JP4470569B2 - Electrodeposition grinding wheel manufacturing method - Google Patents

Description

  The present invention relates to a method for producing an electrodeposition grindstone in which an abrasive grain layer in which abrasive grains are fixed by a plating phase deposited by electroless plating is formed on the surface of a substrate.

As a method for producing this type of electrodeposition grindstone, for example, in Patent Document 1, a plate (base material) is immersed in an electroless plating solution mainly composed of nickel sulfate containing abrasive grains having an appropriate particle size. At first, the stirrer in the electroless plating solution was gently rotated so that abrasive grains would not enter the plating film (plating phase), and a plating film with an appropriate thickness was deposited on the surface of the platen. Then, by increasing the rotation speed of the stirrer so that the abrasive grains are dispersed in the plating film, an electroless plating layer on the surface of the plate and an electroless plating phase having the same film composition as the electroless plating layer There has been proposed a manufacturing method for sequentially forming an abrasive grain layer bonded with abrasive grains. Patent Document 2 discloses a step of temporarily attaching super hard abrasive grains to fix the surface of a grindstone base (base material) and a grindstone base in a state in which the super hard abrasive grains are temporarily attached by a stirrer. Super hard grinding is performed by depositing this plating layer (plating phase) using an electroless plating process while applying ultrasonic vibration while immersed in an electroless plating tank filled with a stirred plating solution such as Ni-P. The process consists of electrodepositing grains on the surface of the grinding wheel base, and this raises the plating layer at the interface between the super-hard abrasive grains and the main plating layer so that the main plating layer wraps the super-hard abrasive grains. A manufacturing method has also been proposed in which ultra-hard abrasive grains are electrodeposited on the surface of the steel.
JP-A-11-198044 JP 2002-178266 A

  By the way, when the base material for forming the abrasive layer is immersed in the plating solution in this way to deposit the plating phase by electroless plating, the abrasive grains are fixed and the abrasive layer is formed on the surface of the base material. In addition to depositing a plating component such as nickel in the plating solution on the surface of the substrate to form a plating phase, precipitation may occur in the plating solution to form small particles. However, even if such particles composed of plating components adhere to the substrate surface, they usually peel off by the plating solution stirred during the electroless plating treatment as described above, but rarely adhere. The particles that have been grown continue to grow on the surface of the base material, and this may result in the formation of a nodule having the particle as a nucleus in the abrasive grain layer. With a grindstone in which such a nodule is formed, In addition, since a portion where the abrasive grains are not fixed is formed around the lump, it is difficult to perform uniform grinding. Of course, if the lump grows larger than the particle size of the abrasive grains, There is a possibility that the bumps may come into contact with the workpiece before the grains and damage the ground surface of the workpiece.

  Here, in order to remove the plating component particles adhering to the surface of the base material before growing in a lump, for example, the stirrer of the plating solution by a stirrer in Patent Document 1 or a stirrer in Patent Document 2 can be enhanced. Alternatively, as in Patent Document 2, it is conceivable that the ultrasonic vibration applied to the base material is strengthened, and further, a strong impact is applied to the base material during electroless plating to peel off the adhered particles. However, when the stirring action of the plating solution is increased in this way, the possibility that the plating component particles in the plating solution will adhere to the surface of the substrate is increased. If the vibration or impact on the substrate is increased, even the abrasive grains fixed to the surface of the base material may fall off, making it impossible to manufacture a grindstone with a desired concentration.

  The present invention has been made under such a background. When a plating layer is deposited on the surface of a substrate immersed in a plating solution by electroless plating to fix the abrasive grains, the abrasive grains are removed. It aims at providing the manufacturing method of the electrodeposition grindstone which can prevent the particle | grains of the plating component in a plating solution adhering to a base-material surface, and growing in a lump, preventing.

In order to solve the above-mentioned problems and achieve such an object, the present invention provides the above-mentioned while depositing a plating phase by electroless plating on the surface of a substrate immersed in a plating solution in which abrasive grains are dispersed. An electrodeposition grindstone manufacturing method in which abrasive grains are fixed to form an abrasive grain layer, wherein the plating phase having a thickness of 10% to 30% of the average grain diameter of the abrasive grains is formed on the surface of the base material. Once deposited, the plating solution is started to be sprayed onto the surface, and the plating phase is further deposited while spraying the plating solution onto the surface to form the abrasive layer.

  In such an electrodeposition grindstone manufacturing method, normal electroless plating is applied and the abrasive grains are fixed until a plating phase having a predetermined thickness is deposited on the surface of the base material. When the plating phase is deposited to such a thickness that the abrasive grains do not fall off, a plating solution is sprayed onto the surface of the base material to further deposit the plating phase without dropping off the fixed abrasive grains to form an abrasive layer. On the other hand, even if the plating component particles deposited in the plating solution in which the base material is immersed adhere to the surface of the base material, it can be peeled off and removed. Therefore, it is possible to prevent the plating component particles from forming a core and form a large nodule in the abrasive layer, and to prevent the surface to be ground of the workpiece from being damaged and perform uniform grinding. A possible electrodeposition grindstone can be produced.

And the thickness of the said plating phase when starting to spray the plating solution on the surface of the base material in this way , in the present invention, the thickness of 10% to 30% of the average particle diameter of the above-mentioned abrasive grains fixed to the base material surface Sato and have this one that could lead to the plating solution spraying the abrasive grains fall off in a thin thickness when plating phase than in than this reversed started spraying the plating solution after plating phase is thickened precipitate However, there is a possibility that the already adhered particles grow so as to be taken into the plating phase and are difficult to peel off. Moreover, as a plating solution sprayed on the surface of the base material, by using a plating solution obtained by filtering the plating solution in which the base material is immersed with a filter, the plating component particles are formed by spraying the plating solution. It is possible to prevent a situation where it adheres to the surface. Furthermore, the spraying pressure of the plating solution on the surface of the base material is desirably 0.05 MPa to 0.5 MPa. If the spraying pressure is lower than this, it may be difficult to remove the adhered particles. On the other hand, if the spraying pressure is too large, even if a plating phase having a predetermined thickness is formed, the abrasive grains may fall off, or after the plating phase having a predetermined thickness is formed in this way, the plating phase may be further precipitated. There is a risk that it takes a long time to form the abrasive layer.

  FIG. 1 shows a manufacturing apparatus according to an embodiment of a method for manufacturing an electrodeposition grindstone of the present invention. In FIG. 1, a reference numeral 1 denotes a plating solution tank. The plating solution tank 1 holds a plating solution L such as Ni in which abrasive grains such as diamond are dispersed. Material 2 is immersed. Here, this base material 2 is, for example, a disk-shaped one, and one circular surface 2A is the surface of the base material 2 on which the abrasive layer is formed, and this circular surface 2A is face up. It is attached to the holder 3 so that.

  Further, a frame 4 that can be moved up and down at predetermined strokes and time intervals by a lifting device (not shown) is bridged on the plating solution tank 1, and the holder 3 to which the substrate 2 is attached is attached to the frame 4. The circular surface 2A is suspended through the hanger 5 so that the circular surface 2A is vertical. As the frame 4 is raised and lowered, the substrate 2 is also fixed in the plating solution L as indicated by the white arrow in FIG. It can be lifted and lowered intermittently with a stroke. In the manufacturing apparatus, a plurality of (two in FIG. 1) base materials 2 are attached to the holder 3 side by side in the ascending / descending direction, that is, the vertical direction.

  On the other hand, a partition wall 6 is provided in the plating solution tank 1, and the plating solution L held inside the partition wall 6 overflows from the upper end of the partition wall 6 and the outer wall of the partition wall 6 and the plating solution tank 1. 7 is held. Therefore, the water level of the plating solution L held in the plating solution tank 1 and immersed in the substrate 2 is maintained equal to the height of the partition wall 6. Further, the plating solution L overflowing from the inside of the partition wall 6 between the partition wall 6 and the outer wall 7 of the plating solution tank 1 is again supplied to the plating solution inside the partition wall 6 through the filter 9 and the circulation pipe 10 by the pump 8. By circulating the plating solution L, the plating solution L held inside the partition wall 6 and immersed in the base material 2 has a stirring action.

  And in the manufacturing apparatus concerning this embodiment, the spraying pipe 11 is connected to the middle of the said circulating pipe 10 from the said filter 9 to the plating solution tank 1 inner bottom part of the partition 6 inside, and is branched from this circulating pipe 10. Thus, the spray pipe 11 branched from the circulation pipe 10 extends into the plating solution tank 1 inside the partition wall 6 through an adjustment valve (not shown), and the plating solution whose opening is held in the plating solution tank 1. It is immersed in L and opened so as to face the circular surface 2A of the base material 2 which is also immersed in the plating solution L. Accordingly, a part of the plating solution L circulated from the pump 8 through the filter 9 is directed from the spray pipe 11 toward the circular surface 2A of the substrate 2 in the plating solution L held in the plating solution tank 1. Will be sprayed.

  Here, the opening of the spray pipe 11 is such that the plating solution L sprayed onto the base material 2 has the entire diameter of the circular surface 2A at the position of the base material 2 in the horizontal direction (direction orthogonal to the drawing in FIG. 1). Of the plurality of base materials 2 at the stroke end when the base material 2 is moved up and down at a predetermined stroke as described above at the position of the base material 2 in the vertical direction. The plate 2 is fixed in the plating solution tank 1 so as to be sprayed at positions exceeding the upper and lower ends of the surface 2A, and the plating solution L is uniformly sprayed on the entire circular surface 2A as the base material 2 is moved up and down. ing. In the above manufacturing apparatus, the opening of the spray pipe 11 is opened so that the plating solution L is sprayed obliquely downward toward the substrate 2 side.

  Next, using the manufacturing apparatus configured as described above, the abrasive grains are fixed to the surface of the substrate 2, that is, the circular surface 2 </ b> A, while depositing a plating phase by electroless plating to form an abrasive grain layer. An embodiment of a method for producing an electrodeposition grindstone of the present invention will be described. In the present embodiment, first, masking is performed except for the circular surface 2A on which the abrasive layer is to be formed on the surface of the base material 2 and pretreatment for degreasing and cleaning is performed. It is attached to the holder 3 and suspended from the frame 4 via the hanger 5 and immersed in the plating solution L held inside the partition wall 6 of the plating solution tank 1.

  Next, the plating solution L is circulated by the pump 8 through the circulation pipe 10, and the substrate 2 is moved up and down in the plating solution L together with the holder 3 through the frame 4 and the hanger 5 by the elevating device. While the plating phase is deposited on the circular surface 2A of the base material 2 by plating, the abrasive grains dispersed in the plating solution L are fixed to form an abrasive grain layer. The adjustment valve of the spray pipe 11 is closed for a predetermined time after the material 2 is immersed in the plating liquid L so that the plating liquid L is not discharged from the spray pipe 11. Accordingly, during this time, the plating phase is precipitated and the abrasive grains are fixed to form an abrasive layer in the same manner as in the production method of an electrodeposition grindstone by ordinary electroless plating. The thickness of the plating phase deposited at this time is It can be known based on the time since the material 2 was immersed and the plating conditions such as the concentration of the plating solution L.

  In this embodiment, after the plating phase having a predetermined thickness is deposited on the circular surface 2A after the predetermined time has elapsed, the plating valve L is circulated from the circulation pipe 10 to the spray pipe 11 by opening the adjustment valve. Part is introduced, electroless plating is continued while spraying the plating solution L from the spray pipe 11 to the circular surface 2A of the base material 2, and the plating phase is further deposited to a thickness required as a final product to polish A grain layer is formed. Further, when a plating phase having a necessary thickness is deposited in this way to form an abrasive layer, the substrate 2 is lifted from the plating solution tank 1 and subjected to post-treatment such as washing, and this embodiment is performed by a series of these steps. The electrodeposited grinding wheel is manufactured.

  Therefore, when a plating phase having a predetermined thickness is deposited on the surface (circular surface 2A) of the base material 2 in this way, the plating phase is further deposited while spraying the plating solution L onto the circular surface 2A to thereby form an abrasive layer. In the method of manufacturing an electrodeposition grindstone having the above-described configuration, a plating component such as Ni is deposited in the plating solution L held in the plating solution tank 1 to form particles thereof, and this has the predetermined thickness. Even if it adheres to the circular surface 2A of the substrate 2 during the deposition of the plating phase, the adhered particles can be peeled off from the circular surface 2A by the plating solution L sprayed thereafter. For this reason, it is possible to prevent such particles from growing greatly with the precipitation of the plating phase and forming a nodule in the abrasive layer, thereby forming a portion where the abrasive grains are not fixed around the nodule. It is possible to prevent the bumps from growing or larger than the abrasive grains and protruding into the abrasive grain layer.

  On the other hand, the plating solution L is sprayed from a state in which the plating phase having a predetermined thickness is deposited on the circular surface 2A as described above, so that the abrasive grains are firmly fixed to a certain degree while being held in the plating phase. As a result, the abrasive particles once fixed in this way are not dropped off by the sprayed plating solution L. Therefore, according to the above manufacturing method, in combination with the fact that no bumps are formed by the particles, an electrode having an abrasive layer in which abrasive grains are uniformly dispersed at a desired concentration in the plating phase. The grinding stone can be manufactured reliably, and it is possible to perform uniform and efficient grinding on the workpiece. It is possible to provide an electrodeposition grindstone that is not damaged.

Here, the thickness of the plating phase on the circular surface 2A when the plating solution L starts to be sprayed from the spray pipe 11 toward the circular surface 2A of the substrate 2 is dispersed in the plating solution L in the plating solution tank 1. Then, the thickness is set to 10% to 30% of the average particle diameter of the abrasive grains fixed to the plating phase . That is, when the plating solution L starts to be sprayed when the thickness of the plating phase is thinner than 10% of the average grain size of the abrasive grains, the abrasive grains with insufficient bonding strength among the abrasive grains held in the plating phase fall off. Conversely, even if the plating solution L starts to be sprayed after the plating phase thickness exceeds 30% of the average grain size of the abrasive grains, the plating component particles adhere to the circular surface 2A before that. In such a case, there is a risk that the knob grows so that the particles are taken into the deposited plating phase, and it is difficult to remove and remove the particles.

  The spraying pressure of the plating solution L sprayed in this way is desirably in the range of 0.05 MPa to 0.5 MPa on the surface of the substrate 2 (circular surface 2A), and the spraying pressure is smaller than this range. It may be difficult to remove the adhered particles. On the other hand, if the spraying pressure is too larger than this range, even if a plating phase having a predetermined thickness is formed as described above, the abrasive grains may fall off, or thus the plating phase having a predetermined thickness. After the plating is formed, it takes more time to deposit the plating phase while spraying the plating solution L to obtain the necessary thickness as the product, and the production efficiency may be impaired.

  In addition, this spraying pressure may be made constant after the spraying of the plating solution L is started, and for example, by operating the adjusting valve, as the plating phase becomes thicker with a small spraying pressure immediately after the spraying is started. The spraying pressure may be changed by gradually increasing the pressure. Further, the plating solution L may be sprayed continuously or intermittently, and before the plating phase is deposited to a thickness necessary for the product, for example, after the plating component particles are adhered, The spraying may be terminated when the plating phase is deposited to a thickness that does not cause a large growth as a lump.

  By the way, in this embodiment, the plating solution L obtained by filtering the plating solution L in the plating solution tank 1 in which the substrate 2 is immersed with the filter 9 is used as the plating solution L sprayed on the circular surface 2A of the substrate 2 in this way. Although being used, for example, the plating solution L in the plating solution tank 1 is sprayed on the substrate 2 as it is, or a plating solution having the same concentration and composition as the plating solution L in which the substrate 2 is immersed is supplied from the outside. It is also possible to remove the particles adhering to the circular surface 2A of the substrate 2 by spraying on the substrate 2. However, in the former case, the particles of the plating component deposited in the plating solution tank 1 may be sprayed and adhered to the circular surface 2A together with the plating solution L, which may cause the occurrence of a bump, whereas in the latter case There is a possibility that the dispersion concentration of the abrasive grains in the plating solution tank 1 is changed by the plating solution supplied from the outside, and a desired concentration cannot be obtained.

  However, according to this embodiment, the plating solution L overflowing from the plating solution tank 1 beyond the partition wall 6 is filtered by the filter 9 as described above, thereby removing the plating component particles. In addition, since it is sprayed on the circular surface 2A, it is possible to reliably prevent such particles from adhering to the substrate 2 and to change the dispersion concentration of the abrasive grains in the plating solution L in the plating solution tank 1. Therefore, it is possible to reliably manufacture an electrodeposition grindstone having a desired concentration. Moreover, in this embodiment, since the plating solution L filtered in this way is sprayed on the base material 2 and circulated also in the plating solution tank 1 from the circulation pipe 10, it is hold | maintained in this plating solution tank 1, and is a base material. The plating component particles themselves in the plating solution L in which 2 is immersed can be reduced, and adhesion of such particles can be prevented more reliably.

  On the other hand, in the manufacturing apparatus of the electrodeposition grindstone according to this embodiment, the opening of the spray pipe 11 that sprays the plating solution L onto the circular surface 2A of the base 2 is circular as the base 2 is lifted and lowered by the lift. It is installed in a position and orientation in which the plating solution L is sprayed evenly over the entire surface 2A and is fixed in the plating solution tank 1. For example, the substrate 2 is fixed and plating is performed while swinging the opening. Compared to spraying the liquid L, the plating liquid L held in the plating liquid tank 1 is stirred too much, and the removal of the adhered particles is more efficient without causing the adhesion of the plating component particles. Can do. In addition, since the base material 2 is moved up and down by a predetermined stroke by the lifting device in this way, an appropriate impact is given to the base material 2 when the direction of lifting is changed at the stroke end, so that the manufacturing according to the present embodiment is performed. According to the apparatus, there is also an advantage that removal of the adhered particles can be promoted even by an impact applied to the substrate 2.

It is a figure which shows the manufacturing apparatus of the electrodeposition grindstone concerning one Embodiment of this invention.

Explanation of symbols

1 plating bath 2 base material 2A circular surface (surface of base material 2)
3 Holder 4 Frame 5 Hanger 6 Partition Wall of Plating Solution Tank 1 Outer Wall of Plating Solution Tank 1 8 Pump 9 Filter 10 Circulating Pipe 11 Spray Pipe L Plating Solution

Claims (3)

A method for producing an electrodeposited grindstone that forms an abrasive layer by adhering the abrasive grains to the surface of a substrate immersed in a plating solution in which abrasive grains are dispersed, by depositing a plating phase by electroless plating. When the plating phase having a thickness of 10% to 30% of the average grain size of the abrasive grains is deposited on the surface of the base material, the plating solution is sprayed on the surface, and the plating solution is sprayed on the surface. The method further comprises depositing the plating phase to form the abrasive layer as described above. The method for producing an electrodeposition grindstone according to claim 1 , wherein the plating solution sprayed onto the surface of the substrate is a plating solution obtained by filtering the plating solution in which the substrate is immersed with a filter. The method for producing an electrodeposition grindstone according to claim 1 or 2 , wherein a spraying pressure of the plating solution on the surface of the base material is set to 0.05 MPa to 0.5 MPa.

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