JP4200450B2 - Manufacturing method of chip-type fuse - Google Patents

Description

  The present invention relates to a method of manufacturing a chip-type fuse that is mounted on, for example, a printed circuit board, and more particularly to formation of an electrode thereof.

  As a chip-type fuse using a fuse wire, for example, there are those disclosed in Patent Documents 1 and 2.

  The chip-type fuse of Patent Document 1 has a substantially rectangular parallelepiped base made of an insulator. In the center of the upper surface of the base, a recess opened on the upper surface side is formed. The lower surface of a substantially rectangular parallelepiped lid made of an insulator is in contact with the upper surface of the base. The lid is formed with a recess opened at the lower surface of the lid at a position corresponding to the recess of the base. A hollow portion is formed by these concave portions. A metal terminal extends from the upper surface on both sides of the recess of the base to both ends of the base and extends downward along the end surface of the base. A fuse wire is disposed across both ends of the hollow portion, and both ends thereof are soldered to the terminal member.

  In the chip-type fuse of Patent Document 2, a recess for forming an internal space is formed at the center of the upper surface of a rectangular parallelepiped base of an insulator. Recesses for receiving metal terminals are respectively formed on both sides thereof. An inner end portion of the metal terminal is disposed in the recess for housing the metal terminal. The metal terminal extends outward from the inner end portion, is bent downward at the end surface of the base, and is further along the bottom surface of the base. And bent inside the base. Between the inner end portions of the metal terminals, a fuse wire is disposed across the recess for forming the internal space, and both ends thereof are soldered to the inner end portions of the metal terminals. The upper surface of the base is covered with a lid, and a concave portion for forming an internal space is formed on the lower surface of the lid so as to correspond to the concave portion for forming the internal space of the base.

U.S. Pat. No. 4,608,548 Japanese Utility Model Publication No.59-119545

  In the chip type fuses shown in Patent Documents 1 and 2, the base, lid, metal terminal, and fuse wire are individually formed, the fuse wire and the metal terminal are arranged on the base, and the fuse wire and the metal terminal are soldered. It had to be attached, and it took time to produce it, and it was not suitable for mass production.

  An object of this invention is to provide the manufacturing method of the chip-type fuse which can be mass-produced.

  In the chip-type fuse manufacturing method according to the present invention, first, a semi-finished product of a fuse is manufactured. This fuse semi-finished product has at least one column. In the columnar body, a plurality of through holes penetrating between the upper and lower surfaces of the insulating substrate are formed in a row at a predetermined interval. In the row body, a hollow portion is further formed in each of the insulating substrates between the adjacent through holes. In this array, fuse wires are inserted through the through holes and the hollow portions in a straight line. It is desirable to arrange the fuse wire so that no one is in contact with the hollow portion. The fuse wires protruding around the upper and lower surfaces of each through hole, in each through hole and in each through hole are plated together. The substrate is cut along a cutting line passing through each through hole.

  According to this manufacturing method, since the fuse wire protruding around the upper and lower surfaces of each through hole, in each of the through holes and in each of the through holes is integrally plated, the substrate is later formed by one step of this plating. Is cut to form a portion serving as a terminal of the chip-type fuse, and a fuse wire is electrically connected to the portion serving as the terminal. Therefore, as in Patent Documents 1 and 2, it is not necessary to perform a plurality of processes such as forming a metal terminal in advance, placing it on the base, and soldering it to the fuse wire, which is suitable for mass production of chip-type fuses. ing.

  The substrate may be provided with a plurality of the columnar bodies in parallel with each other. In this case, the cutting is performed along a cutting line that passes through the corresponding through hole of each columnar body and a cutting line that passes between the columnar bodies. By providing a plurality of columnar bodies in this way, chip-type fuses can be further mass-produced.

  Alternatively, the substrate can be divided into an upper substrate and a lower substrate. In this case, a plurality of upper through holes and a plurality of lower through holes are formed in the upper and lower substrates. The upper substrate and the lower substrate are bonded to each other, and this bonding is performed so that the corresponding ones of the upper through hole and the lower through hole match each other. A recess for forming the hollow portion is formed at least between the lower through holes of the lower substrate. A recess for forming a hollow portion can also be provided at the position of the upper substrate corresponding to the recess for forming the hollow portion of the lower substrate. Before the bonding, the fuse wire is disposed so as to be positioned in the lower through hole of the lower substrate in the columnar body and the hollow forming recess of the lower substrate.

  With this configuration, it is only necessary to arrange one fuse line on the lower substrate of one columnar body, which facilitates manufacture.

  As described above, according to the present invention, chip-type fuses can be easily mass-produced.

  1A to 1C show a chip-type fuse manufactured by a chip-type fuse manufacturing method according to an embodiment of the present invention. The chip-type fuse 1 has a main body 2 made of an insulator, for example, a glass epoxy substrate. The main body 2 is formed in a substantially rectangular parallelepiped shape, for example, and has a hollow portion 4 therein. A fuse wire 6 is disposed in the hollow portion 4 in a non-contact manner with the inner peripheral surface of the hollow portion 4. Both ends of the fuse wire 6 protrude outward from both ends of the main body 2. The protruding ends are electrically connected to terminals 8a and 8b formed on the lower surface and upper surface of the main body 2 by plating.

  Specifically, the main body 2 includes a lower main body 2a and an upper main body 2b, and both have the same length, width, and height. A substantially rectangular opening of the lower recess 4a is formed in the center of the upper surface of the lower main body 2a along the length direction of the lower main body 2a. From this opening, the lower recess 4a is recessed substantially perpendicularly to the lower surface side of the lower body 2a. Similarly, a substantially rectangular opening of the upper recess 4b is formed in the center of the lower surface of the upper body 2b along the length direction of the upper body 2b, and the upper recess 4b extends from the opening to the upper side of the upper body 2b. It is recessed almost vertically. In a state in which the upper main bodies 2a and 2b are overlapped, the lower recess 4a and the upper recess 4b coincide with each other to form a hollow portion 4. In addition, arc-shaped notches 10a and 10b are formed at the centers of both ends of the lower main body 2a and the upper main body 2b so as to coincide with each other.

  The fuse wire 6 is linear, and is disposed on the joint surface between the lower main body 2a and the upper main body 2b in a non-contact state with any portion of the hollow portion 4, and both end portions thereof protrude into the notches 10a and 10b. Yes.

  The lower terminal 8a and the upper terminal 8b are formed by plating so as to surround the lower notches 10a and 10b. As shown in FIG. 1B, the plating extends to the inner peripheral surfaces of the lower notch 10a and the upper notch 10b, and further to the entire circumference of the fuse wire 6 protruding from the joint portion of the lower notch 10a and the upper notch 10b. It also extends. The plating layer on the inner peripheral surface of the notch is indicated by reference numerals 12a and 12b, and the plating layer at the protruding end of the fuse wire 6 is indicated by reference numeral 14.

  Each of the lower terminal 8a, the upper terminal 8b, and the plating layers 12a, 12b, and 14 includes a plurality of plating layers as shown in an enlarged view in FIG. The lower terminals 8a and 8b are composed of electroless copper plating layers 16a and 16b, electrolytic copper plating layers 18a and 18b formed on the outer surfaces thereof, electrolytic nickel plating layers 20a and 20b formed on the outer surfaces thereof, and outer surfaces thereof. The electroplated tin plating layers 22a and 22b are formed.

  The plating layers 12a and 12b are formed by electroless copper plating layers 24a and 24b formed integrally with the electroless copper plating layers 16a and 16b on the inner peripheral surfaces of the upper and lower notches 10a and 10b, and the electroless copper plating layer. Electrolytic copper plating layers 26a and 26b formed integrally with the electrolytic copper plating layers 18a and 18b on the outer surface side of 24a and 24b, and electrolytic nickel plating layers 20a and 20b on the outer surface side of the electrolytic copper plating layers 26a and 26b. And electrolytic tin plating layers 30a and 30b integrally formed with the electrolytic tin plating layers 22a and 22b on the outer surface side of the electrolytic nickel plating layers 28a and 28b. .

  The plating layer 14 is formed all around the protruding end of the fuse wire 6, and is formed integrally with the electroless copper plating layers 24 a and 24 b, and the outer surface side of the electroless copper plating layer 32. Furthermore, the electrolytic copper plating layer 34 formed integrally with the electrolytic copper plating layers 26a, 26b, and the electrolytic nickel plating layer 36 formed integrally with the electrolytic nickel plating layers 28a, 28b on the outer surface side of the electrolytic copper plating layer 34. And an electrolytic tin plating layer 38 formed integrally with the electrolytic tin plating layers 30a and 30b on the outer surface side of the electrolytic nickel plating layer 36.

  The electroless copper plating layers 16a, 16b, 24a, 24b, and 32 are formed simultaneously. Similarly, the electrolytic copper plating layers 18a, 18b, 26a, 26b, and 34 are formed simultaneously. Electrolytic nickel plating layers 20a, 20b, 28a, 28b, 36 are also formed at the same time, and electrolytic tin plating layers 22a, 22b, 30a, 30b, 38 are also formed at the same time. In addition, in the figure (c), the thickness of each plating layer is drawn exaggerated considerably.

  This chip-type fuse is manufactured as follows, for example. First, a semi-finished product 40 as shown in FIG. The semi-finished product 40 includes a substrate 42 and a long fuse wire 44.

  The substrate 42 is made of an insulator, for example, a lower substrate 42a and an upper substrate 42b made of glass epoxy resin. As shown in FIGS. 2A and 2B, the lower substrate 42a has a substantially rectangular or square planar shape, and the lower through holes 46a are arranged in a row at predetermined intervals along one side thereof. Are centered on the same straight line. These lower through holes 46a are circular holes that penetrate the upper and lower surfaces of the lower substrate 42a. A lower concave portion 48a for forming a hollow portion is formed between adjacent lower through holes 46a. The lower concave portion 48a is located at an equal distance from each of the adjacent lower through holes 46a, opens in a long hole shape on the upper surface of the lower substrate 42a, and is recessed substantially vertically toward the lower surface side of the lower substrate 42a by a predetermined depth. It is. The lower recess 48a is formed so that its longitudinal direction is along the one side, and its center line is located on a straight line connecting the centers of the respective lower through holes 46a. In this way, the lower through hole 46a and the lower recess 48a are formed in a line. A plurality of rows are formed at predetermined intervals in the direction of the other side perpendicular to the one side.

  The upper substrate 42b has the same size and the same material as the lower substrate 42a, and the upper through hole 46b is formed in the same size as the lower through hole 46a. The upper substrate 42b is in the position corresponding to the lower recess 48a. An upper recess 48b is formed in the same size. However, the upper concave portion 48b is open on the lower surface side and is recessed on the upper surface side (see FIG. 4B).

  As shown in FIGS. 3A and 3B, on the upper surface side of the lower substrate 42a, a groove 50a opened on the upper surface side in a straight line connecting the centers of the lower through holes 46a and the lower recesses 48a in each row. Is formed from the other side to the side opposite to the other side. A plurality of these grooves 50a are formed at predetermined intervals as shown in FIG. 3C. Similarly, the upper substrate 42b is linearly connected to the centers of the upper through holes 46b and the lower recesses 48b in each row. In addition, the groove 50b opened on the upper surface side is formed from the other side to the side opposite thereto.

  Next, as shown in FIG. 4A, a long fuse wire 44 is disposed on each groove 50a of the lower substrate 42a from the other side to the side opposite thereto. Next, as shown in FIG. 4B, an adhesive 52 is applied to portions other than the upper through hole 46b and the upper recess 48a on the lower surface of the upper substrate 42b, and the lower through holes 46a and the upper through holes 46b are formed. Bonding is performed as shown in FIG. 5C so that the corresponding ones match and the corresponding ones of the lower recesses 48a and the upper recesses 48b match.

  As a result, through holes 46 arranged vertically and horizontally are formed by corresponding lower through holes 46a and upper through holes 46b, and a plurality of hollows arranged vertically and horizontally by corresponding lower recesses 48a and upper recesses 48b. A portion 48 is formed, and a long fuse wire 44 is inserted into the through hole 46 and the hollow portion 48 in the same row. This insertion position is on the joint surface between the lower substrate 42 a and the upper substrate 42. In this state, the long fuse wire 44 is not in contact with the hollow portion 48 in each hollow portion 48. Further, a portion of the long fuse wire 44 extending from the hollow portion 48 passes through a joint portion between the lower through hole 46 a and the upper through hole 46 b in each through hole 46 and enters the adjacent hollow portion 48. is doing. The through-holes 46, the hollow portions 48, and the long fuse wires 44 in the same row form a row-like body. A plurality of the row-like bodies are formed at a predetermined interval along the other side. In this way, the semi-finished product 40 is manufactured.

  Next, as shown in FIG. 4E, the periphery of each lower through hole 46a on the lower surface of the lower substrate 42a, the periphery of each upper through hole 46b on the upper surface of the upper substrate 42a, and the inner peripheral surface of each lower through hole 46a. A plating layer 54 is integrally formed on the inner peripheral surface of each upper through-hole 46b and a portion of each long fuse wire 46 in each through-hole 46. As described above, the plating layer 54 is formed by stacking the electroless copper plating layer, the electrolytic copper plating layer, the electrolytic nickel plating layer, and the electrolytic tin plating layer in the order described above from the lower substrate 42a and the upper substrate 42b. Is formed by. As shown in FIG. 5, the plating layer 54 is formed so as to be connected to the plating layer 54 around the corresponding through hole 46 of the adjacent columnar body.

  Then, by cutting the substrate 42 along the cutting lines indicated by the dotted lines in FIGS. 5 and 4 (e), a large number of chip-type fuses 1 are simultaneously formed. In addition, there are cutting lines that pass through the center of the corresponding through-hole 46 in each columnar body, and those that pass through the center of the interval between adjacent columnar bodies, and further, on each side of the substrate 42 Some cut along.

  According to such a manufacturing method of the chip-type fuse 1, the portions that become the terminals 8 a and 8 b of the chip-type fuse 1 by cutting and the connection portions between the terminals 8 a and 8 b and the fuse line 6 are formed. Since the plating layer 54 is formed, it is not necessary to form a terminal separately from the main body 2 of the chip-type fuse 1 or to connect the terminal and the fuse wire, so that mass production is easy. Can be done.

  In the above embodiment, as shown in FIG. 1, the recesses 48a and 48b are formed in the lower substrate 42a and the upper substrate 42b, respectively. However, the recesses can be formed only in the lower substrate 42a, for example. However, in this case, the height of the lower substrate 42a is made higher than that of the lower substrate 42a shown in the above embodiment, the depth of the lower recess 48a is also increased, and the long fuse wire 44 is connected to the lower recess 42a. It is desirable to be positioned approximately at the center of the height of 48a. Therefore, it is desirable that the groove 50a formed in the lower substrate 48a is formed deeper than in the case of the above embodiment. However, the groove 50b of the upper substrate 48b is unnecessary. If comprised in this way, since only the upper through-hole 46b should be formed in the upper board | substrate 42b, the manufacture becomes easy.

  In the above-described embodiment, a plurality of columnar bodies are formed on the insulating substrate 42. However, at least one columnar body may be formed at a minimum.

It is a perspective view of a chip type fuse manufactured by a manufacturing method of one embodiment of the present invention, a central longitudinal section, and an enlarged view of a central longitudinal section. It is a figure which shows the initial stage process of the manufacturing method of one Embodiment of this invention. It is a figure which shows the intermediate process of the manufacturing method of one Embodiment of this invention. It is a figure which shows the remaining processes of the manufacturing method of one Embodiment of this invention. It is a figure which shows the last process of the manufacturing method of one Embodiment of invention.

Explanation of symbols

42 Insulating substrate 44 Long fuse wire 46 Through hole 48 Hollow part

Claims (3)

A plurality of through holes penetrating between the upper and lower surfaces of the insulating substrate are formed in a row at a predetermined interval, and the hollow body is formed in each of the insulating substrates between the adjacent through holes. Forming a semi-finished fuse product in which a long fuse wire is inserted through each through hole and each hollow portion in a straight line; and
The process of integrally plating the fuse wires protruding around the upper and lower surfaces of each through hole, in each through hole and in each through hole;
Cutting the substrate along a cutting line passing through each through hole,
A method for manufacturing a chip-type fuse.   2. The chip-type fuse manufacturing method according to claim 1, wherein a plurality of the columnar bodies are provided in parallel to each other on the substrate, and the cutting is performed by a cutting line passing through a corresponding through hole of each of the columnar bodies. A method for manufacturing a chip-type fuse, which is performed along a cutting line passing between the respective columns. 2. The method of manufacturing a chip-type fuse according to claim 1, wherein the substrate is divided into an upper substrate and a lower substrate, and a plurality of upper through holes and a plurality of lower through holes are formed in the upper and lower substrates. The upper substrate and the lower substrate are bonded by matching the corresponding ones of the upper through hole and the lower through hole, and at least the lower substrate has the hollow portion formed between the lower through holes. A chip-type fuse manufacturing method in which a recess is formed and the fuse wire is positioned before the bonding so that the fuse wire is positioned in a lower through hole in the columnar body and in the recess for forming the hollow portion.

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