JP4418064B2 - Non-contact data carrier - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type data carrier having a resin base material, an antenna coil, and an IC chip, and more particularly to a non-contact type data carrier capable of reinforcing a resin base material when an IC chip is mounted.
[0002]
[Prior art]
Conventionally, contactless data carriers have been used in logistics systems. Such a non-contact type data carrier is used by being attached to, for example, a product packaging box or the product itself.
[0003]
A non-contact type data carrier generally includes a resin base material, a metal antenna coil provided on the resin base material, and an IC chip connected to the antenna coil.
[0004]
When electromagnetic waves are emitted from the reader side to the non-contact type data carrier, an induced voltage is generated in the antenna coil, and the IC chip is operated.
[0005]
[Problems to be solved by the invention]
The non-contact type data carrier includes the metal antenna coil provided on the resin base as described above and the IC chip connected to the antenna coil. When the IC chip is mounted on the antenna coil, It is necessary to heat-press the IC chip to the antenna coil.
[0006]
When the IC chip is heated and pressure-bonded, the resin base material sags or contracts, and a non-contact data carrier cannot be manufactured with high accuracy.
[0007]
The present invention has been made in consideration of such points, and an object of the present invention is to provide a non-contact data carrier in which a resin base material does not sag or shrink even when an IC chip is mounted.
[0008]
[Means for Solving the Problems]
The present invention includes a resin base , a metal antenna coil provided on the resin base and having a pair of ends , and an IC chip connected to the antenna coil, and one end of the antenna coil is an antenna. Connected to the IC chip inside the coil, the other end of the antenna coil is connected to the IC chip outside the antenna coil, and one metal reinforcing part is provided near one end of the antenna coil inside the antenna coil. The non-contact type data carrier is characterized in that the other metal reinforcing portion is provided near the other end of the antenna coil outside the coil .
[0009]
According to the present invention, when the IC chip is connected to the antenna coil and mounted, even if the IC chip is heat-pressed, the metal reinforcing portion provided on the resin substrate prevents the resin substrate from sagging and shrinking. can do.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing an embodiment of a contactless data carrier according to the present invention.
[0011]
As shown in FIGS. 1 and 2, for example, a non-contact data carrier 10 such as an IC card or an IC tag includes a PET resin base material 11 and a photoresist layer (not shown) on almost the entire area of the resin base material 11. 2) and an IC chip 20 connected to the antenna coil 13.
[0012]
In addition, on the resin base material 11, the antenna coil 13 and the IC chip 20 are disposed in the vicinity of the IC chip 20 in order to reinforce the strength when the IC chip 20 is thermocompression bonded to the antenna coil 13 and to prevent the resin base material 11 from sagging and shrinking. Metal reinforcing portions 26 and 27 made of the same material are provided. The metal reinforcing portions 26 and 27 are electrically insulated from the antenna coil 13, but may be electrically connected.
[0013]
The pair of end portions of the antenna coil 13 are disposed on the inner side and the outer side of the antenna coil 13, respectively.
[0014]
The non-contact type data carrier 10 having such a configuration is used by being affixed to, for example, a product packaging box or the product itself, and the IC chip 20 is operated by electromagnetic waves from a reader of a distribution system (not shown). It is like that.
[0015]
On the antenna coil 13 and the metal reinforcement portions 26 and 27, a buffer layer 15 is provided in which a storage opening 15a for storing the IC chip 20 is formed in a portion corresponding to the IC chip 20. Further, a protective layer 18 made of a resin base material is provided on the buffer layer 15 via an adhesive layer (not shown), but the adhesive layer is not necessarily provided.
[0016]
Next, the material and shape of each part will be described.
[0017]
As the resin base material 11, for example, a plastic film such as polyester, polyethylene, polypropylene, and polyimide, paper, or non-woven fabric can be used. However, polyester and polyimide are mainly used from the viewpoint of chemical resistance and heat resistance. Normally, the shape of the antenna coil 13 is about 40 mm × 40 mm, but the antenna coil 13 may be formed in a card shape or the like depending on the intended use and required performance. Moreover, the thickness of the resin base material 11 is 30-200 micrometers. The metal antenna coil 13 is made of aluminum and has a thickness of about 5 to 100 [mu] m, but is preferably 15 to 30 [mu] m from the viewpoint of cost and electrical characteristics. Further, the IC chip 20 having a size of 1.5 mm × 1.5 mm square and a thickness of about 180 μm is used.
[0018]
The buffer layer 15 is made of, for example, polyester, PVC, polyimide, polypropylene, polyethylene, paper, non-woven fabric, etc., but polyester is mainly used in terms of strength and heat resistance. The thickness of the buffer layer 15 is larger than the thickness of the IC chip 20 and is, for example, 180 to 200 μm. When the buffer layer 15 is made of a material having hot melt adhesiveness, the adhesive layer can be removed.
[0019]
The protective layer 18 is made of PET and has a thickness of 50 to 100 μm. Further, printing may be performed on the protective layer 18.
[0020]
Next, a method for manufacturing a non-contact type data carrier having such a configuration will be described. First, the resin substrate 11 is prepared, and the antenna coil 13 is formed on the resin substrate 11 by an etching method using a photoresist layer. When the antenna coil 13 is formed, the metal reinforcing portions 26 and 27 are simultaneously formed of the same material as the antenna coil 13.
[0021]
Next, the IC chip 20 is mounted on the antenna coil 13 via an insulating adhesive (not shown), and the IC chip 20 is fixed by thermocompression bonding. In this case, since the metal reinforcing portions 26 and 27 are previously formed of the same material as that of the antenna coil 13 in the vicinity of the position where the IC chip 20 is disposed, the resin base material 11 remains even if the IC chip 20 is heat-pressed. There is no sagging or shrinking. That is, in the case where the metal reinforcing portions 26 and 27 are not provided, it is conceivable that the resin base material 11 in the vicinity of the IC chip 20 is slackened or contracted during the thermocompression bonding of the IC chip 20. , 27 is provided to prevent such sagging and shrinkage of the resin base material 11.
[0022]
Thereafter, the buffer layer 15, the adhesive layer, and the protective layer 18 are overlaid on the antenna coil 13 and the metal reinforcing portions 26, 27, and the buffer layer 15, the adhesive layer, and the protective layer 18 are pressure-bonded onto the antenna coil 13 by a laminating method. To be fixed.
[0023]
In this case, since the IC chip 20 on the antenna coil 13 is housed and held in the housing opening 15a of the buffer layer 15, the buffer layer 15, the adhesive layer and the protective layer 18 are pressure-bonded onto the antenna coil 13 by a laminating method. Thus, the IC chip 20 is not damaged due to excessive pressure when it is fixed.
[0024]
Further, since the IC chip 20 is housed in the housing opening 15a of the buffer layer 15, the IC chip 20 does not protrude upward from the buffer layer 15, so that the surface of the protective layer 18 can be kept smooth.
[0025]
Next, another embodiment of the non-contact type data carrier 10 according to the present invention will be described with reference to FIG.
[0026]
In the embodiment shown in FIG. 4, a circular frame 16 surrounding the IC chip 20 is provided, and a soft resin, for example, a polyester buffer layer 15 and a protective layer 18 are sequentially provided on the frame 16. It is.
[0027]
Other configurations are substantially the same as those of the embodiment shown in FIGS. In FIG. 4, the same parts as those in the embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0028]
In FIG. 4, the thickness of the frame 16 is larger than the thickness 180 μm of the IC chip 20, for example, 180 to 200 μm.
[0029]
In FIG. 4, an antenna coil 13 and metal reinforcing portions 26 and 27 are provided on a resin substrate 11 by an etching method using a photoresist layer, and an IC chip 20 is mounted on the antenna coil 13 and fixed by thermocompression bonding. Is done. Next, the frame 16 is attached so as to surround the IC chip 20, and the buffer layer 15 and the protective layer 18 are further provided by pressure bonding by a laminating method so as to cover the antenna coil 13, the metal reinforcing portions 26 and 27 and the frame 16. FIG. 4).
[0030]
In this case, since the buffer layer 15 is made of a soft resin, when the buffer layer 15 covers the antenna coil 13 and the frame body 16, the buffer layer 15 absorbs the frame body 16 portion and deforms into a concave shape. Therefore, when the buffer layer 15 is provided by the laminating method, the IC chip 20 can be protected by the frame body 16 and the surface of the protective layer 18 does not protrude outward by the buffer layer 15.
[0031]
Next, another embodiment of the non-contact type data carrier 10 according to the present invention will be described with reference to FIG. As shown in FIG. 5, the antenna coil 13 and the metal reinforcing portions 26 and 27 are provided on the resin base material 11. An IC chip 20 is connected to the antenna coil 13, and a soft resin, eg, polyester-based buffer layer 15 is provided on the antenna coil 13 so as to cover the antenna coil 13, the metal reinforcing portions 26 and 27, and the IC chip 20. Further, for example, a polyester-based protective layer 18 is laminated on the buffer layer 15 by a laminating method. Among these, since the buffer layer 15 is made of a soft resin such as a thermoplastic plastic, a portion corresponding to the IC chip 20 is deformed into a concave shape to absorb the outer shape of the IC chip 20.
[0032]
【The invention's effect】
As described above, according to the present invention, when the IC chip is connected to the antenna coil and mounted, even if the IC chip is heat-pressed, the sagging of the resin base and the metal base are provided by the metal reinforcing portion provided on the resin base. Shrinkage can be prevented. For this reason, the non-contact-type data carrier with a sufficient precision which a resin base material does not deform | transform can be obtained.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a contactless data carrier according to the present invention.
FIG. 2 is an enlarged view showing an embodiment of a contactless data carrier according to the present invention.
FIG. 3 is a side view showing an embodiment of a contactless data carrier according to the present invention.
FIG. 4 is a side view showing another embodiment of a contactless data carrier according to the present invention.
FIG. 5 is a side view showing another embodiment of the contactless data carrier according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Non-contact-type data carrier 11 Resin base material 13 Antenna coil 15 Buffer layer 15a Storage opening 16 Frame 20 IC chip 26, 27 Metal reinforcement part

Claims (6)

A resin substrate;
A metal antenna coil provided on a resin substrate and having a pair of ends ;
An IC chip connected to the antenna coil,
One end of the antenna coil is connected to the IC chip on the inner side of the antenna coil, the other end of the antenna coil is connected to the IC chip on the outer side of the antenna coil, and one end near the one end of the antenna coil on the inner side of the antenna coil. A non-contact type data carrier , wherein the other metal reinforcing portion is provided near the other end of the antenna coil outside the antenna coil . 2. The non-contact type data carrier according to claim 1, wherein each metal reinforcing portion is insulated from the antenna coil. 2. The non-contact type data carrier according to claim 1, wherein each metal reinforcing portion is connected to an antenna coil. A buffer layer disposed on the antenna coil and having a storage opening for storing the IC chip in a portion corresponding to the IC chip;
The contactless data carrier according to claim 1, further comprising a protective layer provided on the buffer layer. A frame provided on the antenna coil so as to surround the IC chip;
A resin buffer layer provided to cover the antenna coil and the frame;
The contactless data carrier according to claim 1, further comprising a protective layer provided on the buffer layer. A resin-made buffer layer provided to cover the antenna coil and the IC chip, and a portion corresponding to the IC chip is deformed into a concave shape;
The contactless data carrier according to claim 1, further comprising a protective layer provided on the buffer layer.

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