JP4493204B2 - Single layer metal bond grindstone and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a metal bond grindstone in which superhard abrasive grains (diamond grains, CBN grains, etc.) are mounted on a grindstone base by plating.
[0002]
[Prior art]
A conventional technique will be described with reference to FIG. Super hard abrasive grains (diamond grains, CBN grains, etc.) 2 are temporarily attached with a thin plated layer 3 that is a metal member and does not fall off from the surface of the grindstone base 1 mainly made of steel, and is well stirred. Immerse it in electroless plating (Ni-P or the like) and after a predetermined time, take out the grindstone base 1 and wash it with water.
[0003]
According to this manufacturing method, the super hard abrasive grains 2 are temporarily attached to the surface of the grindstone base 1 with the temporary plating layer 3, and then the height of the super hard abrasive grains 2 is filled on the temporary plating layer 3 by about half. The main plating layer 4 is applied by electroless plating until the thickness is reached, and the super hard abrasive grains 2 are electrodeposited on the surface of the grindstone base 1 with the main plating layer 4.
[0004]
[Problems to be solved by the invention]
In the above-described conventional manufacturing method, the interface between the superhard abrasive grains and the main plating layer has poor wettability and a dent is formed. For this reason, the adhesion between the super hard abrasive grains and the present plating layer is insufficient, and the holding power of the super hard abrasive grains that can counter the grinding resistance cannot be obtained sufficiently.
[0005]
Further, in order to increase the holding power of the super hard abrasive grains, when the plating layer has a layer thickness of 50 to 70% of the super hard abrasive grains, the protruding height at which the super hard abrasive grains are exposed from the main plating layer. Becomes smaller. Therefore, the use range of super hard abrasive grains is reduced, leading to an increase in grinding resistance and a reduction in the life of the grinding wheel.
[0006]
In addition, electroless plating has an advantage that the surface of the coating material can be uniformly plated over electrolytic plating, but has a drawback that it takes much time to perform plating.
[0007]
An object of the present invention is to provide a single-layer metal bond grindstone having a large amount of protrusion of superhard abrasive grains and a high retention strength of ultrahard abrasive grains, and a method for producing the same.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, the following measures are taken in the present invention. That is, a process of temporarily attaching super hard abrasive grains to fix the surface of the grindstone base, and an electroless plating process while applying ultrasonic vibration to the grindstone base with the superhard abrasive grains temporarily attached. And the step of depositing the present plating layer and electrodepositing super hard abrasive grains on the surface of the grindstone base.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1A, superhard abrasive grains (diamond grains, CBN grains, etc.) 2 are temporarily attached on the surface of the grindstone base 1. There are various methods for temporarily attaching the superhard abrasive grains 2 to the grindstone base 1. For example, there are a conventional method of temporary attachment using an adhesive and a method of temporary attachment using copper, zinc, or the like.
Here, it is assumed that the thin plated layer 3 is formed to such an extent that the superhard abrasive grains 2 do not fall off from the grindstone base 1 by electrolytic plating or electroless plating. The grindstone base 1 is a metal member mainly made of steel in order to improve the bondability with the temporary plating layer 3.
[0010]
Next, the main plating process is performed on the grindstone base 1 subjected to the above-described temporary plating process. An electroless plating process is adopted as a method for performing the main plating process. An apparatus diagram for performing the main plating process on the grindstone base 1 is shown in FIG.
[0011]
In the apparatus shown in FIG. 2, a stirrer 12 is placed on a jack 11 that can be moved vertically and vertically, and a plating tank 14 filled with a plating (Ni-P, etc.) solution is placed horizontally thereon. Yes. A stirrer 13 is placed in the plating tank, and the inside of the plating tank can be stirred by the stirrer 12 and the stirrer 13. On the other hand, a piezoelectric ultrasonic vibrator 15 is fixed horizontally at a position higher than the plating tank 14 and an ultrasonic horn 16 is attached to one end thereof. A vibration plate 17 is attached vertically downward to the tip, and the grindstone base 1 can be attached to the tip of the vibration plate 17. The piezoelectric ultrasonic vibrator 15 can arbitrarily give amplitude and frequency by a control device 18 such as a frequency generator.
[0012]
Next, a method for performing the main plating process on the grindstone base 1 using the apparatus shown in FIG. 2 will be described. The grindstone base 1 is attached to the tip of the vibration plate 17, and the attached grindstone base 1 is immersed in an electroless plating tank 14 that is well stirred by a stirrer 12 and a stirrer 13. The main plating layer 4 is deposited on the temporary plating layer 3 while applying ultrasonic vibration of a specific amplitude and frequency to the diaphragm 17 using the piezoelectric ultrasonic vibrator 15 and the ultrasonic horn 16. After a predetermined time (the time experimentally determined so that the main plating layer 4 has a layer thickness of 30 to 50% of the height of the superhard abrasive grains 2), the grindstone base 1 is taken out from the plating tank 14 and washed with water. To do.
[0013]
By manufacturing as described above, as shown in FIG. 1B, the plating layer at the interface between the superhard abrasive grains 2 and the main plating layer 4 is raised, and the main plating layer 4 is used to form the superhard abrasive grains 2. A single-layer metal bond grindstone is produced in which the superhard abrasive grains 2 are electrodeposited on the surface of the grindstone base 1 so as to be wrapped.
[0014]
In order to confirm that the plating layer at the interface between the superhard abrasive grains and the main plating layer was raised by the above manufacturing method and the superhard abrasive grains were electrodeposited on the surface of the grindstone base, the following experiment was attempted.
[0015]
First, according to the manufacturing method of the present invention, superhard abrasive grains are temporarily attached to the surface of the grindstone base with a temporary plating layer. In the experiment, a CBN grindstone having a particle size of 80/100 was used as the superhard abrasive, and S45C was used as the grindstone base, which was inexpensive, easy to shape and easy to plate. The method of temporarily attaching super hard abrasive grains to the grindstone base is usually performed by electrolytic plating, but electroless plating was used in this experiment. Next, a main plating process is performed on the grindstone base that has been subjected to the temporary plating process using an electroless Ni-P plating process. The ultrasonic vibration applied to the grindstone base is fixed at a resonance frequency of 18.3 Hz, the amplitude is controlled by changing the input voltage to the piezoelectric ultrasonic vibrator, and the amplitude is 0 μm, that is, the ultrasonic wave The main plating layer was deposited on the temporary plating layer when no vibration was applied and when ultrasonic vibration was applied with an amplitude of 8 μm. The temperature of the plating solution was kept at 90 ± 1 ° C.
[0016]
The following results were obtained as a result of the above experiment. That is, a sample prepared without applying ultrasonic vibration (amplitude 0 μm) and a sample prepared by adding an ultrasonic wave with an amplitude of 8 μm are recessed around the superhard abrasive grains in the sample with an amplitude 0 μm. In the sample having an amplitude of 8 μm, the ultrasonic vibration affected the interface between the super hard abrasive grains and the main plating layer, and a rise of about 10 μm was confirmed around the super hard abrasive grains.
[0017]
Further, the deposition rate of the present plating layer was measured by changing the amplitude of the ultrasonic vibration from 0 to 16 μm. The result is shown in FIG. That is, when the amplitude of the ultrasonic vibration is up to 8 μm, the film forming speed is improved as the amplitude is increased, and when the amplitude is 8 μm, the film forming speed is maximized, and this plating layer is formed as compared with the normal electroless plating process. The speed is 1.6 times, which is a time reduction of about 2 hours. However, when the amplitude exceeds 8 μm, the film forming speed is conversely reduced, and the film forming speed after the amplitude of 14 μm or later is lower than when the amplitude is 0 μm. Therefore, by setting the amplitude of the ultrasonic vibration to around 8 μm, the film forming speed of the main plating process can be maximized, and when the amplitude is made larger than 0 μm and smaller than 14 μm, the film forming speed can be improved.
[0018]
The shape of the grindstone base can be applied to all shapes such as a plate shape, a ring-shaped outer periphery, a ring-shaped inner periphery, a cup shape, and a general-purpose grindstone.
[0019]
【The invention's effect】
As described above, according to the present invention, by depositing the main plating layer while applying ultrasonic vibration, the main plating layer is deposited so as to wrap the super hard abrasive grains. On the other hand, high holding power can be obtained. Therefore, the layer thickness of the present plating layer can be reduced.
[0020]
Further, since the thickness of the main plating layer can be reduced, the protruding height at which the superhard abrasive grains are exposed from the main plating layer is increased. Therefore, the range of use of the super hard abrasive grains is increased, leading to a reduction in grinding resistance and an improvement in the grinding wheel life.
[0021]
Furthermore, by depositing the main plating layer while applying ultrasonic vibration with an amplitude larger than 0 μm and smaller than 14 μm, the interface of the super hard abrasive grains is activated and the main plating layer is likely to be deposited. Superhard abrasive grains can be electrodeposited in a shorter time than the treatment.
[Brief description of the drawings]
1A is an explanatory diagram of a state in which superhard abrasive grains are temporarily attached to a grindstone base, and FIG. 1B is an explanatory diagram of a state in which superhard abrasive grains are electrodeposited on the surface of a grindstone base. FIG. 2 is an apparatus diagram for performing the main plating process in the method of the present invention. FIG. 3 is a graph showing the relationship between the amplitude and the deposition rate of the main plating layer in the experimental results of the method of the present invention. Explanatory diagram of the state of the main plating treatment of the super hard abrasive grains on the surface of the grindstone base
DESCRIPTION OF SYMBOLS 1 Grinding wheel base 2 Super hard abrasive grain 3 Temporary plating layer 4 Main plating layer 5 Indentation 11 Jack 12 Stirrer 13 Stirrer 14 Plating tank 15 Piezoelectric ultrasonic vibrator 16 Ultrasonic horn 17 Diaphragm 18 Control device

Claims (3)

A process for temporarily fixing super hard abrasive grains to be fixed on the surface of the grindstone base, and an electroless plating process while applying ultrasonic vibration to the grindstone base with the super hard abrasive grains temporarily attached thereto. A method for producing a single-layer metal bond grindstone, comprising: depositing a plating layer and electrodepositing superhard abrasive grains on the surface of a grindstone base. 2. The method for manufacturing a single layer metal bond grindstone according to claim 1, wherein the amplitude of ultrasonic vibration is smaller than 14 [mu] m. The process of temporarily attaching super hard abrasive grains to the surface of the grinding wheel base and the process of depositing the present plating layer while applying ultrasonic vibration to electrodeposit the super hard abrasive grains on the surface of the grinding stone base are super hard. Single-layer metal bond characterized by electrodepositing super hard abrasive grains on the surface of the grindstone base so that the plating layer at the interface between the abrasive grains and the main plating layer is raised and the main plating layer wraps the super hard abrasive grains Whetstone.

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