JP4100470B2 - Circuit board, component adsorber movement control method and allowable acceleration / deceleration determination program - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present inventionA component adsorber for adsorbing and holding a circuit board or electronic circuit component on which an electronic circuit component is mounted,When moving starts and stopsInThis is related to acceleration / deceleration control.
[0002]
[Prior art]
The electronic circuit component is mounted on the circuit board by, for example, moving the component holder in a plane perpendicular to the axis and moving the circuit board in a direction parallel to the surface. For example, in the electronic circuit component mounting system disclosed in Japanese Examined Patent Publication No. 7-63106, a plurality of component suction tools are swung around a common vertical swing axis and sequentially moved to a component receiving position and a component mounting position. The electronic circuit component is received and mounted, and the printed wiring board is moved in the horizontal direction by the XY table, and the mounted position set on the surface thereof moves to a position corresponding to the component mounting position of the component suction tool. The electronic circuit component is mounted by being moved.
[0003]
When the electronic component is mounted by moving the component adsorber and the circuit board in this way, the electronic circuit component is adsorbed and held by the component adsorber, and the electronic circuit component mounted on the circuit board is creamy. Although temporarily fixed by the solder, the electronic circuit component may be displaced from the component suction tool and the circuit board due to the impact caused by acceleration at the start of movement and the impact caused by deceleration at the time of stopping.
[0004]
Therefore, in the electronic circuit component mounting system disclosed in the above publication, as the mass of the electronic circuit component is larger, the swing speed of the component suction tool is decreased, and the acceleration and deceleration at the start and stop of the swing are decreased. The acceleration / deceleration at the start and stop of the movement of the XY table is reduced, the impact due to acceleration / deceleration is reduced, and the displacement of the electronic circuit components is less likely to occur. The above has described the electronic component mounting system such as a suction swivel type and an index table type in which a plurality of component suction tools are swung around a common vertical swivel axis. The same problem also occurs in an XY robot type electronic circuit component mounting system that is moved to an arbitrary position on the XY coordinate plane and mounts an electronic circuit component. For example, there is a possibility that the electronic circuit component is displaced from the component suction tool due to acceleration and deceleration when the component suction tool is started or stopped by the XY robot.
[0005]
[Problems to be solved by the invention, means for solving problems and effects]
However, even if the acceleration / deceleration of the component suction tool and the acceleration / deceleration of the circuit board are determined based on the mass of the electronic circuit component in this way, the component suction tool still moves (including turning). When the circuit board is moved, the electronic circuit components may be displaced.
[0006]
With the above circumstances as a background, the present invention has as an object to reduce as much as possible the displacement of electronic circuit components when holding and moving the electronic circuit components for at least one of the component adsorber and the circuit board. According to the present invention, a circuit board movement control method, a circuit board movement control program, an electronic circuit component mounting system, an electronic circuit component mounting system control program, a component suction tool movement control method, and a component according to the present invention The suction tool movement control program, the allowable acceleration / deceleration determination program for the circuit board, and the allowable acceleration / deceleration determination program for the component suction tool are obtained. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating understanding of the present invention, and should not be construed as limiting the technical features described in the present specification and the combinations thereof to those described in the following sections. . In addition, when a plurality of items are described in one section, it is not always necessary to employ the plurality of items together. It is also possible to select and employ only some items.
[0007]
  In the following sections,(3) TermCorresponds to claim 1,(Four)The claim is in claim 2,(Five) TermIn claim 3,(11) TermIn claim 4,(12) TermIn claim 5,(15) The term related to the instability coefficient is limited to the instability coefficientIn claim 6,(16) The term related to the instability coefficient is limited to the instability coefficientClaim 6NisoIt corresponds to each.
(1) A circuit board on which an electronic circuit component is temporarily fixed by the adhesive force of a temporary fixing agent applied in a spot shape is allowed to permit or decelerate a plurality of electronic circuit components already temporarily fixed on the circuit board. It is a method of moving in the direction parallel to the surface of the circuit board with the target acceleration / deceleration below the minimum of these,
  The allowable acceleration and deceleration, for each of the plurality of electronic circuit components, a mass-related amount related to the mass of each electronic circuit component, a height-related amount that is an amount related to the height of each electronic circuit component, and A circuit board movement control method that is set based on a bottom surface dimension related quantity that is a quantity related to a bottom surface dimension of each electronic component.
  For the movement of the circuit board in the present invention, the circuit board is moved by a board moving device for mounting electronic circuit components on the circuit board, the circuit board is moved by a board conveying device such as a board conveyor, and the circuit board is moved relative to the board conveying device. This includes movement of the circuit board during loading and unloading, movement during delivery of the circuit board between the board transfer apparatus and the board movement apparatus, and the like. Further, the mass-related quantity includes not only the mass itself but also a power function function of mass, a value obtained by adding mass nonuniformity to mass, and the like. An example of “a value in which nonuniformity of mass distribution is added to mass” is when the mass distribution of an electronic circuit component is close to the mounting surface side, which is the surface closer to the circuit board of the electronic circuit component. , Obtained by multiplying the mass by a small coefficient or decreasing the exponent of the power function of the mass, and when the mass distribution is far from the mounting surface, multiply the mass by a large coefficient or This value is obtained by increasing the exponent of the power function. The height-related quantity includes not only the height itself but also a function such as a power function of the height, the height of the center of gravity, and the like. The bottom dimension related quantity corresponds to the bottom area, the circumference of the bottom, the shape factor of the bottom, and the like. When the direction of acceleration / deceleration actually applied is unknown, the bottom shape factor is increased as the shape of the bottom is closer to a circle, and the direction of acceleration / deceleration actually applied is known in advance. Is increased as the bottom dimension in the direction parallel to the acceleration / deceleration is increased.
  Examples of the temporary fixing agent include cream solder, conductive adhesive, and insulating adhesive.
  The allowable acceleration / deceleration and the target acceleration / deceleration may be set stepwise or may be set as continuous values.
  Thus, if the allowable acceleration / deceleration is set based on the mass-related quantity, the height-related quantity, and the bottom dimension-related quantity for each of the plurality of electronic circuit components, it is a kind of mass-related quantity as in the past. Compared with the case where acceleration / deceleration is set based only on the mass, the target acceleration / deceleration can be set to a size that can prevent the positional deviation of the electronic circuit component better. For example, if the acceleration and deceleration of the electronic circuit component are the same, the higher the height, the easier it will fall, and the smaller the bottom area, the smaller the holding force by the circuit board, and the easier it will be to cause displacement. This is because the occurrence of misalignment, etc. is related to the mass-related quantity, the height-related quantity, and the bottom dimension-related quantity.
  The permissible acceleration and deceleration of a plurality of electronic circuit components temporarily fixed on the circuit board are not necessarily the same, but all are set based on the mass-related quantity, the height-related quantity, and the bottom dimension-related quantity. The circuit board can be moved with an acceleration / deceleration below the minimum of them. The acceleration / deceleration for moving the circuit board is the acceleration / deceleration allowed for all electronic circuit components, and is an acceleration / deceleration that takes into account the mass-related quantity, height-related quantity, and bottom dimension-related quantity. In addition, the circuit board can be moved as quickly as possible while satisfactorily preventing the occurrence of misalignment or the like for all electronic circuit components.
[0008]
(2) The circuit board on which the electronic circuit components are temporarily fixed by the adhesive force of the temporary fixing agent applied in the form of a spot is allowed to be allowed for acceleration / deceleration of a plurality of electronic circuit components already temporarily fixed on the circuit board. It is a method of moving in the direction parallel to the surface of the circuit board with the target acceleration / deceleration below the minimum of these,
Movement control of the circuit board in which the allowable acceleration / deceleration is set to be smaller for each of the plurality of electronic circuit components as the mass and height of each electronic circuit component is larger and as the bottom area of each electronic component is larger. Method.
According to this section, each allowable acceleration / deceleration of the plurality of electronic circuit components is set based on the mass, height, and bottom area of each electronic circuit component, and all the electronic circuits temporarily fixed to the circuit board are set. The component can be moved as quickly as possible while preventing the occurrence of misalignment and the like.
[0009]
(3) When the mass of each electronic circuit component is M, the height is H, the bottom area is S, and exponents of power functions are a, b, and c, the allowable acceleration and deceleration are expressed as (M^a・ H^b) / S^cThe circuit board movement control method according to item (2), wherein the magnitude is in accordance with an instability coefficient represented by:
The indices a, b, and c should be referred to as contribution ratios of the mass, height, and bottom area to the instability coefficient. For example, the unit of mass M is g, the unit of height H is mm, and the bottom area S Unit of mm²When the index a is 1, the index b is preferably selected from the range of 0.5 to 3.5, and more preferably selected from the range of 0.7 to 2.8. The index c is preferably selected from the range of 0.5 to 2.5, and more preferably selected from the range of 0.8 to 1.4.
The instability coefficient is the ease of occurrence of displacement, overturning, etc. when the electronic circuit component temporarily fixed to the circuit board is moved, and represents instability.
The indices b and c may be selected as constant values regardless of the type of electronic circuit component, or may be selected according to the type of electronic circuit component. In the former case, for example, the same can be applied to all electronic circuit components mounted on one circuit board. In the latter case, for example, it can be changed according to the shape, size, etc. of the electronic circuit component. According to this section, the allowable acceleration / deceleration based on the mass, height, and bottom area of the electronic circuit component can be set with higher accuracy, that is, a size that can prevent the occurrence of misalignment more reliably. .
The instability coefficient is determined by the moving speed of the clamp member when the circuit board is clamped to the substrate moving device by the clamping device, and the loading when the circuit board is moved in the direction perpendicular to the substrate surface with respect to the substrate moving device. It can also be used to set the moving speed or acceleration / deceleration when unloading. In these cases as well, if the moving speed of the clamp member is excessive, vibration in a direction perpendicular to the surface of the circuit board (thickness direction) will increase or the circuit board may be moved in the thickness direction. If the deceleration is excessive, the electronic circuit component is separated from the circuit board to cause a positional shift (when the electronic circuit component is temporarily fixed on the upper surface of the circuit board) or dropped (the electronic circuit If the component is temporarily fixed to the lower surface of the circuit board), the greater the instability coefficient, the smaller the movement speed of the clamp member and the acceleration / deceleration of movement in the thickness direction of the circuit board. It is possible to satisfactorily prevent the electronic circuit component from being displaced or dropped. However, in these cases, the height of the electronic circuit component does not contribute to the instability coefficient as much as the mass and the bottom area. Therefore, the index b of the height H is usually very small, and the instability coefficient is M^a/ S^cIt is also possible to adopt.
(4) The circuit board movement control method according to (2) or (3), wherein the allowable acceleration / deceleration is increased as the adhesive strength of the temporary fixing agent is increased.
Even if the instability coefficient is large and the electronic circuit components are unstable, if the adhesive strength of the temporary fixing agent is large, the electronic circuit components are unlikely to slip during movement, reducing the instability, and increasing the allowable acceleration / deceleration. Can be bigger.
(5) The circuit board movement control method according to any one of (2) to (4), wherein the allowable acceleration / deceleration is increased as the peripheral length of the bottom surface of each electronic circuit component is increased.
The temporary fixing agent does not exist only in the gap between the bottom surface of the electronic circuit component and the circuit board, but also in the space formed by the side surface of the electronic circuit component and the surface of the circuit board that protrudes from the gap. There are many cases. In this case, the temporary fixing agent existing in the space also functions to prevent the positional deviation of the electronic circuit component. Since this function increases as the circumference of the electronic circuit component increases, the allowable acceleration / deceleration can be increased as the circumference of the bottom surface of the electronic circuit component increases.
[0010]
(6) Implemented by a computer to control movement of a circuit board in which a plurality of electronic circuit components are temporarily fixed by the adhesive force of the temporary fixing agent applied in a spot shape in a direction parallel to the surface of the circuit board. A program
For each of the plurality of electronic circuit components that are already temporarily fixed to the circuit board, the circuit is set to a larger value as the mass and height of each electronic circuit component is larger and as the bottom area of each electronic component is larger. A minimum acceleration / deceleration acquisition step for acquiring the minimum of the allowable acceleration / deceleration of the substrate;
A movement control step for moving the circuit board at an acceleration / deceleration below the acquired minimum acceleration / deceleration;
A circuit board movement control program.
The features described in the items (3) to (5) can be applied to the program of this item. In addition, the allowable acceleration / deceleration in the program of this section can be set based on the mass-related quantity, the height-related quantity and the bottom dimension-related quantity described in the above section (1).
According to this section, for example, the operation and effect described in the section (2) can be obtained.
[0011]
(7) a substrate moving device that holds the circuit board on which the temporary fixing agent is applied in a spot shape and moves the circuit board to an arbitrary position in a plane parallel to the surface of the circuit board;
A component mounting device that holds an electronic circuit component by a component holder, and contacts and mounts the held electronic circuit component on a portion of the circuit board positioned by the substrate moving device to which the temporary fixing agent is applied, and
By controlling the substrate moving device, the circuit board is reduced as the mass and height of each electronic circuit component increases with respect to each of the plurality of electronic circuit components already temporarily fixed to the circuit board. A board movement control device that moves with the minimum allowable acceleration / deceleration of acceleration / deceleration set to a larger value as the bottom area of the component is larger
Electronic circuit component mounting system including.
The features described in the items (3) to (5) can be applied to the system of this item. In addition, the allowable acceleration / deceleration in the system of this section may be set based on the mass-related quantity, the height-related quantity, and the bottom dimension-related quantity described in the above section (1). It is desirable that the component mounting device mounts electronic circuit components at a predetermined component mounting position. Even if the “predetermined position” is always a constant position, it is different at each mounting operation. There may be.
According to this section, for example, the operation and effect described in the section (2) can be obtained.
[0012]
(8) (a) a substrate moving device that holds a circuit board on which a temporary fixing agent is applied in a spot shape at a plurality of component mounting points and moves the circuit board to an arbitrary position in a plane parallel to the surface of the circuit board; (b) The electronic circuit component is held by a component holder, and the held electronic circuit component is mounted in contact with the temporary fixing agent applied to the plurality of component mounting points of the circuit board positioned by the substrate moving device. A program executed by the computer to control an electronic circuit component mounting system including: a component mounting device that includes: (c) a substrate movement control device that includes a computer and controls the substrate movement device;
Each time an electronic circuit component is mounted on the circuit board held by the board moving device, the circuit board is mounted on the circuit board with the electronic circuit component mounted on the circuit board. An allowable acceleration / deceleration acquisition step for acquiring an allowable acceleration / deceleration allowed to be moved in a direction parallel to
A minimum allowable acceleration / deceleration acquisition step for acquiring the minimum allowable acceleration / deceleration acquired; and
After the electronic circuit component is mounted by the component mounting device, the substrate moving device moves the circuit board to the substrate moving device with the minimum acceleration, the acceleration equal to or less than the deceleration acquired in the minimum allowable acceleration / deceleration acquisition step. Movement control step and
And the allowable acceleration / deceleration of each electronic circuit component is set to a smaller value as the mass and height of each electronic circuit component is larger, and to a larger value as the bottom area of each electronic component is larger. Electronic circuit component mounting system control program.
The features described in the items (3) to (5) can be applied to the system of this item. In addition, the allowable acceleration / deceleration in the system of this section may be set based on the mass-related quantity, the height-related quantity, and the bottom dimension-related quantity described in the above section (1).
The allowable acceleration / deceleration may be acquired by calculation, or may be acquired by reading from the storage unit of the allowable acceleration / deceleration that has already been calculated and stored in the storage means.
According to this section, for example, the operation and effect described in the section (2) can be obtained.
[0013]
(9) A method for controlling movement of a component suction tool that sucks an electronic circuit component by negative pressure on the suction surface in a direction parallel to the suction surface,
The component adsorber is attached to a mass-related amount related to the mass of the electronic circuit component, a height-related amount that is related to the height of each electronic circuit component, and an amount related to the size of the suction surface. A movement control method for a component suction tool that moves at an acceleration / deceleration set based on the surface dimension related quantity.
For the movement in the direction parallel to the suction surface of the component suction tool, for example, the movement of the component suction tool to an arbitrary position in a plane perpendicular to the axis, or a turning trajectory centered on a predetermined turning axis There is a move up.
The mass-related quantity, height-related quantity, and adsorption surface dimension-related quantity are explained in the same way as the mass-related quantity, height-related quantity, and bottom dimension-related quantity in (1). At that time, the mounting surface and the bottom surface are read as the suction surface, and the bottom area is read as the suction area.
When moving the component suction tool in a direction parallel to the suction surface, for example, the electronic circuit component has a larger mass, and the higher the height, the easier it is to shift relative to the component suction tool. The smaller the suction surface size, the smaller the suction force. , Easy to slip. Therefore, the allowable acceleration / deceleration is set based on the mass-related quantity, height-related quantity, and suction surface dimension-related quantity, and the acceleration / deceleration set to the largest possible value within the allowable acceleration / deceleration range. If the component suction tool is moved at a speed (target acceleration / deceleration), it is possible to move the component suction tool as quickly as possible while satisfactorily preventing displacement of the electronic circuit component relative to the component suction tool. it can. When a plurality of component suction tools are held by a common moving member and a plurality of the component suction tools are moved while holding the electronic circuit component, acceleration / deceleration of the moving member is performed. Is set in the same manner as in the case of the circuit board. Allowable acceleration / deceleration is set for multiple electronic circuit parts, and moving member acceleration / deceleration below the minimum allowable acceleration / deceleration, that is, acceleration / deceleration common to multiple component suction tools Is set.
[0014]
(10) A method of controlling movement of a component suction tool that sucks an electronic circuit component by negative pressure on a suction surface in a direction parallel to the suction surface,
A component suction tool movement control method for moving the component suction tool at a larger acceleration / deceleration as the mass and height of the electronic circuit component are smaller and as the suction surface area of the component suction tool is larger.
(11) When the mass of the electronic circuit component is M, the height is H, the area of the suction surface of the component suction tool is S, and the indices are d, e, and f, the acceleration / deceleration of the movement of the component suction tool , (M^d・ H^e) / S^fThe circuit board movement control method according to item (10), wherein the circuit board has a size corresponding to the instability coefficient represented by:
The indices d, e, and f should be referred to as the contribution ratios of the mass, the height, and the area of the adsorption surface to the instability coefficient. For example, the unit of mass M is g, the unit of height H is mm, and the area Unit of S is mm²When the index d is 1, the index e is preferably selected from the range of 0.5 to 3, and more preferably selected from the range of 0.7 to 2.0. The index f is preferably selected from the range of 0.5 to 2.5, and more preferably selected from the range of 0.6 to 1.8.
In this section, the instability coefficient represents the instability of holding the electronic circuit component by the component adsorbing tool. The larger the instability coefficient, the easier the electronic circuit component is displaced from the component adsorbing tool. Therefore, if the acceleration / deceleration of the movement of the component suction tool is set according to the instability coefficient, the component suction tool can be moved as quickly as possible while well preventing the electronic circuit components from shifting. Can be made.
The instability coefficient in this section indicates the acceleration / deceleration when the component suction tool is rotated around an axis parallel to the axial direction, and the acceleration / deceleration when the component suction tool is moved in a direction parallel to the axial direction. It can also be used for setting. However, the indices d, e, and f are usually different from those when the component suction tool is moved in a direction perpendicular to the axis (a direction parallel to the suction surface). In addition, the instability coefficient used for setting acceleration / deceleration when the component suction tool is moved in the direction parallel to the axial direction (direction perpendicular to the suction surface) is M^d/ S^fThis is the same as the case where the circuit board is moved in a direction perpendicular to the plate surface thereof. Furthermore, the acceleration / deceleration when the component suction tool is rotated about the axis parallel to the axial direction is preferably the rotation angle acceleration / deceleration, and the moment of inertia is used instead of the mass of the electronic circuit component. It is desirable.
[0015]
(12) The movement control method for a component suction tool according to (10) or (11), wherein the acceleration / deceleration of the movement of the component suction tool is increased as the negative pressure increases.
As the negative pressure for adsorbing the electronic circuit component by the component adsorbing tool is larger, a larger adsorbing force is obtained and the electronic circuit component is stably held. Therefore, the acceleration / deceleration of the movement of the component suction tool can be increased as the negative pressure increases.
(13) The movement control method of the component suction tool according to any one of (10) to (12), wherein the acceleration / deceleration of the movement of the component suction tool is set in consideration of the shape factor of the suction surface. .
Regarding the shape factor of the attracting surface, the description of the shape factor of the bottom surface of the electronic circuit component applies almost as it is.
[0016]
(14) A program executed by a computer to control movement of a component suction tool that sucks an electronic circuit component on the suction surface by negative pressure in a direction parallel to the suction surface,
An allowable acceleration / deceleration acquisition step for acquiring a set allowable acceleration / deceleration that is smaller as the mass and height of the electronic circuit component is larger and that the area of the adsorption surface of the component adsorber is larger;
A movement control step for moving the component suction tool at an acceleration / deceleration below the permissible acceleration / deceleration acquired;
Part suction tool movement control program.
The features described in the items (11) to (13) can be applied to the program of this item. In addition, the allowable acceleration / deceleration in the program of this section may be set based on the mass-related quantity, the height-related quantity and the bottom dimension-related quantity described in the above section (9).
The allowable acceleration / deceleration may be acquired by calculation, or may be acquired by reading from the storage unit of the allowable acceleration / deceleration that has already been calculated and stored in the storage means.
[0017]
(15) To determine the allowable acceleration / deceleration for moving the circuit board on which the electronic circuit components are temporarily fixed by the adhesive force of the temporary fixing agent applied in a spot shape in the direction parallel to the surface of the circuit board. A program executed by a computer,
  When the mass of the electronic circuit component is M, the height is H, the bottom area is S, and exponents of power functions are a, b, c, (M^a・ H^b) / S^cAn unstable coefficient related quantity acquisition step for acquiring an unstable coefficient related quantity related to the unstable coefficient represented by:
  A permissible acceleration / deceleration determining step for determining an allowable acceleration / deceleration of the movement of the circuit board larger as the instability coefficient-related amount is smaller, based on the acquired instability coefficient-related amount;
  Circuit board allowable acceleration / deceleration determination program.
  The features described in the items (3) to (5) can be applied to the program of this item. In addition, the allowable acceleration / deceleration in the program of this section can be set based on the mass-related quantity, the height-related quantity and the bottom dimension-related quantity described in the above section (1).
  The instability coefficient related quantity may be the instability coefficient itself, or may be a physical quantity whose magnitude changes in accordance with the magnitude of the instability coefficient. Data for obtaining the instability coefficient, for example, an electronic circuit that is component information It may be the mass, height and bottom area of the part.
  According to the program of this section, the allowable acceleration / deceleration of the circuit board can be determined to be as large as possible without causing displacement of the electronic circuit component.
(16) A program executed by a computer to determine an allowable acceleration / deceleration of movement in a direction parallel to the suction surface of a component suction tool that sucks an electronic circuit component by negative pressure on the suction surface,
  When the mass of the electronic circuit component is M, the height is H, the area of the suction surface of the component suction tool is S, and the indices are d, e, and f, (M^d・ H^e) / S^fAn unstable coefficient related quantity acquisition step for acquiring an unstable coefficient related quantity related to the unstable coefficient represented by:
  Based on the acquired instability coefficient related quantity,Allowable acceleration / deceleration of the movementNotAn allowable acceleration / deceleration determination step in which the smaller the stability coefficient related quantity is,
Allowable acceleration / deceleration determination program for parts suction tool including
  The instability coefficient related quantity may be the instability coefficient itself, or a physical quantity whose magnitude changes in accordance with the magnitude of the instability coefficient, and data for obtaining the instability coefficient, for example, an electronic circuit that is component information It may be the area of the suction surface that is the mass and height of the component and the suction tool information.
  The features described in the items (11) to (13) can be applied to the program of this item. In addition, the allowable acceleration / deceleration in the program of this section may be set based on the mass-related quantity, the height-related quantity, and the suction surface dimension-related quantity described in the above section (9).
  According to the program of this section, the allowable acceleration / deceleration of the component adsorbing tool can be determined to be as large as possible without causing the positional deviation of the electronic circuit component.
[0018]
(17) To determine the allowable acceleration / deceleration when moving the circuit board on which the electronic circuit component is temporarily fixed by the adhesive force of the temporary fixing agent applied in a spot shape in a direction parallel to the surface of the circuit board. A program executed by a computer,
A component information acquisition step of acquiring the mass, height and bottom area of the electronic circuit component;
An allowable acceleration / deceleration determining step for determining an allowable acceleration / deceleration of the movement of the circuit board to be smaller as the mass and height are larger and to be larger as the bottom area is larger;
Circuit board allowable acceleration / deceleration determination program.
(18) A program executed by a computer to determine allowable acceleration / deceleration of movement in a direction parallel to the suction surface of a component suction tool that sucks an electronic circuit component by negative pressure on the suction surface,
A component / adsorber information acquisition step for acquiring the mass and height of the electronic circuit component and the area of the adsorption surface;
An allowable acceleration / deceleration determining step for determining an allowable acceleration / deceleration of the movement of the component adsorbing tool to be smaller as the acquired mass and height are larger and larger as the area of the adsorption surface is larger;
Allowable acceleration / deceleration determination program for parts suction tool including
[0019]
(19) A recording medium on which the program according to any one of (6), (8), (14), (15) to (18) is recorded so as to be readable by a computer.
The recording medium is, for example, a removable recording medium that can be attached to and removed from a computer such as a ROM cassette, a magnetic tape that can be read by a reading device provided in the computer, a magnetic disk, a magneto-optical disk, an optical disk, a rewritable CD-ROM, etc. A readable recording medium is used.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 schematically shows an electronic circuit manufacturing line that is a consistent mounting line. This electronic circuit manufacturing line uses a cream solder (hereinafter abbreviated as solder), which is a kind of temporary fixing agent, on a printed wiring board as a circuit board from the upstream side (left side in FIG. 1) to the downstream side. Solder coating system 2 for coating, two electronic circuit component mounting systems 4 and 6 for mounting electronic circuit components on a printed wiring board, and a reflow furnace system 8 for soldering electronic circuit components mounted on the printed wiring board are provided. Has been. Each of these includes a substrate transfer device for transferring a circuit board, and a substrate transfer device 10 for connecting each of them is provided between the systems. Further, a board carry-in device (loader) 12 for carrying a printed wiring board into the main line is disposed upstream of the solder application system 2, and a board carry-out apparatus for carrying out a printed circuit board from the main line is disposed downstream of the reflow furnace system 16. An (unloader) 14 is disposed, and a line control device 16 mainly including a computer that centrally manages these devices is disposed outside the line.
[0021]
The upstream electronic circuit component mounting system 4 (hereinafter referred to as “first mounting system 4”) is an index table type mounting system having a component mounting device in which a plurality of mounting heads are intermittently rotated. The circuit component mounting system 6 (hereinafter referred to as “second mounting system 6”) is an XY type mounting system having a component mounting device in which a mounting head is moved by an XY robot. A small electronic component is mounted, and the second mounting system 6 performs a task sharing such as mounting a relatively large or irregular electronic circuit component, and performs an electronic circuit component mounting operation on one printed wiring board.
[0022]
The first mounting system 4 will be described with reference to FIGS. The first mounting system 4 of the present embodiment is disclosed in JP-A-6-342998, JP-A-2001-345599 and JP-A-2001-172915 by the applicant of the present application. The configuration is almost the same as the electronic circuit component mounting system, which will be briefly described.
[0023]
As shown in FIG. 2, the first mounting system 4 includes a bed 18 as a system main body, a component supply device 20 provided on the bed 18, a component mounting device 22, an XY moving device 24 as a substrate moving device, and board imaging. A system 26 and a first mounting system controller 28 (see FIG. 5) are provided.
[0024]
As shown in FIG. 1, the component supply apparatus 20 includes at least one component supply table 30, 32 in this embodiment. Each of these component supply tables 30 and 32 includes a feeder support table 34 and a plurality of feeders 36 mounted on the feeder support table 34. In the present embodiment, the plurality of feeders 36 are tape feeders that supply electronic circuit components 38 (see FIG. 4) in a state where they are held on a component holding tape to form a taped electronic circuit component. Electronic circuit components are fed by being fed by the tape feeder, and are supplied one by one from the component supply unit. The component supply tables 30 and 32 are moved independently in the X-axis direction (left and right direction in FIG. 1) by the table moving device 40, and each component supply unit of the plurality of feeders 36 is mounted with the electronic circuit component 38. According to the order, the electronic circuit component 38 is supplied by being selectively positioned at the component supply position. Electronic circuit components are given the same reference numerals even if the types are different. The same applies to the second mounting system 6.
[0025]
As shown in FIG. 1, the XY moving device 24 holds a printed wiring board 52 as a circuit board by a printed wiring board holding device 50, and is a plane parallel to the mounting surface 54 that is the surface of the printed wiring board 52. To an arbitrary position in a horizontal plane. The XY moving device 24 includes an X-axis slide 74 as a moving member guided by a guide device 72 and moved in the X-axis direction by an X-axis slide drive motor 68 and a ball screw 70 as a feed screw, and the X On the shaft slide 74, a Y-axis slide 82 as a moving member guided by a guide device 80 and moved in the Y-axis direction by a Y-axis slide drive motor 76 and a ball screw 78 as a feed screw is provided. . The Y-axis direction is a direction orthogonal to the X-axis direction in the horizontal plane, and the X-axis and Y-axis directions are directions parallel to the two coordinate axes of the horizontal XY coordinate plane. The X-axis slide drive motor 68, the ball screw 70, and the like constitute an X-axis slide movement device 86, and the X-axis slide 74 and the X-axis movement device 88 constitute a Y-axis slide drive motor 76, a ball screw 78, etc. Constitutes a Y-axis slide moving device 90, and constitutes a Y-axis moving device 92 together with the Y-axis slide 82.
[0026]
In the present embodiment, the printed wiring board holding device 50 includes a wiring board support device that supports the printed wiring board 52 from below and a clamp device that clamps the printed wiring board 52, although illustration is omitted. The printed wiring board 52 is held in a horizontal posture. Although not shown on the bed 18, the board transfer device connected to the board transfer device 10 with the solder application system 2, receives the printed wiring board 52, and passes it to the printed wiring board holding device 50. There is provided a substrate transfer device that receives the printed wiring board 52 from the holding device 50 and passes it to the substrate transfer device 10 with the second mounting system 6. Although not shown, the mounting surface 54 of the printed wiring board 52 is provided with a plurality of reference marks in the present embodiment, and images are taken by the board imaging system 26 (see FIG. 2). The board imaging system 26 includes an imaging device and a lighting device.
[0027]
The component mounting device 22 will be briefly described with reference to FIGS.
The component mounting apparatus 22 includes a plurality of, in this embodiment, 16 sets of mounting heads 100, a head swiveling device 102 as a head moving device that rotates the mounting heads 100 around a single axis, and in this embodiment, a mounting head. Head lifting devices 104 and 106 for lifting and lowering 100, head rotating devices 108, 110 and 112 (see FIG. 5) for rotating the mounting head 100 around its axis, a component imaging system 114 (see FIG. 2), and the like are provided.
[0028]
In this embodiment, the head turning device 102 includes an intermittent rotating disk 130 that is a kind of rotating body and an intermittent rotating device 132 that is a kind of rotating body rotating apparatus, as shown in FIG. The intermittent rotating disk 130 is supported by the frame 134 of the component mounting device 22 so as to be rotatable about a single axis, in this embodiment, a vertical axis, and on a circumference around the rotating axis of the intermittent rotating disk 130. 16 sets of mounting heads 100 are held at equal angular intervals.
[0029]
The intermittent rotation device 132 uses an intermittent rotation motor 136 (see FIG. 5) as a drive source, and includes a rotation shaft 138, a roller gear, and a roller gear cam (not shown; hereinafter referred to as a cam), and the cam is an intermittent rotation motor. When the roller 136 is rotated at a constant speed in one direction, the plurality of rollers of the roller gear are sequentially engaged with the cam ribs of the cam, and the rotation shaft 138 has a fixed angle around the vertical axis, that is, the mounting angle of 16 sets of mounting heads 100. It is rotated intermittently at an angle equal to the interval. As a result, the intermittent rotating disk 130 is intermittently rotated, and the 16 sets of mounting heads 100 are rotated around a common axis of rotation, that is, the axis of rotation of the intermittent rotating disk 130, which is a vertical axis. 16 stop positions, such as the component holding position or the component pickup position set as the component receiving position, the component posture changing position, the imaging position or the component holding posture detecting position, the component posture correcting position, the component mounting position, the mounting head posture return position, etc. Sequentially stopped at the position. These stop positions are predetermined positions in the present embodiment, and are always constant positions.
[0030]
The 16 sets of mounting heads 100 are provided on the intermittent rotating disk 130 so as to be movable in a direction parallel to the rotation axis thereof and to be movable up and down. When turning, the action of the cylindrical cam 140 fixed to the lower surface of the frame 134 is provided. By this, it is moved in the direction parallel to the rotation axis of the rotator and moved up and down. Each of the 16 sets of mounting heads 100 detachably holds a plurality of suction nozzles 150 as component suction tools which are a kind of component holder.
[0031]
As shown in FIG. 4, the suction nozzle 150 includes a main body 152 and an adsorption tube 154, the main body 152 constitutes a main body portion, and the adsorption tube 154 constitutes an adsorption portion. One of the plurality of suction nozzles 150 is selectively positioned at the working position, and the electronic circuit component 38 is sucked and held on the suction surface 156 that is the tip surface of the suction pipe 154 by a negative pressure.
[0032]
The head lifting devices 104 and 106 are provided at the component receiving position and the component mounting position, and the mounting head 100 is lifted and the suction nozzle 150 is lifted to receive and mount the electronic circuit component 38. The head rotation devices 108, 110, and 112 are provided at the component posture change position, the component posture correction position, and the mounting head posture return position, respectively, and the suction nozzle 150 is rotated by rotating the mounting head 100 about the axis. Is rotated, and the posture of the electronic circuit component 38 is changed (change in position around the axis), the rotational position error of the electronic circuit component 38 is corrected, and the mounting head 100 is returned to the original position.
[0033]
The component imaging system 114 is provided at the component holding posture detection position. The component imaging system 114 includes an imaging device, a light guide device, and an illumination device, and is configured to selectively capture a front image and a projection image of an electronic circuit component.
[0034]
As shown in FIG. 5, the first mounting system controller 28 is mainly composed of a computer 166 (hereinafter referred to as a first mounting system computer 166) having a PU 160, a ROM 162, a RAM 164, and a bus 165 for connecting them. It is. An input / output interface 168 is connected to the bus, and an image processing computer 180 for processing image data obtained by imaging by the board imaging system 26 and the component imaging system 114, a computer 182 of the line control device 16 (hereinafter referred to as a host computer 182). Are connected to each other, various sensors such as an encoder 186, a reading device 192, and the like. A part data generator (hereinafter abbreviated as PDG) 188 is connected to the host computer 182. The reading device 192 reads a program and data recorded on a magneto-optical disk 194 which is a kind of recording medium, and inputs it to a computer 166.
[0035]
The input / output interface 168 is also connected to an actuator constituting the table moving device 40 and the like via a drive circuit 190. In these devices 40 and the like, the motor constituting the drive source is a kind of actuator. In the present embodiment, the motor is an electric rotary motor that is a kind of electric motor, and a servo motor capable of controlling the rotation angle with high accuracy. It is configured. A step motor may be used instead of the servo motor. The rotation angles of these motors are detected by an encoder which is a rotation angle detection device, and the motors and the like are controlled based on the detection results. FIG. 5 representatively shows one of these encoders.
[0036]
The ROM 162 and RAM 164 store various programs and data, such as a main routine (not shown), a wiring board movement control routine shown in the flowchart of FIG. 16, a program for mounting the electronic circuit component 38 on the printed wiring board 52, and the like. Has been.
[0037]
Although detailed illustration is omitted, the host computer 182 is configured in the same manner as the first mounting system computer 166, and its RAM and ROM have a main routine not shown and prints shown in flowcharts in FIG. 10 and the like, respectively. Various programs and data are stored, such as a wiring board allowable acceleration / deceleration determination routine. These programs, data, and the like, for example, are stored in a rewritable ROM, stored in a backup unit of a RAM, or stored in an external storage device or a recording medium, if necessary.
[0038]
The second mounting system 6 will be described with reference to FIGS.
The basic configuration of the second mounting system 6 is the same as the electronic circuit component mounting system described in Japanese Patent No. 2824378, and will be briefly described.
[0039]
As shown in FIG. 6, the second mounting system 6 includes a bed 300 as a system main body, a wiring board transport device 302 provided on the bed 300, a printed wiring board holding device 304, a component mounting device 306, and feeder-type component supply. A device 308, a tray-type component supply device 310, a board imaging system 312, and a second mounting system control device 314 (see FIG. 9) for controlling these devices and the like are provided.
[0040]
In the present embodiment, the printed wiring board 52 is transported in a horizontal posture by the wiring board transporting device 302, stopped at a predetermined component mounting position by a stop device (not shown), and by the printed wiring board holding device 304. The mounting surface 54 is held in a horizontal posture. The wiring board transfer device 302 is connected to the substrate transfer device 10 between the first mounting system 4 and the substrate transfer device 10 between the reflow furnace system 8 and receives the printed wiring board 52 from the first mounting system 4. To the reflow furnace system 8. The printed wiring board holding device 304 includes a printed wiring board support device and a clamping device (not shown), is provided with a fixed position, and the electronic circuit component 38 is mounted on the printed wiring board 52 in a stationary state.
[0041]
The feeder-type component supply device 308 has a plurality of feeders 322 aligned on the feeder support table 320 side by side in the X-axis direction (left-right direction in FIG. 6). The feeder 322 is a tape feeder like the feeder 36. A plurality of trays 326 for storing a plurality of electronic circuit components 38 are stacked in the tray-type component supply device 310, and these trays 326 are in a state where the mounting head can acquire the electronic circuit components 38 from each tray 326. Are sequentially moved to supply the electronic circuit component 38. These component supply devices 308 and 310 are provided with fixed positions, and supply the electronic circuit component 38 in a stationary state.
[0042]
The component mounting device 306 mainly includes a mounting head 330 and a head moving device or a component suction device moving device that moves the mounting head 330 to an arbitrary position in a horizontal plane that is parallel to the mounting surface 54 of the printed wiring board 52. XY robot 334, a head rotating device 336 that rotates the mounting head 330 about the axis, a head lifting device 338 that lifts and lowers the mounting head 330, and the like.
[0043]
As shown in FIG. 6, the XY robot 334 includes an X-axis slide 340 as a moving member, an X-axis slide moving device 342, a Y-axis slide 344 as a moving member, and a Y-axis slide moving device 346. The X-axis slide moving device 342 includes an X-axis slide driving motor 348, a ball screw 350, and a nut (not shown), moves the X-axis slide 340 in the X-axis direction, and the X-axis slide device 354 together with the X-axis slide 340. Is configured. The Y-axis slide 344 and the Y-axis slide moving device 346 are provided on the X-axis slide 340. The Y-axis slide moving device 346 includes a Y-axis slide driving motor 356, a ball screw 358, and a nut (not shown), and moves the Y-axis slide 344 in the Y-axis direction, along with the Y-axis slide 344, the Y-axis moving device 362. Is configured.
[0044]
The mounting head 330 includes a nozzle holder, and holds the suction nozzle 370 in a detachable manner as shown in FIGS. The suction nozzle 370 includes a main body 372 as a main body part and an adsorption pipe 374 constituting the adsorption part, and adsorbs the electronic circuit component 38 by a negative pressure on an adsorption surface 376 that is a tip surface of the adsorption pipe 374. The adsorption pipe 374 is selectively communicated with a negative pressure source, a positive pressure source and the atmosphere by switching an electromagnetic direction switching valve device (not shown) to hold and release the electronic circuit component 38. The suction nozzle 370 held by the mounting head 330 is moved by the XY robot 334 in a direction parallel to the mounting surface 54 of the printed wiring board 52 and parallel to the suction surface 376.
[0045]
The mounting head 330 can be moved up and down on the Y-axis slide 344 and can rotate about the axis. The mounting head 330 is moved up and down by the head lifting device 338 provided on the Y-axis slide 344 together with the mounting head 330, and the suction nozzle 370. The electronic circuit component 38 is received from the component supply devices 308 and 310 at the component supply position, and is mounted on the printed wiring board 52 at the component mounting position. The component mounting position differs for each mounting of the electronic circuit component 38. The mounting head 330 is also rotated by a head rotating device 336 provided on the Y-axis slide 344, and the posture of the electronic circuit component 38 sucked by the suction nozzle 370 is corrected and the rotational position error is corrected. In the present embodiment, these mounting heads 330 and the like are configured in the same manner as the mounting head 330 described in Japanese Patent No. 3093339 and the description thereof is omitted.
[0046]
The Y-axis slide 344 is also provided with the board imaging system 312 as shown in FIG. The board imaging system 312 includes an imaging device and an illumination device, and is moved by an XY robot 334 so that an arbitrary position on the mounting surface 54 of the printed wiring board 52 can be imaged. The X-axis slide 340 is provided with two sets of component imaging systems 390, as shown in part in FIG. The component imaging system 390 includes an imaging device, a light guide device, and a lighting device, images the electronic circuit component 38 held by the suction nozzle 370, and a front image and a projection image of the electronic circuit component 38 are selectively acquired. The
[0047]
As shown in FIG. 9, the second mounting system controller 314 is mainly composed of a computer 410 (hereinafter referred to as a second mounting system computer 410) having a PU 400, a ROM 402, a RAM 404 and a bus 406 for connecting them. Basically, the configuration is the same as that of the first mounting system control device 28, and detailed description thereof is omitted. In FIG. 9, reference numeral 412 is an input / output interface, reference numeral 416 is an image processing computer, reference numeral 418 is an encoder, reference numeral 422 is a reading device, reference numeral 424 is a magneto-optical disk, and reference numeral 420 is a drive circuit. In the present embodiment, a motor that constitutes a drive source in the XY robot 334 or the like is a servo motor. The ROM 402 and RAM 404 store various programs and data such as a main routine (not shown) and a suction nozzle movement control routine shown in the flowchart of FIG. These programs and data are supplied from the host computer 182. It may be stored in the magneto-optical disk 424 and supplied by reading by the reading device 422. The second mounting system control device 314 constitutes a component suction tool moving device control device.
[0048]
The mounting of the electronic circuit component 38 on the printed wiring board 52 in the first mounting system 4 will be briefly described.
When the electronic circuit component 38 is mounted on the printed wiring board 52 in the first mounting system 4, the intermittent rotating disk 130 is intermittently rotated by the intermittent rotation motor 136, and the plurality of mounting heads 100 sequentially move to the component receiving position or the like. Be made. The mounting head 100 is lowered by the head lifting device 104 at the component receiving position, and negative pressure is supplied to the suction nozzle 150 to suck and hold the electronic circuit component 38. If the posture of the electronic circuit component 38 is changed after receiving the electronic circuit component 38, the mounting head 100 is rotated by the head rotating device 108 at the component posture changing position, and then the component imaging system at the component holding posture detection position. The electronic circuit component 38 is imaged by 114. The imaging data is processed by the image processing computer 180, and the holding posture error of the electronic circuit component 38 by the suction nozzle 150 is acquired. Then, the mounting head 100 is rotated by the head rotating device 110 at the component posture correction position, and the rotational position error, which is the holding posture error of the electronic circuit component 38, is corrected. The electronic circuit component 38 is mounted on the printed wiring board 52.
[0049]
In the component supply apparatus 20, the component supply tables 30 and 32 are moved to position the feeder 36 at the component supply position, and the electronic circuit component 38 is supplied from the component supply unit. A plurality of component mounting points on the mounting surface 54 of the printed wiring board 52 are respectively spot-coated with solder in the solder application system 2, and the printed wiring board 52 is held by the printed wiring board holding device 50, and XY It is moved by the moving device 24 so that the component mounting position is a position corresponding to the component mounting position of the component mounting device 22 and is positioned at the position where the electronic circuit component 38 is mounted. The suction nozzle 150 holding the electronic circuit component 38 brings the electronic circuit component 38 into contact with the soldered portion of the printed wiring board 52 positioned by the XY moving device 24 at a predetermined component mounting position. Installing. At the time of positioning the printed wiring board 52, the horizontal position error of the component mounting position obtained based on the imaging of the reference mark by the board imaging system 26, the horizontal position error that is the holding position error of the electronic circuit component 38, and the rotation of the electronic circuit component 38 The center position shift caused by the correction of the position error is corrected.
[0050]
The mounting of the electronic circuit component 38 to the printed wiring board 52 by the second mounting system 6 will be briefly described.
The printed wiring board 52 carried in by the wiring board conveying device 302 and stopped at the work position is held by the printed wiring board holding device 304. For example, if the electronic circuit component 38 supplied by the feeder-type component supply device 308 is mounted on the printed wiring board 52, the suction nozzle 370 is moved to the component receiving position by the XY robot 334, and the component supply of the feeder 322 is performed. The suction nozzle 370 sucks the electronic circuit component 38 by a negative pressure.
[0051]
After receiving, the suction nozzle 370 is moved to the component mounting position by the XY robot 334 and is lowered on the component mounting position of the printed wiring board 52, and the solder of the printed wiring board 52 is applied in a spot shape to the electronic circuit component 38. Wear in contact with the part that has been touched. The electronic circuit component 38 is imaged by the component imaging system 390 in the middle of the movement, and among the holding posture errors of the electronic circuit component 38 obtained based on the imaging data, the rotational position error is detected by the head rotating device 336 by the mounting head 330. The horizontal position error of the electronic circuit component 38, the shift of the center position due to the correction of the rotational position error, and the horizontal position error of the component mounting location are corrected by correcting the moving distance of the suction nozzle 370. The horizontal position error of the component mounting location is acquired based on the imaging of the reference mark by the board imaging system 312.
[0052]
In this way, in the first embodiment, the mounting program for mounting the electronic circuit component 38 on the printed wiring board 52 in the first and second mounting systems 4 and 6 is created in the host computer 182 in this embodiment. The host computer 182 distributes the electronic circuit components 38 mounted on the printed wiring board 52 to the first mounting system 4 and the second mounting system 6 to create a mounting program. At this time, the host computer 182 performs a mounting simulation, and the electronic circuit component 38 is mounted in a state where the electronic circuit component 38 is mounted while satisfying predetermined conditions in the first and second mounting systems 4 and 6. Distribution is performed so that the total amount of time required is the shortest. The electronic circuit component 38 mounted on the printed wiring board 52 is obtained from, for example, printed circuit board design data. In the design data, for example, all the component mounting locations of the printed circuit board are associated with the electronic circuit components to be mounted at each of the component mounting locations.
[0053]
In the mounting simulation, for the first mounting system 4, for example, target acceleration / deceleration below the minimum of the allowable acceleration / deceleration of the plurality of electronic circuit components 38 that are already temporarily fixed to the printed wiring board 52. The printed circuit board 52 is moved, the electronic circuit component 38 having a large allowable acceleration / deceleration allowed on the printed circuit board 52 is mounted first, and the electronic circuit component 38 held and mounted by the suction nozzle 150 is mounted. On the condition that it does not interfere with the electronic circuit component 38 already mounted on the printed wiring board 52, the movement distance of the printed wiring board 52 (the distance between the component mounting positions where the electronic circuit component 38 is mounted before and after) The mounting order of the electronic circuit components 38 and the arrangement of the electronic circuit components 38 in the component supply device 20 are set so that the mounting time is as short as possible. It is carried out by. At this time, data regarding the electronic circuit component 38 is obtained from the PDG 188.
[0054]
For the second mounting system 6, for example, the suction nozzle 370 is moved at an acceleration / deceleration below the allowable acceleration / deceleration, and the electronic circuit component 38 held and mounted by the suction nozzle 370 is printed wiring. The moving distance of the suction nozzle 370 (between the component supply portions of the component supply devices 308 and 310 and the component mounting portion of the printed wiring board 52 is provided on condition that the electronic circuit component 38 already mounted on the board 52 does not interfere. The sum of the electronic circuit components 38 and the arrangement of the electronic circuit components 38 in the component supply devices 308 and 310 (the arrangement order of the feeders 322 and the tray 326) This is done by setting the stacking order). Then, in each of the first and second mounting systems 4 and 6, the distribution of the electronic circuit components 38 that requires the shortest mounting time is actually applied to the printed wiring board 52 in the first and second mounting systems 4 and 6. The electronic circuit component 38 to be mounted is used for sorting.
[0055]
The acceleration / deceleration allowed for the printed wiring board 52 will be described.
When the electronic circuit component 38 is mounted on the printed wiring board 52 in the first mounting system 4, the electronic circuit component 38 is placed on the solder whose electrodes are applied in a spot shape on the mounting surface 54. Although it is temporarily fixed to the printed wiring board 52 by the adhesive force, it is not fixed. Depending on the acceleration at the start of movement of the printed wiring board 52 and the magnitude of the deceleration at the stop, the position may shift or fall down. There is a risk of doing.
[0056]
At this time, the printed wiring board 52 is mounted with the allowable acceleration / deceleration set for the electronic circuit component 38 mounted on the printed wiring board 52, that is, with the printed wiring board 52 mounted. Even if the electronic circuit component 38 is moved in a direction parallel to the surface 54, the electronic circuit component 38 is not displaced or decelerated. It is possible to move in a short time without causing the above. A plurality of types of electronic circuit components 38 are mounted on the printed wiring board 52, and the allowable acceleration and deceleration set for each of the electronic circuit components 38 are not necessarily the same. Among the allowable acceleration / deceleration set for each of the plurality of electronic circuit components 38 mounted on the target acceleration / deceleration set to the minimum allowable acceleration / deceleration, the target acceleration / deceleration below the deceleration is as large as possible. If the printed wiring board 52 is moved, any electronic circuit component 38 mounted on the printed wiring board 52 can be moved in a short time without causing a positional shift or the like.
[0057]
Furthermore, the total mounting time can be shortened when the electronic circuit component 38 having the larger allowable acceleration / deceleration is mounted first than when the electronic circuit component 38 is mounted later. In order to move the printed wiring board 52 with a target acceleration / deceleration below the minimum of the allowable acceleration / deceleration of the plurality of electronic circuit components 38 temporarily fixed to the printed wiring board 52, the allowable acceleration / deceleration is allowed. If the electronic circuit component 38 having a larger value is mounted first, the target acceleration / deceleration gradually decreases. However, if the electronic circuit component 38 having a smaller allowable acceleration / deceleration is mounted first, the target acceleration / deceleration is reduced. Because it is small from the beginning, it takes time to move.
[0058]
In the host computer 182, when the mounting simulation is executed, the first mounting system 4 has the allowable acceleration / deceleration of the electronic circuit component 38 and the acceleration / deceleration allowed by the printed wiring board 52 (hereinafter, “printing”). In addition to obtaining the allowable acceleration / deceleration of the wiring board 52 and the minimum acceleration / deceleration, the target acceleration / deceleration for moving the printed wiring board 52 is set. In the present embodiment, the allowable acceleration and deceleration of the printed wiring board 52 are set based on the mass, height and bottom area of the electronic circuit component 38 and the adhesive strength of the solder. As the mass and height of the electronic circuit component 38 are larger, the bottom area is smaller, and the adhesive strength of the solder is smaller, the position of the electronic circuit component 38 is shifted due to the impact caused by acceleration and deceleration at the start and stop of movement. It is because it is easy to occur.
[0059]
The allowable acceleration / deceleration of the printed wiring board 52 is determined for each type of electronic circuit component 38 by executing the routine for determining the allowable acceleration / deceleration of the printed wiring board shown in FIG. In step 1 of the routine for determining the allowable acceleration / deceleration of the printed wiring board (hereinafter abbreviated as S1. The same applies to other steps), first, all the electronic circuit components 38 mounted on the printed wiring board 52 are checked. For one of them, the mass, height, and bottom area, which are component information, are read from the PDG 188, and in S2, the instability coefficient of the electronic circuit component 38 is calculated based on the mass, height, and bottom area. Is done. In S1, the mass and dimensions of the electronic circuit component 38 may be read and the bottom area may be obtained by calculation. The instability coefficient is a coefficient representing the instability when the printed wiring board 52 is moved in a state where the electronic circuit component 38 is mounted on the printed wiring board 52, that is, the ease of occurrence of positional deviation or overturning. The larger the instability coefficient, the easier it is to cause misalignment. Instability coefficient K_EIs obtained by equation (1).
K_E= (M^a・ H^b) / S_E ^c ... (1)
Where M is the mass of the electronic circuit component 38, H is the height, S_EIs the bottom area, and a, b, and c are exponents of the power function. The indices a, b, and c should be referred to as the contribution ratios of the mass, height, and bottom area to the instability coefficient. For example, the unit of mass M is g, the unit of height H is mm, and the bottom area S_E Unit of mm²When the index a is 1, the index b and the index c are both 1 in this embodiment.
[0060]
After calculation of the instability coefficient, S3 is executed to determine the allowable acceleration / deceleration of the printed wiring board 52. The electronic circuit component 38 from which the component information is read in S1 and only the electronic circuit component 38 for which the allowable acceleration / deceleration is determined is mounted on the printed wiring board 52, and the printed wiring board 52 is mounted on the mounting surface. Therefore, an allowable acceleration / deceleration that is allowed to be moved in a direction parallel to 54 is required. The allowable acceleration / deceleration is determined based on the instability coefficient calculated in S2 and data (which may be an equation) that defines the relationship between the instability coefficient and the allowable acceleration / deceleration. The greater the instability coefficient, the easier the position of the electronic circuit component 38 will shift, and the acceleration and deceleration allowed for the printed wiring board 52 will decrease. There is a tendency relationship shown in the graph of FIG. 11 between the instability coefficient of the electronic circuit component 38 and the acceleration / deceleration allowed for the printed wiring board 52. The curve shown in the graph of FIG. 11 defines the boundary between the acceleration / deceleration allowed and the unacceptable acceleration / deceleration of the printed wiring board 52 with respect to the magnitude of the instability coefficient of the electronic circuit component 38. If the permissible acceleration / deceleration is determined in the area below the permissible limit stipulated line and the permissible acceleration / deceleration is determined, there is no possibility that the electronic circuit component 38 will be displaced, and the permissible limit is in the area above the permissible limit stipulated line If the acceleration / deceleration is determined, the electronic circuit component 38 is likely to be misaligned.
[0061]
Further, even if the instability coefficient of the electronic circuit component 38 is the same, the electronic circuit component 38 is less likely to be displaced as the adhesive strength of the solder is larger. Therefore, a plurality of types of data defining the relationship between the instability coefficient and the allowable acceleration / deceleration are set according to the adhesive strength of the solder and stored in the RAM backup unit of the host computer 182. In all the data, the tendency of the relationship obtained between the instability coefficient and the allowable acceleration / deceleration is the same, but the allowable limit stipulation line increases as the adhesive force increases. This is the line where acceleration and deceleration can be obtained.
[0062]
In S3, the allowable acceleration / deceleration is determined based on the data defining the relationship between the instability coefficient selected according to the adhesive force of the solder and the allowable acceleration / deceleration, and the instability coefficient. Solder is applied to the printed wiring board 52 in the solder application system 2, and the host computer 182 stores data relating to the type of solder applied to the printed wiring board 52. Here, the allowable acceleration / deceleration is determined to be a magnitude obtained on the allowable limit stipulated line for the instability coefficient, and stored in the RAM of the host computer 182 in association with the type of the electronic circuit component 38. Then, S4 is executed, and it is determined whether or not the allowable acceleration / deceleration has been determined for all the electronic circuit components 38 mounted on the printed wiring board 52.
[0063]
Until all the electronic circuit components 38 are determined, the determination result of S4 is NO, the execution of the routine returns to S1, and the allowable acceleration / deceleration is determined for another electronic circuit component 38. If the type of the electronic circuit component 38 read in S1 has already been determined to have allowable acceleration / deceleration, the determined allowable acceleration / deceleration may be read and used. . Based on the design data of the printed circuit board, data for setting the type of the electronic circuit component 38 to be mounted on the printed wiring board 52 is created, and based on the data, the type of the electronic circuit component 38 is read and allowed to be added. The deceleration may be determined. Thus, the allowable acceleration / deceleration of the printed wiring board 52 is set according to the instability coefficient and the adhesive strength of the solder, and is set to a larger value as the instability coefficient is smaller, and the mass and height of the electronic circuit component 38 are increased. The larger the value is, the smaller the value is set, and the larger the bottom area of the electronic circuit component 38 is, the larger the value is set.
[0064]
The target acceleration / deceleration of the printed wiring board 52 is set based on the target acceleration / deceleration determination routine of the printed wiring board 52 shown in FIG. This routine is executed every time one electronic circuit component 38 is mounted on the printed wiring board 52. In the mounting simulation, assuming that the electronic circuit components 38 distributed to the first mounting system 4 are mounted on the printed wiring board 52 in the set mounting order, a target acceleration / deceleration determining routine is executed. First, in S <b> 11, the allowable acceleration / deceleration determined for the latest electronic circuit component 38 mounted on the printed wiring board 52 is read from the RAM based on the type of the electronic circuit component 38.
[0065]
Next, S12 is executed to compare which of the currently set target acceleration / deceleration and the allowable acceleration / deceleration read in S11 is greater. If the allowable acceleration / deceleration read in S11 is greater than or equal to the currently set target acceleration / deceleration, the determination result in S12 is NO, and the execution of the routine ends. In this case, the latest installed electronic circuit component 38 has a large allowable acceleration / deceleration, and even if the printed wiring board 52 is moved with the currently set target acceleration / deceleration, no positional deviation occurs. It is. The initial value of the target acceleration / deceleration is, for example, the maximum value obtained for the printed wiring board 52 by the XY moving device 24.
[0066]
On the other hand, if the allowable acceleration / deceleration read in S11 is smaller than the target acceleration / deceleration, the determination result in S12 is YES, S13 is executed, and the target acceleration / deceleration is changed. In this case, if the printed wiring board 52 is moved with the currently set target acceleration / deceleration, there is a risk that the newly mounted electronic circuit component 38 may be misaligned. Is smaller than the allowable acceleration / deceleration set for the newly mounted electronic circuit component 38 and is changed to a value as large as possible. The target acceleration / deceleration currently set is the minimum acceleration / deceleration among the allowable acceleration / deceleration of the printed wiring board 52 set for each of the plurality of electronic circuit components already mounted on the printed wiring board 52. If the acceleration / deceleration is below the speed and the allowable acceleration / deceleration of the newly mounted electronic circuit component 52 is compared with the currently set target acceleration / deceleration, the acceleration / deceleration is smaller than the target acceleration / deceleration The setting of the target acceleration / deceleration to a size equal to or smaller than the allowable acceleration / deceleration is set for each of the plurality of electronic circuit components 52 that are already temporarily fixed to the printed wiring board 52. It is to acquire the minimum of the allowable acceleration / deceleration of the printed wiring board 52.
[0067]
The target acceleration / deceleration may be an acceleration / deceleration below the allowable acceleration / deceleration determined for the latest mounted electronic circuit component. In the present embodiment, the acceleration / deceleration when the XY moving device 24 moves the printed wiring board 52 is changed in stages. Here, the target acceleration / deceleration is the latest installation. It is set to a size that is smaller than the allowable acceleration / deceleration of the electronic circuit component and closest to the latest allowable acceleration / deceleration. If the printed wiring board 52 is moved with the target acceleration / deceleration, all the electronic circuit components 38 that are already temporarily fixed on the printed wiring board 52 can be moved without causing a positional shift or the like. it can.
[0068]
The allowable acceleration / deceleration of the suction nozzle 370 of the second mounting system 6 will be described.
The suction nozzle 370 holds the electronic circuit component 38 by suction and is moved in the horizontal direction. However, the electronic circuit component 38 moves against the suction nozzle 370 by an impact caused by acceleration and deceleration when the suction nozzle 370 starts and stops moving. May be misaligned or fall. For this reason, the allowable acceleration / deceleration of the suction nozzle 370, that is, the acceleration / deceleration that does not cause a positional shift or the like in the electronic circuit component 38 even if the movement of the suction nozzle 370 with the electronic circuit component 38 started and stopped is stopped. Is determined for each of all the electronic circuit components 38 mounted on the printed wiring board 52.
[0069]
The allowable acceleration / deceleration of the suction nozzle 370 is determined based on the allowable acceleration / deceleration determination routine of the suction nozzle shown in FIG. In S21 of this routine, component information about one of all electronic circuit components 38 mounted on the printed wiring board 52, here, the mass and height of the electronic circuit component 38 are read from the PDG 188, and the suction tool information is used. The area of a certain suction surface 376 is read from the RAM of the host computer 182.
[0070]
Next, S22 is executed, and the instability coefficient is calculated for the electronic circuit component 38. When the electronic circuit component 38 is adsorbed by the adsorption nozzle 370 and conveyed by the movement of the adsorption nozzle 370 in the horizontal direction, the larger the mass and height, the larger the electronic circuit component 38 is, due to the impact caused by acceleration and deceleration at the start and stop of movement. The circuit component tends to be displaced with respect to the adsorption tube 374 and is unstable. The larger the area of the adsorption surface 376 of the adsorption tube 374, the larger the adsorption force is obtained, and the more difficult the displacement is and the higher the stability. Instability coefficient K_NIs the ease with which the electronic circuit component is displaced or dropped with respect to the suction nozzle 370, and is calculated according to equation (2).
K_N= (M^d・ H^e) / S_N ^f... (2)
Where M is the mass of the electronic circuit component 38, H is the height, S_NIs the area of the suction surface 376, and d, e, and f are exponents of the power function. The indices d, e, and f should be referred to as contribution ratios of the mass, the height, and the area of the adsorption surface 376 to the instability coefficient. For example, the unit of mass M is g, the unit of height H is mm, and adsorption Area S of surface 376_NUnit of mm²When the index e is 1, the index f and the index g are both 1 in this embodiment.
[0071]
After calculating the instability coefficient, S23 is executed to determine the allowable acceleration / deceleration of the suction nozzle 370. The allowable acceleration / deceleration is determined based on data (which may be an equation) that defines the relationship between the instability coefficient and the allowable acceleration / deceleration, and the instability coefficient calculated in S22. The larger the instability coefficient, the easier the displacement of the electronic circuit component 38 occurs, and the acceleration and deceleration allowed by the suction nozzle 370 become smaller. There is a tendency relationship shown in the graph of FIG. 14 between the instability coefficient of the electronic circuit component held by the suction nozzle 370 and the allowable acceleration / deceleration. The curve shown in the graph of FIG. 14 is an allowable limit defining line that defines the boundary between the acceleration / deceleration allowed by the suction nozzle 370 and the unacceptable acceleration / deceleration with respect to the magnitude of the instability coefficient. If the permissible acceleration / deceleration is determined in the area below the permissible limit stipulated line, the electronic circuit component 38 is not likely to be displaced, and the permissible acceleration / deceleration is determined in the area above the permissible limit stipulated line In this case, there is a high possibility that the electronic circuit component 38 is displaced.
[0072]
Further, as the negative pressure of the suction nozzle 370 increases, a higher suction force is obtained, the electronic circuit component 38 is stably held, and the allowable acceleration / deceleration can be increased. Therefore, a plurality of types of data defining the relationship between the instability coefficient and the allowable acceleration / deceleration are set according to the magnitude of the negative pressure and stored in the RAM backup unit of the host computer 182. In all the data, the tendency of the relationship obtained between the instability coefficient and the allowable acceleration / deceleration is the same, but the allowable limit specification line increases as the negative pressure increases. This is the line where acceleration and deceleration can be obtained. In the same type of printed wiring board 52, the negative pressure of the suction nozzle 370 at the time of mounting a plurality of electronic circuit components 38 performed on one printed wiring board 52 is the same. The magnitude of the negative pressure of the suction nozzle 370 may be varied according to the shape, size, etc. of the electronic circuit component 38.
[0073]
In S23, the allowable acceleration / deceleration is determined based on the data defining the relationship between the instability coefficient selected according to the negative pressure of the suction nozzle 370 and the allowable acceleration / deceleration, and the instability coefficient. The determined allowable acceleration / deceleration is stored in the RAM of the host computer 182 in association with the type of the electronic circuit component 38. Then, in S24, it is determined whether the allowable acceleration / deceleration has been determined for all the electronic circuit components 38, and the allowable acceleration / deceleration allowed for the suction nozzle 370 for all the electronic circuit components 38 is determined.
[0074]
The determination result of S24 is NO until all electronic circuit components 38 are determined, and the routine execution returns to S21 to determine the allowable acceleration / deceleration for another electronic circuit component 38. If the information read in S21 has already been determined with the allowable acceleration / deceleration, the determined allowable acceleration / deceleration may be read and used. Alternatively, data of only the type of the electronic circuit component 38 to be mounted on the printed wiring board 52 is created, and based on the data and the data of the suction nozzle 370, the allowable acceleration / deceleration of the suction nozzle 370 is determined. May be. As described above, the allowable acceleration / deceleration of the suction nozzle 370 is determined according to the instability coefficient and the negative pressure, and is determined to be smaller as the instability coefficient is larger. The mass and height of the electronic circuit component 38 are larger. The smaller it is, the larger the suction surface area is. Further, the larger the negative pressure, the larger is set.
[0075]
In the present embodiment, the acceleration and deceleration of the XY robot 334 of the second mounting system 6 are changed stepwise. Therefore, when a mounting simulation is performed for the second mounting system 6, target acceleration and deceleration are set based on the allowable acceleration and deceleration set for each of the electronic circuit components 38, and the suction nozzle 370 is moved based on the target acceleration and deceleration. Simulation is carried out as if The mounting head 330 includes only one suction nozzle 370 in this embodiment, and only one electronic circuit component 38 is mounted by one movement of the mounting head 330, and the electronic circuit component 38 is determined. The suction nozzle 370 can be moved with the target acceleration / deceleration set to the largest possible value within the range of the allowable acceleration / deceleration or less.
[0076]
The target acceleration / deceleration is set based on a target acceleration / deceleration setting routine shown in FIG. This routine is executed every time the suction nozzle 370 picks up the electronic circuit component 38, and is distributed to the second mounting system 6 in the mounting simulation, and the electronic circuit component 38 in which the mounting order and the like are set is It is performed on the assumption that they are mounted in the set mounting order. In S31, the allowable acceleration / deceleration determined for the sucked electronic circuit component 38 is read from the RAM. Next, S32 is executed, and target acceleration / deceleration is set. Also in the second mounting system 6, the acceleration / deceleration of the movement of the suction nozzle 370 can be changed stepwise. Therefore, the acceleration / deceleration that is equal to or less than the allowable acceleration / deceleration read out in S31 and is closest to the allowable acceleration / deceleration is set as the target acceleration / deceleration.
[0077]
As a result of the mounting simulation, the host computer 182 determines the electronic circuit components 38 to be mounted in the first and second mounting systems 4 and 6, respectively, the mounting order, the arrangement of the electronic circuit components 38 in the component supply device, and the like. The mounting program is created, supplied to the first and second mounting systems 4 and 6, and stored in the RAMs 164 and 404 of the computers 166 and 410. At this time, necessary data such as component information, allowable acceleration / deceleration of the printed wiring board 52 and allowable acceleration / deceleration of the suction nozzle 370 are also supplied and stored. These mounting programs are executed by the mounting control program in each of the systems 4 and 6, and the electronic circuit component 38 is mounted on the printed wiring board 52.
[0078]
In the first mounting system 4, the electronic circuit component 38 is mounted on the printed wiring board 52 as described above. At this time, the movement of the printed wiring board 52 is controlled according to the wiring board movement control routine shown in FIG. The The wiring board movement control routine is executed every time one electronic circuit component 38 is mounted on the printed wiring board 52. Since S41 to S43 of this routine are executed in the same manner as S11 to S13 of the target setting acceleration / deceleration setting routine of the printed wiring board, description thereof will be omitted. However, in S 41, the allowable acceleration / deceleration determined for the latest electronic circuit component 38 mounted on the printed wiring board 52 is read from the RAM 164. Further, the set target acceleration / deceleration is stored in the RAM 164.
[0079]
If the target acceleration / deceleration is set, S44 is executed, and after the electronic circuit component 38 is mounted by the component mounting apparatus 22, the printed wiring board 52 is mounted on the next component mounting position. , The XY moving device 24 moves the printed wiring board 52 according to the set target acceleration / deceleration. The X-axis slide moving device 86 and the Y-axis slide moving device 90 start and stop moving the X-axis slide 74 and the Y-axis slide 82 with the set target acceleration and deceleration, respectively.
[0080]
In the present embodiment, the target acceleration / deceleration is the minimum acceleration among the allowable acceleration / deceleration of the plurality of electronic circuit components 38 temporarily fixed to the mounting surface 54, and the acceleration / deceleration below the deceleration. An electronic circuit component that is installed in the printed wiring board 52 before the allowable acceleration / deceleration of the latest electronic circuit component mounted on the printed wiring board 52 is as large as possible. Even if it is smaller than the allowable acceleration / deceleration, the printed circuit board 52 can be moved as quickly as possible without causing the displacement of the electronic circuit component 38 and the like. The mounting order of the electronic circuit components 38 is set as one of the conditions that the electronic circuit components 38 having a large allowable acceleration and deceleration are mounted first, and the electronic circuit components 38 mounted on the printed wiring board 52 are set. The minimum acceleration / deceleration of the allowable acceleration / deceleration is initially large and gradually decreased. Therefore, although the printed circuit board 52 can be moved at a large acceleration / deceleration as in the case where the electronic circuit component 38 having a small allowable acceleration / deceleration is mounted first, the acceleration / deceleration is small. As compared with the case where the electronic circuit component 38 is generated, the printed wiring board 52 can be quickly moved while preventing the occurrence of the positional deviation of the electronic circuit component 38 and the electronic circuit to the printed wiring board 52 in the first mounting system 4. The time required for mounting the component 38 is made as short as possible.
[0081]
The printed wiring board 52 carried into the solder application system 2 from the board carrying-in device 12 is not temporarily fixed with the electronic circuit components 38 on both the front and back surfaces, and the printed wiring board 52 is obtained by, for example, the board carrying-in device 12. It can be carried into the solder application system 2 with the maximum acceleration / deceleration possible. The same applies to the printed wiring board 52 carried into the first mounting system 4 from the solder application system 2, and the printed wiring board 52 is first mounted at the maximum acceleration / deceleration that can be obtained by the board transfer device 10, for example. Can be carried into the system 4.
[0082]
The printed wiring board 52 on which the electronic circuit components 38 have been mounted in the first mounting system 4 has an acceleration / deceleration that does not cause misalignment of all the electronic circuit components 38 temporarily fixed to the printed wiring board 52, for example, When the last electronic circuit component 38 is mounted, it is moved at the target acceleration / deceleration obtained by executing the wiring board movement control routine, and is transferred from the printed wiring board holding device 50 to the board conveying device of the first mounting system 4. From the substrate transfer device, the substrate is transferred to the substrate transfer device 10 and transferred to the second mounting system 6. The wiring board transport device 302 of the second mounting system 6 also has an acceleration / deceleration at which the electronic circuit component 38 mounted on the mounting surface 54 is not displaced and has the same acceleration / deceleration as the substrate transport device 10, for example. The printed wiring board 52 is conveyed to the component mounting position.
[0083]
Thus, when the printed wiring board 52 is moved at the set target acceleration / deceleration, the rotational speed of the camshaft, which is the input shaft of the intermittent rotation device 132, matches the target acceleration / deceleration of the printed wiring board 52. The size is controlled. For example, if the maximum rotation speed obtained by the cam shaft is 100%, the cam is continuously rotated at a speed of 100% when the acceleration / deceleration of the printed wiring board 52 is large. On the other hand, when the acceleration / deceleration of the printed wiring board 52 is small, the rotational speed of the cam is decreased from 100% to a speed smaller than 100%, for example, 70% during one rotation. , It is returned to 100% again. The rotation speed of the cam may be 0%, and the suction nozzle 370 may stop and wait for the component mounting point of the printed wiring board 52 to reach the component mounting position.
[0084]
Each of the plurality of mounting heads 100 held by the intermittent rotating disk 120 includes a plurality of different types of suction nozzles 170, and these suction nozzles 170 are selectively used. The suction surface 156 is sucked by the suction nozzle 150 having a large area. Therefore, the suction nozzle 150 can obtain a suction force large enough to hold the electronic circuit component 38, and the acceleration / deceleration allowed for the suction nozzle 170 is set for each of the electronic circuit components 38. Thus, even if the acceleration / deceleration of the rotation of the cam is not controlled, the electronic circuit component 38 does not shift with respect to the suction pipe 154 during the turning.
[0085]
When the electronic circuit component 38 is mounted on the printed wiring board 52, the electronic circuit component 38 is not always mounted in the set mounting order. For example, when the suction nozzle 150 fails to receive the electronic circuit component 38 from the component supply device 20, the suction nozzle 150 receives the electronic circuit component 38 from the component supply device 20, but the holding posture error is deviated so that it cannot be corrected. When the printed circuit board 52 cannot be mounted, or when the received electronic circuit component 38 is of the wrong type, the electronic circuit of the same type as the electronic circuit component 38 that has not been mounted on the printed circuit board due to these disadvantages. This is because the component 38 may be mounted on the printed wiring board 52 later. Even if the mounting order changes in this way, the target acceleration / deceleration of the printed wiring board 52 is set every time one electronic circuit component 38 is mounted, so the printed wiring board 52 is mounted on the mounted electronic circuit component. Thus, the electronic circuit component 38 can be prevented from being misaligned.
[0086]
In the second mounting system 6, when the electronic circuit component 38 is mounted on the printed wiring board 52, the movement of the suction nozzle 370 is controlled according to the suction nozzle movement control routine shown in FIG. Since S51 and S52 of this routine are executed in the same manner as S31 and S32 of the target acceleration / deceleration setting routine of the suction nozzle, description thereof will be omitted. However, the allowable acceleration / deceleration of the suction nozzle 370 is read from the RAM 404 based on the type of the electronic circuit component 38, and the target acceleration / deceleration is stored in the RAM 404.
[0087]
After setting the target acceleration / deceleration, S53 is executed, and the XY robot 334 is controlled with the target acceleration / deceleration set in S52, and the X-axis slide 340 and Y-axis slide 344 are added with the target acceleration / deceleration. , The suction nozzle 370 starts moving and is stopped. The target acceleration / deceleration is set based on the allowable acceleration / deceleration of the suction nozzle 370 set to a size corresponding to the instability coefficient. The target acceleration / deceleration is set to a size corresponding to the instability coefficient. Is moved with a larger acceleration / deceleration as the mass and height of the electronic circuit component 38 are larger and as the area of the suction surface 376 is larger. Therefore, the electronic circuit component 38 is transported and mounted on the printed wiring board 52 in as short a time as possible without causing positional displacement or dropping with respect to the suction nozzle 370.
[0088]
The printed wiring board 52 on which the electronic circuit component 38 has been mounted in the second mounting system 6 is transported to the substrate transport apparatus 10 by the wiring board transport apparatus 302 and sent to the reflow furnace system 8. This transport (including the transport of the printed wiring board 52 after the mounting of the electronic circuit component 38 in the second mounting system 6) is permitted for all the printed circuit boards 52 mounted on the mounting surface 54. Of the allowable acceleration / deceleration to be performed, the minimum allowable acceleration / target acceleration / deceleration below the deceleration is performed, and the occurrence of misalignment of the electronic circuit component 38 is satisfactorily prevented. The electronic circuit component 38 is electrically joined to the printed wiring board 52 by heating in the reflow furnace system 8. The acceleration / deceleration during conveyance from the reflow furnace system 8 to the printed circuit board 52 to the substrate carry-out device 14 may be the same as when the printed circuit board 52 is carried into the reflow furnace system 8, and the electronic circuit component 38. You may enlarge according to the fixing condition.
[0089]
The allowable acceleration / deceleration of the circuit board may be determined in consideration of the circumference of the bottom surface of the electronic circuit component.
In a state where the electronic circuit component 38 is temporarily fixed to the printed wiring 52 which is a kind of circuit board, the temporary fixing agent 500 such as solder is applied to the bottom surface of the electronic circuit component 38 and the printed wiring board 52 as shown in FIG. Often protrudes from the gap between the surface. When this protrusion is present, the holding force of the electronic circuit component 38 by the printed wiring board 52 is greater than when there is no protrusion. The temporary fixing agent 500 present in the corner of the space formed by the side surface 502 of the electronic circuit component 38 and the mounting surface 54 which is the surface of the printed wiring board 52 serves to connect the side surface 502 and the mounting surface 54. It is. The amount of increase in holding force for this purpose varies depending on the amount of protrusion of the temporary fixing agent 500, but is generally determined by the peripheral length 2 · (P + Q) of the bottom surface of the electronic circuit component 38. Therefore, when obtaining the instability coefficient of the electronic circuit component 38, it is desirable to consider the circumference of the bottom surface of the electronic circuit component 38. When the shape of the bottom surface of the electronic circuit component 38 is close to a square or a circle, the relationship between the bottom area and the peripheral length of the bottom surface is determined almost uniquely, so in particular, only the bottom area is considered without considering the peripheral length. However, when the shape of the bottom surface of the electronic circuit component 38 is variously different, it is desirable to consider the circumferential length separately from the bottom area. For example, the instability coefficient K_EIs expressed by equation (3).
K_E= (M^a・ H^b) / {S_E ^c + [2 ・ (P + Q)]^g} (3)
[0090]
However, when the bottom shape of the electronic circuit component 38 is such that the long side length R and the short side length T are significantly different from each other, as shown in FIG. Since the ease of overturning of the electronic circuit component 38 differs significantly between the case where it is moved in a direction parallel to the short side and the case where it is moved in a direction parallel to the short side, instability coefficients are obtained in the above two directions, respectively. It is desirable to do.
[0091]
The allowable acceleration / deceleration of the component suction tool may be determined in consideration of the shape of the suction surface.
When the shape of the suction surfaces 156 and 376 of the suction nozzles 150 and 370 as the component suction tool is a circle, it is not necessary to consider the shape of the suction surfaces 156 and 376, but the shape is significantly different from the circle. For example, as shown in FIG. 20, it is desirable to consider the shape of the suction surfaces 156 and 376 in the case of a rectangle in which the length of the long side is significantly different from the length of the short side. When the moving direction of the suction nozzles 150 and 370 is determined by the relationship with the shape of the suction surfaces 156 and 376, the instability coefficient is acquired for each of the direction parallel to the long side and the direction parallel to the short side. It is desirable to select and use one according to the moving direction, but when the moving direction is not constant, it is safe to use an instability coefficient in a direction parallel to the short side. When the moving direction of the suction nozzles 150 and 370 is not constant, the instability corrected by multiplying the instability coefficient acquired by the above-described method by what should be called the shape factor determined by the shape of the suction surfaces 156 and 376, etc. Coefficients can also be used. The shape factor decreases as the shape of the suction surfaces 156 and 376 becomes elongated.
[0092]
In the above-described embodiment, in the index table type electronic circuit component mounting system, the rotational speed of the cam constituting the intermittent rotation device of the component mounting device can be changed according to the target acceleration / deceleration of the printed wiring board. The movement of the suction nozzle held by the head to the component mounting position and the movement of the printed wiring board component mounting point to the position corresponding to the component mounting position were combined, but an XY type electronic circuit As in the component mounting system, the suction nozzle may be moved (turned) by setting a target acceleration / deceleration according to the type of electronic circuit component held.
[0093]
The intermittent rotating disk holds a plurality of mounting heads, and suction nozzles respectively held by the plurality of mounting heads located between the component receiving position and the component mounting position simultaneously suck and rotate the electronic circuit components. The types of electronic circuit components held by each of the plurality of suction nozzles are not necessarily the same. If the types of electronic circuit components that are simultaneously moved are different, the combination of the types of electronic circuit components and the types of suction nozzles. If the suction nozzle is swung with the minimum acceleration, acceleration below the deceleration, or deceleration of the allowable acceleration / deceleration set for each of the combinations (if the intermittent rotating disk is rotated), any electronic circuit The occurrence of misalignment with respect to the suction nozzle can also be prevented for the components.
[0094]
The allowable acceleration / deceleration of the suction nozzle is, for example, the same as the allowable acceleration / deceleration of the suction nozzle of the XY type electronic circuit component mounting system, and the mass and height of the electronic circuit component, the area of the suction surface of the suction nozzle, and It is determined by the magnitude of the negative pressure. Then, the minimum acceleration / deceleration of each allowable acceleration / deceleration of the suction nozzles holding the electronic circuit parts is acquired, and the target acceleration / deceleration of the intermittent rotating disk is below the minimum acceleration / deceleration Is set to the size of The target acceleration / deceleration is set for the printed wiring board in the same manner as in the above embodiment, the target acceleration / deceleration of the intermittent rotating disk is compared with the target acceleration / deceleration of the printed wiring board, and the time required for movement is compared. Both the target acceleration / deceleration are set according to the longer target acceleration / deceleration. Since the intermittent rotating disk is intermittently rotated by rotating the cam with a motor, the acceleration / deceleration is determined by the rotation speed of the cam, and the rotation speed of the cam is set so that the target acceleration / deceleration is obtained. The
[0095]
The target acceleration / deceleration of the circuit board and the target acceleration / deceleration of the component holder may be continuously changed.
[0096]
In an XY type component mounting system, a plurality of component suction tools may be moved simultaneously by an XY moving device, and a plurality of electronic circuit components may be simultaneously transported and mounted on a circuit board. For example, the component suction tools are arranged in a line parallel to the Y-axis direction on the Y-axis slide of the XY moving device. If the types of electronic circuit components held by multiple component suction tools are different, the acceleration / deceleration for moving the component suction tools is the minimum allowable acceleration / deceleration for each electronic circuit component. Acceleration / deceleration below acceleration / deceleration is set.
[0097]
When a plurality of electronic circuit components are simultaneously transported and mounted in an XY type component mounting system, it is desirable that the plurality of electronic circuit components have the same type, and even if the types are different, each allowable addition and reduction is reduced. It is desirable that the difference in speed is small. For this reason, the order of mounting the electronic circuit components on the circuit board is the same for the types of the plurality of electronic circuit components that are simultaneously conveyed by the movement of the plurality of component suction tools, or there is a difference in the magnitude of the allowable acceleration / deceleration. It is desirable to set it to be small.
[0098]
The allowable acceleration / deceleration of the circuit board and the allowable acceleration / deceleration of the component suction tool may be determined by the mounting system computer. The determined allowable acceleration / deceleration is transferred to the host computer and stored in a RAM backup unit or the like, and may be used later or in another mounting system, or a recording medium such as a magnetic recording medium, It may be stored in an external storage device.
[0099]
In an electronic circuit manufacturing line, it is not indispensable to perform a mounting simulation in order to distribute electronic circuit components to be mounted on a circuit board to a plurality of mounting systems. For example, if the types of electronic circuit components that can be mounted by a plurality of mounting systems are different, and there are no electronic circuit components that can be mounted in any of the mounting systems, the electronic circuit components may be classified into a plurality of mounting systems depending on the type. Sorted. Then, a mounting program is created for each mounting system, a mounting order, etc. is set and supplied to the mounting system. For example, the mounting program is created so that the mounting time is the shortest. Therefore, at least in the index table type mounting system, at least the allowable acceleration / deceleration of the circuit board is determined in order to set the mounting order. .
[0100]
In an index table type electronic circuit component mounting system, when an electronic circuit component is already mounted and temporarily fixed on the back side of the circuit board (the side opposite to the mounting surface), the target acceleration / deceleration of the circuit board is It is set in consideration of allowable acceleration / deceleration of electronic circuit parts mounted on the back surface. For example, the circuit board can be moved with a minimum allowable acceleration, an acceleration below the deceleration, and an acceleration / deceleration below the minimum allowable acceleration / deceleration of the plurality of electronic circuit components mounted on the back surface.
[0101]
Each allowable acceleration / deceleration of the circuit board and the component adsorbing tool may be determined by a computer other than the mounting system computer and not connected to the mounting system computer. In this case, the determined allowable acceleration / deceleration is recorded on a recording medium such as a magnetic tape, a magnetic disk, or a magneto-optical disk, and is read by the reading device of the mounting system computer.
[0102]
Programs and data used in the mounting system computer may be read from an external storage device.
[0103]
In the present invention, the component suction tool is moved in one of two directions orthogonal to each other in a plane parallel to the mounting surface of the circuit board, and the electronic circuit component is mounted on the circuit board by moving the circuit board in the other direction. It can also be applied to electronic circuit component mounting systems, circuit board movement control, and component suction tool movement control.
[0104]
As mentioned above, although some embodiment of this invention was described in detail, these are only illustrations and this invention was described in the above-mentioned section of [the subject which invention intends to solve, a problem-solving means, and an effect]. The present invention can be implemented in various forms including various modifications and improvements based on the knowledge of those skilled in the art.
[Brief description of the drawings]
FIG. 1 is a front view showing an electronic circuit manufacturing line including an electronic circuit component mounting system according to an embodiment of the present invention.
FIG. 2 is a plan view schematically showing an index table type electronic circuit component mounting system constituting the electronic circuit manufacturing line.
FIG. 3 is a side view (partial cross section) showing the index table type electronic circuit component mounting system.
FIG. 4 is a front view (partially cross-sectional view) showing a suction nozzle held by a mounting head of a component mounting apparatus of the index table type electronic circuit component mounting system.
FIG. 5 is a block diagram showing a portion deeply related to the present invention in the control device for controlling the index table type electronic circuit component mounting system.
FIG. 6 is a plan view schematically showing an XY-type electronic circuit component mounting system constituting the electronic circuit manufacturing line.
FIG. 7 is a side view showing the XY electronic circuit component mounting system.
FIG. 8 is a side view showing a component mounting apparatus of the XY type electronic circuit component mounting system.
FIG. 9 is a block diagram showing a portion deeply related to the present invention in the control device for controlling the XY type electronic circuit component mounting system.
FIG. 10 is a flowchart showing a routine for determining an allowable acceleration / deceleration of a printed wiring board stored in a memory of a host computer constituting the main body of the line control device of the electronic circuit manufacturing line.
FIG. 11 is a graph defining the relationship between the instability coefficient of an electronic circuit component and the allowable acceleration / deceleration of a printed wiring board.
FIG. 12 is a flowchart showing a target acceleration / deceleration setting routine for a printed wiring board stored in the memory of the host computer.
FIG. 13 is a flowchart showing a routine for determining the allowable acceleration / deceleration of the suction nozzle stored in the memory of the host computer.
FIG. 14 is a graph defining the relationship between the instability coefficient of electronic circuit components and the allowable acceleration / deceleration of the suction nozzle.
FIG. 15 is a flowchart showing a target acceleration / deceleration setting routine of the suction nozzle stored in the memory of the host computer.
FIG. 16 is a flowchart showing a wiring board movement control routine stored in a memory of a computer constituting the main body of the control device of the index table type electronic circuit component mounting system.
FIG. 17 is a flowchart showing a suction nozzle movement control routine stored in a memory of a computer constituting the main body of the control device of the XY type electronic circuit component mounting system.
FIG. 18 is a diagram showing an electronic circuit component for explaining determination of allowable acceleration / deceleration of a printed wiring board in an electronic circuit component mounting system according to another embodiment of the present invention.
FIG. 19 is a diagram showing another electronic circuit component for which allowable acceleration and deceleration are determined in the same manner as the electronic circuit component shown in FIG.
FIG. 20 is a diagram illustrating a suction surface of a suction nozzle for explaining determination of allowable acceleration / deceleration of a component suction tool in an electronic circuit component mounting system according to still another embodiment of the present invention.
[Explanation of symbols]
2, 4: Electronic circuit component mounting system 22: Component mounting device 24: XY moving device 28: First mounting system control device 38: Electronic circuit component 52: Printed wiring board 54: Mounting surface 166: Computer 306: Component mounting device 314 : Second mounting system control device 330: mounting head 334: XY robot 370: suction nozzle 374: suction tube 376: suction surface 500: temporary fixing agent

Claims (7)

Among the allowable acceleration / deceleration of each of the plurality of electronic circuit components that are already temporarily fixed to the circuit board, the circuit board on which the electronic circuit components are temporarily fixed by the adhesive force of the temporary fixing agent applied in a spot shape. A method of moving in a direction parallel to the surface of the circuit board with a target acceleration / deceleration below the minimum of
When the mass of each of the plurality of electronic circuit components is M, the height is H, the bottom area is S, and the exponents of power functions are a, b, and c, the allowable addition of each of the plurality of electronic circuit components is The circuit board movement control method is characterized in that the deceleration is a magnitude corresponding to the instability coefficient represented by (M ^a · H ^b ) / S ^c . The circuit board movement control method according to claim 1 , wherein the allowable acceleration / deceleration is increased as the tackiness of the temporary fixing agent is increased. The circuit board movement control method according to claim 1 , wherein the allowable acceleration / deceleration is increased as the circumference of the bottom surface of each electronic circuit component is increased. A method for controlling movement of a component suction tool that sucks an electronic circuit component by negative pressure on a suction surface in a direction parallel to the suction surface,
Each of the plurality of electronic circuit components is held when the mass is M, the height is H, the area of the suction surface of the component suction tool is S, and the indices are d, e, and f. A component adsorber movement control method, wherein the component adsorber is moved at an acceleration / deceleration having a magnitude corresponding to an instability coefficient represented by (M ^d · H ^e ) / S ^f . The component adsorber movement control method according to claim 4, wherein the acceleration / deceleration of the movement of the component adsorber is increased as the negative pressure increases. A computer is used to determine the allowable acceleration / deceleration when moving the circuit board on which the electronic circuit components are temporarily fixed by the adhesive force of the temporary application agent applied in a spot shape in the direction parallel to the surface of the circuit board. A program to be executed,
When the mass of the electronic circuit component is M, the height is H, the bottom area is S, and exponents of power functions are a, b, c, (M ^a ・ H ^b ) / S ^c An unstable coefficient acquisition step for acquiring the unstable coefficient represented by:
A permissible acceleration / deceleration determining step for determining the allowable acceleration / deceleration of the circuit board based on the acquired instability coefficient to be larger as the instability coefficient is smaller;
Circuit board allowable acceleration / deceleration determination program. A program executed by a computer to determine an allowable acceleration / deceleration of movement in a direction parallel to the suction surface of a component suction tool that sucks an electronic circuit component by negative pressure on the suction surface,
When the mass of each of the plurality of electronic circuit components is M, the height is H, the area of the suction surface of the component suction tool is S, and the indices are d, e, and f, M ^d ・ H ^e ) / S ^f An unstable coefficient acquisition step for acquiring the unstable coefficient represented by:
A permissible acceleration / deceleration determining step for determining the permissible acceleration / deceleration of the component suction tool as the instability coefficient is smaller based on the acquired instability coefficient;
Allowable acceleration / deceleration determination program for parts suction tool including

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