JP4180318B2 - Screen printing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a screen printing method for printing on a printing material using a screen mask (screen plate).To the lawIn particular, a screen printing method suitable for attaching a paste-like object corresponding to ink uniformly and bulky to a substrate.To the lawRelated.
[0002]
[Prior art]
In order to form a fine structure on an object surface, a technique using screen printing is used in various situations. FIG. 10 is a diagram schematically illustrating a method of forming conductive bumps as fine structures on a substrate (in this case, for example, a wiring board or a metal foil) using screen printing. In addition, since the conductive bump printed and formed by such a method has a sharp point, it can easily penetrate a semi-cured insulating plate (prepreg) and can be used as an interlayer connection between the insulating plates by the penetration. It is.
[0003]
As shown in the figure, a screen mask 75 is disposed opposite to and spaced from the wiring board or metal foil 78. The screen mask 75 is stretched on the screen mask stretching portions 73 and 74. Further, the screen mask 75 includes through holes 75a, 75b, 75c, 75d, 75e,... For moving and transferring the conductive paste 76 to the wiring board or the metal foil 78.
[0004]
The squeegee 71 pushes down the screen mask 75 linearly so that the screen mask 75 and the wiring board or metal foil 78 come into contact with each other. In this state, the squeegee 71 moves from the right to the left in the figure (moves in the direction perpendicular to the contact line shape). At this time, the conductive paste 76 exists on the screen mask 75 in contact with the front of the squeegee 71. Keep it like that.
[0005]
Due to the movement of the squeegee 71 in such a state, a part of the conductive paste 76 is filled in the through hole 75b near the position immediately below the squeegee 71. When the squeegee 71 moves and the screen mask 75 begins to separate from the wiring board or metal foil 78, a part of the conductive paste 76 filled in the through hole 75b is applied to the wiring board or metal foil 78 due to adhesive force or surface tension. It is pulled and a part is pulled so that it may remain in the through-hole 75b (75c).
[0006]
When the distance between the screen mask 75 and the wiring board or the metal foil 78 is further increased, a part of the screen mask 75 remains in the through hole 75c (75d, 75e), and the portion pulled by the wiring board or the metal foil 78 is divided and the tip is sharp. It adheres to the wiring board or the metal foil 78 in a different shape.
[0007]
The pointed-shaped conductive paste (the pointed-shaped conductive paste is hereinafter referred to as a conductive bump 77) is dried and cured, and is passed through a semi-cured insulating plate (prepreg) to connect the interlayer connector. Can be. Such an interlayer connection body by screen printing can be formed with a fine pitch, and is used to meet the fine patterning required for a wiring board.
[0008]
In the above-described formation of the interlayer connection body, as shown in the drawing, the screen paste 75 is pushed down by the squeegee 71 and the conductive paste 76 is passed through the through-holes 75a and the like in a state where the substrate to be printed is separated from the screen mask 75. It is transferred and attached to the wiring board or metal foil 78.
[0009]
As the screen printing, in addition to the method of separating the printing material and the screen mask 75 in advance as described above (so-called off-contact), the printing material and the screen mask 75 are previously brought into contact with the surface. There is also a printing method (so-called on-contact).
[0010]
In the case of on-contact, the squeegee 71 is moved and the conductive paste 76 is filled into the through-holes 75a and the like in a state in which the substrate to be printed and the screen mask 75 are in contact with each other, and the filled conductive paste The bottom of 76 is attached to the wiring board or metal foil 78. Thereafter, the screen mask 75 is isolated from the substrate 78. Due to this isolation, the conductive paste 76 in the through hole 75a or the like is partially pulled by the wiring board or the metal foil 78 due to adhesive force or surface tension, and part is pulled so as to remain in the through hole 75a or the like.
[0011]
As a result, when the distance between the screen mask 75 and the wiring board or the metal foil 78 is further separated, a part of the screen mask 75 remains in the through hole 75a and the like, and the portion pulled by the wiring board or the metal foil 78 is divided and the tip is cut off. It adheres to the wiring board or metal foil 78 in a sharp shape. Therefore, similarly to the case of the above-described off-contact, the conductive paste 76 having a pointed shape is formed, and the interlayer connection body (conductive bump 77) can be formed by drying and curing the paste.
[0012]
[Problems to be solved by the invention]
The formation of the conductive bump 77 as described above requires a certain height to penetrate the insulating plate. As the pitch required for the wiring board is further reduced, it is necessary to form a shape having a relatively high height relative to the bottom area while maintaining the height, that is, a so-called high aspect ratio shape. is there.
[0013]
Looking at the formation of conductive bumps by screen printing from such a future viewpoint, there is a certain limit to increasing the aspect ratio. As described above, in both cases of off-contact and on-contact, the conductive bumps are formed so that the conductive paste 76 is formed when the distance between the screen mask 75 and the wiring board or the metal foil 78 is separated. This is because it depends on the amount of the wiring board or the metal foil 78 that is adhered and pulled.
[0014]
Therefore, simply, the volume of the through-hole 75a (75b, 75c, 75d, 75e) may be relatively increased to increase the amount of the conductive paste 76 filled in the through-hole 75a. It is conceivable to increase the thickness of the screen mask 75. However, even if it does in this way, the amount pulled and remaining in the through-hole 75a etc. also increases, and does not simply increase as the amount attached to the wiring board or the metal foil 78.
[0015]
Therefore, as a measure for making the amount of the conductive paste 76 filled in the through-hole 75a etc. substantially increase, and reducing the amount remaining by being pulled to the through-hole 75a etc. regardless of this. The shape of the through-hole 75a and the like is not a simple square, but a shape in which the diameter of the through-hole 75a or the like is increased from the side in contact with the printing material to the middle thickness of the screen mask 75 (that is, for example, a convex shape as the longitudinal cross-sectional shape). It can also be considered.
[0016]
In this way, the thickness of the screen mask 75 can be substantially increased, and the conductive paste 76 can be prevented from coming into contact with the side wall of the through hole 75a or the like in a portion having a large diameter. Since the amount of the conductive paste 76 remaining in the through hole 75a and the like is determined corresponding to the thickness of the screen mask 75 corresponding to the small diameter portion of the through hole 75a and the like, therefore, a larger amount of conductive paste. 76 can be attached to a wiring board or metal foil 78.
[0017]
When such a method is applied to so-called on-contact screen printing, however, the following problems can be considered. That is, whether or not a uniform contact state can be obtained when the substrate to be printed and the screen mask 75 are brought into contact with each other in advance. In general, the screen mask 75 is locally wrinkled and floats, and a portion where sufficient contact with the printing material is not secured occurs.
[0018]
When the screen mask 75 is lifted, the amount of the conductive paste 76 filled varies depending on the position of the through hole 75a and the like. Then, since the amount of the conductive paste 76 to be filled increases in the portion where the lift occurs, when the screen mask 75 is isolated from the printing material, the height of the pointed shape of the conductive paste 76 is abnormal. An abnormality in the bottom area occurs. That is, it may be a cause of variation in the formation height and shape of the conductive bumps 77.
[0019]
In a printed material having such conductive bumps 77, the conductive bumps 77 are not evenly penetrated into the insulating layer. For example, when the conductive bump 77 is pressure-compressed in the axial direction at the time of manufacturing a printed circuit board, it may be considered that defects such as conduction of unnecessary portions are caused by abnormal plastic deformation along the wiring board surface. That is, the reliability as an interlayer connection body is deteriorated, and quality assurance may be affected.
[0020]
  The present invention has been made in consideration of the above-described circumstances, and a screen printing method for printing on an object to be printed using a screen mask.To the lawScreen printing method that allows a paste-like object equivalent to ink to be uniformly and bulkyly adhered to the substrate.The lawThe purpose is to provide.
[0021]
[Means for Solving the Problems]
  In order to solve the above problems, a screen printing method according to the present invention includes a support plate, a screen printing spacer including an adhesive layer attached to one side of the support plate, and the screen printing spacer. A screen mask having a screen plate disposed on a side opposite to the surface on which the adhesive layer is attached, wherein the screen plate has a through hole at a predetermined position, and the support plate has the through hole A step of bringing the screen printing spacer side of the screen mask, which is arranged so that a second through hole having a diameter larger than the hole overlaps with the position of the through hole, in a planar shape with the substrate, The through-hole of the screen mask with a squeegee provided on the surface of the screen mask opposite to the printed material in a state where the screen mask is in a planar contact A step of filling a paste, and a step of isolating the screen mask having the paste in the through hole from the printed material, and isolating the screen mask having the paste in the through hole from the printing surface. The step is performed by arranging a roll on the screen mask, rolling the arranged roll, and winding the screen mask onto the roll.
[0022]
That is, a screen mask in which a screen plate and a screen printing spacer are laminated is used, and an adhesive layer is present on the surface of the screen printing spacer that is in contact with the substrate. The screen plate has a through hole, and the screen printing spacer is arranged so that a second through hole having a diameter larger than the through hole overlaps.
[0023]
Such a screen mask is brought into contact with the substrate to be printed, and then the paste is filled in the through holes with a squeegee. When the screen mask is brought into contact with the substrate to be printed, the screen mask and the substrate are brought into contact with each other uniformly, that is, without causing wrinkles or the like, due to the function of the adhesive layer. Therefore, the filling of the paste into the subsequent through holes can be performed in a uniform amount with respect to each through hole.
[0024]
  Since the screen mask filled with the paste in a uniform amount is isolated from the printed material, the amount of paste adhered from each through hole to the printed material is made uniform.Here, if the screen mask is separated from the printing material at a time instead of at once on the printing surface, the screen mask is more evenly separated from the printing material by sequentially performing in accordance with the line in contact with the roll. There is a possibility of becoming.Further, the amount of paste in each through hole increases when the amount of the second through hole of the screen printing spacer is added. Here, since the diameter of the second through hole of the screen printing spacer is larger than that of the through hole of the screen plate, contact of the paste to the side wall is avoided, and the amount of paste attached to the substrate side is increased. Bring. Therefore, according to this printing method, the paste-like object can be uniformly and bulkyly attached to the printing material.
[0025]
The planar shape of the through hole and the second through hole may be an ellipse or a polygon other than a circle. A well-known material can be used for the screen plate. For example, aluminum, nickel, stainless steel, copper, brass and the like. For example, a resin can be used for the support plate of the screen printing spacer, but a metal such as that used for the screen plate may be used.
[0026]
The pressure-sensitive adhesive layer of the screen printing spacer has sufficient strength to ensure sufficient adhesion with the substrate, and is strong enough to be peeled off relatively easily when the screen mask is isolated from the surface to be printed. Is appropriate. For example, it is the adhesive strength of glue material used for sticky paper and adhesive material for cleaning rolls. Moreover, even if it says an adhesion layer, you may maintain the contact state between two persons by the mechanism close | similar to adsorption | suction. For example, it is a material that can exhibit a contact state by elastic deformation when an object surface having fine-structured bubbles on the surface contacts the surface to be printed.
[0027]
Moreover, a rigid or flexible wiring board base material, metal foil (copper foil), a glass plate, a ceramic board etc. can be used for to-be-printed material.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
  As an embodiment of the screen printing method, the roll has a magnetic force, and the magnetic force is used to wind the screen mask on the roll. This ensures more reliable winding of the screen mask around the roll.
[0032]
As an embodiment of the screen printing method, the roll has a vacuum suction function, and the vacuum suction function is used to wind the screen mask on the roll. This also ensures the winding of the screen mask around the roll.
[0035]
  Embodiments of the present invention are described below.(And reference examples)Will be described with reference to the drawings.First,FIG.For reference exampleIt is the figure which shows typically the screen printer for performing the screen printing method which concerns, and is the figure which looked at the printing surface from the horizontal direction.
[0036]
In this screen printing machine, conductive bumps are formed on the main surface of the wiring board substrate 12 that is a substrate to be printed placed on the printing table 11. To describe the configuration, the screen mask 18 can be arranged so as to be spaced apart so that one surface of the screen mask 18 faces the main surface of the wiring board substrate 12.
[0037]
The screen mask 18 is stretched with its ends held by screen mask stretching portions 13, 14 positioned opposite to each other. The screen mask extending portions 13 and 14 can move the stretched screen mask 18 downward and bring it into contact with the main surface of the wiring board substrate 12. Further, it can be moved upward from this contacted state and isolated from the wiring board substrate 12. In order to place and hold the wiring board substrate 12 on the printing stand 11, for example, this can be achieved by providing the printing stand 11 with a vacuum suction mechanism.
[0038]
The screen mask 18 has a laminated structure of a screen plate 15, a shim 16 as a support plate for a screen printing spacer, and an adhesive layer 17. In addition, through holes 15a, 15b, 15c, 15d, 15e,... (For example, a diameter of about 50 μm to 500 μm) and through holes 16a, 16b, 16c, 16d, 16e through which the paste is discharged through the screen mask 18. ... (diameter is about 1.1 to 2 times that of the through-hole 15a, for example). The through holes 15a, 15b, 15c, 15d, 15e,... Are drilled in the screen plate 15, and the through holes 16a, 16b, 16c, 16d, 16e,. These drilling positions overlap, and both penetrate the screen mask 18. The adhesive layer is provided on the lower surface of the shim 16 (the side facing the wiring board substrate 12).
[0039]
For the portions 15, 16, and 17 of the screen mask 18, the materials and properties described above can be used. Further, the thickness of the screen plate 15 is, for example, about 50 μm to 300 μm, and the thickness of the shim 16 is, for example, about 100 μm to 350 μm, and the conductive bump to be formed has a predetermined height with respect to a predetermined bottom size. Can be selected. For example, the conductive bumps to be formed have a bottom diameter of about 150 μm to 300 μm and a height of about 200 μm.
[0040]
A squeegee 19 having an inclination with respect to the vertical direction as shown in the drawing is provided above the stretched screen mask 18 so as to be on standby. As will be described later, the lower end of the squeegee 19 is linearly contacted (in the direction perpendicular to the paper surface) on the screen mask 18, and in this state, from the right to the left in the drawing (that is, above the inclined squeegee, below the squeegee). Is moved in the direction of chasing.
[0041]
As a material of the squeegee 19, a resin such as a urethane resin, a metal, a metal coated with a resin, or the like can be used. Alternatively, since the squeegee 19 is used for printing and wears over time, the squeegee 19 may be configured to be replaceable as an apparatus.
[0042]
FIG. 2 is a plan view (top view) of the screen mask 18 used in the screen printing apparatus shown in FIG. 1, and the same parts as those in FIG. As shown in FIG. 2, the arrangement of the through holes 15a, 16a, etc. is a position according to the layout as a produced wiring board, and the conductive bumps formed by the through holes 15a, 16a, etc. are independent of each other.
[0043]
FIG. 3 is a diagram showing a state of the next stage of the screen printing machine shown in FIG. 1, and the components already described are assigned the same numbers. As shown in the figure, the screen mask 18 is brought into contact with the main surface of the wiring board substrate 12 by the downward movement of the screen mask extending portions 13 and 14 (or the printing table 11 moves upward). (You may make it like this). And the squeegee 19 is contact | abutted on the screen mask 18 near the right end of a figure.
[0044]
A conductive paste 20 is supplied on the screen mask 18 in the direction in which the squeegee 19 travels. Such supply of the conductive paste 20 can be performed by providing a nozzle for supplying paste in front of the squeegee 19 and moving it with the movement of the squeegee 19. Further, in order to adjust the amount of the conductive paste 20 to be supplied, a paste suction nozzle may be provided at the same position. As the conductive paste 20, for example, a paste in which metal particles (silver, gold, copper, solder, etc.) are dispersed in a paste-like resin and a volatile solvent is mixed is used.
[0045]
  BookReference exampleThen, the adhesive layer 17 is attached to the wiring board substrate 12 side of the screen mask 18, and the screen mask 18 and the wiring board substrate 12 are in close contact with each other as a result of the contact. . That is, the screen mask 18 adheres without causing wrinkles.
[0046]
For such close contact, the contact state may be reached by adjusting the tension of the screen mask 18 by the screen mask extending portions 13 and 14. For example, if the tension is adjusted so as to be loosened, the screen mask 18 is slightly bent, so that the screen substrate 18 is gradually brought into contact with the wiring substrate 12 from the portion of the screen mask 18 that is positioned below. Etc.
[0047]
FIG. 4 is a diagram showing a state of the next stage of the screen printing machine shown in FIG. 3, and the components already described are assigned the same numbers. As shown in the drawing, the squeegee 19 moves on the screen mask 18 from the vicinity of the right end of the drawing to the vicinity of the left end of the drawing in a direction perpendicular to the contact line while being in contact with the screen mask 18.
[0048]
As a result, the conductive paste 20 is supplied and filled into the through holes 15a, 16a and the like of the screen mask 18 (the filled conductive paste is indicated by reference numerals 20a, 20b, 20c, 20d, 20e,...). Here, among the through holes 15a, 16a, etc., the through holes 16a, etc. provided in the shim 16 are larger in diameter than the through holes 15a, etc. provided in the screen plate 15, so that the side walls of the through holes 16a, etc. The conductive paste 20a or the like does not come into contact with the conductive paste 20a, but the bottom surface of the conductive paste 20a or the like comes into contact with the wiring board substrate 20.
[0049]
Here, the filling amount of the conductive paste 20a and the like into the through holes 15a and 16a is highly uniform. This is because the adhesion between the screen mask 18 and the wiring board substrate 12 is made uniform by the adhesive layer 17, and the distance from the upper surface of the wiring board substrate 12 to the upper surface of the screen mask 18 is the surface of the screen mask 18. Because it is uniform.
[0050]
FIG. 5 is a diagram showing a state of the next stage of the screen printing machine shown in FIG. 4, and the components already described are given the same numbers. As shown in the figure, the squeegee 19 is retracted above the screen mask 18. Then, by moving the screen mask 18 on which the screen mask extending portions 13 and 14 are extended upward (or the printing stand 11 may be moved downward), this is connected to the wiring board substrate 12. Quarantine.
[0051]
By such an operation, the conductive paste 20a filled in each through-hole 15a, 16a, etc. is divided, and a pointed (= conical) conductive bump 21a is formed on the wiring board substrate 12. , 21b, 21c, 21d, 21e, ... are formed. The remaining portion of the conductive paste 20a remains in the through holes 15a of the screen plate 15 and the like. This remaining amount is a material for forming conductive bumps when the conductive paste 20 is printed on the next wiring board substrate.
[0052]
The conductive bumps 21a and the like formed here are separated from the conductive paste 20a and the like filled in the respective through holes 15a and 16a at a larger ratio and formed. This is because the shim 16 facing the wiring board substrate 12 functions as a spacer to increase the filling amount and does not come into contact with the filled conductive paste 20a or the like, so that the conductive paste 20a or the like is placed on the screen mask 18 side. This is because it does not contribute to the pulling force. Therefore, the conductive bumps 21a and the like can be formed with a high aspect.
[0053]
Further, as described above, since the filling amount of the conductive paste 20a into the through holes 15a, 16a, etc. is made uniform, the height and shape of the conductive bumps 21a, etc. are also highly uniform. The variation in height (percentage of the height of the conductive bumps 21a, etc.) can be made, for example, about 1/3 (about 5% in terms of the above percentage) when using a screen mask without the adhesive layer 17, for example. .
[0054]
Subsequent to the above steps, the wiring board substrate 12 on which the uniform and high aspect conductive bumps 21a and the like are formed is dried at, for example, hundreds of degrees Celsius to cure the conductive bumps 21a and the like. The wiring board substrate 12 having the cured conductive bumps 21a can be laminated and pressed with a semi-cured insulating plate (prepreg), and the prepreg can be penetrated by the conductive bumps 21a to form an interlayer connector.
[0055]
Such an interlayer connection body has improved connection reliability due to the higher uniform aspect ratio as described above, and can be used to meet the fine patterning required as a wiring board. Moreover, since the choice of a material can also be expanded as a prepreg to be used (for example, a harder thing can also be used), cost and productivity can be improved.
[0056]
  Next, the screen printing method according to the present inventionThe fruitThe embodiment will be described with reference to FIG. FIG. 6 shows a screen printing method according to the present invention.The fruitIt is a schematic diagram which shows embodiment, The same number is attached | subjected to the component already demonstrated. The screen printing method of this embodiment isReference example above1 to FIG. 4 is almost the same as the operation.
[0057]
  That is,Reference example aboveThe operation shown in FIG. 6 is performed instead of the operation shown in FIG. In the case shown in FIG. 5, the screen mask 18 is temporarily isolated from the wiring board substrate 12, but in this embodiment, the screen mask 18 is wound on the outer cylindrical surface of the roll 25 as shown in the figure. In this way, the screen mask 18 is isolated from the wiring board substrate 12.
[0058]
According to such a method for isolating the screen mask 18, the screen mask 21 is isolated from the wiring board substrate 12 in a linear manner. Therefore, for example, even if the arrangement density of the conductive bumps 21a and the like on the wiring board substrate 12 varies greatly depending on the location, the screen mask 21 is uniformly isolated regardless of the location by avoiding the deflection of the screen mask 21. be able to. That is, it is possible to form the conductive bumps 21a and the like in which the separation of the screen mask 21 from the wiring board substrate 12 is made more uniform and the height variation is further reduced.
[0059]
Moreover, you may make it equip the roll 25 with a magnet (permanent magnet or electromagnet) so that a magnetic force line may generate | occur | produce from the outer cylinder surface of the roll 25 outside. In this way, when the screen mask 18 contains a magnetic material, the roll 25 can more reliably wind the screen mask 18.
[0060]
Further, even if the roll 25 is provided with a vacuum suction function, it is possible to obtain an effect that the screen mask 18 is more reliably wound by the roll 25. In this case, suction holes are formed on the outer cylinder surface of the roll 25.
[0061]
  Next, aboveReference examples,A screen mask that can be used in the embodiment will be further described with reference to FIG. FIG. 7 is a cross-sectional view for explaining an example of the manufacturing process of the screen mask, and the same reference numerals are given to the components described in FIG.
[0062]
First, as shown in FIG. 7A, the screen plate 15 is formed. The screen plate 15 is made of a material as described above, and through holes 15n,. Laser machining, plasma machining, etching, drilling, electric discharge machining, electroforming, or the like can be used for forming the through holes 15n.
[0063]
At the same time, as shown in FIG. 7B, a shim 16 and an adhesive layer 17 are formed as screen printing spacers. The shim 16 is made of a material as described above, and through holes 16n,... Are formed at positions corresponding to the layout as a produced wiring board. The diameter of the through holes 16n,... Is about 1.1 to 2 times the diameter of the through holes 15n,. The pressure-sensitive adhesive layer 17 may be formed in advance on one surface of the shim 16, or the pressure-sensitive adhesive layer 17 may be formed by, for example, applying a pressure-sensitive adhesive material after forming the through holes 16n.
[0064]
  Next, the screen plate 15 and the shim 16 are bonded together as shown in FIG. Each known method can be used for this bonding. For example, an adhesive or a double-sided adhesive tape can be used. As described above,Reference examples ofA screen mask that can be used in the embodiment can be obtained.
[0065]
  Next, aboveReference examples,Another screen mask that can be used in the embodiment will be further described with reference to FIG. FIG. 8 is a cross-sectional view for explaining another example of the manufacturing process of the screen mask.
[0066]
In this screen mask, the shim, which is the main part of the screen printing spacer, is manufactured as the same member, not as a separate member. That is, for example, a screen plate 15A having a shim thickness is prepared, and the through-hole 15An has a small diameter from one side to the middle and a thickness from the other side to the middle. Then, a hole having a larger diameter is formed so as to be aligned with and penetrate the hole having the smaller diameter. Such through-holes can be formed by using any one of laser processing, plasma processing, etching, drilling, electric discharge processing, electroforming, etc. from both sides. The relationship between the diameter and size is as described above.
[0067]
And the adhesion layer 17 is formed by application | coating of the adhesion material, for example in the surface in which the hole with a larger diameter was formed. As described above, another screen mask that can be used in each of the above embodiments can be obtained.
[0068]
According to such a screen mask, the structure as a screen mask can be simplified and the production of a screen mask and the handling in screen printing can be facilitated.
[0069]
FIG. 9 is a view showing a modification of the screen mask shown in FIG. 8, and corresponding portions are denoted by the same reference numerals. In this case, the longitudinal sectional shape of the through holes 15Bn,... Is different from that shown in FIG. As described above, the hole having the larger diameter may be configured such that the conductive paste filled from the hole having the smaller diameter is not in contact with the side wall. In this sense, such a U-shaped vertical cross section, and other vertical cross sections such as a tapered shape, an arc shape, a semicircular shape, and a semielliptical shape may be used.
[0070]
The formation of the hole having such a vertical cross-sectional shape can be performed by appropriately applying or combining the laser processing, plasma processing, etching, drilling, electric discharge processing, and electroforming methods described above.
[0071]
【The invention's effect】
  As detailed above, according to the present invention,, BaeA toast-like object can be uniformly and bulkyly attached to a substrate.
[Brief description of the drawings]
[Figure 1]Reference exampleThe figure which shows typically the screen printer for performing the screen printing method which concerns on.
FIG. 2 is a plan view of a screen mask 18 used in the screen printing apparatus shown in FIG.
FIG. 3 is a diagram showing a state of the next stage of the screen printing machine shown in FIG. 1;
4 is a diagram showing a state of the next stage of the screen printing machine shown in FIG. 3. FIG.
FIG. 5 is a diagram showing a state of the next stage of the screen printing machine shown in FIG. 4;
FIG. 6 shows a screen printing method according to the present invention.The fruitThe schematic diagram which shows embodiment.
FIG. 7 is a cross-sectional view illustrating a manufacturing process of a screen mask that can be used in an embodiment of the present invention.
FIG. 8 is a cross-sectional view illustrating another screen mask manufacturing process that can be used in the embodiment of the present invention.
FIG. 9 is a cross-sectional view illustrating a manufacturing process of still another screen mask that can be used in the embodiment of the present invention.
FIG. 10 is a diagram schematically illustrating a method for forming conductive bumps as fine structures on a wiring board or metal foil using screen printing (conventional diagram).
[Explanation of symbols]
  DESCRIPTION OF SYMBOLS 11 ... Printing stand 12 ... Wiring board base material 13, 14 ... Screen mask extension part 15 ... Screen board 15a, 15b, 15c, 15d, 15e ... Through-hole 16 ... Shim 16a, 16b, 16c, 16d, 16e ... Through-hole DESCRIPTION OF SYMBOLS 17 ... Adhesive layer 18 ... Screen mask 19 ... Squeegee 20, 20a, 20b, 20c, 20d, 20e ... Conductive paste 21a, 21b, 21, 21c, 21d, 21e ... Conductive bump 25 ... Roll

Claims (3)

A screen printing spacer comprising a support plate and an adhesive layer attached to one side of the support plate, and disposed on the opposite side of the surface of the screen printing spacer to which the adhesive layer is attached. A screen mask having a screen plate, wherein the screen plate is provided with a through hole at a predetermined position, and the support plate has a second through hole having a diameter larger than the through hole overlapping the position of the through hole. A step of contacting the screen printing spacer side of the screen mask arranged in a plane with the substrate to be printed;
Filling the through hole of the screen mask with a paste with a squeegee provided on the surface of the screen mask opposite to the surface of the screen mask in a state in which the screen mask is in surface contact with the substrate; ,
Separating the screen mask having the paste in the through-hole from the substrate,
In the step of isolating the screen mask having the paste in the through-hole from the printing surface, a roll is arranged on the screen mask and the arranged roll is rolled to wind the screen mask onto the roll. A screen printing method, characterized in that   The screen printing method according to claim 1, wherein the roll has a magnetic force, and the magnetic force is used to wind the screen mask on the roll.   The screen printing method according to claim 1, wherein the roll has a vacuum suction function, and the vacuum suction function is used to wind the screen mask on the roll.

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