JP4337622B2 - Substrate underlay device - Google Patents

Description

The present invention relates to a substrate receiving device for receiving a substrate by a receiving pin in an electronic component mounting apparatus.

An electronic component mounting apparatus for mounting an electronic component on a substrate includes a lowering device that supports the substrate from the lower surface at a mounting position by a mounting head. As such a receiving device, a pin type receiving device that supports a substrate by bringing a plurality of pins into contact with the lower surface of the substrate is often used (see, for example, Patent Document 1). In this receiving device, a plate-like pin mounting base provided with a plurality of mounting holes for mounting pins is arranged at a component mounting position, and the lower receiving pins are arranged at pin arrangement positions according to the shape and size of the board to be mounted. I am trying to wear it. According to this pin method, even when a so-called double-sided mounting board in which electronic components are mounted on both sides as well as on one side of the board is set, the electronic components are already mounted by appropriately setting the pin arrangement. There is an advantage that the mounting surface can be supported.
JP 2000-124690 A

  Incidentally, a stopper for accurately stopping and positioning the substrate, a sensor for detecting the substrate, and the like are disposed on the lower side of the substrate in the substrate holding unit that holds the substrate at the component mounting position in the electronic component mounting apparatus. For this reason, the above-described pin mounting base may not be disposed on the entire bottom surface of the substrate, and in such a portion, the electronic component is mounted in a state where the bottom surface of the substrate is not directly received by the pin, and stable. In some cases, electronic components could not be mounted in the posture.

  In order to avoid mounting electronic components in such a poorly-understood state, the pin mounting base has to be partially cut out in a range corresponding to the stopper or sensor placement portion. In such a case, since the position where this notch is necessary is not uniform for all the substrates, it is necessary to prepare various types of pin mounting bases. In this way, the substrate under the pin system in the conventional electronic component mounting apparatus cannot stably receive the entire range where the substrate is required, and can ensure mounting accuracy. There was a problem that it was difficult.

Therefore, the present invention is capable of stably receiving the entire range where the under-loading is required for various types of substrates, and is capable of ensuring mounting accuracy. An object is to provide an apparatus .

The substrate support device of the present invention is a substrate support device that supports a substrate from the lower surface side, and is arranged between the clampers when both ends of the substrate are clamped by the clamper, and is mounted with a support pin. A pin mounting base for supporting a part of the substrate as a receiving range, and an auxiliary receiving jig for receiving another part of the substrate at a portion other than the receiving range where the pin mounting base cannot be disposed. The auxiliary lower receiving jig includes an auxiliary lower receiving pin for supporting another part of the substrate from a lower surface side in a portion other than the lower receiving range, an auxiliary mounting base on which the auxiliary lower receiving pin is mounted, Auxiliary base mounting means for detachably fixing the auxiliary mounting base to the pin mounting base.

According to the present invention, when the substrate is received in a portion other than the receiving range where the pin mounting base cannot be disposed , the auxiliary receiving jig having the portion as the receiving range is mounted on the pin mounting base. In addition, it is possible to stably receive the entire range where the under-loading is required for various types of substrates, and to stabilize the posture of the substrate during mounting and to ensure mounting accuracy.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of a substrate receiving apparatus according to an embodiment of the present invention, and FIGS. FIG. 5, FIG. 6 and FIG. 7 are explanatory views of a substrate underlaying method according to an embodiment of the present invention. .

  First, referring to FIG. 1, the structure of an electronic component mounting apparatus in which a substrate receiving apparatus is incorporated will be described. A transport path 2 is disposed in the center of the upper surface of the base 1 in the X direction. The conveyance path 2 conveys the board 3 delivered from the upstream side, and positions the board 3 at the component mounting position. At the component mounting position, the substrate 3 is sandwiched between the clampers 2a and supported from the lower surface side by a receiving device described later.

  On both sides of the conveyance path 2, component supply units 4 are disposed, and a plurality of tape feeders 5 are mounted in parallel on the component supply unit 4. The tape feeder 5 feeds electronic components to a component mounting mechanism described below by pitch-feeding a carrier tape holding electronic components mounted on the substrate 3.

  Y axis tables 6A and 6B are disposed on both ends of the upper surface of the base 1, and two X axis tables 7A and 7B are installed on the Y axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. The X-axis tables 7A and 7B are equipped with a transfer head 8 and a camera 9 that moves integrally with the transfer head 8, respectively.

  When the Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B are driven in combination, the transfer head 8 moves horizontally, and an electronic component is picked up from each component supply unit 4 by suction nozzles (not shown). (Omitted) is picked up and mounted on the substrate 3 positioned at the component mounting position. The camera 9 that has moved onto the substrate 3 captures and recognizes the substrate 3.

  A line camera 10 and a nozzle stocker 11 are disposed on the path from the component supply unit 4 to the conveyance path 2. The line camera 10 captures an image of the electronic component held by each transfer head 8 from below. The nozzle stocker 11 stores a plurality of types of suction nozzles corresponding to the types of electronic components, and when the transfer head 8 accesses the nozzle stocker 11 during the mounting operation, the suction corresponding to the electronic component to be mounted is stored. A nozzle is attached to the transfer head 8.

Next, with reference to FIG. 2, the receiving device for the substrate 3 will be described. As shown in FIG. 2A, the receiving device 12 is disposed at a component mounting position where the electronic component is mounted on the substrate 3 so as to be positioned between the rows of the transport path 2. The lower receiving device 12 has a configuration in which two lower receiving units 12a are arranged side by side in the transport direction, and one or two lower receiving units 12a are used depending on the size of the target substrate 3. Is done.

  The lower receiving unit 12a includes a pin mounting base 13 in which a plurality of mounting holes 13a are provided in a lattice shape. As shown in FIG. 5A, two pin mounting bases 13 are provided on the upper surface of the lower receiving base 12b. It is the structure which has arranged in piles. Then, by inserting the lower portion of the lower receiving pin 15 into the mounting hole 13a, the lower receiving pin 15 is mounted in the mounting hole 13a in a vertical posture.

  The lower receiving base 12 b is coupled to an elevating mechanism 14 such as an air cylinder. By driving the elevating mechanism 14, the pin mounting base 13 rises together with the mounted lower receiving pin 15. The upper end portion of the lower receiving pin 15 is in contact with and supported by the lower surface of the substrate 3 conveyed by the conveying path 2, whereby the substrate 3 is received from the lower surface side at the component mounting position.

  As shown in FIG. 2A, at the component mounting position, a board positioning sensor 2c for detecting the presence or absence of a board at the component mounting position and a stopper mechanism 2b for positioning the board in the vicinity of the conveyance path 2 on one side. It is arranged. Since the stopper mechanism 2b and the substrate detection sensor 2c need to be positioned on the lower surface side of the substrate 3 to be received and inside the transport path 2, the pins are mounted in a range where these component parts exist. The base 13 cannot be arranged. For this reason, in the conventional receiving device, the component mounting is performed while the substrate 3 is not supported on the lower surface side within the range of the width A shown in FIG.

  However, in the component mounting, it is desirable to perform the component mounting operation while keeping the substrate 3 as stable as possible, and the ranges A1 and A2 shown in FIG. Since the stopper mechanism 2b and the substrate detection sensor 2c do not directly overlap with each other, it is desirable to arrange a receiving pin within this range. For this reason, in the substrate receiving apparatus shown in the present embodiment, as shown in FIG. 2B, in order to cover such ranges A1 and A2, the auxiliary lower base using the auxiliary mounting base 16 is used. A receiving jig 19 is supplementarily mounted on the pin mounting base 13 so as to receive the lower surface of the substrate 3 as much as possible.

  With reference to FIG. 3 and FIG. 4, the structure of the auxiliary lower receiving jig 19 that is auxiliaryly attached to the pin attachment base 13 will be described. The auxiliary lower receiving jig 19 includes an auxiliary lower receiving pin 17 that supports the substrate 3 from the lower surface side, an auxiliary mounting base 16 provided with a plurality of auxiliary mounting holes 16a in which the auxiliary lower receiving pins 17 are mounted, and the auxiliary mounting base 16. The mounting base 16 includes a connecting pin 18 that detachably fixes the mounting base 16 to the pin mounting base 13. As shown in FIG. 3A, the auxiliary mounting base 16 is provided with auxiliary mounting holes 16 a in a lattice shape, and a connecting pin 18 is connected to the auxiliary mounting base 16 at one end of the auxiliary mounting base 16. A fixing fastening hole 16b is provided for fixing to the base plate.

  Then, by inserting the lower end portion of the connecting pin 18 fixed to the auxiliary mounting base 16 into the mounting hole 13a of the pin mounting base 13, the auxiliary receiving jig 19 is detachably fixed to the pin mounting base 13. The That is, the connecting pin 18 fixed to the auxiliary mounting base 16 and mounted in the mounting hole 13a of the pin mounting base 13 serves as auxiliary base mounting means for detachably fixing the auxiliary mounting base 16 to the pin mounting base 13. Yes.

In FIG. 4, instead of mounting the normal receiving pin 17 having a flat upper end as shown in FIG. 3 on the auxiliary mounting base 16, a flexible material such as resin is formed into a cone shape with a sharp top. An example in which the flexible receiving pin 20 is mounted on the auxiliary mounting base 16 is shown. By using the flexible underpin 20 as the underpin, as will be described later, the double-sided mounting board on which the electronic component is mounted on both the front and back surfaces is targeted as the undercover, and the already mounted surface on which the electronic component is already mounted is In receiving, there are the following advantages. That is, even when the upper end portion of the flexible receiving pin 20 comes into contact with an electronic component already mounted on the lower surface of the substrate, the upper end portion bends the substrate without causing damage to the electronic component. It can be accepted.

  Next, with reference to FIGS. 5 and 6, a substrate underlaying method by the substrate underlaying device having the above-described configuration will be described. FIG. 5A shows the lower receiving unit 12a before the auxiliary lower receiving jig 19 is mounted. In this state, the pin mounting base 13 provided in the lower receiving unit 12a does not cover the ranges A1 and A2 shown in FIG. 2A, and the ranges A1 and A2 are other than the lower receiving range by the pin mounting base 13. It has become.

  When the substrate 3 carried into the component mounting position by the conveyance path 2 is received by the lower receiving unit 12a in this state, the upper surface of the substrate 3 corresponding to the ranges A1 and A2 is not supported from the lower surface side. In this embodiment, as described above, the auxiliary lower receiving jig 19 having these portions as lower receiving ranges is mounted on the pin mounting base 13 in this embodiment. Yes. That is, as shown in FIG. 5B, by inserting the connecting pin 18 into the mounting hole 13a, the auxiliary lower receiving jig 19 in which the lower receiving pin 17 is mounted in a required position in advance is attached to the lower receiving unit 12a. Attachment, range A1, A2 is included in the receiving range.

When the electronic component mounting operation is started, as shown in FIG. 6A, the substrate 3 is carried into the component mounting position by the transport path 2, and both ends of the substrate 3 are clamped by the clamper 2a. Next , when clamped, as shown in FIG. 6 (b), the lifting mechanism 14 is driven so that the pin mounting base 13 mounted and disposed between the clampers 2a together with the lower receiving pins 15 is used for auxiliary purposes. The lower receiving jig 19 is raised together with the lower receiving pins 17. As a result, the upper ends of the lower receiving pins 15 and 17 come into contact with the lower surface of the substrate 3 to be received, and the substrate 3 is supported from the lower surface side. In this state, mounting of electronic components by the transfer head is executed.

  That is, in the above-described substrate receiving method, when receiving the substrate 3 at a portion other than the receiving range by the pin mounting base 13, the supporting auxiliary jig 19 having the receiving portion as the receiving range is used as the pin. Auxiliary mounting is performed on the mounting base 13. As a result, the substrate 3 is supported by the support pins 17 even in the portions corresponding to the ranges A1 and A2 that are originally located outside the support range of the pin mounting base 13, so that the support can be applied to various types of substrates. Therefore, it is possible to stably receive the entire range required for the mounting, and it is possible to secure mounting accuracy by eliminating mounting defects caused by the receiving failure.

  FIG. 7 shows an example of proper use of the receiving pins in the substrate receiving method using the above-described auxiliary receiving jig 19. FIG. 7 (a) shows a normal receiving pin 15 and a lower receiving pin 17 whose upper ends are flat on both the pin mounting base 13 of the lower receiving unit 12a and the auxiliary mounting base 16 of the auxiliary lower receiving jig 19. It shows an example of wearing and using. In this case, the upper end portions of the lower receiving pins 15 and 17 are not allowed to come into contact with the already mounted components on the lower surface side of the substrate 3, so the lower receiving pins are referred to with reference to the arrangement of the already mounted components P on the substrate 3. It is necessary to arrange 15 and 17 at positions where they do not interfere with these already mounted components P.

  FIG. 7B shows an example in which a resin-made flexible lower receiving pin 20 is selected as the lower receiving pin attached to the auxiliary lower receiving jig 19. In this case, since the upper end of the flexible lower receiving pin 20 is allowed to contact the already mounted component P, it is not necessary to change the arrangement of the lower receiving pin on the auxiliary mounting base 16 each time, and the same auxiliary There is an advantage that the receiving jig 19 can be applied to various types of substrates.

Further, FIG. 7C shows a resin-made flexible receiving pin for the lower receiving pin attached to the pin attaching base 13 in addition to the flexible lower receiving pin 20 attached to the auxiliary lower receiving jig 19. An example in which 21 is selected is shown. In this case, since the upper ends of both the flexible lower receiving pins 20 and 21 are allowed to contact the already mounted component P, the arrangement of the lower receiving pins on the pin mounting base 13 and the auxiliary mounting base 16 is changed each time. There is no need, and the same base unit 12a and auxiliary base jig 19 can be applied to many types of substrates, and the setup change work can be greatly reduced.

The substrate receiving device of the present invention has the effect of being able to stably receive the entire range where the substrate is required for various types of substrates, and ensuring mounting accuracy. In addition, it is useful for a substrate receiving device used in an electronic component mounting apparatus.

The top view of the electronic component mounting apparatus of one embodiment of this invention The top view of the board | substrate receiving apparatus of one embodiment of this invention Structure explanatory drawing of the auxiliary | assistant receiving jig used for the substrate lowering apparatus of one Embodiment of this invention Structure explanatory drawing of the auxiliary | assistant receiving jig used for the substrate lowering apparatus of one Embodiment of this invention Explanatory drawing of the substrate underlay method of one embodiment of the present invention Explanatory drawing of the substrate underlay method of one embodiment of the present invention Explanatory drawing of the substrate underlay method of one embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Conveyance path 3 Board | substrate 12 Underlay apparatus 12a Underlay unit 13 Pin mounting base 13a Mounting hole 15 Lower receiving pin 16 Auxiliary mounting base 16a Auxiliary mounting hole 17 Lower receiving pin 18 Connection pin 19 Auxiliary lower receiving jig

Claims (4)

In the substrate receiving device that supports the substrate from the lower surface side,
A pin mounting base that is disposed between the clampers when both ends of the substrate are clamped by the clamper and supports a part of the substrate as a receiving range by mounting a lower receiving pin;
An auxiliary support jig for receiving the other part of the substrate in a portion other than the support range where the pin mounting base cannot be disposed;
The auxiliary lower receiving jig includes an auxiliary lower receiving pin for supporting another part of the substrate from a lower surface side in a portion other than the lower receiving range, an auxiliary mounting base on which the auxiliary lower receiving pin is mounted, and the auxiliary An underlaying device for a substrate, comprising: an auxiliary base mounting means for detachably fixing the mounting base to the pin mounting base.   2. The substrate receiving apparatus according to claim 1, wherein the auxiliary receiving pin is a flexible receiving pin made of resin.   3. The substrate according to claim 1, wherein the portion other than the receiving range is a portion where the pin mounting base cannot be disposed because a stopper mechanism for positioning the substrate is disposed. Underlay device.   The portion other than the lower receiving range is a portion where the pin mounting base cannot be disposed because a substrate detection sensor for detecting the presence or absence of the substrate at the component mounting position is disposed. 3. A substrate receiving device according to claim 1 or 2.

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