the surface of the molded body is identified by the monitoring camera, and the molded body is cut out to obtain a plurality of cut blocks 21.
[0060]
In this cutting, the cutting edge of the dicing device 22 is positioned in the middle of the adjacent coils with the marker 19 as a reference. In this case, the computer control unit 23 recognizes the marker 19 with the monitoring camera 24 and controls the cutting edge of the dicing device 22 based on the recognition result.
[0061]
(Input / output electrode connection process)
In this step, the input / output electrodes 6 are connected to the coil 3 by forming the cut block 21 by applying and baking a conductive paste, sputtering, vapor deposition, electroless plating, or the like. In this way, the inductor 1 shown in FIG. 1 is obtained.
[0062]
Specifically, for example, the inductor 1 of such a chip component has a length of 3.2 mm × 2.5 mm × 2. In the case of 5 mm, the lower plate 14 having a thickness of 4 mm is formed in advance, the coil positioning hole 16a is orthogonally drilled using a φ2.1 mm drill, the hole pitch is 3.2 mm, and the position accuracy is ± 0.1 mm or less. The depth of the coil positioning hole 16a is 2 mm to 3 mm.
[0063]
In the above-described embodiment, a hole for inserting a component material such as a coil in an upright state is formed for each component material. However, a plurality of component materials are inserted into the groove. In this case, the component material may be fixed to the lower plate with an adhesive in order to stabilize the posture of the component material.
[0064]
Next, an embodiment different from the above embodiment will be described.
[0065]
The other embodiment is an embodiment relating to the invention according to claims 5 to 10 and will be described with reference to FIGS. FIG. 17 is a perspective view of a molding die provided with a protrusion for holding the component element body in an upright posture, and FIGS. 18 to 25 show the process of the chip component manufacturing method according to the other embodiment. It is explanatory drawing. In addition, since this another embodiment is also described as being applied to an inductor component similar to the above-described embodiment, description of the structure and the like will be omitted, and a manufacturing method thereof will be described.
[0066]
The process of manufacturing such an inductor 1 includes a coil manufacturing process, a coil arranging process, a lower plate forming process, a molded body forming process, a molded body firing process, a polishing process, a cutting process, and an input / output electrode connecting process.
[0067]
Since the coil manufacturing process is the same as that of the above-described embodiment, the description thereof is omitted.
[0068]
(Coil arrangement process (part arrangement process))
A mold 30 shown in FIGS. 17 and 18 is prepared as a molding mold. The metal mold 30 has a rectangular flat plate shape, and a cylindrical pin 31 as a protrusion capable of holding the coil 3 in an upright posture is erected on the upper surface thereof. The pins 31 are arranged at intersections where a plurality of virtual straight lines that are equally spaced vertically and horizontally in a plan view are orthogonal to each other.
[0069]
As shown in FIG. 18, the mold 30 is arranged in a predetermined automatic component insertion device, and the coil 3 is inserted into each pin 31 in the arrangement state. The mold 30 with the coils 3 inserted into all the pins 31 is moved to the lower plate forming step (first forming step) as the next step.
[0070]
(Lower plate forming process)
This will be described with reference to FIGS. In this step, the prepared wet press slurry 7 is poured into a mold 8. The mold 8 includes a main body mold member 9, a pressing mold member 10 on which the mold 30 is installed and fixed, and a closing mold member 11. The slurry 7 is poured into the recess 12 formed by the main body mold member 9 and the mold 30. When the pouring operation of the slurry 7 is completed, the opening of the concave portion 12 is covered with a filter 13 that filters only moisture, and then the sealing member 11 is packed so that the slurry 7 does not leak.
[0071]
The preparation of the slurry 7 is the same as in the above embodiment.
[0072]
Next, the pressing die member 10 is moved in the direction indicated by the arrow a, and a required pressing pressure is applied to the slurry 7 for a predetermined time. As a result, the slurry 7 is drained through the drain hole provided in the closing member 11 via the filter 13. The lower plate 32 thus molded is removed from the mold 8.
[0073]
Thus, the lower plate 32 as shown in FIG. 21 is obtained.
[0074]
(Molded body forming step (second forming step))
This will be described with reference to FIGS. In the figure, the lower plate 32 is loaded in the molding die 8 of the same molding machine or another molding machine in an inverted state so that the coil 3 embedded therein is positioned closer to the upper surface (see FIG. 22).
[0075]
And the slurry 7 for wet press is poured into this shaping | molding die 8 (refer FIG. 23). Next, the opening of the mold 8 is covered with a filter 13 that allows only moisture to pass through, and then packing is performed with the closing mold member 11 so that the wet press slurry 7 does not leak (see FIG. 24). Next, the pressing die member 10 is moved in the direction indicated by the arrow a, and a required pressing pressure is applied to the slurry 7 for a predetermined time. This pressing direction coincides with the longitudinal direction of the coil 3 arranged in the longitudinal direction, that is, the longitudinal direction of the coil 3.
[0076]
As a result, the slurry 7 is drained through the drain hole provided in the closing member 11 via the filter 13. The formed body 33 thus molded is removed from the mold.
[0077]
As a result, a molded body 33 incorporating a plurality of coils 3 as shown in FIG. 25 is obtained.
[0078]
Since the firing process, polishing process, cutting process, and input / output electrode connection process for the cut block are the same as those in the above-described embodiment, the description thereof is omitted.
[0079]
Although the pin 31 as the protrusion in the other embodiment is shown as a column, it may be shaped as illustrated in FIG.
[0080]
That is, in FIGS. 26 (a), (b), (c), (d), (e), (f), (g), (h), and (i), a triangular pyramid shape and a conical shape are shown, respectively. , Triangular columnar, cylindrical, threaded to the outer periphery, elliptical columnar, cylindrical, stepped shape with a small diameter pin 34 near the upper end, cylindrical, constricted in the middle in the axial direction, upside down A pin 31 having a round streamline shape, a columnar shape and a small protrusion 35 attached to the outer periphery is shown. Although not shown, the pin 31 may have a truncated pyramid shape or a truncated cone shape.
[0081]
The pin 31 having a conical shape (cone, pyramid, etc.) with a constricted top is easily guided for insertion when a hollow component body is inserted. The threaded portion of FIG. 26 (d) may be screwed in such a manner that the pin itself penetrates vertically into the mold, and the coil as a component body may be held while being screwed. . In this case, in a state where the lower plate is molded, the pin is turned in the direction opposite to the screwing in order to remove the pin from the lower plate. In the case where the small protrusions 35 are provided as shown in FIG. 26 (i), the posture of the component element body can be stably maintained by the light engagement by the small protrusions 35.
[0082]
Moreover, even if it is a cylindrical pin or the prismatic pin 31, you may make it the taper shape which chamfered the shape of the upper end part, as shown to Fig.27 (a). In addition, as shown in FIG. 27B, the upper surface portion may be a convex curved surface like a spherical surface. Moreover, as shown in FIG.27 (c), you may provide a cone-shaped top part in the upper part. As a result, it is easy to guide the component body 3 so that the pin 31 is inserted.
[0083]
In the case of the conical pin 31, as shown in FIG. 28, a relatively wide slurry receiving portion is formed on the upper side between the coil 3 and the pin 31 when the coil 3 or the like is inserted. Therefore, as indicated by an arrow in FIG. 28, the slurry of the raw material can easily enter the coil, so that an inappropriate gap portion is hardly generated.
[0084]
Further, the protrusion is preferably made of a corrosion-resistant material such as stainless steel. In this case, for example, when molding is performed in a corrosive atmosphere, the protrusions can be prevented from being corroded unduly.
[0085]
Further, it is preferable to use a protrusion whose surface is hardened by a surface treatment. In this case, since it will be excellent in wear resistance, it will be sufficiently resistant to long-term use.
[0086]
Further, the protrusion may be formed of an elastic body such as spring steel or rubber material. In this case, there is an advantage that when the protrusion is pulled out from the lower plate, it is easy to pull out in a state in which the protrusion is prevented from breaking the lower plate. In addition, you may comprise with a spring material in the shape of a coil spring, and you may comprise with one leaf | plate spring to stand or a piano wire.
[0087]
In the description of the other embodiment, the formation of the marker has not been described. However, in order to form the marker, a protrusion for forming the recess for forming the marker is separately provided on the mold 30. Alternatively, such a marker-forming protrusion may not be provided in the mold, and a marker-forming hole may be formed in the molded lower plate.
[0088]
Next, still another embodiment according to the present invention will be described.
[0089]
This further embodiment relates to a method of manufacturing a chip component according to claim 11, and therefore, the description of the same configuration as that of the above-described another embodiment is omitted, and it is mainly a feature. Will be described.
[0090]
As shown in FIGS. 29 and 30, the molding die 36 that holds the coil 3 as the component element body in an upright posture is composed of a lower die 37 and an upper die 38. The lower mold 37 is provided with columnar pins 39 as protrusions for holding the coil 3 in a state of being arranged vertically and horizontally on the upper surface of the lower mold 37. On the other hand, the upper mold 38 provided in a state of being stacked on the lower mold 37 is provided with a through hole 40 through which each pin 39 penetrates in an up and down direction with an inner diameter substantially close to the outer diameter of the pin 39. The upper mold 38 is loaded on the lower mold 37 in a state where the opposing surfaces are in close contact with each other. In this loaded state, each pin 39 protrudes above the upper surface of the upper mold 38, and the parts are arranged so that the coil 3 is inserted into the protruding pin 39 and held in an upright posture.
[0091]
Although not shown in the drawing, the first molding process for the molding die 36 in which the arrangement of the coils 3 has been completed goes through the same process as the first molding process of the other embodiment. For example, in the case of a configuration in which the pressing die member 10 is moved upward so as to perform the pressing for molding in the state in which the molding is completed, the molding die 36 is positioned more than the upper edge of the molding main body member 9. At least the upper mold 38 is placed at the upper position, and in this state, the upper mold 38 is pulled upward from the lower mold 37. Then, the pins 39 are removed from the molded lower plate. At this time, each through hole 40 also guides the pins 39, so that the pins 39 are maintained in a fixed posture and the pins 39 are removed from the lower plate. It is also possible to suppress the breaking of the lower plate. The subsequent steps are the same as those in the other embodiment.
[0092]
The present invention is not limited to the above-described embodiment, and various applications and modifications are possible.
[0093]
(1) In the inventions according to claims 5 to 11, the form of holding the component body against the protrusion may be as shown in FIG. 31. That is, for example, in order to hold one component element body 3 such as a coil, three pins as projections are erected on the upper surface of the mold 30. The three pins 31, 31, 31 are provided at positions that are vertices of a regular triangle in plan view. The component body 3 is held in the space between the three pins 31, 31, 31 and inscribed in the three pins 31, 31, 31. In this holding state, the mold 30 is mounted on a molding machine, and a molded body is created through the same process as in the other embodiment described above. In this case, since it is possible to hold even a non-hollow component element body, it is highly versatile. In this case, the component material may be held by four pins, and the arrangement of each pin in a plan view is not limited to the position of the apex of the equilateral triangle. It can be set appropriately according to the shape.
[0094]
(2) In the case of each of the above-described embodiments, the lower plate and the molded body are molded by a wet press, but may be performed by a dry press. In the case of this dry press, in the lower plate forming step and the formed body forming step, as the forming material, not the slurry but the powdered forming material is put into the forming die. Moreover, since it is the same as that of the process mentioned above except the filter which filters only a water | moisture becomes unnecessary, the detail is abbreviate | omitted.
[0095]
Also in the case of the manufacturing method by a dry press, the effect similar to that by the wet press mentioned above can be acquired.
[0096]
Further, the lower plate and the molded body may be molded by casting.
[0097]
(3) In each of the above-described embodiments, the manufacturing method of the chip component of the inductor has been described. However, the present invention is not limited to the chip component of the inductor, and the capacitor, resistor, semiconductor element, etc. It can be applied to various chip parts.
[0098]
(4) In order to arrange the component element body with respect to the lower plate, it is shown that a groove for positioning the component element body is formed in the lower plate, or a projection is provided on a molding die for forming the lower plate. However, the component body may be bonded to the lower plate with an adhesive in a vertically long standing posture without providing such a positioning structure. In this case, there is an advantage that a process such as formation of a slot or a special molding die can be eliminated.
[0099]
【The invention's effect】
As described above, according to the chip component manufacturing method of the present invention, the component body is arranged in a state in which the vertically long components are arranged in the horizontal direction in a standing posture along the vertical direction. The density of the component bodies is higher than that in the conventional case where the density of the component bodies is arranged on the lower plate, and the number of component bodies contained in the molded product can be increased.
[0100]
Therefore, since the number of chip parts that can be cut out from one molded product is increased as compared with the conventional one, the number of moldings is reduced with respect to the number of parts, thereby improving the production efficiency.
[Brief description of the drawings]
FIG. 1 is a partially broken perspective view of an inductor manufactured by a manufacturing method according to an embodiment of the present invention.
FIG. 2 is a perspective view of a coil used in the inductor shown in FIG.
FIG. 3 is a longitudinal sectional view of a mold in which a molding material is poured in a lower plate molding process of a primary molding process.
FIG. 4 is a longitudinal sectional view showing a state where a lower plate forming press is performed in the lower plate forming step.
FIG. 5 is a longitudinal sectional view showing a state where the lower plate is removed from the lower plate mold.
FIG. 6 is a perspective view showing a lower plate after being molded.
FIG. 7 is a longitudinal sectional view showing a process of forming a coil positioning hole in the lower plate.
FIG. 8 is a longitudinal sectional view showing a process of inserting a coil into the coil positioning hole of the lower plate.
FIG. 9 is a longitudinal sectional view showing a state in which the lower plate is placed in a forming die in the secondary forming step.
10 is a longitudinal sectional view showing a state in which a molding material is poured into the molding die of FIG.
FIG. 11 is a longitudinal sectional view showing a state in which a molded body is pressed in the secondary molding process.
FIG. 12 is a longitudinal sectional view showing a state where the molded body is removed from the mold.
FIG. 13 is a perspective view showing a molded body.
FIG. 14 is a longitudinal sectional view showing a molded body before polishing.
FIG. 15 is a longitudinal sectional view showing a molded body after polishing.
FIG. 16 is an explanatory view showing a process of dicing the molded body.
FIG. 17 is a perspective view of a molding die with projections used in another embodiment and a perspective view showing a state where a coil is held by the projections;
FIG. 18 is a longitudinal sectional view showing a component arranging step in another embodiment.
FIG. 19 is a longitudinal sectional view showing a state in which the molding material is supplied in the first molding step in another embodiment.
FIG. 20 is a longitudinal sectional view showing a state where pressing is performed in the first molding step in another embodiment.
FIG. 21 is a longitudinal sectional view showing a state in which the lower plate is removed in the first molding step in another embodiment.
FIG. 22 is a longitudinal sectional view showing a state in which the lower plate is mounted on the molding machine in the second molding step in another embodiment.
FIG. 23 is a longitudinal sectional view showing a state in which the molding material is supplied in the second molding step in another embodiment.
FIG. 24 is a longitudinal sectional view showing a pressed state in a second forming step in another embodiment.
FIG. 25 is a longitudinal sectional view showing a state in which the molded body is removed in the second molding step in another embodiment.
FIGS. 26A and 26B are a plan view and a front view showing a modification of the projection of the molding die in another embodiment. FIGS.
FIG. 27 is a front view showing a modification of the upper end shape of the projection of the molding die according to another embodiment.
FIG. 28 is a longitudinal sectional view showing a state where a coil is inserted into a projection formed in a conical shape or the like.
FIG. 29 is a perspective view showing a molding die in yet another embodiment.
30 is a longitudinal sectional view showing a state in which the molding die in still another embodiment of FIG. 29 is separated into an upper die and a lower die.
FIG. 31 is a plan view and a front view showing a form in which a component body is held between a plurality of pins.
[Explanation of symbols]
3 Coil (component body)
7 Slurry (molding material)
8 Mold
14 Lower plate
16a Coil positioning hole (slot hole)
20 Molded body
30 mold (molding mold)
31, 39 pins (protrusions)
40 Through hole

Claims (11)

A method of manufacturing a chip-type component incorporating a component body having a vertically long shape,
A primary molding process in which a slurry for wet pressing is placed in a mold and the lower plate is press- molded;
A component arranging step of arranging a plurality of the component bodies on the lower plate;
A secondary molding step in which a slurry for wet pressing is put into a molding die loaded with the lower plate and a molded body in which a plurality of the component bodies are incorporated is press- molded;
A firing step of firing the molded body;
Including
In the component arranging step, a plurality of slots for inserting the component element body in an upright posture are formed in the lower plate, and the component element body is stored in an upright position in each of the plurality of slots. A method of manufacturing a chip-type component , wherein the plurality of component bodies are juxtaposed with each other in a vertically upright posture with respect to the lower plate. In the manufacturing method of the chip type component according to claim 1,
The chip-type component manufacturing method, wherein a molding pressure in the secondary molding step is given along a longitudinal direction of the component body. In the manufacturing method of the chip-type component according to claim 1 or 2 ,
The method of manufacturing a chip-type component, wherein the component body is a coil having a winding axis in a longitudinal direction. A method of manufacturing a chip-type component incorporating a component body having a vertically long shape,
A component arranging step of holding the component element body in a vertically upright posture with respect to a protrusion provided in parallel on the upper surface of the molding die;
A first molding step in which a wet press slurry is filled on the molding die in a state where the molding die subjected to the component arranging step is mounted on a molding machine, and then a press molding is performed to obtain a lower plate;
After removing the lower plate from the first mold, it is turned upside down and mounted on a molding machine, and then a slurry for wet pressing is put into the molding die loaded with the lower plate, and a plurality of the component bodies are built in. A second molding step of press- molding the molded body,
A firing step of firing the molded body;
A method for manufacturing a chip-type component, comprising: It is a manufacturing method of the chip type component according to claim 4 ,
The chip-type component manufacturing method, wherein the molding pressure in the second molding step is given along the longitudinal direction of the component body. It is a manufacturing method of the chip type component according to claim 4 or 5 ,
The component body has a hollow portion in the longitudinal direction, and
In the component arranging step, a hollow part of the component element body is inserted into the protrusion to hold the component element body in an upright posture in a vertically long direction. In the manufacturing method of the chip type component according to any one of claims 4 to 6 ,
The method of manufacturing a chip-type component, wherein the component body is a coil having a winding axis in a longitudinal direction. In the manufacturing method of the chip type component according to claim 4 or 5 ,
In the component arranging step, the component element body is held in a vertically long posture by being sandwiched between the protrusions. It is a manufacturing method of the chip type component according to any one of claims 4 to 8 ,
The method of manufacturing a chip-type component, wherein the protrusion provided on the molding die is a conical body or a columnar body with a constricted top. In the manufacturing method of the chip type component according to claim 4 ,
The molding die includes a lower die having the protrusion and a through hole through which the protrusion penetrates, and an upper side that can be loaded on the lower die in a state in which the protrusion protrudes above the through hole. A chip-type component manufacturing method, characterized in that the component element body can be held in a vertically long posture with respect to the protrusion above the end of the through-hole of the upper die. . A method of manufacturing a chip-type component incorporating a coil having a winding axis,
A primary molding process in which a slurry for wet pressing is placed in a mold and the lower plate is press- molded;
A component arranging step of arranging a plurality of coils on the lower plate;
A secondary molding step in which a slurry for wet pressing is put into a molding die loaded with the lower plate, and a molded body in which the plurality of coils are incorporated is press- molded;
A firing step of firing the molded body;
Including
In the component arranging step, the lower plate is formed with a plurality of slots into which the coil can be inserted in an upright posture, and the coils are stored in the upright posture with respect to each of the plurality of slots. Each of the plurality of coils is juxtaposed in an upright posture in the winding axis direction.

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