JP4209572B2 - Transport system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier system for efficiently carrying sheets for conveyance in a process. SOLUTION: In this carrier system of the manufacturing line of semiconductor or liquid crystals for performing conveyance between processes by cassette conveyance and conveyance in a process by sheet conveyance, respectively, running paths 8A, 8B, and 8C of a carrier path 8 in a process are composed independently, in a plurality of steps in upper and lower directions, sheet conveyance vehicles 7A, 7B, and 7C with a placement stand 73 for placing a substrate 6 are arranged at each of the running paths 8A, 8B, and 8C, and at the same time, a load port 9 for simultaneously passing a substrate 6 among the sheet conveyance vehicles 7A, 7B, and 7C at the same position, is arranged along the carrier in-process path 8.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a transport system for a semiconductor or liquid crystal production line in which transport between processes is performed by cassette transport, and transport within a process is performed by single-wafer transport, and in particular, single-wafer transport in in-process transport is efficient. The present invention relates to a transport system that can be performed automatically.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in a semiconductor or liquid crystal production line, a plurality of semiconductor or liquid crystal substrates (hereinafter simply referred to as “substrates” in this specification) are mainly housed in a cassette and in a process. A cassette conveyance method for carrying was adopted.
[0003]
[Problems to be solved by the invention]
By the way, this cassette carrying system has the advantage that the substrate can be carried in a clean state without being attached to the substrate because the substrate is carried in a state of being accommodated in the cassette.
[0004]
However, with the recent increase in size of substrates, cassettes have become larger and heavier, and equipment such as transport carts and stockers used to transport and store cassettes have been increased in size, including buildings. There was a problem that the construction cost and maintenance cost of the equipment increased extremely.
[0005]
Also, when transporting large, heavy cassettes, increasing the transport speed is problematic in terms of safety, etc., so it is difficult to shorten the tact time and the transport cannot be performed efficiently. was there.
[0006]
On the other hand, along with the increase in size of substrates, it has been proposed and put into practical use that conveyance between processes is performed by cassette conveyance and conveyance within a process is performed by single wafer conveyance.
In this single wafer transfer, since the substrates are transferred one by one, it is possible to increase the transfer speed, and there is an advantage that the tact time can be shortened as compared with the cassette transfer, but using the conventional transfer system as it is, If only the in-process conveyance is changed from the cassette conveyance to the single wafer conveyance, the conveyance ability will be insufficient.
For example, if one cassette containing 20 glass substrates is transported at intervals of 3 minutes in the conventional cassette transport, the transport time per glass substrate is 3 minutes / 20 sheets = 180. Second / 20 sheets = 9 seconds / 1 sheet.
If this is a single wafer transfer, it is necessary to transfer the glass substrate at intervals of 9 seconds.
However, in the method in which the single-wafer transport vehicle travels on a one-lane travel path, it is difficult to perform stable transport at a high speed of 9 seconds, so it is apparent that the transport capability is insufficient.
[0007]
In view of the problems of the transport system of a semiconductor or liquid crystal production line in which conventional inter-process transport is performed by cassette transport and in-process transport is performed by single-wafer transport, It is an object of the present invention to provide a transport system that can efficiently transport a single sheet.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the transport system of the present invention is a transport system for a semiconductor or liquid crystal production line in which transport between processes is performed by cassette transport, and transport within a process is performed by single wafer transport. A single-wafer transport vehicle that is configured independently in a plurality of stages in the vertical direction so that the travel path of the inner transport path is superimposed in plan view, and is provided with a mounting table on which a substrate is placed on each travel path. A load port that can be disposed and simultaneously transferred to and from each single wafer transport vehicle at the same position is disposed along the in-process transport path, and each single wafer transport vehicle is placed in the load port. The substrate is transferred between the mounting table and the inside of the process. It consists of a frame with a space formed in the center, and is connected to a notch that can be inserted through the arm part of the mounting table of the single wafer transport vehicle and one side having the notch. Engineering in addition to the side to be The cradle forming a recess recessed downwardly to allow insertion of the forks of arranged the transfer device within pivotally, arranged in a plurality of stages in the vertical direction, the single wafer convey the transfer of the substrate It is characterized in that it is performed by the intersection of the loading table of the single-wafer transport vehicle and the loading port of the load port by the raising and lowering operation of the loading table of the vehicle or the loading port.
[0009]
This transport system is configured independently in a plurality of stages in the vertical direction so that the travel paths of the in-process transport path are superimposed in plan view, and each platform has a mounting table on which a substrate is placed. Since the single-wafer transport vehicle is arranged, it is possible to increase the transport capacity without substantially increasing the space of the in-process transport path or increasing the transport speed of the single-wafer transport vehicle. Furthermore, since the load port capable of simultaneously transferring the substrate to and from each single wafer transfer vehicle at the same position is arranged along the in-process transfer path, the transfer operation of the substrate is performed. It is possible to efficiently perform single wafer conveyance in the in-process conveyance including.
[0010]
The load port is composed of a frame having a space formed in the central portion for transferring the substrate between the mounting table of each single wafer transport vehicle and the inside of the process, and the arm portion of the mounting table of the single wafer transport vehicle is It is possible to turn a cradle that has a notch that can be inserted and a recess that is recessed downward so that the fork of the transfer device disposed in the process can be inserted into the other side connected to the side having the notch. , Arranged in multiple stages in the vertical direction, and transfer of the substrate is performed by the intersection of the mounting table of the single-wafer transport vehicle and the receiving port of the load port by the lifting operation of the mounting table of the single-wafer transport vehicle or the receiving port of the load port By doing so, it is possible to simultaneously deliver the substrate between each single wafer transport vehicle and the load port at the same position by a simple mechanism, and also deliver the substrate to the substrate. Hold the unit horizontally to It can be carried out.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a transport system of the present invention will be described with reference to the drawings.
[0012]
FIG. 1 to FIG. 3 show an example of a semiconductor or liquid crystal production line transport system in which inter-process transport is performed by cassette transport and in-process transport is performed by single-wafer transport.
[0013]
This semiconductor or liquid crystal production line conveyance system lays an inter-process conveyance path 1 for carrying a cassette conveyance so that a conveyance vehicle 2 carrying a cassette 3 can travel along the production line. An in-process conveyance path 8 for carrying a single wafer is laid in a direction crossing the conveyance path 1.
[0014]
One or a plurality (two in this embodiment) of the inter-process transfer path 1 is laid according to the semiconductor or liquid crystal production line, and one or a plurality of each of the inter-process transfer paths 1 is provided. The transport vehicle 2 is arranged.
The transport vehicle 2 is configured to be able to deliver a cassette 3 containing a plurality of substrates at a predetermined position on the production line.
[0015]
In the in-process conveyance path 8 for carrying the single wafer conveyance, a single wafer conveyance vehicle 7 is arranged, and further, the stocker 4 is arranged at the intersection of the inter-process conveyance path 1 and the in-process conveyance path 8, The substrate accommodated in the cassette 3 transported along the inter-process transport path 1 can be transferred to the intra-process transport path 8 side.
For this reason, the stocker 4 is provided with a transfer machine 5 for loading and unloading the substrates 6 accommodated in the cassette 3, while a load port 9 is provided at a predetermined position along the in-process transport path 8. It arrange | positions and it is comprised so that the board | substrate 6 can be delivered one by one between the single-wafer conveyance vehicles 7 which drive | work along the in-process conveyance path 8. FIG.
[0016]
As shown in FIG. 2, the in-process conveyance path 8 has a plurality of independent (three stages in this embodiment) traveling paths 8A, 8B, and 8C at predetermined intervals in the vertical direction. Constitute.
The in-process conveyance path 8 configured by the travel paths 8A, 8B, and 8C is configured to be substantially the same as the space occupied by the conventional in-process conveyance path.
In each of the travel paths 8A, 8B, and 8C, the single-wafer transport vehicles 7A, 7B, and 7C that transport the substrates one by one are arranged so as to be able to travel independently without interfering with each other.
[0017]
Each single wafer transport vehicle 7A, 7B, 7C can basically have the same configuration except for a configuration that allows independent traveling without interference with each other, which will be described later.
[0018]
Therefore, here, the single wafer transport vehicle 7A traveling along the traveling path 8A will be described.
The single wafer transport vehicle 7A includes a carriage main body 71 configured to travel along the traveling path 8A, a support base 72 protruding from the side of the carriage main body 71, and a predetermined stroke on the upper portion of the support base 72. The substrate 6 placed so as to be able to be moved up and down, and the substrate 6 placed on the placement table 73 is prevented from directly hitting the downflow and adhering dust or the like to the substrate 6, The substrate 6 is composed of a cover 74 provided above the mounting table 73 so that the substrate 6 can be transported in a clean state.
[0019]
In this embodiment, the single-wafer transport vehicles 7A, 7B, and 7C can independently travel without interfering with each other. The support base 72 is disposed at different positions in the height direction and the horizontal direction.
More specifically, the placement positions of the mounting table 73 and the cover 74 are increased in the order of the single-wafer transport vehicles 7C, 7B, and 7A, and the support table 72 is protruded greatly to the side of the cart body 71. Like that.
[0020]
In addition, a load port 9 is installed at a predetermined position along the in-process conveyance path 8.
As shown in FIGS. 2 to 3, the load port 9 is provided with a support column 91 established on a fixed side such as a floor surface and the support column 91 so that it can be turned by a turning device (not shown). The carriages 7A, 7B, and 7C are configured by receiving bases 92, 93, and 94 that transfer the substrate 6 to and from the mounting base 73 that can be moved up and down.
The receiving bases 92, 93, 94 are arranged at positions (three in this embodiment) corresponding to the mounting bases 73 of the single-wafer transport vehicles 7A, 7B, 7C in the in-process transport path 8. To do.
[0021]
Since each of the cradle 92, 93, 94 basically has the same configuration, here, the uppermost cradle 92 will be described.
The pedestal 92 is formed of a frame having a space at the center thereof, and a cutout 92a is formed on one side thereof so that the thinly formed arm portion 73a of the mounting table 73 can be inserted. On the other side connected to the other side, a recessed portion 92b that is recessed downward so that the fork 11 of the transfer device 10 disposed in the process (on the manufacturing apparatus side) can be inserted is formed.
[0022]
The transfer device 10 disposed adjacent to the load port 9 is configured so that the fork 11 can be combined with the three operations of raising, lowering, raising and lowering, and turning, and each of the pedestals 92, 93, 94 of the load port 9. The substrate 6 can be transferred between the two.
[0023]
Hereinafter, the operation of the transport system of the present invention will be described.
The cassette 3 transported by the transport vehicle 2 traveling along the inter-process transport path 1 is placed on the stocker 4.
A substrate 6 accommodated in the cassette 3 is taken out one by one by a transfer machine 5 arranged in the stocker 4 and is transferred to a single wafer transport vehicle 7A that travels on the travel paths 8A, 8B, 8C of the in-process transport path 8. , 7B, 7C, the closest to the transfer machine 5 is mounted on the mounting table 73 of the single wafer transport vehicle running in the sky.
[0024]
In this way, in this transport system, the travel paths 8A, 8B, and 8C of the in-process transport path 8 are configured independently in a plurality of stages in the vertical direction, and the substrate 6 is placed on each of the travel paths 8A, 8B, and 8C. Since the single wafer transport vehicles 7A, 7B, and 7C having the mounting table 73 to be placed are arranged so as to be able to travel independently without interfering with each other, the travel paths 8A, 8B, and 8C of the in-process transport path 8 are arranged. Without increasing the plane space substantially, and without increasing the transport speed of the single wafer transport vehicles 7A, 7B, 7C, it is possible to increase the transport capability and efficiently perform the single wafer transport in the in-process transport. It will be possible.
[0025]
Then, the single wafer transport vehicles 7A, 7B, and 7C on which the substrate 6 is mounted on the mounting table 73 travel along the predetermined traveling paths 8A, 8B, and 8C of the process transport path 8, but at this time, the mounting table 73 The cover 74 provided above the substrate 6 prevents the downflow from directly hitting the substrate 6 and preventing dust and the like from adhering to the substrate 6, thereby enabling the substrate 6 to be transported while being kept in a clean state. .
[0026]
When the single wafer transport vehicles 7A, 7B, 7C on which the substrate 6 is placed on the mounting table 73 reach the designated load port 9, the single wafer transport vehicles 7A, 7B, 7C stop, It is made to transfer to the receiving bases 92, 93, 94 of the load port 9 from the mounting base 73 of the leaf conveyance vehicles 7A, 7B, 7C.
[0027]
This transfer operation will be described with reference to FIG.
Here, although the single wafer transport vehicle 7A will be described, the same operation is basically performed in the case of the other single wafer transport vehicles 7B and 7C.
[0028]
The single wafer transport vehicle 7A on which the substrate 6 is mounted on the mounting table 73 travels along the predetermined travel path 8A of the process transport path 8 (FIG. 3A) and reaches the position of the designated load port 9. Then, the single wafer transport vehicle 7A stops (FIG. 3B).
At this time, by driving a turning device (not shown) of the load port 9, the corresponding receiving base 92 is turned so as to be positioned below the mounting table 73.
Note that the cradle 92 can be turned after the single-wafer transport vehicle 7A has stopped.
Next, by lowering the mounting table 73, the mounting table 73 passes through the frame of the frame-shaped receiving table 92 (the mounting table 73 and the receiving table 92 intersect), and the substrate 6 is transferred to the single wafer transport vehicle 7A. Is transferred from the mounting table 73 to the receiving table 92 of the load port 9 (FIGS. 3C and 3D).
In the present embodiment, the mounting table 73 is configured to move up and down, but the receiving table 92 can also be configured to move up and down.
Then, by lowering the mounting table 73, when the transfer of the substrate 6 from the receiving table 73 of the single-wafer transport vehicle 7 </ b> A to the receiving table 92 of the load port 9 is completed, the single wafer is transferred for transporting another substrate 6. The substrate 6 is moved to a position facing the transfer device 10 by starting the traveling of the transport vehicle 7A and driving the turning device (not shown) of the load port 9 to turn the receiving base 92. (FIGS. 3E and 3F).
Note that the start of traveling of the single wafer transport vehicle 7A and the turning of the cradle 92 can be performed independently.
[0029]
Then, using the transfer device 10, the substrate 6 is supplied from the cradle 92 of the load port 9 into the process (manufacturing device side).
The transfer device 10 includes a fork 11 configured to be able to perform a combination of three actions of raising / lowering, raising / lowering, and turning, and the fork 11 faces the pedestal 92 of the load port 9 in a state where the fork 11 is depressed. The fork 11 is moved up and down to adjust the height position of the fork 11 to a position where it can be inserted into the recess 92b of the pedestal 92, and then the fork 11 is projected and inserted into the recess 92b of the pedestal 92. To do. When the fork 11 is raised, the substrate 6 is transferred from the pedestal 92 of the load port 9 to the fork 11, and the fork 11 is turned in the opposite direction to supply the substrate 6 into the process (manufacturing apparatus side). .
[0030]
When the substrate 6 is transferred from the process (manufacturing device side) to the mounting table 73 of the single wafer transport vehicle 7A via the transfer device 10 and the receiving port 92 of the load port 9, the operation opposite to the above operation is performed. To do.
[0031]
Thereby, even when the single wafer transfer vehicle 7A is performing the transfer operation of the substrate 6 at the position of the load port 9, the other single wafer transfer vehicles 7B and 7C are performing the single wafer transfer operation. Traveling over the vehicle 7A, and the other single wafer transport vehicles 7B and 7C can transfer the substrate 6 at the same or other load port 9 position. It is possible to efficiently perform the single wafer conveyance in the in-process conveyance including the work.
[0032]
【The invention's effect】
According to the transport system of the present invention, the travel paths of the in-process transport path are configured independently in a plurality of stages in the vertical direction so as to overlap in plan view, and the substrate is placed on each travel path. Since a single-wafer transport vehicle equipped with a mounting table is arranged, the transport capacity can be increased without substantially increasing the space of the in-process transport path or increasing the transport speed of the single-wafer transport vehicle. In addition, the load port that can transfer the substrate simultaneously with each single wafer transport vehicle at the same position is arranged along the in-process transfer path. It is possible to efficiently perform single wafer conveyance in the in-process conveyance including the transfer work of the semiconductor, the liquid crystal of the semiconductor or the liquid crystal which is conveyed by the cassette conveyance and the in-process conveyance by the single wafer conveyance, respectively. Production line transport system It is possible to smoothly running.
[0033]
The load port is composed of a frame having a space formed in the central portion for transferring the substrate between the mounting table of each single wafer transport vehicle and the inside of the process, and the arm portion of the mounting table of the single wafer transport vehicle is It is possible to turn a cradle that has a notch that can be inserted and a recess that is recessed downward so that the fork of the transfer device disposed in the process can be inserted into the other side connected to the side having the notch. , Arranged in multiple stages in the vertical direction, and transfer of the substrate is performed by the intersection of the mounting table of the single-wafer transport vehicle and the receiving port of the load port by the lifting operation of the mounting table of the single-wafer transport vehicle or the receiving port of the load port By doing so, it is possible to simultaneously deliver the substrate between each single wafer transport vehicle and the load port at the same position by a simple mechanism, and also deliver the substrate to the substrate. Hold the unit horizontally to It can be carried out.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing an example of a transport system of a semiconductor or liquid crystal production line.
FIG. 2 is an explanatory diagram of the main part.
FIG. 3 is an explanatory diagram of the operation.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Inter-process conveyance path 2 Conveyance vehicle 3 Cassette 4 Stocker 5 Transfer machine 6 Substrate 7, 7A, 7B, 7C Single wafer conveyance vehicle 71 Bogie main body 72 Support base 73 Mounting base 8 In-process conveyance path 8A, 8B, 8C Travel path 9 Load port 91 Post 92, 93, 94 Receiving base 10 Transfer device

Claims (1)

In a transport system of a semiconductor or liquid crystal production line that transports between processes by cassette transport and by in-process transport by single wafer transport, the traveling path of the in-process transport path is superimposed in plan view. As described above, each of the plurality of stages in the vertical direction is configured independently, and a single-wafer transport vehicle including a mounting table on which the substrate is placed is disposed on each traveling path, and at the same position, A load port that can transfer the substrate at the same time is arranged along the in-process transfer path, and the substrate is transferred to the load port between the stage of each single wafer transport vehicle and the process. The transfer is made of a frame having a space formed in the center , and is arranged in the process on the other side connected to one side having the notch that can be inserted through the arm portion of the mounting table of the single wafer transport vehicle. So that the fork of the device can be inserted Was the cradle forming a recess recessed downward, pivotally, arranged in a plurality of stages in the vertical direction, sheets by vertical movement of the cradle passes the mounting table or the load port of the single wafer transport vehicle of the substrate A conveyance system characterized in that it is carried out at the intersection of a loading table of a leaf conveyance vehicle and a receiving table of a load port.

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