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JP4374155B2 - Screw mounting structure of printed wiring board, grounding structure of printed wiring board, and thin plate member - Google Patents
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JP4374155B2 - Screw mounting structure of printed wiring board, grounding structure of printed wiring board, and thin plate member - Google Patents

Screw mounting structure of printed wiring board, grounding structure of printed wiring board, and thin plate member Download PDF

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Publication number
JP4374155B2
JP4374155B2 JP2001206146A JP2001206146A JP4374155B2 JP 4374155 B2 JP4374155 B2 JP 4374155B2 JP 2001206146 A JP2001206146 A JP 2001206146A JP 2001206146 A JP2001206146 A JP 2001206146A JP 4374155 B2 JP4374155 B2 JP 4374155B2
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screw
printed wiring
wiring board
thin plate
mounting hole
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JP2003023273A (en
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広晃 加藤
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Kitagawa Industries Co Ltd
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Kitagawa Industries Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、各種電子機器に使用可能なプリント配線板をネジ固定するためのプリント配線板のネジ取付構造及び、当該取付構造を用いたプリント配線板の接地構造に関する。
【0002】
【従来の技術】
従来、プリント配線板は、各コーナーに設けられた取付穴によって、ケースに固定されるのが一般的である。この場合、プリント配線板の取付穴の径はネジの外径、すなわち、ネジの山頂に接する仮想的な円筒の直径よりも大きくなっており、プリント配線板の取付穴にネジを通した後、ケースに対してネジを締め付けることにより、プリント配線板は、ネジの皿部とケースとで挟まれて固定されている。
【0003】
【発明が解決しようとする課題】
しかしながら、振動などでネジが緩んでしまうと、ネジの外径よりも取付穴の径が大きいため、プリント配線板がネジによって十分に固定されなくなってしまう。つまり、取付穴がラフな分だけ、ネジの緩みによって、プリント配線板ががたつくことになる。
【0004】
特に、このようなネジ自体で、あるいは、ネジに取り付けたリード線によってプリント配線板のパターン(アースパターン)の接地を図る場合があり、上述したようにプリント配線板が十分に固定されない状況下では、良好な接地状態が確保されなくなるおそれがある。
【0005】
本発明は、上述した問題を解決するためになされたものであり、プリント配線板をネジによって固定する場合に、プリント配線板を確実に固定することを目的とする。
【0006】
本発明のプリント配線板のネジ取付構造は、プリント配線板と、ネジと、薄板状部材とで構成される。
プリント配線板には、取付穴及び、当該取付穴に対応するパターンが形成されている。ネジは、プリント配線板に形成された取付穴を貫通し、プリント配線板をケースに固定するためのものである。薄板状部材は、プリント配線板上のパターンに半田付けされる際に、クリーム半田を使ったリフローソルダリングによる半田の表面張力によってプリント配線板の取付穴の端縁部の一部を覆うようにして位置決めされる。それによって、ネジによるプリント配線板のケースへの締め付け固定に際し、薄板状部材がネジの谷底に係合されて、ネジのプリント配線板に対する変位が規制される。端縁部の一部としたのは、薄板状部材が端縁部全部を覆うようなリング状でないことを意味する。
【0007】
特に、パターンは、薄板状部材が取付穴の端縁部の一部を覆うように配置されるプリント配線板上の領域における少なくとも両端部の外形にあわせて形成されている。これにより、半田の表面張力を利用した薄板状部材のプリント配線板上への位置決めに際して、薄板状部材の両端部がプリント配線板に確実に固定される。その結果、半田の表面張力による位置決めの際に、薄板状部材の両端部のふら付きが抑えられて、薄板状部材が取付穴の端縁部の一部を覆う位置に確実に配置されるのである。また、薄板状部材の半田付けには、クリーム半田を使ったリフローソルダリングが採用されていることから、小形の薄板状部材を半田付けする場合にも半田付け作業を容易に行うことが出来て、プリント配線板への位置決めが確実となる。なお、例えば請求項2に示すように、薄板状部材の両端部がパターンに半田付けされて、薄板状部材の半田付けされない中間部分がネジの谷底に係合されるようにしても良い。これにより、薄板状部材のプリント配線板への位置決め安定性が確保されつつ、薄板状部材の中間部分が半田で固定されないことで、中間部分の弾性変形が十分に許容されることから、かかる中間部分をネジの谷底に係合させることによって、中間部分の弾性変形による反力を利用して、ネジの緩みの防止効果を一層効果的に得ることも出来る。
【0008】
ここにある技術思想は、上述したように電子機器の小型化に伴う薄板状部材の小型化に着目したものであり、溶融した半田の表面張力によって位置決めされる、すなわちセルフアライメント効果を得られる大きさで薄板状部材を構成するというものである。例えば請求項に示すように、略四方形形状の薄板状部材を用いることが考えられる。具体的には、セルフアライメント効果が得られるように、縦、横がそれぞれ数ミリといった小型で薄い金属部材を用いる。なお、ここで「略」としたのは、厳密な四方形形状でなくてもよいからである。
【0009】
このような薄板状部材を用いれば、セルフアライメント効果による位置決めが可能となり、取付穴に対応して形成されたパターンに対する実装精度の向上が図られる。したがって、このパターンを取付穴に対して精度よく形成しておけば、取付穴に対して薄板状部材が精度よく実装される。
【0010】
これにより、取付穴を貫通するネジの谷底に薄板状部材の端部が係合するようにでき、ネジの変位が規制される。したがって、振動でネジが緩んだとしても、プリント配線板ががたつくことがなくなる。また、薄板状部材は、プリント配線板面に半田付けされるため、プリント配線板の実装面よりも僅かに上方に位置する。したがって、ネジの締め付けによって、その係合部分を中心にしてプリント配線板側へ弾性変形し、その反力によって、ネジを引き抜く方向の力が作用する。これによって、振動によってネジが緩むことも防止できる可能性が高い。
【0011】
なお、略四方形形状の薄板状部材を用いるのは一例であって、例えば請求項に示すように、薄板状部材の端部を円弧状に形成し、この円弧状の端部でネジの谷底に係合するようにしてもよい。ネジの谷の径に合わせて円弧状の端部を形成すれば、ネジの谷底との係合部分が大きくなり、ネジの固定効果が大きくなる。
【0012】
ネジの固定効果を大きくするという観点からは、請求項に示す構造を採用してもよい。すなわち、薄板状部材をネジの両側に配置することを特徴とするものである。この場合、薄板状部材が、ネジの谷底を両側から挟み込む。このようにすれば、さらに、ネジの固定効果が大きくなる。また、薄板状部材がその係合部分を中心にプリント配線板側へ弾性変形すれば、振動によるネジの緩みを防止できることは既に述べが、この場合、薄板状部材がネジの両側にあるため、弾性変形による反力は、ネジ止め方向に平行に作用し、ネジの緩みを防止する効果も際だつ。
【0013】
なお、薄板状部材の弾性変形に着目すれば、請求項に示すように、薄板状部材は、ネジとの係合部分を中心に、プリント配線板の実装面から離れる方向へ、折り曲げて形成するとよい。このようにすれば、薄板状部材は係合部分を中心にしてプリント配線板に近づく方向へ十分に弾性変形することになり、ネジを引き抜く方向に作用する反力が大きくなるため、振動などでネジが緩むことを確実に防止できる。
【0014】
なお、以上はネジの取付構造の発明として説明してきたが、このようなネジ取付構造を用いたプリント配線板の接地構造の発明として実現することもできる。すなわち、請求項に示すような、上述したネジ取付構造を用いて構成される接地構造であって、ケースを接地導体として実現し、薄板状部材を導電性部材として実現することにより、ネジを介してプリント配線板のパターンと接地導体とが電気的に接続されることを特徴とするプリント配線板の接地構造である。このような接地構造においては、上述したように、プリント配線板ががたつくことがなく、また、振動によってネジが緩む可能性も小さくなるため、良好な接地を実現することができる。
【0015】
また、上述したネジ取付構造に用いられて有効な薄板状部材の発明として実現することもできる。すなわち、請求項に示すような薄板状部材がそれである。このような薄板状部材の作用及び効果は、上述したネジ取付構造の薄板状部材の作用及び効果と同様であることは言うまでもない。
【0016】
もちろん、この薄板状部材においても、略四方形形状としたり、あるいは、ネジの谷底に係合する端部を円弧状にしたりすることもできる。また、ネジとの係合部分を中心に、プリント配線板の実装面から離れるように折り曲げて形成してもよい。さらに、ケースが接地導体で実現されることを前提とし、プリント配線板上のパターンと接地導体との間でネジを介した導通が図られるように、導電性能を有する部材で実現することも考えられる。
【0017】
【発明の実施の形態】
以下、本発明を具体化した実施例を図面を参照して説明する。
図1は、実施例の接地構造を構成するプリント配線板10と、薄板状部材30とを示す斜視図である。
【0018】
プリント配線板10には、取付穴11及び、この取付穴11に対応させてパターン12a,12b,12c,12dが形成されている。取付穴11は、プリント配線板10を貫く円形形状の穴である。
薄板状部材30は、長方形形状の薄板状の金属部材である。この金属部材としては、例えばベリリウム銅などを用いることが考えられる。ベリリウム銅を用いれば、導電性だけでなく十分な弾性が確保できる。なお、もちろんベリリウム銅以外の材料を用いてもよい。
【0019】
このような薄板状部材30は、プリント配線板10に形成されたパターン12a〜12dに半田付けされる。具体的には、一方の面の長手方向の両端部30aで半田付けされ、2つのパターン12a,12bをセットにして一つが、これらとは別の2つのパターン12c,12dをセットにしてもう一つが半田付けされる。つまり、プリント配線板10に形成された取付穴11に対し、計2つの薄板状部材30が半田付けされるのである。なお、図1中には、1つの薄板状部材30がプリント配線板10上に配置された様子を二点鎖線で示した。
【0020】
薄板状部材30は、プリント配線板10に対して自動実装機によって載置される。このとき、プリント配線板10のパターン12a〜12dには、予めクリーム半田を供給しておく。そして、リフローソルダリングによってクリーム半田を溶融させて薄板状部材30を半田付けする。このとき、薄板状部材30は、溶融した半田の表面張力によって位置決めされる。言い換えれば、このようなセルフアライメント効果が得られるような大きさに薄板状部材30を形成する。
【0021】
図2は、薄板状部材30がプリント配線板10に実装された様子を示す平面図であり、図3(a)は図2のA−A線断面図であり、図3(b)は、ネジ20によってプリント配線板10がケースに固定された状態における図2のB−B線断面を示す説明図である。このネジ20が、プリント配線板10及び薄板状部材30とともに本実施例の接地構造を構成する。
【0022】
図2に示すように、プリント配線板10に形成された取付穴11の両側に薄板状部材30が実装される。なお、図2中には、薄板状部材30に隠れたパターン12a〜12dを斜線を施して示した。そして、図3(a)に示すように、実装状態においては、薄板状部材30を固定する半田により、薄板状部材30は、プリント配線板10の実装面よりも僅か上方に位置する。
【0023】
このように薄板状部材30がプリント配線板10に実装された後、プリント配線板10の実装側より、取付穴11にネジ20が通され、接地導体としてのケースにネジ20を締め付け固定することによって、プリント配線板10が固定される。図3(b)に示す如くである。
【0024】
プリント配線板10上の2つの薄板状部材30は、取付穴11とパターン12a〜12dとの関係により、ネジ20の外径(図2中に二点鎖線で示した)よりも狭い、ネジ20の谷の径(図2中に一点鎖線で示した)の幅で配置される。したがって、図3(b)に示すように、ネジ20による締め付け固定に際し、薄板状部材30の短手方向中央部分の内側端部30bがネジ20の谷底20aに係合して、プリント配線板10に対するネジ20の移動を規制する。また、ネジ20を締め付け固定することによって、薄板状部材30は、内側端部30bを中心にネジ挿入方向に弾性変形し、その反力がネジ20を引き抜く方向に作用する。
【0025】
そして、このようなネジ20による締め付け固定によって、接地導体としてのケースとプリント配線板10のパターン12a〜12dがネジ20を介して電気的に接続されることになる。
このような本実施例によれば、薄板状部材30は、リフローソルダリングに際し、溶融した半田の表面張力によって、プリント配線板10上で位置決めがなされる。これによって、取付穴11とパターン12a〜12dとの関係を適切にしておけば、薄板状部材30は精度よくプリント配線板10上に実装でき、ネジ20による固定に際し、薄板状部材30の内側端部30bをネジ20の谷底20aに係合させることが可能となる。その結果、振動などによってネジ20が緩んだとしても、プリント配線板10に対するネジ20の移動が規制され、プリント配線板10ががたつくことがなく、良好な接地状態を確保することができる。
【0026】
また、ネジ20の締め付け固定により、薄板状部材30は、ネジ20の谷底20aと係合する内側端部30bを中心にして弾性変形し、その反力がネジ20を引き抜く方向に作用する。したがって、振動などによってネジ20が緩んでしまうことを防止できる可能性が高い。これによってもまた、良好な接地状態が確保されることになる。加えて、薄板状部材30を、プリント配線板10上のネジ20の両側に1つずつ配置するようにした。これによって、薄板状部材30の弾性変形による反力はネジ止め方向にほぼ平行に作用するため、ネジの緩みを防止できる可能性がさらに高くなる。
【0027】
以上、本発明はこのような実施例に何等限定されるものではなく、本発明の主旨を逸脱しない範囲において種々なる形態で実施し得る。
(イ)上記実施例では、プリント配線板10の取付穴11の両側に薄板状部材30を1つずつ配置する構成であったが、図4に示すように、プリント配線板10の取付穴11に対応させて2つのパターン12e,12fを形成し、取付穴11の片側に薄板状部材30を配置する構成にすることも考えられる。この場合は、ネジ20の外径(図4中に二点鎖線で示した)が取付穴11の端に接する状態において、ネジ20の谷の径(図4中に一点鎖線で示した)に内側端部30bが反対側から接するように薄板状部材30を配置すればよい。
【0028】
(ロ)また、上記実施例では、薄板状部材30の一方の面の長手方向の両端部30aが半田付けされるものとしたが、一方の面の全体で半田付けされるようにしてもよい。
(ハ)さらにまた、上記実施例の薄板状部材30に代え、種々の形状の薄板状部材を採用することができる。
【0029】
例えば、図1中に記号αで示す方向から見た場合、図5(a)や図5(b)に示すような、内側端部31b,32bを円弧状にした薄板状部材31,32を採用してもよい。ネジ20の谷の径に合わせて内側端部31b,32bを円弧状に形成すれば、ネジ20の谷底20aとの係合部分が大きくなり、ネジ20の固定効果が大きくなる。
【0030】
また例えば、図1中に記号βで示す方向から見た場合、図5(c)に示すような、中央部分33aから長手方向の両端部33bを略垂直に折り曲げ、さらに、その先端側を反対側へ略垂直に折り曲げた薄板状部材33を採用してもよい。また、図5(d)に示すような、両端部34bから緩やかに上方へ傾斜させて中央部分34aが形成された薄板状部材34を採用してもよい。さらに、一方の端部35bから上方へ略垂直に折り曲げ、その折り曲げた部分を反対側へ折り曲げて中央部分35aを形成し、この中央部分35aから他方の端部35cになめらかに接続された薄板状部材35を採用してもよい。このように、ネジ20の谷底20aと係合する中央部分33a,34a,35aを中心に、プリント配線板10の実装面から離れて実装されるように折り曲げた薄板状部材33〜35を用いれば、プリント配線板10に近づく方向へ十分に弾性変形するため、ネジ20を引き抜く方向に作用する反力が大きくなり、振動などによるネジ20の緩みを確実に防止できる。
【図面の簡単な説明】
【図1】実施例の薄板状部材とプリント配線板とを示す斜視図である。
【図2】薄板状部材の実装状態を示す平面図である。
【図3】(a)は図2のA−A線断面図であり、(b)はネジ挿入状態における図2のB−B線断面を示す説明図である。
【図4】別実施例における薄板状部材の実装状態を示す平面図である。
【図5】薄板状部材のバリエーションを示す説明図である。
【符号の説明】
10…プリント配線板
11…取付穴
12a,12b,12c,12d…パターン
20…ネジ
20a…ネジの谷底
30…薄板状部材
30a…両端部
30b…内側端部
31,32,33,34,35…薄板状部材
31b,32b…内側端部
33a,34a,35a…中央部分
33b,34b,35b,35c…端部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a screw mounting structure of a printed wiring board for fixing a printed wiring board that can be used in various electronic devices, and a grounding structure of a printed wiring board using the mounting structure.
[0002]
[Prior art]
Conventionally, a printed wiring board is generally fixed to a case by mounting holes provided at each corner. In this case, the diameter of the mounting hole of the printed wiring board is larger than the outer diameter of the screw, that is, the diameter of a virtual cylinder in contact with the top of the screw, and after passing the screw through the mounting hole of the printed wiring board, By tightening the screw with respect to the case, the printed wiring board is sandwiched and fixed between the screw plate and the case.
[0003]
[Problems to be solved by the invention]
However, if the screw is loosened due to vibration or the like, the diameter of the mounting hole is larger than the outer diameter of the screw, so that the printed wiring board is not sufficiently fixed by the screw. In other words, the printed wiring board is rattled by the looseness of the screws by the amount of the mounting holes that are rough.
[0004]
In particular, the printed wiring board pattern (ground pattern) may be grounded by such a screw itself or by a lead wire attached to the screw. Under the circumstances where the printed wiring board is not sufficiently fixed as described above. There is a risk that a good grounding state may not be ensured.
[0005]
The present invention has been made to solve the above-described problems, and an object thereof is to securely fix a printed wiring board when the printed wiring board is fixed with screws.
[0006]
The screw mounting structure for a printed wiring board according to the present invention includes a printed wiring board, screws, and a thin plate member.
A mounting hole and a pattern corresponding to the mounting hole are formed on the printed wiring board. The screw is for passing through a mounting hole formed in the printed wiring board and fixing the printed wiring board to the case. When the thin plate-like member is soldered to the pattern on the printed wiring board, it covers the edge part of the mounting hole of the printed wiring board by the surface tension of the solder by reflow soldering using cream solder. Is positioned. Thereby, when the printed wiring board is fastened and fixed to the case by the screw, the thin plate-like member is engaged with the bottom of the screw, and the displacement of the screw with respect to the printed wiring board is restricted. Making it a part of the end edge means that the thin plate-like member is not in a ring shape covering the entire end edge.
[0007]
In particular, the pattern is formed in accordance with the outer shape of at least both ends in the region on the printed wiring board in which the thin plate-like member is arranged so as to cover a part of the edge of the mounting hole. Thus, when positioning the thin plate member on the printed wiring board using the surface tension of the solder, both end portions of the thin plate member are securely fixed to the printed wiring board. As a result, when positioning due to the surface tension of the solder, wobbling of both ends of the thin plate-like member is suppressed, and the thin plate-like member is reliably arranged at a position covering a part of the edge of the mounting hole. is there. Also, since reflow soldering using cream solder is used for soldering thin plate members, soldering work can be easily performed even when soldering small thin plate members. The positioning to the printed wiring board is ensured. For example, as shown in claim 2, both end portions of the thin plate member may be soldered to the pattern, and an unsoldered intermediate portion of the thin plate member may be engaged with the valley of the screw. As a result, the stability of positioning of the thin plate member to the printed wiring board is ensured, and the intermediate portion of the thin plate member is not fixed with solder, so that elastic deformation of the intermediate portion is sufficiently allowed. By engaging the part with the bottom of the screw, the effect of preventing the loosening of the screw can be obtained more effectively by utilizing the reaction force caused by the elastic deformation of the intermediate part.
[0008]
The technical idea here focuses on the miniaturization of the thin plate member accompanying the miniaturization of the electronic device as described above, and is positioned by the surface tension of the melted solder, that is, the self-alignment effect can be obtained. Thus, a thin plate member is formed. For example, as shown in claim 3 , it is conceivable to use a thin plate member having a substantially square shape. Specifically, small and thin metal members each having a length and width of several millimeters are used so that the self-alignment effect can be obtained. Note that the term “substantially” is used here because it does not have to be a strict square shape.
[0009]
If such a thin plate member is used, positioning by the self-alignment effect is possible, and the mounting accuracy for the pattern formed corresponding to the mounting hole can be improved. Therefore, if this pattern is formed accurately with respect to the mounting hole, the thin plate-like member is mounted with high precision in the mounting hole.
[0010]
Thereby, the edge part of a thin plate-shaped member can be engaged with the valley bottom of the screw which penetrates an attachment hole, and the displacement of a screw is controlled. Therefore, even if the screw is loosened by vibration, the printed wiring board is not rattled. Further, since the thin plate-like member is soldered to the printed wiring board surface, it is positioned slightly above the mounting surface of the printed wiring board. Therefore, when the screw is tightened, it is elastically deformed toward the printed wiring board centering on the engaging portion, and the reaction force exerts a force in the direction of pulling out the screw. Accordingly, there is a high possibility that the screw can be prevented from loosening due to vibration.
[0011]
Note that the use of the substantially square-shaped thin plate member is an example. For example, as shown in claim 4 , the end portion of the thin plate member is formed in an arc shape, and the end portion of the screw is formed at the arc-shaped end portion. You may make it engage with a valley bottom. If the arc-shaped end portion is formed in accordance with the diameter of the valley of the screw, the engagement portion with the valley of the screw is increased, and the fixing effect of the screw is increased.
[0012]
From the viewpoint of increasing the screw fixing effect, the structure shown in claim 5 may be employed. That is, the thin plate-like member is arranged on both sides of the screw. In this case, the thin plate member sandwiches the valley of the screw from both sides. This further increases the screw fixing effect. In addition, if the thin plate-like member is elastically deformed toward the printed wiring board around its engaging portion, it can be said that the loosening of the screw due to vibration can be prevented, but in this case, since the thin plate-like member is on both sides of the screw, The reaction force due to elastic deformation acts in parallel with the screwing direction, and the effect of preventing loosening of the screw is outstanding.
[0013]
If attention is paid to the elastic deformation of the thin plate-like member, as shown in claim 6 , the thin plate-like member is formed by bending in the direction away from the mounting surface of the printed wiring board around the engagement portion with the screw. Good. In this way, the thin plate member is sufficiently elastically deformed in the direction approaching the printed wiring board with the engaging portion as the center, and the reaction force acting in the direction of pulling out the screw becomes large. It is possible to reliably prevent the screws from loosening.
[0014]
Although the above has been described as an invention of a screw mounting structure, it can also be realized as an invention of a grounding structure of a printed wiring board using such a screw mounting structure. That is, a grounding structure configured using the above-described screw mounting structure as shown in claim 7 , wherein the case is realized as a grounding conductor, and the thin plate member is realized as a conductive member. The printed wiring board grounding structure is characterized in that the pattern of the printed wiring board and the grounding conductor are electrically connected via each other. In such a grounding structure, as described above, the printed wiring board does not rattle and the possibility of loosening of the screw due to vibration is reduced, so that good grounding can be realized.
[0015]
It can also be realized as an invention of an effective thin plate member used in the above-described screw mounting structure. That is, it is a thin plate member as shown in claim 8 . It goes without saying that the operation and effect of such a thin plate member are the same as the operation and effect of the thin plate member of the screw mounting structure described above.
[0016]
Of course, also in this thin plate-shaped member, it can also be set as a substantially square shape, or the edge part engaged with the valley bottom of a screw can also be made into circular arc shape. Further, it may be formed by being bent away from the mounting surface of the printed wiring board around the engaging portion with the screw. Furthermore, on the premise that the case is realized with a ground conductor, it is also possible to realize it with a member having conductive performance so that conduction through a screw is achieved between the pattern on the printed wiring board and the ground conductor. It is done.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing a printed wiring board 10 and a thin plate member 30 constituting the grounding structure of the embodiment.
[0018]
The printed wiring board 10 is provided with mounting holes 11 and patterns 12a, 12b, 12c, and 12d corresponding to the mounting holes 11. The mounting hole 11 is a circular hole that penetrates the printed wiring board 10.
The thin plate member 30 is a rectangular thin plate metal member. For example, beryllium copper may be used as the metal member. If beryllium copper is used, not only conductivity but sufficient elasticity can be secured. Of course, materials other than beryllium copper may be used.
[0019]
Such a thin plate member 30 is soldered to the patterns 12 a to 12 d formed on the printed wiring board 10. Specifically, it is soldered at both ends 30a in the longitudinal direction of one surface, and one set includes two patterns 12a and 12b, and another set includes two patterns 12c and 12d different from these. One is soldered. That is, a total of two thin plate members 30 are soldered to the mounting holes 11 formed in the printed wiring board 10. In FIG. 1, a state where one thin plate member 30 is arranged on the printed wiring board 10 is indicated by a two-dot chain line.
[0020]
The thin plate member 30 is placed on the printed wiring board 10 by an automatic mounting machine. At this time, cream solder is supplied in advance to the patterns 12 a to 12 d of the printed wiring board 10. Then, the cream solder is melted by reflow soldering to solder the thin plate member 30. At this time, the thin plate member 30 is positioned by the surface tension of the molten solder. In other words, the thin plate member 30 is formed in such a size that such a self-alignment effect can be obtained.
[0021]
2 is a plan view showing a state in which the thin plate-like member 30 is mounted on the printed wiring board 10, FIG. 3A is a cross-sectional view taken along line AA in FIG. 2, and FIG. FIG. 3 is an explanatory diagram showing a cross section taken along line B-B in FIG. 2 in a state where the printed wiring board 10 is fixed to the case with screws 20. The screw 20 and the printed wiring board 10 and the thin plate member 30 constitute the grounding structure of the present embodiment.
[0022]
As shown in FIG. 2, thin plate-like members 30 are mounted on both sides of the mounting hole 11 formed in the printed wiring board 10. In FIG. 2, the patterns 12 a to 12 d hidden in the thin plate member 30 are shown by hatching. Then, as shown in FIG. 3A, in the mounted state, the thin plate member 30 is positioned slightly above the mounting surface of the printed wiring board 10 by the solder that fixes the thin plate member 30.
[0023]
After the thin plate-like member 30 is mounted on the printed wiring board 10 in this way, the screw 20 is passed through the mounting hole 11 from the mounting side of the printed wiring board 10, and the screw 20 is fastened and fixed to the case as the ground conductor. Thus, the printed wiring board 10 is fixed. As shown in FIG.
[0024]
The two thin plate-like members 30 on the printed wiring board 10 have a screw 20 that is narrower than the outer diameter of the screw 20 (indicated by a two-dot chain line in FIG. 2) due to the relationship between the mounting hole 11 and the patterns 12a to 12d. Are arranged at a width of the diameter of the valley (shown by a one-dot chain line in FIG. 2). Therefore, as shown in FIG. 3B, when tightening and fixing with the screw 20, the inner end 30 b of the central portion in the short direction of the thin plate-like member 30 engages with the valley bottom 20 a of the screw 20, and the printed wiring board 10. The movement of the screw 20 with respect to is controlled. Further, by tightening and fixing the screw 20, the thin plate member 30 is elastically deformed in the screw insertion direction around the inner end portion 30 b, and the reaction force acts in a direction in which the screw 20 is pulled out.
[0025]
The case as the ground conductor and the patterns 12 a to 12 d of the printed wiring board 10 are electrically connected via the screw 20 by the tightening and fixing with the screw 20.
According to this embodiment, the thin plate member 30 is positioned on the printed wiring board 10 by the surface tension of the melted solder during reflow soldering. Thus, if the relationship between the mounting hole 11 and the patterns 12a to 12d is appropriately set, the thin plate-like member 30 can be mounted on the printed wiring board 10 with high accuracy, and the inner end of the thin plate-like member 30 is fixed when the screw 20 is fixed. It becomes possible to engage the part 30 b with the valley bottom 20 a of the screw 20. As a result, even if the screw 20 is loosened due to vibration or the like, the movement of the screw 20 with respect to the printed wiring board 10 is restricted, and the printed wiring board 10 is not rattled and a good grounding state can be ensured.
[0026]
Further, by tightening and fixing the screw 20, the thin plate-like member 30 is elastically deformed around the inner end 30 b that engages with the valley bottom 20 a of the screw 20, and the reaction force acts in a direction in which the screw 20 is pulled out. Therefore, there is a high possibility that the screw 20 can be prevented from loosening due to vibration or the like. This also ensures a good grounding condition. In addition, one thin plate member 30 is arranged on each side of the screw 20 on the printed wiring board 10. As a result, the reaction force due to the elastic deformation of the thin plate member 30 acts substantially parallel to the screwing direction, so that the possibility of preventing loosening of the screw is further increased.
[0027]
As described above, the present invention is not limited to such embodiments, and can be implemented in various forms without departing from the spirit of the present invention.
(A) In the above embodiment, the thin plate-like members 30 are arranged one by one on both sides of the mounting hole 11 of the printed wiring board 10, but the mounting hole 11 of the printed wiring board 10 is shown in FIG. It is also conceivable that the two patterns 12e and 12f are formed corresponding to the above and the thin plate member 30 is arranged on one side of the mounting hole 11. In this case, when the outer diameter of the screw 20 (indicated by a two-dot chain line in FIG. 4) is in contact with the end of the mounting hole 11, the diameter of the valley of the screw 20 (indicated by the one-dot chain line in FIG. 4). What is necessary is just to arrange | position the thin plate-shaped member 30 so that the inner side edge part 30b may contact from the other side.
[0028]
(B) In the above embodiment, both end portions 30a in the longitudinal direction of one surface of the thin plate member 30 are soldered. However, the entire one surface may be soldered. .
(C) Furthermore, instead of the thin plate member 30 of the above embodiment, various shapes of thin plate members can be employed.
[0029]
For example, when viewed from the direction indicated by the symbol α in FIG. 1, the thin plate-like members 31 and 32 having the inner end portions 31b and 32b in an arc shape as shown in FIGS. 5 (a) and 5 (b). It may be adopted. If the inner end portions 31b and 32b are formed in an arc shape according to the diameter of the valley of the screw 20, the engagement portion of the screw 20 with the valley bottom 20a is increased, and the fixing effect of the screw 20 is increased.
[0030]
Further, for example, when viewed from the direction indicated by symbol β in FIG. 1, both longitudinal end portions 33b are bent substantially vertically from the central portion 33a as shown in FIG. You may employ | adopt the thin plate-shaped member 33 bent to the side substantially perpendicular | vertical. Further, as shown in FIG. 5D, a thin plate-like member 34 in which a central portion 34a is formed by being gently inclined upward from both end portions 34b may be employed. Further, it is bent substantially vertically upward from one end portion 35b, and the bent portion is bent to the opposite side to form a central portion 35a. The thin plate-like shape is smoothly connected from the central portion 35a to the other end portion 35c. The member 35 may be adopted. Thus, if the thin plate-like members 33 to 35 bent so as to be mounted away from the mounting surface of the printed wiring board 10 around the center portions 33a, 34a and 35a engaged with the valley bottom 20a of the screw 20 are used. Since it is sufficiently elastically deformed in the direction approaching the printed wiring board 10, the reaction force acting in the direction of pulling out the screw 20 is increased, and loosening of the screw 20 due to vibration or the like can be reliably prevented.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a thin plate member and a printed wiring board according to an embodiment.
FIG. 2 is a plan view showing a mounted state of a thin plate member.
3A is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 3B is an explanatory view showing a cross section taken along the line BB in FIG. 2 in a screw insertion state.
FIG. 4 is a plan view showing a mounted state of a thin plate member in another embodiment.
FIG. 5 is an explanatory view showing variations of a thin plate member.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Printed wiring board 11 ... Mounting hole 12a, 12b, 12c, 12d ... Pattern 20 ... Screw 20a ... Screw valley bottom 30 ... Thin plate-like member 30a ... Both ends 30b ... Inner edge 31, 32, 33, 34, 35 ... Thin plate-like members 31b, 32b ... inner end portions 33a, 34a, 35a ... central portions 33b, 34b, 35b, 35c ... end portions

Claims (8)

取付穴及び、当該取付穴に対応するパターンが形成されたプリント配線板と、
前記取付穴を貫通し、前記プリント配線板をケースに固定するためのネジと、
前記取付穴の端縁部の一部を覆い、前記ネジによる締め付け固定に際し、該取付穴を貫通する該ネジの谷底に係合して前記プリント配線板に対する該ネジの変位を規制する薄板状部材とで構成されるネジ取付構造であって、
前記薄板状部材が前記取付穴の端縁部の一部を覆うように配置される前記プリント配線板上の領域における少なくとも両端部の外形にあわせて、前記パターンが形成され、
前記薄板状部材は、前記パターンに供給されたクリーム半田をリフローソルダリングによって溶融することにより生じる半田の表面張力によって前記プリント配線板上のパターンに位置決めされて半田付けされていることを特徴とするプリント配線板のネジ取付構造。
A printed wiring board on which a mounting hole and a pattern corresponding to the mounting hole are formed;
A screw for passing through the mounting hole and fixing the printed wiring board to the case;
A thin plate-like member that covers a part of the edge of the mounting hole and engages with a valley bottom of the screw that passes through the mounting hole to restrict displacement of the screw with respect to the printed wiring board when tightening and fixing with the screw. A screw mounting structure composed of
According to the outer shape of at least both ends in the region on the printed wiring board where the thin plate-like member is arranged so as to cover a part of the edge of the mounting hole, the pattern is formed,
The thin plate member includes wherein the solder surface tension caused by melting the cream solder supplied to the pattern by reflow soldering, are soldered being positioned in a pattern on the printed circuit board Screw mounting structure for printed wiring boards.
請求項1に記載のネジ取付構造において、前記パターンは、前記薄板状部材が前記取付穴の端縁部の一部を覆うように配置される前記プリント配線板上の領域における両端部の外形にあわせて形成されて、該薄板状部材の両端部が該パターンに半田付けされ、2. The screw mounting structure according to claim 1, wherein the pattern has an outer shape of both end portions in an area on the printed wiring board in which the thin plate-like member is disposed so as to cover a part of an end edge portion of the mounting hole. Formed together, both end portions of the thin plate member are soldered to the pattern,
該薄板状部材の半田付けされない中間部分が前記ネジの谷底に係合されることを特徴とするプリント配線板のネジ取付構造。A screw mounting structure for a printed wiring board, wherein an intermediate portion of the thin plate member that is not soldered is engaged with a bottom of the screw.
請求項1又は2に記載のネジ取付構造において、前記薄板状部材は、略四方形形状であることを特徴とするプリント配線板のネジ取付構造。 3. The screw mounting structure according to claim 1 , wherein the thin plate member has a substantially square shape. 請求項1又は2に記載のネジ取付構造において、前記薄板状部材は、端部が円弧状であり、当該端部で前記ネジの谷底に係合することを特徴とするプリント配線板のネジ取付構造。The screw mounting structure according to claim 1 or 2 , wherein the thin plate-like member has an arcuate end, and engages with a valley bottom of the screw at the end. Construction. 請求項1〜のいずれかに記載のネジ取付構造において、前記薄板状部材は、前記ネジの両側に配置され、前記ネジの谷底を挟み込むことを特徴とするプリント配線板のネジ取付構造。In screw mounting structure according to any one of claims 1 to 4, wherein the thin plate member is disposed on both sides of the screw, screw mounting structure of a printed wiring board, characterized in that sandwich the root of the screw. 請求項1〜のいずれかに記載のネジ取付構造において、前記薄板状部材は、前記ネジとの係合部分を中心に、前記プリント配線板の実装面から離れる方向へ、折り曲げられていることを特徴とするプリント配線板のネジ取付構造。The screw mounting structure according to any one of claims 1 to 5 , wherein the thin plate-like member is bent in a direction away from a mounting surface of the printed wiring board around an engagement portion with the screw. The printed wiring board screw mounting structure characterized by 請求項1〜のいずれかに記載のネジ取付構造を用いて構成される接地構造であって、
前記ケースを接地導体として実現し、前記薄板状部材を導電性部材として実現することにより、前記ネジを介して前記プリント配線板のパターンと前記接地導体とが電気的に接続されることを特徴とするプリント配線板の接地構造。
A grounding structure configured using the screw mounting structure according to any one of claims 1 to 6 ,
The case is realized as a ground conductor, and the thin plate member is realized as a conductive member, whereby the pattern of the printed wiring board and the ground conductor are electrically connected via the screw. The printed wiring board grounding structure.
取付穴及び、当該取付穴に対応するパターンが形成されたプリント配線板と、
前記取付穴を貫通し、前記プリント配線板をケースに固定するためのネジとともにプリント配線板のネジ取付構造を構成し、
前記取付穴の端縁部の一部を覆い、前記ネジによる締め付け固定に際し、該取付穴を貫通する該ネジの谷底に係合して前記プリント配線板に対する該ネジの変位を規制する薄板状部材であって、
前記取付穴の端縁部の一部を覆うように配置される前記プリント配線板上の領域における少なくとも両端部の外形にあわせて、前記パターンが形成されて、
前記パターンに供給されたクリーム半田をリフローソルダリングによって溶融することにより生じる半田の表面張力によって前記プリント配線板上のパターンに位置決めされて半田付けされていることを特徴とする薄板状部材。
A printed wiring board on which a mounting hole and a pattern corresponding to the mounting hole are formed;
The screw mounting structure of the printed wiring board is configured together with a screw for passing through the mounting hole and fixing the printed wiring board to the case,
A thin plate-like member that covers a part of the edge of the mounting hole and engages with a valley bottom of the screw that passes through the mounting hole to restrict displacement of the screw with respect to the printed wiring board when tightening and fixing with the screw. Because
According to the outer shape of at least both ends in the region on the printed wiring board arranged to cover a part of the edge of the mounting hole, the pattern is formed,
A thin plate-like member characterized by being positioned and soldered to a pattern on the printed wiring board by a surface tension of solder generated by melting cream solder supplied to the pattern by reflow soldering .
JP2001206146A 2001-07-06 2001-07-06 Screw mounting structure of printed wiring board, grounding structure of printed wiring board, and thin plate member Expired - Lifetime JP4374155B2 (en)

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