JP4476592B2 - Semiconductor device and manufacturing method of semiconductor device - Google Patents

Description

The present invention relates to a power device, a semiconductor device in which a drive circuit and a control circuit for the power device are housed in one case, and a method for manufacturing the semiconductor device, and more particularly, to a power device control circuit and a printed wiring outside the case. The present invention relates to a semiconductor device in which a plurality of pin terminals for transmitting and receiving control signals to and from a board are extended from a predetermined surface of a case to the outside, and a method for manufacturing the semiconductor device .

  Various power devices are used in power electronics application equipment for semiconductor devices used in general-purpose inverters, uninterruptible power supply devices, machine tools, industrial robots, etc. Insulated gate bipolar transistors ( IGBTs (Insulated Gate Bipolar Transistors) are becoming mainstream. The intelligent power module (IPM: Intelligent Power Module) that integrates the drive circuit of the IGBT and the control circuit consisting of transistors and diodes such as current sensing and temperature sensing in a single module. ) Has also been put to practical use.

  Such a power module includes a power switching circuit combining a plurality of IGBT chips, a main circuit for driving the IGBT, and a control integrated circuit having functions such as overcurrent protection, short circuit protection, and heating protection. And these circuits are connected to the main unit or the like through various terminals formed outside the case.

  FIG. 15 is an external view showing an example of an IPM (for one phase) used for driving a three-phase motor, for example. In this power module, a module substrate on which a power device such as an IGBT is mounted and a control circuit for the power device are stored in an outer resin case 100 made of a resin molded product, and a power circuit (P , N, M (AC), etc.) terminal blocks 1 to 3, control signal transmission lead terminals 4, and the like. Among these, the control signal lead terminal 4 is for outputting a signal such as an alarm (product abnormality) to the printed circuit board on the main unit side, and includes an IGBT drive circuit, a protection circuit, etc. on the module board. And a plurality of pin terminals 40 to 49 connected to each other and an insulating terminal block 50 for holding these pin terminals 40 to 49. The terminal block 50 is integrated with the surrounding resin case 100 by a method such as double molding, adhesion, and screwing.

  Patent Document 1 describes an invention of an internal plate conductive lead structure in a resin-encapsulated power semiconductor device. According to this patent document 1, in order to relieve the tensile and compressive stress on the module substrate (insulating substrate) due to the thermal expansion / contraction caused by the difference in thermal expansion coefficient between the internal conductive lead terminal and the external package resin. The U-shaped bend structure is provided in the middle of the internal conductive lead to prevent the module from being broken.

  As for the connection between the controller of the main unit and the control integrated circuit of the IPM, the pin terminals 40 to 49 coming out from the terminal block 50 are directly soldered to the power board on which the controller is mounted or attached to the power board. The tip of the pin terminals 40 to 49 of the terminal block 50 is inserted into the connector thus attached to the main unit.

When such a power module is used as an IPM, the output line is screwed to the output terminal blocks 1 to 3 for connection between the motor and the main circuit, so that the main unit can be attached to the printed circuit board. Therefore, it is necessary to devise such that the module substrate and the module surrounding resin case 100 are not destroyed.
Japanese Patent Laid-Open No. 9-129797 (paragraph numbers [0001] to [0005], FIG. 1 etc.)

  When the power module described above is applied to, for example, an in-vehicle inverter device as a main device, the IPM is fixed to a cooling fin of the inverter device so as to release heat generated in the IGBT. In this case, if the pin terminals 40 to 49 coming out from the terminal block 50 are connected to the connector, the wall surface of the connector is scraped at the tip of the pin terminals 40 to 49 due to vibration from the in-vehicle inverter device, resulting in poor contact. Since there is a fear, generally, the tips of the pin terminals 40 to 49 and the power board are directly soldered to be attached to the main unit.

  However, since the conventional pin terminals 40 to 49 are linearly extended from the terminal block 50, when a connection process using a brazing material such as soldering is performed, vibrations from the main body device are received at the joint portion and the power is received. Repeated stress is applied to the brazed part between the board. For this reason, there is a problem that the controller of the main device and the integrated circuit for control of the IPM may be poorly connected due to cracks in the brazed portion while the IPM is continuously used for a long time. It was.

The present invention has been made in view of the above points, a semiconductor device capable of preventing damage to a connection portion between a power board and a pin terminal, and maintaining the stable connection state, and a method for manufacturing the semiconductor device. The purpose is to provide.

In the present invention, in order to solve the above problem, a power device, a drive circuit and a control circuit for the power device are housed in one case, and control is performed between the control circuit and a printed circuit board outside the case. a plurality of pin terminals for exchanging signals, in a semiconductor device which is extended and formed to the outside from the predetermined surface of the case, the intermediate portion of each pin terminal extended form to the outside from the predetermined surface of the case, the printed circuit board A bent portion serving as a cushion portion for absorbing stress transmitted from the pin portion to the pin terminal, and a guide portion is provided on the tip side from the bent portion , and each pin terminal has a single base portion It is fixed to a block, and is held on a predetermined surface of the case by fixing the terminal block inside the case, and the guide portion has a plurality of holes or a plurality of holes. A groove, on each of the plurality of holes or the plurality of grooves, which said each pin terminals are arranged is provided.
Further, a method of manufacturing a semiconductor device including a terminal block in which a plurality of pin terminals are arranged, the step of forming a first mold body provided with a groove portion, and the groove portion from below the first mold body exposing the pin terminal having a bent portion of the control signal, the steps of the side surface of the pin terminal into the groove to insert to be supported, said the first mold body, the bent portion of the pin terminal And adding a second mold body so as to cover a part of the groove, and integrating the first mold body and the second mold body to hold the pin terminal. A method for manufacturing a semiconductor device is provided.

According to the semiconductor device and the manufacturing method of the semiconductor device of the present invention, it is possible to relieve the stress generated in the connecting portion between the power board and the pin terminal due to the bent portion of the pin terminal, and the connection between the power board and the pin terminal. It is possible to prevent breakage of the portion and maintain its stable connection state.

  In addition, if the configuration is such that the extended portion of the pin terminal is guided on the tip side from the bent portion, variations in the positional accuracy of the pin terminal can be eliminated, and the assembly with the main body device can be easily and reliably performed. Can do.

Hereinafter, the best mode for carrying out the invention will be described in detail with reference to the drawings, taking as an example the case of application to an in-vehicle IGBT intelligent power module (IPM).
[First Embodiment]
FIG. 1 is an external view showing an IPM according to a first embodiment of the present invention. In FIG. 1, as in FIG. 15, terminal blocks 1 to 3 for power (P, N, M (AC), etc.) provided on the surrounding resin case 100 and lead terminals 5 for control signals are shown. Yes. In particular, the ten pin terminals 10 to 19 constituting the lead terminal 5 are each provided with a bent portion having a U-shape in a side view at an intermediate portion thereof.

  FIG. 2 is a side sectional view showing the shape of the lead terminal 5 along the AA section of FIG. The lead terminal 5 is brazed to the power board (printed circuit board) 200 of the main body device by solder or the like at the tip portion of the pin terminal 10. The U-shaped bent portion 10 a formed on the pin terminal 10 forms a cushion portion for absorbing stress transmitted from the power board (printed circuit board) 200. The pin terminal 10 is formed by punching a brass plate, for example, and has a U-shaped bent portion 10a formed by press molding. The lower portion of the bent portion 10a of the pin terminal 10 is held by a terminal block 50 formed of a resin material such as polyphenylene sulfide resin (PPS), and its lower end portion 10b is bent in a U-shape and is enclosed in the surrounding resin case 100. This is a connection point with the module substrate (not shown).

  As shown in FIG. 2, the terminal block 50 itself is integrally fixed to the upper surface plate 101 of the surrounding resin case 100 at a predetermined position. Accordingly, although vibration in the vertical direction as shown in the figure is transmitted from the pin terminal 10 to the power board 200, in the present embodiment, stress due to vibration is absorbed in the bent portion 10a of the pin terminal 10. Therefore, even if this IGBT intelligent power module is fixed to the cooling fin of the in-vehicle inverter device, the stress at the brazed portion with the power board 200 is relieved to cause problems such as generation of solder cracks and poor contact with the controller. Can be avoided. In this case, needless to say, the U-shaped dimension at the bent portion forming the cushion portion is selected to have an optimal size according to the vibration characteristics assumed in the main body device.

Next, the manufacturing method of the terminal block which comprises IPM of 1st Embodiment is demonstrated.
3A, 3B, and 3C are front views showing a terminal block different from the terminal block 50 shown in FIG. 2, and a cross section taken along the line BB and a cross section taken along the line CC in FIG. FIGS. 9D and 9E are diagrams showing the molding process.

  In the resin molding of this terminal block, first, the primary mold body 51 that holds the ten pin terminals 10 to 19 upright at equal intervals is injected in an L shape as viewed from the side as shown in FIG. Molded. As shown in FIG. 1A, the primary mold body 51 has through holes 53 formed at both side end portions 52, and these through holes 53 are planted at predetermined positions in the surrounding resin case 100. Alignment with a guide pin (not shown) is possible. Further, the L-shaped standing portion 54 of the primary mold body 51 is formed slightly shorter than the length from the lower end portion of the pin terminals 10 to 19 to the bent portions 10a to 19a. As shown in c), a vertical hole 55 opened on the upper surface and a groove 56 for supporting the ten pin terminals 10 to 19 from one side are formed.

  Next, as shown in FIG. 8D, in the state where the ten pin terminals 10 to 19 are inserted into the primary mold body 51 along the groove 56, as shown in FIG. The secondary mold body 57 is poured by insert molding so as to cover the outside of the pin terminals 10 to 19 from the vertical hole 55 across the notch portion 54a of the standing portion 54.

  4 is a side sectional view showing a modification of the lead terminal according to the present embodiment, and FIGS. 5A, 5B, and 5C are front views showing guide blocks of the lead terminal 5a in FIG. It is sectional drawing along the DD line of a side view and a guide block.

  The lead terminal 5 a is composed of pin terminals 10 (˜19), a terminal block 50, and a guide block 60. The pin terminals 10 (˜19) and the terminal block 50 are the same as those shown in FIG. 2, but here, from the tip portion of each pin terminal 10 (˜19), the tip portion of each pin terminal 10 (˜19). As a sheath block for guiding the position, there is a feature in that a guide block 60 separate from the terminal block 50 is fitted.

  The guide block 60 is configured as a U-shaped resin molded product in a side view. As shown in FIGS. 5A and 5C, one leg portion 61 has a through hole 62 having an elliptical cross section. Further, a guide hole 63 through which each of the ten pin terminals 10 to 19 is formed is formed at equal intervals with a through hole 64 having a circular cross section formed in the other leg portion 61. . In each of the guide holes 63, the insertion side of the pin terminals 10 to 19 is processed into a mortar shape. Further, by positioning guide pins for positioning (not shown) in a shape that can be inserted into the through holes 62 and 64 in accordance with the fixing position of the terminal block 50 of the surrounding resin case 100, Thus, the positioning of the guide block 60 and the engagement of the pin terminals 10 to 19 with the tip portions are facilitated.

  In the lead terminal 5a, the tip end portions of the pin terminals 10 to 19 of the terminal block 50 can be held at predetermined positions by the guide block 60, so that variations in the positional accuracy of the pin terminals 10 to 19 are eliminated, and the power board 200 and the like. It is possible to easily perform automatic assembly with the main body apparatus.

  In general, in a vehicle-mounted inverter device, the vibration direction applied to the lead terminal 4 is not necessarily limited to the vertical direction in FIG. That is, it is expected that the lead terminal 4 is also subjected to vibrations in the front-rear and left-right directions that are horizontal with respect to the axial direction of the pin terminal 10. Such horizontal vibration can be absorbed to a certain extent by forming the pin terminal 10 itself to a certain length or more. Further, the guide block 60 may be formed with a guide groove instead of the guide hole 63.

FIG. 6 is a front view showing a guide block different from the guide block 60 of FIG.
In the guide block 65 of FIG. 6, a slit 66 is provided instead of the through hole 62 of FIG. 5, and a groove 67 is formed instead of the guide hole 63 of each pin terminal 10-19, and the aligned pin terminals 10-19. It is configured to be attached from the side.

  In FIG. 1, a module having three power terminals is shown. However, the present invention is not limited to this, and it can be applied to a three-phase output IPM storing six sets of power devices. Not too long. The same applies to the following.

[Second Embodiment]
FIG. 7 is an external view showing an IPM according to the second embodiment of the present invention. The present embodiment is characterized in that a sheath portion is provided integrally with the terminal block 70 of the lead terminal 6 for guiding the pin terminals 10 to 19 on the distal end side with respect to the bent portions 10a and the like.

  8 is a side sectional view showing the shape of the lead terminal 6 along the section EE in FIG. The terminal block 70 fixed integrally with the surrounding resin case 100 at a predetermined position on the upper surface plate 101 is formed with a hole portion 71 that opens in the side surface direction above the upper surface plate 101, and is a bent portion of the pin terminals 10 to 19. 10a is exposed, and a groove portion 72 is formed in the hole portion 71 to support each bent portion 10a from the side surface.

  According to the present embodiment, the lead terminal 6 eliminates variations in the position of the tip of the pin terminals 10 to 19 without using a separate guide block 60 as in the first embodiment. There is an advantage that automatic assembly can be easily performed with a main body device such as the power board 200.

In the lead terminal shown in FIG. 8, the terminal block 70 is configured as an integrally molded product, but may be configured from two partially molded products.
FIG. 9 is an explanatory diagram showing an outline of a method for manufacturing the terminal block 70 of FIG.

  First, as shown in FIG. 9A, the terminal block 70 is formed with a primary mold body 73 having a groove 72, and the pin terminals 10 (˜19) are inserted into the primary mold body 73 from below. In this state, the secondary mold body 74 is formed by performing secondary molding such as injection molding using a predetermined mold.

[Third Embodiment]
FIG. 10 is a side sectional view showing the shape of the lead terminal according to the third embodiment of the present invention.

  The lead terminal 7 is integrally provided with a guide wall 81 in which the terminal block 80 supports the bent portion 10a of the pin terminal 10 from the side surface. Further, the pin terminal 10 is fitted into the guide wall 81, and the tip of the lead terminal 7 is fitted. A groove portion 82 for positioning is formed.

In the present embodiment, the lead terminal 7 has an advantage that the shape of the terminal block 80 and the molding process can be simplified compared to the lead terminal 6 of the second embodiment.
[Fourth Embodiment]
FIG. 11 is a side sectional view showing the shape of the lead terminal according to the fourth embodiment of the present invention.

  In the lead terminal 8, the bent portions of the pin terminals 20 (˜29) have an S-shape when viewed from the side, and the terminal block 90 to which they are fixed is guided on the tip side from the bent portion 20 a of the pin terminal 20. Therefore, there is a feature in that a sheath portion 91 is integrally provided.

  In the pin terminal 20, the S-shaped bent portion 20 a serves as a cushion portion that absorbs stress transmitted from the power board (printed circuit board) 200. In addition, since the bent portions 20a are provided on the left and right with respect to the axis of the pin terminal 20, the power board 200 is compared with the U-shaped bent portion shown in the first to third embodiments. For example, there is an advantage that an inclination is hardly generated with respect to the axis due to the stress transmitted from the main body device to the pin terminal 20.

The lead terminal in FIG. 11 has its terminal block 90 configured as an integrally molded product, but may be configured from two partially molded products.
FIG. 12 is a cross-sectional view showing a modified example of a lead terminal in which the terminal block 90 of FIG. 11 is composed of two partially molded products.

  This lead terminal comprises the terminal block from the primary mold body 92 which supports the pin terminal 20 (-29) from the right side in the figure, and the secondary mold body 93 which supports from the left side in the figure. The upper portion of the primary mold body 92 is a guide portion 92a that guides the upper portion of the bent portion 20a of the pin terminal 20 (-29), and the tip portion of the pin terminal 20 (-29) is positioned.

[Fifth Embodiment]
FIG. 13 is a side sectional view showing the shape of the lead terminal according to the fifth embodiment of the present invention.

  In this lead terminal 9, the bent portions of the pin terminals 30 (˜39) are L-shaped in side view, and the terminal block 90 to which they are fixed is guided on the tip side from the bent portion 30 a of the pin terminal 30. This is characterized in that a sheath portion 91 is integrally provided.

The lead terminal 9 has an advantage that the pin terminal 30 can be easily processed.
In addition, although the terminal block 90 is comprised as an integrally molded product, the lead terminal of FIG. 13 may be comprised from two partial molded products.

FIG. 14 is a cross-sectional view showing a modified example of a lead terminal in which the terminal block 90 of FIG. 13 is composed of two partially molded products.
This lead terminal constitutes a terminal block from a primary mold body 94 that supports the pin terminals 30 (-39) from the right side in the figure and a secondary mold body 95 that supports the pin terminals 30 from the left side in the figure. The upper part of the primary mold body 94 is a guide part 94a that guides the upper part of the bent part 30a of the pin terminal 30 (-39), and the tip part of the pin terminal 30 (-39) is positioned.

It is an external view which shows IPM of 1st Embodiment. It is a sectional side view which shows the shape of the lead terminal of 1st Embodiment. It is the figure which shows the front view and sectional drawing which show the modification of the terminal block of 1st Embodiment, and its formation process. It is a sectional side view which shows the modification of the lead terminal of 1st Embodiment. FIG. 5 is a front view, a side view, and a cross-sectional view showing a guide block of the lead terminal of FIG. 4. It is a front view which shows the modification of the guide block of 1st Embodiment. It is an external view which shows IPM of 2nd Embodiment. It is a sectional side view which shows the shape of the lead terminal of 2nd Embodiment. It is explanatory drawing showing the outline of the manufacturing method of the lead terminal of 2nd Embodiment. It is a sectional side view which shows the shape of the lead terminal of 3rd Embodiment. It is a sectional side view which shows the shape of the lead terminal of 4th Embodiment. It is a fragmentary sectional view showing the modification of the lead terminal of a 4th embodiment. It is a sectional side view which shows the shape of the lead terminal of 5th Embodiment. It is a fragmentary sectional view showing the modification of the lead terminal of a 5th embodiment. It is an external view which shows an example of the conventional IPM.

Explanation of symbols

1 to 3 Output terminal block 5, 5a, 6, 7, 8, 9 Lead terminal 10 to 19, 20 to 29, 30 to 39 Pin terminal 10a, 20a, 30a Bent part 50, 70, 80, 90 Terminal block 60 Guide block (sheath block)
100 Enclosed resin case 200 Power board (printed circuit board)

Claims (9)

A power device and a drive circuit and a control circuit for the power device are housed in one case, and a plurality of pin terminals for transferring control signals between the control circuit and a printed circuit board outside the case are provided. In the semiconductor device formed to extend outside from the predetermined surface of the case,
A bent portion serving as a cushion portion for absorbing stress transmitted from the printed circuit board to the pin terminal is provided in an intermediate portion of each pin terminal formed to extend from a predetermined surface of the case to the outside. A guide part is provided on the tip side ,
Each of the pin terminals is secured to a predetermined surface of the case by fixing the base of the pin terminal to a single terminal block and fixing the terminal block inside the case.
The guide device includes a plurality of holes or a plurality of grooves, and each pin terminal is disposed in each of the plurality of holes or the plurality of grooves . The semiconductor device according to claim 1, wherein the front Symbol bent portion, characterized in that it is disposed in the hole portion of the terminal block.   3. The semiconductor device according to claim 2, wherein the terminal block is integrally provided with a sheath portion that guides the pin terminals on the distal end side with respect to the bent portion. Wherein it is inserted from the tip of each pin terminal, the semiconductor device according to claim 1, wherein the said terminal block for guiding the tip position of each pin terminal, characterized in that it comprises a sheath block separate.   The semiconductor device according to claim 1, wherein the bent portion of each pin terminal has a U shape in a side view.   5. The semiconductor device according to claim 1, wherein the bent portion of each pin terminal has an S shape in a side view.   The semiconductor device according to claim 1, wherein the bent portion of each pin terminal has an L shape in a side view. The terminal block includes an exposed side wall surface, and the plurality of grooves are provided on the side wall surface,
The semiconductor device according to claim 1, wherein the side surface of each pin terminal is characterized in that it is supported by the plurality of grooves. A method of manufacturing a semiconductor device equipped with a terminal block in which a plurality of pin terminals are arranged,
Forming a first mold body having a groove,
Inserting a pin terminal having a bent portion for a control signal in the groove portion from below the first mold body so that a side surface of the pin terminal is supported in the groove portion;
A second mold body is added to the first mold body so as to expose the bent portion of the pin terminal and cover a part of the groove, and the first mold body and the second mold body. And holding the pin terminal by integrating
A method for manufacturing a semiconductor device, comprising:

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