JP5439066B2 - Method and apparatus for chamfering hard brittle plate - Google Patents

Description

  The present invention relates to a method and apparatus for chamfering a glass substrate of a display panel and other hard brittle plates.

  The glass substrate of the display panel is cut to a predetermined size by cleaving, but a sharp ridge line (edge) is formed at a portion where the cut surface (surface in the plate thickness direction formed by cleaving) and the front and back surfaces of the panel intersect. . This ridgeline may become a sharp blade and may cause harm to an operator who handles the panel. In addition, there are often small cracks (chipping) and small cracks called horizontal cracks (hereinafter collectively referred to as “chipping”) on the ridgeline, and large chippings and cracks are generated starting from this chipping. In many cases, a glass piece called a cullet is attached to the substrate surface, resulting in a defective product. Therefore, a chamfering process is performed in which the rotating grindstone is run along the ridgeline and the ridgeline is cut off obliquely.

  Various shapes have been proposed for the shape of the grindstone used for chamfering, the direction of its rotation axis, and the like. As a grindstone unit that is widely used in recent years, a plurality of disc-shaped grindstones are fixed to a grindstone shaft parallel to the ridge line to be chamfered at intervals in the axial direction, and the plurality of disc grindstones are simultaneously attached. There is a method of relatively moving in parallel with the ridgeline of the glass substrate while rotating. In this chamfering method, as shown in FIG. 1, a plurality of disc grindstones 1 (1a to 1a) are arranged with grindstone shafts 5u and 5d arranged on the upper and lower sides of the cut section 22 of the glass substrate 2 and attached to each grindstone shaft. 1d) is arranged so that the disc wheels 1a to 1d attached to the upper and lower grindstone shafts 5u and 5d enter each other between the mating disc grindstones 1 and the upper and lower disc grindstones. The upper and lower ridgelines 7 (7u, 7d) of the split section 22 are simultaneously chamfered on one outer peripheral surface.

  Conventionally, a chamfer angle (chamfering) between the surfaces (chamfered surfaces) 9 (9u, 9d) and the plate surfaces (front and back surfaces) 8u, 8d of the glass substrate which are cut obliquely by the disc grindstone 1 during this chamfering process. The angle is about 40 to 45 degrees, and the rotating direction of the disc grindstone 1 is such that the peripheral surface 11 of the disc grindstone 1 divides the chamfered surface 9 from the plate surface 8 side as indicated by an arrow B in FIG. The direction slid toward the cross section 22 side.

  In the conventional chamfering process, the grindstone is rotated in such a direction that the peripheral surface 11 of the disc grindstone is pulled out (slid) from the chamfered surface 9 to the split section 22 side. This is because a lot of chipping occurs on the slipping side. That is, a circuit pattern is provided on the plate surface of the glass substrate of the display panel, and chipping is prevented as much as possible from occurring on the side where the circuit pattern is provided.

  Further, the plurality of disc grindstones used for the processing are shown in FIG. 7 by exaggerating the relationship between their cutting edges (outer peripheral portions), by the relative movement of the disc grindstones 1 on the outer peripheral edge in the relative movement direction. A conical cut surface 11a for cutting the glass substrate is formed, and the rear of the relative movement direction is a cylindrical surface 11b for sparking out, and a plurality of disc grindstones in front of the relative movement direction (first glass A structure is adopted in which the diameter of the one that contacts the substrate is smaller than that of the rear one, and the difference in diameter between the front and rear disc grindstones is made smaller between the rear disc grindstones.

JP 2006-82147 A JP 2006-26845 A

  As electronic devices become smaller and lighter, the glass substrate of the display panel becomes thinner (thinner), and the relative movement speed (feed speed) of the rotating grindstone with respect to the glass substrate is increased due to the demand for improved productivity. Therefore, it is necessary to prevent the generation of defective products that tend to increase with the reduction in thickness and speed. In other words, chipping is likely to occur when the grinding stone feed rate is increased, and the chipping that occurs during chamfering may become large cracks or chips in the subsequent process as the glass substrate becomes thinner. Therefore, there is a need to prevent this and improve the yield of products.

  The present invention has been made to solve such a problem, and is to obtain technical means capable of chamfering a glass substrate at a higher speed while suppressing the occurrence of chipping as much as possible. It is an issue.

  The chamfering method according to the present invention includes a sharp ridge line 7 formed at a portion where the split surface 22 of the glass substrate of the display panel or other hard brittle plate 2 and the plate surface 8 intersect with each other around the grindstone axis 5 parallel to the ridge line. The present invention relates to a chamfering method in which a plurality of disc grindstones 1 rotating in parallel are fed in parallel with the ridgeline 7 and the ridgelines are cut off obliquely by the peripheral surface 11 of the disc grindstone 1.

  In the chamfering method of the present invention, the depression angle (chamfering angle) θ between the oblique chamfered surface 9 and the plate surface 8 formed by scraping the ridge line 7 is set to an angle in the range of 35 degrees to 15 degrees, The rotation direction of the plate grindstone 1 is the direction opposite to that of the prior art, that is, the rotation in the direction in which the peripheral surface 11 of the rotary grindstone rubs the chamfered surface 9 from the split section 22 side to the plate surface 8 side. Has solved.

  That is, the chamfering method of the hard brittle plate according to the present invention is such that the ridge line 7 where the plate surface 8 (8u, 8d) of the hard brittle plate 2 and the split section 22 intersect is indicated by the grindstone shaft 5 (5u) parallel to the ridge line. 5d) Grinding with a short conical or short cylindrical peripheral surface 11 (11a, 11b) of a plurality of disc grindstones 1 (1a to 1d) that rotate around and move in parallel with the ridge line, In the chamfering method of the hard brittle plate that cuts the ridge line 7 diagonally, the depression angle between the plate surface 8 and the surface (chamfered surface) 9 cut off diagonally is set to an angle of 35 to 15 degrees, and the disc grindstone The disc grindstone 1 is rotated in a direction in which the peripheral surface 11 of the first surface rubs the ridgeline 7 or the chamfered surface 9 from the fractured surface 22 side to the plate surface 8 side.

  The ridgeline 7 to be scraped off with respect to the diameter of the three or more disc grindstones 1a to 1d in the above-described chamfering method in which three or more disc grindstones 1a to 1d are arranged at intervals on one grindstone shaft 5. In addition, the diameter of the disc grindstone 1a that first slidably contacts the chamfered surface 9 is made smaller than the diameter of the disc grindstone 1b that rubs second, and the diameter of the disc grindstone 1d that rubs last and the last 1 By performing chamfering with the same diameter as that of the disc grindstone 1c that is rubbed forward, a smoother chamfered surface can be obtained particularly in chamfering of a hard brittle plate having a thin plate thickness. .

A chamfering apparatus suitable for carrying out the chamfering method of the present invention includes a table 3 that supports the bottom surface of a hard brittle plate placed thereon, and a grindstone unit 4 disposed on both sides of the table in the width direction. And a feed device for moving the grindstone unit relative to the table 3 in the direction Y orthogonal to the width direction X within the surface of the table, and the grindstone unit 4 is a hard brittle plate to be chamfered. A plurality of disc grindstones 1 rotating around the upper and lower grindstone axes 5 parallel to the ridgeline 7 are provided, and the ridgeline 7 where the plate surface 8 of the hard brittle plate 2 intersects the split section 22 is defined as a short of the disc grindstone 1. In a chamfering device for a hard brittle plate that is ground with a conical or short cylindrical peripheral surface 11, a grindstone motor 6 (6u, 6d) that rotationally drives the grindstone shaft 5 in forward and reverse directions, and the upper and lower grindstone shafts 5 Elevating mount 14 for setting the interval of For example, the one of the upper and lower grinding wheel 1 is mounted on the wheel head 12 through the lifting mount 14, the grinding wheel unit 4, the disc grindstone 1 or 3 which rotates each of the wheel spindle 5 around the The three or more disk grindstones 1 have a diameter of the first-stage disk grindstone 1a that first comes into sliding contact with the surface scraped by the relative feed movement smaller than the diameter of the second-stage disk grindstone 1b. And the diameter of the last disc grindstone 1d to be rubbed last is the same as the diameter of the last disc grindstone 1c of the last step . Chamfering device.

  By using the chamfering apparatus having the above structure, the chamfering process by the conventional method and the chamfering process by the method of the present invention can be performed by the same apparatus.

  As the plate thickness of the hard brittle plate 2 to be chamfered becomes thinner, the cutting allowance c on the split cross section side has to be reduced. Therefore, the chamfered surface 9 and the plate surface 8 are inevitably reduced. The depression angle θ becomes small, and the angle which is 40 to 45 degrees in the past is 35 degrees or less, for example, an angle of 30 degrees to 20 degrees.

  The occurrence of chipping associated with the chamfered surface 9 being rubbed by the rotating grindstone 1 is likely to occur on the removal side of the grindstone peripheral surface 11 where the abrasive particles rub in the direction of separating the chips from the main body. Therefore, in the method of the present invention in which the disc grindstone 1 is rotated in the direction in which the grindstone peripheral surface 11 is rubbed from the split cross section 22 side of the hard brittle plate toward the plate surface 8 side, It can be considered that a lot of chipping occurs, but the effect of suppressing the chipping due to the decrease in the depression angle θ of this part works greatly, and the occurrence of chipping on the plate surface 8 side is suppressed.

  On the other hand, since the split section 22 side is the entrance side of the grindstone peripheral surface 11, the occurrence of chipping in the split section is reduced as compared with the conventional method. That is, according to the method of the present invention, chipping on both the plate surface 8 side and the chamfered surface 9 side is suppressed, and the occurrence of defective products can be reduced due to chipping caused by chipping in the subsequent process. Further, since both chipping on the split section 22 side and the plate surface 8 side are suppressed, the feed speed of the disc grindstone 1 to the hard brittle plate can be increased, and the processing speed can be improved.

  Further, as the hard brittle plate 2 is thinned and the included angle θ between the chamfered surface 9 and the plate surface 8 is reduced, the bending of the hard brittle plate 2 due to the processing reaction force during grinding increases. Since this bend is a bend in the direction in which the chamfered surface 9 escapes from the disc grindstone 1, even if an attempt is made to obtain a desired cutting depth due to the diameter difference of the grinding wheel, the bend of the hard brittle plate 2 is increased. Only the cutting depth becomes smaller. This means that even if the difference between the diameters of the adjacent disc whetstones is set to 0, the remaining disc whetstone remains cut by the amount left by the bending of the hard brittle plate.

  That is, when three or more disc grindstones are mounted on one grindstone shaft and chamfering is performed by the method of the present invention, the last grindstone with a small depth of cut, and in some cases the last grindstone and the last grindstone By making the second grindstone the same diameter as the grindstone in front of it, an appropriate amount of incision is given, sufficient sparking is performed, and a smooth chamfered surface can be obtained.

The perspective view which shows the chamfering method of this invention Explanatory drawing which shows the relationship between the edge of a hard brittle board, and a disc grindstone in the chamfering method of this invention The figure which shows typically an example of the peripheral shape of each disc grindstone when four disc grindstones are mounted | worn with one grindstone axis | shaft. The figure which shows the example of the other periphery shape typically The perspective view of the principal part of the chamfering apparatus of this invention Explanatory drawing which shows the relationship between the edge of a hard brittle board in a conventional chamfering method, and a disc grindstone The figure which shows typically an example of the conventional peripheral shape of each disc grindstone when four disc grindstones are mounted on one grindstone shaft. The figure which shows the generation situation of chipping when a chamfering angle is 30 degrees The figure which shows the generation situation of chipping when a chamfering angle is 20 degrees

  The present invention will be further described below with reference to the drawings. 1 and 2 are views showing a chamfering method according to the present invention. FIG. 1 is a perspective view, and FIG. 2 is a view of a chamfered portion as viewed from a feeding direction of a grindstone 1. The example in the figure shows an example in which four disc grindstones are provided on one grindstone shaft, and FIG. 3 is a partial cross-sectional view schematically showing the shape of the outer periphery of the four disc grindstones. 4 is a partial cross-sectional view schematically showing the other shape. FIG. 5 is a perspective view of a main part of the chamfering apparatus of the present invention.

  1 and 2, a glass substrate 2 to be processed includes opposing side edges 21 that are parallel to each other. The glass substrate 2 is fixed to the table 3 by vacuum suction or the like, and the opposite side sides 21 are in a state of protruding from the table.

  The grindstone unit 4 is composed of upper and lower grindstone shafts 5u and 5d in a direction parallel to the side 21 of the glass substrate, and four disc grindstones 1a to 1d fixed to the respective grindstone shafts. Each grindstone shaft 5u, 5d is supported with its base end fixed to the shaft of the grindstone motor 6u, 6d. The grindstone motors 6u and 6d can be rotated forward and backward. When chamfering is performed by the method of the present invention, the grindstone motors 6u, 6d are reversed, that is, the grindstone shafts 5u, 5d, and the peripheral surface 11 of each disc grindstone splits the ridge line 7 portion of the glass substrate 2. It rotates in the direction of rubbing from the 22 side to the plate surface 8 side (the direction of arrow A in FIG. 2). At this time, as shown in FIG. 2, the cutting fluid (usually pure water) is sprayed from the cutting fluid nozzle 19 provided on the side opposite to the glass substrate of the grindstone unit 4 toward the split surface 22.

One of the upper and lower grinding wheel motors 6d is mounted at a fixed position of the grinding wheel base 12, and the other 6u is mounted on a lifting mount 14 provided on the grinding wheel base 12 so that the lifting motor 13 can be moved up and down. The grinding wheel base 12 is mounted on columns (not shown) provided on both sides of the table 3 in the width direction (arrow X direction in FIG. 1) so as to be movable and positionable in the width direction and the vertical direction (thickness direction of the hard brittle plate 2). .

When chamfering the upper and lower ridge lines of the glass substrate 2 with the same chamfering angle θ and the chamfering amount c, the elevating mount 14 is arranged so that the distance between the upper and lower grindstone shafts 5u and 5d corresponds to the thickness of the glass substrate. The height of the grinding wheel base 12 is set to a height at which the intermediate height between the upper and lower grinding wheel shafts 5u, 5d is the thickness center of the glass substrate, and the circumference of the disk grinding wheel 1d at the last stage in the feed direction is set. The position in the width direction of the grindstone base 12 is set at a position where the surface cuts the predetermined chamfered surface 9. For glass substrates having the same thickness, the chamfering angle θ varies depending on the position setting of the lift mount 14. That is, the chamfering angle θ increases when the upper and lower grindstone shafts 5u, 5d are brought closer, and the chamfering angle θ decreases when they are separated from each other.

  When chamfering the upper and lower ridge lines of the edge of the glass substrate with different chamfering angles θ, the grindstone base 12 can be rocked and positioned around an axis parallel to the edge 21 of the glass substrate, or the grindstone shafts 5u, 5d. One of these is mounted on the grindstone base 12 so that the position of the glass substrate can be adjusted in the width direction.

  The table 3 fixing the glass substrate 2 is fed and moved in the direction of the arrow Y in FIG. 1 parallel to the ridge line 7 with respect to the grindstone units 4 and 4, and in the grinding process accompanying this feed movement, the disc grindstone 1a is moved. The first-stage disc grindstone is used, and the disc-whetstone 1d is the last-stage disc grindstone.

A conical surface 11a for cutting is provided on the outer peripheral front edge of each disk grindstone 1a to 1d on the entrance side of each glass substrate. This conical surface is a conical surface with an apex angle of 90 degrees, and the incision dimension (actual incision amount is smaller than this) L is 0.3 mm in the first stage, for example, in the example of FIG. The last stage is 0.2 mm. In the example of FIG. 4, the first stage is 0.2 mm, and the second to last stages are 0.1 mm.

  Tables are set so that the grindstone units 4 on both sides are set as described above and the grindstone shafts 5u and 5d are rotated so that the edge 21 of the glass substrate passes through the grindstone unit 4 from one end 23 to the other end 24. 3 is sent, the upper and lower ridgelines 7u and 7d on both sides of the glass substrate 2 are simultaneously chamfered.

  8 and 9 show chamfer angles when a cutting depth is set to 100 microns and 200 microns using a single disc grindstone rotating around an axis parallel to the ridge line to be chamfered. It is a figure which shows the result of having tested the relationship between the relative feed rate of a grindstone, and the dimension of the largest chipping generate | occur | produced when chamfering was performed about the case of 30 degrees and 20 degrees. In the figure, A to E indicate the types of grindstones, and 100 and 200 following the letters A to E indicate the depth of cut. As shown in the figure, when the chamfering angle is 20 degrees, the size of the generated chipping is smaller than that of the chamfering angle is 30 degrees except for one abnormal point p. Also, as a result of this test, the surface of the hard brittle plate with a thin plate thickness, in which the chipping dimension is small on the low feed rate side and the high feed region where the feed rate exceeds 40 m / min, the chamfer angle is reduced. In the chamfering process, it can be seen that the chamfering process can be performed at a high speed with less occurrence of chipping by the method of the present invention.

DESCRIPTION OF SYMBOLS 1 (1a-1d) Disc grindstone 2 Hard brittle board 3 Table 4 Grinding wheel unit 5 (5u, 5d) Grinding wheel axis | shaft 6 (6u, 6d) Grinding wheel motor 7 Edge line 8 (8u, 8d) Plate surface 9 Chamfering surface 11 ( 11a, 11b) Peripheral surface of disc grinding wheel 12 Grinding wheel base 13 Lifting motor 14 Lifting mount 22 Split section θ Depression angle X Width direction Y Feed direction

Claims (2)

A short conical or short cylindrical peripheral surface of a disc grindstone that rotates around a grindstone axis parallel to the ridgeline and moves relative to and parallel to the ridgeline where the plate surface of the hard brittle plate intersects with the split section. In the chamfering method of a hard brittle plate that is ground with
Three or more disc grindstones are arranged at intervals on each of the grindstone shafts, and the diameter of the first disc grindstone that first slidably contacts the surface scraped by the relative feed movement is set to the second disc. The diameter of the wheel grindstone is smaller than the diameter of the grindstone, and the diameter of the last disk grindstone to be rubbed last is the same as the diameter of the disk grindstone of the last previous stage,
The depression angle between the plate surface and the obliquely scraped surface is set at an angle of 35 to 15 degrees, and the surface of the peripheral surface of the disc grindstone is rubbed from the split cross section side to the plate surface side. A chamfering method for a hard brittle plate, characterized in that the disc grindstone is rotated in a direction to be cut. A table that supports the lower surface of the hard brittle plate placed thereon, a grindstone unit disposed on both sides of the table in the width direction, and the grindstone unit orthogonal to the width direction in the plane of the table with respect to the table The grindstone unit includes a plurality of disc grindstones that rotate about upper and lower grindstone axes parallel to the ridgeline of the hard brittle plate to be chamfered, and a plate of the hard brittle plate. In a chamfering device for a hard brittle plate that grinds a ridge line where a surface and a split section intersect with a short conical or short cylindrical peripheral surface of the disc grindstone,
A grindstone motor that rotates the grindstone shaft in forward and reverse directions; and a lift mount that sets a distance between the upper and lower grindstone shafts. One of the upper and lower grindstones is attached to the grindstone table via the lift mount. And the grindstone unit includes three or more disc grindstones that rotate around respective grindstone axes, and the three or more disc grindstones are first contacted with a surface scraped off by the relative feed movement first. The diameter of the disk whetstone is smaller than the diameter of the second stage disk whetstone, the diameter of the last disk whetstone to be rubbed last and the diameter of the disk whetstone of the last previous stage Is a chamfering machine for hard brittle plates.

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