JP4297350B2 - Chip component conveying method and apparatus, and appearance inspection method and apparatus - Google Patents

Description

  The present invention relates to a chip component conveying method and apparatus in a conveying form suitable for imaging four surfaces (an upper surface, a lower surface, and both side surfaces other than both end surfaces) of a chip component such as a chip capacitor and a chip inductor, and the conveying method and The present invention relates to an appearance inspection method and apparatus using the apparatus.

Conventionally, there are the following transport techniques for transporting chip components such as chip capacitors and chip inductors for the purpose of inspection or the like.
(1) A workpiece storage groove is formed on the rotating plate, and a workpiece (conveyed product) is supplied to the workpiece storage groove, and separated and conveyed by intermittent operation (commercial product inspection machine).
(2) A work is separated and supplied from a parts feeder to a rotating disk that continuously rotates, and then the work supplied on the rotating disk is transported only by its own weight (see Patent Document 1 and Patent Document 2 below).
(3) A work is separated and supplied onto a belt that is continuously conveyed (see Patent Document 3 below).

JP 2000-266521 A Japanese Patent Publication No. 6-87072 JP 2000-337843 A

Further, as a conventional technique for inspecting a workpiece side surface (four surfaces), there is a method for inspecting the upper surface, both side surfaces, and the lower surface of a workpiece on a rotating disk. 4)). In this case, there are a configuration in which the rotating plate is transparent and a configuration in which the workpiece is transferred as described below.
(1) The rotating plate is made of a transparent member (eg, hard glass), and the upper surface and both sides of the workpiece are inspected by three CCD cameras arranged on the circuit path, and the lower surface is recognized through the transparent rotating plate. Do.
(2) Inspect 2 surfaces (upper surface, one of the side surfaces) or 3 surfaces (upper surface, both side surfaces) of the workpiece on the rotating disk. The workpiece is transferred to the next rotating disk, and the remaining two surfaces (the other of the lower surface and the side surface) or one surface (the lower surface) are inspected.

Japanese Examined Patent Publication No. 6-54226

Furthermore, the structure shown in the following Patent Document 5 is known as a technique related to the improvement of the suction plate structure in the rotating disk that sucks and conveys the workpiece.
JP 2001-3241 A

  In the configuration of Patent Document 5, in order to form a work suction hole, it is necessary to form a suction hole by stacking and arranging at least a lid plate portion above and below a plate portion in which a slit for suction is formed. Three to four members are required.

  FIG. 6 to FIG. 7 show an example of a conventional chip part conveying apparatus, and shows a configuration in which the chip part 1 as a workpiece is delivered by two rotating disks. This apparatus includes a parts feeder 50, a lower rotating disk 51, and an upper rotating disk 52, and a plurality of suction holes 53 are formed on the lower surface of the upper rotating disk 52 as shown in FIG. The workpiece conveyed on the lower rotating disk 51 that rotates continuously is sucked through the suction hole 53 on the upper rotating disk 52 side that rotates continuously, and the chip component 1 is delivered.

  When performing an appearance inspection of a chip component using this chip component transport apparatus, for example, the upper surface and one side surface of the chip component being transported by the lower rotating disk 51 are imaged by the imaging means, and are transported by the upper rotating disk 52. The lower surface and the other side surface of the chip component are imaged by the imaging means. Thereby, four-surface inspection of chip parts is possible.

The problems of the conventional transfer technology are as follows.
(1) In the workpiece transfer method, the workpiece posture is not stable due to the effect of acceleration / deceleration during transfer by intermittent drive. There are also problems such as not being able to earn processing power.
(2) In the conveyance with the continuous rotating disk, because the workpiece is conveyed only by its own weight, due to the influence of the displacement of the workpiece due to the centrifugal force due to the increase in the conveyance speed and the mechanical vibration due to the speeding up of the equipment, Work posture failure occurs. Appearance inspection accuracy (recognition accuracy) is hindered because the detection surface varies due to a poor posture of the workpiece.
(3) The belt conveyance also has the problem that the workpiece posture varies due to vibration of the belt itself during conveyance.

The problems of the conventional inspection method are as follows.
(1) In the method for detecting the surface of the workpiece 4 using a transparent member, there is no delivery of the workpiece and the conveying method itself is simple. However, the transparent member is likely to become dirty or scratched, and this stain or scratch is a problem in inspection accuracy. Occurs and there is a problem in stable detection (originally a good product is regarded as a defective product).
(2) In the conventional workpiece transfer configuration using the two rotating disks shown in FIGS. 6 and 7, the upper rotating disk 52 that continuously rotates the work that has been conveyed on the lower rotating disk 51 that rotates continuously. In this method, the clearance between the workpiece and the upper rotating disk 52 is affected by the thickness tolerance of the workpiece, and the clearance management is difficult. If the clearance is large, the workpiece is transferred. There are problems such as being unable to deliver successfully. In addition, there is a problem that defects such as a workpiece having a poor posture of the workpiece are likely to be caught in the gap between the upper and lower rotary disks.

  Further, as a suction plate structure for sucking the side surface of a workpiece, there is Patent Document 5, and in the technique disclosed therein, in order to form a workpiece suction hole, the upper and lower sides of a plate portion where slits for suction are formed are formed. It is necessary to form a suction hole by laminating and arranging at least the lid plate portion in this case, and in this case, three to four constituent members are required, and there is a problem that the structure becomes complicated. Note that Patent Document 5 does not refer to workpiece four-surface inspection by delivery.

  In view of the above points, the first object of the present invention is to stably convey the workpiece (chip component) posture by the first and second rotating disks and to improve the delivery of the workpiece between the first and second rotating disks. It is an object of the present invention to provide a chip component transport method and apparatus that achieves stabilization of a series of work transport across the first and second rotating disks.

  A second object of the present invention is to provide a chip component visual inspection method and apparatus that improve and stabilize the inspection accuracy of the visual inspection of the chip component by conveying the chip component using the chip component conveying method and apparatus. Is to provide.

  Other objects and novel features of the present invention will be clarified in embodiments described later.

In order to achieve the above object, a chip component carrying method according to the invention of claim 1 of the present application is as follows.
Using a first rotating disk that rotates in a horizontal plane and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk;
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and There is a gap narrower than the height of the chip component to be transported with respect to the chip component mounting surface, and the method includes:
Wherein conveying the chip components by the rotation of said first rotary disc while asked to support the chip component in the chip component mounting surface of the first rotating disk, the circumferential surface of the second rotary disk after out said chip than the outer edge of the component placement surface is brought into contact with the chip component to a portion in the center axis side of the first rotary disc, the chips at the circumferential surface of the second rotary disk The chip component is conveyed by rotation of the second rotating disk while adsorbing and holding the component .

  The chip component carrying method according to the invention of claim 2 of the present application is characterized in that, in claim 1, the first rotating disk and the second rotating disk rotate continuously.

The chip component conveying apparatus according to the invention of claim 3 of the present application is
A first rotating disk that rotates in a horizontal plane, and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk,
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and Present with a gap narrower than the height of the chip component to be conveyed with respect to the chip component placement surface,
Said first rotary disc, the said by rotation of its own while asked to support the chip component in the chip component mounting surface conveys the chip components, said chip part of the circumferential surface of the second rotary disk The chip component is brought into contact with a portion on the center axis side of the outer surface of the placement surface,
It said second rotary disk includes a Turkey be conveyed by the rotation of itself while holding adsorbing the first of the chip component abuts against the circumferential surface is carried by a rotating disc at the circumferential surface It is a feature.

The chip component conveying device according to claim 4 of the present application is the chip component conveying device according to claim 3, wherein the second rotating disk is sucked by a grooved plate portion in which a suction groove is formed by half-etching and a cover of the suction groove. A lid plate portion serving as a hole, and the suction hole is open to the circumferential surface .

The chip component transport device according to the invention of claim 5 of the present application is the chip component transport device according to claim 3 or 4, wherein the suction holes are arranged in the circumferential direction of the circumferential surface so that a plurality of suction holes face one chip component. Is characterized in that a large number of are arranged.

  A chip component appearance inspection method according to a sixth aspect of the present invention uses the chip component conveying method according to the first or second aspect, and the first imaging means in a state where the chip component is conveyed by the first rotating disk. The upper surface of the chip component is imaged by the second imaging unit, one side surface of the chip component is imaged by the second imaging unit, and the chip component is conveyed by the third imaging unit in a state where the chip component is conveyed by the second rotating disk. And the other side surface of the chip part is imaged by the fourth imaging means.

A chip component visual inspection apparatus according to the invention of claim 7 of the present application comprises the chip component conveyance device of claim 3, 4 or 5,
A first imaging means for imaging the upper surface of the chip component and a second imaging means for imaging one side surface of the chip component in a state in which the chip component is being conveyed by the first rotating disk;
And a third imaging means for imaging the lower surface of the chip component and a fourth imaging means for imaging the other side surface of the chip component while the chip component is being conveyed by the second rotating disk. It is said.

The chip component conveying method according to the invention of claim 8 of the present application is as follows.
Using a first rotating disk that rotates in a horizontal plane and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk;
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and There is a gap narrower than the height of the chip component to be transported with respect to the chip component mounting surface, and the method includes:
Wherein the chip components conveyed by the rotation of said second rotary disc while sucking and holding the chip component at the circumferential surface of the second rotary disc, the circumferential surface of the chip component is held by suction is The chip component is moved from the circumferential surface to the chip component mounting surface when it comes to a portion closer to the center axis of the first rotating disc than the outer edge of the chip component mounting surface of the first rotating disc. after transfer, it is characterized by conveying the chip components by rotation of said first rotary disc while asked to support the chip component in the chip component mounting surface of the first rotating disk.

The chip component carrying method according to the invention of claim 9 is as follows:
Using a first rotating disk that rotates in a vertical plane and a second rotating disk that rotates in a vertical plane in the opposite direction to the first rotating disk;
A part of the outer peripheral surface of the second rotating disk is closer to the center axis side of the first rotating disk than the outer edge of the vertical chip component mounting surface of the first rotating disk, and the chip component There is a gap that is narrower than the height of the chip component to be conveyed with respect to the mounting surface, and this method is
Conveying the chip components by the rotation of the second rotary disk while sucking and holding the chip component at the outer peripheral surface of said second rotary disc, the outer peripheral surface that holds adsorbing the chip component is the first The chip component is transferred from the outer peripheral surface to the chip component mounting surface when it comes to a portion closer to the center axis of the first rotating disk than the outer edge of the chip component mounting surface of the one rotating disk. after, it is characterized by conveying the chip components by rotation of said first rotary disc while sucking and holding the chip component in the chip component mounting surface of the first rotating disk.

  The chip component conveying method according to the invention of claim 10 is characterized in that, in claim 8 or 9, the first rotating disk and the second rotating disk rotate continuously.

  The chip component conveying method according to the invention of claim 11 is the conveying path according to claim 1, 2, 8, 9 or 10 on the inner peripheral side of the conveying path of the chip component conveyed by the first rotating disk. A centering roller that is inscribed in contact with the outer peripheral surface of the centering roller so that the peripheral speed of the outer peripheral surface of the centering roller matches the peripheral speed of the first rotating disk at a position inscribed in the conveyance path. The posture of the chip component is corrected so as to be close to the tangential direction of the transport path.

The chip component conveying apparatus according to the invention of claim 12 of the present application is
A first rotating disk that rotates in a horizontal plane, and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk,
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and Present with a gap narrower than the height of the chip component to be conveyed with respect to the chip component placement surface,
The second rotary disk carries by the rotation of itself while maintaining suction chip components at the circumferential surface,
In the first rotating disk, the circumferential surface of the second rotating disk holding the chip component by suction is held on the chip component mounting surface by the chip component conveyed by the second rotating disk. receives where the outer edge came toward the central axis of its own, is characterized in the Turkey be conveyed by the rotation of itself while supported by the chip component mounting surface.

A chip component conveying apparatus according to the invention of claim 13 of the present application,
A first rotating disk that rotates in a vertical plane; and a second rotating disk that rotates in a vertical plane in a direction opposite to the first rotating disk;
A part of the outer peripheral surface of the second rotating disk is closer to the center axis side of the first rotating disk than the outer edge of the vertical chip component mounting surface of the first rotating disk, and the chip component It exists with a gap narrower than the height of the chip part to be transported with respect to the mounting surface,
The second rotating disk is conveyed by its own rotation while adsorbing and holding the chip components on the outer peripheral surface,
The first rotating disk is configured such that the outer peripheral surface of the second rotating disk holding the chip component by suction is the outer edge of the chip component mounting surface. receiving at came toward the central axis of itself than is characterized and Turkey be conveyed by the rotation of itself while holding adsorption in the chip component mounting surface.

  The chip component transport device according to the invention of claim 14 is the transport route according to claim 3, 4, 5, 12 or 13 on the inner peripheral side of the transport route of the chip component transported by the first rotating disk. A centering roller inscribed in the tip, and the peripheral speed of the centering roller coincides with the peripheral speed of the first rotating disk at a position inscribed in the transport path, and the tip contacts the outer peripheral surface of the centering roller It is characterized in that the posture of the component is corrected so as to approach the tangential direction of the transport path.

  The chip component conveying apparatus according to the invention of claim 15 is the chip component conveying device according to claim 3, 4, 5, 12, 13 or 14, wherein the first rotating disk has a plurality of suction holes for one chip component. A plurality of suction holes are arranged so that the suction holes are arranged in an annular shape at equal intervals so as to face each other, and a plurality of vacuum suction grooves so that one vacuum suction groove communicates with each suction hole group composed of a plurality of suction holes. And a vacuum suction plate portion in which a groove is formed, and the suction hole forming plate portion is integrated on the vacuum suction plate portion.

  The chip component appearance inspection method according to the invention of claim 16 of the present invention uses the chip component transport method of claim 8, 9, 10 or 11, and is in a state where the chip component is transported by the first rotating disk. The first imaging means images the upper surface of the chip component, the second imaging means images one side surface of the chip component, and the third imaging in a state where the chip component is conveyed by the second rotating disk. The lower surface of the chip component is imaged by the means, and the other side surface of the chip component is imaged by the fourth imaging means.

  The chip component appearance inspection method according to the invention of claim 17 uses the chip component transport method of claim 1, 2, 8, 9, 10 or 11 and transports the chip component with the first rotating disk. In this state, the first imaging means images the upper surface of the chip component, the second imaging means images one side surface of the chip component, the fourth imaging means images the other side surface of the chip component, The lower surface of the chip component is imaged by the third imaging means while the chip component is being conveyed by the second rotating disk.

A chip component visual inspection device according to the invention of claim 18 of the present application comprises the chip component transport device of claim 12, 13, 14 or 15,
A first imaging means for imaging the upper surface of the chip component and a second imaging means for imaging one side surface of the chip component in a state in which the chip component is being conveyed by the first rotating disk;
And a third imaging means for imaging the lower surface of the chip component and a fourth imaging means for imaging the other side surface of the chip component while the chip component is being conveyed by the second rotating disk. It is said.

A chip component visual inspection apparatus according to the invention of claim 19 includes the chip component transport device of claim 3, 4, 5, 12, 13, 14, or 15,
In a state where the chip component is being conveyed by the first rotating disk, a first imaging unit that images the upper surface of the chip component, a second imaging unit that images one side surface of the chip component, and an image of the other side surface A fourth imaging means for
And third imaging means for imaging the lower surface of the chip component in a state where the chip component is being conveyed by the second rotating disk.
The chip component carrying method according to the invention of claim 20 is characterized in that, in claim 1, 2 or 8, the chip component mounting surface is an upward horizontal plane.
The chip component carrying device according to the invention of claim 21 is characterized in that, in claim 3, 4, 5 or 12, the chip component mounting surface is an upward horizontal surface.

  According to the present invention, stable conveyance of the work posture by the first and second rotating disks and stabilization of the delivery operation by improving the delivery of the work between the rotating disks, and consequently the first and second rotating disks. It is possible to realize a chip component conveying method and apparatus that achieve high speed and stabilization of a series of workpiece conveyance.

  In addition, by using the chip component transport method and transport device, it is possible to realize a chip component visual inspection method and apparatus that can improve the number of inspection processes, reduce the inspection cost, improve the inspection accuracy, and improve the yield. In particular, it is effective in improving and stabilizing the inspection accuracy particularly in the appearance inspection of four surfaces of extremely small size chip parts (1005, 0603, 0402, etc.).

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a chip component carrying method and apparatus and an appearance inspection method and apparatus will be described below with reference to the drawings as the best mode for carrying out the present invention.

  Embodiment 1 of a chip component carrying method and apparatus, and an appearance inspection method and apparatus according to the present invention will be described with reference to FIGS. In these drawings, the first rotating disk 10 and the second rotating disk 20 constitute a conveying device for a rectangular parallelepiped chip component as a workpiece, and a chip mounting surface (upper surface) 11 at the outer edge portion of the first rotating disk 10. The chip parts 1 are sequentially supplied from the parts feeder 5. Here, the tip of the parts feeder 5 has a shape that guides the side surface of the chip component 1 in order to keep the posture of the chip component 1 properly when the chip component 1 is delivered to the first rotating disk 10 side. Alternatively, a non-vibrating portion may be provided at the tip to form a chip component guide.

  As shown in FIG. 2, the first rotary disk 10 is fixed to the first rotary drive shaft 16 and continuously rotates along with the continuous rotation of the rotary drive shaft 16. As shown in FIGS. 2, 3, and 5, a plurality of suction holes 12 are opened on the chip mounting surface 11 of the first rotating disk 10 in order to suck and hold the chip component 1. Further, a vacuum exhaust plate 13 that does not rotate is in close contact with the lower surface of the first rotary disk 10 (biased in a close contact direction by a spring 19), and a fixed vacuum suction groove 14 is formed on the upper surface of the vacuum exhaust plate 13. Is formed. The fixed vacuum suction groove 14 is connected to a vacuum exhaust system such as a vacuum pump through a hose 15. Therefore, the suction hole 12 on the first rotating disk 10 side vacuum-sucks the lower surface of the chip component 1 within a range communicating with the fixed vacuum suction groove 14. At that time, it is preferable that one chip component 1 is vacuum-sucked and held in the plurality of suction holes 12 as shown in FIG. For the purpose of reducing the leakage of the vacuum, the fixed vacuum suction groove 14 is formed so that the vacuum suction of the suction hole 12 is cut from the delivery of the chip component to the second rotating disk 20 side to the supply position of the chip component 1 before the supply position. The formation range is set (suction by the suction holes 12 is effective in the range of a half circumference in which the chip parts are conveyed). The vacuum can be switched on / off by the position of the fixed vacuum suction groove formed on the vacuum exhaust plate 13.

  The second rotating disk 20 sucks and holds the side surface of the rectangular chip component 1 with the circumferential surface (outer circumferential side surface) forming the vertical surface, and is fixed to the second rotation drive shaft 26 and rotated. As the drive shaft 26 rotates continuously, it rotates continuously. The second rotating disk 20 continuously rotates at substantially the same peripheral speed as the first rotating disk 10, and rotates in the same movement direction when the chip component 1 is transferred (the rotation direction of the second rotating disk 20 is the first rotation). The direction is opposite to the disk 10). Further, the second rotating disk 20 is above the first rotating disk 10 (there is a gap between the upper surface of the first rotating disk and the lower surface of the second rotating disk), and in a planar arrangement, the second rotating disk 20 is perpendicular to the second rotating disk 20. The peripheral surface is inside the outer edge of the chip mounting surface 11 of the first rotating disk 10 (on the central axis side of the first rotating disk), and the peripheral surface of the second rotating disk 20 is securely in contact with the chip component side surface. The positional relationship can be transferred.

  As shown in FIGS. 3 and 4, the second rotating disk 20 has a large number of minute suction holes 31 opened on a circumferential surface forming a vertical surface. The center height of each suction hole 31 is matched with the center of the chip component height on the first rotating disk 10. Further, the minute suction holes 31 include the annular grooved plate portion 21 in FIG. 4 (A) in which the minute suction grooves 31a are formed radially by half etching indicated by hatching in FIG. 4 (B), and the suction grooves. The second rotating disk 20 is obtained by overlapping the disk-like lid plate portion 22 for forming the micro suction hole 31 by covering the upper side of 31a as shown in FIG. 4 (D).

  As shown in FIG. 3 and FIG. 4B, the base portion of the group of minute adsorption grooves 31 a communicates with the merging groove portion 32, and the vacuum suction hole 33 formed in the disc-like lid plate portion 22 is further formed in the merging groove portion 32. Each communicates.

  A vacuum exhaust plate 27 that does not rotate is disposed in close contact with the upper surface of the second rotating disk 20, and a fixed vacuum suction groove 28 is formed on the lower surface of the second rotary disk 20 over a half circumference. Accordingly, the vacuum suction hole 33 on the disc-like lid plate portion 22 side is connected to a vacuum exhaust system such as a vacuum pump through the fixed vacuum suction groove 28 on the vacuum exhaust plate 27 side and the vacuum suction path 29 communicating with the fixed vacuum suction groove 28. As a result, the minute suction holes 31 opened on the vertical circumferential surface on the second rotating disk 20 side vacuum-suck the chip component 1 in a range communicating with the fixed vacuum suction groove 28. At that time, it is preferable that one chip component 1 is vacuum-sucked and held by a large number of minute suction holes 31 as shown in FIG.

  In such a conveying apparatus, the first rotating disk 10 continuously rotates at a peripheral speed faster than the supply speed of the chip parts on the part feeder 5 side, and the chip parts 1 are separated and conveyed by the speed difference. The chip components 1 supplied to the chip mounting surface 11 of the first rotary disk 10 are vacuum-sucked by the suction holes 12 of the first rotary disk 10 so that the chip parts 1 are aligned on the circumference and are substantially equally spaced. Then, it is conveyed while maintaining a stable posture, and reaches a contact point P that becomes a delivery position to the second rotating disk 20 when it moves half a circle.

  As shown in FIG. 1, it is preferable that a fixed alignment guide 15 is provided in front of the delivery position to align the traveling position and posture of the chip component 1 on the first rotating disk 10.

  Then, the peripheral surface (outer peripheral surface) forming the vertical surface of the second rotating disk 20 is brought into contact with the side surface side (outside) of the chip component 1 mounted on the first rotating disk 10 to rotate the chip component side surface in the second rotation. The disk 20 is held by suction.

  Here, the suction on the first rotating disk 10 side is turned off at the contact point P, and the second rotating disk 20 is turned on before the contact point so that the circumferential surface suction is turned on. The fixed vacuum suction grooves 14 and 28 are formed in the vacuum exhaust plates 13 and 27 corresponding to 20.

  Since the chip component 1 on the first rotating disk 10 comes closest to the second rotating disk 20 at the contact point P (as a result of contacting), the distance from the second rotating disk 20 gradually increases. It is desirable that the vacuum suction on the one-rotation disk 10 side is turned off in the vicinity of the contact point P. Further, since the second rotating disk 20 comes into contact with the chip component 1 at the contact point P, vacuum suction is effective before the contact point (for example, about 5 mm before) in view of the stability of suction. It is desirable that the vacuum suction overlaps in the vicinity of the contact point.

  In this way, the chip component 1 is continuously transferred from the first rotating disk 10 to the second rotating disk 20 with the chip component posture being stabilized. Therefore, the chip component 1 is not damaged because an excessive force exceeding the vacuum adsorption force is not applied.

  The chip component 1 transferred to the second rotating disk 20 is held by vacuum suction at the side surface by the minute suction holes 31 on the side surface and is transported over a half circumference, and then the vacuum suction of the minute suction holes 31 is turned off. As a result (the fixed vacuum suction groove 28 is formed only in a half circumference), it falls from the circumferential surface of the second rotating disk 20 and is collected.

  Next, a configuration in the case where the appearance inspection of the chip component is performed using the transfer device will be described.

  The first camera C1 and the second camera C2 as imaging means are arranged facing the conveying path of the chip component 1 of the first rotating disk 10, and opposed to the conveying path of the chip component 1 of the second rotating disk 20. A third camera C3 and a fourth camera C4 are arranged. The first camera C1 images and inspects (image processing inspection) the upper surface of the chip component 1, the second camera C2 images and inspects one side surface of the chip component 1, and the third camera C3 detects the lower surface of the chip component 1. The fourth camera C4 is used to image and inspect the other side surface of the chip part 1, and is, for example, a CCD camera or a line sensor.

  Further, the first to eighth workpiece detection sensors S1 to S8 are fixedly arranged along the conveyance path of the chip component 1 of the first rotating disk 10. Ninth to fourteenth workpiece detection sensors S9 to S14 are fixedly arranged along the conveyance path of the chip component 1 of the second rotating disk 20. Each of the sensors S1 to S14 is, for example, an optical sensor in which a light emitting side and a light receiving side are paired. The sensors S9 to S14 corresponding to the second rotating disk 20 are schematically shown in a horizontal arrangement in FIG. 1, but the chip component 1 is adsorbed on the vertical circumferential surface of the second rotating disk 20. Therefore, the sensors S9 to S14 are actually arranged in the vertical direction (up and down direction).

  Furthermore, the first to third actuators A1 to A3 correspond to the conveyance path of the chip component 1 on the first rotating disk 10 in order to eject the chip component 1 based on the sensor detection result, the imaging of each camera, and the inspection result. The fourth and fifth actuators A4 and A5 are arranged corresponding to the conveying path of the chip component 1 on the second rotating disk 10. As shown in FIG. 5, each actuator A1 to A5 employs a chip component discharge mechanism 40 using a piezo element, for example, in order to realize a discharge operation of a minute work. The actuators A4 and A5 are configured to drop the chip component adsorbed on the vertical circumferential surface of the second rotating disk 20 downward.

  The third, sixth, ninth, and twelfth workpiece detection sensors S3, S6, S9, and S12 provided in front of the first to fourth cameras C1 to C4 are triggers for imaging continuously conveyed objects. A signal is generated. Further, the second, fourth, seventh, tenth and thirteenth workpiece detection sensors S2, S4, S7, S10 and S13 provided in front of the first to fifth actuators A1 to A5 are for the workpiece discharging operation. The trigger signal is generated.

  In the present embodiment, the overall operation when performing an appearance inspection of a chip component will be described.

  As shown in FIG. 1, the chip component 1 as a workpiece is sequentially supplied from the tip of the parts feeder 5 to the chip mounting surface (upper surface) 11 of the outer edge of the first rotating disk 10. Since the first rotating disk 10 continuously rotates at a peripheral speed faster than the supply speed of the chip parts on the part feeder 5 side, the chip parts 1 are separated and conveyed by the speed difference. The chip components 1 supplied to the chip mounting surface 11 of the first rotary disk 10 are vacuum-sucked by the suction holes 12 of the first rotary disk 10 so that the chip parts 1 are aligned on the circumference and are substantially equally spaced. It keeps a stable posture and is transported.

  When the chip component 1 passes in front of the first and second workpiece detection sensors S1 and S2, the set of the first and second workpiece detection sensors S1 and S2 is not aligned (the pitch is defective). ) State, this is detected and the first actuator A1 is operated to return the unaligned chip component 1 to the parts feeder 5 via the unaligned component recovery part 7. The unaligned part collection unit 7 is a belt conveyor or the like.

  The aligned chip parts 1 that have passed in front of the first actuator A1 are detected by the third workpiece detection sensor S3 (in order to image continuously conveyed objects, a trigger signal for imaging is generated by the sensor in front of the camera). The upper surface is imaged and inspected (image processing inspection) by the first camera C1, and a chip component having a defective inspection result is detected by the fourth work detection sensor S4 (a sensor before the actuator generates a trigger signal for discharging). ) Is discharged by the second actuator A2. The fifth workpiece detection sensor S5 is for discharge confirmation.

  The chip part 1 after the upper surface inspection is further detected by the sixth work detection sensor S6, and then one side surface is imaged and inspected by the second camera C2, and the chip part having a defective inspection result is detected by the seventh work detection sensor S7. Later, it is discharged by the third actuator A3. The eighth workpiece detection sensor S8 is for discharge confirmation.

  The chip part 1 that has passed in front of the third actuator A3 is guided by the fixed alignment guide 15 so that the turning radius and posture of the chip part 1 are appropriate, and as shown in an enlarged view in FIG. The contact point P is reached.

  At the contact point P for delivering the chip component, both the vacuum suction of the suction hole 12 on the upper surface of the first rotary disk 10 and the vacuum suction of the suction hole 31 on the side surface of the second rotary disk 20 are both on. The side surface of the chip component 1 that is in contact with the vertical surface of the two-rotation disk 20 is adsorbed and held on the second rotation disk 20 side. Thereafter, the vacuum suction of the suction hole 12 on the first rotating disk 10 side is turned off as the chip part 1 moves, so that the chip part 1 is conveyed along with the continuous rotation of the second rotating disk 20.

  After the chip part 1 transferred to the second rotating disk 20 is detected by the ninth work detection sensor S9, the lower surface is imaged and inspected by the third camera C3. After the passage is detected by the sensor S10, it is discharged by the fourth actuator A4. The eleventh workpiece detection sensor S11 is for discharge confirmation.

  The chip part 1 after the lower surface inspection is further detected by the twelfth workpiece detection sensor S12, the other side surface is imaged and inspected by the fourth camera C4, and the chip part having a defective inspection result is detected by the thirteenth workpiece detection sensor S13. Later, it is discharged by the fifth actuator A5. The fourteenth workpiece detection sensor S14 is for discharge confirmation. Then, the non-defective chip component 1 that has been inspected for the total of four surfaces including the upper surface, one side surface, the lower surface, and the other side surface reaches the non-defective product discharge position Q, and the vacuum suction of the suction hole 31 of the second rotating disk 20 is performed here. By turning off, the chip component 1 is discharged and collected.

  According to the first embodiment, the following effects can be obtained.

(1) After the chip part 1 as a workpiece is sucked and held on a horizontal plane by the first rotating disk 10, the chip part 1 is sucked and held on the vertical surface of the second rotating disk 20, and transported. The chip component can be transferred from the first rotating disk 10 to the second rotating disk 20 regardless of variations in the thickness of the chip component, and the chip component delivery operation is reliable. There are no inconveniences or chip component damage accidents due to thickness variations of the chip parts as in the conventional examples of FIGS. In addition, the chip parts can be transferred without changing the posture of the chip parts (without vertical or horizontal inversion), and stable conveyance is possible.

(2) The first rotating disk 10 and the second rotating disk 20 are continuously rotated, and the chip component 1 is sucked and held by the suction hole 12 in the first rotating disk 10 and the suction hole 31 in the second rotating disk 20 and transported. By doing so, it is possible to increase the conveying speed and stabilize the conveying posture of the chip component.

(3) The second rotating disk 20 has a large number of minute suction holes 31 arranged in the circumferential direction on the circumferential surface forming the vertical plane, and the side surfaces of the individual chip components 1 are arranged on the side surfaces of the many minute suction holes 31. By adsorbing with, stable conveyance can be performed without causing a deviation of the conveyance posture. Then, the second rotating disk 20 includes an annular grooved plate portion 21 in which a large number of suction grooves 31a are radially formed by half etching, and a disk-shaped lid plate portion that covers the suction grooves 31a to form suction holes 31. The second rotating disk 20 having a large number of minute suction holes 31 opened on the circumferential surface can be configured with a small number of structural members (a combination of two plate portions).

(4) Due to the above (1) to (3), the number of inspection processes (processing capacity) in the case of visual inspection of the four surfaces (upper and lower surfaces and two side surfaces) of the chip component is improved (1.3 to 3 in the conventional example) 2.0 times), the inspection cost can be reduced.

(5) The inspection accuracy can be improved and the yield in the inspection process can be expected to improve. In particular, it is possible to improve and stabilize the inspection accuracy and to obtain a highly reliable inspection method and apparatus for ultra-small chip parts (1005 type, 0603 type, 0402 type, etc.) having a length of 1 mm or less. It should be noted that, like capacitors, inductors, thermistors, varistors, etc., the thickness and width of the chip component shape are approximately the same, in other words, a rectangular parallelepiped chip component whose cross section is almost square is conveyed. Above preferred. It is not suitable for a flat chip having a small thickness such as a chip resistor.

  A second embodiment of the present invention will be described with reference to FIGS. In these drawings, the first rotating disk 10 and the second rotating disk 20 constitute a conveying device for a rectangular parallelepiped chip component as a workpiece, and a chip mounting surface (upper surface) 11 at the outer edge portion of the first rotating disk 10. The configuration in which the chip parts 1 are sequentially supplied from the parts feeder 5 is the same as in the first embodiment.

  Here, when supplying the chip parts from the parts feeder 5 to the first rotating disk 10, the chute portion of the parts feeder 5 is disposed above the chip mounting surface 11 of the first rotating disk 10, as shown in FIG. A slight gap is required so that the one-turn disc 10 and the chute portion of the parts feeder 5 do not interfere with each other. Further, when the chip component 1 is delivered to the first rotating disk 10, the bottom surface (conveying surface) 5 b of the work conveying groove 5 a as a chute part of the parts feeder 5 and the chip mounting surface 11 of the first rotating disk 10 If the distance D is not shortened as much as possible, the tilt (incident angle) of the chip component at the time of delivery becomes large, and the problem of poor posture such as standing of the chip component 1 occurs. For this reason, it is necessary to make the wall thickness T of the bottom surface portion of the workpiece conveying groove 5 of the parts feeder 5 as thin as possible. 10A, since the thickness T of the bottom surface portion of the workpiece conveying groove 5 is not thin, the distance D from the chip mounting surface 11 of the first rotary disk 10 is also large, and the extremely small chip component. In this case, the incident angle becomes excessive, but the chip placement of the first rotating disk 10 is achieved by setting the bottom surface portion of the work conveying groove 5 to be as thin as possible T ′ as shown in FIG. By reducing the distance to the surface 11 to D ′ and forming the inclined surface 5c at the tip of the workpiece conveying groove 5a, the incident angle of the chip component is reduced, and the chip component 1 is transferred to the chip mounting surface 11 The posture can be stabilized. This effect is particularly remarkable in the case of extremely small chip components.

  Further, when the chip component 1 is supplied from the parts feeder 5 to the first rotating disk 10, the chute portion of the parts feeder 5 is located among the four longitudinal surfaces of the chip component 1 as shown in FIGS. However, when the chip part 1 comes out of the chute and is supplied to the chip mounting surface 11, the first shape is eliminated. When the chip component is transferred to the chip mounting surface 11 of the rotary disk 10, the chip component rotates, and the chip component posture varies. If the posture of the chip component varies, the reflected state of the inspection surface varies in appearance inspection in a later process, which causes a decrease in inspection accuracy.

  In order to improve the variation in the posture of the chip component 1, both side surfaces of the chute part are more than the bottom surface 5b for the purpose of constraining both side surfaces of the chip part 1 at the delivery position as shown in FIGS. Or a workpiece posture regulation guide 5d ′ provided separately as shown in FIGS. 12A and 12B.

  However, when the workpiece posture regulation guides 5d and 5d 'are provided, it is necessary to consider workpiece dimension tolerance. For example, a 0603 size capacitor has a workpiece size of 0.3 ± 0.03 mm in width and height, 0.6 ± 0.03 mm in length, and a guide width of 0.33 mm or more. Actually, it is necessary to consider the maximum dimension and 0.35 mm for the guide width dimension. When considering a workpiece having the minimum tolerance, a gap of 0.08 mm is generated at the maximum, and a gradient of 7.6 degrees is generated at the maximum of a workpiece length of 0.6 mm.

  From the experimental results, it was found that the inclination of the chip component allowable in the visual inspection is within ± 6 degrees. If the angle exceeds ± 6 degrees, the reflected light changes, and therefore, the defect extraction of the chip parts will vary.

  Therefore, the workpiece posture regulation guides 5d and 5d 'shown in FIGS. 11 and 12 are not sufficient for the appearance inspection. For this reason, as shown in FIG. 9, a centering roller 60 serving as a posture correction unit that further corrects the posture of the chip component is provided above the first rotating disk 10 before the appearance inspection. In this case, the centering roller 60 is continuously rotated, and the outer peripheral surface is inscribed in the inner peripheral side of the annular transport path of the chip component 1 transported by the first rotating disk 10. The peripheral speed of 60 coincides with the peripheral speed of the first rotating disk 10 at a position inscribed in the transport path (corresponds to the peripheral speed of the inner side surface of the chip part moving on the transport path). Posture correction is performed so that the posture of the chip component 1 in contact with the outer peripheral surface is brought closer to the tangential direction of the transport path.

  As described above, by matching the peripheral speed of the centering roller 60 continuously rotating above the first rotating disk 10 with the peripheral speed of the chip component, the chip component posture is deteriorated due to frictional resistance at the time of contact, and the centering roller 60. And the tip part as a moving object during continuous conveyance at high speed can be corrected.

  The posture of the chip component 1 is suppressed within a certain variation range by the workpiece posture regulation guides 5d and 5d 'at the tip portion of the chute portion of the parts feeder 5, and the posture of the chip component is corrected by performing high-precision posture correction by the centering roller 60. It is possible to be within ± 5 degrees (within 4σ, where σ is standard deviation).

  Further, the first rotating disk 10 will be described. Conventionally, when a work is supplied to a continuously rotating suction disk, the work supply is irregularly supplied, so that the positional relationship between the suction holes and the work can be controlled. Therefore, a porous suction disk was used, and it was possible to hold and hold the workpiece regardless of the position of the workpiece and the suction hole. However, as in each embodiment of the present invention, when using two suction disks and transferring chip parts as workpieces between the suction disks, the porous disk cannot perform the switching of the vacuum well, There is a problem that the delivery of the workpiece is not stable (the porous operation causes a vacuum around it, and the delivery operation is not stable because the vacuum does not break when the workpiece is delivered).

  Therefore, in the present embodiment, the first rotating disk 10 has a structure shown in FIGS. That is, the first rotating disk 10 has the suction holes 12 in an annular shape so that the plurality of suction holes 12 shown in FIGS. 14A and 14B face (open) with respect to one chip component 1. A plurality of suction hole forming plate portions 65 arranged at intervals and a vacuum suction groove 67 shown in FIGS. 15A and 15B communicate with each other corresponding to each suction hole group including a plurality of suction holes 12. And a vacuum suction plate portion 66 in which a plurality of vacuum suction grooves 67 are separately formed in an island shape, and the suction hole forming plate portion is formed on the vacuum suction plate portion 66 as shown in FIGS. 65 is an integrated configuration. As shown in FIG. 2 of the first embodiment, a vacuum exhaust plate 13 that does not rotate is in close contact with the lower surface of the first rotary disk 10, and a vacuum suction groove that communicates with the fixed vacuum suction groove 14. 67 is vacuumed.

  As a method for forming equal pitch suction holes on the suction hole forming plate portion 65, etching processing or laser processing on a stainless steel plate is used. In particular, when the workpiece size is 0402 size or the like, the suction hole diameter is preferably 0.1 mm or less, but the hole diameter variation increases in etching. In addition, because the hole diameter that can be machined and the plate thickness of the stainless steel are limited in etching (generally, the hole diameter and plate thickness that can be machined are limited to 1: 1, so the plate thickness of the stainless steel plate is 0. 1). There are also problems such as difficulty in obtaining the rigidity of the stainless steel material. For this reason, it is suitable to form a suction hole by applying laser processing using a UV-YAG laser or a femtosecond laser to a stainless steel plate. In this case, a plate thickness of 0.3 mm can be realized.

  As can be seen from FIG. 13B, the circumference passing through the center of the chip component conveyance path to suck and hold the chip component on the vacuum suction plate portion 66 provided with the vacuum suction groove 67 formed in an island shape. By forming a large number of minute suction holes 12 at equal intervals on the chip parts, the chip parts can be sucked and held regardless of the chip part supply position, and the vacuum suction communication is turned on for each vacuum suction groove 67 formed in an island shape (ON ), Can be cut off (off), and chip component delivery during continuous conveyance of the chip component 1 can be performed stably.

  Other configurations of the second embodiment are the same as those of the first embodiment described above, and the same or corresponding parts are denoted by the same reference numerals and description thereof is omitted.

  FIG. 16 is a third embodiment of the present invention, which is an example in which the arrangement of cameras as imaging means for performing appearance inspection is changed. In this case, the first camera C1, the second camera C2, and the fourth camera C4 as imaging means are arranged facing the conveyance path of the chip component 1 of the first rotating disk 10, and the chip of the second rotating disk 20 is disposed. A third camera C3 is disposed to face the conveyance path of the component 1. The first camera C1 corresponding to the conveying path of the first rotating disk 10 images and inspects (image processing inspection) the upper surface of the chip component 1, and the second camera C2 images and inspects one side of the chip component 1, The fourth camera C4 is for imaging and inspecting the other side surface of the chip component 1, and the third camera C3 corresponding to the transport path of the second rotating disk 20 is for imaging and inspecting the lower surface of the chip component 1. For example, a CCD camera or a line sensor. In this case, the first rotating disk 10 conveys chip components about 3/4 rounds to enable the arrangement of three cameras.

  Other configurations of the third embodiment are the same as those of the first or second embodiment described above, and the same or corresponding parts are denoted by the same reference numerals and description thereof is omitted.

  FIG. 17 shows a fourth embodiment of the present invention, which is the same as the first, second, and third embodiments in that the first rotating disk 10 and the second rotating disk 20 are used to convey chip components. The structure which replaced the order of chip components conveyance is shown.

  That is, the chip component 1 is sequentially supplied from the parts feeder 5 so as to be in contact with the circumferential surface (outer circumferential surface) forming the vertical surface of the second rotating disk 20. As shown in FIGS. 18A and 18B, the second rotating disk 20 has minute suction holes 31 on the circumferential surface thereof, so that the chip component 1 is held by vacuum suction and transported over a half circumference. Then, the vacuum suction is released, and the chip is transferred to the chip mounting surface (upper surface) 11 at the outer edge of the first rotating disk 10.

  The chip component 1 transferred to the first rotating disk 10 is held by vacuum suction through a minute suction hole of the chip mounting surface 11 and is transported over a half circumference.

  As shown in FIG. 18A, the receiving part 70 having a flat surface for supporting the chip part 1 at a predetermined height is provided at a position where the chip part 1 is supplied from the parts feeder 5 to the circumferential surface of the second rotary disk 20. The second rotating disk 20 is continuously rotated at a peripheral speed faster than the supply speed of the chip parts on the part feeder 5 side, so that the chip parts 1 can be separated and conveyed by the speed difference.

  FIG. 18B is an example of the first, fourth, and fifth actuators A1, A4, and A5 in the fourth embodiment. In the case of the first actuator A1 in the piezo actuator 75 using a piezo element, it is not aligned ( Chip components with defective pitch) are dropped and discharged. In the case of the fourth and fifth actuators A4 and A5, chip components with defective appearance are dropped and discharged. Work detection sensors are arranged before and after each actuator (the sensor function is the same as described in the first embodiment).

  Other configurations of the fourth embodiment are the same as those of the first or second embodiment described above, and the same or corresponding parts are denoted by the same reference numerals and description thereof is omitted.

  In the fourth embodiment, the overall operation when performing an appearance inspection of a chip component will be described.

  As shown in FIG. 17, the chip component 1 as a workpiece is sequentially supplied from the tip of the parts feeder 5 so as to contact the circumferential surface (outer peripheral surface) of the second rotating disk 20. Since the second rotating disk 20 continuously rotates at a peripheral speed faster than the supply speed of the chip component on the part feeder 5 side, the chip component 1 is separated and conveyed by the speed difference. The chip parts 1 supplied so as to be in contact with the circumferential surface of the second rotating disk 20 are vacuum-sucked by the suction holes 31 of the second rotating disk 20 so that the chip parts 1 are aligned and arranged at almost equal intervals. It is transported while maintaining a stable posture.

  When there is an unaligned (pitch defect) chip component 1 when passing through the first actuator A1, it is returned to the parts feeder 5 via the unaligned component recovery unit 7. The unaligned part collection unit 7 is a belt conveyor or the like.

  The chip part 1 in the aligned state that has passed through the first actuator A1 is imaged and inspected by the third camera C3, and the chip part having a defective inspection result is discharged by the fourth actuator A4.

  The chip part 1 after the lower surface inspection is further imaged and inspected by the fourth camera C4, and a chip part having a defective inspection result is discharged by the fifth actuator A5.

  At the point P for transferring the chip parts from the second rotating disk 20 to the first rotating disk 10, the vacuum suction of the suction hole 12 on the upper surface of the first rotating disk 10 and the vacuum of the suction hole 31 on the side surface of the second rotating disk 20 are performed. Both the suction and the suction are turned on, and the chip component 1 in contact with the horizontal surface of the first rotating disk 10 is adsorbed on the bottom surface and held on the first rotating disk 10 side. Thereafter, the vacuum suction of the suction hole 31 on the second rotating disk 20 side is turned off as the chip part 1 moves, so that the chip part 1 is conveyed along with the continuous rotation of the first rotating disk 10.

  Then, the upper surface of the chip component 1 is imaged and inspected (image processing inspection) by the first camera C1, and the chip component having a defective inspection result is discharged by the second actuator A2. The chip part 1 after the upper surface inspection is further imaged and inspected by the second camera C2, and the remaining one side is discharged by the third actuator A3. Then, the non-defective chip component 1 that has been inspected for a total of four surfaces including the lower surface, one side surface, the upper surface, and the other side surface reaches the non-defective product discharge position Q, and the vacuum suction of the first rotating disk 10 is turned off here. The chip part 1 is discharged and collected by a collecting means (not shown).

  In the fourth embodiment, the first rotating disk 10 is positioned below the second rotating disk 20 and the bottom surface of the chip component is sucked and supported by the first rotating disk 10. The upper surface of the chip component may be sucked and supported by the first rotating disk 10 so that the upper surface of the chip component is disposed on the upper side of the second rotating disk 20 and the suction holes 12 open downward.

  In the first to fourth embodiments, the first rotating disk 10 and the second rotating disk 20 are continuously rotated in a horizontal plane. However, both the first rotating disk 10 and the second rotating disk 20 are vertical surfaces ( A fifth embodiment configured to continuously rotate within a vertical plane) will be described with reference to FIG.

  In the fifth embodiment of FIG. 19, the second rotating disk 20 is rotated in a vertical plane and sucks and holds the chip component on the circumferential surface (outer peripheral surface) where the suction holes are opened. The chip component 1 is supplied from the parts feeder 5 onto the circumferential surface. The first rotating disk 10 rotates in a vertical plane, receives a chip component from the second rotating disk 20 at a point P, and sucks and holds the chip component on one side vertical surface where the suction holes are opened. Is.

  Except that both the first rotating disk 10 and the second rotating disk 20 are continuously rotated in a vertical plane (vertical plane), the configuration and operation are substantially the same as those in the above-described fourth embodiment, and the same or corresponding parts. The same reference numerals are given and the description is omitted.

  In addition, the conveyance system of the chip component in each of the above embodiments can be used not only for the appearance inspection of the chip component but also for other measuring machines.

  In each of the above embodiments, an actuator using a piezo element is used as a chip component discharge mechanism. However, it is also possible to use a configuration in which air blowing is used as a chip component discharge method for defective products.

  The camera arrangement of the third embodiment shown in FIG. 16 can also be applied to the fourth or fifth embodiment. The bottom surface of the chip component is imaged with one camera on the second rotating disk side, and the rest It is good also as a structure which images 3 surfaces with three cameras by the side of a 1st rotation disk.

  Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows Embodiment 1 of the chip component conveyance method and apparatus which concerns on this invention, and an external appearance inspection method and apparatus. FIG. 3 is a front sectional view of the first embodiment. In Embodiment 1, it is an expanded plane sectional view of the delivery part from the 1st rotation disk to the 2nd rotation disk. FIG. 2A is a structural member of the second rotating disk according to the first embodiment, where FIG. 3A is a plan view of an annular grooved plate portion, and FIG. The X-part enlarged view of the formed plan view of (A), (C) is a plan view of a disc-like lid plate part that forms a micro-adsorption hole by covering the upper side of the micro-adsorption groove, and (D) is an annular shape. It is a partial side view of the state where the grooved plate portion and the disc-like lid plate portion were overlapped to form a fine suction hole. FIG. 3 is a schematic configuration diagram of an actuator for discharging chip components used in the first embodiment. It is a top view which shows the conventional conveying apparatus. FIG. It is a Y arrow line view of FIG. It is a top view which shows Embodiment 2 of this invention. It is a structure of the part which supplies a chip component from a parts feeder to a 1st rotation disc, Comprising: (A) is a fragmentary sectional side view before improvement of chip component incident angle, (B) is chip component incident angle in Embodiment 2. FIG. It is the structure of the part which supplies a chip component from the parts feeder in Embodiment 2 to a 1st rotation disc, (A) is a top view of the guide part using a chute | shoot part side surface, (B) is the same sectional side view. is there. FIG. 5B is another configuration of the part for supplying chip parts from the parts feeder to the first rotating disk in the second embodiment, and FIG. 5A is a plan view of a configuration in which a separate guide part is provided on the tip side of the chute part; ) Is a cross-sectional side view of the same side. It is a structure of the 1st rotation disc in Embodiment 2, Comprising: (A) is a front sectional view, (B) is an enlarged plan view. It is the suction hole formation plate part which comprises a 1st rotation disk similarly, Comprising: (A) is a top view, (B) is a front sectional view. Similarly, it is a vacuum suction plate part which comprises a 1st rotation disc, Comprising: (A) is a top view, (B) is a front sectional view. It is a top view which shows Embodiment 3 of this invention. It is a top view which shows Embodiment 4 of this invention. FIG. 4 is a configuration around the second rotating disk in the fourth embodiment, where (A) is a schematic configuration diagram of a portion for supplying chip parts from the parts feeder to the second rotating disk, and (B) is around the second rotating disk. It is a schematic block diagram of the actuator for chip | tip component discharge | emission provided. It is a side view which shows Embodiment 5 of this invention.

Explanation of symbols

1 Chip parts 5,50 Parts feeder
7 Unaligned parts collection part 10,20 Rotating disk 21,22 Plate part 11 Chip mounting surface
12, 31 Suction hole 31a Suction groove 13, 27 Vacuum exhaust plate 14, 28 Fixed vacuum suction groove 15 Hose 16, 26 Rotating drive shaft 40 Chip component discharge mechanism 60 Centering roller 65 Suction hole forming plate section 66 Vacuum suction plate section 67 Vacuum Suction groove A1-A5 Actuator C1-C4 Camera P Point S1-S14 Work detection sensor

Claims (21)

Using a first rotating disk that rotates in a horizontal plane and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk;
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and There is a gap narrower than the height of the chip component to be transported with respect to the chip component mounting surface, and the method includes:
Wherein conveying the chip components by the rotation of said first rotary disc while asked to support the chip component in the chip component mounting surface of the first rotating disk, the circumferential surface of the second rotary disk after out said chip than the outer edge of the component placement surface is brought into contact with the chip component to a portion in the center axis side of the first rotary disc, the chips at the circumferential surface of the second rotary disk A chip component conveying method comprising conveying the chip component by rotation of the second rotating disk while adsorbing and holding the component.   The chip part conveying method according to claim 1, wherein the first rotating disk and the second rotating disk rotate continuously. A first rotating disk that rotates in a horizontal plane, and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk,
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and Present with a gap narrower than the height of the chip component to be conveyed with respect to the chip component placement surface,
Said first rotary disc, the said by rotation of its own while asked to support the chip component in the chip component mounting surface conveys the chip components, said chip part of the circumferential surface of the second rotary disk The chip component is brought into contact with a portion on the center axis side of the outer surface of the placement surface,
It said second rotary disk includes a Turkey be conveyed by the rotation of itself while holding adsorbing the first of the chip component abuts against the circumferential surface is carried by a rotating disc at the circumferential surface A chip component conveying device. The second rotating disk has a grooved plate portion in which an adsorption groove is formed by half-etching, and a lid plate portion that serves as an adsorption hole by covering the adsorption groove, and the adsorption hole is formed on the circumferential surface. 4. The chip part conveying apparatus according to claim 3, wherein the chip part conveying apparatus is open. 5. The chip part conveying apparatus according to claim 3, wherein a plurality of the suction holes are arranged in a circumferential direction of the circumferential surface so that a plurality of suction holes face one chip part.   Using the chip component transport method according to claim 1 or 2, in a state where the chip component is transported by the first rotating disk, the first imaging unit captures an upper surface of the chip component, and the second imaging. One side surface of the chip component is imaged by the means, and the lower surface of the chip component is imaged by the third imaging means while the chip component is being conveyed by the second rotating disk, and the chip is captured by the fourth imaging means. A chip component visual inspection method, wherein the other side surface of the component is imaged. While comprising the chip component conveying device of claim 3, 4 or 5,
A first imaging means for imaging the upper surface of the chip component and a second imaging means for imaging one side surface of the chip component in a state in which the chip component is being conveyed by the first rotating disk;
And a third imaging means for imaging the lower surface of the chip component and a fourth imaging means for imaging the other side surface of the chip component while the chip component is being conveyed by the second rotating disk. Chip part appearance inspection device. Using a first rotating disk that rotates in a horizontal plane and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk;
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and There is a gap narrower than the height of the chip component to be transported with respect to the chip component mounting surface, and the method includes:
Wherein the chip components conveyed by the rotation of said second rotary disc while sucking and holding the chip component at the circumferential surface of the second rotary disc, the circumferential surface of the chip component is held by suction is The chip component is moved from the circumferential surface to the chip component mounting surface when it comes to a portion closer to the center axis of the first rotating disc than the outer edge of the chip component mounting surface of the first rotating disc. after transfer, the chip component, characterized by conveying the chip components by rotation of said first rotary disc while asked to support the chip component in the chip component mounting surface of the first rotating disk Transport method. Using a first rotating disk that rotates in a vertical plane and a second rotating disk that rotates in a vertical plane in the opposite direction to the first rotating disk;
A part of the outer peripheral surface of the second rotating disk is closer to the center axis side of the first rotating disk than the outer edge of the vertical chip component mounting surface of the first rotating disk, and the chip component There is a gap that is narrower than the height of the chip component to be conveyed with respect to the mounting surface, and this method is
Conveying the chip components by the rotation of the second rotary disk while sucking and holding the chip component at the outer peripheral surface of said second rotary disc, the outer peripheral surface that holds adsorbing the chip component is the first The chip component is transferred from the outer peripheral surface to the chip component mounting surface when it comes to a portion closer to the center axis of the first rotating disk than the outer edge of the chip component mounting surface of the one rotating disk. and then, the chip component conveyance method characterized in that by rotation of said first rotary disc while maintaining adsorbing the chip component in the chip component mounting surface of the first rotating disk conveying the chip components.   The chip part conveying method according to claim 8 or 9, wherein the first rotating disk and the second rotating disk rotate continuously.   A centering roller inscribed in the conveying path is used on the inner circumference side of the conveying path of the chip parts conveyed by the first rotating disk, and the peripheral speed of the first rotating disk is in a position inscribed in the conveying path. The peripheral speed of the outer peripheral surface of the centering roller is matched, and the posture of the chip component that contacts the outer peripheral surface of the centering roller is corrected so as to approach the tangential direction of the transport path. 10. The method for conveying a chip part according to 10. A first rotating disk that rotates in a horizontal plane, and a second rotating disk that rotates in a horizontal plane in a direction opposite to the first rotating disk,
A portion of the vertical circumferential surface of the second rotating disk is closer to the central axis side of the first rotating disk than the outer edge of the horizontal chip component mounting surface of the first rotating disk, and Present with a gap narrower than the height of the chip component to be conveyed with respect to the chip component placement surface,
The second rotary disk carries by the rotation of itself while maintaining suction chip components at the circumferential surface,
In the first rotating disk, the circumferential surface of the second rotating disk holding the chip component by suction is held on the chip component mounting surface by the chip component conveyed by the second rotating disk. It receives where the outer edge came toward the central axis of its own, the chip parts conveying apparatus according to claim and Turkey be conveyed by the rotation of itself while supported by the chip component mounting surface. A first rotating disk that rotates in a vertical plane; and a second rotating disk that rotates in a vertical plane in a direction opposite to the first rotating disk;
A part of the outer peripheral surface of the second rotating disk is closer to the center axis side of the first rotating disk than the outer edge of the vertical chip component mounting surface of the first rotating disk, and the chip component It exists with a gap narrower than the height of the chip part to be transported with respect to the mounting surface,
The second rotating disk is conveyed by its own rotation while adsorbing and holding the chip components on the outer peripheral surface,
The first rotating disk is configured such that the outer peripheral surface of the second rotating disk holding the chip component by suction is the outer edge of the chip component mounting surface. receiving at came toward the central axis of itself than the chip parts conveying apparatus according to claim and Turkey be conveyed by the rotation of itself while holding adsorption in the chip component mounting surface.   A centering roller inscribed in the conveying path is provided on the inner peripheral side of the conveying path of the chip component conveyed by the first rotating disk, and the circumferential speed of the centering roller is the first in the position inscribed in the conveying path. 14. A chip component that matches the peripheral speed of the rotating disk 1 and that is in contact with the outer peripheral surface of the centering roller is corrected so as to approach the tangential direction of the transport path. The chip component conveying apparatus as described.   The first rotating disk includes a plurality of suction hole forming plate portions arranged at equal intervals in an annular shape so that a plurality of suction holes face one chip component, and a plurality of suction holes. A plurality of vacuum suction plates formed so that one vacuum suction groove communicates with each suction hole group, and the suction hole forming plate portion is integrated on the vacuum suction plate portion. 15. The chip part conveying apparatus according to claim 3, 4, 5, 12, 13, or 14.   Using the chip component transport method according to claim 8, 9, 10 or 11, in a state where the chip component is transported by the first rotating disk, the top surface of the chip component is imaged by the first imaging means, The second imaging unit images one side surface of the chip component, and the third imaging unit images the lower surface of the chip component while the chip component is conveyed by the second rotating disk. A chip component appearance inspection method, wherein the other side surface of the chip component is imaged by an imaging means.   Using the chip component transport method of claim 1, 2, 8, 9, 10 or 11, the top surface of the chip component is covered by the first imaging means in a state where the chip component is transported by the first rotating disk. An image is taken, one side surface of the chip component is imaged by the second imaging means, the other side surface of the chip component is imaged by the fourth imaging means, and the chip component is conveyed by the second rotating disk A chip component appearance inspection method, wherein the lower surface of the chip component is imaged by a third imaging means. The chip component transport device according to claim 12, 13, 14 or 15 is provided,
A first imaging means for imaging the upper surface of the chip component and a second imaging means for imaging one side surface of the chip component in a state in which the chip component is being conveyed by the first rotating disk;
And a third imaging means for imaging the lower surface of the chip component and a fourth imaging means for imaging the other side surface of the chip component while the chip component is being conveyed by the second rotating disk. Chip part appearance inspection device. Including the chip component transport device according to claim 3, 4, 5, 12, 13, 14, or 15;
In a state where the chip component is being conveyed by the first rotating disk, a first imaging unit that images the upper surface of the chip component, a second imaging unit that images one side surface of the chip component, and an image of the other side surface A fourth imaging means for
A chip component appearance inspection apparatus comprising: a third imaging unit that images a lower surface of the chip component while the chip component is being conveyed by the second rotating disk. The chip component carrying method according to claim 1, wherein the chip component placement surface is an upward horizontal surface. The chip component carrying device according to claim 3, wherein the chip component mounting surface is an upward horizontal surface.

Images