JP4356609B2 - Chip-type electronic component storage mount - Google Patents

Description

The present invention relates to a paper chip-type electronic component storage board.

The chip-type electronic component storage board is usually processed as follows and used as a carrier for the chip-type electronic component.
(1) Slit to a predetermined width.
(2) Open a square hole (hereinafter referred to as a cavity) and a round hole of a predetermined size. The cavity is for storing chip-type electronic components, and the round hole is for feeding in the filling machine.
(3) Adhere the cover tape to the back side (bottom side) of the mount. In addition, a square embossing of a predetermined size may be performed without opening the cavity, and in this case, this step is omitted. A method of bonding the mount and the cover tape is performed by a so-called heat seal method in which the mount and the cover tape are overlapped and bonded by applying heat and pressure from the cover tape.
(4) The chip type electronic component is filled.
(5) A cover tape is bonded to the surface (top side) of the mount by a heat seal method.
(6) It is wound around a cassette reel of a predetermined size and shipped with a chip-type electronic component.
(7) The top user peels off the top cover tape and takes out the chip-type electronic component.

  Since it is used as described above, conventionally, the quality required for the storage board is that there is no adverse effect such as corrosion on the filled chip parts, the cover tape is well bonded, and the cover tape When removing the chip-type electronic component by peeling, it can be peeled off smoothly with a certain strength, it has enough strength to withstand various types of paper processing, the size of the cavity into which the chip component is inserted is accurate, and the expansion and contraction due to environmental changes Is small.

  However, in recent years, chip-type electronic components have been gradually reduced in size, and the length and width have become mainstream from 1.6 × 0.8 mm to 1.0 × 0.5 mm, and 0.6 × 0. Sizes of 3 mm or less have been put into practical use. Along with this, paper dust that has fallen from the storage mount causes problems that result in adhesion failure and chip-type electronic component removal failure when the cover tape is bonded (hereinafter referred to as taping) or when the component is removed. A chip-type electronic component storage board that does not generate paper dust has been desired. On the other hand, along with the refinement of the substrate, the mounting process to the electronic device may be performed in a clean room, and it has been desired that the storage board be cleaned like dust-free paper used in the clean room.

  Until now, many inventions related to paper dust in the cavity have been made. For example, as a method for preventing the jump-out of pulp fibers called whiskers or burrs in the cavity, Japanese Patent No. 2838818 (see Patent Document 1), Japanese Patent Laid-Open No. 10-218281 (see Patent Document 2), Japanese Patent Laid-Open No. 11- No. 165786 (see Patent Document 3), a method of applying a binder resin to the cavity inner wall, Japanese Patent Application Laid-Open No. 9-221192 (see Patent Document 4), or a film layer formed on the cavity inner wall, Although a method has been proposed in which a cup made of synthetic resin or metal is fitted into a cavity as disclosed in Japanese Patent Laid-Open No. 2001-315846 (see Patent Document 5), even if the generation of paper dust from the cavity can be suppressed, Paper dust from the back and sides cannot be suppressed.

Japanese Patent No. 2838818 Japanese Patent Laid-Open No. 10-218281 JP-A-11-165786 Japanese Patent Laid-Open No. 9-221192 JP 2001-315846 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a chip-type electronic component storage mount made of paper, which generates very little dust and can be used in a clean room.

  As a result of various investigations on methods for eliminating chipping and paper dust generated from the chip-type electronic component storage board without impairing other physical properties such as cover tape adhesion and thickness accuracy, the present inventors have applied radical polymerization reaction. Thus, it has been found that formation of a resin layer or a mixed layer of resin and pulp fibers can be suppressed by forming a resin layer or a mixed layer of resin and pulp fibers on every surface of the chip-type electronic component storage board, and the present invention has been completed.

That is, the present invention includes the following inventions.
(1) A chip-type electronic component storage board for storing chip-type electronic components, which has a resin layer hardened by radical polymerization reaction by electron beam irradiation on all surfaces including cavities and feed holes. .

  The present invention relates to a chip-type electronic component storage board that can be used in a clean room because dust generation is extremely small and that generates very little paper dust when running on a taping machine or mounter.

  The chip-type electronic component storage board of the present invention is formed by applying a curable resin that is cured by a radical polymerization reaction after punching or pressing a cavity or a feed hole, and then curing by a radical polymerization reaction to form a cured resin layer. Completed. By providing the cured resin layer on every surface of the chip-type electronic component storage board by radical polymerization reaction, it is possible to prevent dimensional changes due to swelling of the chip-type electronic component storage board.

  The cured resin layer of the present invention is not only the one in which the cured resin layer is formed on every surface of the chip-type electronic component storage board, but also cured with the curable resin penetrating into the paper layer, and the pulp fiber is partially It also includes the state of being embedded. Therefore, it exists in the state by which the network and space | gap of a pulp fiber are hold | maintained.

In the present invention, by making a cured resin layer, or by making a state in which the curable resin penetrates into the paper layer and partially embeds the pulp fiber (this is also one form of the cured resin layer). The generation of paper dust can be suppressed. On the other hand, it is possible to suppress the generation of paper dust even with emulsion-type and water-soluble type resins, but the efficiency and efficiency are low due to the time and energy required for heating and drying, and the size and spacing of the cavities change due to swelling. This is not preferable because quality control becomes easy.
The hardened resin layer is not limited to the surface because the paper dust generated by physical treatment with a taping machine or mounter is detached from about 30 μm at a depth from the paper surface. When the cured resin layer becomes thick, the chip-type electronic component storage board becomes hard, and when it is finished in traverse winding or record winding, it may be broken or wrinkled.

  The cured resin layer is cured by radical polymerization reaction because the treatment time is short. As the curable compound used when the cured resin layer is formed by radical reaction, a prepolymer or a monomer having an unsaturated group or a mixture thereof is used. The prepolymer used for the radical polymerization reaction is not particularly limited. For example, (1) bisphenol A type, bisphenol S type, bisphenol F type, epoxidized oil type, phenol novolak type, alicyclic type, etc. Epoxy acrylate, (2) urethane acrylate, (3) unsaturated polyester, (4) polyester acrylate, (5) polyether acrylate, (6) vinyl / acryl oligomer, (7) polyene / thiol, (8) silicon acrylate (9) polybutadiene acrylate, (10) polystyrylethyl methacrylate, and the like.

  When the storage board is thick, soft prepolymers are preferred, depending on how they are used in taping machines and mounters. Specifically, urethane acrylate, polyether acrylate, polyene / thiol, silicon acrylate, polybutadiene acrylate Etc. are good. Epoxy acrylate, vinyl / acrylic oligomer, polybutadiene acrylate, etc. are preferable for improving the adhesiveness to the cover tape. However, as long as a cured resin layer in which resin and pulp fibers are mixed is formed, the network is used as described above. In other words, there is no problem with other prepolymers because the adhesive component of the cover tape is anchored. However, when the resin to be radically polymerized is infiltrated into the paper layer, ultraviolet irradiation does not reach the inside of the paper layer due to ultraviolet irradiation, and sufficient reaction may not be obtained, so heat or electron beam irradiation is preferable, In order to advance the radical reaction quickly, electron beam irradiation is more preferable.

As the monomer used for the radical polymerization reaction, a monofunctional or polyfunctional monomer or a mixture thereof can be used. For example, a compound containing a radical polymerizable functional group such as an acrylate group, a methacrylate group, a vinyl ether group, or a thiol group. It is preferable to use a mixture of a monofunctional radically polymerizable compound (monomer) and a polyfunctional radically polymerizable compound (crosslinking agent) in order to form a chemically crosslinked body.

  Specifically, monofunctional monomers include methyl acrylate, ethyl acrylate, lauryl acrylate, stearyl acrylate, N-vinyl pyrrolidone, acryloyl morpholine, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, cyclohexyl acrylate, cyclohexyl methacrylate, dicyclohexyl acrylate, isobornyl acrylate, benzyl acrylate, ethoxydiethylene glycol acrylate, methoxytriethylene glycol acrylate, methoxypropylene glycol acrylate N, N-dimethylaminoethyl acrylate, N, N-dimethylaminoethyl methacrylate, 2-ethylhexyl carbitol acrylate, ω-carboxypolycaprolactan monoacrylate, phthalic acid monohydroxyethyl acrylate, acrylic acid dimer, acrylic acid-9 , 10-epoxidized oleyl, methacrylic acid-9,10-epoxidized oleyl, ethylene glycol monoacrylate maleate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyloxyethylene acrylate, 4,4-dimethyl-1 Acrylate of caprolactan adduct of 1,3-dioxolane, acrylate of caprolactone adduct of 3-methyl-5,5-dimethyl-1,3-dioxolane, ethylene oxide modification Examples thereof include, but are not limited to, phenoxylated phosphoric acid acrylate and the like.

  As polyfunctional monomers, ethanediol diacrylate, 1,3-propanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, 1,14 -Tetradecanediol diacrylate, 1,15-pentadecanediol diacrylate, diethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, neopentyl glycol diacrylate, 2-butyl-2-ethylpropanediol diacrylate, ethylene oxide modified bisphenol A diacrylate, polyethylene oxide modified bisphenol A diacrylate, polyethylene oxide modified hydrogenated bisphenol A diac Rate, propylene oxide modified bisphenol A diacrylate, polypropylene oxide modified bisphenol A diacrylate, hydroxypivalate ester neopentyl glycol ester diacrylate, hydroxypivalate ester caprolactone adduct diacrylate, ethylene oxide modified isocyanuric acid diacrylate , Pentaerythritol diacrylate monostearate, 1,6-hexanediol diglycidyl ether acrylic acid adduct, polyoxyethylene epichlorohydrin modified bisphenol A diacrylate, tricyclodecane dimethanol diacrylate, trimethylolpropane triacrylate, Ethylene oxide modified trimethylolpropane triacryle Polyethylene oxide modified trimethylolpropane triacrylate, propylene oxide modified trimethylolpropane triacrylate, polypropylene oxide modified trimethylolpropane triacrylate, pentaerythritol triacrylate, ethylene oxide modified isocyanuric acid triacrylate, ethylene oxide modified glycerol triacrylate, polyethylene oxide modified Glycerol triacrylate, propylene oxide modified glycerol triacrylate, polypropylene oxide modified glycerol triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, Examples include dipentaerythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, polycaprolactone-modified dipentaerythritol hexaacrylate, and the like. However, the present invention is not limited to these, and a mixture of two or more types may be used.

  The chemical reaction of the present invention uses radical polymerization, and the initiation reaction is performed by any one of heat, ultraviolet irradiation, and electron beam irradiation. When using heat, a thermal polymerization initiator is used. Thermal polymerization initiators include azobisisobutyronitrile, azobisisovaleronitrile, benzoyl peroxide, lauroyl peroxide, methyl ethyl ketone peroxide, bis- (4-t-butylcyclohexyl) peroxydicarbonate, diisopropylperoxy Although carbonate etc. can be mentioned, it is not limited to these. When ultraviolet rays are used, an ultraviolet polymerization initiator is used. Examples of the ultraviolet polymerization initiator include benzyldimethyl ketal, 2,2-diethoxyacetophenone, benzoylisobutyl ether, trimethylsilylbenzophenone, benzoin, 2-methylbenzoin, 4-methoxybenzophenone, benzoin methyl ether, benzoin butyl ether, anthraquinone, etc. However, it is not limited to these. The amount of these polymerization initiators used is 0.001 to 0.8% by weight, preferably 0.005 to 0.5% by weight, based on the total amount of the solution. When using electron beams, no initiator is required.

  As a method for forming a cured resin layer on all the inner side surfaces such as the front and back surfaces, end surfaces and cavities of the storage board, it is preferable to apply a resin solution (prepolymer and / or monomer solution). As a coating method, methods such as impregnation, coating, and spraying can be employed. If the cured resin layer is on the extreme surface, paper dust can be suppressed, and since it is applied to complicated shapes such as cavities and feed holes, the impregnation or spray method is preferred. After application, excess prepolymer or monomer may be wiped off with an air spray, a water absorbent cloth, filter paper or the like. In particular, a method of wiping off the cavity with air so that the preprimer does not block the cavity is preferable.

When a resin liquid is applied and a resin layer is formed by radical polymerization, when heat is used for the initiation reaction, the reaction temperature is 30 to 90 ° C., preferably 35 to 80 ° C., and 0.5 to 8 This can be done by holding for a time, preferably 2 to 6 hours. Moreover, when using ultraviolet irradiation for an initiation reaction, it can carry out by hold | maintaining for 5 to 60 minutes on the irradiation conditions of wavelength 365nm and light quantity 10-50 mW / cm < ² >. Examples of the ultraviolet irradiation device include known high-pressure mercury lamps and metal halide lamps, and are not particularly limited. Furthermore, when electron beam irradiation is used for the initiation reaction, the acceleration voltage is preferably 100 to 800 keV, the absorbed dose is preferably 1 to 300 kGy, and particularly preferably 5 to 200 kGy. The electron beam irradiation apparatus includes a van de graff scanning method, a double scanning method, a curtain beam method, and the like. Although there is no particular limitation, a curtain beam method that is relatively inexpensive and can provide a large output is widely used. There is no problem when the radical polymerization reaction is started by heat and electron beam irradiation. However, in the case of ultraviolet rays, the end surface, cavity, and feed hole of the chip-type electronic component storage board are difficult to hit, so the reaction by heat It is necessary to devise such as using together.

  In the case of electron beam irradiation, the oxygen concentration in the atmosphere is preferably 500 ppm or less. If the oxygen concentration exceeds 500 ppm, oxygen may act as a retarder for the polymerization reaction, and the resin composition may be insufficiently cured. Of course, there is no problem in using an inert gas for the purpose of suppressing ozone generation due to electron beam irradiation or for cooling a window that generates heat when the electron beam passes through.

The coating amount as the solid content of the resin solution to perform a radical polymerization reaction, it is preferably in the range of 0.1 to 10 g / m ^2. More preferably, it is the range of 0.5-3.0 g / m < ² >. In a general resin amount in other applications, a large amount of resin is required to form a resin layer. However, in the case of the resin layer of the present invention or a mixed layer of resin and pulp fiber, the chip-type electronic component storage board is used. Since it is sufficient if generation of paper dust can be suppressed, good results can be obtained at about 3.0 g / m ^{2 at} most. If more than 10 g / m ² ,
The chip-type electronic component storage board becomes hard and may be broken or wrinkled when finished in traverse winding or record winding. Furthermore, the suppression effect of the paper dust generated from the chip-type electronic component storage board is not practical because it reaches a peak and the resin cost is high.

  As prescriptions for resin liquids, many prepolymers generally have high viscosity, so the viscosity is adjusted with monofunctional and polyfunctional monomers, but without using prepolymers, radical polymerization reactions are centered on monofunctional monomers. There are formulations such as blending a polyfunctional monomer in order to increase the speed or formulations diluted with a solvent, and various formulations can be used without any limitation. In the case of electron beam irradiation, the prescription is adjusted in consideration of the viscosity of the resin liquid and the permeability to the paper layer, and the irradiation dose is determined according to the general relationship between the acceleration energy of the electron beam and the permeability.

  The resin liquid formulation used in the present invention is blended with inorganic pigments such as titanium dioxide, calcium carbonate, aluminum hydroxide, magnesium hydroxide, kaolin, talc, etc., as long as dust generation is not affected for the purpose of suppressing blocking. Can do.

  In the resin liquid formulation of the present invention, various plasticizers, anti-aging agents, stabilizers, antistatic agents, dispersants, lubricants, antifoaming agents, paints, thickeners, other aqueous resins, etc. Can be added without any limitation.

  Various pulps can be used for paper making of the chip-type electronic component storage board of the present invention. For example, chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, etc. may be used alone. Although a plurality of combinations may be used, it is preferable to use pulp having a uniform fiber form in order to achieve a uniform penetration depth of the resin liquid. Further, these pulps may be used in appropriate combination with various beating machines.

  The beating machine used in the present invention is not particularly limited, and various beating machines such as a beater, Jordan, a deluxe finer (DF), and a double disc refiner (DDR) are used. Further, the degree of beating is not particularly limited, but a treatment of about 250 to 550 ml with Canadian Standard Freeness is preferable from the viewpoint of papermaking suitability. Also, in terms of preventing burrs in the cavity shape and changing the cavity shape due to environmental changes, the difference in freeness between the layers is preferably 50 ml or less.

  In making the chip-type electronic component storage board of the present invention, various internal additives can be used as necessary. Examples include rosin-based sizing agents, styrene / maleic acid, styrene / acrylic, styrene / olefins, alkyl ketene dimers, alkenyl succinic anhydrides, internal sizing agents for natural and synthetic papermaking, various paper strength enhancers, filtered water Yield improvers, waterproofing agents such as polyamide polyamine epichlorohydrin, antifoaming agents, fillers such as talc, dyes, and the like can be used.

  Further, in the present invention, the chip-type electronic component storage board is coated with a water-based resin or a resin emulsion on the front and back surfaces of the storage board in order to improve the adhesion to the bottom tape and the cover tape and the anti-feathering effect. Is common. Water-based resins include polyvinyl alcohol, starch, polyacrylamide, acrylic resin, styrene-butadiene resin, styrene-isoprene resin, polyester resin, ethylene-vinyl acetate resin, vinyl acetate-vinyl alcohol resin, urethane resin. Select necessary chemicals and use them. Further, as the application means, there are, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a gate roll coater, a roll coater such as a size press and a calendar coater, a bill blade coater, and a bellbapa coater. In the present invention, a resin layer or a mixed layer of resin and pulp fibers is formed on every surface of the chip-type electronic component storage board by a radical polymerization reaction. Also good.

The basis weight of the chip-type electronic component storage board of the present invention is determined by the size of the chip-type electronic component stored therein, but is generally about 200 to 1000 g / m ² . Because of this basis weight range, multilayer paper making that is easy to form is preferable as the paper making method for the mount paper.

  The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. Numerical values indicating the composition, concentration, etc. are numerical values based on the mass of the solid component or active ingredient. Unless otherwise specified, the paper made was subjected to pretreatment according to JIS P8111 and then subjected to measurements and tests. The details of the method for producing the storage board paper, the formulation of the resin liquid, the method for measuring the peel strength, and the evaluation of the amount of paper dust generated are as follows.

Storage paper 1
Pulp is properly used for the surface layer, middle layer, and back layer. For the surface layer, 30% by mass of softwood kraft pulp A and 70% by mass of hardwood bleached kraft pulp B are mixed and beaten with a double disc refiner to prepare 460 ml of CSF (Canadian Standard Freeness). For middle layer, softwood kraft pulp A 10% by weight and hardwood bleached kraft pulp B 90% by weight are mixed and beaten with a double disc refiner to prepare 410ml CSF (Canadian Standard Freeness), and for the back layer hardwood bleached kraft pulp B was prepared by beating up to 470 ml of CSF (Canadian Standard Freeness) using a double disc refiner alone. To each pulp slurry, 2.0% by mass of a sulfuric acid band was added to the pulp, and 0.50% by mass of size pine N-771 (Arakawa Chemical Industries, Ltd., rosin emulsion sizing agent) was added as a sizing agent. Polystron 117 (manufactured by Arakawa Chemical Industries, Ltd., polyacrylamide paper strength agent) was added at 1.0 mass%. The pulp slurry under the above conditions was combined with a long mesh three-layer papermaking machine with a surface layer of 100 g / m ² , a middle layer of 200 g / m ² , and a back layer of 50 g / m ² , and a smoothing machine installed in the paper machine ( Machine chip) to produce a chip-type electronic component storage board having a basis weight of 350 g / m ² and a thickness of 0.42 mm.

Storage paper 2
In the same manner, except that the storage base paper 1 was coated with 1.0 g / m ² of polyvinyl alcohol having a saponification degree of 88 mol% and a polymerization degree of 1000 as a solid content with a size press installed in the paper machine. A chip-type electronic component storage board having an amount of 350 g / m ² and a thickness of 0.42 mm was manufactured.

Resin liquid composition 1
Prepolymer: 15 parts by mass of urethane acrylate oligomer (beam set 505A-6, manufactured by Arakawa Chemical Co., Ltd.).
Diluting solvent: isopropyl alcohol / ethyl acetate = 1/11, 85 parts by mass.

Resin liquid composition 2
Resin liquid composition 1 is 0.03% by mass of azobisisobutyronitrile (manufactured by Tokyo Chemical Industry Co., Ltd.) as a thermal polymerization initiator, and benzyldimethyl ketal (manufactured by Tokyo Chemical Industry Co., Ltd.) as an ultraviolet irradiation polymerization initiator. 0.03% by mass was added.

Resin liquid composition 3
Prepolymer: 10 parts by mass of urethane acrylate oligomer (beam set 550B, manufactured by Arakawa Chemical Industries, Ltd.).
Monomer: 40 parts by mass of acrylate monomer (ACMO, manufactured by Kojin Co., Ltd.)
Diluting solvent: isopropyl alcohol / ethyl acetate = 1/11, 50 parts by mass.

Resin liquid composition 4
Prepolymer: Epoxy acrylate oligomer (beam set AQ-9, manufactured by Arakawa Chemical Industries, Ltd.) 15 parts by mass.
Diluting solvent: isopropyl alcohol, 85 parts by mass.

Resin liquid composition 5
Monomer: 99 parts by mass of methyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.).
Monomer: 1 part by mass of triethylene glycol diacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.).

<Measurement method of peel strength>
The chip-type electronic component storage board is a heat seal tester TP701S manufactured by Tester Sangyo Co., Ltd. 318H-14A (manufactured by Nitto Denko) is used, the heat seal temperature is 155 ° C., the heat seal pressure applied to the sample is 1.5 Mpa, the heat seal time is 2 seconds, and the wire is 0.5 mm wide and 130 mm long. Two heat-sealed portions in the shape of rails, and after about 1 hour, the peel strength was measured by a method according to JIS C 0806-3 (peel rate 300 mm / min) for a measurement time of 12 seconds, The average value during that time was determined.

<Evaluation of paper dust generation>
The test was performed using “TWA6601” manufactured by Tokyo Wells. An empty operation was performed for 2000 m at a taping speed of 2400 tact / min without storing chip-type electronic components, and the amount of generated paper dust was evaluated at two locations, an unreel and a chip insertion portion, according to the following criteria.
Paper dust does not occur: ◎
A very small amount of paper dust is generated: ○
Paper dust is generated: ×

Examples 1-4
Using the storage board paper 1, the sample is slit into a tape shape with a width of 8 mm in an environment of a temperature of 23 ° C. and a relative humidity of 45%, and the diameter is 1.54 mm at intervals of 4 mm in accordance with JIS C 0806-3. At the same time, cavities having a CD direction of 0.66 mm and an MD direction of 0.36 mm were created at intervals of 2 mm, and the coating amount as a solid content of the resin liquid formulation 1 was 0.5 g / m ² (Example 1) ), 1.0 g / m ² (Example 2), 2.5 g / m ² (Example 3), 4.5 g / m ² (Example 4). Spray coating was performed so that it hits, and irradiation with an electron beam was cured to obtain a chip-type electronic component storage board.

Reference example Spray application of resin liquid formulation 2 so that the solid content coating amount is 1.0 g / m ² , apply heat and cure by irradiating with ultraviolet rays, and mount a chip-type electronic component storage board. Obtained. Other parts are the same as those in the second embodiment.

Example 5
A chip-type electronic component storage board was obtained in the same manner as in Example 2 except that the resin liquid formulation 3 was used.

Example 6
A chip-type electronic component storage board was obtained in the same manner as in Example 2 except that the resin liquid formulation 4 was used.

Example 7
A chip-type electronic component storage board was obtained in the same manner as in Example 2 except that the resin liquid formulation 5 was used.

Example 8
A chip-type electronic component storage board was obtained in the same manner as in Example 2 except that the storage board paper 2 was used.

Comparative Example 1
A chip-type electronic component storage board was obtained in the same manner as in Example 1 except that the resin was not applied using the storage board paper 1.

Comparative Example 2
A chip-type electronic component storage board was obtained in the same manner as Comparative Example 1 except that the storage board paper 2 was used.

Comparative Example 3
Except for using the mount paper 1 and spraying polyvinyl alcohol having a saponification degree of 88 mol% and a polymerization degree of 1000 to a solid content of 2.5 g / m ² instead of the resin liquid formulation 1. In the same manner as in Example 3, a chip-type electronic component storage board was obtained.

Comparative Example 4
Except for the use of the storage mount paper 2, instead of the resin liquid formulation 1, polyvinyl alcohol having a saponification degree of 88 mol% and a polymerization degree of 1000 was spray-applied so that the solid content was 2.5 g / m ^2. In the same manner as in Example 3, a chip-type electronic component storage board was obtained.

  Evaluation of the peel strength and the amount of paper dust of the obtained chip-type electronic component storage board was performed by the method described above. The evaluation results are shown in Table 1.

Claims (1)

A chip-type electronic component storage board for storing a chip-type electronic component, comprising a resin layer cured by radical polymerization reaction by electron beam irradiation on all surfaces including a cavity and a feed hole Storage mount.