JP4244100B2

JP4244100B2 - Resin mold

Info

Publication number: JP4244100B2
Application number: JP2000171326A
Authority: JP
Inventors: 実基彦木村; 文人上羽; 正照辻
Original assignee: Honda Motor Co Ltd
Current assignee: Honda Motor Co Ltd
Priority date: 2000-06-07
Filing date: 2000-06-07
Publication date: 2009-03-25
Anticipated expiration: 2020-06-07
Also published as: JP2001347552A

Description

【０００１】
【発明の属する技術分野】
本発明は樹脂成形金型の改良に関する。
【０００２】
【従来の技術】
樹脂成形金型として、例えば▲１▼特開平７−２８５１６９号公報「樹脂成形用金型」や▲２▼実開平６−９７４４号公報「金型」が知られている。
上記▲１▼は、同公報の図１によれば、金型本体１４（符号は公報に記載の符号を流用）を加熱又は冷却のために多孔質焼結金属で形成し、金型本体１４のキャビティに金属、合成樹脂又はセラッミクなどの表面被膜１２を形成し、金型本体１４をバックプレート１６Ｒで覆い、このバックプレート１６Ｒに温調流体供給管２２Ｒ及び温調流体排出管２４Ｒを接続したものである。
上記▲２▼は、同公報の図１によれば、金型１のキャビティ２表面近傍に冷却のために多孔質材の部分域３を形成し、この部分域３にメッキ等の表層７を形成し、この表層７の反対から部分域３に給水路４及び排水路５を接続したものである。
【０００３】
【発明が解決しようとする課題】
しかし、上記▲１▼の樹脂成形用金型では、金型本体１４を多孔質焼結金属で形成し、金型本体１４のキャビティに金属、合成樹脂又はセラッミクなどの表面被膜１２で覆っただけのものなので、温調流体供給管２２Ｒから温調流体排出管２４に向けて金型本体１４に加熱媒体又は冷却媒体を流すときに、キャビティ２の必要部位によって加熱又は冷却の度合いを変化させることはできない。すなわち、複雑に入り組んだキャビティを有する金型には不向きである。
上記▲２▼の金型では、金型１のキャビティ２表面近傍に冷却のために多孔質材の部分域３を形成し、この部分域３にメッキ等の表層７を形成し、この表層７の反対から部分域３に給水路４及び排水路５を接続しただけのものなので、上記▲１▼の樹脂成形用金型と同様に、キャビティ２の必要部位によって冷却の度合いを変化させることはできない。
【０００４】
また、射出成形の場合には、樹脂を供給する射出成形機のスプルーに近い部分は、樹脂を射出した後も比較的高温になる部位である。従って、金型の末端部では金型温度が下がっても、スプルーに近い部分では金型温度が高いことがしばしばある。すなわち、成形時間はスプルーに近い部分の樹脂が硬化するまでの時間に左右されることになり、生産性の向上のためには、詳細に金型温度を検出して金型温度を制御する必要にせまられる。
【０００５】
そこで、本発明の目的は、金型本体の温度を均一化して制御するできる樹脂成形金型を、あるいは、金型本体の温度を部分的に差を付けて制御することのできる樹脂成形金型を提供することにある。
【０００６】
【課題を解決するための手段】
上記目的を達成するために請求項１は、金型本体に、多孔質の焼結金属層を設け、この焼結金属層へ冷却用媒体又は加熱用媒体としての熱媒体を流通させる樹脂成形金型において、焼結金属層を互いに独立させることで複数個の流路を金型本体に形成し、複数個の流路に供給する熱媒体の量及び／又は温度を、個別に制御する制御装置を備えたこと特徴とする。
【０００７】
金型本体に、多孔質の焼結金属層を設け、この焼結金属層へ冷却用媒体又は加熱用媒体としての熱媒体を流通させる樹脂成形金型において、焼結金属層を互いに独立させることで複数個の流路を金型本体に形成し、複数個の流路に供給する熱媒体の量及び／又は温度を、個別に制御する制御装置を備え、熱媒体の量及び／又は温度を緻密に制御する。
すなわち、焼結金属層を互いに独立させることで複数個の流路を金型本体に形成し、複数個の流路に供給する熱媒体の量及び／又は温度を、個別に制御する制御装置を備えることで、熱媒体の量及び／又は温度を緻密に制御し、成形品の品質の向上を図る。
【０００８】
【発明の実施の形態】
本発明の実施の形態を添付図に基づいて以下に説明する。なお、図面は符号の向きに見るものとする。
図１は本発明に係る樹脂成形金型の斜視図であり、後述する樹脂金型装置２０に制御装置６０を設けた樹脂成形システム１０を示す。
樹脂成形システム１０は、樹脂成形品Ｗを形成する樹脂金型装置２０と、この樹脂金型装置２０を制御する制御装置６０とからなる。
樹脂金型装置２０は、樹脂成形金型としての可動側金型３０と樹脂成形金型としての固定側金型４０とから構成するものであって、可動側金型３０に成形凸部３２を形成し、固定側金型４０に成形凹部４２を形成し、これらの成形凹部４２及び成形凸部３２を合せることで樹脂成形品Ｗを成形するためのキャビティ５０を形成するものである。
【０００９】
図２は図１の２−２線断面図であり、可動側金型３０の縦断面を示す。
可動側金型３０は、金型本体３１に形成した成形凸部３２と、金型本体３１に形成した複数個の流路３３Ａ〜３３Ｆ（３３Ｃのみ図示）と、これらの流路３３Ａ〜３３Ｆにそれぞれ形成する多孔質の焼結金属層３４Ａ〜３４Ｆ（３４Ｃのみ図示）と、これらの焼結金属層３４Ａ〜３４Ｆを一括して覆う蓋部材３５と、流路３３Ａ〜３３Ｆに形成それぞれ形成した入水口３６Ａ〜３６Ｆ（３６Ｃのみ図示）及び排水口３７Ａ〜３７Ｆ（３７Ｃのみ図示）とからなる。
固定側金型４０は、金型本体４１に成形凹部４２を備え、金型本体４１に可動側金型３０と略同一の流路、焼結金属層、蓋部材、入水口及び排水口を備えるものであり、詳細な説明は省略する。
【００１０】
図３は図１の３−３線断面図であり、可動側金型３０の横断面を示す。
流路３３Ａは、流路３３Ａの底３９Ａがキャビティ５０に近づくように金型本体３１に形成するものであり、流路３３Ｂ〜３３Ｆについても流路３３Ａと同様に形成したものである。なお、３９Ｂ〜３９Ｆは、それぞれ流路３３Ｂ〜３３Ｆの底を示す。また、３８・・・（・・・は複数個を示す。以下同じ）は流路３３Ａ〜３３Ｆを仕切る流路壁を示す。
焼結金属層３４Ａは、熱媒体（不図示）としての冷却用媒体又は加熱用媒体を流通させるための部材であり、熱媒体は、焼結金属層３４Ａを流通させることで可動側金型３０を強制冷却又は強制加熱を図るための媒体である。また、焼結金属３４Ｂ〜３４Ｆは、焼結金属層３４Ａと同様に形成したものである。
【００１１】
蓋部材３５は、焼結金属層３４Ａ〜３４Ｆを一括して覆うベース部３５ａと、このベース部３５ａに形成した冷却フィン３５ｂ・・・とからなる部材である。
冷却フィン３５ｂ・・・は、流路壁３８・・・の軸線Ｃ・・・上に配置することで、可動側金型３０の放熱効果の促進を図ることを狙ったものである。
【００１２】
図４は図１の４−４断面図であり、可動側金型３０の平面断面を示す。
可動側金型３０は、流路３３Ａ〜３３Ｆの底３９Ａ〜３９Ｆがキャビティ５０に近づくように流路３３Ａ〜３３Ｆを金型本体３１に形成し、この金型本体３１の流路３３Ａ〜３３Ｆに焼結金属層３４Ａ〜３４Ｆを形成し、この焼結金属層３４Ａ〜３４Ｆを蓋部材３５で塞ぎ、焼結金属層３４Ａ〜３４Ｆに冷却用媒体又は加熱用媒体としての熱媒体（不図示）を流通させるようにしものであると言うことができる。従って、キャビティ５０の強度を維持しつつ熱媒体の通路を形成することができる。この結果、耐久性を向上させた樹脂成形金型（可動側金型３０）を得ることができる。
【００１３】
図５は本発明に係る樹脂成形金型の制御装置のブロック図である。
制御装置６０は、金型本体３１の流路３３Ａ〜３３Ｆに熱媒体（不図示）を送るポンプ６１と、熱媒体を貯溜するタンク６２と、入水口３６Ａ〜３６Ｆにそれぞれ設けた流量センセ６３Ａ〜６３Ｆと、入水口３６Ａ〜３６Ｆにそれぞれ設けた流量調節弁６４Ａ〜６４Ｆと、流路３３Ａ〜３３Ｆに設けた温度センサ６５Ａ〜６５Ｆと、これらの温度センサ６５Ａ〜６５Ｆ及び流量センセ６３Ａ〜６３Ｆの情報で流量調節弁６４Ａ〜６４Ｆ及びポンプ６１を制御するコントローラ６６とからなる。なお、本図は流量センセ６３Ａ〜６３Ｆを、流量センセ６３Ａから流量センセ６３Ｆに向かって図面右下がりに表示したが、流量センセ６３Ａ〜６３Ｆは、流路３３Ａ〜３３Ｆの入水口３６Ａ〜３６Ｆからの距離をほぼ同一に、即ち図面横方向に一直線上に配置するものである。
【００１４】
すなわち、可動側金型３０は、金型本体３１に、多孔質の焼結金属層３４Ａ〜３４Ｆを設け、この焼結金属層３４Ａ〜３４Ｆへ冷却用媒体又は加熱用媒体としての熱媒体（不図示）を流通させる樹脂成形金型において、焼結金属層３４Ａ〜３４Ｆを互いに独立させることで複数個の流路３３Ａ〜３３Ｆを金型本体３１に形成し、複数個の流路３３Ａ〜３３Ｆに供給する熱媒体の量及び／又は温度を、個別に制御する制御装置６０を備えたものである。
【００１５】
焼結金属層３４Ａ〜３４Ｆを互いに独立させることで複数個の流路３３Ａ〜３３Ｆを金型本体３１に形成し、複数個の流路３３Ａ〜３３Ｆに供給する熱媒体の量及び／又は温度を、個別に制御する制御装置６０を備えるたので、熱媒体の量及び／又は温度を緻密に制御することができる。この結果、成形品の品質の向上を図ることができる。
【００１６】
以上に述べた可動側金型３０（樹脂成形金型）の作用を次に説明する。
図６（ａ）〜（ｄ）は本発明に係る樹脂成形金型の第１作用説明図であり、可動側金型３０（図３参照）の製作手順の一例を示す。
（ａ）において、金属ブロック５２に成形凸部３２及び流路３３Ａ〜３３Ｆを形成し、金型本体３１を製作する。
（ｂ）において、鉄系金属、アルミニウム系金属若しくはステンレス鋼の金属粒５３・・・を流路３３Ａ〜３３Ｆに充填する。
（ｃ）において、流路３３Ａ〜３３Ｆに金属粒５３・・・を充填済みの金型本体３１を焼結炉５４に入れ、金属粒５３・・・同士を焼結させ、焼結金属層３４を形成する。
【００１７】
（ｄ）において、蓋部材３５で焼結金属層３４Ａ〜３４Ｆを一括して覆い、ボルト締め又は熱溶着を行ない、流路３３Ａ〜３３Ｆを密封する。その後、成形凸部３２面の仕上を行なう。例えば、成形凸部３２面と流路３３Ａの底３９Ａ面との厚さをｔとするときに、厚さｔを２ｍｍから５ｍｍの範囲に設定する。ここで、厚さｔが２ｍｍ以下では成形凸部３２の強度が不足する。また、５ｍｍ以上では冷却効率又は熱効率の悪化を招く。なお、成形凸部３２面と他の流路３３Ｂ〜３３Ｆの底３９Ｂ〜３９Ｆ（図３参照）面との厚さについても同様である。
【００１８】
図７（ａ），（ｂ）は本発明に係る樹脂成形金型の第２作用説明図であり、（ａ）は比較例を示し、（ｂ）は実施例を示す。
（ａ）において、樹脂成形金型としての可動側金型１００は、金型本体１０１に成形凸部１０２を形成し、金型本体１０１に流路１０３を形成し、この流路１０３に焼結金属層１０４を形成し、金型本体１０１に入水口１０６及び排水口１０７を形成したものであって、入水口１０６から熱媒体（不図示）を供給するときに、流路１０３で矢印▲１▼・・・の如く熱媒体は流れる。すなわち、流路１０３の流路中央付近に集中し、両端部分には流すことはできない。従って、可動側金型１００を部分ごとに緻密に管理することはできない。
【００１９】
（ｂ）において、可動側金型３０は、焼結金属層３４Ａ〜３４Ｆを互いに独立させることで複数個の流路３３Ａ〜３３Ｆを金型本体３１に形成し、複数個の流路３３Ａ〜３３Ｆに供給する熱媒体の量及び／又は温度を、個別に制御する制御装置６０を備えるたので、熱媒体の量及び／又は温度を緻密に制御することができ。この結果、成形品の品質の向上を図ることができる。
【００２０】
尚、実施の形態では図５に示すように、温度センサ６５Ａ〜６５Ｆを流路３３Ａ〜３３Ｆに配置したが、これに限るものではなく、例えば、射出成形機のスプルーに近い部分の樹脂成形金型に配置したものであってもよい。
また、実施の形態では図３に示すように、６個の流路３３Ａ〜３３Ｆを形成したが、これに限るものではなく、複数の流路を形成したものであればよい。
【００２１】
【発明の効果】
本発明は上記構成により次の効果を発揮する。
請求項１は、金型本体に、多孔質の焼結金属層を設け、この焼結金属層へ冷却用媒体又は加熱用媒体としての熱媒体を流通させる樹脂成形金型において、焼結金属層を互いに独立させることで複数個の流路を金型本体に形成し、複数個の流路に供給する熱媒体の量及び／又は温度を、個別に制御する制御装置を備えたので、熱媒体の量及び／又は温度を緻密に制御することができる。この結果、成形品の品質の向上を図ることができる。
【図面の簡単な説明】
【図１】本発明に係る樹脂成形金型の斜視図
【図２】図１の２−２線断面図
【図３】図１の３−３線断面図
【図４】図１の４−４断面図
【図５】本発明に係る樹脂成形金型の制御装置のブロック図
【図６】本発明に係る樹脂成形金型の第１作用説明図
【図７】本発明に係る樹脂成形金型の第２作用説明図
【符号の説明】
３０…樹脂成形金型（可動側金型）、３１…金型本体、３３Ａ〜３３Ｆ…流路、３４Ａ〜３４Ｆ…焼結金属層、５０…制御装置。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement of a resin molding die.
[0002]
[Prior art]
As resin molding dies, for example, (1) Japanese Patent Laid-Open No. 7-285169 “Resin Mold” and (2) Japanese Utility Model Publication No. 6-9744 “Mold” are known.
According to the above (1), according to FIG. 1 of the publication, the mold body 14 (the reference numeral is the same as the reference numeral) is formed of a porous sintered metal for heating or cooling. A surface coating 12 made of metal, synthetic resin, ceramic, or the like is formed in the cavity, and the mold body 14 is covered with a back plate 16R, and a temperature control fluid supply pipe 22R and a temperature control fluid discharge pipe 24R are connected to the back plate 16R. Is.
According to the above (2), according to FIG. 1 of the publication, a partial region 3 of a porous material is formed in the vicinity of the surface of the cavity 2 of the mold 1 for cooling, and a surface layer 7 such as plating is formed in the partial region 3. The water supply channel 4 and the drainage channel 5 are connected to the partial area 3 from the opposite side of the surface layer 7.
[0003]
[Problems to be solved by the invention]
However, in the resin molding die of the above (1), the mold body 14 is formed of a porous sintered metal, and the cavity of the mold body 14 is simply covered with the surface coating 12 such as metal, synthetic resin or ceramic. Therefore, when a heating medium or a cooling medium flows through the mold body 14 from the temperature adjustment fluid supply pipe 22R toward the temperature adjustment fluid discharge pipe 24, the degree of heating or cooling is changed depending on the necessary part of the cavity 2. I can't. That is, it is not suitable for a mold having a complicated and complicated cavity.
In the above mold (2), a porous material partial area 3 is formed in the vicinity of the surface of the cavity 2 of the mold 1 for cooling, and a surface layer 7 such as plating is formed in the partial area 3. Since the water supply channel 4 and the drainage channel 5 are simply connected to the partial area 3 from the opposite side, it is possible to change the degree of cooling depending on the necessary part of the cavity 2 as in the case of the resin molding die of (1) above. Can not.
[0004]
In the case of injection molding, the portion close to the sprue of the injection molding machine that supplies the resin is a portion that remains relatively hot even after the resin is injected. Therefore, even if the mold temperature is lowered at the end portion of the mold, the mold temperature is often high in the portion close to the sprue. In other words, the molding time depends on the time until the resin near the sprue is cured, and in order to improve productivity, it is necessary to detect the mold temperature and control the mold temperature in detail. Be fooled.
[0005]
Accordingly, an object of the present invention is to provide a resin molding mold that can control the temperature of the mold body by making it uniform, or a resin molding mold that can control the temperature of the mold body with a partial difference. Is to provide.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, claim 1 is a resin molding die in which a porous sintered metal layer is provided on a mold body, and a cooling medium or a heating medium as a heating medium is circulated through the sintered metal layer. In the mold, a plurality of flow paths are formed in the mold body by making the sintered metal layers independent from each other, and the amount and / or temperature of the heat medium supplied to the plurality of flow paths are individually controlled. It is characterized by having.
[0007]
In a resin molding die in which a porous sintered metal layer is provided in a mold body and a cooling medium or a heating medium as a heating medium is circulated through the sintered metal layer, the sintered metal layers are made independent of each other. A plurality of flow paths are formed in the mold body, and a control device for individually controlling the amount and / or temperature of the heat medium supplied to the plurality of flow paths is provided, and the amount and / or temperature of the heat medium is controlled. Control precisely.
That is, a control device that individually controls the amount and / or temperature of the heat medium supplied to the plurality of channels by forming a plurality of channels in the mold body by making the sintered metal layers independent of each other. By providing it, the amount and / or temperature of the heat medium is precisely controlled to improve the quality of the molded product.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings. The drawings are viewed in the direction of the reference numerals.
FIG. 1 is a perspective view of a resin molding die according to the present invention, and shows a resin molding system 10 in which a control device 60 is provided in a resin molding device 20 described later.
The resin molding system 10 includes a resin mold device 20 that forms a resin molded product W and a control device 60 that controls the resin mold device 20.
The resin mold apparatus 20 includes a movable mold 30 as a resin mold and a fixed mold 40 as a resin mold, and a molding convex portion 32 is provided on the movable mold 30. The cavity 50 for molding the resin molded product W is formed by forming the molding recess 42 in the fixed mold 40 and combining the molding recess 42 and the molding projection 32.
[0009]
FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1 and shows a vertical cross section of the movable mold 30.
The movable mold 30 includes a molding protrusion 32 formed on the mold body 31, a plurality of flow paths 33A to 33F (only 33C shown) formed on the mold body 31, and the flow paths 33A to 33F. Porous sintered metal layers 34A to 34F (only 34C shown) to be formed respectively, a lid member 35 that collectively covers these sintered metal layers 34A to 34F, and inlets formed in the flow paths 33A to 33F, respectively. It consists of water ports 36A to 36F (only 36C is shown) and drain ports 37A to 37F (only 37C is shown).
The fixed-side mold 40 includes a molding recess 42 in the mold body 41, and the mold body 41 includes substantially the same flow path, sintered metal layer, lid member, water inlet, and drain outlet as the movable-side mold 30. Therefore, detailed description is omitted.
[0010]
3 is a cross-sectional view taken along the line 3-3 in FIG.
The flow path 33A is formed in the mold main body 31 so that the bottom 39A of the flow path 33A approaches the cavity 50, and the flow paths 33B to 33F are formed in the same manner as the flow path 33A. In addition, 39B-39F shows the bottom of the flow paths 33B-33F, respectively. 38 (... indicates a plurality. The same applies hereinafter) indicates flow path walls that partition the flow paths 33A to 33F.
The sintered metal layer 34A is a member for circulating a cooling medium or a heating medium as a heat medium (not shown), and the heat medium can be moved by moving the sintered metal layer 34A. Is a medium for forcibly cooling or forcibly heating. The sintered metals 34B to 34F are formed in the same manner as the sintered metal layer 34A.
[0011]
The lid member 35 is a member that includes a base portion 35a that collectively covers the sintered metal layers 34A to 34F, and cooling fins 35b formed on the base portion 35a.
The cooling fins 35b are intended to promote the heat radiation effect of the movable mold 30 by being arranged on the axis C of the flow path wall 38.
[0012]
4 is a cross-sectional view taken along the line 4-4 of FIG.
The movable-side mold 30 forms flow paths 33A to 33F in the mold body 31 so that the bottoms 39A to 39F of the flow paths 33A to 33F approach the cavity 50, and the flow paths 33A to 33F of the mold body 31 are formed. Sintered metal layers 34A to 34F are formed, the sintered metal layers 34A to 34F are closed with a lid member 35, and a heat medium (not shown) as a cooling medium or a heating medium is applied to the sintered metal layers 34A to 34F. It can be said that it is intended to be distributed. Therefore, the passage of the heat medium can be formed while maintaining the strength of the cavity 50. As a result, a resin molding die (movable side die 30) with improved durability can be obtained.
[0013]
FIG. 5 is a block diagram of a resin mold control apparatus according to the present invention.
The control device 60 includes a pump 61 for sending a heat medium (not shown) to the flow paths 33A to 33F of the mold body 31, a tank 62 for storing the heat medium, and flow rate sensors 63A to 63F provided in the water inlets 36A to 36F, respectively. 63F, flow control valves 64A to 64F provided at the water inlets 36A to 36F, temperature sensors 65A to 65F provided to the flow paths 33A to 33F, and information on these temperature sensors 65A to 65F and flow rate sensors 63A to 63F And the controller 66 for controlling the flow rate adjusting valves 64A to 64F and the pump 61. In this figure, the flow rate sensors 63A to 63F are displayed in the lower right direction from the flow rate sensor 63A to the flow rate sensor 63F. However, the flow rate sensors 63A to 63F are connected to the inlets 36A to 36F of the flow paths 33A to 33F. The distances are substantially the same, that is, arranged in a straight line in the horizontal direction of the drawing.
[0014]
That is, the movable-side mold 30 is provided with porous sintered metal layers 34A to 34F on the mold body 31, and the sintered metal layers 34A to 34F are provided with a heat medium (non-heating medium) as a cooling medium or a heating medium. In the resin molding mold in which the figure is distributed, a plurality of flow paths 33A to 33F are formed in the mold body 31 by making the sintered metal layers 34A to 34F independent of each other, and the plurality of flow paths 33A to 33F are formed. A control device 60 that individually controls the amount and / or temperature of the heat medium to be supplied is provided.
[0015]
A plurality of flow paths 33A to 33F are formed in the mold main body 31 by making the sintered metal layers 34A to 34F independent of each other, and the amount and / or temperature of the heat medium supplied to the plurality of flow paths 33A to 33F is set. Since the control device 60 for individually controlling is provided, the amount and / or temperature of the heat medium can be precisely controlled. As a result, the quality of the molded product can be improved.
[0016]
Next, the operation of the movable mold 30 (resin mold) described above will be described.
FIGS. 6A to 6D are first operation explanatory views of the resin mold according to the present invention, and show an example of a manufacturing procedure of the movable mold 30 (see FIG. 3).
In (a), the shaping | molding convex part 32 and the flow paths 33A-33F are formed in the metal block 52, and the metal mold body 31 is manufactured.
In (b), iron-based metal, aluminum-based metal, or stainless steel metal particles 53 are filled in the flow paths 33A to 33F.
In (c), the mold body 31 in which the metal particles 53... Are filled in the flow paths 33A to 33F is placed in the sintering furnace 54, and the metal particles 53. Form.
[0017]
In (d), the sintered metal layers 34A to 34F are collectively covered with the lid member 35, and bolted or thermally welded to seal the flow paths 33A to 33F. Thereafter, the surface of the molding convex portion 32 is finished. For example, when the thickness of the surface of the molding convex portion 32 and the surface of the bottom 39A of the flow path 33A is t, the thickness t is set in the range of 2 mm to 5 mm. Here, when the thickness t is 2 mm or less, the strength of the molding convex portion 32 is insufficient. On the other hand, if it is 5 mm or more, the cooling efficiency or the thermal efficiency is deteriorated. The same applies to the thickness of the surface 32 of the molding convex portion and the surfaces 39B to 39F (see FIG. 3) of the other flow paths 33B to 33F.
[0018]
FIGS. 7A and 7B are explanatory views of the second action of the resin molding die according to the present invention. FIG. 7A shows a comparative example and FIG. 7B shows an example.
In (a), a movable mold 100 as a resin molding mold is formed with a molding projection 102 on a mold body 101, a flow path 103 is formed on the mold body 101, and the flow path 103 is sintered. A metal layer 104 is formed, and a water inlet 106 and a water outlet 107 are formed in the mold body 101. When a heat medium (not shown) is supplied from the water inlet 106, the arrow ▲ 1 The heat medium flows like ▼ ... That is, it concentrates in the vicinity of the center of the flow path 103 and cannot flow at both ends. Therefore, the movable mold 100 cannot be precisely managed for each part.
[0019]
In (b), the movable mold 30 forms a plurality of flow paths 33A to 33F in the mold body 31 by making the sintered metal layers 34A to 34F independent of each other, and the plurality of flow paths 33A to 33F. Since the control device 60 that individually controls the amount and / or temperature of the heat medium supplied to the heat medium is provided, the amount and / or temperature of the heat medium can be precisely controlled. As a result, the quality of the molded product can be improved.
[0020]
In the embodiment, as shown in FIG. 5, the temperature sensors 65A to 65F are arranged in the flow paths 33A to 33F. However, the present invention is not limited to this, and for example, a resin mold at a portion close to the sprue of the injection molding machine. It may be arranged in a mold.
In the embodiment, as shown in FIG. 3, the six flow paths 33 </ b> A to 33 </ b> F are formed. However, the present invention is not limited to this, and any structure may be used as long as a plurality of flow paths are formed.
[0021]
【The invention's effect】
The present invention exhibits the following effects by the above configuration.
Claim 1 is a resin molding die in which a porous sintered metal layer is provided on a mold body, and a cooling medium or a heating medium as a heating medium is passed through the sintered metal layer. Since a plurality of flow paths are formed in the mold body by making them independent from each other, and a control device for individually controlling the amount and / or temperature of the heat medium supplied to the plurality of flow paths is provided. The amount and / or temperature can be precisely controlled. As a result, the quality of the molded product can be improved.
[Brief description of the drawings]
1 is a perspective view of a resin mold according to the present invention. FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1. FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. FIG. 5 is a block diagram of a control device for a resin molding die according to the present invention. FIG. 6 is a first operation explanatory view of the resin molding die according to the present invention. Second action illustration of mold [Explanation of symbols]
DESCRIPTION OF SYMBOLS 30 ... Resin molding die (movable side die), 31 ... Mold main body, 33A-33F ... Flow path, 34A-34F ... Sintered metal layer, 50 ... Control apparatus.

Claims

In a resin molding die in which a porous sintered metal layer is provided in a mold body and a heat medium as a cooling medium or a heating medium is circulated through the sintered metal layer, the sintered metal layers are made independent of each other. A resin molding comprising a control device for individually controlling a quantity and / or temperature of the heat medium supplied to the plurality of flow paths by forming a plurality of flow paths in the mold main body Mold.