JP4423250B2 - Thick metal circuit embedded substrate and manufacturing method thereof - Google Patents

Description

  The present invention relates to a printed circuit board and a method for manufacturing the same, which can be used for a substrate that requires a large current by using a thick metal, has excellent voltage resistance, and can be miniaturized.

As the use of wiring boards expands, higher performance and more functions are required . For example , the demand for power supply members for medical equipment, high current applications such as in-vehicle relay boxes, or substrates with high voltage resistance has been significantly increased . Also, the substrate is also required to enable miniaturization.

However, wiring substrate formed with conventional thick material metal circuit, it takes time and effort, such as a solder resist printing and silk screen printing, the cost is not a resolver hunting a high, when the heat and pressure treatment, a synthetic resin Resin that has flowed out of the core material in the thickness direction of the board has problems such as hindering the efficiency of soldering during component mounting.
Edited by Koji Ito, "Printed Wiring Technology Reader", Nikkan Kogyo Shimbun

Therefore, in order to improve these drawbacks, the inventors of the present application have intensively researched and repeated experiments to arrive at the present invention.

An object of the present invention is to provide, in the first, can cope with a case requiring a large current, also with an excellent voltage resistance, improve productivity Save time of the solder resist printing it is to provide the formed substrate and a manufacturing method thicknesses product metal circuit that can have.

Secondly, a substrate and a manufacturing method on which a thick metal circuit is formed that not only reduces the cost but also prevents the above-described obstruction phenomenon during component mounting, facilitates component mounting, and enables miniaturization . Is to provide.

In the present invention , based on a desired circuit design, a part insertion hole opening is previously formed in the resist member, and a metal plate (for example, copper, aluminum, brass, etc. can be used) on the resist member. A circuit formed by performing a temporary bonding and etching to form a circuit separately, or using a means such as cutting, press punching, electric discharge machining or the like to perform a desired process on the resist member. Are temporarily bonded to each other, and a plurality of synthetic resin core members are sandwiched and heated and pressure-molded and pressed.

That is, the thick metal circuit-embedded substrate of the present invention has a part insertion hole opening formed in the resist member in advance, a metal plate is temporarily bonded on the resist member, and etching is performed to close the opening. Create a thick metal circuit separately, or cut, press punch, or electrodischarge process a metal plate to form a thick metal circuit on the resist member so as to close the opening. In the state where the thick metal circuits are in contact with each other on the upper surface and the lower surface of a bundle of a plurality of synthetic resin core members, and the resist member is positioned outside. Heating and pressure forming press processing is performed, and the spring resin part that springs out from the bundle of synthetic resin core members is formed to be the same height as the thick metal circuit, and the part insertion hole is formed in the opening. It is characterized by that.

The method for manufacturing a thick metal circuit embedded substrate according to the first aspect of the present invention includes a step of temporarily joining a metal plate on a resist member having an opening for a component insertion hole, an etching process on the metal plate, The step of forming a thick metal circuit so as to close the opening, and the thick metal circuit are in contact with each other on the upper surface and the lower surface of a bundle of a plurality of synthetic resin core members so that the resist member is located outside Heating and pressure forming press processing in the overlapped state, forming the spring resin part that springs out from the bundle of synthetic resin core members to the same height as the thick metal circuit, and inserting the part into the opening And a step of drilling a hole.

The manufacturing method of the thick metal circuit embedded substrate according to the second aspect of the present invention includes a step of cutting, press punching, or electric discharge machining a metal plate to form a thick metal circuit, and forming a part insertion hole opening. A step of temporarily joining the thick metal circuit so as to close the opening on the resist member provided, and the thick metal circuit is in contact with each of the upper surface and the lower surface of a bundle of a plurality of synthetic resin core members, Heating and pressure forming press processing is performed in a state where the resist members are positioned so as to be positioned on the outside, and the spring resin portion that springs out from the bundle of synthetic resin core members is formed to be the same height as the thick metal circuit. And a step of drilling a component insertion hole in the opening.

According to the thick metal circuit-embedded substrate and the manufacturing method thereof of the present invention, the resin that springs out from the plurality of core members by heating and pressurizing can cope with a large current by embedding the thick metal circuit to the upper end. , to improve the voltage resistance, also, the so resist member covers except opening parts insertion hole, it is possible to avoid having to the source Ruda resist printing. Further, by going through the seep resin, it is possible to narrow the inter-end edge of the circuit, allowing downsizing.

According to the thick metal circuit-embedded substrate and the manufacturing method thereof of the present invention, in the heating / pressure forming press step, the resin that springs out is suppressed by the resist member, and the height of the circuit and the height of the springing resin portion are made the same. Can hold.

A thick metal circuit-embedded substrate and a manufacturing method thereof according to the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a configuration of a thick metal circuit embedded substrate according to the present invention, and FIGS. 2 to 5 are explanatory views of a manufacturing process.

As shown in FIG. 1, Thick metal circuit embedded board according to the present invention, a bundle a plurality of synthetic resin core member bundle 5 (for example a thickness 0.15 mm prepreg plate of four sleeping heavy The thick metal circuit 4 and the well resin part 6 are formed at the same height on both sides, and the upper surfaces of the thick metal circuit 4 and the well resin part 6 are covered with the resist member 1. The component insertion hole 7 is drilled.

First, explain the manufacturing method of the first aspect of the present invention. As shown in FIGS . 2 and 3, based on a desired circuit design, a metal plate 3, for example, copper, in which a resist insertion member 1 is pre-pierced with a component insertion hole opening 2 and the adhesive surface is roughened. A thick metal circuit 4 is formed by pre-polishing and post-etching etching using aluminum, brass or the like, with a minimum thickness of 0.1 mm or more being placed and temporarily bonded.

Resist member 1, for example, it can be used KYOCERA Chemical Co. halogen-free bonding sheet TFA-89 0 made of a thermosetting resin.

In the following, as shown in FIGS. 4 and 5, with the heavy weight metal circuit 4 on the top and bottom surfaces of the bundle 5 of a plurality of synthetic resin core member superposed in contact respectively, heating and pressing the press Processing is performed, and the spring resin portion 6 springing out from the bundle 5 of synthetic resin core members is formed to be the same height as the thick metal circuit 4.

Finally, as shown in FIG. 1, a part insertion hole 7 is formed in the opening 2, and a desired finishing process is performed to produce a thick metal circuit embedded substrate.

The production how the second aspect of the present invention, the resist member 1 bored openings 2 for the parts insertion hole 7, for example cutting, thick material metal formed by means such as press-punching, electrical discharge machining The circuit 4 is mounted and temporarily bonded. The remaining steps are the same as in the first aspect .

It is a longitudinal cross-sectional view which shows the structure of a thick metal circuit embedding board. It is explanatory drawing of a manufacturing process. It is explanatory drawing of a manufacturing process. It is explanatory drawing of a manufacturing process. It is explanatory drawing of a manufacturing process.

1 registration member 2 parts insertion bundle 6 gush resin part 7 parts insertion holes in opening 3 the metal plate 4, thick metal circuit 5 plurality of synthetic resin core member

Claims (3)

A part insertion hole opening (2) is previously drilled in the resist member (1),
A metal plate (3) is temporarily bonded onto the resist member (1) and etched to form a thick metal circuit (4) so as to close the opening (2).
Alternatively, a thick metal circuit (4) formed in advance by cutting, press punching, or electric discharge machining treatment on the metal plate (3) is temporarily placed on the resist member (1) so as to close the opening (2). Create joints for each,
The thick metal circuit (4) is in contact with each of the upper surface and the lower surface of a bundle (5) of a plurality of synthetic resin core members, and the resist member (1) is superposed so that the resist member (1) is positioned outside. Press-molding press treatment, forming the resin portion (6) that springs out of the bundle (5) of synthetic resin core members to be the same height as the thick metal circuit (4),
A thick metal circuit-embedded board comprising a part insertion hole (7) formed in the opening (2) . Temporarily joining the metal plate (3) on the resist member (1) having the opening (2) for component insertion holes ;
Forming a thick metal circuit (4) so as to close the opening (2) by etching the metal plate (3) ;
The thick metal circuit (4) is in contact with each of the upper surface and the lower surface of a bundle (5) of a plurality of synthetic resin core members , and the resist member (1) is superposed so that the resist member (1) is positioned outside. A step of performing pressure molding press treatment and forming the spring resin portion (6) that springs out of the bundle (5) of the synthetic resin core member so as to have the same height as the thick metal circuit (4) ;
It said opening (2) a step you puncture set a parts insertion hole (7), a thick material metal circuit embedded board fabrication method characterized by comprising. Metal plate (3) cutting and forming a thick material metal circuit (4) press-punching, or electrical discharge machining to,
Temporarily bonding the thick metal circuit (4) so as to block the opening (2) on the resist member (1 ) having the opening (2) for component insertion holes ;
The thick metal circuit (4) is in contact with each of the upper surface and the lower surface of a bundle (5) of a plurality of synthetic resin core members, and the resist member (1) is superposed so that the resist member (1) is positioned outside. A step of performing pressure molding press treatment and forming the spring resin portion (6) that springs out of the bundle (5) of the synthetic resin core member so as to have the same height as the thick metal circuit (4) ;
It said opening (2) a step you puncture set a parts insertion hole (7), a thick material metal circuit embedded board fabrication method characterized by comprising.

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