JP4614518B2 - Non-contact data carrier - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type data carrier having a resin base material, an antenna, and an IC chip, and more particularly to a non-contact type data carrier capable of obtaining surface smoothness.
[0002]
[Prior art]
Conventionally, non-contact data carriers have been used in distribution systems and the like. Such a non-contact type data carrier is used by being attached to, for example, a product packaging box or the product itself.
[0003]
A non-contact type data carrier generally includes a resin base, a conductive antenna coil provided on the resin base, and an IC chip having bumps connected to the antenna coil.
[0004]
When electromagnetic waves are emitted from the reader side to the non-contact type data carrier, an induced voltage is generated in the antenna coil, and the IC chip is operated.
[0005]
[Problems to be solved by the invention]
The non-contact type data carrier includes a conductive antenna coil provided on a resin base as described above, and an IC chip having bumps connected to the antenna coil. In order to enhance protection of the IC chip, a resin sealing layer is provided to cover the IC chip, and a protective layer is further provided on the resin sealing layer.
[0006]
The resin sealing layer is provided to prevent damage and failure of the IC chip due to impact or outside air in the process up to finally forming the protective layer. The protective layer covers the entire circuit surface including the antenna coil. It is finally formed for the purpose of protection.
[0007]
However, when a resin sealing layer and a protective layer are provided on the IC chip, the portion of the protective layer corresponding to the IC chip rises upward, and the smoothness of the outer surface of the protective layer cannot be maintained.
[0008]
The present invention has been made in consideration of such points, and an object thereof is to provide a non-contact type data carrier that can effectively protect an IC chip and can maintain the smoothness of the outer surface. And
[0009]
[Means for Solving the Problems]
The present invention includes a resin base material, an antenna provided on one side of the resin base material, and an IC chip connected to the antenna, and a resin sealing layer made of a thermoplastic resin covering the IC chip. And a protective layer is provided on the resin sealing layer via a resin intermediate layer. The protective layer and the resin intermediate layer are made of a thermoplastic resin having a melting point lower than that of the resin sealing layer. A non-contact type data carrier characterized by covering a stop layer and an antenna .
[0010]
According to the present invention, the resin sealing layer is provided so as to cover the IC chip, and the protective layer is further provided on the resin sealing layer via the resin intermediate layer. The protective layer can enhance the mechanical protection of the IC chip. Moreover, since the resin intermediate layer has a melting point lower than that of the resin sealing layer, when a protective layer is placed on the resin sealing layer via the resin intermediate layer and a hot press operation is performed on the protective layer, the resin intermediate layer The layer is deformed to absorb the thickness of the IC chip and the resin sealing layer. For this reason, the outer surface of the protective layer can be kept smooth.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 (a), (b), (c) to FIG. 3 are diagrams showing an embodiment of a non-contact type data carrier according to the present invention.
[0012]
As shown in FIGS. 1A, 1B, and 1C, a non-contact data carrier 10 such as an IC card or an IC tag includes a resin base material 11 made of PET and an upper surface of the resin base material 11 (resin base material). A conductive antenna coil 13 formed by etching using aluminum or a conductive ink containing a conductive filler using a photoresist layer (not shown) over substantially the entire area of one side of the antenna 11; IC chip 20 connected on 13.
[0013]
Among these, the IC chip 20 has an IC chip main body 20 a and bumps 22 provided on the bottom surface of the IC chip main body 20 a, and a surface (bottom surface) on the bump 22 side of the IC chip 20 is a circuit surface 23. The IC chip 20 is disposed on the antenna coil 13 with an insulating adhesive 14 in a state where the circuit surface 23 on the bump 22 side faces the antenna coil 13 and the bump 22 is in contact with the antenna coil 13. ing. In this case, the circuit surface 23 of the IC chip 20 is covered and protected by the insulating adhesive 14.
[0014]
Instead of the antenna coil 13, an area transmission / reception type antenna 33 that is in contact with the bumps 22 of the IC chip 20 and configured by a pattern may be used (FIG. 4).
[0015]
Further, a metal reinforcing member 26 made of a metal plate is provided on the upper surface of the resin base material 11 in order to reinforce the strength when the IC chip 20 is heat-pressed to the antenna coil 13. The metal reinforcing member 26 is preferably formed at the same time when the antenna coil 13 is formed on the resin base material 11. For this reason, the metal reinforcing member 26 is made of aluminum or a conductive printed layer.
[0016]
As shown in FIGS. 2 and 3, the pair of end portions of the antenna coil 13 are disposed inside and outside the antenna coil 13, respectively.
[0017]
Further, as shown in FIG. 1C, a resin sealing layer 15 is provided so as to cover the IC chip 20, and the resin sealing layer 15 includes the entire outer periphery of the insulating adhesive 14 and the side and top surfaces of the IC chip. It is provided to cover. Furthermore, a protective layer 18 is provided on the resin sealing layer 15 via a resin intermediate layer 17.
[0018]
Next, the material and shape of each part will be described.
[0019]
As the resin base material 11, for example, a plastic film such as polyester, polyethylene, polypropylene, and polyimide, paper, or non-woven fabric can be used. However, polyester and polyimide are mainly used from the viewpoint of chemical resistance and heat resistance. As the polyester, biaxially stretched polyester that has been heat-treated in advance is used.
[0020]
Normally, the shape of the antenna coil 13 is about 40 mm × 40 mm, but the antenna coil 13 may be formed in a card shape or the like depending on the intended use and required performance. Moreover, the thickness of the resin base material 11 is 30-200 micrometers.
[0021]
The antenna coil 13 is formed by etching and is made of aluminum. Although the thickness of the antenna coil 13 is about 5 to 100 μm, it is preferably 15 to 30 μm from the viewpoint of cost and electrical characteristics. The antenna coil 13 may be formed by printing using a conductive filler and the thickness thereof may be 5 to 50 nm. In this case, Ag, carbon, or a mixture thereof can be considered as the conductive filler, and the specific resistance of the antenna coil 13 made of the conductive filler is 1 × 10 ⁻¹ Ω · cm to ¹ × 10 ⁻⁶ Ω · cm.
[0022]
Further, the IC chip body 20a of the IC chip 20 has a size of 1.5 mm × 1.5 mm square and a thickness of about 180 μm.
[0023]
The metal reinforcing member 26 is made of aluminum, but another metal member may be used.
[0024]
The insulating adhesive 14 may be selected from various thermoplastic resins in addition to those using a thermosetting resin such as epoxy, acrylic, urethane, etc. as a base polymer.
In addition, the protective effect is further enhanced by concealing with a colorant.
[0025]
Next, the resin sealing layer 15 will be described. As the resin sealing layer 15, a thermoplastic resin such as urethane, polyester, EVA, PBT or the like is used. In particular, a hot melt type having a melting point of about 80 to 150 ° C. is desirable from the viewpoint of hot press suitability, but a material having a melting point of 100 to 120 ° C. is better for ensuring practical durability and finish (surface smoothness). .
[0026]
In addition, the resin sealing layer 15 may be formed by printing, or may be formed by application by tip spence.
[0027]
Further, as the resin intermediate layer 17 and the protective layer 18, a material having a melting point lower than that of the resin sealing layer 15, for example, a thermoplastic resin such as urethane, polyester, EVA, PBT, or the like, heat such as epoxy, acrylic, urethane, etc. A curable resin or a reactive curable resin may be used in an uncured or semi-cured state.
[0029]
Next, a method for manufacturing a non-contact type data carrier having such a configuration will be described. First, as shown in FIG. 1A, a resin substrate 11 is prepared, and an antenna coil 13 is formed on the upper surface of the resin substrate 11 by an etching method or a printing method using a photoresist layer.
[0030]
At the same time, the metal reinforcing member 26 is provided on the upper surface of the resin base 11 by an etching method or a printing method.
[0031]
Next, the IC chip 20 is mounted on the antenna coil 13 via the insulating adhesive 14, and the IC chip 20 is heat-pressed by a heating head (not shown) and fixed to the antenna coil 13. In this case, since the metal reinforcing member 26 is provided on the resin base material 11, the resin base material 11 does not sag or shrink even if the IC chip 20 is heat-pressed by the heating head. That is, when the metal reinforcing member 26 is not provided, the resin base material 11 may be slackened or contracted due to the force and heat applied to the IC chip 20 when the IC chip 20 is heat-bonded. However, according to the present invention, since the metal reinforcing member 26 is provided, the force and heat applied to the IC chip 20 can be received by the metal reinforcing member 26, and sagging and shrinkage of the resin base material 11 are prevented.
[0032]
Thereafter, as shown in FIG. 1B, a resin sealing layer 15 is provided so as to cover the IC chip 20.
[0033]
Next, as shown in FIG. 1C, the resin intermediate layer 17 and the protective layer 18 are placed so as to cover the resin sealing layer 15, and a hot pressing operation is performed from above the protective layer 18 using a hot plate (not shown). (Heating temperature 80-160 ° C., pressure 2-20 kgf / cm ² ). In this case, since the resin intermediate layer 17 has a melting point lower than that of the resin sealing layer 15, the resin intermediate layer 17 is deformed during the hot press operation and absorbs the thickness of the IC chip 20 and the resin sealing layer 15. For this reason, the protective layer 18 does not protrude outward by the IC chip 20 and the resin sealing layer 15, and the surface of the protective layer 18 can be kept smooth.
[0034]
As described above, according to the present embodiment, since the resin sealing layer 15, the resin intermediate layer 17, and the protective layer 18 are provided so as to cover the IC chip 20, the resin sealing layer 15, the resin intermediate layer 17, and the The protective layer 18 can mechanically protect and strengthen the IC chip 20. Further, since the resin intermediate layer 17 has a melting point lower than that of the resin sealing layer 15, the resin intermediate layer 17 is deformed during the hot press operation and absorbs the thickness of the IC chip 20 and the resin sealing layer 15. For this reason, the outer surface of the protective layer 18 can be kept smooth.
[0035]
【The invention's effect】
As described above, according to the present invention, the protection of the IC chip of the non-contact data carrier can be strengthened and the outer surface of the protective layer can be kept smooth.
[Brief description of the drawings]
FIG. 1 is a side view showing an embodiment of a contactless data carrier according to the present invention.
FIG. 2 is a plan view of a non-contact data carrier according to the present invention.
FIG. 3 is an enlarged view of a non-contact data carrier according to the present invention.
FIG. 4 is a diagram showing an area receiving / transmitting antenna;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Non-contact-type data carrier 11 Resin base material 13 Antenna coil 14 Insulating adhesive 15 Resin sealing layer 17 Resin intermediate layer 18 Protective layer 20 IC chip 22 Bump

Claims (2)

A resin substrate;
An antenna provided on one side of the resin substrate;
An IC chip connected to the antenna,
A resin sealing layer made of a thermoplastic resin is provided to cover the IC chip, and a protective layer is provided on the resin sealing layer via a resin intermediate layer. The protective layer and the resin intermediate layer have a lower melting point than the resin sealing layer. A non-contact type data carrier comprising a thermoplastic resin having a resin intermediate layer covering a resin sealing layer and an antenna .   2. The non-contact type data carrier according to claim 1, wherein an insulating adhesive is interposed between the antenna and the IC chip.

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