JP4455952B2 - Probe for measurement - Google Patents
Probe for measurement Download PDFInfo
- Publication number
- JP4455952B2 JP4455952B2 JP2004240181A JP2004240181A JP4455952B2 JP 4455952 B2 JP4455952 B2 JP 4455952B2 JP 2004240181 A JP2004240181 A JP 2004240181A JP 2004240181 A JP2004240181 A JP 2004240181A JP 4455952 B2 JP4455952 B2 JP 4455952B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- contact
- folded portion
- bent
- shaped folded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 35
- 238000005259 measurement Methods 0.000 title description 14
- 238000005452 bending Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 229910001020 Au alloy Inorganic materials 0.000 claims description 5
- 239000003353 gold alloy Substances 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 238000007689 inspection Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
Description
この発明は、高周波チップデバイス測定用に適した測定用プローブ(接点)に係り、詳記すれば、被測定物との当接面に弾性を付与させた測定用プローブに関する。 The present invention relates to a measurement probe (contact) suitable for high-frequency chip device measurement, and more particularly to a measurement probe in which elasticity is imparted to a contact surface with an object to be measured.
高周波チップデバイス検査用、特にコンデンサーのフィルター検査用として、基板に多数の薄板状プローブ(接点)を固定し、このプローブを被測定物に当てて検査する測定用プローブは従来から公知である。 2. Description of the Related Art Conventionally, a measurement probe for fixing a large number of thin plate probes (contacts) on a substrate and inspecting the probe against an object to be measured is used for high-frequency chip device inspection, particularly for capacitor filter inspection.
この種従来の測定用プローブは、薄板状の銅合金に金メッキしたものが使用されていたが、被測定物当接面は金メッキの弾性が多少あるにすぎず、弾性は殆どない平坦なものであった。そのため被測定物に接触しないプローブが生じるので、強く接触させなければならなかったが、強く接触させて、多数回測定するとメッキがはがれて銅合金の面が露出する問題があった。このように銅合金の面が露出すると酸化されるので、正確に測定し得ない問題が生じる。 This type of conventional measurement probe used was a thin plate copper alloy gold-plated, but the object contact surface was flat with little gold-plating elasticity and almost no elasticity. there were. For this reason, a probe that does not come into contact with the object to be measured is generated, and it has to be brought into strong contact. Thus, since the surface of the copper alloy is exposed and oxidized, there arises a problem that it cannot be measured accurately.
この発明は、このような点に着目してなされたものであり、請求項1記載の発明は、被測定物に確実に容易に接触し得るようにした測定用プローブを提供することを目的とする。 The present invention has been made paying attention to such points, and an object of the present invention is to provide a measurement probe that can be reliably and easily brought into contact with an object to be measured. To do.
また、請求項2記載の発明は、上記目的に加えて、全てのプローブを被測定物に容易に確実に接触し得るようにした測定用プローブを提供することを目的とする。 In addition to the above object, an object of the present invention is to provide a measurement probe that can easily and reliably contact all the probes with the object to be measured.
上記目的に沿う本発明のうち請求項1記載の発明は、バネ性を有する細長く薄い金属板を、基部から上方に折り曲げ、折り曲げた起立部から前記基部方向に折り曲げ折り返えすことにより、折り返し部が凸起部となるように略U字状の折り返し部を形成し、前記略U字状の折り返し部を、前記起立部に接触する部位から更に基部方向に折曲して、第2の略U字状の折り返し部を形成し、基部の長さを、前記折り返し部よりも長く形成し、前記第2の略U字状の折り返し部先端を該長く形成した部位に接触させて、弾性を付与させたことを特徴とする。 According to one aspect of the present invention along above object, the elongated thin metal plate having a spring property, bending from the base upwards, by to Kaee folding bent from the bent upright portion to the base direction, the folded portion There is formed a substantially U-shaped folded portion such that the protrusion portion, the substantially U-shaped folded portion, by bending the further base part direction from the portion in contact with the upright portion, the second An approximately U-shaped folded portion is formed, the length of the base is longer than that of the folded portion, and the tip of the second substantially U-shaped folded portion is brought into contact with the elongated portion so as to be elastic. It is characterized by giving.
また請求項2記載の発明は、バネ性を有する細長く薄い金属板を、基部から上方に折り曲げ、折り曲げた起立部から前記基部方向に折り曲げ折り返えすことにより、折り返し部が凸起部となるように略U字状の折り返し部を形成し、前記略U字状の折り返し部を、前記起立部に接触する部位から更に基部方向に折曲して、第2の略U字状の折り返し部を形成し、この先端部からまた基部方向に折り曲げて第3の略U字状の折り返し部を形成し、前記第3の略U字状の折り返し部先端を前記基部に接触させて、弾性を付与させたことを特徴とする。The invention according to claim 2 is configured such that a long and thin metal plate having a spring property is bent upward from a base portion and folded back from the bent standing portion toward the base portion so that the folded portion becomes a protruding portion. A substantially U-shaped folded portion is formed, and the substantially U-shaped folded portion is further bent in a base direction from a portion in contact with the upright portion to form a second substantially U-shaped folded portion. Forming a third substantially U-shaped folded portion by bending the distal end portion toward the base portion, and bringing the third substantially U-shaped folded portion distal end into contact with the base portion to provide elasticity. It was made to be characterized.
要するに本発明は、従来バネ性のなかった測定用プローブにバネ性を付与させることによって、被測定物に確実に容易に接触し得るようにしたことを要旨とするものである。また、バネ性を有する部分を平坦な部分より凸起するように形成することによって、バネ性を有する部分を被測定物に更に当接し易く且つ安定化するようにしたものである。しかして従来、この種プローブ(接点)でバネ性のあるものについても、段差を形成したものについても市販されていないし、このような発想も知られていない。また、プローブが安定化するということは、高周波プローブとしては重要なことであり、不安定に接触したのでは高周波用として使用し得ない。 In short, the gist of the present invention is that the measurement probe, which has not been provided with a conventional spring property, is provided with a spring property so that it can be easily and easily brought into contact with an object to be measured. In addition, the portion having the spring property is formed so as to protrude from the flat portion so that the portion having the spring property is more easily brought into contact with the object to be measured and is stabilized. Conventionally, this type of probe (contact point) having a spring property or a step formed thereon is not commercially available, and such an idea is not known. In addition, the fact that the probe is stabilized is important for a high-frequency probe, and cannot be used for high-frequency applications if it is in unstable contact.
以上述べた如く、請求項1に記載の発明によれば、被測定面当接面が弾性を有するので、基板上の全てのプローブを被測定面に容易に確実に接触させることができる。具体的には従来のプローブの1/10程度の力で被測定物に当接させることができる。
また、請求項2に記載の発明によれば、被測定面に当たる折曲部は、基部より凸起しているので、従来の平坦なプローブと比べて、全てのプローブを極めて確実に接触させ易くなると共に、安定して接触させることができるので高周波プローブとして極めて好適である。
As described above, according to the first aspect of the present invention, since the measured surface contact surface has elasticity, all the probes on the substrate can be easily and reliably brought into contact with the measured surface. Specifically, it can be brought into contact with the object to be measured with a force of about 1/10 of the conventional probe.
In addition, according to the second aspect of the invention, since the bent portion that hits the surface to be measured protrudes from the base portion, it is very easy to make all the probes contact with each other more reliably than the conventional flat probe. In addition, since it can be contacted stably, it is extremely suitable as a high-frequency probe.
次に、本発明の実施の形態を図面に基づいて説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
図1及び図2は、本発明の一実施例を示すものであり、リボン状金合金薄板の基部1から上方に向けて垂直に折曲し、折り曲げた起立部2先端から基部1の方向に水平に折り曲げ、同水平折曲部3から折り返して第1の略U字状折曲部4を形成し、同折曲部4を前記起立部2当接部から基部1方向に第2の略U字状折曲部5を形成するように折曲した例を示す。尚、基部1と第2の略U字状折曲部先端の当接部6とは、単に接触しているだけである。
1 and 2 show an embodiment of the present invention. The ribbon-shaped gold alloy thin plate is bent vertically from the
また、第2の略U字状折曲部5と垂直部2とも当接するように形成するのが好ましい。当接するように形成することによって、適度のバネ圧が付与されるからである。 Moreover, it is preferable to form so that the 2nd substantially U-shaped bending part 5 and the perpendicular | vertical part 2 may also contact | abut. This is because an appropriate spring pressure is applied by forming the contact portions.
上記実施例においては、略U字状の折曲部を2個形成し、図2に示すように、折曲部が略B字状になっているが、略U字状の折曲部は、2個でも3個でも良い。
In the above embodiment, two substantially U-shaped bent portions are formed, and the bent portion is substantially B-shaped as shown in FIG. 2, but the substantially U-shaped bent portion is , but it may also in the three be two.
本発明に使用するバネ性を有する金属としては、好ましくは金合金、特に好ましくは金―ニッケル合金を使用するのが良い。このような合金を使用すれば、従来の金メッキのように金メッキが剥がれて酸化し、使用し得なくなるという問題がなくなるからである。 As the metal having a spring property used in the present invention, a gold alloy, preferably a gold-nickel alloy is preferably used. If such an alloy is used, there is no problem that the gold plating is peeled off and oxidized like the conventional gold plating, and cannot be used.
上記実施例においては、略B字状折曲部よりも基部1の長さの方が長く形成されている。このように形成することによって、折曲部(略B字状部)は凸起部となるので、被測定面に接触させ易くなると共に測定用プローブが安定化することから好ましい。
In the said Example, the length of the
本発明に使用する薄板の厚さは、好ましくは50〜100μ、特に好ましくは、60〜80μである。また薄板の幅は、0.2〜1.0mm、特に好ましくは0.3〜0.6mmである。起立部2の高さは、好ましくは、0.2mm〜1.0mm特に好ましくは、0.3〜0.6mmである。基部1の長さは、0.5〜1.5mm、好ましくは、0.6〜1.0mmである。略B字状の折曲部の長さは、基部1の略中間程度とするのが好ましい。
The thickness of the thin plate used in the present invention is preferably 50 to 100 μ, particularly preferably 60 to 80 μ. The width of the thin plate is 0.2 to 1.0 mm, particularly preferably 0.3 to 0.6 mm. The height of the standing part 2 is preferably 0.2 mm to 1.0 mm, particularly preferably 0.3 to 0.6 mm. The length of the
上記実施例では、薄板の厚さは、70〜80μと60〜70μの2種類について行った。薄板の巾は0.4mm、起立部2の高さは、0.35〜0.4mm、基部1は0.8mm、折曲部の長さは0.4mmであった。
In the said Example, the thickness of the thin plate was performed about two types, 70-80micro and 60-70micro. The width of the thin plate was 0.4 mm, the height of the upright part 2 was 0.35 to 0.4 mm, the
本発明においては、線状体を使用しないで薄板を使用しているが、これは上端の水平折曲部3を被測定物に面接触させるためである。線状体を使用したのでは、面接触とはならずに点接触となるから不安定となり、検査の信頼性が損なわれる。
In the present invention, a thin plate is used without using a linear body. This is because the
本発明においては、通常は多数のプローブ(接点)の基部1を基板に固定し、折曲部上端水平折曲部3を被測定物に当接させて検査を行う。プローブの使用方法自体は、従来の測定用プローブ(接点)と同様にして行えば良いのは勿論である。本発明のプローブは、高周波チップデバイス検査用、特にコンデンサーのフィルター検査用として使用するのに適している。しかしながら、低周波チップデバイス検査用としても勿論使用することができる。
In the present invention, the
本発明によれば、この種従来の測定用プローブと異なり、被測定面に当接する方向に弾力性を有するので、多数の測定用プローブを基板に固定し、これを被測定面に当接させても、全てのプローブを容易に確実に被測定物に当接させることができる。しかも従来のように強い力で押圧する必要もないので、プローブ自体の使用寿命も著しく向上する。 According to the present invention, unlike this type of conventional measurement probe, since it has elasticity in the direction of contact with the surface to be measured, a large number of measurement probes are fixed to the substrate and made to contact the surface to be measured. However, all the probes can be easily and reliably brought into contact with the object to be measured. Moreover, since it is not necessary to press with a strong force as in the prior art, the service life of the probe itself is significantly improved.
また、本発明のプローブを金合金で形成すれば、従来のように金メッキが剥がれて正確に測定し得なくなる等の支障も生じないので、検査の信頼性も飛躍的に向上する。 Further, if the probe of the present invention is formed of a gold alloy, there is no trouble such that the gold plating is peeled off and accurate measurement cannot be performed as in the conventional case, so that the reliability of inspection is greatly improved.
更に、折曲部よりも基部1を長く形成すれば、折曲部は、基板上で凸起しているので、すべてのプローブの折り曲げ部を被測定面に接触させ易くなる。
Furthermore, if the
1・・………薄板の基部
2・・………起立部
3・・………水平折曲部
4・・………第1の略U字状折曲部
5・・………第2の略U字状折曲部
6・・………折曲部先端と基部との当接部
1 .... Base of thin plate 2 .... Standing
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004240181A JP4455952B2 (en) | 2004-08-20 | 2004-08-20 | Probe for measurement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004240181A JP4455952B2 (en) | 2004-08-20 | 2004-08-20 | Probe for measurement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006058133A JP2006058133A (en) | 2006-03-02 |
| JP4455952B2 true JP4455952B2 (en) | 2010-04-21 |
Family
ID=36105712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004240181A Expired - Fee Related JP4455952B2 (en) | 2004-08-20 | 2004-08-20 | Probe for measurement |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4455952B2 (en) |
-
2004
- 2004-08-20 JP JP2004240181A patent/JP4455952B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006058133A (en) | 2006-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6515496B2 (en) | Microstructure testing head | |
| JP2021085725A (en) | probe | |
| JP4859820B2 (en) | probe | |
| JP2003307525A (en) | Contact probe | |
| JP2006153723A (en) | Vertical coil spring probe and probe unit using the same | |
| JP4455952B2 (en) | Probe for measurement | |
| JP4571511B2 (en) | Probe for current test | |
| JP5088504B2 (en) | Contact for board inspection and method for manufacturing the same | |
| JP4008408B2 (en) | Probe card | |
| CN112526178A (en) | Probe and testing device | |
| JP2008151684A (en) | Electrical connection device and method of using the same | |
| JP4056983B2 (en) | Probe card | |
| JPH02206765A (en) | Probe card | |
| JP2004117081A (en) | Vertical probe unit and vertical probe card using the same | |
| JP2007127488A (en) | Probe card | |
| JP3908230B2 (en) | probe | |
| JP2014016204A (en) | Electric contact and contact method of electric contact | |
| JP6770798B2 (en) | Contact probe | |
| JPH06216215A (en) | Contact structure in probe card | |
| JP2007113946A (en) | Probe for current test | |
| JP2001357951A (en) | socket | |
| JP4743850B2 (en) | Vertical probe pin | |
| JPH0744052B2 (en) | IC Socket | |
| JPH0763785A (en) | Probe pin having semispheric front end | |
| JPH0745021Y2 (en) | Contact structure of probe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070817 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090910 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090914 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091023 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091109 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091225 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100115 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100204 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130212 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |