JP4398739B2 - Wiring film connecting member manufacturing method and wiring film connecting member manufacturing apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a wiring film connecting member and a multilayer wiring board manufacturing apparatus used for the manufacturing method.

As one of the methods for connecting the wiring films of the multilayer wiring board, there is a method of using bumps made of metal, for example, copper. For this, the applicant of the present application has developed various techniques, for example, Japanese Patent Application No. 2001-322944. Various proposals have been made based on patent applications such as JP-A-2003-129259. Many of the methods use a three-layer metal plate as a starting member.
Briefly, for example, a copper foil having a thickness of, for example, 18 μm is provided on one main surface of a bump forming metal layer made of copper foil having a thickness of, for example, 100 μm via an etching stop layer made of nickel having a thickness of, for example, 1 μm. The above-mentioned three-layer metal plate is used as a starting member, which is a laminate of metal layers for forming a wiring film made of the above.

Then, the bump forming metal layer of the three-layer metal plate is selectively etched to form a bump for connecting the wiring film, and after this etching is completed, the bump and the metal film forming metal layer are formed. Etching is performed on the etching stop layer using copper as a mask, an insulating film made of, for example, a thermosetting resin is adhered to the bump formation surface, and further polished to expose the top of the bump. A thin metal plate for wiring film formation made of copper, for example, is laminated on the surface of the bump of the layer metal plate on which the bumps protrude, and the metal foil plate and the metal layer for wiring film formation are selectively etched simultaneously or differently. By doing so, a wiring film is formed on both surfaces.
A multilayer wiring board having three or more layers can also be provided by applying a technique using this bump as a connection means between wiring films having different layers.

By the way, in the technique mentioned above, there existed a problem that the three-layer metal plate prepared as a starting member was expensive. This is because a three-layer metal plate made of copper, nickel, and copper is not commercially available, is made by a special order, and uses a large amount of metal, which considerably increases the material cost. In addition, it takes a non-negligible cost to form each layer uniformly according to dimensions, which also contributes to the high price of the three-layer metal plate.
Therefore, an attempt was made to lower the price of a member prepared as a starting member, and the attempted technology was proposed in Japanese Patent Application No. 2002-233778, which was disclosed in Japanese Patent Application Laid-Open No. 2003-309370.

4A to 4H are cross-sectional views showing a typical manufacturing method of the proposed technique in the order of steps.
(A) First, a first resin film 13 as a carrier layer is laminated (adhered) to a copper foil 12 as a bump forming metal layer via an adhesive (not shown) [FIG. 4A].
The thickness of the copper foil 12 is, for example, 100 μm. Instead of the first resin film 13, for example, a metal foil made of aluminum or the like may be laminated on the copper foil 12 as a carrier layer.

(B) Next, an etching resist pattern 16 for forming a bump is formed on the surface of the two surfaces of the copper foil 12 which is not the surface on which the first resin film 13 is laminated [FIG. ]].
(C) Next, the copper foil 12 is etched using the etching resist pattern 16 as a mask. As a result, the first member 17 is formed in which the substantially conical-shaped bumps 14 project from the first resin film 13 [FIG. 4C]. The size of the bump 14 is arbitrary. For example, when the height is 100 μm, the diameter is 100 μm at the top and 150 μm at the bottom.

(D) Next, the second resin film 18 that is an insulating film corresponding to the insulating layer of the wiring board is brought into contact with the bump 14 of the first member 17 from the side where the bumps 14 project (FIG. 4D). The thickness of the second resin film 18 is also arbitrary, but is, for example, 50 μm. In addition, a thermoplastic resin such as a liquid crystal polymer, a polyether ether ketone resin, a polyether sulfone resin, a polyphenylene sulfide resin, a fluorine resin, or a thermosetting resin B-stage epoxy prepreg is also suitable as a material.
(E) Next, the second member 19 is formed by laminating the first member 17 on the second resin film 18 so that the tops of the bumps 14 are exposed [FIG. 4 (E)].

  In addition, the lamination | stacking to the 1st member 17 of the 2nd resin film 18 is specifically performed in the procedure as shown, for example in FIG. 5 (A)-(C). That is, first, the second resin film 18 is brought into contact with the bumps 14 of the first member 17 from the side where the bumps 14 are projected (FIG. 5A). Next, the second resin film 18 is rubbed with a grindstone 21 [FIG. 5B]. As a result, the top of the bump 14 bites into the second resin film 18 and eventually breaks through the second resin film 18 so that the top of the bump 14 is exposed from the second resin film 18 [FIG. (C)]. A roller or the like may be used instead of the grindstone 21.

(F) Next, the first resin film 13 is peeled off from the second member 19 (FIG. 4F). Thus, the inter-wiring film connecting member 22 is formed in which the substantially conical bump 14 is embedded in the second resin film 18 as an insulating film.
Note that the wiring film connecting member 22 as shown in FIG. 4F, that is, the wiring film connecting member 22 in which the bottom part (base) of the substantially cone-shaped bump 14 protrudes from the second resin film. Instead, the inter-wiring film connecting member 22 as shown in FIG. 4 ((F ′)), that is, the inter-wiring film connecting member 22 in which the top of the bump 14 protrudes from the second resin film 18 is obtained. You can also.

  6 (A) to 6 (C) show a method of obtaining the wiring film connecting member 22 as shown in FIG. 4 (F '). Specifically, the state shown in FIG. 6A [same as the state shown in FIG. 4C] is applied, and then the second resin film 18 is made of an elastic sheet such as polyethylene, polypropylene, or rubber. The sheet 70 is arranged and the entire surface is pressed to the state shown in FIG. 6B, and then the sheet 70 and the first resin film 13 are removed to obtain the state shown in FIG. Then, the inter-wiring film connecting member 22 shown in FIG. 4 (F ′) can be obtained.

Next, the description will be continued from the step (G) next to the step shown in FIG.
(G) Two wiring film forming copper foils 23 are brought into contact with both sides of the wiring film connecting member 22 [FIG. 4G].
(H) Next, the wiring film forming copper foil 23 and the wiring film connecting member 22 are pressed at a high temperature of 300 ° C. or more in the case of a liquid crystal polymer, for example [FIG. 1 (H)]. As a result, the bumps 14 made of the same copper as the wiring film forming copper foils 23 are firmly joined to each other because they are of the same kind of metal (Cu-Cu joining), and a good conduction state is realized.
JP 2003-129259 A (Japanese Patent Application 2001-322944) JP 2003-309370 A (Japanese Patent Application No. 2002-233778)

Incidentally, in the technique shown in FIG. 4, when the adhesive force between the resin film 13 and the copper foil 12 is increased, the first resin film 13 is peeled from the second member 19 shown in FIG. In the process, as shown in FIG. 7, some or all of the bumps 14 are attached to the first resin film 13, so that the peeling proceeds and the defect that the bumps 14 come off from the second resin film 18 occurs. This has been a factor in reducing yield.
Therefore, the inventor of the present application first tried to weaken the adhesive force between the resin film 13 and the copper foil 12. However, in such a case, a defect that the bumps 14 are peeled off from the resin film 13 when the bumps 14 are formed or before or after the second resin film 18 is laminated after the formation occurs, and the yield reduction is prevented. could not.

Next, as an adhesive for bonding the copper foil 12 and the resin film 13, a process for laminating the second resin film 18 shown in FIG. And the step of peeling the first resin film 13 from the second member 19 as shown in FIG. 4F, an ultraviolet irradiation step for irradiating the resin film 13 with ultraviolet rays is provided. An attempt was made to reduce the adhesive strength of the adhesive.
However, the adhesive force cannot be sufficiently reduced by this, and it is difficult to fundamentally solve the problem that the defect that the bump 14 comes off from the second resin film 18 is generated, and avoid the yield reduction. I couldn't. In addition, this method has a problem that the number of UV irradiation processes is increased by one, and has led to a new problem of an increase in the number of man-hours and the resulting cost gift.

  The present invention has been made to solve such a problem. A metal bump is selectively formed on one surface of a carrier sheet by a metal foil bonded via an adhesive, and the one surface thereof is formed. In the method for manufacturing an inter-wiring-film connecting member, the method includes a step of peeling and removing the carrier sheet from a laminated member in which an insulating sheet is laminated so as to be penetrated by the metal bump. An object of the present invention is to provide a device for manufacturing an inter-wiring film connecting member that is suitable for manufacturing so as not to cause a risk of coming off from the insulating sheet by being attached to a carrier sheet. With the goal.

  The manufacturing method of the member for connecting between wiring films of Claim 1 selectively forms a metal bump with the metal foil adhere | attached through the adhesive on one surface of the carrier sheet, The said one surface WHEREIN: In the method for manufacturing a member for connecting an inter-wiring film having a step of peeling and removing the carrier sheet from a laminated member in which insulating sheets are laminated so as to be penetrated by metal bumps, the laminated member is opposite to the metal bump forming surface. Pressing with the pressing tool on the surface, grasping the end of the carrier sheet, and applying a peeling force to the carrier sheet in the direction in which the tip side of the pressing tool is peeled off while maintaining the state of pressing the laminated member with the pressing tool However, the carrier sheet is peeled off by retreating the pressing member from the end of the laminated member toward the opposite end.

  The manufacturing method of the wiring film connecting member according to claim 2 is the manufacturing method of the wiring film connecting member according to claim 1, wherein a margin part where the carrier sheet protrudes from the metal bump forming region as the laminated member is provided. The blank portion is gripped from the metal bump formation region when a peeling force is applied to the carrier sheet.

  The method for manufacturing an inter-wiring film connecting member according to claim 3 is the method for manufacturing an inter-wiring film connecting member according to claim 2, wherein the metal foil is formed in a blank portion protruding from the metal bump forming region as a laminated member. Is used, and the carrier sheet is grasped and peeled off at the portion where the metal foil is present.

  The apparatus for manufacturing an inter-wiring film connecting member according to claim 4 selectively forms a metal bump with a metal foil adhered to one surface of a carrier sheet via an adhesive, and the one surface has the above-mentioned An apparatus for manufacturing an inter-wiring-film connecting member that peels and removes the carrier sheet from a laminated member in which insulating sheets are laminated so as to be penetrated by metal bumps, and the carrier sheet includes the laminated member in which the insulating sheets are laminated. A base part that is supported so as to face upward, and a pressing tool that presses the laminated member supported by the base part from above and can move from one end of the laminated member to the other end side in the pressed state. And a peeling mechanism that grips one end of the laminated member with a clamp portion and applies a peeling force to the carrier sheet of the laminated member.

According to the method for manufacturing an inter-wiring film connecting member according to claim 1, the end of the carrier sheet is gripped, and the front side of the carrier sheet is peeled off from the carrier sheet while maintaining the state in which the carrier sheet is pressed by the pressing tool. Since the carrier sheet is peeled off by applying the peeling force and retracting the presser in the direction from the end of the carrier sheet toward the opposite end, the metal bumps should follow the carrier sheet when peeling off. However, the follow-up can be prevented by the pressing force of the pressing tool.
Therefore, when peeling off a carrier sheet, the possibility that the said metal bump will adhere to a carrier sheet and will come off from the said insulating sheet can be eliminated.

  According to the method for manufacturing a member for connecting between wiring films according to claim 2, the carrier sheet has a blank portion protruding from the metal bump forming region as a laminated member, and a peeling force is applied to the carrier sheet. Since the blank portion is grasped from the metal bump formation region, there is no possibility that the metal bump formation region is damaged by the peeling operation.

According to the manufacturing method of the member for connecting between wiring films according to claim 3, a laminate member in which the metal foil is present in a blank portion of the carrier sheet is used, and the carrier sheet is grasped at the portion where the metal foil is present. Therefore, the strength of the portion where the carrier sheet can be gripped can be increased by the metal foil, and the carrier sheet is not broken.
Moreover, the thickness of the part to which the carrier sheet is gripped can be increased by the metal foil, and the end of the carrier sheet can be firmly gripped. Therefore, it is easy to sufficiently apply the necessary peeling force, and the peeling operation can be performed reliably.

According to the apparatus for manufacturing an inter-wiring film connecting member according to claim 4, a base part for supporting the laminated member with the carrier sheet facing upward, and the laminated member supported by the base part from above are pressed and pressed. In this state, the pressing member that is movable from one end of the laminated member to the other end side, and one end of the laminated member are grasped by a clamp portion, and a peeling force is applied to the carrier sheet of the laminated member. The carrier sheet supported by the base part is held by the presser, and in this state, one end of the laminated member is grasped by the clamp part of the peeling mechanism, and the carrier sheet of the laminated member is On the other hand, a peeling force can be applied.
Therefore, the manufacturing method of the member for connection between wiring films of Claim 1 can be implemented.

The method for manufacturing a wiring film connecting member according to the present invention basically includes pressing the laminated member with a pressing member on the surface opposite to the metal bump forming surface, grasping the end of the carrier sheet, and pressing the pressing member. While holding the state of pressing the laminated member, while applying a peeling force to the carrier sheet to peel away the front side of the pressing member, the pressing member is retracted from the end of the laminated member toward the opposite end. However, it is preferable to use a laminated member having a blank portion protruding from the metal bump formation region as the laminated member.
This is because it can be peeled off by grasping the blank portion and applying a peeling force to the carrier sheet, so that there is no risk of damage such as damage to the metal bump forming region by the peeling operation.

Furthermore, it is preferable to use a laminate member in which the metal foil is present in the blank portion of the carrier sheet.
Because it is possible to thicken the part by providing a metal foil, and further to strengthen it, it becomes easier to firmly grip the edge of the carrier sheet, and it is necessary This is because it is easy to apply a sufficient peeling force and the peeling work can be carried out reliably.

  The manufacturing apparatus of the wiring film connecting member of the present invention basically holds the laminated member from above so as to support the laminated member so that the carrier sheet faces upward, and the laminated member supported by the pedestal. A holding tool that can move from one end of the laminated member to the other end side in a pressed state and one end of the laminated member are gripped by a clamp portion, and a peeling force is applied to the carrier sheet of the laminated member The shape of the tip of the presser has an obtuse angle as shown in FIG. 2 (A). There can be a right angle as shown and an acute angle as shown in (C). And although any thing can perform a smooth peeling operation | work, it is confirmed that the thing of the acute angle shown in FIG.2 (C) is the most preferable.

Also, the direction of the peeling force applied to the carrier sheet of the laminated member is such that the angle β with respect to the mounting surface of the laminated member is an obtuse angle as shown in FIG. 3 (A) and a right angle as shown in FIG. 3 (B). There may be three types, one having an acute angle as shown in FIG. In either case, there is no difference in that the stripping operation can be performed smoothly, but the one with the acute angle as shown in FIG.
Therefore, it can be said that it is preferable to apply a peeling force as shown in FIG. 3C using a presser having the shape shown in FIG.

  The pressing tool of the wiring film connecting member manufacturing apparatus of the present invention may be guided by a guide mechanism so as to be reciprocated along one direction so that it can be retracted as the peeling operation proceeds. In addition, a presser drive mechanism may be provided that moves the presser back with the progress of the peeling operation, or moves forward in preparation for the start of peeling of a new laminated member. Instead, the pressing tool may be moved backward while being guided by the guide mechanism by the peeling force applied by simply gripping the carrier sheet at the clamp portion. In that case, the weight of the pressing tool itself (a weight may be placed on the pressing tool. In that case, the weight of the pressing tool and the weight of the weight) is important as defining the pressing force by the pressing tool. There is a case where it is not possible to effectively prevent the trouble that the metal bump remains on the insulating sheet because it is too light.

Hereinafter, the details of the present invention will be described based on illustrated embodiments.
1A to 1C show a first embodiment of the present invention, in which FIG. 1A is a sectional view, FIG. 1B is a bottom view of a laminated member, and FIG. 1C is a sectional view of the laminated member. is there.
In the figure, reference numeral 50 denotes a laminated member (corresponding to the member 19 in FIG. 4), and a metal bump 56 made of copper and an edge portion 58 are formed on one surface of a carrier sheet 52 made of resin via an adhesive 54, Further, an insulating sheet 60 serving as an interlayer insulating film is laminated so as to be penetrated by the metal bumps 56 on the surface of the carrier sheet 52 where the metal bumps 56 and the like are formed.

The said edge part 58 which consists of copper is formed along the edge of the carrier sheet 52, and the planar shape is formed in the rectangular shape. A large number of the metal bumps 56 are disposed in a metal bump forming region 62 formed inside the rectangular edge portion 58, and the outer side of the metal bump forming region 62 becomes a blank portion 64. The edge portion 58 made of the copper is formed in the portion 64.
The edge portion 58 is made strong by the strength of the carrier sheet 52 to eliminate the possibility of tearing during the peeling operation, and by thickening the edge portion 58, the edge portion 58 can be firmly held by the clamp portion of the wiring film connecting member manufacturing apparatus described later. It is formed for this purpose.

  Reference numeral 70 denotes a pedestal portion of the apparatus for manufacturing an inter-wiring film connecting member, and the upper surface thereof has a substantially horizontal surface, and the laminated member 50 on the upper surface is adsorbed by vacuum suction. 70h is a vacuum suction hole. The laminated member 50 is placed on the upper surface of the pedestal 70 so that the carrier sheet 52 is positioned on the upper side. Reference numeral 72 denotes a pressing member placed on the laminated member 50 on the platform 70 and presses the laminated member 50 by its own weight. Note that a weight may be placed on the presser 72 to increase the weight. A guide 74 guides the pressing member 72 on the laminated member 50 in one direction from a position where one end of the pressing member 72 is located on one end of the laminated member 50 to a position located on the other end. is there.

76 is a clamper of the peeling mechanism 78 of the manufacturing apparatus of the member for connecting between wiring films, and clamps one end of the carrier sheet 52 of the laminated member 50 (the portion where the edge 58 made of copper is formed). The clamper 76 keeps applying the peeling force by moving the position while pulling the laminated member 50 with a predetermined tension by the action of the peeling mechanism 78 in the clamped state.
The peeling mechanism 78 controls the clamper 76 to be clamped or released, controls the extension length of the clamper 76 to the outside, and further creates a peeling force by pulling and pulling the clamper 76. In addition, it also moves in the one direction, that is, moves backward while performing the peeling operation itself.

By the way, the peeling force by the peeling mechanism 78 acts in the direction in which the presser 72 is moved backward, so that the presser 72 is moved by the guide 74 in the above-mentioned direction [left and right direction in FIG. 1 (A)]. ] Retreat while being guided.
Therefore, the peeling position gradually moves along one direction [left and right direction in FIG. 1A] to one side [right direction in FIG. 1A], and peeling proceeds.

Then, when the one end of the pressing member 72 is retracted to a position where the one end is positioned on the other end portion of the laminated member 72, the peeling of the carrier sheet 52 is completed.
According to such an embodiment, even when the metal bump 56 tries to follow the carrier sheet 52 during the peeling operation, the following can be prevented by the pressing force of the pressing tool 72.
Therefore, when the carrier sheet 52 is peeled off, it is possible to eliminate the possibility that the metal bumps 56 are attached to the carrier sheet 52 and come off from the insulating sheet 60.

  The carrier sheet 52 is provided with a blank portion 64 that protrudes from the metal bump formation region 62. The blank portion 64 is provided with an edge portion 58 made of copper, and the edge portion 58 is grasped and clamped. Therefore, there is no possibility that the metal bump forming region is damaged by the peeling operation, and the thickness of the portion where the carrier sheet is gripped is increased by the edge portion 58. It becomes easy to grip the end firmly. Therefore, it is easy to sufficiently apply the necessary peeling force, and the peeling operation can be performed reliably.

2A to 2C are cross-sectional views showing other vertical cross-sectional shape examples of the presser 72, and FIGS. 3A to 3C are cross-sectional views showing another example of the direction of the peeling force. FIG.
As a result of the inventor's experiment, as described above, the stripper 72 can be smoothly peeled off regardless of the type of the longitudinal cross-sectional shape of the presser 72 shown in FIGS. 2 (A) to 2 (C), but is most preferable. It has been confirmed that the angle α shown in FIG. 2C is an acute angle.

Further, the direction of the peeling force applied to the carrier sheet of the laminated member is as shown in FIG. 3B, in which the angle β with respect to the mounting surface of the laminated member is an obtuse angle as shown in FIGS. There can be three types, such as a right angle as shown in FIG. 3 and an acute angle as shown in FIG. In either case, there is no difference in that the stripping operation can be performed smoothly, but the one with the acute angle as shown in FIG.
Therefore, it can be said that it is preferable to apply a peeling force as shown in FIG. 3C using a presser having the shape shown in FIG.

  The present invention is not limited to the peeling step shown in (F) of the method for manufacturing a wiring film connecting member shown in FIGS. 4 (A) to 4 (H), but any peeling described in JP-A-2003-309370. The metal bump is selectively formed by a metal foil bonded to one surface of the carrier sheet via an adhesive, and the one surface is penetrated by the metal bump. The present invention has applicability to a manufacturing method of a wiring film connecting member having a step of peeling and removing the carrier sheet from a laminated member having an insulating sheet laminated thereon, and a manufacturing apparatus of a wiring film connecting member used in the implementation. .

(A)-(C) are for demonstrating the 1st Example of this invention, (A) is sectional drawing explaining peeling operation | movement, (B) is a bottom view of a laminated member, (C) is It is sectional drawing of a laminated member. (A)-(C) are sectional drawings which show the mutually different vertical cross-sectional shape example of the pressing tool of the manufacturing apparatus of the member for connection between wiring films of this invention. (A)-(C) are sectional drawings which show another example of the direction of peeling force, respectively. (A)-(H) is sectional drawing which shows the manufacturing method of the member for wiring film | membrane connection which is background art in order of a process, (F ') is sectional drawing which shows the variation of the process shown to (F). (A)-(C) are sectional drawings which show an example of the method of laminating | stacking the 2nd resin film and 1st member which are insulating films in the manufacturing method shown in FIG. (A)-(C) is sectional drawing which shows an example of the manufacturing method of the member for wiring film connection shown in FIG.4 (F ') in order of a process. It is sectional drawing for demonstrating the subject which this invention tends to solve.

Explanation of symbols

50 ... laminated member, 52 ... carrier film,
54 ... adhesive, 56 ... metal bump, 58 ... edge,
60 ... Insulating sheet, 70 ... Base, 72 ... Presser,
74 ... guide, 76 ... clamper, 78 ... peeling mechanism.

Claims (4)

A metal bump is selectively formed with a metal foil adhered to one surface of the carrier sheet via an adhesive, and an insulating sheet is laminated on the one surface of the carrier sheet so as to be penetrated by the metal bump. In the manufacturing method of the member for connecting between wiring films having a step of peeling off the carrier sheet from the laminated member formed,
Holding the laminated member on the surface opposite to the metal bump forming surface, with a pressing tool having a vertical cross-sectional shape with a sharp tip ,
Grasp the end of the carrier sheet and keep the laminated member pressed by the tip of the pressing tool so that the metal bumps do not come off the insulating sheet , the retainer while peeling force added stripping is retracted in a direction towards the opposite end to that from the end of the carrier sheet and pulling Rukoto the carrier sheet along the sharp surface of the distal end portion of the retainer A method for producing a member for connecting between wiring films, wherein the carrier sheet is peeled off. As the laminated member, the carrier sheet having a blank portion protruding from a metal bump forming region where the metal bump is formed,
2. The method for manufacturing an inter-wiring film connecting member according to claim 1, wherein the blank portion is gripped when a peeling force is applied to the carrier sheet. As the laminated member, the one in which the metal foil is present in the blank portion of the carrier sheet,
3. The method for manufacturing an inter-wiring film connecting member according to claim 2, wherein the carrier sheet is grasped and peeled off at a portion where the metal foil is present. Lamination formed by selectively forming metal bumps with a metal foil adhered to one surface of a carrier sheet via an adhesive, and laminating an insulating sheet so as to be penetrated by the metal bumps on the one surface An apparatus for manufacturing an inter-wiring film connecting member for peeling off and removing the carrier sheet from a member,
A base for supporting the laminated member in a direction in which the carrier sheet faces upward,
A pressing tool configured to be able to move from one end to the other end side of the laminated member in a state where the laminated member supported by the pedestal is pressed from above and held down, and has a vertical section with a sharp tip. The presser, which has a shape, and can suppress the laminated member so that the metal bumps do not come off from the insulating sheet when the carrier sheet is peeled from the laminated member ;
A peeling mechanism that grips one end of the laminated member at the clamp portion, applies a peeling force to the carrier sheet of the laminated member, and pulls up the carrier sheet along the acute angle surface of the distal end portion of the presser ;
An apparatus for manufacturing a member for connecting between wiring films having at least

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