JP4259364B2 - Semiconductor device - Google Patents

Description

The present invention relates to a resin-molded semiconductor device provided with a plurality of terminals including adjustment terminals .

  In recent years, with the high density of semiconductor devices, the number of terminals of semiconductor devices taken out from a resin molded package has also increased.

  A resin-molded semiconductor device provided with a plurality of terminals is disclosed in, for example, Japanese Patent Application Laid-Open No. 62-158352 (Patent Document 1), Japanese Patent Application Laid-Open No. 63-244658 (Patent Document 2), No. 67000 (Patent Document 3) and Japanese Utility Model Publication No. 03-51853 (Patent Document 4).

  9 to 12 show semiconductor devices 91 to 94 disclosed in Patent Documents 1 to 4, respectively.

  The semiconductor device 91 disclosed in Patent Document 1 shown in the perspective view of FIG. 9 is a semiconductor device in which the terminal t is taken out from the upper and lower surfaces in addition to the side surface of the resin sealing body (package) p. . As a result, it is possible to cope with the increase in the number of terminals due to the high density of semiconductor devices.

  The semiconductor device 92 disclosed in Patent Document 2 shown in the perspective view of FIG. 10 is provided such that the terminal t is parallel to the long side of the resin package p having a substantially rectangular planar shape and exposed from the short side. It is a semiconductor device. Thus, by collecting a plurality of terminals t on the short side, the outer shape of the package can be reduced, and high-density mounting on a printed circuit board or the like can be achieved.

  A semiconductor device 93 disclosed in Patent Document 3 shown in the perspective view of FIG. 11 has a projection pc protruding from the plurality of terminals t at the corner of the package p. Thereby, damage to the terminal t due to contact with an external object from the side surface direction of the package p can be avoided.

A semiconductor device 94 disclosed in Patent Document 4 shown in the top view of FIG. 12 is a semiconductor device on which an integrated circuit that adjusts electrical characteristics in a manufacturing stage is mounted. The semiconductor device 94 of FIG. 12 includes a terminal ta used when using the semiconductor device 94 taken out from the side surface of the package p, and an adjustment terminal for adjusting the electrical characteristics taken out from the corner of the package p. tb. The adjustment terminal tb is cut off after adjusting the electrical characteristics, so that the number of terminals of the semiconductor device 94 can be reduced.
Japanese Patent Laid-Open No. 62-158352 JP-A 63-244658 Japanese Utility Model Publication No. 05-67000 Japanese Utility Model Publication No. 03-51853

  In each of the semiconductor devices 91 to 94 shown in FIGS. 9 to 12, the tips of the terminals t, ta, and tb protrude to the outside of the package p.

  In a resin molded semiconductor device in recent years, as shown by the semiconductor device 94 in FIG. 12, among the plurality of terminals, an adjustment terminal that is used when the semiconductor device is manufactured and is not used when the semiconductor device is used. There are many things including. In a semiconductor device having such an adjustment terminal, if there is an adjustment terminal that is not used when the semiconductor device is used, it may contact an external object and cause damage or electrostatic breakdown. In the semiconductor device 93 of FIG. 11, the protrusions pc provided at the corners protect the terminal t against contact from the side surface direction of the package p. The protection is insufficient. Also, as shown by the semiconductor device 94 in FIG. 12, if the adjustment terminal is cut off after adjusting the electrical characteristics, the cost is increased due to the addition of the cutting step, and an external force is applied at the time of cutting, resulting in damage to the inside of the package. There is a risk of getting up.

  Accordingly, the present invention provides a resin-molded semiconductor device provided with a plurality of terminals including an adjustment terminal, which is unlikely to be damaged or destroyed by the adjustment terminal and can be manufactured at low cost. The purpose is that.

  The invention described in claims 1 to 9 relates to a semiconductor device in which an adjustment terminal is disposed inside a groove formed on the surface of a package.

  The invention according to claim 1 is a semiconductor device provided with a plurality of terminals and packaged by a resin mold, wherein the plurality of terminals are used for adjusting electrical characteristics of the semiconductor device used at the time of manufacture. An adjustment terminal is included, and the adjustment terminal is disposed in a groove formed on the surface of the package.

  According to this, since the adjustment terminal is arranged inside the groove and the periphery is protected by the mold resin, it is possible to prevent damage to the adjustment terminal and electrostatic breakdown caused by the adjustment terminal coming into contact with an external object. it can. Further, by arranging the adjustment terminal having the shortest required length inside the groove, the increase in size of the package can be suppressed. Furthermore, since the semiconductor device does not require cutting (removal) of the adjusting terminal after adjusting the electrical characteristics during manufacturing, it prevents the internal destruction of the package due to external force at the time of cutting and the cost increase due to the addition of a cutting process. be able to. Since the adjustment terminal is not cut and remains in the groove, if it is necessary to adjust the electrical characteristics again during use of the semiconductor device, the adjustment terminal can be used for readjustment. .

  The semiconductor device includes a semiconductor chip mounted on a heat sink, the semiconductor chip and the terminal are connected by a bonding wire, and one surface of the heat sink is exposed to the outside. Thus, it may be a packaged semiconductor device.

  Even if a semiconductor device has a semiconductor chip mounted on a heat sink and handles a large amount of power, by arranging the adjustment terminal inside the groove as described above, damage to the adjustment terminal and electrostatic breakdown can be prevented, and the package can be used. Increase in size can be suppressed.

  According to a third aspect of the present invention, the groove can be formed independently for each adjustment terminal. In this case, separation of each adjustment terminal and protection by the mold resin can be ensured, and damage and electrostatic breakdown caused by contact with an external object can be surely prevented.

  According to a fourth aspect of the present invention, the groove can be formed in common over a plurality of adjustment terminals. In this case, since the number of grooves is small, the semiconductor device can be easily manufactured, and an inexpensive semiconductor device can be obtained.

  As described in claim 5, when the planar shape of the package is substantially rectangular, the adjustment terminal and terminals other than the adjustment terminal are separated along each side of the outer periphery of the substantially rectangular shape in the package. Are preferably arranged.

  As described above, the adjustment terminals used for adjusting the electrical characteristics and the terminals other than the adjustment terminals (drive terminals used during the operation of the semiconductor device) are arranged separately on each side of the substantially rectangular package. It is preferable. According to this, compared with the case where the adjustment terminal and the drive terminal are mixed and arranged on one side of the substantially rectangular package, the interval between the drive terminals can be narrowed, so that the other terminal to which the drive terminal is connected The interval can also be reduced, and the mounting density around the semiconductor device can be increased.

  According to a sixth aspect of the present invention, the adjustment terminal can be disposed on the upper surface of the package on the side opposite to the surface exposed to the outside of the heat sink. According to a seventh aspect of the present invention, the adjustment terminal may be disposed on a side surface of the package that intersects an externally exposed surface of the heat sink.

  Regardless of whether the adjustment terminal is placed on the top or side of the package, the adjustment terminal is protected by the mold resin as described above. Can be prevented. The selection of whether the adjustment terminal is arranged on the upper surface or the side surface of the package is performed in consideration of the ease of connection to the adjustment terminal and the direction in which contact with an external object is unlikely to occur.

  As described in claim 8, the semiconductor device in which the adjustment terminal is disposed in the groove is suitable for a semiconductor device in which terminals other than the adjustment terminal are used as connection pins of a connector in the semiconductor device. is there.

  According to this, a terminal other than the adjustment terminal used as a connector connection pin (a drive terminal used during operation of the semiconductor device) is generally connected to the other party during use in the connector case. Protected by. Accordingly, the semiconductor device can be protected from damage and electrostatic breakdown caused by contact with external objects for all of the adjustment terminals and the drive terminals.

The best mode for carrying out the present invention will be described below with reference to the drawings.
(First embodiment)
1A to 1C are examples of the semiconductor device according to the present embodiment, FIG. 1A is a perspective view of the semiconductor device 101, and FIG. 1B is the semiconductor of FIG. 3 is a perspective view of the device 101. FIG. Moreover, FIG.1 (c) is AA sectional drawing in FIG.1 (b).

  As shown in FIG. 1A, the semiconductor device 101 is a semiconductor device provided with a plurality of terminals ta and tb1 and packaged by a resin mold. The terminal tb1 is an adjustment terminal for adjusting electrical characteristics of the semiconductor device 101 used at the time of manufacture, and is arranged inside a groove h1 formed on the surface of the package p. The terminal ta is a drive terminal used during the operation of the semiconductor device 101 and protrudes from the side surface of the package p.

  The semiconductor device 101 is a semiconductor device that is used by being inserted between an in-vehicle ECU (Electronic Control Unit) and an actuator, and handles a large amount of power. As shown in FIGS. 1B and 1C, in the semiconductor device 101, the semiconductor chip c is mounted on the heat sink s, and the semiconductor chip c and the terminals ta and tb1 are connected by the bonding wire w. The surface of the heat sink s opposite to the mounting surface of the semiconductor chip c is packaged so as to be exposed to the outside, and heat generated in the semiconductor chip c is radiated to the outside through the heat sink s.

  The drive terminal ta of the semiconductor device 101 shown in FIGS. 1A to 1C is used as a connector connection pin in the semiconductor device 101. The drive terminal ta used as the connection pin of this connector is protected by the case of the mating connector when it is connected to the mating connector in use.

  The adjustment terminal tb1 of the semiconductor device 101 shown in FIGS. 1A to 1C is disposed on the upper surface of the package p on the opposite side to the surface exposed to the outside in the heat sink s. The adjustment terminal tb1 is disposed inside a groove h1 formed on the upper surface of the package p, and the periphery thereof is protected by a mold resin. The groove h1 is formed independently for each adjustment terminal tb1, and separation of each adjustment terminal tb1 and protection by the mold resin are reliably performed. For this reason, it is possible to reliably prevent damage to the adjustment terminal tb1 and electrostatic breakdown of the semiconductor chip c caused by the adjustment terminal tb1 coming into contact with an external object. In addition, the adjustment of the package p can be suppressed by arranging the adjustment terminal tb1 having the minimum required length inside the groove h1. Furthermore, unlike the conventional semiconductor device 94 shown in FIG. 12, the semiconductor device 101 does not require cutting (removal) of the adjustment terminal tb1 after adjusting the electrical characteristics during manufacturing. For this reason, it is possible to prevent package internal destruction due to external force at the time of cutting and cost increase due to the addition of a cutting process. Since the adjustment terminal tb1 is not cut and remains in the groove h1, if the electrical characteristics need to be adjusted again during use of the semiconductor device 101, the adjustment terminal tb1 should be readjusted using this. You can also.

  The package p of the semiconductor device 101 has a substantially rectangular planar shape, and the adjustment terminal tb1 and the drive terminal ta are arranged on the outer periphery of the substantially rectangular shape in the package p as shown in FIGS. They are arranged separately along the side. As a result, the distance between the drive terminals ta can be reduced as compared with the case where the adjustment terminal tb1 and the drive terminal ta are arranged on one side of the substantially rectangular package p. For this reason, the terminal interval of the counterpart to which the drive terminal ta is connected can be narrowed, and the mounting density around the semiconductor device 101 can be increased.

  2A to 2C are top views of other semiconductor devices 102 to 104 in which the arrangement of the adjustment terminal tb1 and the drive terminal ta is different. In the semiconductor devices 102 to 104 shown in FIGS. 2A to 2C, the same parts as those of the semiconductor device 101 shown in FIG.

  In the semiconductor device 102 shown in FIG. 2A, the drive terminal ta is arranged along one short side in the substantially rectangular package p, and the adjustment terminal tb1 is arranged along the remaining three sides. In the semiconductor device 103 shown in FIG. 2B, the adjustment terminal tb1 is arranged along one short side in the substantially rectangular package p, and the drive terminal ta is arranged along the remaining three sides. In the semiconductor device 104 shown in FIG. 2C, the adjustment terminal tb1 is arranged along one long side in the substantially rectangular package p, and the drive terminal ta is arranged along the remaining three sides.

  In any of the semiconductor devices 102 to 104 shown in FIGS. 2A to 2C, the adjustment terminal tb1 and the drive terminal ta are substantially rectangular in the package p, similarly to the semiconductor device 101 shown in FIG. It is a semiconductor device arranged separately along each side of the outer periphery. Therefore, as described above, compared with the case where the adjustment terminal tb1 and the drive terminal ta are mixedly arranged on one side of the substantially rectangular package p, the interval between the drive terminals ta can be reduced, and the semiconductor devices 102 to 102 can be reduced. The mounting density around 104 can be increased.

  3A to 3C are examples of another semiconductor device in which the arrangement of the adjustment terminals is different. FIG. 3A is a perspective view of the semiconductor device 105, and FIG. It is a perspective view of the semiconductor device 105 of a). Moreover, FIG.3 (c) is BB sectional drawing in FIG.3 (b). In the semiconductor device 105 shown in FIGS. 3A to 3C, the same reference numerals are given to the same portions as those of the semiconductor device 101 shown in FIGS. 1A to 1C, and description thereof is omitted.

  The adjustment terminal tb1 of the semiconductor device 101 shown in FIGS. 1A to 1C is disposed on the upper surface of the package p on the opposite side to the surface exposed to the outside in the heat sink s. On the other hand, the adjustment terminal tb2 of the semiconductor device 105 shown in FIGS. 3A to 3C is disposed on the side surface of the package p that intersects the surface exposed to the outside of the heat sink s.

  The adjustment terminal tb2 of the semiconductor device 105 shown in FIGS. 3A to 3C is also disposed inside the groove h2 formed on the side surface of the package p, and the periphery thereof is protected by the mold resin. The groove h2 is formed independently for each adjustment terminal tb2, and separation of each adjustment terminal tb2 and protection by the mold resin are reliably performed. Therefore, similarly to the adjustment terminal tb1 of the semiconductor device 101 shown in FIGS. 1A to 1C, damage to the adjustment terminal tb2 and electrostatic breakdown of the semiconductor chip c can be reliably prevented. In addition, the adjustment of the package p can be suppressed by arranging the adjustment terminal tb2 having the shortest required length inside the groove h2. Furthermore, since the adjustment terminal tb2 does not need to be cut (removed) after adjusting the electrical characteristics at the time of manufacture, it is possible to prevent the package from being destroyed due to an external force at the time of cutting and the cost increase due to the addition of a cutting process. Since the adjustment terminal tb2 is not cut and remains in the groove h2, if the electrical characteristics need to be adjusted again during use of the semiconductor device 105, the adjustment terminal tb2 should be readjusted using this. You can also.

  As for the semiconductor device 105, as in the semiconductor device 101 shown in FIGS. 1A and 1B, the adjustment terminal tb2 and the drive terminal ta are arranged as shown in FIGS. 3A and 3B. Along each side of the outer periphery of the substantially rectangular shape at p, they are arranged separately. Therefore, compared with the case where the adjustment terminal tb2 and the drive terminal ta are mixedly arranged on one side of the substantially rectangular package p, the interval between the drive terminals ta can be narrowed, and the mounting density around the semiconductor device 105 can be reduced. Can be increased.

  4A to 4C, another semiconductor device 106 to 108 in which the arrangement of the adjustment terminal tb2 and the drive terminal ta is different in the same manner as the semiconductor devices 102 to 104 shown in FIGS. 2A to 2C. The top view of is shown.

  In any of the semiconductor devices 106 to 108 shown in FIGS. 4A to 4C, the adjustment terminal tb2 and the drive terminal ta are substantially rectangular in the package p, similarly to the semiconductor device 105 shown in FIG. It is a semiconductor device arranged separately along each side of the outer periphery. Therefore, as described above, compared with the case where the adjustment terminal tb2 and the drive terminal ta are mixedly arranged on one side of the substantially rectangular package p, the interval between the drive terminals ta can be reduced, and the semiconductor devices 106 to The mounting density around 108 can be increased.

  Semiconductor devices 101-104 shown in FIGS. 1 (a)-(c) and FIGS. 2 (a)-(c), and semiconductors shown in FIGS. 3 (a)-(c) and FIGS. 4 (a)-(c). As in the devices 105 to 108, the selection of whether the adjustment terminal is disposed on the upper surface or the side surface of the package p is performed in consideration of the ease of connection to the adjustment terminal and the direction in which contact with an external object is difficult to occur. Is called.

  FIGS. 5A to 5C and FIGS. 6A to 6C show examples of other semiconductor devices.

  FIG. 5A is a perspective view of the semiconductor device 109, and FIG. 5B is a perspective view of the semiconductor device 109 of FIG. Moreover, FIG.5 (c) is CC sectional drawing in FIG.5 (b). Similarly, FIG. 6A is a perspective view of the semiconductor device 110, and FIG. 6B is a perspective view of the semiconductor device 110 of FIG. 6A. Moreover, FIG.6 (c) is DD sectional drawing in FIG.6 (b).

  In the semiconductor devices 101 to 108 shown in FIGS. 1 to 4, the grooves h1 and h2 are formed independently for each of the adjustment terminals tb1 and tb2. On the other hand, in the semiconductor device 109 shown in FIG. 5 and the semiconductor device 110 shown in FIG. 6, the grooves h3 and h4 are formed in common over the plurality of adjustment terminals tb3 and tb4, respectively. The semiconductor devices 109 and 110 shown in FIGS. 5 and 6 are easy to manufacture because the number of the grooves h3 and h4 is small, and an inexpensive semiconductor device can be obtained. The semiconductor devices 109 and 110 shown in FIGS. 5 and 6 in which the common grooves h3 and h4 are formed over the plurality of adjustment terminals tb3 and tb4 are also applied to the semiconductor devices 101 to 108 shown in FIGS. Similarly to the above, it is possible to prevent the adjustment terminals tb3 and tb4 from being damaged and the semiconductor chip c from being electrostatically damaged. In addition, the increase in size of the package p can be suppressed, and the adjustment terminals tb3 and tb4 need not be cut (removed), thereby preventing the package from being destroyed due to an external force at the time of cutting and the cost increase due to the addition of a cutting process. . Further, since the adjustment terminals tb3 and tb4 are not cut and remain in the grooves h3 and h4, the adjustment terminals tb3 and tb4 can be readjusted using the adjustment terminals tb3 and tb4. In addition, since the adjustment terminals tb3, tb4 and the drive terminal ta are arranged separately along each outer side of the package p, the mounting density around the semiconductor devices 109, 110 can be increased.

As described above, the semiconductor devices 101 to 110 shown in FIGS. 1 to 6 are resin-molded semiconductor devices provided with a plurality of terminals ta and tb1 to tb4 including the adjustment terminals tb1 to tb4. The semiconductor device is less likely to be damaged or broken by the adjustment terminals tb1 to tb4 and can be manufactured at low cost. In the semiconductor devices 101 to 110 shown in FIGS. 1 to 6, the drive terminal ta protrudes from the surface of the package p. However, the present invention is not limited to this, and like the adjustment terminals tb1 to tb4, all the terminals of the adjustment terminal and the drive terminal are arranged inside the groove formed on the surface of the package made of mold resin, and contact with an external object. The semiconductor device may be protected from damage or electrostatic breakdown that occurs.
( Reference example )
The semiconductor device according to the first embodiment is a semiconductor device in which the adjustment terminal is disposed inside a groove formed on the surface of a package made of mold resin. The semiconductor device of this reference example, the semiconductor device is not a semiconductor device of the present embodiment to be a reference, adjustment terminal, Ru semiconductor device der consisting disposed along the package surface.

7A to 7C are examples of the semiconductor device in this reference example , FIG. 7A is a perspective view of the semiconductor device 201, and FIG. 7B is the semiconductor of FIG. 2 is a perspective view of the device 201. FIG. Moreover, FIG.7 (c) is EE sectional drawing in FIG.7 (b). In addition, in the semiconductor device 201 shown in FIGS. 7A to 7C, the same portions as those of the semiconductor device 101 shown in FIGS. 1A to 1C are denoted by the same reference numerals, and the description thereof is omitted.

  Similarly to the semiconductor device 101 shown in FIGS. 1A to 1C, the semiconductor device 201 shown in FIGS. 7A to 7C is provided with a plurality of terminals ta and tb5 and packaged by a resin mold. Semiconductor device. In the semiconductor device 101 shown in FIGS. 1A to 1C, the adjustment terminal tb1 is disposed inside the groove h1 formed on the surface of the package p. On the other hand, in the semiconductor device 201 shown in FIGS. 7A to 7C, the adjustment terminal tb5 is arranged along the surface of the package p.

  The adjustment terminal tb5 of the semiconductor device 201 shown in FIGS. 7A to 7C is arranged along the surface of the package p, and the tip of the adjustment terminal tb5 does not protrude from the package p. For this reason, compared with the case where the tip protrudes from the package p, it is possible to prevent damage and electrostatic breakdown of the semiconductor chip c caused by the adjustment terminal tb5 coming into contact with an external object. Further, the space occupied by the adjustment terminal tb5 is only the thickness of the adjustment terminal tb5 around the package p, and the arrangement of the adjustment terminal tb5 does not increase the size of the package p. Further, in the semiconductor device 201, the adjustment terminal tb5 is not cut (removed) after adjusting the electrical characteristics at the time of manufacture, as in the semiconductor devices 101 to 110 shown in the first embodiment. It is possible to prevent internal destruction and cost increase due to the addition of a cutting process. Further, when it becomes necessary to adjust the electrical characteristics again during use of the semiconductor device 201, it can be readjusted using this.

  Similarly to the semiconductor devices 101 to 110 shown in the first embodiment, the package p of the semiconductor device 201 has a substantially rectangular planar shape, and the adjustment terminal tb5 and the drive terminal ta correspond to FIGS. As shown to b), it arrange | positions separately along each edge | side of the substantially rectangular outer periphery in the package p. Therefore, compared with the case where the adjustment terminal tb5 and the drive terminal ta are mixedly arranged on one side of the substantially rectangular package p, the interval between the drive terminals ta can be reduced, and the mounting density around the semiconductor device 201 can be reduced. Can be increased.

  8A to 8C are top views of other semiconductor devices 202 to 204 in which the arrangement of the adjustment terminal tb5 and the drive terminal ta is different.

  In any of the semiconductor devices 202 to 204 shown in FIGS. 8A to 8C, the mounting density around the semiconductor devices 202 to 204 can be increased in the same manner as the semiconductor device 201 shown in FIG. it can.

  As described above, the semiconductor devices 201 to 204 shown in FIGS. 7 and 8 are resin-molded semiconductor devices provided with a plurality of terminals ta and tb5 including the adjustment terminal tb5, and the adjustment terminal tb5. Therefore, the semiconductor device can be manufactured at low cost.

  In the semiconductor devices 201 to 204 shown in FIGS. 7 and 8, the adjustment terminal tb5 is taken out from the side surface of the package p. However, the present invention is not limited thereto, and the adjustment terminal tb5 may be taken out from the upper surface or the lower surface of the package p. Further, in the semiconductor device 201, as shown in FIGS. 7A and 7C, the adjustment terminal tb5 is arranged so that the tip thereof goes around the lower surface of the package p. However, the present invention is not limited to this, and the adjustment terminal may be arranged so that the front end thereof wraps around the upper surface of the package p. Further, the adjustment terminal may be arranged such that the tip is kept on the side surface of the package p. In any of the above cases, the tip of the adjustment terminal does not protrude from the package p like the drive terminal ta, so that the adjustment terminal can be prevented from being damaged by contact with an external object or electrostatic breakdown. it can. Note that the selection position of the adjustment terminal take-out surface and the tip is selected in consideration of the ease of connection to the adjustment terminal and the direction in which contact with an external object is unlikely to occur. When the drive terminal ta is used as a connector connection pin in the semiconductor devices 201 to 204 shown in FIGS. 7 and 8, the drive terminal ta is protected by the case of the mating connector.

Further, in the semiconductor devices 201 to 204 shown in FIGS. 7 and 8, the drive terminal ta protrudes from the surface of the package p. However, the present invention is not limited to this, and when the drive terminal is not used as a connector connection pin in the semiconductor device, all of the adjustment terminal and the drive terminal are arranged along the surface of the package made of mold resin, like the adjustment terminal tb5. Then, the semiconductor device may be protected from damage or electrostatic breakdown caused by contact with an external object.
(Other embodiments)
In the semiconductor device 101 to 11 0 shown in FIGS. 1 to 6, both, the terminals ta, and the Tb1～tb 4 and the semiconductor chip c, were connected by a bonding wire w. Is not limited to this, the terminals ta, may be a semiconductor device comprising directly connected by solder and Tb1～tb 4 and the semiconductor chip c.

In the semiconductor device 101 to 11 0 shown in FIGS. 1 to 6, the semiconductor chip c is, was mounted on a heat sink s. However, the present invention is not limited thereto, and a semiconductor device in which the semiconductor chip c is mounted on a lead frame may be used.

1A is a perspective view of a semiconductor device, FIG. 1B is a perspective view of the semiconductor device of FIG. 1A, and FIG. It is sectional drawing. (A)-(c) is a top view of another semiconductor device from which the arrangement | positioning of an adjustment terminal and a drive terminal differs. In another example of the semiconductor device in which the arrangement of the adjustment terminals in the first embodiment is different, (a) is a perspective view of the semiconductor device, (b) is a perspective view of the semiconductor device of (a), and (c). FIG. 6 is a cross-sectional view taken along line BB in FIG. (A)-(c) is a top view of another semiconductor device from which the arrangement | positioning of an adjustment terminal and a drive terminal differs. In another example of the semiconductor device according to the first embodiment, (a) is a perspective view of the semiconductor device, (b) is a perspective view of the semiconductor device of (a), and (c) is a C of FIG. It is -C sectional drawing. In another example of the semiconductor device according to the first embodiment, (a) is a perspective view of the semiconductor device, (b) is a perspective view of the semiconductor device of (a), and (c) is D in (b). It is -D sectional drawing. An example of a semiconductor device which is not a semiconductor device of the present embodiment but is a reference, (a) is a perspective view of the semiconductor device, (b) is a perspective view of the semiconductor device of (a), and (c) is a perspective view. It is EE sectional drawing in (b). (A)-(c) is a top view of another semiconductor device from which the arrangement | positioning of an adjustment terminal and a drive terminal differs. It is a perspective view which shows the conventional semiconductor device. It is a perspective view which shows the conventional semiconductor device. It is a perspective view which shows the conventional semiconductor device. It is a top view which shows the conventional semiconductor device.

Explanation of symbols

91-94, 101-110, 201-204 Semiconductor device tb1-tb5 Adjustment terminal h1-h4 Groove ta Terminals other than the adjustment terminal (drive terminal)
p package c semiconductor chip s heat sink w bonding wire

Claims (8)

A semiconductor device provided with a plurality of terminals and packaged by a resin mold,
The plurality of terminals comprise adjustment terminals for adjusting electrical characteristics of the semiconductor device used during manufacture,
The semiconductor device, wherein the adjustment terminal is arranged in a groove formed on a surface of the package. The semiconductor device is
A semiconductor chip is mounted on the heat sink, the semiconductor chip and the terminal are connected by a bonding wire,
2. The semiconductor device according to claim 1, wherein the semiconductor device is packaged such that one surface of the heat sink is exposed to the outside.   The semiconductor device according to claim 1, wherein the groove is formed independently for each adjustment terminal.   3. The semiconductor device according to claim 1, wherein the groove is formed in common over a plurality of adjustment terminals. The planar shape of the package is substantially rectangular;
The said adjustment terminal and terminals other than the said adjustment terminal are separately arrange | positioned along each edge | side of the substantially rectangular outer periphery in the said package, It is any one of Claim 2 thru | or 4 characterized by the above-mentioned. The semiconductor device described.   6. The semiconductor device according to claim 2, wherein the adjustment terminal is arranged on an upper surface of the package on a side opposite to a surface exposed to the outside of the heat sink.   The semiconductor device according to claim 2, wherein the adjustment terminal is disposed on a side surface of the package that intersects a surface exposed to the outside of the heat sink. 8. The semiconductor device according to claim 1, wherein a terminal other than the adjustment terminal is used as a connection pin of a connector in the semiconductor device .

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