JP4334711B2 - Method for forming insulating film on electronic member and electronic member - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an insulating film forming method in which an insulating resin layer is formed by electrodeposition on the entire exposed conductive portion or a predetermined region of an electronic member, and this is used as an insulating film.
[0002]
[Prior art]
In recent years, high-density mounting such as miniaturization of semiconductor packages represented by CSP (Chip Scale Package), bare chip mounting, and the like has been rapidly promoted along with higher integration and higher performance of semiconductor elements. ing.
With regard to printed wiring boards, progress is being made from single-sided wiring to double-sided wiring, further multilayering, and reduction in thickness and weight.
There are strong demands not only for new media products but also for electronic devices, and in addition to miniaturization and thinning of semiconductor devices, other various electronic components and components for electronic components are also increasingly miniaturized and miniaturized. Is required.
Many electronic components are used in electronic devices, and among them, in particular, passive circuit components called LCR such as coils, capacitors and resistors are most frequently used.
With the recent progress of SMT (Surface Mount Technology) of electronic circuits, surface mounting (chip formation) of LCR components is progressing at a rapid pace, and further downsizing is aimed at.
[0003]
Under such circumstances, an insulating resin layer is formed over the entire exposed conductive portion or a predetermined region for various electronic components and electronic members which are members for electronic components, and this is used as an insulating film. Although an insulating film is formed, the conventional method for forming an insulating film by application by curtain flow or the like forms an insulating film that can cope with further downsizing of electronic members and is satisfactory in quality. It has become difficult.
[0004]
[Problems to be solved by the invention]
Under such circumstances, it is possible to form an insulating film that is satisfactory in terms of quality in response to further miniaturization for various electronic components and electronic components that are members for electronic components, and There has been a demand for a method of forming an insulating film that can form the insulating film relatively easily.
The present invention corresponds to this, and specifically, an insulating resin layer is formed by electrodeposition on the entire exposed conductive portion or a predetermined region of the electronic member, and this is used as an insulating film. A method for forming a film, which is capable of forming an insulating film that is satisfactory in quality in response to further downsizing, and that can be formed relatively easily. It is intended to provide a forming method.
[0005]
[Means for Solving the Problems]
In the method for forming an insulating film on an electronic member according to the present invention, a plurality of electronic members are individually sandwiched and held by the first jig and the second jig, and the through holes provided in each jig are provided. A masking jig that exposes only the conductive portion of a predetermined region of each electronic member is formed by the hole, and an insulating resin layer is formed by electrodeposition on the entire exposed conductive portion of each electronic member. A step of fitting an electronic member into a recess connected to the through-hole portion in order so as to cross the through-hole portion of the first jig; 2 jigs are fitted to the first jig with the electronic member sandwiched therebetween, and a plurality of electronic members are individually clamped and held by the first jig and the second jig, and A masking process for exposing only a conductive portion of a predetermined region of each electronic member, and each electronic member The electrodeposition throughout exposed conductive portion forming an insulating electrocoating resin layer, and a electrodeposition step, after the degree conductive construction, Drying, and heat-treated, electrodeposited formed insulating electrodeposition Chakujushi In the step of fitting, a plurality of electronic members are randomly placed on the first jig, the first jig is vibrated, and each electronic member is moved by vibration. It is what fits into the recessed part connected with a through-hole part, It is characterized by the above-mentioned.
The method for forming an insulating film on the electronic member is characterized in that the first jig is vibrated by ultrasonic vibration.
Also, in any one of the above-described methods for forming an insulating film on an electronic member, an electrodeposition agent for forming an insulating resin layer by electrodeposition includes a polyimide resin containing an ionic group and the polyimide resin. It is an electrodeposition coating composition comprising a soluble organic solvent, water, and an ionic compound having a polarity different from that of the ionic group.
In the electrodeposition process, the electronic member is brought into contact with the electrode provided on the first jig or the second jig, and the electronic member is used as one electrode. On the conductive portion of the electronic member, After the electrodeposition resin layer is formed into a predetermined shape by electrodeposition, it is dried and heat-treated as necessary, and the electrodeposition resin layer formed by electrodeposition is used as an insulating film.
[0006]
The electronic member of the present invention is characterized in that an insulating film is formed by any of the above-described methods for forming an insulating film on an electronic member of the present invention.
[0007]
[Action]
The insulating film forming method of the present invention can form an insulating film that is satisfactory in quality in response to further downsizing of the electronic member by using such a configuration, and that is relatively It is possible to provide a method for forming an insulating film that can easily form the insulating film.
Specifically, it is possible to provide an insulating film forming method in which an insulating resin layer is formed directly or entirely on a predetermined region of an exposed conductive portion of an electronic member by electrodeposition, and this is used as an insulating film.
Specifically, a plurality of electronic members are individually sandwiched and held by the first jig and the second jig, and each electronic member is predetermined by a through hole provided in each jig. A masking jig that exposes only the conductive portion of the region is formed, and an insulating resin layer is formed by electrodeposition on the entire exposed conductive portion of each electronic member, and this is used as an insulating film. In the forming method, the electronic member is inserted into a recess connected to the through-hole portion so as to cross the through-hole portion of the first jig in order, and the second jig is connected to the electronic member. A plurality of electronic members are individually sandwiched and held by the first jig and the second jig so as to be sandwiched between the first jig and the conductive material in a predetermined region of each electronic member. Masking process that exposes only the conductive part and the entire exposed conductive part of each electronic member Applied by forming an insulating electrocoating resin layer, and a electrodeposition step, after the degree conductive construction, Drying, heat treated, the electrodeposition-formed insulating electrocoating resin layer in which the insulating film In the fitting step, a plurality of electronic members are randomly placed on the first jig, the first jig is vibrated, each electronic member is moved by vibration, and is fitted into a recess connected to the through hole. This is achieved through the inclusion of
[0008]
In particular, in the fitting step, a plurality of electronic members are randomly placed on the first jig, the first jig is vibrated, each electronic member is moved by vibration, and is fitted into a recess connected to the through hole. As a result, the formation of the insulating film on the electronic member can be improved, and as a result, the electronic member can be made smaller and the mass production of the electronic member can be dealt with.
As a vibration method for vibrating the first jig, an ultrasonic vibration method using a vibrator such as magnetostriction or electrostriction can be given.
[0009]
As an electrodeposition agent for forming an insulating resin layer by electrodeposition, a polyimide resin containing an ionic group, an organic solvent capable of dissolving the polyimide resin, water, and an ionic having a polarity different from that of the ionic group An electrodeposition coating composition composed of a compound is preferable from the viewpoints of insulation, chemical stability and strength of the insulating film to be formed.
[0010]
By adopting such a configuration, the electronic member of the present invention is easy to manufacture, low in cost, reliable in quality, and suitable for mass production.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
First, an embodiment of a method for forming an insulating film on an electronic member according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic process diagram showing an example of an embodiment of a method for forming an insulating film on an electronic member according to the present invention. FIG. 2 is produced by the method for forming an insulating film on an electronic member shown in FIG. FIG. 3 is a cross-sectional view for explaining a modified example of the jig.
1A and 1B are cross-sectional views taken along line A1-A2 in FIGS. 1A and 1A, and FIGS. 1B and 1B are cross-sectional views taken along line A3-A4 in FIGS. Yes,
FIGS. 1C and 1D are cross-sectional views of positions corresponding to FIGS. 1A and 1A and 1B and 1A.
In FIG. 1, for ease of understanding of the drawing, eight electronic members are shown to be processed, but the number means a larger number.
1 and 2, 110 is a first jig, 115 is a through hole, 117 is a recess, 120 is an electronic member, 130 is a second jig, 311 is an electrode, 135 is a through hole, and 140 is a counter electrode. , 150 is an electrodeposition bath, 155 is an electrodeposition liquid (also referred to as an electrodeposition agent), and 160 is an electrodeposition resin layer.
In this example, the electrodeposition resin layer 160 is formed by electrodeposition only in a predetermined region straddling the periphery of a part of the plate-shaped electronic member 110 having a conductive surface at least on the surface. Then, in the method of forming an insulating film using this as an insulating film, simply, a plurality of electronic members are individually clamped and held by the first jig and the second jig, and A masking jig that exposes only a conductive portion of a predetermined region of each electronic member is formed by a through hole provided in the jig, and an insulating resin is formed by electrodeposition on the entire exposed conductive portion of each electronic member. This is a method of forming an insulating film by forming a layer and using this as an insulating film.
Examples of the electronic member 110 include those composed only of gold, copper, nickel, aluminum, iron, and alloys thereof, or those obtained by providing the metal layer, gold, silver, or other metal layers only on the surface portion. It is done.
Of course, an insulating resin such as glass, polyester, polycarbonate, polyimide, polyethylene, and acrylic is used as an insulating base material that becomes the core of the electronic member 110, and only a metal layer, gold, silver, or other metal layer is formed on the surface portion. There are also those provided.
[0012]
First, the through-hole part 115 corresponding to the electrodeposition area | region of an electronic member, the recessed part 117 corresponding to the shape of an electronic member, many provided 1st jig | tools 110 (FIG.1 (a)), and 1st jig | tool The second jig provided with only the through-hole portion 115 (130 in FIG. 1 (c), the plan view is not shown, but in FIG. 1 (a) (a), the shape without the recess 117). Prepare.
The depth of the concave portion 117 of the first jig 110 is the thickness of the electronic member 120, and the second jig 130 is pressed against the electronic member 120 in a state where the electronic member 120 is fitted and fixed in the concave portion 117. In addition, the respective through-hole portions are combined to form a masking jig for electrodeposition.
As the material of the first jig 110 and the second jig 130, it is necessary to have a predetermined mechanical strength with electrodeposition liquid resistance, and examples thereof include polyvinyl chloride and allyl material. In particular, it is not limited to this.
Further, the main material may be the polyvinyl chloride, the allyl material, etc., and a rubber layer or a sponge layer may be partially or entirely laminated thereon.
[0013]
Next, although not shown, the electronic member 110 is randomly placed on the first jig 110 more than the number of through holes, and the first jig 110 is vibrated.
Then, the vibration causes the electronic member to move and fit into the through-hole portion 115, and after the electronic member 110 is fitted into all the through-hole portions 115 of the first jig 110, the excess electronic member is removed. Keep it. (Fig. 1 (b))
The method for vibrating the first jig 110 is not particularly limited. However, in the case of a small electronic member, the first jig 110 can be easily attached to the first jig by using ultrasonic vibration using a vibrator or the like. It can move up and can be easily fitted into the recess 115.
[0014]
Next, the position of the through-hole portion 135 is aligned with the first jig 110 through-hole portion 115, and the second jig 130 is aligned with the first jig 110 so as to cover the electronic member 120. A masking jig that exposes only the conductive portion of the predetermined region is formed by the first jig 110 and the second jig 130. (Fig. 1 (c))
[0015]
Next, with the first jig 110 and the second jig 130 forming a masking jig that exposes only a conductive portion of a predetermined region of the electronic member, the entire electrodeposition liquid 155 of the electrodeposition bath 150 is formed. The electrode member is immersed in the electrode member, and the electronic member is electrodeposited as one electrode, and an electrodeposition resin layer 160 is formed in a predetermined region where the electronic member is exposed.
Then, after the electrodeposition resin layer 160 is formed, it is dried and heat-treated as necessary, and the electrodeposited resin layer 160 formed by electrodeposition is used as an insulating film.
[0016]
Examples of the polymer used in the electrodeposition liquid (electrodeposition agent) 155 include various anionic or cationic synthetic polymer resins having electrodeposition properties.
As an anionic synthetic polymer resin, an acrylic resin, a polyester resin, a maleated oil resin, a polybutadiene resin, an epoxy resin, a polyamide resin, a polyimide resin, etc. alone or as a mixture of any combination of these resins Can be used. Furthermore, you may use together said crosslinking | crosslinking resin, such as said anionic synthetic resin and a melamine resin, a phenol resin, and a urethane resin.
As the cationic synthetic polymer resin, an acrylic resin, an epoxy resin, a urethane resin, a polybutadiene resin, a polyamide resin, a polyimide resin, or the like can be used alone or as a mixture of any combination thereof. Further, the above cationic synthetic polymer resin may be used in combination with a crosslinkable resin such as a polyester resin and a urethane resin.
In addition, in order to impart tackiness to the above polymer resin, it is possible to add tackifying resins such as rosin, terpene, and petroleum resins as necessary.
The polymer resin is subjected to an electrodeposition method in a state in which it is neutralized with an alkaline or acidic substance and solubilized in water in a production method described later, or in a water-dispersed state. That is, the anionic synthetic polymer resin is neutralized with amines such as trimethylamine, diethylamine, dimethylethanolamine and diisopropanolamine, and inorganic alkalis such as ammonia and caustic potash. The cationic synthetic polymer resin is neutralized with an acid such as acetic acid, formic acid, propionic acid, or lactic acid. The polymer resin solubilized in the neutralized water is used in a state of being diluted in water as a water dispersion type or a dissolution type.
[0017]
In particular, from the viewpoint of insulation reliability, a preferred electrodeposition liquid (electrodeposition agent) 155 includes a polyimide resin containing an ionic group, an organic solvent capable of dissolving the polyimide resin, water, the ionic group and polarity. Examples thereof include electrodeposition coating compositions composed of ionic compounds having different values. As polyimide, it is only necessary to be soluble in a solvent and to maintain heat resistance, insulation and mechanical strength, and various aromatic dianhydrides and aromatic diamines are selected depending on the purpose and function.
These aromatic acid dianhydrides and aromatic diamines are heated and dehydrated to synthesize polyimide.
In order to add a function of electrodeposition, a functional group or an ionic group is introduced. For example, carboxylic acid is introduced. In this case, an aromatic diaminocarboxylic acid or the like can be used as the aromatic diamine.
In order to give good adhesion, diaminodiphenyl sulfone or the like is introduced.
[0018]
For the preparation of the electrodeposition liquid of polyimide for electrodeposition forming such an electrodeposition coating composition for forming an insulating film, the description of Japanese Patent Publication No. 51-15061, Japanese Patent Publication No. 46-17415 And having an imide bond and an amic acid produced as a result of charging and synthesizing an aromatic tetracarboxylic acid and an aromatic diamine component by a combination of these methods based on the description of JP-A-9-104839 Carboxylic acid-containing polyimides can also be synthesized.
Furthermore, in addition to the aromatic tetracarboxylic acid and the aromatic diamine component, a carboxylic acid-containing monomer is charged in advance during synthesis, and finally a polyimide varnish containing an imide bond, an amic acid, and a carboxylic acid functional group can be synthesized.
In order to make an electrodeposition solution, a base such as amine is added to this varnish, a part of the imide bond is further opened, a neutralized salt is formed, and water and various solvents are added as necessary. A polyimide electrodeposition solution can be produced.
Incidentally, Japanese Patent Publication No. 51-15061 discloses that a part of a polyimide having a carboxyl group at the terminal in the main chain and an imide bond in the repeating unit is allowed to act on ammonia, amine or other base. A method for producing an electrodeposition solution of polyimide is described in which ring-opening is performed, and an imide bond in a repeating unit is converted into an ammonium salt or amine salt of an amide carboxylic acid and dispersed by forcibly stirring in an aqueous solution containing a surfactant. ing.
Japanese Patent Publication No. 46-17415 discloses a method for producing a polyimide having an imide bond in a repeating unit by reacting an aromatic tetracarboxylic acid and an aromatic diamine component in a phenol solvent by heating. A method for directly obtaining a solvent-soluble polyimide resin having a high conversion rate is described.
In addition, in JP-A-9-104839, aromatic diaminocarboxylic acid or the like is used as an aromatic diamine, and another aromatic tetracarboxylic acid and another aromatic diamine component are heated in a phenol solvent. And a method for directly obtaining an electrodeposition-type polyimide resin having a high imidation ratio is described.
[0019]
Here, the storage stability is increased by using polyimide as a polyimide instead of a polyimide precursor.
Polyimide that can be used is heated and polycondensed in an organic polar solvent such as N-methyl-2-pyrrolidone using approximately equal amounts of aromatic tetracarboxylic dianhydride and aromatic diamine. If necessary, a catalyst is added and heated to 140 to 200 ° C. to remove water generated by the condensation out of the system.
[0020]
As a functional group to be introduced for electrodeposition, that is, an ionic group, if it is an anionic group, for example, a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, a phenol group, etc. An amino group or the like is used. In the case of introducing an anionic group, a carboxylic acid group is particularly preferable, and diaminobenzoic acid or the like is used as a monomer.
[0021]
In the case of an anionic electrodeposition liquid, an electrodeposition polyimide having an anionic group dissolved in a solvent is neutralized with a basic compound, and an appropriate solvent and water are added. As the basic compound, triethylamine, triethanolamine, methylmorpholine and the like can be used.
In the case of a cationic electrodeposition solution, a polyimide for electrodeposition solution having a cationic group dissolved in a solvent is neutralized with an acidic compound, and an appropriate solvent and water are added. As the acidic compound, formic acid, lactic acid, acetic acid, butyric acid and the like can be used.
[0022]
A variety of solvents can be used. Considering the stability during washing, a relatively lipophilic material is used, and an appropriate flow property after electrodeposition can be adjusted.
[0023]
As a method of emulsifying and dispersing the resin, any method can be used as long as it can be uniformly stirred, and an ultrasonic dispersion salt or the like can also be used.
[0024]
The electronic members formed with the insulating film in this way are as shown in FIG.
In particular, an electronic member formed of an electrodeposited resin layer made of polyimide and used as an insulating film is excellent in terms of insulation and stability, and is particularly effective for an electronic member that places importance on these.
[0025]
Instead of the first jig 110 and the second jig 130 of this example, jigs 110A and 130A for fitting electronic members as shown in FIG.
FIG. 3 is an enlarged view of the A5 portion of FIG.
The depth of the concave portion 117 </ b> A of the jig 110 </ b> A is necessary to such an extent that the electronic member can be fitted by vibration and the position can be fixed.
In this example, the plate-shaped electronic member is the object to be processed, but it goes without saying that the present invention can also be applied to a round-bar-shaped electronic member by changing the shape of the recess 115 (135).
[0026]
【Example】
In the embodiment, an insulating film is formed on the surface portion of a plate-shaped electronic member (chip component) by the insulating film forming method on the electronic member shown in FIG. Hereinafter, a description will be given based on FIG.
The plate-like electronic member (chip component) has a length of 2 mm, a width of 2 mm, and a thickness of 0.5 mm, and the entire surface portion is made conductive.
First, a first jig 110 (FIG. 1A) provided with a large number of through-hole portions 115 corresponding to the electrodeposition region of the electronic member and concave portions 117 corresponding to the shape of the electronic member, and the first jig. In the tool, a second jig provided with only the through-hole portion 115 (130 in FIG. 1 (c), in FIG. 1 (a) (a), in which there is no recess 117)) is prepared, and a vibrator or the like is prepared. Using the ultrasonic vibration device used, a large number of electronic members randomly placed on the first jig 110 are moved on the first jig, and are fitted into all the recesses 115 of the first jig 110. It was.
After the excess electronic member was removed (FIG. 1B), a masking jig was formed with the second jig 130 (FIG. 1C), and an electrodeposition solution (electrodeposition agent) was formed as follows. ) To form an electrodeposited resin layer with a thickness of 20 μm in a wet state on the exposed conductive surface portion of the electronic member. (Fig. 1 (d))
The electrodeposition resin layer 160 is formed by placing the exposed conductive surface portion of the electronic member facing the platinum electrode and immersing it in an anionic electrodeposition solution prepared as described below, and applying it to the anode of the constant voltage power source. The exposed conductive surface portion of the electronic member is connected to a cathode with a platinum electrode, electrodeposited at a voltage of 150 V for 6 minutes, dried and heat-treated at 150 ° C. for 5 minutes, An insulating electrodeposition resin layer 160 was formed so as to cover the exposed conductive surface portion.
The liquid temperature of the electrodeposition agent was set to approximately 25 ° C.
[0027]
A polyimide varnish was prepared as follows, and the electrodeposition solution was adjusted.
<Manufacture of polyimide varnish>
A 11-volume three-necked separable flask is equipped with a stainless steel squid stirrer, a nitrogen condenser and a reflux condenser with a ball condenser on a trap with a stopcock. While flowing in a nitrogen stream, a separable flask was attached to a silicone bath equipped with a temperature controller and heated. The reaction temperature is indicated by the bath temperature.
3,4,3 ′, 4′-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA) 32.22 g (0.1 mol), bis (4- (3-aminophenoxy) phenyl) sulfone (m-BAPS) ) 21.63 g (0.05 mol), γ-valerolactone 1.5 g (0.015 mol), pyridine 2.37 g (0.03 mol), NMP (abbreviation of N-methyl-2-pyrrolidone) 200 g, 30 g of toluene is added, and the mixture is stirred for 30 minutes at room temperature (200 rpm) in a silicon bath while passing nitrogen, and then the temperature is raised and the reaction is carried out at 180 ° C. for 1 hour with stirring at 200 rpm. 15 ml of toluene-water distillate was removed, air-cooled, BTDA 16.11 g (0.05 mol), 3, 5 diaminobenzoic acid (hereinafter referred to as DABz) 15.22 g (0.1 mol), NMP 119 g, toluene 30 g is added and stirred at room temperature for 30 minutes (200 rpm), then heated to 180 ° C. and heated to 180 ° C. to remove 15 ml of toluene-water distillate. Thereafter, the toluene-water distillate was removed from the system, and the reaction was terminated by heating and stirring at 180 ° C. for 3 hours. A 20% polyimide varnish was obtained.
<Preparation of electrodeposition solution>
100 g of 20% polyimide varnish, 150 g of 3SN (mixed solution of NMP: tetrahydrothiophene-1, l-dioxide = 1: 3 (weight)), 75 g of benzyl alcohol, 5.0 g of methylmorpholine (neutralization rate 200%), water Aqueous electrodeposition solution is prepared by stirring 30 g. The obtained aqueous electrodeposition liquid is a polyimide 7.4%, pH 7.8, dark reddish brown transparent liquid.
[0028]
Thereafter, the electrodeposition product was heated and cured at 300 ° C. for 30 minutes to obtain a dry film thickness of 4 μm.
In this way, an insulating film made of polyimide resin could be formed on a predetermined surface portion of the electronic member 110.
[0029]
【The invention's effect】
As described above, according to the present invention, it is possible to form an insulating film that is satisfactory in terms of quality in response to further downsizing, and to form the insulating film relatively easily. It is possible to provide a method for forming an insulating film.
In particular, an electrodeposition coating composition comprising an ionic group-containing polyimide resin, an organic solvent capable of dissolving the polyimide resin, water, and an ionic compound having a polarity different from that of the ionic group is used as an electrodeposition agent. This makes it possible to provide electronic components with excellent insulation, thermal stability, strength and chemical stability.
[Brief description of the drawings]
FIG. 1 is a schematic process diagram showing an example of an embodiment of a method for forming an insulating film on an electronic member of the present invention. FIG. 2 is produced by the method for forming an insulating film on an electronic member shown in FIG. Fig. 3 is a schematic view of an electronic member. Fig. 3 is a cross-sectional view for explaining a modification of the jig.
110, 110A First jig 115, 115A Through hole 117, 117A Recess 120, 120A Electronic member 130, 130A Second jig 137 Recess 311 Electrode 135 Through hole 140 Counter electrode 150 Electrodeposition bath 155 Electrodeposition liquid (electrode Also called a dressing)
160 Electrodeposition resin layer

Claims (4)

A plurality of electronic members are individually sandwiched and held by the first jig and the second jig, and conductive portions of predetermined regions of the respective electronic members are formed by through holes provided in the respective jigs. A method of forming an insulating film, in which an insulating resin layer is formed by electrodeposition on the entire exposed conductive portion of each electronic member by forming a masking jig that only exposes In order, the electronic member is inserted into a recess connected to the through-hole portion so as to cross the through-hole portion of the first jig, and the electronic device is sandwiched between the fitting step and the second jig. In accordance with the first jig, a plurality of electronic members are sandwiched and held individually by the first jig and the second jig, and only a conductive portion of a predetermined region of each electronic member is exposed. Masking process, and the entire exposed conductive part of each electronic component is insulated by electrodeposition. Forming a sexual electrocoating resin layer, and a electrodeposition step, after the degree conductive construction, Drying, heat treated, the electrodeposition-formed insulating electrocoating resin layer in which the insulating film, the fitting The process is to place a plurality of electronic members randomly on the first jig, vibrate the first jig, move each electronic member by vibration, and fit into the recesses connected to the through-holes. A method for forming an insulating film on an electronic member. The method for forming an insulating film on an electronic member according to claim 1, wherein the first jig is vibrated by ultrasonic vibration. The method for forming an insulating film on an electronic member according to any one of claims 1 to 2 , wherein the electrodeposition agent for forming the insulating resin layer by electrodeposition is an polyimide containing an ionic group. A method of forming an insulating film on an electronic member, comprising an electrodeposition coating composition comprising a resin, an organic solvent capable of dissolving the polyimide resin, water, and an ionic compound having a polarity different from that of the ionic group. The insulating film formation method of the electronic component according to any one of claims 1 to 3, an electronic member, characterized in that the formation of the insulating film.

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