Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP4313285B2 - Edge processing device for plate workpiece - Google Patents
[go: Go Back, main page]

JP4313285B2 - Edge processing device for plate workpiece - Google Patents

Edge processing device for plate workpiece Download PDF

Info

Publication number
JP4313285B2
JP4313285B2 JP2004333632A JP2004333632A JP4313285B2 JP 4313285 B2 JP4313285 B2 JP 4313285B2 JP 2004333632 A JP2004333632 A JP 2004333632A JP 2004333632 A JP2004333632 A JP 2004333632A JP 4313285 B2 JP4313285 B2 JP 4313285B2
Authority
JP
Japan
Prior art keywords
workpiece
grindstone
disc
peripheral surface
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004333632A
Other languages
Japanese (ja)
Other versions
JP2006142418A (en
Inventor
一 斉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nakamura Tome Precision Industry Co Ltd
Original Assignee
Nakamura Tome Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nakamura Tome Precision Industry Co Ltd filed Critical Nakamura Tome Precision Industry Co Ltd
Priority to JP2004333632A priority Critical patent/JP4313285B2/en
Publication of JP2006142418A publication Critical patent/JP2006142418A/en
Application granted granted Critical
Publication of JP4313285B2 publication Critical patent/JP4313285B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Description

この発明は、板状のワークの辺縁(辺ないし縁)を研削加工する装置に関するもので、特にディスプレイパネル用のガラス基板やセラミックス板などの硬質脆性板の辺縁の面取加工、端面仕上加工その他の整形加工に特に適した上記装置に関するものである。   The present invention relates to an apparatus for grinding a side edge (side or edge) of a plate-like workpiece, and in particular, chamfering and edge finishing of a hard brittle plate such as a glass substrate or a ceramic plate for a display panel. The present invention relates to the above apparatus particularly suitable for machining and other shaping processes.

ガラス基板その他の硬質脆性板の切断辺に鋭い稜(エッジ)が形成され、この部分から欠けやクラックが発生するのを防止するために、またこれらの部材を取り扱う際の危険を防止するために、その切断面を平滑にする加工や稜の面取加工などの整形加工が行われる。 Sharp edges for cutting the sides of the glass substrate other hard and brittle plate (edge) is formed, in order to prevent the chipping or cracking is generated from this portion, and to prevent the risk of when handling these members Further, a shaping process such as a process of smoothing the cut surface or a chamfering process of a ridge is performed.

この種の整形加工は、加工しようとするワークの辺縁に沿って回転砥石を相対移動させることによって行うのが普通であるが、加工用の砥石の配置として、図4に示すように、加工しようとするワーク1の辺縁4の外側上下に当該辺縁と平行ないし略平行な砥石軸6回りに回転する複数の円盤砥石7(7a、7b・・・)を備えた砥石ユニット3u、3dを配置する構造が提案されている。この構造では、図5に示すように、上下の砥石7の外周面がワークの辺縁4の上下のエッジにそれぞれ接触して、当該エッジの面取加工を行う。矢印Rは、加工時の砥石7の回転方向である。   This type of shaping is usually performed by relatively moving the rotating grindstone along the edge of the workpiece to be machined. However, as shown in FIG. A grindstone unit 3u, 3d provided with a plurality of disc grindstones 7 (7a, 7b...) Rotating around a grindstone axis 6 parallel to or substantially parallel to the marginal edge 4 of the workpiece 1 to be worked. The structure which arrange | positions is proposed. In this structure, as shown in FIG. 5, the outer peripheral surfaces of the upper and lower grindstones 7 come into contact with the upper and lower edges of the edge 4 of the workpiece, respectively, and chamfering the edges is performed. Arrow R is the direction of rotation of the grindstone 7 during processing.

更に特許文献1には、上記の複数枚の円盤砥石を備えた辺縁加工装置において、各円盤砥石の外周面をワーク進入側を小径とした円錐周面とする技術が提案されており、砥石軸心に対する円錐周面の傾斜角をワーク進入側の円盤砥石ほど大きな傾斜角(急勾配)にした辺縁加工装置が提案されている。
特開2002‐346890号公報
Further, Patent Document 1 proposes a technique in which the outer peripheral surface of each disc grindstone is a conical peripheral surface having a small diameter on the workpiece entry side in the edge processing apparatus provided with the plurality of disc grindstones. There has been proposed an edge processing apparatus in which the inclination angle of the conical circumferential surface with respect to the shaft center is set to a larger inclination angle (steep slope) as the disc grindstone is closer to the workpiece.
JP 2002-346890 A

上記特許文献1記載の研削装置で、ディスプレイパネル用ガラス基板などの硬質脆性板の面取加工を行うとき、加工能率を向上させるために、円盤砥石に対するワークの相対送り速度を速くすると、加工面に切り残しによると思われるうねりが生ずることが認められ、加工面にうねりを生じさせないためには、加工速度を約6m/min以下に抑えることが必要であった。   When chamfering a hard brittle plate such as a glass substrate for a display panel in the grinding apparatus described in Patent Document 1, in order to improve the processing efficiency, if the relative feed speed of the workpiece to the disk grindstone is increased, the processing surface It was recognized that the waviness considered to be due to the uncut portion was generated, and it was necessary to suppress the processing speed to about 6 m / min or less in order not to generate waviness on the processed surface.

この発明は、加工面にうねりなどの面精度の低下を生じさせないで、より速い速度での硬質脆性板の辺縁加工を行うことができるようにすることにより、砥石の外周面でワーク辺縁の加工を行う辺縁加工装置の加工能率を向上させることを課題としている。   The present invention enables the processing of the edge of a hard brittle plate at a higher speed without causing a decrease in surface accuracy such as waviness on the processed surface, thereby allowing the workpiece edge to be processed on the outer peripheral surface of the grindstone. It is an object to improve the processing efficiency of the edge processing apparatus that performs the above processing.

この発明は、加工しようとするワーク辺縁4の砥石7に対する相対送り方向Yと平行な砥石軸6回りに回転する円盤砥石7の、ワーク進入側を小径とした円錐周面10で、当該ワーク辺縁を研削加工する板状ワークの辺縁加工装置において、円盤砥石の円錐周面10のワーク退出側外周面に前記相対送り方向Yと平行に当該辺縁に接触する平行接触周面11を設けることにより、上記課題を解決している。 The present invention, in the disk grinder 7 which rotates in the relative feed direction Y and the flat line grindstone shaft 6 around for the grinder 7 of the workpiece edge 4 to be machined, a conical peripheral surface 10 of the workpiece entering side has a small diameter, the In the edge processing apparatus for a plate-like workpiece that grinds the workpiece edge, a parallel contact peripheral surface 11 that comes into contact with the peripheral edge of the conical peripheral surface 10 of the disc grindstone contacts the peripheral edge in parallel with the relative feed direction Y. By providing the above, the above-mentioned problem is solved.

上記構造の辺縁加工装置は、砥石軸6の軸方向に間隔を隔てて複数枚の円盤砥石7・・・を配置し、それら複数の円盤砥石7・・・の外周面をワークの辺縁4に順次深く切り込ませることにより、加工速度、特に硬質脆性板に対する加工速度を向上させることができる。   The edge processing apparatus having the above structure arranges a plurality of disk grindstones 7 at intervals in the axial direction of the grindstone shaft 6, and the outer peripheral surface of the plurality of disk grindstones 7. By sequentially cutting deeply into 4, the processing speed, particularly the processing speed for a hard brittle plate can be improved.

複数の円盤砥石7・・・を順次深く切り込ませる手段として、ワーク退出側(ワークの相対送り方向下流側)に向けて順次大径とした円盤砥石7・・・を加工する辺縁4の送り方向Yと平行に配置した砥石軸6回りに回転させる。この構造の場合には、平行接触周面は正確な円筒面となる。 As means for sequentially cutting a plurality of disc grindstones 7..., The edge 4 for machining the disc grindstones 7... Which are successively increased in diameter toward the workpiece withdrawal side (downstream side in the relative feed direction of the workpiece). feeding direction Y and rotating the parallel to the grinding wheel axis 6 around. In the case of this structure, parallel contact peripheral surface exact cylindrical surface and ing.

平行接触周面11の幅(砥石軸方向の長さ)は、広くすればするほど加工速度を速くできる。砥石軸6に複数枚の円盤砥石7・・・を設けたときの平行接触周面11は、総ての円盤砥石7・・・に設けるのが好ましい。最終段の砥石7dのワーク1への切り込み量は、それより前段の砥石の切り込み量より小さくするのが望ましく、少なくとも2分の1以下、好ましくは4〜5分の1程度とすることが、より平滑で精度の高い加工面を得るのに有効である。 The processing speed can be increased as the width of the parallel contact peripheral surface 11 (length in the grinding wheel axis direction) is increased. Parallel contact peripheral surface when provided with a plurality of disk grinder 7 ... the grinding wheel spindle 6 11 have preferred to dispose the all disc grinder 7 .... The cutting amount of the final stage grindstone 7d into the workpiece 1 is desirably smaller than the cutting amount of the preceding stage grindstone, and is preferably at least one half or less, preferably about 4 to 1/5. It is effective to obtain a smoother and more accurate machined surface.

本願の請求項1の発明に係る板状ワークの辺縁加工装置は、ワークの相対送り方向と平行な砥石軸と、この砥石軸回りに回転してワークの辺縁を研削する3枚以上の円盤砥石とを備え、当該3枚以上の円盤砥石は、前記砥石軸の軸方向に間隔を隔てて配置されかつワーク退出側に向けて順次大径とされている板状ワークの辺縁加工装置において、前記円盤砥石の総ての外周面が、ワークの進入側を小径とする円錐周面10と、この円錐周面のワーク退出側に段差を有することなく連接してワークの相対送り方向と平行にワークの前記辺縁に接触する平行接触周面11とを備えており、当該円錐周面(10)は各円盤砥石のワーク進入側に位置し、平行接触周面(11)は各円盤砥石のワーク退出側に位置しており、隣接する円盤砥石間の径差がワーク進入側の円盤砥石間ほど大きくされ、かつこの径差に対応して前記円錐周面の円錐の頂角がワーク進入側の円盤砥石ほど大きくされていることを特徴とするものである。 The edge processing apparatus for a plate-like workpiece according to the invention of claim 1 of the present application includes a grinding wheel shaft parallel to the relative feed direction of the workpiece, and three or more sheets that rotate around the grinding wheel shaft and grind the edge of the workpiece. An edge processing apparatus for a plate-like workpiece, comprising a disc grinding wheel, wherein the three or more disc grinding stones are arranged at an interval in the axial direction of the grinding wheel shaft and are gradually increased in diameter toward the workpiece withdrawal side. in all of the outer peripheral surface of the disc grindstone, a conical peripheral surface 10 of the entry side of the workpiece with a small diameter, and the relative feed direction of the continuously connected without work having a step on the workpiece exit side of the conical peripheral surface And a parallel contact peripheral surface 11 that contacts the edge of the workpiece in parallel, the conical peripheral surface (10) is located on the work entry side of each disc grindstone, and the parallel contact peripheral surface (11) is each disc. Located on the workpiece exit side of the grindstone, the diameter difference between adjacent disc grindstones is the workpiece advance It is large enough between the side of the disc grindstone, and in which the apex angle of the cone of the conical peripheral surface corresponding to the diameter difference is characterized in that it is larger as a disk grinding wheel of a workpiece entry side.

本願の請求項2の発明に係る板状ワークの辺縁加工装置は、上記手段を備えた板状ワークの辺縁加工装置において、ワーク退出側端の円盤砥石とそのワーク進入側に隣接する円盤砥石との径差が、当該ワーク退出側端の円盤砥石よりワーク進入側に位置する2枚の隣接する円盤砥石間の径差の1/2以下であることを特徴とするものである。 Edge processing apparatus of the plate-shaped workpiece according to the present invention of claim 2 is the edge machining device plate workpiece having the above means, a disc adjacent disc grindstone work exit end and in the work entrance side The difference in diameter with the grindstone is ½ or less of the difference in diameter between two adjacent disc grindstones located on the workpiece entry side with respect to the disc grindstone on the workpiece withdrawal side end.

この発明により、円盤砥石7の外周面による硬質脆性板の辺縁の加工速度をうねりの発生などの加工面精度の低下を生じることなく高速化することができる。具体的な一例として、4枚の円盤砥石7・・・を用い、各円盤砥石外周面のワーク退出側に1〜2mmの平行接触周面11を設け、2段目の円盤砥石7bの切り込み量(前段の円盤砥石に対する半径差)140ミクロン、及び、3段目の円盤砥石7cの切り込み量100ミクロンに対して、4段面(ワーク退出側端)の円盤砥石7dの切り込み量を20ミクロンとしたガラス基板の面取加工装置において、平行接触周面11を設けないときの加工速度6m/minに対し、平行接触周面11を設けたときは14m/minのうねりのない研削加工が可能であった。   According to the present invention, the processing speed of the edge of the hard brittle plate by the outer peripheral surface of the disc grindstone 7 can be increased without causing a decrease in the processing surface accuracy such as the generation of waviness. As a specific example, four disk grindstones 7 are used, and a parallel contact circumferential surface 11 of 1 to 2 mm is provided on the workpiece withdrawal side of each disc grindstone outer circumferential surface, and the cutting amount of the second-stage disc grindstone 7b (Radial difference with respect to the previous stage disc wheel) 140 microns and the cut amount of the third stage disc grindstone 7c to 100 microns, the cut amount of the disc grindstone 7d on the fourth step surface (work withdrawal side end) is 20 microns. In the glass substrate chamfering apparatus, when the parallel contact peripheral surface 11 is provided, grinding processing without waviness of 14 m / min is possible with respect to the processing speed 6 m / min when the parallel contact peripheral surface 11 is not provided. there were.

図1は、図4及び5に示したガラス基板の面取加工装置における円盤砥石7・・・の外周面の形状を模式的に示した図、図2は図1との対比において、従来構造における円盤砥石の外周形状を示した図である。図中、6は回転砥石軸、7は回転砥石軸6に固定された円盤砥石、1はワーク(ガラス基板)、4は加工するワークの辺縁、Yはワークの相対送り方向である。   FIG. 1 is a diagram schematically showing the shape of the outer peripheral surface of the disk grindstone 7... In the chamfering apparatus for a glass substrate shown in FIGS. 4 and 5, and FIG. 2 is a conventional structure in comparison with FIG. It is the figure which showed the outer periphery shape of the disk grindstone in. In the figure, 6 is a rotating grindstone shaft, 7 is a disc grindstone fixed to the rotating grindstone shaft 6, 1 is a workpiece (glass substrate), 4 is the edge of the workpiece to be processed, and Y is the relative feed direction of the workpiece.

図2に示す従来構造においては、円盤砥石7の外周面は、全体がワークの進入方向を小径とした円錐周面10となっている。これに対してこの発明の辺縁加工装置における円盤砥石7の外周面は、ワーク進入側が小径となった円錐周面10と、ワークの送り方向Yと平行に加工中の辺縁4に接触する平行接触周面11とを備えており、円錐周面10はワーク1の進入側に位置し、平行接触周面11はワーク1の退出側に位置している。図1の例では、砥石軸6はワークの送り方向Yと平行で、従って平行接触周面11は円筒面である。   In the conventional structure shown in FIG. 2, the outer peripheral surface of the disk grindstone 7 is a conical peripheral surface 10 having a small diameter in the workpiece entry direction. On the other hand, the outer peripheral surface of the disc grindstone 7 in the edge processing apparatus of the present invention is in contact with the conical peripheral surface 10 having a small diameter on the workpiece entry side and the edge 4 being processed in parallel with the workpiece feed direction Y. The conical circumferential surface 10 is located on the entry side of the workpiece 1, and the parallel contact circumferential surface 11 is located on the withdrawal side of the workpiece 1. In the example of FIG. 1, the grindstone shaft 6 is parallel to the workpiece feed direction Y, and therefore the parallel contact peripheral surface 11 is a cylindrical surface.

この発明の辺縁加工装置における円盤砥石7は、ワークに切り込む円錐周面10のワーク送り方向下流側に、加工後の辺縁4と平行に接触する平行接触周面11を備えており、この平行接触周面11が円錐周面10によって切り込み加工された後の加工面を平滑にする。   The disc grindstone 7 in the edge processing apparatus of the present invention includes a parallel contact peripheral surface 11 that contacts the processed peripheral edge 4 in parallel to the downstream side of the conical peripheral surface 10 cut into the work in the workpiece feed direction. The processed surface after the parallel contact peripheral surface 11 is cut by the conical peripheral surface 10 is smoothed.

図2の従来構造では、ワークの相対送り速度を速くすると、加工面12にうねりが生じたが、図1のこの発明の構造によれば、平行接触周面11によりうねりが修正されて、平滑で高精度な加工面12が得られる。   In the conventional structure of FIG. 2, when the relative feed speed of the workpiece is increased, waviness occurs on the machining surface 12. However, according to the structure of the present invention of FIG. Thus, a highly accurate processed surface 12 can be obtained.

回転砥石軸6に軸方向に間隔をあけて複数枚の円盤砥石7・・・を装着した好ましい構造の辺縁加工装置は、図3に示すように、ワーク進入側に円錐周面10を備え、当該円錐周面のワーク退出側に平行接触周面11を備えた4枚の円盤砥石7・・・を備えている。砥石軸6は、ワークの送り方向Yと平行で、ワーク進入側の円盤砥石ほど後段に隣接する円盤砥石との半径差が大きく、これに対応して円錐周面10の砥石軸6に対する傾斜角(円錐の頂角)も、ワーク進入側のものほど大きい角度となっている。最終段の円盤砥石7dの切り込み量は、前段のものの5分の1としてあり、前段の3枚の円盤砥石7a〜7cがワークに切り込んで加工するのを主な作用としているのに対し、最終段の円盤砥石7dは、加工された後の加工面を平滑化する作用に重点が置かれている。   As shown in FIG. 3, the edge processing apparatus having a preferable structure in which a plurality of disk grinding wheels 7... Are mounted on the rotary grinding wheel shaft 6 at intervals in the axial direction includes a conical circumferential surface 10 on the workpiece entry side. , And four disc grindstones 7 provided with the parallel contact peripheral surface 11 on the workpiece withdrawal side of the conical peripheral surface. The grindstone shaft 6 is parallel to the workpiece feed direction Y, and the disc grindstone on the workpiece entry side has a larger radius difference from the disc grindstone adjacent to the subsequent stage. Correspondingly, the inclination angle of the conical circumferential surface 10 with respect to the grindstone shaft 6 The (cone apex angle) is also larger at the workpiece entry side. The cutting amount of the final stage disc whetstone 7d is one fifth of that of the previous stage, and the main action is that the three front stage disc whetstones 7a to 7c cut into the workpiece and work. The stepped disc grindstone 7d focuses on the action of smoothing the processed surface after being processed.

図4及び図5に示した構造のガラス基板その他の硬質脆性板の面取加工装置に、図1及び図3に示した円盤砥石を用いることにより、加工面の面制度の低下を招くことなく、砥石に対するワークの相対送り速度、すなわちワークの加工速度を飛躍的に向上させることができる。   By using the disk grindstone shown in FIGS. 1 and 3 in the chamfering apparatus for the glass substrate or other hard brittle plate having the structure shown in FIGS. 4 and 5, the surface system of the machined surface is not lowered. The relative feed speed of the workpiece with respect to the grindstone, that is, the processing speed of the workpiece can be dramatically improved.

この発明の辺縁加工装置における円盤砥石の外周面の形状を示す図The figure which shows the shape of the outer peripheral surface of the disk grindstone in the edge processing apparatus of this invention 従来の辺縁加工装置における円盤砥石の外周面の形状を示す図The figure which shows the shape of the outer peripheral surface of the disk grindstone in the conventional edge processing apparatus 図1の円盤砥石を同一砥石軸上に複数設けた構造とその加工態様を示す図The figure which shows the structure which provided the disk grindstone of FIG. 1 with two or more on the same grindstone axis | shaft, and its processing aspect 複数の円盤砥石を備えたガラス基板の面取加工装置の砥石とワークとの関係を示す斜視図The perspective view which shows the relationship between the grindstone and the workpiece | work of the chamfering processing apparatus of the glass substrate provided with the some disk grindstone. 図4の要部の拡大正面図The enlarged front view of the principal part of FIG.

符号の説明Explanation of symbols

10 円錐周面
11 平行接触周面
10 Conical surface
11 Parallel contact surface

Claims (2)

ワークの相対送り方向と平行な砥石軸と、この砥石軸回りに回転してワークの辺縁を研削する3枚以上の円盤砥石とを備え、当該3枚以上の円盤砥石は、前記砥石軸の軸方向に間隔を隔てて配置されかつワーク退出側に向けて順次大径とされている板状ワークの辺縁加工装置において、
前記円盤砥石の総ての外周面が、ワークの進入側を小径とする円錐周面(10)と、この円錐周面のワーク退出側に段差を有することなく連接してワークの相対送り方向と平行にワークの前記辺縁に接触する平行接触周面(11)とを備えており、当該円錐周面(10)は各円盤砥石のワーク進入側に位置し、平行接触周面(11)は各円盤砥石のワーク退出側に位置しており、隣接する円盤砥石間の径差がワーク進入側の円盤砥石間ほど大きくされ、かつこの径差に対応して前記円錐周面の円錐の頂角がワーク進入側の円盤砥石ほど大きくされていることを特徴とする、板状ワークの辺縁加工装置。
A grindstone shaft parallel to the relative feed direction of the workpiece, and three or more disc grindstones that rotate around the grindstone shaft and grind the edges of the workpiece, the three or more disc grindstones are arranged on the grindstone shaft. In the edge processing apparatus for plate-like workpieces that are arranged at intervals in the axial direction and that are sequentially increased in diameter toward the workpiece withdrawal side,
All the outer peripheral surfaces of the disk grindstone are conical circumferential surface (10) having a small diameter on the workpiece entry side, and the workpiece is connected to the workpiece withdrawal side without a step on the relative circumferential direction of the workpiece. A parallel contact peripheral surface (11) that contacts the edge of the workpiece in parallel, the conical peripheral surface (10) is located on the workpiece entry side of each disk grindstone, the parallel contact peripheral surface (11) is Located on the workpiece exit side of each disc grindstone, the difference in diameter between adjacent disc grindstones is increased between the disc grindstones on the workpiece entry side, and the apex angle of the cone on the conical circumferential surface corresponding to this diameter difference An edge processing apparatus for a plate-shaped workpiece, wherein the disk grinding wheel on the workpiece entry side is made larger .
ワーク退出側端の円盤砥石とそのワーク進入側に隣接する円盤砥石との径差が、当該ワーク退出側端の円盤砥石よりワーク進入側に位置する2枚の隣接する円盤砥石間の径差の1/2以下であることを特徴とする、請求項1記載の板状ワークの辺縁加工装置。 Diameter difference of the disc grindstone work exit end with a disc grindstone adjacent to the work entrance side, of the diameter difference between the two adjacent disk grindstone positioned from the disc grindstone of the workpiece exit end to the work entrance side The edge processing apparatus for a plate-like workpiece according to claim 1, wherein the edge processing apparatus is 1/2 or less.
JP2004333632A 2004-11-17 2004-11-17 Edge processing device for plate workpiece Expired - Fee Related JP4313285B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004333632A JP4313285B2 (en) 2004-11-17 2004-11-17 Edge processing device for plate workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004333632A JP4313285B2 (en) 2004-11-17 2004-11-17 Edge processing device for plate workpiece

Publications (2)

Publication Number Publication Date
JP2006142418A JP2006142418A (en) 2006-06-08
JP4313285B2 true JP4313285B2 (en) 2009-08-12

Family

ID=36622671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004333632A Expired - Fee Related JP4313285B2 (en) 2004-11-17 2004-11-17 Edge processing device for plate workpiece

Country Status (1)

Country Link
JP (1) JP4313285B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5439066B2 (en) * 2009-07-06 2014-03-12 中村留精密工業株式会社 Method and apparatus for chamfering hard brittle plate
TWI491470B (en) * 2010-07-08 2015-07-11 Nakamura Tome Precision Ind A chamfering method for a hard brittle plate, and a chamfering apparatus
CN104439932B (en) * 2014-10-30 2016-08-24 綦江永跃齿轮有限公司 A kind of processing method of spline spindle multiple interval cannelure

Also Published As

Publication number Publication date
JP2006142418A (en) 2006-06-08

Similar Documents

Publication Publication Date Title
CN1284651C (en) Centerless grinding apparatus and centerless grinding process
JP5439066B2 (en) Method and apparatus for chamfering hard brittle plate
JP4252093B2 (en) Disc-shaped substrate grinding method and grinding apparatus
CN1753757A (en) Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools
JP2006326785A (en) End surface machining device for glass substrate and end surface machining method
JP6976713B2 (en) Chamfer grinding method and chamfer grinding equipment
CN107249818B (en) Grinding method of glass substrate
JP3459058B2 (en) Wafer chamfering method
JP2001009684A (en) Electric sharpener for ceramic blades
JPH1080849A (en) Material grinding method for semiconductor wafer edge
JP5502385B2 (en) Double-head surface grinding method and apparatus
US7121928B2 (en) High smoothness grinding process and apparatus for metal material
JP4313285B2 (en) Edge processing device for plate workpiece
JP5623249B2 (en) Wafer chamfering method
JP6608604B2 (en) Chamfered substrate and method for manufacturing liquid crystal display device
JP2021094693A (en) Manufacturing method of chamfered baseboard and chamfering device used in the same
JP2007030119A (en) Wafer chamfering device and wafer chamfering method
JP6151529B2 (en) Grinding method of sapphire wafer
JP3997569B2 (en) Edge processing method for architectural glass plate
JPH11347953A (en) Wafer chamfering grinding wheel
US20150126096A1 (en) System and method for contoured peel grinding
JP2003291069A (en) Grinding wheel for grinder and grinding method using grinding wheel
US20090191793A1 (en) Method of and device for abrasive machining and abrasive tool provided therefor
JP3630950B2 (en) Manufacturing method of spherical lens
JP2008023690A (en) Truing method for wafer chamfering grinding wheel and wafer chamfering device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071108

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080701

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080821

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090203

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090330

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090421

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090514

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120522

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4313285

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120522

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150522

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees