JP4469072B2 - Alkali-developable photocurable / thermosetting composition - Google Patents
Alkali-developable photocurable / thermosetting composition Download PDFInfo
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- JP4469072B2 JP4469072B2 JP2000262959A JP2000262959A JP4469072B2 JP 4469072 B2 JP4469072 B2 JP 4469072B2 JP 2000262959 A JP2000262959 A JP 2000262959A JP 2000262959 A JP2000262959 A JP 2000262959A JP 4469072 B2 JP4469072 B2 JP 4469072B2
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- Prior art keywords
- group
- compound
- acrylate
- meth
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000203 mixture Substances 0.000 title claims description 34
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 32
- 150000001875 compounds Chemical class 0.000 claims description 33
- VTJUKNSKBAOEHE-UHFFFAOYSA-N calixarene Chemical class COC(=O)COC1=C(CC=2C(=C(CC=3C(=C(C4)C=C(C=3)C(C)(C)C)OCC(=O)OC)C=C(C=2)C(C)(C)C)OCC(=O)OC)C=C(C(C)(C)C)C=C1CC1=C(OCC(=O)OC)C4=CC(C(C)(C)C)=C1 VTJUKNSKBAOEHE-UHFFFAOYSA-N 0.000 claims description 32
- -1 acrylate compound Chemical class 0.000 claims description 31
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 239000003513 alkali Substances 0.000 claims description 10
- 125000003566 oxetanyl group Chemical group 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 7
- 239000003085 diluting agent Substances 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 125000000466 oxiranyl group Chemical group 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 3
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 claims description 3
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 claims description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229940126062 Compound A Drugs 0.000 claims 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 39
- 238000006243 chemical reaction Methods 0.000 description 38
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 33
- 238000001723 curing Methods 0.000 description 16
- 239000000126 substance Substances 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 14
- 238000003786 synthesis reaction Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 11
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- DHZRPIBBMLXGQX-UHFFFAOYSA-N p-methylcalix[6]arene Chemical compound C1C(C=2O)=CC(C)=CC=2CC(C=2O)=CC(C)=CC=2CC(C=2O)=CC(C)=CC=2CC(C=2O)=CC(C)=CC=2CC(C=2O)=CC(C)=CC=2CC2=CC(C)=CC1=C2O DHZRPIBBMLXGQX-UHFFFAOYSA-N 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000012452 mother liquor Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 7
- 238000005160 1H NMR spectroscopy Methods 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 4
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 4
- MOBNLCPBAMKACS-UHFFFAOYSA-N 2-(1-chloroethyl)oxirane Chemical compound CC(Cl)C1CO1 MOBNLCPBAMKACS-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 239000005457 ice water Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- 229950000688 phenothiazine Drugs 0.000 description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 150000003983 crown ethers Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 150000004714 phosphonium salts Chemical class 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 2
- 239000005695 Ammonium acetate Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 229940043376 ammonium acetate Drugs 0.000 description 2
- 235000019257 ammonium acetate Nutrition 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- 238000010908 decantation Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- HZZUMXSLPJFMCB-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;acetate Chemical compound CC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 HZZUMXSLPJFMCB-UHFFFAOYSA-M 0.000 description 2
- JHYNXXDQQHTCHJ-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 JHYNXXDQQHTCHJ-UHFFFAOYSA-M 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 2
- DPKBAXPHAYBPRL-UHFFFAOYSA-M tetrabutylazanium;iodide Chemical compound [I-].CCCC[N+](CCCC)(CCCC)CCCC DPKBAXPHAYBPRL-UHFFFAOYSA-M 0.000 description 2
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 2
- IBWGNZVCJVLSHB-UHFFFAOYSA-M tetrabutylphosphanium;chloride Chemical compound [Cl-].CCCC[P+](CCCC)(CCCC)CCCC IBWGNZVCJVLSHB-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- AEFPPQGZJFTXDR-UHFFFAOYSA-M tetraphenylphosphanium;iodide Chemical compound [I-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 AEFPPQGZJFTXDR-UHFFFAOYSA-M 0.000 description 2
- WAGFXJQAIZNSEQ-UHFFFAOYSA-M tetraphenylphosphonium chloride Chemical compound [Cl-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 WAGFXJQAIZNSEQ-UHFFFAOYSA-M 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- 0 *CCC1(*)*NC1 Chemical compound *CCC1(*)*NC1 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- SUDVPELGFZKOMD-UHFFFAOYSA-N 1,2-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(C(C)C)C(C(C)C)=CC=C3SC2=C1 SUDVPELGFZKOMD-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
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Description
【0001】
【発明の属する技術分野】
本発明は、新規な光硬化性樹脂であるカリックスアレーン誘導体を含有するアルカリ現像型光硬化性・熱硬化性組成物に関する。
【0002】
【従来の技術】
カリックスアレーンは、フェノールとホルムアルデヒドの縮合により生成する環状オリゴマーである。カリックスアレーン及びその誘導体は、円錐台形の周側面に沿ってベンゼン環が配されたようなその特有の構造から、クラウンエーテルやシクロデキストリンに次ぐ、第三の包接化合物として注目され、これまで主に分子認識を中心とした研究がなされてきた。さらには、カリックスアレーンは安価なフェノールとホルムアルデヒドから容易に合成できること、その特有の構造から高い熱安定性を示すこと、及び分子サイズが小さく、その誘導体の成膜性が良好であることなどから、高機能材料としての応用が期待されている。
【0003】
近年、例えば特開平9−263560号や特開平11−43524号に記載のように、カリックスアレーンの水酸基に重合性不飽和基を化学修飾させて、光機能性を持たせたカリックスアレーン誘導体の報告がなされている。
しかしながら、アルカリ可溶性基と重合性不飽和基を併せ持つカリックスアレーン誘導体及びそれを用いたアルカリ現像型光硬化性・熱硬化性組成物に関する報告は未だなされていない。
【0004】
【発明が解決しようとする課題】
本発明は、前記のような特有の構造を有するカリックスアレーンの誘導体に着目してなされたものであり、その主たる目的は、液状のため取り扱い易く、かつ光硬化性とアルカリ可溶性を兼ね備えた耐熱性に優れるカリックスアレーン誘導体を用いた高耐熱性、高解像性のアルカリ現像型光硬化性・熱硬化性組成物を提供することにある。
さらに本発明の目的は、光硬化性・熱硬化性組成物を回路形成されたプリント基板上にコーティングし、仮乾燥を行ないタックフリーの塗膜を得た後、活性エネルギー線により選択的に露光し、未露光部を希アルカリ水溶液により現像することができ、その後熱硬化し、或いはさらに熱硬化前又は後にポストUV硬化を併用することにより硬化塗膜を形成できるアルカリ現像型の光硬化性・熱硬化性組成物を提供し、もって耐熱性、電気絶縁性、密着性、硬度、耐薬品性等に優れる硬化塗膜を提供することにある。
【0005】
【課題を解決するための手段】
前記目的を達成するために、本発明によれば、(A)下記一般式(1)で示される重合性不飽和基とフェノール性水酸基及び/又はカルボキシル基を併せ持つカリックスアレーン誘導体、(B)光重合開始剤、(C)アクリレート化合物及び/又はメタクリレート化合物からなる反応性希釈剤、(D)有機溶剤、(E)1分子内に少なくとも2個のオキシラン基又はオキセタニル基を有する熱硬化性化合物、及び(F)硬化促進剤を含有することを特徴とするアルカリ現像型光硬化性・熱硬化性組成物が提供される。
【化2】
なお、上記一般式(1)において、各官能基を含む部分(アルキルベンジル部分)はランダムでもブロックでもよく、また、m及び(1−m)はそれらの平均存在数を表わしている。
好適な態様においては、前記一般式(1)において、重合性不飽和基が、アクリロイル基、メタクリロイル基、ビニル基、プロペニル基、プロパルギル基、及び4−ビニルベンジル基よりなる群から選択される官能基を少なくとも1種以上含む。
【0006】
【発明の実施の形態】
本発明者らは、前記目的を達成するために鋭意研究した結果、特定の構造を有するカリックスアレーン誘導体が光硬化性、アルカリ可溶性、及び耐熱性を満たすことを見出し、さらに、このようなカリックスアレーン誘導体を適当な光重合開始剤及び熱硬化性成分と共存させることで、露光・現像後に熱硬化させ、或いはさらに熱硬化前又は後にポストUV硬化を併用することにより耐熱性、電気絶縁性、密着性、硬度、耐薬品性等に優れた硬化塗膜を形成できることを見出し、本発明を完成するに至ったものである。
【0007】
すなわち、本発明の前記一般式(1)で示されるカリックスアレーン誘導体(A)は、p−アルキルフェノールとホルムアルデヒドの縮合により生成するp−アルキルカリックスアレーンの水酸基を部分的に又は完全に化学修飾した点に特徴を有する。つまり、p−アルキルカリックスアレーンに重合性不飽和基を部分的に導入させることで光硬化性を持たせると同時に、一部の未修飾の水酸基をそのまま残存させること、又はその未修飾の水酸基の一部又は全部にさらにカルボキシル基を導入することで、アルカリ可溶性を付与したものであり、この光硬化性樹脂に未修飾水酸基及び/又はカルボキシル基が存在することによってアルカリ現像に利用することが可能となる。それゆえ、このようなカリックスアレーン誘導体を適当な光重合開始剤と共存させることで、光照射により容易に重合し、アルカリ溶液により現像可能な、高い熱安定性を示す光硬化性組成物が得られる。さらに、このようなカリックスアレーン誘導体をベースとした光硬化性組成物に、1分子内に少なくとも2個以上のオキシラン基又はオキセタニル基を有する熱硬化性化合物(エポキシ化合物又はオキセタン化合物)(E)及び硬化促進剤(F)等の熱硬化成分を含有させることで、後硬化(ポストキュア)により耐薬品性、耐熱性、硬度、密着性などの諸特性がさらに向上した硬化物が得られる。
【0008】
以下、本発明について詳細に説明すると、まず、本発明で用いるカリックスアレーン誘導体(A)の出発原料であるp−アルキルカリックスアレーンの合成は、p−アルキルフェノールとホルムアルデヒドを水酸化カリウムや水酸化ナトリウムなどの塩基性触媒の存在下で加熱反応させる従来公知の手法により容易に合成できる。従来公知の反応条件により3〜10量体のカリックスアレーンを選択的に合成することができるが、特に4〜8量体が好ましい。
【0009】
また、p−アルキルカリックスアレーンのアルキル基は、炭素数1〜12のものである必要がある。カリックスアレーンのp−位に電子供与性のアルキル基が導入されていることで、その後の化学修飾が容易になる。しかしながら、アルキル基の炭素数が12を超えると、得られるカリックスアレーン誘導体の耐熱性が劣化し易くなるため好ましくない。工業的見地からは、上記のアルキル基としてメチル基、エチル基、n−プロピル基、イソプロピル基、イソブチル基、t−ブチル基、t−オクチル基などが好ましく、耐熱性を考慮するとメチル基、エチル基、n−プロピル基、イソプロピル基、イソブチル基、t−ブチル基が好ましい。
【0010】
上記の重合性不飽和基の導入は、公知の方法に従い、p−アルキルカリックスアレーンとアクリル酸クロリド、メタクリル酸クロリドなどの不飽和基含有ハロゲン化物を適当な塩基の存在下、反応させることで製造することができる。塩基としては、水酸化ナトリウム、水酸化カリウム、ピリジン、トリエチルアミンなど無機及び有機塩基のいずれも使用可能である。反応温度は、用いる反応溶剤の沸点を超えなければいかなる温度でも可能であるが、経済性を考慮すると約0℃〜100℃の範囲が好ましい。より好ましくは、20℃〜70℃である。
【0011】
また、カリックスアレーン類に対する不飽和基含有ハロゲン化物の割合(仕込み時の当量割合)は、カリックスアレーンの水酸基1モルに対して0.1モル以上、2.5モル未満の範囲で任意に選択可能である。0.1モル未満では、得られる誘導体の光硬化性が低く、得られる硬化物の物性低下が生じる可能性がある。一方、2.5モル以上では、カリックスアレーン類の水酸基が全て反応してしまい、アルカリ可溶性が損なわれてしまうので好ましくない。
【0012】
さらに本発明では、アルカリ可溶性を向上させるために、未修飾の水酸基に部分的に又は未修飾の水酸基全てにカルボキシル基を導入することができる。このカルボキシル基の導入法は、例えば、無水コハク酸、テトラヒドロテレフタル酸無水物、ヘキサヒドロテレフタル酸無水物等の公知慣用の酸無水物類との付加反応、ブロモ酢酸、クロロ酢酸等のハロゲン化アルキルとの縮合反応等が挙げられる。
【0013】
本発明に用いる光重合開始剤(B)としては、活性エネルギー線の照射によりラジカルを発生するものであればいかなる化合物でも使用可能である。具体的には、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル等のベンゾインとそのアルキルエーテル類;アセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、4−(1−t−ブチルジオキシ−1−メチルエチル)アセトフェノン等のアセトフェノン類;2−メチルアントラキノン、2−アミルアントラキノン、2−t−ブチルアントラキノン、1−クロロアントラキノン等のアントラキノン類;2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2,4−ジイソプロピルチオキサントン、2−クロロチオキサントン等のチオキサントン類;アセトフェノンジメチルケタール、ベンジルジメチルケタール等のケタール類;ベンゾフェノン、4−(1−t−ブチルジオキシ−1−メチルエチル)ベンゾフェノン、3,3´,4,4´−テトラキス(t−ブチルジオキシカルボニル)ベンゾフェノン等のベンゾフェノン類;2−メチルチオ−1−[4−(メチルチオ)フェニル]−2−モルホリノ−プロパン−1−オンや2−ベンジル−2−ジメチルアミノ−1−(4−モルホリノフェニル)−ブタン−1−オン等のアミノアセトフェノン類;2,4,6−トリメチルベンゾイルホスフィンオキシド等のアルキルホスフィン類;9−フェニルアクリジン等のアクリジン類などが挙げられる。
【0014】
これらの活性エネルギー線の照射によりラジカルを発生する光重合開始剤(B)は、1種又は2種以上の混合物として使用することが可能であり、その配合量は、カリックスアレーン誘導体(A)100質量部に対して0.1〜30質量部の範囲とすることが好ましい。0.1質量部よりも少ない場合には、活性エネルギー線の照射を行なっても硬化しない、もしくは照射時間を増やす必要があり、適切な塗膜物性が得られなくなる。一方、30質量部を超えて多量に添加しても、光硬化性に変化はなく、経済的に好ましくない。
【0015】
本発明の光硬化性・熱硬化性組成物においては、活性エネルギー線による硬化を促進させるために、光重合促進剤もしくは増感剤を前記光重合開始剤(B)と併用してもよい。併用しうる光重合促進剤の具体例としては、トリエチルアミン、トリエタノールアミン、2−ジメチルアミノエタノール、N,N−ジメチルアミノ安息香酸エチルエステル、N,N−ジメチルアミノ安息香酸イソアミルエステル、ペンチル−4−ジメチルアミノベンゾエート等の三級アミン類などを挙げることができる。また、併用し得る増感剤の具体例としては、β−チオジグリコール等のチオエーテル類;(ケト)クマリン、チオキサンテン等の増感色素類、及びシアニン、ローダミン、サフラニン、マラカイトグリーン、メチレンブルー等の色素のアルキルホウ酸塩などが挙げられる。これらの光重合促進剤/増感剤は、それぞれ単独でもしくは2種以上を混合して使用してもよい。その使用量は、カリックスアレーン誘導体(A)100質量部に対し、0.1〜30質量部の割合が好ましい。
【0016】
さらに、組成物の粘度調整及び光硬化性向上のために反応性希釈剤(C)を配合することができる。この反応性希釈剤(C)は、所望の硬化特性に応じて、カリックスアレーン誘導体(A)100質量部に対し5〜500質量部の割合で配合することが好ましい。
【0017】
反応性希釈剤(C)としては、硬化反応に関与できる重合性基を有する化合物であればよく、単官能(メタ)アクリレート類及び/又は多官能(メタ)アクリレート類などの公知の反応性希釈剤が使用可能である。具体的な例としては、メチル(メタ)アクリレート、エチル(メタ)アクリレート、n−ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、イソデシル(メタ)アクリレート、ラウリル(メタ)アクリレート、トリデシル(メタ)アクリレート、ステアリル(メタ)アクリレート、メトキシポリエチレングリコール(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、イソボロニル(メタ)アクリレート、ベンジル(メタ)アクリレート、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、2−ヒドロキシブチル(メタ)アクリレート、ジメチルアミノエチル(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、グリセリンジ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ポリエステルアクリレート、及び二塩基酸無水物と1分子中に少なくとも1個以上の不飽和基を有するアルコールとの反応物を挙げることができる。なお、本明細書中において、(メタ)アクリレートとは、アクリレート、メタクリレート及びそれらの混合物を総称する用語である(他の類似の表現についても同様)。
【0018】
有機溶剤(D)としては、原料を溶解するものが好ましい。その使用量は、組成物が塗布方法に適した粘度となるように調整すればよいが、概ねカリックスアレーン誘導体(A)100質量部に対し50〜500質量部の割合で使用すればよい。有機溶剤の具体例としては、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノブチルエーテル等のアルコール類;エチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、ジプロピレングリコールモノメチルエーテルアセテート等のグリコールエステル類;ジエチレングリコールジメチルエーテル、ジプロピレングリコールジメチルエーテル、1,4−ジオキサン等のエーテル類;メチルイソブチルケトン、シクロヘキサノン等のケトン類;トルエン、キシレン等の炭化水素類などが挙げられる。
【0019】
前記の1分子内に少なくとも2個のオキシラン基又はオキセタニル基を有する熱硬化性化合物(E)は、多官能のエポキシ化合物(E−1)又はオキセタン化合物(E−2)である。
多官能エポキシ化合物(E−1)としては、例えば、ノボラック型エポキシ樹脂(例えばフェノール、クレゾール、ハロゲン化フェノール、アルキルフェノールなどのフェノール類とホルムアルデヒドとを酸触媒下で反応させて得られるノボラック類に、エピクロルヒドリン及び/又はメチルエピクロルヒドリンを反応させて得られるものであり、市販品としては日本化薬(株)製のEOCN−103、EOCN−104S、EOCN−1020、EOCN−1027、EPPN−201、BREN−S;ダウ・ケミカル社製のDEN−431、DEN−439;大日本インキ化学工業(株)製のN−730、N−770、N−865、N−665、N−673、N−695、VH−4150等)、ビスフェノールA型エポキシ樹脂(例えば、ビスフェノールA、ビスフェノールF、ビスフェノールS、テトラブロムビスフェノールAなどのビスフェノール類にエピクロルヒドリン及び/又はメチルエピクロルヒドリンを反応させて得られるものや、ビスフェノールAのグリシジルエーテルと前記ビスフェノール類の縮合物にエピクロルヒドリン及び/又はメチルエピクロルヒドリンを反応させて得られるもの等であり、市販品としては、油化シェルエポキシ(株)製のエピコート1004、エピコート1002;ダウ・ケミカル社製のDER−330、DER−337等)、トリスフェノールメタン型エポキシ樹脂(例えば、トリスフェノールメタン、トリスクレゾールメタン等とエピクロルヒドリン及び/又はメチルエピクロルヒドリンを反応させて得られるものであり、市販品としては日本化薬(株)製のEPPN−501、EPPN−502等)、トリス(2,3−エポキシプロピル)イソシアヌレート、ビフェニルグリシジルエーテル、その他脂環式エポキシ樹脂、アミノ基含有エポキシ樹脂、共重合型エポキシ樹脂、カルド型エポキシ樹脂、カリックスアレーン型エポキシ樹脂など公知慣用のエポキシ樹脂を単独で又は2種類以上を組み合わせて用いることができる。
【0020】
分子中に2つのオキセタン環を有する化合物の代表例としては、下記一般式(2)で示されるビスオキセタン類が挙げられる。
【化3】
上記一般式(2)において、R3は水素原子又は炭素数1〜6のアルキル基を表わし、R4は、炭素数1〜12の線状又は分岐状飽和炭化水素類、炭素数1〜12の線状又は分岐状不飽和炭化水素類、下記式(A)、(B)、(C)、(D)及び(E)で示される芳香族炭化水素類、式(F)及び(G)で示されるカルボニル基を含む直鎖状又は環状のアルキレン類、式(H)及び(I)で示されるカルボニル基を含む芳香族炭化水素類から選択される2つの原子価を持った基である。
【0021】
【化4】
式中、R5は、水素原子、炭素数1〜12のアルキル基、アリール基、又はアラルキル基を表わし、R6は、−O−、−S−、−CH2−、−NH−、−SO2−、−CH(CH3)−、−C(CH3)2−、又は−C(CF3)2−を表わし、R7は、水素原子又は炭素数1〜6のアルキル基を表わす。
【0022】
【化5】
式中、pは1〜12の整数を表わす。
【0023】
【化6】
【0024】
分子中に3つ以上のオキセタン環を有する化合物の代表例としては、下記一般式(3)で示されるような化合物の他、オキセタンとノボラック樹脂、ポリ(p−ヒドロキシスチレン)、カルド型オキセタン樹脂、カリックスアレーン類、カリックスレゾルシンアレーン、又はシルセスキオキサン等のシリコーン樹脂類などの水酸基を有する樹脂とのエーテル化物などが挙げられる。その他、オキセタン環を有する不飽和モノマーとアルキル(メタ)アクリレートとの共重合体等も挙げられる。
【化7】
上記一般式(3)において、R3は前記と同じ意味であり、R8は、前記エーテル化物の水酸基含有樹脂残基、下記式(J)、(K)及び(L)で示されるような炭素数1〜12の分岐状アルキレン基、式(M)、(N)及び(O)で示される芳香族炭化水素類である。また、rは残基R8に結合している官能基の数を表わし、3以上の整数、好ましくは3〜5000の整数である。
【0025】
【化8】
【0026】
【化9】
式中、R9は、水素原子、炭素数1〜6のアルキル基、又はアリール基を表わす。
前記したようなオキセタン化合物(E−2)は、単独で又は2種以上を組み合わせて用いることができる。
【0027】
前記熱硬化性化合物(エポキシ化合物又はオキセタン化合物)(E)の配合量は、前記カリックスアレーン誘導体(A)100質量部に対して5〜100質量部の割合が適当であり、好ましくは15〜60質量部である。
また、解像性の点からは、前記反応性希釈剤(C)や有機溶剤(D)に難溶性の微粒状のエポキシ化合物又はオキセタン化合物、あるいは難溶性のエポキシ化合物又はオキセタン化合物と可溶性のエポキシ化合物又はオキセタン化合物を組み合わせて用いることが好ましい。
【0028】
硬化促進剤(F)としては、三級アミン、三級アミン塩、四級オニウム塩、三級ホスフィン、イミダゾール誘導体及びクラウンエーテル錯体の中から任意に選択することが可能であり、これらを単独で又は2種以上混合して用いてもよい。その他、ホスホニウムイリドなど、公知の硬化促進剤を使用できる。
【0029】
三級アミンとしては、トリエチルアミン、トリブチルアミン、ピリジン、N,N´−ジメチル−4−アミノピリジン、DBU(1,8−ジアザビシクロ[5.4.0]ウンデカ−7−エン)、DBN(1,5−ジアザビシクロ[4.3.0]ノナ−5−エン)、DABCO(1,4−ジアザビシクロ[2.2.2]オクタン)などが挙げられる。
三級アミン塩としては、例えば、サンアプロ(株)製のU−CATシリーズなどが挙げられる。
【0030】
さらに、三級アミン又は三級ホスフィンと、カルボン酸あるいは酸性の強いフェノール類との付加反応により形成される四級オニウム塩も硬化促進剤として使用可能である。これらは、反応系に添加する前に四級塩を形成するか、もしくはそれぞれを別に添加して反応系中で四級塩形成を行なわせるいずれの方法でもよい。具体的には、トリブチルアミンと酢酸により得られるトリブチルアミン酢酸塩、トリフェニルホスフィンと酢酸により形成されるトリフェニルホスフィン酢酸塩等が挙げられる。
【0031】
四級オニウム塩としては、アンモニウム塩、ホスホニウム塩、アルソニウム塩、スチボニウム塩、オキソニウム塩、スルホニウム塩、セレノニウム塩、スタンノニウム塩、ヨードニウム塩等が挙げられる。特に好ましいものは四級アンモニウム塩及び四級ホスホニウム塩である。四級アンモニウム塩の具体例としては、テトラ−n−ブチルアンモニウムクロライド(TBAC)、テトラ−n−ブチルアンモニウムブロミド(TBAB)、テトラ−n−ブチルアンモニウムアイオダイド(TBAI)、及びテトラ−n−ブチルアンモニウムアセテート(TBAAc)等が挙げられる。四級ホスホニウム塩の具体例としては、テトラ−n−ブチルホスホニウムクロリド(TBPC)、テトラ−n−ブチルホスホニウムブロミド(TBPB)、テトラ−n−ブチルホスホニウムアイオダイド(TBBI)、テトラフェニルホスホニウムクロリド(TPPC)、テトラフェニルホスホニウムブロミド(TPPB)、テトラフェニルホスホニウムアイオダイド(TPPI)、エチルトリフェニルホスホニウムブロミド(ETPPB)、エチルトリフェニルホスホニウムアセテート(ETPPAc)などが挙げられる。
【0032】
三級ホスフィンとしては、炭素数1〜12個のアルキル基又はアリール基を有する三価の有機リン化合物であればよい。具体例としては、トリエチルホスフィン、トリブチルホスフィン、トリフェニルホスフィンなどが挙げられる。
【0033】
イミダゾール誘導体としては、イミダゾール、2−メチルイミダゾール、2−エチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニルイミダゾール、4−フェニルイミダゾール、1−シアノエチル−2−フェニルイミダゾール、1−(2−シアノエチル)−2−エチル−4−メチルイミダゾールなどが挙げられる。具体的に市販されているものとしては、例えば四国化成(株)製の2MZ−A、2MZ−OK、2PHZ、2P4BHZ、2P4MHZなどが挙げられる。また経時安定性向上を図るものとして、旭チバ(株)製のノバキュアHX−3721、HX−3748、HX―3741、HX−3088、HX―3722、HX−3742、HX−3921HP、HX−3941HP、HX―3613等も挙げられる。
【0034】
クラウンエーテル錯体としては、例えば、18−クラウン−6/又はジベンゾ18−クラウン−6/カリウム−tert−ブトキシド、カリウムフェノキシド、カリウムベンゾエーテル、塩化カリウム、臭化カリウム、よう化カリウム又はアンモニウムアセテート等が挙げられる。
【0035】
硬化促進剤(F)の使用量は、オキシラン基又はオキセタニル基1モルに対して0.1〜25モル%の範囲であり、好ましくは0.5〜20モル%であり、より好ましくは1〜15モル%である。硬化促進剤の使用量が、オキシラン基/オキセタニル基に対して0.1モル%よりも少ないと実用的な速度で硬化反応が進行し難く、一方、25モル%よりも多量に使用しても顕著な反応促進効果は見られないため、経済性の点で好ましくない。
【0036】
ところで、多官能オキセタン化合物は多官能エポキシ化合物に比べて室温下では反応性が低く安定であるが、100℃以上の加温下では優れた反応性を示すことが知られている。そのため、オキセタン化合物を含有する光硬化性・熱硬化性組成物はシェルフ・ライフ(保存寿命)が長く、一液型に組成することが可能となる。しかしながら、組成物調製から使用開始までに比較的時間を要する場合、前記のような熱硬化性成分を予め前記光硬化性・熱硬化性組成物に混合しておいた場合には回路板ブランクへの塗布前に増粘し易いので、使用に際して両者を混合して用いるのが望ましい。すなわち、前記多官能エポキシ化合物(E−1)又は多官能オキセタン化合物(E−2)を主体とした硬化剤溶液と、前記カリックスアレーン誘導体(A)を主体とし、これに前記硬化促進剤(F)等を配合した主剤溶液の二液型に組成し、使用に際してこれらを混合して用いることが好ましい。また、前記した光重合性モノマーや充填剤、着色顔料等を前記熱硬化性化合物(多官能エポキシ化合物又は多官能オキセタン化合物)の有機溶剤溶液に混合することもできる。
また、本発明の光硬化性・熱硬化性樹脂組成物は、多官能オキセタン化合物の優れたシェルフ・ライフとカリックスアレーン誘導体の優れた成膜性を利用して、ドライフィルムとすることができる。
【0037】
さらに、本発明の光硬化性・熱硬化性組成物には、硬化物の密着性、硬度、はんだ耐熱性などの特性を挙げる目的で、光反応性を損なわない範囲で、必要に応じて硫酸バリウム、酸化ケイ素、タルク、クレー、炭酸カルシウムなどの公知慣用の充填剤、フタロシアニングリーン、フタロシアニンブルー、酸化チタン、カーボンブラックなどの公知慣用の着色顔料、消泡剤、密着性付与剤、レベリング剤などの各種添加剤類を加えてもよい。
【0038】
上記のような各成分を配合して調製された光硬化性・熱硬化性組成物は、基板上に適当な方法で塗布し、活性エネルギー線の照射によって硬化させる。
例えば、レジストパターン形成の場合には、得られた光硬化性・熱硬化性組成物に前記したような反応性希釈剤(C)や有機溶剤(D)を添加したりして所望の粘度に調整した後、回路形成されたプリント配線板等の基材上に、スクリーン印刷法、カーテンコーティング法、ロールコーティング法、ディップコーティング法、スピンコーティング法などの適宜の塗布方法により塗布し、例えば約60〜120℃の温度で仮乾燥することで組成物中に含まれる有機溶剤を除去し、タックフリーの塗膜を形成する。その後、所定の露光パターンを形成したフォトマスクを通して選択的に活性エネルギー線により露光し、未露光部を希アルカリ水溶液により現像してレジストパターンを形成できる。さらに、例えば約140〜200℃の温度で加熱して熱硬化させることにより、密着性、はんだ耐熱性、耐薬品性、電気絶縁性、耐電蝕性等の諸特性に優れた硬化塗膜が形成できる。またさらには、熱硬化前又は後にポストUV硬化を行なうことにより、諸特性をさらに向上させることができる。
【0039】
上記現像に用いるアルカリ水溶液としては、水酸化ナトリウム、水酸化カリウム、炭酸ナトリウム、炭酸カリウム、珪酸ナトリウム、アンモニア、有機アミン、テトラメチルアンモニウムハイドロオキシドなどの水溶液が使用できる。
また、前記光硬化性・熱硬化性組成物を硬化させるための活性エネルギー線照射光源としては、低圧水銀灯、中圧水銀灯、高圧水銀灯、超高圧水銀灯、キセノンランプ、メタルハライドランプなどの工業的に利用し得る光源が適当である。その他、レーザー光線、電子線、X線などの公知の活性光線のいずれも用いることができる。
【0040】
【実施例】
以下に実施例を示し、本発明についてさらに具体的に説明するが、本発明が以下の実施例に限定されるものでないことは勿論である。なお、以下において「部」とあるのは、特に断りのない限り全て「質量部」を示す。
【0041】
合成例1
公知の方法で合成したp−メチルカリックス−[6]−アレーン1.20g(10ミリモル)とトリエチルアミン2.53g(25ミリモル)とフェノチアジン0.03mgをN−メチルピロリドン6mlに溶かし、その後アクリル酸クロリド1.81g(20ミリモル)を少量ずつ滴下し、さらに共洗い用のN−メチルピロリドンを6ml加えた。反応は室温で24時間行ない、反応終了後、反応母液を弱塩酸でpH4〜5に調整した氷水200mlに注ぎ、析出物を再沈殿により精製し、p−メチルカリックス−[6]−アレーンアクリレートを1.51g得た。
反応率は1H−NMRより算出し、平均で83.0%の反応率であった。また、この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0042】
合成例2
アクリル酸クロリドをメタクリル酸クロリド(10ミリモル)に変更した以外は、合成例1と同様に行なった。その結果、p−メチルカリックス−[6]−アレーンメタクリレート1.67gを得た。1H−NMRよりエステル化率は67%であった。この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0043】
合成例3
p−メチルカリックス−[6]−アレーン0.60g(5ミリモル)をN−メチルピロリドン6mlに溶解し、氷冷下で水酸化ナトリウム0.12g(5ミリモル)を加え、50℃で3時間攪拌した。その後、テトラブチルアンモニウムブロミド0.08g(0.25ミリモル)と2−クロロビニルエーテル0.50ml(4.1ミリモル)を加え、80℃で12時間攪拌した。反応終了後、反応母液を氷水に注ぎ、デカンテーションにより油状物を回収した。それをクロロホルムに溶解し、水洗後、無水硫酸マグネシウムで乾燥させ、濃縮した後、メタノールに再沈殿させて精製することにより、粉末状の白色固体を得た。反応率は1H−NMRより算出し、平均で82.0%の反応率であった。また、この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0044】
合成例4
p−メチルカリックス−[6]−アレーン0.60g(5ミリモル)と水酸化カリウム0.34g(5ミリモル)をN−メチルピロリドン6mlに溶解し、室温で3時間攪拌した。その後、テトラブチルアンモニウムブロミド0.08g(0.25ミリモル)とプロパルギルブロミド0.40ml(3.9ミリモル)を加え、50℃で8時間攪拌した。反応終了後、反応母液を水に注ぎ、析出固体をろ別して回収した。それをクロロホルムに溶解し、水洗後、無水硫酸マグネシウムで乾燥させ、濃縮した後、メタノールに再沈殿させて精製することにより、粉末状の白色固体を得た。反応率は1H−NMRより算出し、平均で78.0%の反応率であった。また、この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0045】
合成例5
p−メチルカリックス−[6]−アレーン0.60g(5ミリモル)と水酸化カリウム0.17g(2.5ミリモル)をN−メチルピロリドン6mlに溶解し、室温で3時間攪拌した。その後、テトラブチルアンモニウムブロミド0.08g(0.25ミリモル)とアリルブロミド0.235ml(2.5ミリモル)を加え、50℃で8時間攪拌した。反応終了後、反応母液を氷水に注ぎ、析出固体をろ別して回収した。それをクロロホルムに溶解し、水洗後、無水硫酸マグネシウムで乾燥させ、濃縮した後、メタノールに再沈殿させて精製することにより、粉末状の白色固体を得た。反応率は1H−NMRより算出し、平均で50.0%の反応率であった。
得られた白色粉末0.40g(2.5ミリモル)とカリウム−tert−ブトキシド0.14g(1.25ミリモル)をN−メチルピロリドン6mlに溶解し、80℃で24時間撹拌した。反応終了後、反応母液を水に注ぎ、析出固体をろ別して回収した。それをクロロホルムに溶解し、水洗後、無水硫酸マグネシウムで乾燥させ、濃縮した後、メタノールに再沈殿させて精製することにより、粉末状の白色固体を得た。アリル基のプロペニル基への異性化率は100%であった。また、この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0046】
合成例6
p−メチルカリックス−[6]−アレーン0.60g(5ミリモル)をN−メチルピロリドン6mlに溶解し、氷冷下で水酸化ナトリウム0.12g(5ミリモル)を加え、50℃で3時間攪拌した。その後、テトラブチルアンモニウムブロミド0.08g(0.25ミリモル)と少量のフェノチアジン及びビニルベンジルクロリド0.76g(5ミリモル)をそれぞれ加え、80℃で12時間攪拌した。反応終了後、反応母液を氷水に注ぎ、デカンテーションにより油状物を回収した。それをクロロホルムに溶解し、水洗後、無水硫酸マグネシウムで乾燥させ、濃縮した後、メタノールに再沈殿させて精製することにより、粉末状の白色固体を得た。反応率は1H−NMRより算出し、平均で83.0%の反応率であった。また、この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0047】
合成例7
合成例1で合成したp−メチルカリックス−[6]−アレーンアクリレート(反応率83.0%)9.95gと少量のフェノチアジン、炭酸セシウム3.26g(10ミリモル)をN−メチルピロリドン6mlに溶解し、50℃で3時間攪拌した。その後、テトラフェニルホスホニウムブロミド0.16g(5モル%)、ブロモ酢酸2.78g(20ミリモル)を5mlのN−メチルピロリドンに溶解させた混合溶液を滴下し、80℃で24時間反応を行なった。反応終了後、反応母液を水に落とし、弱塩酸で酸析し、析出物をろ収した。それをクロロホルムに溶解し、水洗後、無水硫酸マグネシウムで乾燥させ、濃縮した後、n−へキサンにて再沈殿させて精製することにより、粉末状の褐色固体を得た。この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0048】
合成例8
合成例1と同様に合成したp−メチルカリックス−[6]−アレーンアクリレート(反応率50.0%)2.96gと少量のフェノチアジン、トリフェニルホスフィン0.070g(5モル%)、テトラヒドロフタル酸無水物3.09g(20ミリモル)を6mlのN−メチルピロリドンに溶解し、90℃で12時間反応を行なった。反応終了後、反応母液をクロロホルムに溶解し、水洗後、無水硫酸マグネシウムで乾燥させ、濃縮した後、n−へキサンにて再沈殿させて精製することにより、粉末状の褐色固体を得た。この化合物は、3%水酸化ナトリウム水溶液に可溶であった。
【0049】
実施例1〜8
前記合成例1〜8で得られた各カリックスアレーン誘導体を用いた下記の配合成分(主剤A成分/硬化剤B成分)を、それぞれ3本ロールミルを用いて混練し、2液形態の樹脂組成物を調製した。このようにして調製された2液形態の各樹脂組成物は、使用に際して主剤と硬化剤を混合して用いた。
【0050】
実施例9〜16
前記実施例1〜8において、A成分のジシアンジアミドをテトラフェニルホスホニウムブロミドに、またB成分のTEPICをキシリレンビスオキセタン(東亜合成化学工業(株)製)にそれぞれ代えたこと以外は同様にして2液形態の各樹脂組成物を調製した。
【0051】
比較例1
前記実施例1において、A成分中のジシアンジアミドとB成分中のTEPICを除いた以外は同様にして各樹脂組成物を調製した。
【0052】
性能評価:
(1)はんだ耐熱性
前記実施例1〜16及び比較例1で得られた各樹脂組成物を、回路形成されたプリント配線板にスクリーン印刷で約20μmの膜厚でそれぞれ全面塗布し、次いで80℃で30分加熱乾燥させた。その後、これらの基板にネガフィルムを介して所定の露光量にて露光を行なった。次いで、アルカリ水溶液で1分間現像を行なった後、さらに実施例1〜16については熱硬化を施して評価基板を作製した。
得られた各評価基板について、ロジン系フラックスを塗布して予め260℃に設定したはんだ槽に30秒間浸漬し、イソプロピルアルコールでフラックスを洗浄した後、目視によるレジスト層の膨れ・剥がれ・変色について評価した。
◎:全く変化が認められないもの
○:僅かに変化したもの
△:塗膜の膨れ、剥がれが20%以下のもの
×:塗膜の膨れ、剥がれが20%以上のもの
【0053】
(2)鉛筆硬度
JIS K−5400 6.14に準拠して測定した。
【0054】
上記各試験の結果を表1にまとめて示す。
【表1】
【0055】
【発明の効果】
以上説明したように、本発明の光硬化性・熱硬化性組成物は、重合性不飽和基を有すると共に水酸基及び/又はカルボキシル基を有し、かつ高い耐熱性を示す前記一般式(1)で示されるカリックスアレーン誘導体と、熱硬化性化合物(エポキシ化合物又はオキセタン化合物)を含有するため、光硬化性に優れると共にアルカリ水溶液により現像可能であり、しかも本発明の光硬化性・熱硬化性組成物から得られる硬化膜は、高い熱安定性を示し、また従来の(メタ)アクリレート系樹脂と比べて硬化収縮が小さく、後硬化(ポストキュア)によりはんだ耐熱性、硬度、密着性、電気絶縁性、耐電蝕性、耐薬品性などの諸特性に優れた硬化物が得られる。従って、本発明の光硬化性・熱硬化性組成物は、印刷板、プリント基板等のソルダ−レジスト、エッチングレジスト、メッキレジスト等、各種レジスト膜の形成や、多層回路作成の際の層間絶縁材として、さらには塗料や印刷インキ、ワニス、接着剤、表面被覆剤などとして有効に利用することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an alkali development type photocurable / thermosetting composition containing a calixarene derivative which is a novel photocurable resin.
[0002]
[Prior art]
Calixarene is a cyclic oligomer produced by the condensation of phenol and formaldehyde. Calixarene and its derivatives have attracted attention as a third inclusion compound after crown ether and cyclodextrin because of its unique structure in which a benzene ring is arranged along the peripheral surface of a frustoconical shape. Research has focused on molecular recognition. Furthermore, calixarene can be easily synthesized from inexpensive phenol and formaldehyde, exhibits high thermal stability from its unique structure, and has a small molecular size and good film formability of its derivatives. Application as a highly functional material is expected.
[0003]
In recent years, for example, as disclosed in JP-A-9-263560 and JP-A-11-43524, a calixarene derivative having a photofunctionality obtained by chemically modifying a hydroxyl group of calixarene with a polymerizable unsaturated group. Has been made.
However, there has not yet been reported a calixarene derivative having both an alkali-soluble group and a polymerizable unsaturated group, and an alkali-developable photocurable / thermosetting composition using the same.
[0004]
[Problems to be solved by the invention]
The present invention was made paying attention to the calixarene derivative having the above-mentioned unique structure, and its main purpose is heat resistance because it is liquid and easy to handle, and has both photocurability and alkali solubility. Another object of the present invention is to provide an alkali development type photocurable / thermosetting composition having high heat resistance and high resolution, which uses a calixarene derivative excellent in.
A further object of the present invention is to coat a photo-curable / thermosetting composition on a printed circuit board on which a circuit is formed, perform temporary drying to obtain a tack-free coating, and then selectively expose with active energy rays. In addition, an alkali-developable photocuring property that can be developed with a dilute alkaline aqueous solution, and then thermally cured, or can be further cured before or after thermal curing to form a cured coating film. An object of the present invention is to provide a thermosetting composition, and thus to provide a cured coating film having excellent heat resistance, electrical insulation, adhesion, hardness, chemical resistance and the like.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, (A) a calixarene derivative having both a polymerizable unsaturated group represented by the following general formula (1) and a phenolic hydroxyl group and / or a carboxyl group, (B) light Polymerization initiator, (C) Consists of acrylate compounds and / or methacrylate compounds An alkali comprising a reactive diluent, (D) an organic solvent, (E) a thermosetting compound having at least two oxirane groups or oxetanyl groups in one molecule, and (F) a curing accelerator. A development type photocurable / thermosetting composition is provided.
[Chemical formula 2]
In the above general formula (1), the portion containing each functional group (alkyl benzyl portion) may be random or block, and m and (1-m) represent the average number of them present.
In a preferred embodiment, in the general formula (1), the polymerizable unsaturated group is a functional group selected from the group consisting of acryloyl group, methacryloyl group, vinyl group, propenyl group, propargyl group, and 4-vinylbenzyl group. Contains at least one group.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
As a result of diligent research to achieve the above object, the present inventors have found that calixarene derivatives having a specific structure satisfy photocurability, alkali solubility, and heat resistance. By coexisting a derivative with an appropriate photopolymerization initiator and a thermosetting component, it is heat-cured after exposure / development, or further combined with post-UV curing before or after thermosetting, heat resistance, electrical insulation, adhesion The present inventors have found that a cured coating film having excellent properties, hardness, chemical resistance and the like can be formed, and have completed the present invention.
[0007]
That is, the calixarene derivative (A) represented by the general formula (1) of the present invention is obtained by partially or completely chemically modifying the hydroxyl group of the p-alkylcalixarene produced by the condensation of p-alkylphenol and formaldehyde. It has the characteristics. In other words, by partially introducing a polymerizable unsaturated group into the p-alkylcalixarene, the photocuring property is given, and at the same time, a part of the unmodified hydroxyl group is left as it is, or the unmodified hydroxyl group Alkali solubility is imparted by introducing a carboxyl group into part or all of it, and it can be used for alkali development due to the presence of unmodified hydroxyl groups and / or carboxyl groups in this photocurable resin. It becomes. Therefore, by coexisting such a calixarene derivative with an appropriate photopolymerization initiator, a photocurable composition exhibiting high thermal stability that can be easily polymerized by light irradiation and developed with an alkaline solution is obtained. It is done. Further, a photocurable composition based on such calixarene derivative is added to a thermosetting compound (epoxy compound or oxetane compound) (E) having at least two oxirane groups or oxetanyl groups in one molecule. By containing a thermosetting component such as a curing accelerator (F), a cured product in which various properties such as chemical resistance, heat resistance, hardness and adhesion are further improved by post-curing (post-cure).
[0008]
Hereinafter, the present invention will be described in detail. First, synthesis of p-alkylcalixarene, which is a starting material of the calixarene derivative (A) used in the present invention, is carried out by combining p-alkylphenol and formaldehyde with potassium hydroxide, sodium hydroxide or the like. It can be easily synthesized by a conventionally known method in which a heat reaction is carried out in the presence of the basic catalyst. Although 3 to 10-mer calixarene can be selectively synthesized under conventionally known reaction conditions, 4- to 8-mer is particularly preferable.
[0009]
Moreover, the alkyl group of p-alkyl calixarene needs to be a C1-C12 thing. The subsequent chemical modification is facilitated by introducing an electron-donating alkyl group at the p-position of calixarene. However, it is not preferred that the alkyl group has more than 12 carbon atoms because the heat resistance of the calixarene derivative obtained is likely to deteriorate. From an industrial standpoint, the alkyl group is preferably a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an isobutyl group, a t-butyl group, a t-octyl group or the like. Group, n-propyl group, isopropyl group, isobutyl group and t-butyl group are preferred.
[0010]
The introduction of the polymerizable unsaturated group is produced by reacting a p-alkylcalixarene with an unsaturated group-containing halide such as acrylic acid chloride or methacrylic acid chloride in the presence of an appropriate base according to a known method. can do. As the base, any of inorganic and organic bases such as sodium hydroxide, potassium hydroxide, pyridine and triethylamine can be used. The reaction temperature can be any temperature as long as it does not exceed the boiling point of the reaction solvent to be used, but it is preferably in the range of about 0 ° C. to 100 ° C. in consideration of economy. More preferably, it is 20 degreeC-70 degreeC.
[0011]
Moreover, the ratio of the unsaturated group-containing halide to the calixarene (equivalent ratio at the time of charging) can be arbitrarily selected within the range of 0.1 mol or more and less than 2.5 mol with respect to 1 mol of the hydroxyl group of the calixarene. It is. If it is less than 0.1 mol, the photocurability of the obtained derivative is low, and the physical properties of the obtained cured product may be lowered. On the other hand, when the amount is 2.5 mol or more, all the hydroxyl groups of the calixarene react and the alkali solubility is impaired, which is not preferable.
[0012]
Furthermore, in this invention, in order to improve alkali solubility, a carboxyl group can be introduce | transduced into an unmodified hydroxyl group partially or all unmodified hydroxyl groups. This method of introducing a carboxyl group includes, for example, addition reaction with known and conventional acid anhydrides such as succinic anhydride, tetrahydroterephthalic anhydride, hexahydroterephthalic anhydride, and alkyl halides such as bromoacetic acid and chloroacetic acid. And the like.
[0013]
As the photopolymerization initiator (B) used in the present invention, any compound can be used as long as it generates radicals upon irradiation with active energy rays. Specifically, benzoin such as benzoin, benzoin methyl ether, and benzoin ethyl ether and alkyl ethers thereof; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 4- (1-t-butyldioxy-1-methylethyl) Acetophenones such as acetophenone; anthraquinones such as 2-methylanthraquinone, 2-amylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4- Thioxanthones such as diisopropylthioxanthone and 2-chlorothioxanthone; Ketals such as acetophenone dimethyl ketal and benzyldimethyl ketal; Benzophenone, 4- (1-t-butyldioxy-1-methyl Benzophenones such as til) benzophenone and 3,3 ′, 4,4′-tetrakis (t-butyldioxycarbonyl) benzophenone; 2-methylthio-1- [4- (methylthio) phenyl] -2-morpholino-propane- Aminoacetophenones such as 1-one and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one; alkylphosphines such as 2,4,6-trimethylbenzoylphosphine oxide; 9 -Acridines such as phenylacridine.
[0014]
These photopolymerization initiators (B) that generate radicals upon irradiation with active energy rays can be used as one kind or a mixture of two or more kinds, and the blending amount thereof is calixarene derivative (A) 100. It is preferable to set it as the range of 0.1-30 mass parts with respect to a mass part. When the amount is less than 0.1 parts by mass, it is not cured even when active energy rays are irradiated, or the irradiation time needs to be increased, and appropriate physical properties of the coating film cannot be obtained. On the other hand, even if it is added in a large amount exceeding 30 parts by mass, there is no change in photocurability, which is not economically preferable.
[0015]
In the photocurable / thermosetting composition of the present invention, a photopolymerization accelerator or a sensitizer may be used in combination with the photopolymerization initiator (B) in order to promote curing by active energy rays. Specific examples of the photopolymerization accelerator that can be used in combination include triethylamine, triethanolamine, 2-dimethylaminoethanol, N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, and pentyl-4. -Tertiary amines such as dimethylaminobenzoate can be mentioned. Specific examples of sensitizers that can be used in combination include thioethers such as β-thiodiglycol; sensitizing dyes such as (keto) coumarin and thioxanthene, and cyanine, rhodamine, safranine, malachite green, and methylene blue. And alkyl borates of the above dyes. These photopolymerization accelerators / sensitizers may be used alone or in admixture of two or more. The amount used is preferably 0.1 to 30 parts by mass with respect to 100 parts by mass of the calixarene derivative (A).
[0016]
Furthermore, a reactive diluent (C) can be blended for adjusting the viscosity of the composition and improving photocurability. This reactive diluent (C) is preferably blended at a ratio of 5 to 500 parts by mass with respect to 100 parts by mass of the calixarene derivative (A) depending on the desired curing characteristics.
[0017]
The reactive diluent (C) may be any compound having a polymerizable group that can participate in the curing reaction, and known reactive dilutions such as monofunctional (meth) acrylates and / or polyfunctional (meth) acrylates. The agent can be used. Specific examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) ) Acrylate, tridecyl (meth) acrylate, stearyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, cyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, isobornyl (meth) acrylate, benzyl (meth) acrylate, 2 -Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, dimethylaminoethyl (meth) acrylate Ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, At least one glycerin di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, polyester acrylate, and dibasic acid anhydride per molecule And a reaction product with an alcohol having an unsaturated group. In the present specification, (meth) acrylate is a generic term for acrylate, methacrylate, and mixtures thereof (the same applies to other similar expressions).
[0018]
As an organic solvent (D), what melt | dissolves a raw material is preferable. The amount used may be adjusted so that the composition has a viscosity suitable for the coating method, but it may be used at a ratio of 50 to 500 parts by mass with respect to 100 parts by mass of the calixarene derivative (A). Specific examples of the organic solvent include alcohols such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monobutyl ether; ethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, Glycol esters such as propylene glycol monomethyl ether acetate and dipropylene glycol monomethyl ether acetate; ethers such as diethylene glycol dimethyl ether, dipropylene glycol dimethyl ether and 1,4-dioxane; ketones such as methyl isobutyl ketone and cyclohexanone; toluene, xylene and the like Such as hydrocarbons.
[0019]
The thermosetting compound (E) having at least two oxirane groups or oxetanyl groups in one molecule is a polyfunctional epoxy compound (E-1) or oxetane compound (E-2).
Examples of the polyfunctional epoxy compound (E-1) include novolak-type epoxy resins (for example, novolaks obtained by reacting phenols such as phenol, cresol, halogenated phenol, and alkylphenol with formaldehyde in the presence of an acid catalyst, It is obtained by reacting epichlorohydrin and / or methyl epichlorohydrin, and commercially available products include EOCN-103, EOCN-104S, EOCN-1020, EOCN-1027, EPPN-201, BPN- manufactured by Nippon Kayaku Co., Ltd. S: DEN-431, DEN-439 manufactured by Dow Chemical Company; N-730, N-770, N-865, N-665, N-673, N-695 manufactured by Dainippon Ink & Chemicals, Inc. VH-4150 etc.), bisphenol A type epoxy resin (for example, Products obtained by reacting bisphenols such as bisphenol A, bisphenol F, bisphenol S, and tetrabromobisphenol A with epichlorohydrin and / or methyl epichlorohydrin, or epichlorohydrin and / or condensates of glycidyl ether of bisphenol A and the bisphenols. Such as those obtained by reacting methyl epichlorohydrin, such as Epicoat 1004 and Epicoat 1002 manufactured by Yuka Shell Epoxy Co., Ltd .; DER-330 and DER-337 manufactured by Dow Chemical Co., Ltd.), Tris Phenolmethane type epoxy resin (for example, obtained by reacting trisphenolmethane, triskresol methane, etc. with epichlorohydrin and / or methylepichlorohydrin, commercially available EPPN-501 and EPPN-502 manufactured by Nippon Kayaku Co., Ltd.), tris (2,3-epoxypropyl) isocyanurate, biphenyl glycidyl ether, other alicyclic epoxy resins, amino group-containing epoxy resins, Known and commonly used epoxy resins such as a polymerization type epoxy resin, a cardo type epoxy resin, and a calixarene type epoxy resin can be used alone or in combination of two or more.
[0020]
Representative examples of compounds having two oxetane rings in the molecule include bisoxetanes represented by the following general formula (2).
[Chemical 3]
In the general formula (2), R Three Represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R Four Are linear or branched saturated hydrocarbons having 1 to 12 carbon atoms, linear or branched unsaturated hydrocarbons having 1 to 12 carbon atoms, the following formulas (A), (B), (C), ( D) Aromatic hydrocarbons represented by (E), linear or cyclic alkylenes containing carbonyl groups represented by formulas (F) and (G), represented by formulas (H) and (I) It is a group having two valences selected from aromatic hydrocarbons containing a carbonyl group.
[0021]
[Formula 4]
Where R Five Represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an aryl group, or an aralkyl group; 6 -O-, -S-, -CH 2 -, -NH-, -SO 2 -, -CH (CH Three )-, -C (CH Three ) 2 -Or -C (CF Three ) 2 -Represents R 7 Represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
[0022]
[Chemical formula 5]
In the formula, p represents an integer of 1 to 12.
[0023]
[Chemical 6]
[0024]
Representative examples of compounds having three or more oxetane rings in the molecule include compounds represented by the following general formula (3), oxetane and novolak resins, poly (p-hydroxystyrene), cardo-type oxetane resins. And etherified compounds with hydroxyl group-containing resins such as calixarenes, calixresorcinarene, and silicone resins such as silsesquioxane. In addition, a copolymer of an unsaturated monomer having an oxetane ring and an alkyl (meth) acrylate is also included.
[Chemical 7]
In the general formula (3), R Three Is as defined above, R 8 Is a hydroxyl group-containing resin residue of the etherified product, a branched alkylene group having 1 to 12 carbon atoms as shown by the following formulas (J), (K) and (L), formulas (M), (N) and Aromatic hydrocarbons represented by (O). R is a residue R 8 Represents the number of functional groups bonded to, and is an integer of 3 or more, preferably an integer of 3 to 5000.
[0025]
[Chemical 8]
[0026]
[Chemical 9]
Where R 9 Represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an aryl group.
The oxetane compound (E-2) as described above can be used alone or in combination of two or more.
[0027]
The amount of the thermosetting compound (epoxy compound or oxetane compound) (E) is appropriately 5 to 100 parts by mass, preferably 15 to 60 parts per 100 parts by mass of the calixarene derivative (A). Part by mass.
From the viewpoint of resolution, a finely divided epoxy compound or oxetane compound that is hardly soluble in the reactive diluent (C) or the organic solvent (D), or a slightly soluble epoxy compound or oxetane compound and a soluble epoxy. It is preferable to use a compound or an oxetane compound in combination.
[0028]
The curing accelerator (F) can be arbitrarily selected from tertiary amines, tertiary amine salts, quaternary onium salts, tertiary phosphines, imidazole derivatives, and crown ether complexes. Or you may use it in mixture of 2 or more types. In addition, a known curing accelerator such as phosphonium ylide can be used.
[0029]
Tertiary amines include triethylamine, tributylamine, pyridine, N, N′-dimethyl-4-aminopyridine, DBU (1,8-diazabicyclo [5.4.0] undec-7-ene), DBN (1, 5-diazabicyclo [4.3.0] non-5-ene), DABCO (1,4-diazabicyclo [2.2.2] octane) and the like.
Examples of the tertiary amine salt include U-CAT series manufactured by San Apro Co., Ltd.
[0030]
Furthermore, a quaternary onium salt formed by an addition reaction between a tertiary amine or tertiary phosphine and a carboxylic acid or a strongly acidic phenol can also be used as a curing accelerator. These may be any method in which a quaternary salt is formed before addition to the reaction system, or each is added separately to form a quaternary salt in the reaction system. Specific examples include tributylamine acetate obtained from tributylamine and acetic acid, and triphenylphosphine acetate formed from triphenylphosphine and acetic acid.
[0031]
Examples of the quaternary onium salt include ammonium salt, phosphonium salt, arsonium salt, stibonium salt, oxonium salt, sulfonium salt, selenonium salt, stannonium salt, iodonium salt and the like. Particularly preferred are quaternary ammonium salts and quaternary phosphonium salts. Specific examples of quaternary ammonium salts include tetra-n-butylammonium chloride (TBAC), tetra-n-butylammonium bromide (TBAB), tetra-n-butylammonium iodide (TBAI), and tetra-n-butyl. Ammonium acetate (TBAAc) etc. are mentioned. Specific examples of the quaternary phosphonium salt include tetra-n-butylphosphonium chloride (TBPC), tetra-n-butylphosphonium bromide (TBPB), tetra-n-butylphosphonium iodide (TBBI), and tetraphenylphosphonium chloride (TPPC). ), Tetraphenylphosphonium bromide (TPPB), tetraphenylphosphonium iodide (TPPI), ethyltriphenylphosphonium bromide (ETPPB), ethyltriphenylphosphonium acetate (ETPPAc), and the like.
[0032]
The tertiary phosphine may be a trivalent organic phosphorus compound having an alkyl group having 1 to 12 carbon atoms or an aryl group. Specific examples include triethylphosphine, tributylphosphine, triphenylphosphine and the like.
[0033]
Examples of imidazole derivatives include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1- (2- And cyanoethyl) -2-ethyl-4-methylimidazole. Specific examples of commercially available products include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, and 2P4MHZ manufactured by Shikoku Kasei Co., Ltd. Moreover, as a thing which aims at stability improvement with time, Asahi Ciba Co., Ltd. product NOVACURE HX-3721, HX-3748, HX-3741, HX-3088, HX-3722, HX-3742, HX-3721HP, HX-3941HP, Examples thereof include HX-3613.
[0034]
Examples of the crown ether complex include 18-crown-6 / or dibenzo 18-crown-6 / potassium-tert-butoxide, potassium phenoxide, potassium benzoether, potassium chloride, potassium bromide, potassium iodide, ammonium acetate, and the like. Can be mentioned.
[0035]
The usage-amount of a hardening accelerator (F) is the range of 0.1-25 mol% with respect to 1 mol of oxirane groups or oxetanyl groups, Preferably it is 0.5-20 mol%, More preferably, it is 1- 15 mol%. If the amount of the curing accelerator used is less than 0.1 mol% with respect to the oxirane group / oxetanyl group, the curing reaction is difficult to proceed at a practical rate. Since a remarkable reaction promoting effect is not seen, it is not preferable in terms of economy.
[0036]
By the way, it is known that the polyfunctional oxetane compound is less reactive and stable at room temperature than the polyfunctional epoxy compound, but exhibits excellent reactivity at a temperature of 100 ° C. or higher. Therefore, the photocurable / thermosetting composition containing an oxetane compound has a long shelf life (storage life) and can be formed into a one-pack type. However, when it takes a relatively long time from the preparation of the composition to the start of use, when the thermosetting component as described above is previously mixed with the photocurable / thermosetting composition, the circuit board blank is used. Since it is easy to increase the viscosity before coating, it is desirable to use a mixture of both. That is, the curing agent solution mainly composed of the polyfunctional epoxy compound (E-1) or the polyfunctional oxetane compound (E-2) and the calixarene derivative (A) are mainly composed of the curing accelerator (F It is preferable to use a mixture of these components in a two-part composition of the main agent solution blended with them. In addition, the above-described photopolymerizable monomer, filler, color pigment and the like can be mixed in an organic solvent solution of the thermosetting compound (polyfunctional epoxy compound or polyfunctional oxetane compound).
Moreover, the photocurable / thermosetting resin composition of the present invention can be made into a dry film by utilizing the excellent shelf life of the polyfunctional oxetane compound and the excellent film forming property of the calixarene derivative.
[0037]
Further, the photo-curable / thermosetting composition of the present invention is not limited to sulfuric acid as necessary within the range that does not impair the photoreactivity for the purpose of increasing the properties of the cured product, such as adhesion, hardness, and solder heat resistance. Known and conventional fillers such as barium, silicon oxide, talc, clay and calcium carbonate, known and commonly used color pigments such as phthalocyanine green, phthalocyanine blue, titanium oxide and carbon black, antifoaming agents, adhesion-imparting agents, leveling agents, etc. Various additives may be added.
[0038]
The photocurable / thermosetting composition prepared by blending the above components is applied onto the substrate by an appropriate method and cured by irradiation with active energy rays.
For example, in the case of resist pattern formation, the reactive viscosity (C) or organic solvent (D) as described above is added to the obtained photocurable / thermosetting composition to obtain a desired viscosity. After the adjustment, it is applied on a substrate such as a printed wiring board on which a circuit is formed by an appropriate application method such as a screen printing method, a curtain coating method, a roll coating method, a dip coating method, or a spin coating method. By temporarily drying at a temperature of ˜120 ° C., the organic solvent contained in the composition is removed, and a tack-free coating film is formed. Then, it can selectively expose with an active energy ray through the photomask which formed the predetermined exposure pattern, and can develop an unexposed part with a dilute alkaline aqueous solution, and can form a resist pattern. Furthermore, for example, a cured coating film excellent in various properties such as adhesion, solder heat resistance, chemical resistance, electric insulation, and electric corrosion resistance is formed by heating at a temperature of about 140 to 200 ° C. and thermosetting. it can. Furthermore, various properties can be further improved by performing post-UV curing before or after thermal curing.
[0039]
As the alkaline aqueous solution used for the development, aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium silicate, ammonia, organic amine, tetramethylammonium hydroxide and the like can be used.
In addition, as an active energy ray irradiation light source for curing the photocurable / thermosetting composition, industrial use such as a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, a metal halide lamp, etc. A possible light source is suitable. In addition, any known active light such as a laser beam, an electron beam, and an X-ray can be used.
[0040]
【Example】
The present invention will be described more specifically with reference to the following examples, but the present invention is of course not limited to the following examples. In the following description, “part” means “part by mass” unless otherwise specified.
[0041]
Synthesis example 1
1.20 g (10 mmol) of p-methylcalix- [6] -arene synthesized by a known method, 2.53 g (25 mmol) of triethylamine and 0.03 mg of phenothiazine are dissolved in 6 ml of N-methylpyrrolidone, and then acrylic acid chloride. 1.81 g (20 mmol) was added dropwise little by little, and 6 ml of N-methylpyrrolidone for co-washing was further added. The reaction is carried out at room temperature for 24 hours. After completion of the reaction, the reaction mother liquor is poured into 200 ml of ice water adjusted to pH 4-5 with weak hydrochloric acid, the precipitate is purified by reprecipitation, and p-methylcalix- [6] -arene acrylate is obtained. 1.51 g was obtained.
The reaction rate is 1 Calculated from 1 H-NMR, the average reaction rate was 83.0%. This compound was soluble in a 3% aqueous sodium hydroxide solution.
[0042]
Synthesis example 2
The same procedure as in Synthesis Example 1 was conducted except that acrylic acid chloride was changed to methacrylic acid chloride (10 mmol). As a result, 1.67 g of p-methylcalix- [6] -arene methacrylate was obtained. 1 The esterification rate was 67% from 1 H-NMR. This compound was soluble in 3% aqueous sodium hydroxide.
[0043]
Synthesis example 3
0.60 g (5 mmol) of p-methylcalix- [6] -arene is dissolved in 6 ml of N-methylpyrrolidone, 0.12 g (5 mmol) of sodium hydroxide is added under ice cooling, and the mixture is stirred at 50 ° C. for 3 hours. did. Thereafter, 0.08 g (0.25 mmol) of tetrabutylammonium bromide and 0.50 ml (4.1 mmol) of 2-chlorovinyl ether were added and stirred at 80 ° C. for 12 hours. After completion of the reaction, the reaction mother liquor was poured into ice water and an oily substance was recovered by decantation. It was dissolved in chloroform, washed with water, dried over anhydrous magnesium sulfate, concentrated, reprecipitated in methanol and purified to obtain a powdery white solid. The reaction rate is 1 Calculated from 1 H-NMR, the average reaction rate was 82.0%. This compound was soluble in a 3% aqueous sodium hydroxide solution.
[0044]
Synthesis example 4
0.60 g (5 mmol) of p-methylcalix- [6] -arene and 0.34 g (5 mmol) of potassium hydroxide were dissolved in 6 ml of N-methylpyrrolidone and stirred at room temperature for 3 hours. Thereafter, 0.08 g (0.25 mmol) of tetrabutylammonium bromide and 0.40 ml (3.9 mmol) of propargyl bromide were added and stirred at 50 ° C. for 8 hours. After completion of the reaction, the reaction mother liquor was poured into water, and the precipitated solid was collected by filtration. It was dissolved in chloroform, washed with water, dried over anhydrous magnesium sulfate, concentrated, reprecipitated in methanol and purified to obtain a powdery white solid. The reaction rate is 1 Calculated from 1 H-NMR, the average reaction rate was 78.0%. This compound was soluble in a 3% aqueous sodium hydroxide solution.
[0045]
Synthesis example 5
0.60 g (5 mmol) of p-methylcalix- [6] -arene and 0.17 g (2.5 mmol) of potassium hydroxide were dissolved in 6 ml of N-methylpyrrolidone and stirred at room temperature for 3 hours. Thereafter, 0.08 g (0.25 mmol) of tetrabutylammonium bromide and 0.235 ml (2.5 mmol) of allyl bromide were added and stirred at 50 ° C. for 8 hours. After completion of the reaction, the reaction mother liquor was poured into ice water, and the precipitated solid was collected by filtration. It was dissolved in chloroform, washed with water, dried over anhydrous magnesium sulfate, concentrated, reprecipitated in methanol and purified to obtain a powdery white solid. The reaction rate is 1 Calculated from 1 H-NMR, the average reaction rate was 50.0%.
0.40 g (2.5 mmol) of the obtained white powder and 0.14 g (1.25 mmol) of potassium tert-butoxide were dissolved in 6 ml of N-methylpyrrolidone and stirred at 80 ° C. for 24 hours. After completion of the reaction, the reaction mother liquor was poured into water, and the precipitated solid was collected by filtration. It was dissolved in chloroform, washed with water, dried over anhydrous magnesium sulfate, concentrated, reprecipitated in methanol and purified to obtain a powdery white solid. The isomerization rate of allyl groups to propenyl groups was 100%. This compound was soluble in a 3% aqueous sodium hydroxide solution.
[0046]
Synthesis Example 6
0.60 g (5 mmol) of p-methylcalix- [6] -arene is dissolved in 6 ml of N-methylpyrrolidone, 0.12 g (5 mmol) of sodium hydroxide is added under ice cooling, and the mixture is stirred at 50 ° C. for 3 hours. did. Thereafter, 0.08 g (0.25 mmol) of tetrabutylammonium bromide, a small amount of phenothiazine and 0.76 g (5 mmol) of vinylbenzyl chloride were added, and the mixture was stirred at 80 ° C. for 12 hours. After completion of the reaction, the reaction mother liquor was poured into ice water and an oily substance was recovered by decantation. It was dissolved in chloroform, washed with water, dried over anhydrous magnesium sulfate, concentrated, reprecipitated in methanol and purified to obtain a powdery white solid. The reaction rate is 1 Calculated from 1 H-NMR, the average reaction rate was 83.0%. This compound was soluble in a 3% aqueous sodium hydroxide solution.
[0047]
Synthesis example 7
9.95 g of p-methylcalix- [6] -arene acrylate (reaction rate 83.0%) synthesized in Synthesis Example 1 and a small amount of phenothiazine and 3.26 g (10 mmol) of cesium carbonate are dissolved in 6 ml of N-methylpyrrolidone. And stirred at 50 ° C. for 3 hours. Thereafter, a mixed solution in which 0.16 g (5 mol%) of tetraphenylphosphonium bromide and 2.78 g (20 mmol) of bromoacetic acid were dissolved in 5 ml of N-methylpyrrolidone was dropped, and the reaction was performed at 80 ° C. for 24 hours. . After completion of the reaction, the reaction mother liquor was dropped into water, acidified with weak hydrochloric acid, and the precipitate was collected by filtration. It was dissolved in chloroform, washed with water, dried over anhydrous magnesium sulfate, concentrated, reprecipitated with n-hexane and purified to obtain a powdery brown solid. This compound was soluble in 3% aqueous sodium hydroxide.
[0048]
Synthesis example 8
2.96 g of p-methylcalix- [6] -arene acrylate (reaction rate 50.0%) synthesized in the same manner as in Synthesis Example 1, a small amount of phenothiazine, 0.070 g (5 mol%) of triphenylphosphine, tetrahydrophthalic acid 3.09 g (20 mmol) of anhydride was dissolved in 6 ml of N-methylpyrrolidone and reacted at 90 ° C. for 12 hours. After completion of the reaction, the reaction mother liquor was dissolved in chloroform, washed with water, dried over anhydrous magnesium sulfate, concentrated, reprecipitated with n-hexane and purified to obtain a powdery brown solid. This compound was soluble in 3% aqueous sodium hydroxide.
[0049]
Examples 1-8
The following blending components (main component A component / curing agent B component) using each calixarene derivative obtained in Synthesis Examples 1 to 8 are kneaded using a three-roll mill, respectively, and a two-component resin composition Was prepared. Each of the two-component resin compositions thus prepared was used by mixing the main agent and the curing agent.
[0050]
Examples 9-16
In Examples 1 to 8, the same procedure was repeated except that A component dicyandiamide was replaced with tetraphenylphosphonium bromide and B component TEPIC was replaced with xylylene bisoxetane (manufactured by Toa Gosei Chemical Co., Ltd.). Each resin composition in liquid form was prepared.
[0051]
Comparative Example 1
Each resin composition was prepared in the same manner as in Example 1, except that dicyandiamide in component A and TEPIC in component B were omitted.
[0052]
Performance evaluation:
(1) Solder heat resistance
Each of the resin compositions obtained in Examples 1 to 16 and Comparative Example 1 was applied to the entire surface of the printed wiring board on which a circuit was formed with a film thickness of about 20 μm by screen printing. I let you. Thereafter, these substrates were exposed with a predetermined exposure amount via a negative film. Next, after developing for 1 minute with an alkaline aqueous solution, Examples 1 to 16 were further thermoset to prepare evaluation substrates.
About each obtained evaluation board, after applying a rosin system flux and immersing for 30 seconds in a solder tub set beforehand at 260 ° C and washing a flux with isopropyl alcohol, it is evaluated about swelling, peeling, and discoloration of a resist layer by visual observation. did.
A: No change is observed
○: Slightly changed
Δ: Swelling and peeling of coating film are 20% or less
X: Swelling and peeling of coating film are 20% or more
[0053]
(2) Pencil hardness
It measured based on JIS K-5400 6.14.
[0054]
The results of the above tests are summarized in Table 1.
[Table 1]
[0055]
【The invention's effect】
As described above, the photocurable / thermosetting composition of the present invention has the above-mentioned general formula (1) having a polymerizable unsaturated group and a hydroxyl group and / or a carboxyl group and exhibiting high heat resistance. And a thermosetting compound (epoxy compound or oxetane compound), it is excellent in photocurability and can be developed with an aqueous alkaline solution, and the photocurable / thermosetting composition of the present invention. The cured film obtained from the product exhibits high thermal stability, and the shrinkage of curing is smaller than that of the conventional (meth) acrylate resin, and heat resistance, hardness, adhesion and electrical insulation by post-cure Cured products having excellent properties such as corrosion resistance, electric corrosion resistance, and chemical resistance. Therefore, the photo-curable / thermo-curable composition of the present invention is an interlayer insulating material used in the formation of various resist films, such as solder resists such as printing plates and printed boards, etching resists, plating resists, and multilayer circuit creation. Furthermore, it can be effectively used as a paint, printing ink, varnish, adhesive, surface coating agent, and the like.
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| US7122288B2 (en) * | 2000-03-28 | 2006-10-17 | Fujitsu Limited | Negative resist composition, a method for forming a resist pattern thereof, and a method for fabricating a semiconductor device |
| JP4691416B2 (en) * | 2005-08-22 | 2011-06-01 | 三洋化成工業株式会社 | Photosensitive resin composition |
| KR101288573B1 (en) * | 2009-08-03 | 2013-07-22 | 제일모직주식회사 | High etch resistant hardmask composition having antireflective property with calixarene and Process of producing patterned materials by using the same |
| CN101927183B (en) * | 2010-08-03 | 2012-07-25 | 浙江工业大学 | Application of diphenylphosphine methyl-substituted calix [4] arene |
| US10344107B2 (en) * | 2013-11-14 | 2019-07-09 | North Carolina Central University | Electroresponsive technology |
| WO2019031182A1 (en) * | 2017-08-08 | 2019-02-14 | Dic株式会社 | Calixarene compound, curable composition, and cured product |
| JP7744268B2 (en) * | 2022-03-08 | 2025-09-25 | 日本化薬株式会社 | Curable resin composition, cured product thereof, and semiconductor device |
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