JP4155091B2 - Heat dissipation device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device suitable for heat dissipation of a high-power laser diode array.
[0002]
[Prior art]
The heat generation density of the high-power laser diode array is as high as several tens to several hundreds W / cm ² . However, the laser diode array has a small bottom surface of about 10 mm × 1 to 1.5 mm, and an air-cooling type heat dissipation device cannot expect sufficient heat dissipation.
[0003]
Therefore, as a device for radiating heat from the laser diode array, as shown in FIG. 8, the upper heat receiving body 1, the middle heat receiving body 2 and the lower heat receiving body 3 are sequentially laminated and joined to the upper surface 1 a of the upper heat receiving body 1. A water-cooled type is used in which a laser diode array LD is installed and a coolant is appropriately passed between the heat receiving members 1, 2, and 3. These heat receiving bodies 1, 2, and 3 are flat members made of a metal having a large thermal conductivity such as copper. Refrigerant voids 4 and 5 are provided on the joint surface of the upper heat receiver 1 with the middle heat receiver 2 and the joint surface of the lower heat receiver 3 with the middle heat receiver 2, respectively. At one end edge, there is provided a communication passage 6 that allows the refrigerant cavities 4 and 5 to communicate with each other.
[0004]
In this heat radiating device, if the coolant is supplied to one of the refrigerant cavities 5, this coolant will sequentially pass through the communication passage 6 and the other refrigerant vacant space 4, and is installed on the upper surface 1a of the upper heat receiving body 1. The laser diode array LD thus made can be cooled (see, for example, Patent Document 1).
[0005]
[Patent Document 1]
International Application Publication No. 00/11922 Pamphlet [0006]
[Problems to be solved by the invention]
In the heat radiating device as described above, in order to reduce the pressure loss of the coolant, the refrigerant space 4 of the upper heat receiver 1 is formed as large as possible, that is, the upper wall of the upper heat receiver 1 is configured as thin as possible. preferable.
[0007]
However, when the upper wall of the upper heat receiving member 1 is made thin, the thermal resistance along the surface direction (left and right direction in FIG. 8) increases. As a result, the heat transferred from the laser diode array LD to the upper heat receiving body 1 does not reach a wide area, but is only exchanged with the cooling liquid in the vicinity of the heat exchanger, and there is a problem in terms of heat radiation efficiency.
[0008]
Of course, if the upper wall of the upper heat receiving member 1 is made thick, the heat transferred from the laser diode array LD to the upper heat receiving member 1 becomes wide, which is advantageous in terms of heat exchange with the coolant. However, as described above, when the upper wall of the upper heat receiving member 1 is made thick, the refrigerant space 4 becomes narrower by that amount, so that the heat radiation efficiency can be improved in terms of the pressure loss of the coolant. It becomes difficult.
[0009]
An object of this invention is to provide the thermal radiation apparatus which can aim at the improvement of the thermal radiation efficiency in view of the said situation.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, a heat dissipation device according to claim 1 of the present invention has a first heat receiving body having a heat receiving surface on one surface, and has one surface opposed to the other surface of the first heat receiving body. And a second heat receiving body that constitutes a refrigerant supply space between the first heat receiving body and the cooling liquid is allowed to pass through the refrigerant supply space, and is installed on the heat receiving surface. in heat radiator that performs heat radiation of the heating element, constituting the refrigerant supply cavity to the site over the one edge portion corresponding to the installation location of the heat generating element from said one surface to Oite central portion of the second heat receiving member In addition, a third heat receiving body is laminated and joined to the other surface of the second heat receiving body, and further formed at a central portion of the third heat receiving body for introducing a coolant into the refrigerant supply space. Between the introduction port and the second heat receiving body and the third heat receiving body, A refrigerant discharge space having a cooling liquid outlet in a portion located on the other edge side of the introduction port in the third heat receiving member, and one of the second heat receiving members. A communication passage that is formed at the edge of the refrigerant and passes through the refrigerant supply space to send the coolant to the refrigerant discharge space, and the other edge side of the second heat receiving body from the refrigerant supply space And a communication space for bringing the coolant passing through the refrigerant discharge space into contact with the other surface of the first heat receiving body .
[0011]
According to claim 2 of the present invention, in the heat dissipation device according to claim 1 described above, the refrigerant supply space between the first heat receiving body and the second heat receiving body is formed only in the second heat receiving body. It is characterized by.
[0012]
According to a third aspect of the present invention, there is provided the heat dissipating device according to the first aspect , wherein the refrigerant is supplied from a portion corresponding to an installation location of the heating element to a portion facing the introduction port in the refrigerant supply space. A plurality of radiating fins are extended along the outer shape of the void .
[0013]
According to a fourth aspect of the present invention, there is provided a heat radiating device according to the first or third aspect, wherein a plurality of auxiliary heat radiating fins are directed to the outlet along the outer shape of the communication space. It is characterized by extending .
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Exemplary embodiments of a heat dissipation device according to the present invention will be described below in detail with reference to the accompanying drawings.
[0016]
(Embodiment 1)
FIG. 1 shows a heat radiating device according to Embodiment 1 of the present invention. The heat radiating device exemplified here is for radiating heat by using the high-power laser diode array LD as a heat generating body, and an upper heat receiving body (first heat receiving body) 10 and a middle heat receiving body (second heat receiving body) which are laminated and joined to each other. ) 20 and a lower heat receiving body (third heat receiving body) 30. These heat receiving bodies 10, 20, and 30 are all configured in a rectangular flat plate shape with a metal having good thermal conductivity, such as copper, copper-tungsten, and aluminum. As a specific example, when a rectangular laser diode array LD having a length of 10 mm, a width of 1 to 1.5 mm, and a height of 0.1 to 0.2 mm is used as a heat generating object, the length is 11 mm. * The heat receiving bodies 10, 20, and 30 having the dimensions of 20 mm in width and 1 mm in height are applied (total height is 3 mm in three layers).
[0017]
The upper heat receiving member 10 has a heat receiving surface 10a on one upper surface (upper surface in FIG. 1), and the installation location of the laser diode array LD is set at one end edge of the heat receiving surface 10a. As shown in FIG. 2, it is applied as a rectangular flat plate having a uniform thickness over its entire length without any processing on any surface.
[0018]
The middle heat receiving body 20 is laminated and joined to the other surface (the lower surface in FIG. 1) located below the upper heat receiving body 10, and as shown in FIGS. 3 and 4, the refrigerant supply recess 21 is introduced. A communication port 22, a communication passage 23 and a communication space 24 are provided.
[0019]
The coolant supply recess 21 is a recess opened on one surface (the upper surface in FIG. 1) of the intermediate heat receiving body 20, and extends from a substantially central portion of the intermediate heat receiving body 20 to a place where the laser diode array LD is installed. It is provided in the part over the corresponding one end edge part. As is clear from FIG. 3, the coolant supply recess 21 gradually increases in width toward the one end edge at the center of the intermediate heat receiving body 20, and is uniform at one end edge of the intermediate heat receiving body 20. It is formed to have a wide width. As shown in FIG. 1, the depth of the coolant supply recess 21 is uniform over the entire region, and is set so that the pressure loss when passing the coolant is minimized. Specifically, the desired wall strength is ensured and the bottom wall of the coolant supply recess 21 is made as thin as possible. The refrigerant supply recess 21 is surrounded by a continuous wall portion having the same height. When the intermediate heat receiving body 20 is laminated and joined to the other surface of the upper heat receiving body 10, the wall supply portion 21 is surrounded by the wall portion. The upper opening is closed and a refrigerant supply space 25 is defined between the upper heat receiving body 10 and the upper heat receiving body 10.
[0020]
The introduction communication port 22 is a circular hole penetrating along the plate thickness direction in a portion that is substantially the center of the middle heat receiving body 20 inside the refrigerant supply recess 21. In the first embodiment, the introduction communication port 22 has an inner diameter that is approximately 1/3 of the width of the intermediate heat receiving body 20.
[0021]
The communication passage 23 is a circular hole that penetrates the one end edge of the intermediate heat receiving body 20 along the plate thickness direction inside the refrigerant supply recess 21, and is located at a position corresponding to the installation location of the laser diode array LD. A plurality of the heat receiving bodies 20 are juxtaposed along the width direction. Each communication passage 23 has the same inner diameter, and in the first embodiment, the communication passage 23 is formed with a sufficiently smaller diameter than the introduction communication port 22.
[0022]
The communication space 24 is a through hole provided along the plate thickness direction at a portion located on the other end edge side of the coolant supply recess 21 across the wall portion. This communication space 24 gradually increases in width toward the one end edge side on the other end edge side of the intermediate heat receiving body 20, and is equal in width to the refrigerant supply recess 21 in the central part of the intermediate heat receiving body 20. It is formed so that However, the portion adjacent to the coolant supply recess 21 in the communication space 24 has a shape recessed toward the other end edge of the intermediate heat receiving body 20 so as to avoid the coolant supply space 25. .
[0023]
Further, the middle heat receiving body 20 is provided with a plurality of heat radiation fins 26 inside the refrigerant supply recess 21. These radiating fins 26 extend in parallel from the portions on both sides of each communication passage 23 toward the other end edge side of the intermediate heat receiving body 20, and correspond to the installation locations of the laser diode array LD. It is formed at the site. Each radiating fin 26 has the same height as the wall portion surrounding the refrigerant supply space 25, and when the middle heat receiving body 20 is stacked on the other surface of the upper heat receiving body 10, It is possible to join to the other surface.
[0024]
The lower heat receiving body 30 is laminated and joined to the other surface (lower surface in FIG. 1) located below the middle heat receiving body 20, and as shown in FIG. 4, the refrigerant discharge recess 31, the boss portion 32, and The outlet 33 is provided.
[0025]
The refrigerant discharge recess 31 is a recess opened on one surface (upper surface in FIG. 1) of the lower heat receiving body 30, and corresponds to the refrigerant supply recess 21 and the communication space 24 formed in the intermediate heat receiving body 20. It is formed over the part. The depth of the refrigerant discharge recess 31 is uniform over the entire area, like the refrigerant supply recess 21. The refrigerant discharge recess 31 is surrounded by a continuous wall portion having the same height, and when the lower heat receiving body 30 is laminated and joined to the other surface of the intermediate heat receiving body 20, the wall portion The upper opening is closed, and a refrigerant discharge space 34 is defined between the upper heat receiving body 20 and the intermediate heat receiving body 20.
[0026]
The boss portion 32 is a columnar portion provided in a portion corresponding to the introduction communication port 22 of the intermediate heat receiving body 20 in the refrigerant discharge recess 31 with an outer diameter larger than the inner diameter of the introduction communication port 22. The boss portion 32 has the same height as the wall portion surrounding the refrigerant discharge recess 31, and when the lower heat receiving body 30 is laminated on the other surface of the intermediate heat receiving body 20, It is possible to join to the other surface.
[0027]
The boss portion 32 is provided with an introduction port 32a at the axial center position along the plate thickness direction of the lower heat receiving body 30, and a distribution guide portion 32b is provided on the outer peripheral surface located on one end edge side. is there. The introduction port 32 a is a circular through-hole formed in the portion corresponding to the introduction communication port 22 of the intermediate heat receiving body 20 with the same inner diameter as the introduction communication port 22. The distribution guide portion 32b protrudes from the outer peripheral surface of the boss portion 32 toward the one end edge portion side of the lower heat receiving body 30 so as to gradually decrease in width, and is arranged at one end edge of the lower heat receiving body 30 inside the refrigerant discharge recess 31. When the fluid passes from the part side toward the other end edge part side, it is a part for guiding the fluid to be distributed left and right.
[0028]
The lead-out port 33 is a circular hole penetrating along the plate thickness direction in a portion corresponding to the communication space 24 of the intermediate heat receiving body 20 inside the refrigerant discharge recess 31. In the first embodiment, a lead-out port 33 having substantially the same inner diameter as the introduction port 32a is provided.
[0029]
The lower heat receiving body 30 is provided with a plurality of sub-radiating fins 35 inside the refrigerant discharge recess 31. These auxiliary heat radiating fins 35 are provided at portions corresponding to the heat radiating fins 26 provided in the intermediate heat receiving body 20 so as to have the same thickness and the same pitch. Each sub-radiating fin 35 has the same height as the wall portion surrounding the refrigerant discharge space 34, and when the lower heat receiving body 30 is stacked on the other surface of the middle heat receiving body 20, the intermediate heat receiving body 20. It is possible to join to the other surface.
[0030]
In addition, the refrigerant supply recess 21, the introduction communication port 22, the communication passage 23, the communication space 24 and the radiation fin 26 of the middle heat receiving body 20 described above, the refrigerant discharge recess 31, the boss portion 32 of the lower heat receiving body 30, The outlet 33 and the sub-radiating fin 35 are configured by, for example, subjecting the heat receiving bodies 20 and 30 to chemical processing such as etching or machining such as cutting or grinding.
[0031]
The upper heat receiving body 10, the middle heat receiving body 20, and the lower heat receiving body 30 having the above-described configuration are mechanically and thermally bonded by applying an appropriate bonding method such as soldering or welding and laminating and bonding to each other. The heat radiating device is configured in a state of being connected to each other.
[0032]
When the laser diode array LD is radiated by applying this heat radiating device, the laser diode array LD is joined to an installation location provided in the upper heat receiving body 10 and the lower heat receiving body 30 is passed through the coolant supply pipe 40 from this state. A cooling liquid such as cooling water is sequentially supplied to the inlet 32a.
[0033]
After the coolant supplied to the inlet 32 a of the lower heat receiving body 30 is introduced into the refrigerant supply space 25 through the introduction communication port 22 of the middle heat receiving body 20, and appropriately passes in a state where the refrigerant supply space 25 is filled. The refrigerant discharge space 34 is reached through the communication passage 23. The coolant that has reached the coolant discharge space 34 is divided into two at the boss portion 32, and then merges again at the communication space 24, and is finally discharged to the outside through the outlet 33 and the coolant discharge pipe 41. Note that the coolant discharged to the outside may be appropriately cooled and then supplied to the refrigerant supply space 25 again through the inlet 32a.
[0034]
During this time, the heat generated when the laser diode array LD is driven is transmitted to the upper heat receiving body 10 and then sequentially transmitted to the coolant passing through the refrigerant supply space 25 through the radiation fins 26.
[0035]
Here, according to the heat radiating device, the upper heat receiving body 10 is configured to have a uniform plate thickness without any processing, and the refrigerant supply recess 21 is formed only in the middle heat receiving body 20, and the refrigerant supply recess is formed. Since the coolant supply space 25 for allowing the coolant to pass between the location 21 and the upper heat receiving body 10 is defined, the surface of the upper heat receiving body 10 when compared with a heat radiating device having the same external dimensions It becomes possible to reduce the pressure loss of the coolant as much as possible without increasing the thermal resistance along the direction. That is, it is possible to reduce the thermal resistance and the pressure loss of the coolant along the surface direction of the upper heat receiving body 10 without causing an increase in the outer dimensions.
[0036]
Therefore, after the heat generated in the laser diode array LD is transferred to the upper heat receiving body 10, the heat spreads smoothly and widely along the surface direction, and the coolant supply space is also provided in a portion other than the portion corresponding to the radiation fin 26. Heat exchange is performed with the coolant passing through 25. As a result, heat can be efficiently radiated from the laser diode array LD, and even when the laser output is increased, the laser output and transmission wavelength are stabilized, the output efficiency is improved, and the element life is improved. Longer, and so on.
[0037]
In addition, since the pressure loss of the coolant in the coolant supply recess 21 can be reduced, a very small drive device such as a pump for supplying or circulating the coolant may be used. This is very advantageous in terms of cost and cost.
[0038]
Further, according to the heat dissipation device, since the communication space 24 is provided in the middle heat receiving body 20, the coolant that has reached the refrigerant discharge space 34 via the communication passage 23 is again in the communication space 24. 10 will come into contact with the other surface. Therefore, the heat transferred from the laser diode array LD to the upper heat receiving body 10 is exchanged with the coolant at the portion corresponding to the communication space 24, and the above-described effect becomes more remarkable. Become.
[0039]
(Embodiment 2)
FIG. 5 shows a heat dissipation device according to the second embodiment of the present invention. The heat dissipating device exemplified here is for dissipating heat using the high-power laser diode array LD as a heating element, similar to the heat dissipating device shown in the first embodiment, and is different from the heat dissipating device of the first embodiment. Only the configuration of the heat receiving body (second heat receiving body) is different.
[0040]
That is, in the heat radiating device of the second embodiment, the plurality of heat radiating fins 126 provided in the refrigerant supply recess 121 in the intermediate heat receiving body 120 are extended, and the plurality of auxiliary heat radiating fins 127 are also provided in the communication space 124. Is provided.
[0041]
As shown in FIGS. 6 and 7, the radiating fins 126 of the refrigerant supply recess 121 ensure the same distance between each other and are connected to the introduction communication port 122 in a form along the outer shape of the refrigerant supply recess 121. It is extended toward. These heat radiation fins 126 can be joined to the other surface of the upper heat receiving body 10 when the middle heat receiving body 120 is laminated on the other surface of the upper heat receiving body 10.
[0042]
The auxiliary heat radiating fin 127 secures a constant space between the coolant supply recess 121 and the communication space 124 from the wall portion separating the refrigerant supply recess 121 and the communication space 124, and follows the outer shape of the communication space 124. It extends toward 30 outlets 33. These auxiliary radiating fins 127 can also be joined to the other surface of the upper heat receiving body 10 when the middle heat receiving body 120 is laminated on the other surface of the upper heat receiving body 10.
[0043]
Since other configurations are the same as those in the first embodiment, the same reference numerals are given and detailed descriptions thereof are omitted.
[0044]
Also in this heat radiating device, the laser diode array LD is joined to the installation location provided in the upper heat receiving body 10, and from this state, a cooling liquid, for example, cooling water is sequentially supplied to the inlet 32 a of the lower heat receiving body 30 through the cooling liquid supply pipe 40. If supplied, it is possible to dissipate heat from the laser diode array LD.
[0045]
Here, according to the heat radiating device, the upper heat receiving body 10 is configured to have a uniform plate thickness without any processing, and the refrigerant supply recess 121 is formed only in the intermediate heat receiving body 120, and this refrigerant supply recess is formed. Since the coolant supply space 125 for allowing the coolant to pass between the location 121 and the upper heat receiving body 10 is defined, the thermal resistance along the surface direction of the upper heat receiving body 10 is not increased. It becomes possible to reduce the pressure loss of the coolant as much as possible. Moreover, in the refrigerant supply space 125, the heat dissipating fins 126 are extended to increase the contact area with the coolant.
[0046]
Therefore, after the heat generated in the laser diode array LD is transferred to the upper heat receiving body 10, the heat spreads smoothly along the surface direction and passes through the refrigerant supply space 125 through the extended radiating fins 126. Heat exchange with the coolant is performed more efficiently. In this case, it is the same as in the first embodiment that it is not necessary to increase the external dimensions of the heat dissipation device.
[0047]
Further, according to the above heat radiating device, since the communication space 124 having the auxiliary heat radiation fins 127 is provided in the intermediate heat receiving body 120, the communication heat space is increased by the effect of increasing the contact area with the coolant by the auxiliary heat radiation fins 127. In 124, heat exchange is performed more efficiently between the coolant that again comes into contact with the other surface of the upper heat receiving body 10 and the heat transmitted to the portion corresponding to the communication space 124.
[0048]
As a result, even when the laser output is increased, the laser output and the transmission wavelength are stabilized, the output efficiency is improved, the element life is extended, and the effects of applying the heat dissipation device of the first embodiment are applied. It becomes even more prominent than.
[0049]
In the first and second embodiments described above, the apparatus for radiating the heat from the laser diode array LD is exemplified, but the present invention can also be applied to a device for radiating heat from other heating elements. .
[0050]
In the first and second embodiments described above, the recesses 21 and 121 for forming the refrigerant supply spaces 25 and 125 are provided only in the second heat receiving bodies 20 and 120, respectively. The heat receiving body 10 may be provided with a recess. In this case, when considering the thermal resistance along the surface direction, it goes without saying that the recess provided in the first heat receiving body 10 is preferably as small as possible.
[0051]
Furthermore, in Embodiments 1 and 2 described above, the third heat receiving body 30 is laminated and joined to the second heat receiving bodies 20 and 120, the refrigerant discharge space 34 is provided between these heat receiving bodies, and the second The heat receiving bodies 20 and 120 are provided with a communication passage 23 communicating between the refrigerant supply cavities 25 and 125 and the refrigerant discharge cavities 34, and the coolant supplied to the refrigerant supply cavities 25 and 125 is supplied to the refrigerant discharge cavities 34. However, the third heat receiving body 30 and the communication passage 23 are not necessarily provided if the communication spaces 24 and 124 described above are not provided.
[0052]
【The invention's effect】
As described above, according to the heat radiating device of the present invention, a recess for forming at least a part of the refrigerant supply space is formed on one surface of the second heat receiving body. It becomes possible to reduce the pressure loss of the coolant as much as possible without increasing the thermal resistance along the surface direction of the first heat receiver . Furthermore, if the refrigerant supply space is formed only in the second heat receiving body as in the heat dissipation device according to the present invention, the thermal resistance along the surface direction of the first heat receiving body and the pressure loss of the coolant are further reduced. Therefore, after the heat from the heating element is transferred to the first heat receiving body , the heat spreads smoothly and widely along the surface direction, and heat exchange is efficiently performed with the coolant passing through the refrigerant supply space. Therefore, it is possible to improve the heat dissipation efficiency. In particular, when applied to a laser diode array, even when the laser output is increased, the laser output and the transmission wavelength are stabilized, the output efficiency is improved, the element life is increased, and the like. It becomes like this.
[0053]
Moreover, according to the heat radiating device according to the present invention, the third heat receiving body is laminated and joined to the other surface of the second heat receiving body, and the refrigerant supply space is provided between the second heat receiving body and the third heat receiving body. A coolant discharge space for deriving the coolant is formed, and a communication space is provided in the second heat receiving body so that the coolant passing through the coolant discharge space is brought into contact with the first heat receiving body . Therefore, the heat transferred from the heating element to the first heat receiving body is heat exchanged with the cooling liquid even at the portion corresponding to the communication space, and the heat radiation efficiency is further improved.
[0054]
Further, according to the heat dissipating device of the present invention, a plurality of heat dissipating fins along the outer shape of the refrigerant supply cavity from the part corresponding to the installation location of the heating element to the introduction port inside the refrigerant supply cavity. Further, according to the heat dissipating device according to the present invention, a plurality of auxiliary heat dissipating fins extending toward the outlet along the outer shape of the communicating space are extended inside the communicating space. In any case, the contact area with the coolant increases in any case, and the above-described effects become more remarkable.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a heat dissipation device according to Embodiment 1 of the present invention.
FIG. 2 is a view taken along the line II-II in FIG.
3A is a view taken along the line IIIa-IIIa in FIG. 1, and FIG. 3B is a view taken along the line IIIb-IIIb in FIG.
4A is a view taken along line IVa-IVa in FIG. 1, and FIG. 4B is a view taken along line IVb-IVb in FIG.
FIG. 5 is an arrow view showing a heat dissipation device according to a second embodiment of the present invention.
6 is a view taken along the line VI-VI in FIG. 5;
7A is a view taken along line VIIa-VIIa in FIG. 5, and FIG. 7B is a view taken along line VIIb-VIIb in FIG.
FIG. 8 is a cross-sectional view showing a conventional heat dissipation device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Upper heat receiving body 10a Heat receiving surface 20 Middle heat receiving body 21 Refrigerant supply recess 22 Introduction communication port 23 Communication passage 24 Communication space 25 Refrigerant supply space 26 Radiation fin 30 Lower heat receiving body 31 Refrigerant discharge recess 32 Boss part 32a Introduction port 32 b Distribution guide 33 Deriving port 34 Refrigerant discharge space 35 Sub-radiating fin 40 Coolant supply pipe 41 Coolant discharge pipe 120 Cooling medium discharge pipe 120 Heat receiving member 121 Refrigerant supply recess 122 Introduction communication port 124 Communication space 125 Refrigerant supply space 126 Radiation fin 127 Auxiliary radiation fin LD Laser diode array

Claims (4)

A first heat-receiving body having a heat-receiving surface on one surface is laminated and joined in such a manner that one surface faces the other surface of the first heat-receiving body, and a refrigerant supply space is formed between the first heat-receiving body and the first heat-receiving body. A heat dissipating device that dissipates heat from the heat generating body installed on the heat receiving surface by allowing the coolant to pass through the refrigerant supply space.
Thereby forming the refrigerant supply cavity to the site over the edge of the one corresponding to the installation location of the heat generating element from Oite central portion on one surface of the second heat receiving member, the other of the second heat receiving member It is formed by laminating and bonding a third heat receiver on the surface,
An inlet for introducing a coolant into the coolant supply space, formed in a central portion of the third heat receiver;
The second heat receiving body and the third heat receiving body are configured so as to avoid the introduction port, and the third heat receiving body has a coolant that is located on the other edge side of the introduction port. A refrigerant discharge space having an outlet,
A communication passage formed at one end edge of the second heat receiving body and sending the coolant that has passed through the refrigerant supply space to the refrigerant discharge space;
A communication space formed in the second heat receiving body on the other edge side of the refrigerant supply space and for contacting the coolant passing through the refrigerant discharge space with the other surface of the first heat receiving body. When
Radiating apparatus characterized by comprising a. The heat radiating device according to claim 1, wherein a refrigerant supply space between the first heat receiving body and the second heat receiving body is formed only in the second heat receiving body . A plurality of radiating fins are extended along the outer shape of the refrigerant supply space from a portion corresponding to the installation location of the heating element to a portion toward the introduction port in the refrigerant supply space. The heat radiating device according to claim 1 . Radiating device according to claim 1 or 3, characterized in that extended a plurality of auxiliary radiation fins toward the outlet port in the interior along the outer shape of the communicating space of the communication space.

Images