JP5016334B2 - Case for receiving solid-state imaging device and solid-state imaging device - Google Patents

Description

  The present invention relates to a case for housing a solid-state imaging device and a solid-state imaging device.

Conventionally, a solid-state imaging device in which a solid-state imaging element is housed in a resin case is known. Such a solid-state imaging device is described in Patent Document 1 below, for example. A plurality of outer leads extend from the solid-state imaging device, and these outer leads are fixed on the wiring board.
JP-A-6-163950

  However, when the solid-state imaging device is fixed on the wiring board, when the wiring board is thermally expanded, the position of the end portion of the outer lead is moved, and stress is applied to the case via the outer lead. In particular, when a solid-state image sensor with a high aspect ratio, such as a line sensor, is fixed in the case and a plurality of outer leads are provided at both ends in the longitudinal direction of the case, the outer lead end portion is directed outwardly parallel to the case longitudinal direction. As the case moves, the case bends in the thickness direction, and the stress at this time causes a problem that the solid-state imaging device fixed in the case largely warps.

  The present invention has been made in view of such a problem, and an object thereof is to provide a case for housing a solid-state imaging device and a fixed imaging device capable of reducing stress generated in the case.

In order to solve the above-described problems, a case for housing a solid-state imaging device according to the present invention includes a resin case main body having a recess and a plurality of leads extending from the inside of the recess through the side wall of the case main body. , the outer lead portions of each lead has a bent portion of the asymmetric with respect to the longitudinal center line of the outer lead portion, the lead, each provided in plurality in the longitudinal direction of the both end portions near the site of the case body, wherein The shape of the plurality of outer lead portions on one end side and the shape of the plurality of outer lead portions on the other end side in the peripheral portion of both ends pass through the center in the longitudinal direction of the case body, and in this longitudinal direction It is characterized by mirror symmetry with respect to a vertical plane.

  Furthermore, it is preferable that the case for housing the solid-state imaging device further includes an island (die pad) provided for installing the solid-state imaging device on the bottom surface of the concave portion of the resin case body. The island can be suitably used for the purpose of radiating heat generated during operation of the solid-state imaging device to the outside.

  Since the outer lead portion has a bent portion that is asymmetric with respect to the center line, when the end portion of the outer lead portion moves, the stress concentrates on the bent portion and is bent slightly. Therefore, the transmission of stress to the case main body to which the outer lead portion is connected is relaxed, and the stress generated in the case can be reduced. The solid-state image sensor is fixed on the conductive island, but the stress on the solid-state image sensor is also reduced because the stress in the case is reduced.

  The bent portion includes a first curved portion that is bent so as to draw an arc on one side of the center line, and a second curved portion that is continuous to the first curved portion and bent so as to draw an arc on the other side of the center line. Part. In this case, the end portion of the outer lead portion is reversed when the wiring board is thermally contracted, just as the end portion of the outer lead portion moves in one direction during the thermal expansion of the wiring substrate and stress is applied to one curved portion. Since stress is applied to the other curved portion by moving in the direction, stress relaxation with high uniformity can be performed in a wide temperature range.

  Moreover, it is preferable that a 1st bending part and a 2nd bending part have a point-symmetrical relationship with respect to one point on the said centerline. In this case, since the stress tends to be evenly relieved around one point on the center line, highly uniform stress relaxation can be performed.

  The bent portion includes a first straight portion projecting linearly on one side of the center line, and a second straight portion continuing to the first straight portion and extending linearly so as to be folded back to the center line side. Can also have. In this case, stress is applied to the connecting portion between the first straight portion and the second straight portion, and stress relaxation can be performed.

  Moreover, it is preferable that the width | variety of the above-mentioned bending part is narrower than the width | variety of the terminal part of an outer lead part. In this case, since the bent part is thin, the stress concentrates and it is easy to bend. When the end portion is within 10% from the tip of the outer lead portion, the width of the bent portion is preferably narrower than the maximum width of the end portion of the outer lead portion.

The outer lead portion is preferably made of a material having a tensile strength of 390 N / mm ² or more. That is, when the outer lead portion is made of such a material, the outer lead portion, particularly the bent portion, is flexibly deformed with respect to the movement of the end portion of the outer lead portion, and the position of the end portion returns to the original position. The shape can be flexibly restored and sufficient elastic deformation can be performed.

  Such a material preferably includes a copper alloy. When the copper alloy is included, it functions sufficiently as a lead with high conductivity and has sufficient elasticity. The copper alloy is preferably selected from the alloy group consisting of phosphor bronze, brass, white and beryllium copper. Since these alloys have high tensile strength and spring properties, they also have sufficient elasticity.

  The outer lead part preferably has a horizontal part extending in the width direction perpendicular to the longitudinal direction of the case body and a shoulder part bent from the end of the horizontal part in the thickness direction of the case body and continuing to the bent part. . When the outer lead part has a horizontal part and a shoulder part, it becomes difficult for stress in the bent part to be transmitted to the case body, and warping of the case body can be suppressed. A solid-state imaging device according to the present invention includes the above-described solid-state imaging element accommodation case and a solid-state imaging element fixed in a recess of the solid-state imaging element accommodation case, and dramatically reduces the amount of warpage generated in the case. Therefore, it is possible to suppress malfunction of the element.

  According to the case for housing a solid-state imaging device of the present invention, it is possible to reduce the stress generated in the case, and thus suppress the warpage of the solid-state imaging device installed therein, and the characteristics of the solid-state imaging device resulting therefrom Deterioration can be suppressed.

  Hereinafter, the case for housing a solid-state imaging device according to the embodiment will be described. Note that the same reference numerals are used for the same elements, and redundant description is omitted.

  FIG. 1 is an exploded perspective view of a solid-state imaging device 10 including a solid-state imaging element housing case 1 according to the first embodiment. 2 is a cross-sectional view taken along the line II-II of the solid-state imaging device 10 shown in FIG.

The solid-state imaging device 10 is fixed on the wiring board 20. A solid-state imaging device accommodating case 1 has a resin case body 1a having a recess 1a _1. The on the bottom surface of the concave portion 1a ₁ of the case body 1a is provided with a conductive island (die pad) 2a, the conductive islands onto 2a solid-state imaging element 3 is fixed. The solid-state imaging device 3 has a high aspect ratio such as a line sensor. The outside from the recess 1a within ₁ via the side walls 1a ₂ of the case main body 1a extending lead 2b. Lead 2b is composed of an outer lead portion 2b ₁ and the inner lead portion 2b _2. The solid-state imaging device 3 is electrically connected to the inner lead portion 2b ₂ through the bonding wire 5.

The recess (opening) 1a ₁ of the case main body 1a is sealed by the transparent plate 4, and the image incident through the transparent plate 4 is incident on the solid-state image sensor 3 and is subjected to photoelectric conversion by the solid-state image sensor 3. The image signal of the image is transmitted to the wiring board 20 through the bonding wire 5, the inner lead portion 2b ₂ , and the outer lead portion 2b ₁ sequentially.

The case body 1a has a long shape with an aspect ratio of 3 or more in the longitudinal direction and the short direction. The inner space of the back surface mold provided on the back surface side of the lead frame 2 gradually decreases in width in the cross section perpendicular to the longitudinal direction of the case body 1a as the distance from the lead frame 2 increases. Can be removed from the mold. The solid-state imaging device 3 also has a long shape with an aspect ratio of 3 or more in the longitudinal direction and the short direction. As described above, when the aspect ratio is 3 or more, the reduction of the warpage amount according to the present invention is effectively exhibited, and becomes more remarkable as the aspect ratio becomes higher. It is preferable that a plurality of concave grooves 1a ₃ (meat stealing portions) be formed in the side wall 1a ₂ along the longitudinal direction of the case body 1a along the longitudinal direction of the case body 1a. Thus, having a meat stealing portion is preferable from the viewpoint of reducing the weight of the case main body 1a. In addition, the use of such a mold for forming the meat stealing portion also has an advantage that the fluidity of the resin during resin molding can be ensured.

A pair of protrusions (projection portions) that extend along the longitudinal direction (X axis) of the case body 1a on the side surfaces at both ends in the width direction (Y axis) of the island 2a and are erected in the Z axis direction from the bottom surface of the recess 1a ₁ 1a ₅ is in contact and restricts movement of the island 2a in the width direction. The side surface on the inner lead portion side of the protrusion 1a ₅ and the end surface on the island side of the inner lead portion 2b ₂ constitute one side surface of the groove 1a ₆ interposed therebetween and a part of the other side surface.

The case body 1a is formed by injection molding of resin. In this case, a mold is disposed on the front surface side and the back surface side of the lead frame 2 (see FIG. 3), and between the front surface mold and the back surface mold. Resin is injected into the space formed in the. Immediately below the inner lead portion 2b _{2 in} the case main body 1a, a concave groove 1a ₄ reaching the back surface of the inner lead portion 2b ₂ from the outer bottom surface of the case main body 1a is provided along the longitudinal direction of the case main body 1a. The concave groove 1a ₄ is a trace of pressing the inner lead portion 2b ₂ with a mold from the back side when resin molding is performed.

The case main body 1a has a pair of reinforcing ribs 1a ₇ along its longitudinal direction (X axis). In other words, the back surface groove 1a ₈ is formed between the pair of reinforcing ribs 1a ₇ .

Outer lead portions 2b ₁ of the lead 2b has a bent portion _{2b 10.} A plurality of leads 2b are provided at the peripheral portions of both ends in the longitudinal direction of the case body 1a.

  FIG. 3 is a plan view of the lead frame 2 serving as the case 1 described above.

The pair of islands 2a is provided at both ends of the case body 1a. The pair of divided islands 2a may be integrated. From both ends in the width direction of the island 2a, the width direction island pressing portions 2a ₂ continuously and integrally extend along the width direction of the case main body 1a and reach the inside of the side wall 1a ₂ . Further, from the longitudinal ends of the case body 1a of the island 2a, extends integrally a longitudinal island pressing portion 2a ₃ continuously along the longitudinal direction of the case body 1a, the short-side direction of the case body 1a ( It reaches the inside of the side wall 1a ₉ (see FIG. 1) extending along the Y axis.

The lead frame 2 includes an outer frame 2c, and a plurality of outer lead portions 2b ₁ and a longitudinal island pressing portion 2a ₃ extend inward from the inner side of the outer frame 2c. After the resin molding, the outer lead portion 2b ₁ and the longitudinal island pressing portion 2a ₃ are cut and separated from the outer frame 2c, and the outer lead portion 2b ₁ is bent along the thickness direction of the case body 1a, as shown in FIG. Case 1 is completed.

4 is a plan view of one of the outer lead portions 2b ₁ shown in FIG.

The outer lead portion 2b ₁ has a bent portion 2b ₁₀ . The bent portion _{2b 10} is asymmetric with respect to the longitudinal centerline _{Z 0} of the outer lead portions 2b _1. Thus, since the outer lead portion 2b ₁ has the asymmetric bent portion 2b ₁₀ with respect to the center line Z ₀ , the end portion of the outer lead portion 2b ₁ is accompanied with the thermal expansion of the wiring board 20 (see FIG. 1). When a is moved along the longitudinal direction (X axis direction) of the case body 1a, the stress in the bent portion 2b ₁₀ bends slightly concentrated. Therefore, the transmission of stress to the case main body 1a to which the outer lead portion 2b ₁ is connected is relaxed, and the stress generated in the case can be reduced.

The width W1 of the bent portion _{2b 10} (= 0.3 mm), the outer lead portions 2b narrower than _one width of the end portion A W2 (= 0.46mm), since the thin bending portion _{2b 10,} stress concentrates And bend easily.

Referring again to FIG. 1, when the wiring board 20 in the longitudinal direction X of the case body 1a is thermally expanded, the outer lead portions 2b ₁ of the end portion A located on the positive side in the X-axis, the positive direction of the X axis force Fs + acts along, the end portion a of the outer lead portions 2b ₁ located on the negative side in the X-axis, the force Fs- acts along the negative direction of the X axis. In this case, X-direction central position of the solid-state imaging device 3 is going to deflect in the negative direction of the Z axis, but by the bent portion 2b ₁₀ is elastically deformed, the force Fs +, transfer to the case body 1a of Fs- suppression Is done. Note that the bending portion 2b ₁₀ is also subjected to a force pulling from the bending portion 2b _{10 in the} direction of the end portion A.

In FIG. 4, the bent portion 2 b ₁₀ is continuous with the first curved portion 2 b ₁₁ bent so as to draw an arc on one side of the center line Z ₀ and the first curved portion 2 b ₁₁ , and the other side of the center line Z ₀ . And a second curved portion 2b ₁₂ bent so as to draw an arc. In this case, similarly to the case where the stress is applied to one curved portion (for example, 2b ₁₁ ) due to the movement of the terminal portion A of the outer lead portion 2b ₁ in one direction when the wiring substrate 20 is thermally expanded, Since stress is applied to the other curved portion (for example, 2b ₁₂ ) when the end portion A of the outer lead portion 2b ₁ moves in the reverse direction during contraction, highly uniform stress relaxation can be performed in a wide temperature range.

Further, the first bending portion _{2b 11} and the second bending portion _{2b 12,} have a relationship of point symmetry with respect to a point B on the center line _{Z 0.} In this case, since the stress tends to be evenly relieved around one point B on the center line, highly uniform stress relaxation can be performed. Further, the outer lead portions 2b ₁ with respect to the center line Z ₀ against above pulling force for hardly deformed asymmetric stress transfer to the case body 1a is further reduced. Further, the outer lead portion 2b ₁ has a taper portion 2b ₁₃ that becomes narrower toward the tip between the base end portion and the bent portion 2b ₁₀ .

In the inner region of the center point B side from the center point B1 of the arc of the first curved portion 2b _11, the minimum value θ1 of an angle formed between the tangent line and the X axis of this arc, the outer leads from the center point B1 of this arc In the region on the base end portion (tapered portion 2b ₁₃ ) side of the portion 2b ₁ , the minimum value θ2 of the angle formed by the tangent of this arc and the X axis, and in this region, the tangent of the arc outside the first bending portion 2b ₁₁ And the minimum angle θ3 formed by the X axis is θ1 = 15 degrees, θ2 = 10 degrees, and θ3 = 20 degrees, respectively. These angles may include an error of ± 20%.

The radius of curvature R1 of the arc which is continuous from the outside of the arc to the proximal end of the outer lead portion 2b ₁ of the first bending portion 2b _11, the proximal end portion of the outer lead portions 2b ₁ from inside the arc of the first curved portion 2b ₁₁ continuous arc of radius of curvature R2, the radius of curvature R3 of the inner arc of the first curved portion _{2b 11,} the curvature radius R4 of the outer arc of the first curved portion _{2b 11,} respectively, R1 = 0.05mm, R2 = 0 .3 mm, R3 = 0.4 mm, and R4 = 0.7 mm. These curvature radii may include an error of ± 20%.

The shape of the second curved portion 2b ₁₂ is point-symmetric with the first curved portion 2b ₁₁ with respect to the center point B, except that the radii of curvature R1 and R2 of the portion continuing to the end portion are slightly different. In the above description, the proximal end portion is read as the distal end portion.

Further, the shape of the outer lead portion 2b ₁ is mirror-symmetric with respect to a plane (YZ plane) passing through the center in the longitudinal direction of the case body 1a and perpendicular to the longitudinal direction, and achieves stress relaxation symmetry. ing.

  FIG. 5 is an exploded perspective view of the solid-state imaging device 10 including the solid-state imaging element housing case 1 according to the second embodiment. 6 is a cross-sectional view taken along the line VI-VI of the solid-state imaging device 10 shown in FIG.

The solid-state imaging device 10, only the shape of the outer lead portions 2b ₁ is unlike the one shown in FIG. 1, the other structures are the same.

The outer lead portion 2b ₁ includes a horizontal portion 2b ₁₄ extending in the width direction Y perpendicular to the longitudinal direction X of the case body 1a, and a bent portion 2b ₁₀ bent from the end of the horizontal portion 2b ₁₄ in the thickness direction of the case body 1a. and a shoulder portion 2b ₈ consecutive. When the outer lead part 2b ₁ has the horizontal part 2b ₁₄ and the shoulder part 2b ₈ , the stress in the bent part 2b ₁₀ becomes difficult to be transmitted to the case body 1a, and the warping of the case body 1a can be suppressed. The length of the horizontal portion 2b ₁₄ is 0.8 mm to 8 mm. This configuration can also be applied to the structure of the outer lead portion 2b ₁ that employs the bent portion 2b ₁₀ having the curved portion described above.

  FIG. 7 is a plan view of the lead frame 2 to be the case 1 shown in FIG.

The lead frame 2 includes an outer frame 2c, and a plurality of outer lead portions 2b ₁ and a longitudinal island pressing portion 2a ₃ extend inward from the inner side of the outer frame 2c, as shown in FIG. and only the shape of the outer lead portions 2b ₁ is different. After resin molding, the outer lead portions 2b ₁ of the outer frame 2c, disconnect by cutting a longitudinal island pressing portion 2a _3, the outer leads 2b _1, taking the length of the horizontal portion _{2b 14} described above (see FIG. 6) The case 1 shown in FIG. 1 is completed by bending along the thickness direction of the case body 1a.

FIG. 8 is a plan view of one of the outer lead portions 2b ₁ shown in FIG.

The bent portion 2b ₁₀ of the outer lead portion 2b ₁ is connected to the first straight portion 2b ₁₅ that linearly protrudes to one side (right side of the drawing) of the center line Z ₀ and the first straight portion 2b ₁₅ , and the center line Z _And a second linear portion 2b ₁₆ linearly extending so as to be folded back to the ₀ side. In this case, stress is applied to the connecting portion C between the first straight portion 2b ₁₅ and the second straight portion 2b _16, and stress relaxation can be performed.

The angle θ11 formed by the first straight part 2b ₁₅ and the second straight part 2b ₁₆ is 90 degrees. The radius of curvature R11 of the portion connecting the inner side surface of the first straight portion 2b ₁₅ and the straight portion (taper portion 2b ₁₃ ), the side surface of the first straight portion 2b ₁₅ and the straight portion (taper portion 2b ₁₃ ). the radius of curvature R12 of the portion connecting the door, the first linear portion _{2b 15} with a curvature radius R13 of the outer arc of the connection portion C and the second linear portion _{2b 16,} a first linear portion _{2b 15} second linear portion _{2b 16} The radius of curvature R14 of the arc inside the connecting portion C is R11 = 0.3 mm, R12 = 0.1 mm, R13 = 0.4 mm, and R14 = 0.1 mm, respectively. These angles and radii of curvature may include an error of ± 20%. The width W1 of the bent portion _{2b 10} (= 0.3 mm), the outer lead portions 2b narrower than _one width of the end portion A W2 (= 0.46mm), since the thin bending portion _{2b 10,} stress concentrates And bend easily.

FIG. 9 is a graph showing the relationship between the temperature (° C.) and the amount of warpage (μm) in the thickness direction of the solid-state imaging device 3. Here, a method for measuring the warpage will be described with reference to FIG. The solid-state imaging device 3 is divided into four equal parts in the longitudinal direction, and the heights of the measurement points X _A , S ₁ , S ₂ , S ₃ , X _B are measured (see FIG. 12A). The a measurement point _{X A} connecting measurement points _{X B} linearly as a reference line _{X P} (see FIG. 12 (b)). Measurement points S _1, S _2, S ₃ and the displacement amount [delta] ₁ the difference between the reference line X _P, δ _2, and [delta] _3, warpage amount of displacement is maximum among them in the longitudinal direction of the solid-state imaging device 3 Amount. If the solid-state image pickup device 3 is bent so as to be convex downward, the displacement amount becomes a negative value, and if the solid-state image pickup device 3 is bent so as to protrude upward, the displacement amount becomes a positive value. The amount of warpage is the maximum value of the displacement amounts δ ₁ , δ ₂ , δ ₃ at each measurement point S ₁ , S ₂ , S ₃ . In addition, the amount of warpage at room temperature is set to 0 μm and plotted in a graph.

As the temperature rises, the center position in the longitudinal direction of the solid-state imaging device 3 is displaced in the −Z direction. A ^* (no horizontal part ≈ 0 mm) is data of a solid-state imaging device using a conventional outer lead part without a bent part, and B ^* is an outer lead part of the type shown in FIG. 8 (no horizontal part ≈ 0 mm) C ^* is data of a solid-state imaging device employing an outer lead portion (horizontal portion = 1 mm) of the type shown in FIG.

  The material of the lead frame is TAMAC194 manufactured by Mitsubishi Shindoh Co., Ltd. TAMAC194 is Cu: 97 (wt%) or more, Fe: 2.1-2.6 (wt%), P: 0.015-0.15 (wt%), Zn: 0.05-0.20 (wt%). % By weight) and Pb: 0.03 (% by weight) or less.

  Although there is some variation in data depending on the product, when the outer lead portion having a bent portion is adopted, the change in displacement with respect to the temperature change is smaller than in the conventional product. When the outer lead portion of the type shown in FIG. 8 is employed in the temperature range of 20 ° C. to 100 ° C., the displacement is 15 μm or less, and when the outer lead portion of the type shown in FIG. 4 is employed, the displacement is 13 μm. It was the following. The graph shows the amount of displacement during temperature rise (μm) and the amount of displacement during temperature drop (μm). The state of the data is (temperature rise) and (temperature drop) in the graph. It is shown.

  FIG. 10 is a graph showing the relationship between the temperature (° C.) and the amount of warpage (μm) in the thickness direction of the solid-state imaging device 3. In addition, the measuring method of curvature amount is as the above-mentioned.

E ^* is the data of the solid-state imaging device adopting the outer lead portion of the type shown in FIG. 8 (with horizontal portion (= 1 mm)), B ^* is the outer lead portion of the type shown in FIG. 8 (no horizontal portion ≈ 0 mm) ) Shows data of a solid-state imaging device employing the above.

  The material of the lead frame is TAMAC194 manufactured by Mitsubishi Shindoh Co., Ltd.

  Although there is some variation in data depending on the product, when an outer lead portion having a horizontal portion (= 1 mm) is adopted, a change in displacement with respect to a temperature change is smaller than that in which the outer lead portion is not adopted. When the outer lead portion having the horizontal portion (= 1 mm) shown in FIG. 6 was employed in the temperature range of 20 ° C. to 100 ° C., the displacement was 12 μm or less. The graph shows the amount of displacement during temperature rise (μm) and the amount of displacement during temperature drop (μm). The state of the data is (temperature rise) and (temperature drop) in the graph. It is shown.

  FIG. 13 is a graph showing the relationship between temperature (° C.) and the amount of warpage (μm) in the thickness direction of the solid-state imaging device 3. In addition, the measuring method of curvature amount is as the above-mentioned.

F ^* is data of a solid-state imaging device using “C5210” (phosphor bronze) manufactured by Kiyomine Metal Industry Co., Ltd. as a lead frame material. "C5210" is Sn: 7-9 (wt%), P: 0.03-0.35 (wt%), Fe: 0.10 (wt%) or less, Pb: 0.05 (wt%) or less Zn: 0.20 (wt%) or less, Cu + Sn + P: 99.7 (wt%) or more.

G ^* is data of a solid-state imaging device using “7 alloy” (beryllium copper) manufactured by NGK as a lead frame material. “7 alloy” is: Be: 0.2 to 0.4 (wt%), Ni + Co: 1.8 to 2.5 (wt%), Al: 0.6 (wt%) or less, Cu + Be + Ni + Co + Al: 99.0 It is a material containing (% by weight) or more.

Note that both F ^* and G ^* are changed to R11 = 0.8 mm, R12 = 0.5 mm, R13 = 0.8 mm, and R14 = 0.5 mm in the outer lead portion of the type shown in FIG. The outer lead part (horizontal part = 1 mm) having the same shape as in FIG. 8 was adopted.

  When the outer lead portion having a bent portion is employed, the change in displacement with respect to the temperature change is smaller than that of the conventional product. In the temperature range of 20 ° C. to 100 ° C., when phosphor bronze was used as the lead frame material, the displacement was 8 μm or less, and when beryllium copper was used as the lead frame material, the displacement was 13 μm or less. Each raw material described above may include an error of ± 10%.

  Next, materials will be described.

The aforementioned outer lead portion 2b ₁ is preferably made of a material having a tensile strength of 390 N / mm ² or more. When the outer lead portion 2b ₁ is made of such a material, the outer lead portion, particularly the bent portion is flexibly deformed with respect to the movement of the end portion A of the outer lead portion 2b ₁ , and the position of the end portion is the original. When it returns to, its shape is flexibly restored, and sufficient elastic deformation can be performed.

  Such a material preferably contains a copper alloy. When the copper alloy is included, it functions sufficiently as a lead with high conductivity and has sufficient elasticity.

  Copper alloys are phosphor bronze (alloy containing 3.5 to 9.0% tin and 0.03 to 0.35% phosphorus), brass (main component (59.0 to 71. 5%)). 5%), white (copper 54.0-75.0%, nickel 5.0% or more, manganese 0-0.50%, alloy consisting of remaining zinc), beryllium copper (copper) (Precipitation hardening type alloy in which beryllium 0.2 to 2.2% and a small amount of cobalt and nickel are added) is suitable, and these can be employed. These alloys have high tensile strength and elasticity.

  Examples of the resin constituting the case body 1a include a thermosetting resin and a thermoplastic resin. Examples of such thermosetting resins include phenol resins, urea resins, melamine resins, diallyl phthalate resins, epoxy resins, polyurethane resins, polyimide resins and unsaturated polyester resins, and phenol resins and epoxy resins are preferably used. . The thermoplastic resin includes polystyrene resin, acrylic resin, polycarbonate resin, polyester resin, polyamide resin, polyacetal resin, polyphenylene ether resin, fluorine resin, polyphenylene sulfide resin, polysulfone resin, polyarylate resin, polyetherimide resin, polyether. Examples include sulfone resins, polyetherketone resins, liquid crystalline polymers, polyamideimide resins, polyimide resins, and polyester resins, polyamide resins, polyphenylene sulfide resins, and liquid crystalline polymers are preferably used and have excellent fluidity, heat resistance, and rigidity. From the point of view, the liquid crystalline polymer is most preferably used. These resins may be used alone or in combination as a polymer alloy.

  The resin is preferably filled with at least one of the following fillers. Fillers include glass fiber (milled glass fiber, chopped glass fiber, etc.), glass beads, hollow glass sphere, glass powder, mica, talc, clay, silica, alumina, potassium titanate, wollastonite, calcium carbonate, carbonic acid Magnesium, sodium sulfate, calcium sulfate, barium sulfate, calcium sulfite, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, calcium silicate, silica sand, silica, quartz, titanium oxide, zinc oxide, iron oxide, graphite, molybdenum, Asbestos, silica alumina fiber, alumina fiber, gypsum fiber, carbon fiber, carbon black, white carbon, diatomaceous earth, bentonite, sericite, shirasu, graphite and other inorganic fillers, potassium titanate whisker, alumina whisker, boro Aluminum whisker, silicon carbide whisker, and the like can be exemplified metal whiskers or nonmetal whiskers such as silicon nitride whiskers.

  Next, some modifications of the island shape will be described.

FIG. 11 is a partial perspective view of a solid-state imaging device in which only the shape of the island 2a is changed from that of FIG. 3 or FIG. In the above example, there are a pair of islands 2a at both ends in the longitudinal direction, and these are separate bodies. However, in this example, the islands 2a are integrated. From this island 2a, a pair of widthwise island pressing portion 2a ₂ spaced by a distance X ₀ along the longitudinal direction of the case body 1a extends along the width direction. That is, from both ends in the width direction of the island 2a, the width direction island pressing portion 2a ₂ continuously and integrally extends along the width direction of the case body 1a and reaches the inside of the side wall 1a ₂ .

The center J of the distance X ₀ corresponds to the longitudinal center position of the case body 1a. Island 2a is on both sides in the longitudinal direction of the center position J, has a pair of slits (notches) 2a _4. One slit 2a ₄ extends from one end in the width direction toward the other end, and the other slit 2a ₄ extends from the other end in the width direction toward one end. The length of each slit 2a ₄ is 1/2 or more 6/7 or less of the width of the island 2a.

In this example, the distance X ₁ from one of the center line in the width direction of the island holding portion 2a ₂ to the center position J is equal to the distance X ₂ to the center position J from the other of the center line in the width direction of the island pressing portion 2a ₂ . The slit 2a ₄ is not filled with resin, and the surrounding island 2a can be easily deformed. In other words, the inside of the slit 2a ₄ is filled with gas. Also, the deepest portion of the slit 2a ₄ is a curved surface, is suppressed metal fatigue due to stress concentration during deformation.

As described above, according to the solid-state imaging element housing case 1 according to the above-described embodiment, since the outer lead portion 2b ₁ has the bent portion 2b ₁₀ , the stress generated in the case can be reduced.

1 is an exploded perspective view of a solid-state imaging device 10 including a solid-state imaging element housing case 1 according to a first embodiment. It is II-II arrow sectional drawing of the solid-state imaging device 10 shown in FIG. FIG. 2 is a plan view of a lead frame 2 that becomes the case 1 shown in FIG. 1. FIG. 4 is a plan view of one of the outer lead portions 2b ₁ shown in FIG. It is a disassembled perspective view of the solid-state imaging device 10 provided with the case 1 for solid-state image sensor accommodation which concerns on 2nd Embodiment. FIG. 6 is a cross-sectional view taken along the line VI-VI of the solid-state imaging device 10 illustrated in FIG. 5. FIG. 6 is a plan view of a lead frame 2 that becomes the case 1 shown in FIG. 5. FIG. 8 is a plan view of one of the outer lead portions 2b ₁ shown in FIG. 4 is a graph showing the relationship between temperature (° C.) and the amount of warpage (μm) in the thickness direction of the solid-state imaging device 3. 4 is a graph showing the relationship between temperature (° C.) and the amount of warpage (μm) in the thickness direction of the solid-state imaging device 3. FIG. 8 is a partial perspective view of a solid-state imaging device in which only the shape of an island 2 a is changed from that of FIG. 3 or 7. It is a figure for demonstrating the measuring method of the curvature amount of a solid-state image sensor. 4 is a graph showing the relationship between temperature (° C.) and the amount of warpage (μm) in the thickness direction of the solid-state imaging device 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Case for solid-state image sensor accommodation, 1a ... Case main body, 1a ₁ ... Recess, 1a ₂ ... Side wall, 1a ₃ ... Concave groove, 1a ₄ ... Concave groove, 1a ₅ ... Protrusions, 1a ₆ ... grooves, 1a ₇ ... reinforcing ribs, 1a ₈ ... back groove, 1a ₉ ... side wall, 2 ... lead frame, 2a ... island, 2a ₂・ ・ ・ Wide direction island pressing part, 2a ₃ ... Longitudinal island pressing part, 2a ₄ ... Slit, 2b ... Lead, 2b ₁ ... Outer lead part, 2b ₁₀ ... Bending part, 2b ₁₁ ... curved portion, 2b ₁₂ ... curved portion, 2b ₁₃ ... tapered portion, 2b ₁₄ ... horizontal portion, 2b ₁₅ ... straight portion, 2b ₁₆ ... straight portion, 2b ₈ ... Shoulder part, 2b ₂ ... Inner lead part, 2c ... Outer frame, 3 ... Solid-state imaging Element: 4 ... Transparent plate, 5 ... Bonding wire, 10 ... Solid-state imaging device, 20 ... Wiring board, A ... Terminal part, B ... Center point, B1 ... Center Point, C: Connection part, Fs ... Force, J ... Center position, R1 ... Curvature radius, R2 ... Curvature radius, R3 ... Curvature radius, R4 ... Curvature radius, R11: radius of curvature, R12: radius of curvature, R13: radius of curvature, R14: radius of curvature, W1: width, W2: width, X: longitudinal direction, X _0. ... distance, Y ··· width _{direction, Z} 0 ··· center line.

Claims (11)

A resin case body having a recess;
A plurality of leads extending to the outside from the inside of the recess through the side wall of the case body,
The outer lead portion of each of the leads has an asymmetric bent portion with respect to the center line in the longitudinal direction of the outer lead portion,
A plurality of the leads are provided in each of the peripheral portions at both ends in the longitudinal direction of the case body, and a plurality of the outer lead portions on one end side in the peripheral portions at both ends and a plurality of leads on the other end side are provided. The shape of the outer lead portion is mirror-symmetric with respect to a plane that passes through the center of the case body in the longitudinal direction and is perpendicular to the longitudinal direction.
A case for housing a solid-state image pickup device.   2. The solid-state image sensor housing case according to claim 1, further comprising an island provided on the bottom surface of the concave portion of the case body made of resin for installation of the solid-state image sensor. 3. The bent portion is
A first bending portion bent to draw an arc on one side of the center line;
3. The solid-state imaging element housing case according to claim 1, further comprising: a second bending portion that is continuous with the first bending portion and is bent so as to draw an arc on the other side of the center line. .   4. The solid-state image sensor housing case according to claim 3, wherein the first bending portion and the second bending portion have a point-symmetric relationship with respect to one point on the center line. The bent portion is
A first straight portion protruding linearly on one side of the center line;
3. The solid-state image sensor housing case according to claim 1, further comprising: a second linear portion that is continuous with the first linear portion and extends linearly so as to be folded back toward the center line.   6. The solid-state image pickup element housing case according to claim 1, wherein a width of the bent portion is narrower than a width of a terminal portion of the outer lead portion. 7. The solid-state image sensor housing case according to claim 1, wherein the outer lead portion is made of a material having a tensile strength of 390 N / mm ² or more.   The case for receiving a solid-state image pickup device according to claim 7, wherein the material is made of a material containing a copper alloy.   The case for accommodating a solid-state imaging device according to claim 8, wherein the copper alloy is selected from an alloy group consisting of phosphor bronze, brass, white and beryllium copper. The outer lead portion is
A horizontal portion extending in the width direction perpendicular to the longitudinal direction of the case body;
A shoulder portion bent in the thickness direction of the case body from the end of the horizontal portion and continuing to the bent portion;
The solid-state image sensor housing case according to claim 1, wherein the solid-state image sensor housing case is provided. The solid-state image sensor housing case according to any one of claims 1 to 10,
A solid-state imaging device provided in the case for housing the solid-state imaging device;
A solid-state imaging device comprising:

Images