JPH0744052B2 - IC Socket - Google Patents
IC SocketInfo
- Publication number
- JPH0744052B2 JPH0744052B2 JP62109294A JP10929487A JPH0744052B2 JP H0744052 B2 JPH0744052 B2 JP H0744052B2 JP 62109294 A JP62109294 A JP 62109294A JP 10929487 A JP10929487 A JP 10929487A JP H0744052 B2 JPH0744052 B2 JP H0744052B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact surface
- package
- contact piece
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Connecting Device With Holders (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はフラット型ICパッケージの試験用のICソケッ
ト，特に高周波数ICを検査及び測定するのに好適なコン
タクトピンを有するICソケットに関する。The present invention relates to an IC socket for testing a flat type IC package, and more particularly to an IC socket having a contact pin suitable for inspecting and measuring a high frequency IC.
第３図示のようにフラット型ICパッケージ１は平坦な直
方体状をなし、その辺にリード端子2,2……を並設して
いる。なお図示のリード端子2,2……はむかでの脚状に
側方に突出しているが、パッケージ１の辺にループ状に
巻き着けたものもある。As shown in FIG. 3, the flat type IC package 1 has a flat rectangular parallelepiped shape, and the lead terminals 2, 2 ... Are arranged side by side on the side thereof. The lead terminals 2, 2, ... Shown in the drawings project laterally in the shape of a leg, but there are also those wound around the sides of the package 1 in a loop.
かかるフラット型ICパッケージ１の試験用のICソケット
４は、第３図及び第４図に例示した如く、ICパッケージ
１を収容する凹部５を有するソケット本体６と、該ソケ
ット本体６に植付けられたコンタクトピン３と、上記ソ
ケット本体６に枢支されていて上記凹部５内に装着され
たICパッケージ１或いはリード端子２を押してそのリー
ド端子２と上記コンタクトピン３とを接続させる押えカ
バー７とよりなり、上記押えカバー７は上記ソケット本
体６に枢支される（第３図参照）か又は上記押えカバー
７に枢支された（第４図参照）ロックレバー８によって
閉状態にロックされる。The IC socket 4 for testing the flat type IC package 1 is, as illustrated in FIGS. 3 and 4, a socket body 6 having a recess 5 for accommodating the IC package 1 and a socket body 6 embedded in the socket body 6. The contact pin 3 and the pressing cover 7 pivotally supported by the socket body 6 and pressing the IC package 1 or the lead terminal 2 mounted in the recess 5 to connect the lead terminal 2 and the contact pin 3 The holding cover 7 is pivotally supported on the socket body 6 (see FIG. 3) or is locked in a closed state by a lock lever 8 pivotally supported on the holding cover 7 (see FIG. 4).
上記コンタクトピン３は薄い弾性板を打ち抜いて形成し
たもので、ソケット本体６内には上記リード端子2,2…
…と対応する位置に並設され、第３図に示す如くリード
端子2,2……と弾性的に接触するためにその上部接着部
はヘアピン状に折り曲げてばね部としているのが一般的
である また本件出願人はコンタクトピンの接触面が斜面をなす
ものを実願昭61−200111号として出願した。The contact pin 3 is formed by punching out a thin elastic plate, and the lead terminals 2, 2 ...
It is generally arranged in a position corresponding to ... and is elastically contacted with the lead terminals 2, 2 as shown in Fig. 3 so that the upper adhesive part is bent into a hairpin shape to form a spring part. In addition, the applicant of the present application has filed as a Japanese Patent Application No. 61-200111 in which the contact surface of the contact pin is a slope.
しかしながら、これでは電流の流路がばね部を通るルー
プ状通路となるため、ICパッケージ１のリード端子２か
らコンタクトピン３の下端までの距離が長くなると共
に、そのループ部によるＬ成分すなわち自己インダクタ
ンスが10nH強程度と高くなり、高周波特性を正確に検査
することが不可能となっていた。特にこの自己インダク
タンスによる障害は100MHz以上のような高周波の場合著
しく大きい。However, in this case, the flow path of the current becomes a loop-shaped passage passing through the spring portion, so that the distance from the lead terminal 2 of the IC package 1 to the lower end of the contact pin 3 becomes long, and the L component due to the loop portion, that is, the self-inductance is increased. Became as high as about 10 nH, making it impossible to accurately inspect high-frequency characteristics. In particular, the disturbance due to this self-inductance is extremely large at high frequencies such as 100 MHz or higher.
また、先に出願（実願昭61−200111号）のICソケットに
おいては、コンタクトピンの接触面の形状を傾斜面とし
たため、ICパッケージを載置してばね接触片を押圧し上
記傾斜した接触面で接触させると、定位置迄押圧するの
に相当の押圧力を要し、ICパッケージ１のリード端子２
に悪影響（折損等により誤接触、接触不良等を生じる）
を及ぼす。Further, in the IC socket of the application (Japanese Patent Application No. 61-200111) previously filed, since the contact surface of the contact pin has an inclined surface, the IC package is placed and the spring contact piece is pressed to contact the inclined contact. When they are brought into contact with each other, a considerable pressing force is required to press them to a fixed position, and the lead terminals 2 of the IC package 1
Adversely affect (causes breakage, etc., causing incorrect contact, poor contact, etc.)
Exert.
本発明はかかる欠点を除去するもので、そのコンタクト
ピン３を改良することにより押圧力が少なくて済むよう
にした高周波用ICのテスト用に好適なコンタクトピンを
有するICソケットを提供するものである。The present invention eliminates such drawbacks, and provides an IC socket having a contact pin suitable for testing a high-frequency IC, which requires less pressing force by improving the contact pin 3. .
本発明は、ICパッケージ１のリード端子２と接触する一
枚の平板を打ち抜き加工することで作られたコンタクト
ピン３を並設してなるICソケットにおいて、前記コンタ
クトピン３は、基部3bに対し一方側には回路への接続端
子3aが延設され、他方側の該接続端子3aに略対応した位
置には上部の傾斜した誘導部3iとそれに連続して該基部
3bに略直角の接触面3eを有する第１接触片3cが延設さ
れ、更に該基部3bから該第１接触片3cと同一側にはばね
作用部3dを介して延び、自由端部側に前記接触面3eと離
隔し且つ接触可能に配設された接触面3fと前記ICパッケ
ージのリード端子２が載置されて押圧される接触端部と
を有した第２接触片3gが形成されてなり、接触端部上に
リード端子２が載置されて押圧されたとき、第２接触片
3gの接触面3fが、ばね作用部の偏倚力を伴って第１接触
片3cの接触面3eに押圧摺動し、接触端部に対する押圧の
解除でばね作用部の弾性復元力により、両接触面3e,3f
が再び隔離するように構成したことを特徴とするICソケ
ットである。The present invention is an IC socket in which contact pins 3 made by punching a flat plate that comes into contact with the lead terminals 2 of an IC package 1 are arranged in parallel. A connection terminal 3a to the circuit is extended on one side, and an inclined guiding part 3i on the upper side and the base part continuous to the guiding part 3i are provided at a position substantially corresponding to the connection terminal 3a on the other side.
A first contact piece 3c having a contact surface 3e at a substantially right angle is extended to 3b, and further extends from the base portion 3b on the same side as the first contact piece 3c via a spring acting portion 3d and to the free end side. A second contact piece 3g is formed which has a contact surface 3f which is separated from the contact surface 3e and is arranged to be contactable therewith, and a contact end portion on which the lead terminal 2 of the IC package is placed and pressed. When the lead terminal 2 is placed on the contact end and pressed, the second contact piece
The contact surface 3f of 3g is pressed and slid on the contact surface 3e of the first contact piece 3c with the biasing force of the spring action portion, and the elastic restoring force of the spring action portion releases the pressure on the contact end portion to cause both contacts. Surface 3e, 3f
The IC socket is characterized in that it is configured to be isolated again.
ICパッケージ１のリード端子２によって第２接触片3gの
接触端部が押圧されると接触面3e,3fが僅かかつ一定の
押圧力で圧接するので、ICパッケージ１のリード端子2,
第２接触片3g,第１接触片3c,基部3b,接続端子3aを通し
て電流が流れ、ICパッケージ１とプリント基板との距離
が短くなると共に電流の流路は直線的になるので自己イ
ンダクタンスが３〜5nH程度以下に小さくなり、ICパッ
ケージ１の高周波特性を正確に測定することができると
共にリード端子２を傷めることがないものである。When the contact end portion of the second contact piece 3g is pressed by the lead terminal 2 of the IC package 1, the contact surfaces 3e, 3f are pressed with a slight and constant pressing force.
A current flows through the second contact piece 3g, the first contact piece 3c, the base portion 3b, and the connection terminal 3a, and the distance between the IC package 1 and the printed circuit board is shortened, and the current flow path is linear, so that the self-inductance is 3 The size is reduced to about 5 nH or less, the high frequency characteristics of the IC package 1 can be accurately measured, and the lead terminals 2 are not damaged.
第１図は本発明に係るコンタクトピンの第１実施例を示
すものでコンタクトピン３の接続端子3aは基部3bに対し
下方に垂直に延び、第１接触片3cは基部3bの接続端子3a
と略対応した位置の上縁より上方に延びる板でその上部
には該基部3bと略直角の接触面3eを形成する。ばね作用
部3dは基部3bの上縁他側より上方に延びて半円弧状に湾
曲する。第２接触片3gはそのばね作用部3dの端部より40
°〜50°好ましくは45°の角度で斜上方に延び、その下
縁には基部3bと略直角の第２の接触面3fを形成する。こ
の第２接触片3gの下縁の接触面3fは自由状態で第１接触
片3cの接触面3eとは平行に形成し、その間隔は0.1〜0.2
mm好ましくは0.1mm重なる状態にする。FIG. 1 shows a first embodiment of a contact pin according to the present invention. The connection terminal 3a of the contact pin 3 extends vertically downward with respect to the base portion 3b, and the first contact piece 3c has a connection terminal 3a of the base portion 3b.
A plate extending upward from the upper edge at a position substantially corresponding to is formed with a contact surface 3e at a substantially right angle with the base 3b on the upper part thereof. The spring action portion 3d extends upward from the other side of the upper edge of the base portion 3b and is curved in a semi-circular shape. The second contact piece 3g is 40 from the end of the spring action portion 3d.
The second contact surface 3f extends obliquely upward at an angle of 50 °, preferably 45 °, and a lower edge thereof forms a second contact surface 3f substantially perpendicular to the base 3b. The contact surface 3f at the lower edge of the second contact piece 3g is formed in parallel with the contact surface 3e of the first contact piece 3c in the free state, and the distance between them is 0.1 to 0.2.
mm, preferably 0.1 mm overlap.
上記コンタクトピン３はBeCuPよりなる厚さ0.3mmの板を
一体に打ち抜いたものである。この板の表面はNi下地２
μｍ以上のメッキ上にAuメッキ0.5μｍ以上のメッキ処
理をしたものである。The contact pin 3 is made by integrally punching a plate of BeCuP having a thickness of 0.3 mm. The surface of this plate is Ni substrate 2
Au plating is plated on 0.5 μm or more and 0.5 μm or more is plated.
各部の寸法は以下の通りである。The dimensions of each part are as follows.
接続端子3aの長さ5.2mm,幅0.5mm 基部3bの長さ1.0mm,幅10.5mm 第１接触片3cの高さ2.0mm,底辺2.5mm ばね作用部3dの幅0.3mm,曲率半径1.2mm 第２接触片3gの幅0.6mm,長さ6.0mm 上記装置において第２接触片3gの上端がICパッケージの
リード端子２と接触した後下方に押されるとばね作用部
3dが下方に撓んで先ずその下端3hは第１の接触片3cの誘
導斜面3iに接し、ばね作用部3dを右方に撓ませつつ僅か
斜下方に摺動する。その後第２の接触片3gに形成された
接触面3gが第１接触片3cの接触面3eに接し、その後は接
触面3fはばね作用部3dを側方（右方）に撓ませた状態で
接触面3e上を下方に摺動するもので、両者は常に接触状
態に保持されると共に第２接触片3gの動きが略上下動の
みとなるので、ICパッケージ１のリード端子２面を摺る
ことなくICパッケージ１のリード端子２面は損傷される
ことがないものである。なお、3f,3kは第１接触片3cと
第２接触片3gに形成されたストッパ面である。Connection terminal 3a length 5.2mm, width 0.5mm Base 3b length 1.0mm, width 10.5mm 1st contact piece 3c height 2.0mm, bottom 2.5mm Spring action part 3d width 0.3mm, curvature radius 1.2mm Width 0.6 mm, length 6.0 mm of the second contact piece 3g In the above device, when the upper end of the second contact piece 3g comes into contact with the lead terminal 2 of the IC package and is pushed downward, the spring action part
When 3d bends downward, first its lower end 3h contacts the guide slope 3i of the first contact piece 3c and slides slightly obliquely downward while bending the spring action portion 3d to the right. After that, the contact surface 3g formed on the second contact piece 3g contacts the contact surface 3e of the first contact piece 3c, and then the contact surface 3f bends the spring action portion 3d laterally (rightward). It slides downward on the contact surface 3e, and both are always kept in contact with each other, and the second contact piece 3g moves only up and down. Therefore, slide the lead terminal 2 surface of the IC package 1. Without this, the surface of the lead terminal 2 of the IC package 1 is not damaged. 3f and 3k are stopper surfaces formed on the first contact piece 3c and the second contact piece 3g.
第２図（イ）は本発明に係るコンタクトピンの第２実施
例を示すもので、第１図と略同じ形状であるが、第１接
触片3cとばね作用部3dの間隔が広く、第２接触片3gが横
方向に延びかつストッパ面3j,3kのない点が異なる。FIG. 2 (a) shows a second embodiment of the contact pin according to the present invention, which has substantially the same shape as that of FIG. 1, but has a wide gap between the first contact piece 3c and the spring action portion 3d. 2 The difference is that the contact piece 3g extends laterally and there is no stopper surface 3j, 3k.
第２図（ロ）は本発明の第３実施例を示すものでばね作
用部3d1の向きは前記実施例のものに対し直角をなす。FIG. 2 (B) shows a third embodiment of the present invention, in which the direction of the spring action portion 3d 1 is perpendicular to that of the above embodiment.
第２図（ハ）は本発明の第４実施例を示すもので接触面
3f1は半円状の突部である。FIG. 2 (c) shows a fourth embodiment of the present invention, in which the contact surface
3f 1 is a semicircular protrusion.
第２図（ニ）は本発明の第５実施例を示すもので接触面
3f2は山形の突部である。FIG. 2D shows a fifth embodiment of the present invention, in which the contact surface
3f 2 is a mountain-shaped protrusion.
第２図（ホ）は本発明の第６実施例を示すもので接触面
3f3はギザギザの凹凸形をなす。FIG. 2 (e) shows a sixth embodiment of the present invention, in which the contact surface
3f 3 has a jagged uneven shape.
以上のように本発明によれば、電流の流路が直線的かつ
短くなり、Ｌ（自己インダクタンス）成分が小さくなる
ので高周波用ICの検査・測定を正確に行うことができる
と共に押圧力は僅かで一定であるからICパッケージのリ
ード端子を傷めることがなく、またコンタクトピンのリ
ード端子は接触面から離間しているので単なる打抜きに
よるだけで製造と共に鍍金し易い。またコンタクトピン
の弾力を強くでき、金属疲労がないので接触圧が狂い難
く、測定誤差を生じないばかりでなく、その略直角の垂
直面により接触圧が一定で安定するという効果を奏す
る。As described above, according to the present invention, the current flow path is linear and short, and the L (self-inductance) component is small, so that high-frequency ICs can be accurately inspected and measured, and the pressing force is small. Since it is constant, the lead terminals of the IC package are not damaged, and the lead terminals of the contact pins are separated from the contact surface, so that they are easily punched together with the manufacturing process simply by punching. Further, since the contact pin can be made elastic and metal fatigue does not occur, the contact pressure does not easily change, a measurement error does not occur, and the contact surface is substantially constant and stable due to its substantially vertical surface.
第１図は本発明の第１実施例の正面図、第２図（イ）
（ロ）（ハ）（ニ）（ホ）は本発明の第2,3,4,5,6実施
例の正面図、第３図は従来のICパッケージとICソケット
の一部断面を示す側面図、第４図は従来の異なる他のIC
ソケットの斜視図である。 １……ICパッケージ、２……リード端子、３……コンタ
クトピン、４……ICソケット、3a……接続端子、3b……
基部、3c……第１接触片、3d……ばね作用部、3e……接
触面、3f……接触面、3g……第２接触片。FIG. 1 is a front view of the first embodiment of the present invention, and FIG. 2 (a).
(B) (c) (d) (e) are front views of the second, third, fourth, fifth and sixth embodiments of the present invention, and FIG. 3 is a side view showing a partial cross section of a conventional IC package and IC socket. Figures and 4 show other conventional ICs
It is a perspective view of a socket. 1 ... IC package, 2 ... lead terminal, 3 ... contact pin, 4 ... IC socket, 3a ... connection terminal, 3b ...
Base part, 3c ... first contact piece, 3d ... spring acting part, 3e ... contact surface, 3f ... contact surface, 3g ... second contact piece.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 村山 剛幸 東京都小平市上水本町1479番地 日立マイ クロコンピュータエンジニアリング株式会 社内 (72)発明者 堀口 幹城 東京都小平市上水本町1479番地 日立マイ クロコンピュータエンジニアリング株式会 社内 (72)発明者 福永 正美 埼玉県川口市並木２丁目30番１号 第一精 工株式会社内 (56)参考文献 実開 昭60−113991（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takeyuki Murayama 1479 Kamimizuhonmachi, Kodaira-shi, Tokyo In-house Hitachi Micro Computer Engineering Co., Ltd. Black Computer Engineering Co., Ltd. In-house (72) Inventor Masami Fukunaga 2-30-1 Namiki, Kawaguchi City, Saitama Daiichi Seiko Co., Ltd. (56) References: 60-113991
Claims (1)
の平板を打ち抜き加工することで作られたコンタクトピ
ンを並設してなるICソケットにおいて、前記コンタクト
ピンは、基部に対し一方側には回路への接続端子が延設
され、他方側の該接続端子に略対応した位置には上部の
傾斜した誘導部とそれに連続して該基部に略直角の接触
面を有する第１接触片が延設され、更に該基部から該第
１接触片と同一側にはばね作用部を介して延び、自由端
部側に前記接触面と離隔し且つ接触可能に配設された接
触面と前記ICパッケージのリード端子が載置されて押圧
される接触端部とを有した第２接触片が形成されてな
り、接触端部上にリード端子が載置されて押圧されたと
き、第２接触片の接触面が、ばね作用部の偏倚力を伴っ
て第１接触片の接触面に押圧摺動し、接触端部に対する
押圧の解除でばね作用部の弾性復元力により、両接触面
が再び隔離するように構成したことを特徴とするICソケ
ット。1. An IC socket in which contact pins made by punching a flat plate that comes into contact with a lead terminal of an IC package are provided side by side, wherein the contact pins are provided on one side with respect to a base portion. A connection terminal to the circuit is extended, and at a position substantially corresponding to the connection terminal on the other side, an inclined guiding portion on the upper side and a first contact piece having a contact surface at a substantially right angle to the base portion continuous to the guiding portion are extended. A contact surface which is provided on the free end side and extends from the base portion to the same side as the first contact piece via a spring action portion, and which is provided so as to be separated from and in contact with the contact surface and the IC package. A second contact piece having a contact end portion on which the lead terminal is placed and pressed, and when the lead terminal is placed and pressed on the contact end portion, The contact surface is the contact surface of the first contact piece with the biasing force of the spring action portion. IC socket pressing slide by an elastic restoring force of the spring acting portion with release of the pressure to the contact end, both contact surfaces is characterized by being configured to isolate again.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62109294A JPH0744052B2 (en) | 1987-05-01 | 1987-05-01 | IC Socket |
| US07/593,305 US5067904A (en) | 1986-12-29 | 1990-10-03 | IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62109294A JPH0744052B2 (en) | 1987-05-01 | 1987-05-01 | IC Socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63274076A JPS63274076A (en) | 1988-11-11 |
| JPH0744052B2 true JPH0744052B2 (en) | 1995-05-15 |
Family
ID=14506528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62109294A Expired - Fee Related JPH0744052B2 (en) | 1986-12-29 | 1987-05-01 | IC Socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744052B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0747828Y2 (en) * | 1989-07-21 | 1995-11-01 | 第一精工株式会社 | IC socket |
| JP2002367746A (en) * | 2001-05-31 | 2002-12-20 | Molex Inc | Socket and contact for test evaluation of semiconductor package |
| JP2006003800A (en) * | 2004-06-21 | 2006-01-05 | Optrex Corp | Display panel |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113991U (en) * | 1984-01-06 | 1985-08-01 | 日本電気株式会社 | IC socket |
-
1987
- 1987-05-01 JP JP62109294A patent/JPH0744052B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63274076A (en) | 1988-11-11 |
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