JP4170475B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component on a substrate.
[0002]
[Prior art]
In an electronic component mounting apparatus, a multi-head that drives a plurality of suction heads by the same driving unit may be used as means for shortening mounting tact time. In this method, a plurality of electronic components are simultaneously picked up by a plurality of suction heads, and the electronic components are supplied in an arrangement form matching the arrangement pitch of the suction heads in the electronic component supply unit.
[0003]
[Problems to be solved by the invention]
However, in an actual mounting apparatus, it is not always possible to match the arrangement form of the electronic components in the electronic component supply unit with the arrangement pitch of the suction heads. In particular, when a tray is used as the electronic component supply method when targeting multiple types of electronic components, the arrangement pitch of the electronic components on the tray is usually different depending on the electronic component, and the tape feeder or bulk This is because even when a feeder is used, the arrangement pitch may not be matched depending on the type of electronic component. For this reason, when different types of electronic components are mounted at the same time, cases that can be handled by a multi-head are limited, and conventional electronic component mounting apparatuses efficiently supply multiple types of electronic components to improve mounting efficiency. It was difficult.
[0004]
Therefore, an object of the present invention is to provide an electronic component mounting apparatus and mounting method that can efficiently supply a plurality of types of electronic components to improve mounting efficiency.
[0005]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that mounts an electronic component on a substrate by a mounting head including a plurality of suction heads, and a circular shape is formed on an outer periphery of a fixed portion that is a cylindrical member. A ring member is rotatably mounted, and a plurality of suction seats are provided radially on the outer surface of the annular member, and branched vertically upward from a suction hole provided in the longitudinal direction of the central position of the fixed portion. The suction holes are communicated with the suction holes of the plurality of suction seats, and the plurality of electronic components transferred from the electronic component supply unit are arranged in the same plane at a pitch equal to the arrangement pitch of the suction heads. An electronic stage is provided with an intermediate stage having a plurality of sets of holding units that are vacuum-sucked and held on a seat , and the mounting head is positioned on an upper surface that is a suction position among the plurality of sets of holding units. Each Was so that be picked up together for each part.
[0007]
The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, further comprising a moving unit that moves the intermediate stage from the electronic component supply unit to the vicinity of the substrate positioning unit. .
[0008]
Electronic part mounting method according to claim 3, there is provided a method of mounting an electronic component for mounting electronic components on a substrate by a mounting apparatus for an electronic component according to claim 1 or 2, a plurality of supply portions of the electronic component The electronic components are transferred and held on the suction seats of the holding portion of the intermediate stage, and the held electronic components are collectively picked up by the mounting head for each holding portion and mounted on the substrate.
[0009]
According to the present invention, a plurality of types of electronic components transferred from the electronic component supply unit are provided with an intermediate stage having a plurality of holding units that vacuum-suck the electronic components at a pitch equal to the arrangement pitch of the mounting heads. Electronic components can be supplied efficiently.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus, and FIG. 3A is a front view of an intermediate stage of the electronic component mounting apparatus. FIG. 3B is a cross-sectional view of the intermediate stage of the electronic component mounting apparatus, FIGS. 4A, 4B, and 4C are process explanatory diagrams of the electronic component mounting method, and FIG. It is a perspective view of the supply head of the mounting device of an electronic component.
[0011]
First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a transport path 2 is arranged in the X direction at the center of a base 1. The transport path 2 transports and positions the substrate 3. Therefore, the conveyance path 2 is a substrate positioning portion. On both sides of the conveyance path 2, first supply parts 4A and 4B for electronic parts are arranged, and a large number of tape feeders 5 are arranged in parallel in each of the supply parts 4A and 4B. The tape feeder 5 stores electronic components held on the tape, and supplies the electronic components by pitch-feeding the tape.
[0012]
An electronic component mounting head 7 is mounted on the X-axis table 6. The mounting head 7 is a multi-head having a plurality (three in this embodiment) of suction heads 7a. The X-axis table 6 is installed with both ends supported by a guide 8B arranged in parallel to face the Y-axis table 8A and the Y-axis table 8A. Therefore, by driving the X-axis table 6 and the Y-axis table 8A, the mounting head 7 moves horizontally, and an electronic component is picked up from the pick-up position 9 of the tape feeder 5 by the nozzle mounted at the lower end of each suction head 7a. Then, it is transferred onto the substrate 3. Between the conveyance path 2 and the second supply unit 4B, a camera 10 that recognizes electronic components is disposed.
[0013]
A second supply unit 12 is disposed on the side of the base 1. A tray 14 for storing different types of electronic components P1, P2, and P3 is placed on the tray placing portion 13 provided in the second supply portion 12. A tray feeder 15 for stacking and storing trays 14 is disposed adjacent to the tray placing unit 13. The tray 14 is supplied from the tray feeder 15 and placed on the tray placing unit 13.
[0014]
The electronic components P1, P2, and P3 in the tray 14 are transferred to the intermediate stage 18 by moving the supply head 16 by the moving means including the X-axis table 17X and the Y-axis table 17Y, and are held by vacuum suction. Between the conveyance path 2 and the supply section 4B has the mobile table 1 9 a moving means is arranged along the conveying path 2, the intermediate stage 18 from the second supply unit 12 by the moving table 19 of the substrate 3 Move to the vicinity of the positioning part. Then, the electronic components held on the intermediate stage 18 are picked up by the plurality of suction heads 7 a of the mounting head 7 and mounted on the substrate 3.
[0015]
Next, the intermediate stage 18 on which electronic components are placed will be described with reference to FIG. As shown in FIG. 3A, the intermediate stage 18 is configured by rotatably mounting an annular member 22 on the outer periphery of a fixed portion 21 that is a cylindrical member fixed to the bracket 20. The fixing portion 21 is provided with a suction hole 21 a in the longitudinal direction at the center position, and the suction hole 21 a is connected to a vacuum suction source via a pipe 26.
[0016]
The intermediate stage 18 is divided into three positions A, B, and C in the longitudinal direction, and the fixing portion 21 has a suction hole 21b that branches vertically upward from the suction hole 21a corresponding to each position of A, B, and C. Is provided. The suction hole 21b communicates with the suction hole 24 of the suction seat 23 that holds the electronic component. As shown in FIG. 3B, the suction seat 23 is provided on the outer surface of the annular member. By vacuum suction from the pipe 26 in a state where the suction hole 24 is in communication with the suction hole 21 b of the fixed portion 21, electronic parts are sucked and held on the suction seat 23.
[0017]
As shown in FIG. 3B, the suction seats 23 are provided radially at the 90-degree distribution position. FIG. 3B shows a cross-section at the position A, and the suction seats 23A1, 23A2, 23A3, and 23A4 hold different types of electronic components by detachably mounting corresponding components of different shapes and sizes. Can be done. Similarly, suction seats 23B1, 23B2, 23B3, and 23B4 and 23C1, 23C2, 23C3, and 23C4 are provided radially at the B position and the C position, respectively, and can hold different types of electronic components.
[0018]
The pitch P between the suction seats 23 shown in FIG. 3A is set equal to the arrangement pitch of the suction heads provided in the mounting head 7. Accordingly, the electronic component is held by the three suction seats 23 positioned on the upper surface of the intermediate stage 18 and the mounting head 7 is lowered onto the intermediate stage 18 to perform the three electronic components in a single pickup operation. Can be picked up by being picked up by each suction head 7a. At this time, the suction head 7a of the transfer head 7 corresponds to different types of electronic components, and similarly, the shape and size of the suction seats at the positions A, B, and C of the intermediate stage 18 are changed to the respective electronic components. By making it correspond, three types of different electronic components can be held on the intermediate stage 18, and these three types of electronic components can be simultaneously supplied to the mounting head 7.
[0019]
Three suction seats in the same plane, for example (23A1, 23B1, 23C1), constitute a first holding unit that holds three electronic components at a predetermined arrangement pitch. Similarly, the combination of (23A2, 23B2, 23C2), (23A3, 23B3, 23C3), (23A4, 23B4, 23C4) constitutes the second to fourth holding units, that is, the intermediate stage 18 has three each. It has four sets of holding parts composed of the suction seats 23. By rotating the pulley 29 coupled to the annular member 22 by the motor 27 via the belt 30 and the pulley 28, any holding part of the four sets of holding parts is positioned on the upper surface which is the suction position. Can do.
[0020]
The electronic component mounting apparatus is configured as described above. Next, the operation will be described. In FIG. 2, the mounting head 7 is moved to pick up the electronic component P from the supply units 4A and 4B. At this time, the arrangement pitch P of the suction heads of the mounting head 7 and the arrangement pitch P of the tape feeders 5 of the supply unit 4 (arrangement pitch of every other tape feeder 5 in the present embodiment) are set to be equal. Three electronic components can be picked up simultaneously by the suction operation. After that, the mounting head 7 moves onto the camera 10 and moves to the substrate 3 of the positioning unit after recognizing the position of the electronic component. Then, the electronic components are sequentially mounted on the mounting position of the substrate 3 by causing the suction head 7a to move up and down.
[0021]
Following the mounting of the electronic components stored in the supply unit 4, the electronic components stored in the second supply unit 12 are mounted. A tray 14 containing three different types of electronic components P1, P2, and P3 is placed on the tray placing portion 13 of the second supply unit 12, and these electronic components are shown in FIG. As described above, the sheet is picked up from the tray 14 by the supply head 16, transferred to the suction seats 23A1, 23B1, and 23C1 (see FIG. 3) of the intermediate stage 18 and held by vacuum suction.
[0022]
The operation of supplying the electronic component to the intermediate stage 18 is performed in parallel with the operation of mounting the electronic component on the substrate 3 by the mounting head 7, and by rotating the annular member 22, a plurality of operations can be performed as necessary. Electronic components are supplied to the holding unit of the set. Here, the number of sets of holding parts to be supplied with electronic components in advance is determined by the balance between the mounting tact time by the mounting head 7 and the transfer tact time by the supply head 16.
[0023]
Next, the intermediate stage 18 moves to the side of the substrate 3 positioned on the transport path 2 by the moving table 19 and stands by at this position. Thereafter, the mounting head 7 is moved, and the three suction heads 7a are lowered onto the intermediate stage 18 as shown in FIG. 4B, whereby three different types of electronic components P1, P2, and P3 are moved to the holding portions. Pick up all at once. Thereafter, the mounting head 7 is moved onto the substrate 3 after the position of the electronic component is recognized by the camera 10 in the same manner as described above, and the electronic components P1 and P1 held on the suction heads 7a as shown in FIG. P2 and P3 are sequentially mounted on the substrate 3.
[0024]
In this way, while the mounting head 7 is performing the mounting operation, it is more preferable that a plurality of different types of electronic components are transferred to the intermediate stage 18 in advance by the supply head 16 in parallel with this operation. By moving the intermediate stage 18 to the vicinity of the substrate 3 and waiting, a plurality of electronic components are simultaneously supplied and the time required for moving the mounting head 7 is reduced to improve the supply efficiency. It can be shortened to improve productivity.
[0025]
In the present embodiment, an example is shown in which the electronic components supplied from the tray 14 are transferred to the intermediate stage 18 and placed on standby. However, the present invention is not limited to this, and the arrangement pitch of the tape feeders 5 is the arrangement pitch of the suction heads 7a. In other cases, the transfer unit similar to the supply head 16 may be provided in the supply unit 4B, and the electronic component supplied from the tape feeder 5 may be transferred to the intermediate stage 18.
[0026]
Further, when the supply head 16 ′ having a plurality of types of suction nozzles capable of position switching as shown in FIG. 5 is used as the supply head 16, the shape and size of the target electronic component are greatly different. In this case, electronic components can be supplied more efficiently without the need to replace the nozzle. The supply nozzle 16 ′ is configured such that a plurality of different types of nozzles 31 are mounted radially on the rotation block 32 and the nozzle position is switched by the rotation index mechanism 33.
[0027]
【The invention's effect】
According to the present invention, the plurality of types of electronic components transferred from the electronic component supply unit are provided with the intermediate stage having a plurality of holding units that vacuum-suck the electronic components at a pitch equal to the arrangement pitch of the mounting heads. Various types of electronic components can be supplied simultaneously, and the mounting tact time can be shortened to improve productivity.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4B is a front view of the intermediate stage of the electronic component mounting apparatus according to the embodiment; FIG. 4B is a sectional view of the intermediate stage of the electronic component mounting apparatus according to the embodiment of the present invention; (B) Process explanatory diagram of the electronic component mounting method of the embodiment of the present invention (c) Process of the electronic component mounting method of the embodiment of the present invention FIG. 5 is a perspective view of a supply head of the electronic component mounting apparatus according to the embodiment of the present invention.
2 Transport path 3 Substrate 4A, 4B Supply unit 5 Tape feeder 7 Mounting head 7a Suction head 12 Second supply unit 14 Tray 16 Supply head 18 Intermediate stage 23A1, 23B1, 23C1 Suction seat

Claims (3)

An electronic component mounting apparatus that mounts an electronic component on a substrate with a mounting head having a plurality of suction heads , wherein the annular member is rotatably mounted on the outer periphery of a fixed portion that is a cylindrical member, A plurality of suction seats are provided radially on the outer surface of the annular member, and suction holes that branch vertically upward from suction holes provided in the longitudinal direction of the center position of the fixed portion are suction holes of the plurality of suction seats. with communicating, a plurality of holding portions for holding by vacuum suction a plurality of said suction seat with electronic components plurality of electronic components are transferred from the supply unit in the arrangement pitch equal to the pitch of the suction head in the same plane an intermediate stage having a set, you pick collectively electronic components in each holding portion by the mounting head suction seats for any holding portion is positioned on an upper surface a suction position of the plurality of sets of holding portions Yo Mounting apparatus of electronic components, characterized in that the. 2. The electronic component mounting apparatus according to claim 1, further comprising moving means for moving the intermediate stage from the electronic component supply unit to the vicinity of the substrate positioning unit. The mounting apparatus of an electronic component according to claim 1 or 2 a mounting method of the electronic component for mounting electronic components on a substrate, the of the holding portion of the plurality of electronic components from the supply portion of the electronic component said intermediate stage A method of mounting an electronic component, wherein the electronic component is transferred and held on each suction seat, and the held electronic components are collectively picked up by the mounting head for each holding portion and mounted on a substrate.

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