JP4163572B2 - Antenna sheet - Google Patents

Description

  INDUSTRIAL APPLICABILITY The present invention is used for an RF-ID medium or the like that can write and read information in a non-contact state, and a plurality of antennas made of a coiled conductive material are arranged in a grid pattern on a base sheet constituting a base substrate The present invention relates to an antenna sheet.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed.

  In information management using such a card, a non-contact IC card equipped with an IC capable of writing and reading information in a non-contact state with respect to the card is rapidly used due to its excellent convenience. Is spreading.

  In a non-contact type IC card capable of writing and reading information in a non-contact state, an electromagnetic coupling method using mutual induction of coils by an AC magnetic field or an induced power due to dielectric flux of two coils is used. An electromagnetic induction system, a microwave system that transmits and receives data by microwaves, and a static electricity that performs communication by charging the antenna between the card side and the external information writing / reading side antenna on the capacitor principle. There are an electric coupling method, an optical method using energy modulation of light by flashing near infrared light at high speed, and the like.

  FIGS. 5A and 5B are diagrams showing an example of the structure of a non-contact type IC card using an electromagnetic induction method. FIG. 5A is a diagram showing an internal structure, and FIG. 5B is a cross-sectional view.

  In this conventional example, as shown in FIG. 5, an antenna 512 made of a coiled conductive material is formed on one surface of a base substrate 514, and information can be written from outside via the antenna 512. An IC chip 511 capable of reading in a non-contact state is mounted, and an inlet 510 in which a bridge 517 made of a conductive material is formed on the other surface of the base substrate 514 is formed on the surface by the adhesive layers 520a and 520b. The layers 530a and 530b are bonded so as to be sandwiched between them. Note that one end of the antenna 512 is connected to the IC chip 511 via a contact 513, and the other end of the antenna 512 is front-to-back conductive formed by mechanically caulking the base substrate 514 from the front and back. The other end of the bridge 517 is connected to one end of the bridge 517 via a portion (not shown), and the other end of the bridge 517 is connected to the IC chip 511 via a front and back conductive portion (not shown) formed in the same manner on the base substrate 514. Connected with. Further, in the antenna 512, when the inlet 510 is bonded so as to be sandwiched between the surface layers 530a and 530b by the adhesive layers 520a and 520b, the antenna 512 is not disconnected when the surface layers 530a and 530b are embossed. As described above, the width of one part is wider than the width of the other part. In addition, by forming a part of the width of the antenna 512 in this way, the resistance of the entire antenna 512 is lowered, thereby extending the communication distance of the non-contact type IC card 501.

  In the non-contact type IC card 501 configured as described above, when it is close to an information writing / reading device (not shown) provided outside, a current is supplied to the antenna 512 by electromagnetic induction from the information writing / reading device. This current is supplied to the IC chip 511 via the contact point 513, so that information is written to the IC chip 511 from the information writing / reading device or written to the IC chip 511 in a non-contact state. Information is read by an information writing / reading device.

  Below, the manufacturing method of the non-contact type IC card 501 mentioned above is demonstrated.

  FIG. 6 is a flowchart for explaining a manufacturing method of the non-contact type IC card 501 shown in FIG.

  First, an inlet sheet in which a plurality of inlets 510 are arranged has the same shape as the inlet sheet, and the two surface sheets constituting the surface layers 530a and 530b have the same shape as the inlet sheet, and are bonded. The two layers 520a and 520b are overlapped via the two adhesive sheets (step S101).

  Next, heat at a predetermined temperature is applied while pressing so as to sandwich the topsheet and the adhesive sheet that are superimposed so as to sandwich the inlet sheet (step S102). Here, since the adhesive sheets constituting the adhesive layers 520a and 520b are made of a thermally activated adhesive like a hot melt adhesive, they melt when a predetermined heat is applied.

  Next, while maintaining the pressurized state, the top sheet and the adhesive sheet superimposed so as to sandwich the inlet sheet are cooled (step S103), and the melted adhesive sheet is cured, whereby the inlet sheet and the top sheet are separated. Glue.

  Thereafter, the inlet sheet and the surface sheet bonded to each other by the adhesive sheet are cut for each inlet 510 to complete the non-contact type IC card 501 (step S104).

  As described above, by using an inlet sheet in which a plurality of inlets 510 are arranged, an adhesive sheet, and a surface sheet, the inlet 510 and the surface layers 530a and 530b are stacked at the same time for a plurality of non-contact type IC cards 501. After that, the laminated sheets are cut for each inlet 510, and thereby the non-contact type IC card 501 is manufactured, thereby improving the production efficiency in the manufacturing process.

  Hereinafter, an inlet sheet in which a plurality of inlets 510 are arranged will be described.

  FIG. 7 is a diagram showing a configuration of an inlet sheet in which a plurality of inlets 510 shown in FIG. 5 are arranged.

  As shown in FIG. 7, the inlet sheet used when manufacturing the non-contact type IC card 501 as described above has an antenna 512 and a bridge 517 formed on a base substrate 514 as shown in FIG. A plurality of inlets 510 each having an IC chip 511 mounted thereon are arranged in a grid pattern, and an adhesive sheet and a surface sheet superimposed on the inlet sheet 610 are a plurality of inlets 510 included in the inlet sheet 610. It has a size that covers all of the above.

  Below, the manufacturing method of the inlet sheet 610 comprised as mentioned above is demonstrated.

  FIG. 8 is a view for explaining a method of manufacturing the inlet sheet 610 shown in FIG.

  First, the adhesive layers 612a and 612b are formed by applying an adhesive to both surfaces of the base sheet 611 constituting the base substrate 514, which is made of PEN (polyethylene naphthalate) or PET (polyethylene terephthalate). Conductive sheets 613a and 613b made of a conductive material such as aluminum or copper are laminated on both surfaces of the base sheet 611 via 612a and 612b (FIG. 8A).

  Next, resist layers 614a and 614b are formed on the conductive sheets 613a and 613b in accordance with the shapes of the antenna 512 and the bridge 517 by gravure printing or silk printing, respectively (FIG. 8B).

  Next, regions where the resist layers 614a and 614b are not formed are removed from the conductive sheets 613a and 613b stacked on the base sheet 611 by wet etching (FIG. 8C), and further resist cleaning is performed. Thus, the resist layers 614a and 614b are removed, whereby the antenna sheet 615 formed by arranging a plurality of coiled antennas 512 and bridges 517 on the base sheet 611 is manufactured (FIG. 8D). Note that the etching method is not limited to wet etching but may be dry etching.

  After that, a thermosetting adhesive such as anisotropic conductive paste (ACP) is applied to the area of the base sheet 611 where the IC chip 511 is mounted, and connected to the antenna 512 formed on the base sheet 611. As described above, the IC chip 511 is mounted on the base sheet 611, and the IC chip 511 and the antenna 512 are electrically connected by an anisotropic conductive paste by heating and pressurizing, and an inlet in which a plurality of inlets 510 are arranged. The sheet 610 is completed (FIG. 8 (e)).

  Here, when the inlet sheet 610 is manufactured by the process as described above, heat is generated in the conductive sheets 613a and 613b during the etching, and the conductive sheets 613a and 613b are melted by this heat, but the conductive sheet 613a. , 613b may melt and harden again, the antenna sheet 615 may warp due to the difference in thermal expansion / contraction between the conductive sheets 613a, 613b and the base sheet 611. In particular, as in the conventional example, when the width of a part of the antenna 512 is wider than the width of other regions, the wide part of the antenna 512 is greatly warped. Further, when the conductive sheets 613a and 613b forming the antenna 512 are thick, or when the conductive sheets 613a and 613b are not so thick, copper is used as the conductive sheets 613a and 613b. A non-contact type IC card manufactured using the sheet 615 is also warped.

Here, by defining the thickness and expansion / contraction ratio of the base sheet 611 to predetermined values, the non-contact type IC card is warped when the inlet sheet 610 and the surface sheet are superposed and heated and pressed. A technique for preventing this is considered (for example, see Patent Document 1).
JP 2003-132317 A

  However, as described above, when the thickness and expansion / contraction ratio of the base sheet are regulated to predetermined values, the non-contact type IC card is warped when the inlet sheet and the surface sheet are superposed and heated and pressed. The technology for preventing this is to prevent the non-contact type IC card from warping when the inlet sheet and the surface sheet are superposed and heated and pressed. When etching is performed to form an antenna pattern, the antenna sheet is warped due to the difference in thermal expansion / contraction rate between the conductive sheet and the base sheet, and the non-contact type IC card is warped. It cannot be suppressed.

  When the antenna sheet is warped, when mounting an IC chip on the antenna sheet, the distance between the IC chip mounting machine and the IC chip mounting area of the antenna sheet cannot be specified, or the mounting position of the IC chip is shifted. There is a possibility that the IC chip cannot be accurately mounted on the antenna. Moreover, there is a possibility that the outer shape of the non-contact type IC card is broken.

  The present invention has been made in view of the problems of the conventional techniques as described above, and is formed by arranging a plurality of antennas made of a coiled conductive material in a grid pattern on a base sheet. An object of the present invention is to provide an antenna sheet that can suppress warping when an antenna is formed on a base sheet.

In order to achieve the above object, the present invention provides:
In the antenna sheet formed by arranging a plurality of antennas made of a coiled conductive material on the base sheet by etching in a grid pattern,
A first pattern made of the same conductive material as the antenna and formed of a pattern along the plurality of antennas and a pattern along the outermost periphery in the arrangement state of the plurality of antennas is formed on the base sheet. It is characterized by that.

  Further, a second pattern made of the same conductive material as that of the antenna is formed on the base sheet along the outer periphery of the antenna sheet.

  In addition, the first pattern and the second pattern are formed on different surfaces of the base sheet.

  Further, the first pattern is formed on both surfaces of the base sheet.

  In the present invention configured as described above, a conductive sheet is laminated on a base sheet in order to form a plurality of antennas made of a coiled conductive material in a grid shape on the base sheet. If etching is performed by forming a resist layer on the antenna according to the shape of the antenna, the portion of the antenna sheet on which the antenna is formed will warp due to the difference in thermal expansion and contraction between the conductive sheet and the base sheet. On the base sheet, the first pattern is formed of the same conductive material as the antenna, and includes a pattern along the plurality of antennas and a pattern along the outermost periphery in the arrangement state of the plurality of antennas. Therefore, the flatness of the antenna sheet is maintained by the first pattern, and the antenna sheet is prevented from warping. It is.

  Even when the second pattern made of the same conductive material as the antenna is formed on the base sheet along the outer periphery of the antenna sheet, the flatness of the antenna sheet is maintained by the second pattern. As a result, the antenna sheet is prevented from warping.

  In addition, if the first pattern and the second pattern are formed on different surfaces of the base sheet, the first pattern and the second pattern warp due to the difference in thermal expansion / contraction rate between the base sheet and the base sheet. Even if a force acts on the antenna sheet, the forces cancel each other, so that the antenna sheet is further prevented from warping.

  Further, even when the first pattern is formed on both surfaces of the base sheet, even if a force acts in a direction that warps due to a difference in thermal expansion / contraction rate between the first pattern and the base sheet, the force Cancel each other out, so that the antenna sheet is further prevented from warping.

  In the present invention configured as described above, the antenna sheet formed by arranging a plurality of coil-shaped conductive material antennas on the base sheet in a grid pattern is made of the same conductive material as the antenna. Since the first pattern consisting of the pattern along the plurality of antennas and the pattern along the outermost periphery in the arrangement state of the plurality of antennas is formed on the base sheet, the antenna sheet is formed by the first pattern. Therefore, the antenna sheet can be prevented from warping when the antenna is formed on the base sheet.

  Further, in the configuration in which the second pattern made of the same conductive material as the antenna is formed on the base sheet along the outer periphery of the antenna sheet, the flatness of the antenna sheet is formed by the second pattern. Therefore, the antenna sheet can be prevented from warping when the antenna is formed on the base sheet.

  In the case where the first pattern and the second pattern are formed on different surfaces of the base sheet, the difference between the thermal expansion and contraction rates of the first pattern and the second pattern and the base sheet is different. Even if forces are applied in the directions of warping, the forces cancel each other, so that the antenna sheet is further prevented from warping.

  Even if the first pattern is formed on both sides of the base sheet, even if a force acts in the direction of warping due to the difference in thermal expansion / contraction rate between the first pattern and the base sheet, Since the forces cancel each other, the antenna sheet is further prevented from warping.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing an embodiment of a non-contact type IC card manufactured using the antenna sheet of the present invention, wherein FIG. 1A is a diagram showing an internal structure, and FIG. 1B is a cross-sectional view.

  In this embodiment, as shown in FIG. 1, an antenna 12 made of a coiled conductive material is formed on one surface of a base substrate 14, and information is written and read from the outside via the antenna 12. Is mounted in a non-contact state, and the inlet 10 in which a bridge 17 made of a conductive material is formed on the other surface of the base substrate 14 is formed by the adhesive layers 20a and 20b. It is configured to be bonded so as to be sandwiched between 30a and 30b. Note that one end of the antenna 12 is connected to the IC chip 11 via the contact 13, and the other end of the antenna 12 is formed by mechanically caulking the base substrate 14 from the front and back. The other end of the bridge 17 is connected to one end of the bridge 17 via a portion (not shown), and the other end of the bridge 17 is connected to the IC chip 11 via a front / back conduction portion (not shown) formed in the same manner on the base substrate 14. Connected with. Further, in the antenna 12, the antenna 12 is not disconnected when the inlet 10 is bonded so as to be sandwiched between the surface layers 30a and 30b by the adhesive layers 20a and 20b and then the surface layers 30a and 30b are embossed. As described above, the width of one part is wider than the width of the other part. Further, by forming a part of the width of the antenna 12 in this way, the resistance of the entire antenna 12 is lowered, thereby extending the communication distance of the non-contact type IC card 1.

  In the non-contact type IC card 1 configured as described above, when it is close to an information writing / reading device (not shown) provided outside, a current is supplied to the antenna 12 by electromagnetic induction from the information writing / reading device. This current is supplied to the IC chip 11 via the contact point 13, whereby information is written to the IC chip 11 from the information writing / reading device or written to the IC chip 11 in a non-contact state. Information is read by an information writing / reading device.

  Below, the manufacturing method of the non-contact type IC card 1 mentioned above is demonstrated.

  FIG. 2 is a flowchart for explaining a manufacturing method of the non-contact type IC card 1 shown in FIG.

  First, an inlet sheet in which a plurality of inlets 10 are arranged has the same shape as the inlet sheet, and the two surface sheets constituting the surface layers 30a and 30b have the same shape as the inlet sheet, and are bonded. The two layers 20a and 20b are overlaid via the two adhesive sheets (step S1).

  Next, heat at a predetermined temperature is applied while pressing so as to sandwich the topsheet and the adhesive sheet that are superimposed so as to sandwich the inlet sheet (step S2). Here, since the adhesive sheets constituting the adhesive layers 20a and 20b are made of a heat activated adhesive like a hot melt adhesive, they melt when a predetermined heat is applied.

  Next, while maintaining the pressurized state, the surface sheet and the adhesive sheet superimposed so as to sandwich the inlet sheet are cooled (step S3), the molten adhesive sheet is cured, and thereby the inlet sheet and the surface sheet are combined. Glue.

  Thereafter, the inlet sheet and the surface sheet bonded to each other by the adhesive sheet are cut for each inlet 10 to complete the non-contact type IC card 1 (step S4).

  As described above, by using an inlet sheet in which a plurality of inlets 10 are arranged, an adhesive sheet, and a surface sheet, the inlet 10 and the surface layers 30a and 30b are stacked on the plurality of non-contact type IC cards 1 at the same time. After that, the laminated sheets are cut for each inlet 10 to manufacture the non-contact type IC card 1, thereby improving the production efficiency in the manufacturing process.

  Hereinafter, an inlet sheet in which a plurality of inlets 10 are arranged will be described.

  FIG. 3 is a diagram illustrating a configuration of an inlet sheet in which a plurality of the inlets 10 illustrated in FIG. 1 are arranged.

  As shown in FIG. 3, the inlet sheet used in manufacturing the non-contact type IC card 1 as described above has the antenna 12 and the bridge 17 formed on the base substrate 14 as shown in FIG. A plurality of inlets 10 on which the IC chip 11 is mounted are arranged in a grid pattern, and an adhesive sheet and a surface sheet superimposed on the inlet sheet 110 are a plurality of inlets 10 included in the inlet sheet 110. It has a size that covers all of the above. Furthermore, in this embodiment, a pattern 15 a made of the same conductive material as the antenna 12 is formed between the plurality of antennas 12 on the base sheet 111 constituting the base substrate 14, and the plurality of antennas A pattern 15b made of the same conductive material as that of the antenna 12 is formed along the outermost periphery in the 12 arrangement states. Note that the first pattern is constituted by these patterns 15a and 15b. The patterns 15a and 15b are formed in regions not included in the plurality of inlets 10 included in the inlet sheet 110, and are cut off when the inlet sheet 110 is cut for each inlet 10 in a later process. A second pattern 16 made of the same conductive material as that of the antenna 12 is formed along the outer periphery of the inlet sheet 110.

  Below, the manufacturing method of the inlet sheet 110 comprised as mentioned above is demonstrated.

  FIG. 4 is a diagram for explaining a method of manufacturing the inlet sheet 110 shown in FIG.

  First, the adhesive layers 112a and 112b are formed by applying an adhesive to both surfaces of the base sheet 111 which is made of PEN (polyethylene naphthalate) or PET (polyethylene terephthalate) and constitutes the base substrate 14. Conductive sheets 113a and 113b made of a conductive material such as aluminum or copper are laminated on both surfaces of the base sheet 111 via 112a and 112b (FIG. 4A).

  Next, resist layers 114a and 114b are respectively formed on the conductive sheets 113a and 113b by gravure printing or silk printing in accordance with the shapes of the antenna 12, the bridge 17, and the patterns 15 and 16 (FIG. 4B).

  Next, regions where the resist layers 114a and 114b are not formed are removed from the conductive sheets 113a and 113b laminated on the base sheet 111 by wet etching (FIG. 4C), and further resist cleaning is performed. Thus, the resist layers 114a and 114b are removed, whereby a plurality of coiled antennas 12 and bridges 17 are formed on the base sheet 111, and the antenna sheets on which the patterns 15a, 15b, and 16 are formed. 115 is produced (FIG. 4D). Note that the etching method is not limited to wet etching but may be dry etching. Further, when the resist cleaning is performed, it is necessary to remove the resist layer 114a on the surface on which the antenna 12 and the patterns 15a and 15b are formed because there is a portion where the IC chip 11 is connected to the antenna 12. The resist layer 114b is not removed on the surface on which the bridge 17 and the pattern 16 are formed. Here, as described above, when etching is performed on the antenna sheet 115 on which the conductive sheets 113a and 113b are stacked, the conductive sheets 113a and 113b are melted by the heat generated in the conductive sheets 113a and 113b, and are solidified again. The portion of the antenna sheet 115 where the antenna 12 is formed is warped due to the difference in thermal expansion and contraction between the conductive sheets 113a and 113b and the base sheet 111. In this embodiment, on the base sheet 111, A pattern 15 a made of the same conductive material as the antenna 12 is formed between the plurality of antennas 12 and made of the same conductive material as the antenna 12 along the outermost periphery in the arrangement state of the plurality of antennas 12. Since the pattern 15b is formed, the patterns 15a, 1 Results in the flatness of the antenna sheet 115 is maintained by b, it is prevented that the antenna sheet 115 is warped. The patterns 15a and 15b may be formed on either one of the front and back surfaces of the base sheet 111. However, if the patterns 15a and 15b are formed on both surfaces, the thermal expansion / contraction rate between the patterns 15a and 15b and the base sheet 111 can be reduced. Even if a force acts in the direction of warping due to the difference, the forces cancel each other, so that the antenna sheet 115 is further prevented from warping. Furthermore, since the pattern 16 made of the same conductive material as that of the antenna 12 is formed along the outer periphery of the inlet sheet 110, the flatness of the antenna sheet 115 is also maintained by this pattern 16. The antenna sheet 115 is prevented from warping. As shown in FIG. 4, if the patterns 15a, 15b and the pattern 16 are formed on different surfaces of the base sheet 111, the difference in thermal expansion / contraction rate between the patterns 15a, 15b, 16 and the base sheet 111 is different. Thus, even if forces act in the directions of warping, the forces cancel each other, so that the antenna sheet 115 is further prevented from warping.

  Thereafter, a thermosetting adhesive such as anisotropic conductive paste (ACP) is applied to the area of the base sheet 111 where the IC chip 11 is mounted, and connected to the antenna 12 formed on the base sheet 111. As described above, the IC chip 11 is mounted on the base sheet 111, and the IC chip 11 and the antenna 12 are electrically connected by an anisotropic conductive paste by heating and pressurizing, and an inlet in which a plurality of inlets 10 are arranged. The sheet 110 is completed (FIG. 4E).

  In the present embodiment, the antenna sheet used in the non-contact type IC card as shown in FIG. 1 has been described as an example, but the antenna sheet according to the present invention is also applied to the resonance tag including only the coiled antenna. Can be used.

It is a figure which shows one Embodiment of the non-contact-type IC card produced using the antenna sheet | seat of this invention, (a) is a figure which shows an internal structure, (b) is sectional drawing. It is a flowchart for demonstrating the manufacturing method of the non-contact-type IC card shown in FIG. It is a figure which shows the structure of the inlet sheet by which the inlet shown in FIG. 1 is arranged in multiple numbers. It is a figure for demonstrating the manufacturing method of the inlet sheet shown in FIG. It is a figure which shows one structural example of the non-contact-type IC card by an electromagnetic induction system, (a) is a figure which shows an internal structure, (b) is sectional drawing. It is a flowchart for demonstrating the manufacturing method of the non-contact-type IC card shown in FIG. It is a figure which shows the structure of the inlet sheet by which multiple inlets shown in FIG. 5 are arranged. It is a figure for demonstrating the manufacturing method of the inlet sheet shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact-type IC card 10 Inlet 11 IC chip 12 Antenna 13 Contact 14 Base base material 15 and 16 Pattern 17 Bridge 20a, 20b Adhesion layer 30a, 30b Surface layer 110 Inlet sheet 111 Base sheet 112a, 112b Adhesive layer 113a, 113b Conductive sheets 114a and 114b Resist layer 115 Antenna sheet

Claims (4)

In the antenna sheet formed by arranging a plurality of antennas made of a coiled conductive material on the base sheet by etching in a grid pattern,
A first pattern made of the same conductive material as the antenna and formed of a pattern along the plurality of antennas and a pattern along the outermost periphery in the arrangement state of the plurality of antennas is formed on the base sheet. An antenna sheet characterized by that. In the antenna sheet according to claim 1,
An antenna sheet, wherein a second pattern made of the same conductive material as that of the antenna is formed on the base sheet along an outer periphery of the antenna sheet. The antenna sheet according to claim 2,
The antenna sheet, wherein the first pattern and the second pattern are formed on different surfaces of the base sheet. In the antenna sheet according to claim 1 or 2,
The antenna sheet, wherein the first pattern is formed on both surfaces of the base sheet.

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