JP4485740B2 - Multilayer electronic components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer electronic component in which an insulator layer and a coil conductor pattern are laminated, and a coil is formed in the laminate by connecting the coil conductor patterns between the insulator layers.
[0002]
[Prior art]
As shown in FIGS. 3 and 4, the insulator layers 31 </ b> A to 31 </ b> G and the coil conductor pattern 32 of less than one turn are stacked on the conventional multilayer electronic component, and the coil conductor pattern 32 between the insulator layers is spirally formed. There is one in which a coil is formed in a laminated body by connecting to (for example, see Patent Document 1). Both ends of this coil are drawn out to the end faces of the laminated body and connected to the external terminals 45 and 46, respectively.
[0003]
[Patent Document 1]
JP-A-3-219606 [0004]
[Problems to be solved by the invention]
In recent years, coil elements that handle a relatively large current, such as a power supply unit of an electronic device and a signal output unit of a power amplifier module, have been miniaturized, but a coil element formed by winding a core is sufficient. It was not possible to reduce the size. Therefore, it has been studied to use the laminated coil element as described above, which has been further miniaturized, for a power supply unit of an electronic device, a signal output unit of a power amplifier module, and the like. However, the conventional multilayer electronic component has a problem that when a large current of 1 A or more is input, the coil is disconnected due to the heat generated from the coil conductor pattern or the printed circuit board of the electronic device is thermally damaged. there were. Therefore, the conventional multilayer electronic component cannot increase the allowable current, and cannot be used for a portion that handles a relatively large current, such as a power supply unit of an electronic device or a signal output unit of a power amplifier module.
[0005]
The present invention provides a multilayer electronic component in which even when a large current is input, the coil is not disconnected or the printed circuit board of the electronic device is not thermally damaged by the heat generated from the coil conductor pattern. With the goal.
[0006]
[Means for Solving the Problems]
The multilayer electronic component of the present invention solves the above-mentioned problems by improving the surface of the multilayer body incorporating the coil and the material of the coil winding shaft portion in the multilayer body. That is, the present invention relates to a multilayer electronic component in which an insulator layer and a coil conductor pattern are laminated, and a coil conductor pattern is connected between the insulator layers to form a coil in the laminate. A heat radiator is formed, or a heat conductor having a higher thermal conductivity than the insulator layer is formed on the winding shaft portion of the coil.
The present invention also relates to a laminated electronic component in which an insulator layer and a coil conductor pattern are laminated, and a coil is formed in the laminate by connecting the coil conductor patterns between the insulator layers. A heat conductor having higher thermal conductivity than the insulator layer is formed on the surface of the laminated body, and a heat radiator is formed on the surface of the laminated body.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the multilayer electronic component of the present invention, an insulator layer and a coil conductor pattern are laminated, and a coil conductor pattern between insulator layers is connected to form a coil in the laminate. A heat conductor having higher thermal conductivity than the insulator layer is formed on the winding axis of the coil so as to extend in parallel with the winding axis of the coil. In addition, a heat radiator is formed on the surface of the laminate. The heat conductor and the heat radiating body are made of metal or an insulator having higher thermal conductivity than the insulator layer, and are connected to each other.
Therefore, the multilayer electronic component of the present invention can efficiently radiate the heat generated from the coil conductor pattern to the outside of the multilayer body by the heat radiator formed on the surface of the multilayer body. In particular, when a radiator is formed on the entire top surface of the laminate, the heat that has risen inside the laminate can be absorbed by the radiator and dissipated outside the laminate. Can be improved.
Also, the multilayer electronic component of the present invention is a coil formed by a thermal conductor having a higher thermal conductivity than an insulator layer formed so as to extend in parallel with the winding axis of the coil at the winding axis portion of the coil in the multilayer body. The heat generated from the conductor pattern can be efficiently radiated to the outside of the laminate. Furthermore, a heat conductor having a higher thermal conductivity than the insulator layer is formed on the winding axis portion of the coil so as to extend in parallel with the winding axis of the coil, and a radiator is formed on the surface of the laminated body. When the conductor and the heat radiating body are connected, the heat of the central portion of the laminate can be absorbed by the heat conductor and transmitted to the heat radiating body, so that the heat radiation efficiency can be further improved. When this heat conductor is formed of a metal, the magnetic conductor can increase the magnetic permeability of the winding shaft portion of the coil, and the inductance value of the coil can be improved.
[0008]
【Example】
Hereinafter, the multilayer electronic component of the present invention will be described with reference to FIGS.
FIG. 1 is an exploded perspective view showing an embodiment of the multilayer electronic component of the present invention, and FIG. 2 is a sectional view of FIG.
1 and 2, 11A to 11G are insulator layers, and 12A to 12E are coil conductor patterns.
The insulator layers 11A, 11B, 11C, 11D, 11E, 11F, and 11G are formed of dielectric ceramics or magnetic ceramics.
The insulator layer 11A is formed with a heat conductor 13A having higher thermal conductivity than the insulator layer. This heat conductor 13A is made of a metal such as silver, silver alloy, copper, or an insulator having a higher heat conductivity than the insulator layer, and corresponds to the winding portion of the coil at the center of the surface of the insulator layer 11A. It is formed so as to penetrate through the insulator layer 11A.
The insulator layer 11B is formed with a heat conductor 13B having higher thermal conductivity than the insulator layer. This heat conductor 13B is made of the same material as that of the heat conductor 13A, and is formed so as to penetrate the insulator layer 11B at a position corresponding to the winding axis portion of the coil at the center of the surface of the insulator layer 11B. The A coil conductor pattern 12A is formed on the surface of the insulator layer 11B.
A heat conductor 13C having higher heat conductivity than the insulator layer is formed on the insulator layer 11C. This heat conductor 13C is made of the same material as that of the heat conductor 13A, and is formed so as to penetrate the insulator layer 11C at a position corresponding to the winding axis portion of the coil at the center of the surface of the insulator layer 11C. The A coil conductor pattern 12B is formed on the surface of the insulator layer 11C. One end of the coil conductor pattern 12B is connected to the other end of the coil conductor pattern 12A via a conductor in a through hole provided in the insulator layer 11C.
The insulator layer 11D is made of the same material as that of the heat conductor 13A so as to pass through the insulator layer 11D at a position corresponding to the winding axis portion of the coil at the center of the surface. A highly conductive heat conductor 13D is formed. A coil conductor pattern 12C is formed on the surface of the insulator layer 11D. One end of the coil conductor pattern 12C is connected to the other end of the coil conductor pattern 12B via a conductor in a through hole provided in the insulator layer 11D.
The insulator layer 11E is made of the same material as that of the heat conductor 13A so as to penetrate through the insulator layer 11E at a position corresponding to the winding axis portion of the coil at the center of the surface, and is more thermally conductive than the insulator layer. High thermal conductor 13E is formed. A coil conductor pattern 12D is formed on the surface of the insulator layer 11E. One end of the coil conductor pattern 12D is connected to the other end of the coil conductor pattern 12C via a conductor in a through hole provided in the insulator layer 11E.
In the insulator layer 11F, a heat conductor 13F having a higher thermal conductivity than the insulator layer penetrating the insulator layer 11F is formed at a position corresponding to the winding portion of the coil. A coil conductor pattern 12E is formed on the surface of the insulator layer 11F. One end of the coil conductor pattern 12E is connected to the other end of the coil conductor pattern 12D through a conductor in a through hole provided in the insulator layer 11F.
In this way, the coil conductor patterns 12A, 12B, 12C, 12D, and 12E are sequentially connected to form a helical coil.
In the insulator layer 11G, a thermal conductor 13G having higher thermal conductivity than the insulator layer penetrating the insulator layer 11G is formed at a position corresponding to the winding axis portion of the coil.
In this manner, a heat radiator 14 is formed on the upper surface of the laminate in which the insulator layers 11A, 11B, 11C, 11D, 11E, 11F, and 11G and the coil conductor patterns 12A, 12B, 12C, 12D, and 12E are laminated. The The radiator 14 is made of metal such as silver, silver alloy, copper, or an insulator having higher thermal conductivity than the insulator layer, and is formed on the entire surface of the insulator layer 11G (that is, the upper surface of the laminate). The
Then, one end of the coil conductor pattern 12A constituting one end of the coil is formed on the back surface of the insulator layer 11A (that is, the lower surface of the multilayer body) via the conductor in the through hole provided in the insulator layer 11A. Connected to the external terminal 25. In addition, the other end of the coil conductor pattern 12E constituting the other end of the coil is connected to the insulator layer 11A via a conductor in a through hole provided in the insulator layers 11A, 11B, 11C, 11D, 11E, and 11F. It is connected to an external terminal 26 formed on the back surface (that is, the bottom surface of the laminate).
As shown in FIG. 2, the multilayer electronic component formed in this way has a heat conductor 23 having higher thermal conductivity than the insulator layer extending in parallel with the coil winding axis on the winding axis of the coil. Thus, the heat sink 14 is formed on the entire top surface of the multilayer body, and the external terminals 25 and 26 are formed on the bottom surface of the multilayer body. The heat radiator 14 and the heat conductor 23 are connected to each other.
[0009]
As mentioned above, although the Example of the multilayer electronic component of this invention was described, it is not restricted to this Example. For example, the number of turns of the coil conductor pattern formed in each insulator layer can be variously changed according to the characteristics. In the embodiments, the coil element in which one coil is formed in the laminated body has been described. However, two or more coils are formed in the laminated body to form a transformer or an array, and circuit elements such as capacitors are also provided in the laminated body. A circuit may be formed in the laminate by forming them integrally. Furthermore, the heat radiating body may be formed on a part of the top surface of the laminated body or on the side surface of the laminated body.
In addition, in the multilayer electronic component of the present invention, the example in which the radiator is formed on the surface of the multilayer body and the thermal conductor is formed on the winding shaft portion of the coil in the multilayer body is described. As long as it is provided, a heat radiating body is formed on the entire top surface of the laminated body in which the heat conductor is not formed on the winding shaft portion of the coil, or a coil winding inside the laminated body in which the heat radiating body is not formed on the surface. A thermal conductor having higher thermal conductivity than the insulator layer may be formed on the shaft portion so as to extend in parallel with the winding axis of the coil.
Furthermore, the multilayer electronic component of the present invention can be manufactured by either a printing lamination method or a sheet lamination method. In this case, when the laminated body is formed by the printing lamination method, the heat radiator is formed by applying an insulating paste having higher thermal conductivity than the conductor paste or the insulating layer to the entire upper surface of the laminated body. Is formed by laminating and pressure-bonding an insulating sheet having higher thermal conductivity than the conductive sheet or the insulating layer on the laminated body.
[0010]
【The invention's effect】
As described above, the multilayer electronic component according to the present invention includes an insulator layer and a coil conductor pattern laminated, and a coil is formed in the laminate by connecting the coil conductor patterns between the insulator layers. A heat radiator is formed on the surface of the coil, or a heat conductor having a higher thermal conductivity than the insulator layer is formed on the winding shaft portion of the coil in the laminated body. The heat generated from the conductor pattern can be efficiently radiated to the outside of the laminate. Therefore, the multilayer electronic component of the present invention does not break the coil or damage the printed circuit board or the like of the electronic device as in the past even when a large current is input, thereby allowing more tolerance than before. The current can be increased.
Further, in the multilayer electronic component of the present invention, when a heat conductor is formed on the coil winding shaft portion using a metal having higher thermal conductivity than the insulator layer, the coil portion of the coil winding portion is formed by the heat conductor. The permeability can be increased, and the inductance value can be increased as compared with the conventional case.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an embodiment of a multilayer electronic component of the present invention.
FIG. 2 is a cross-sectional view of an embodiment of the multilayer electronic component of the present invention.
FIG. 3 is an exploded perspective view of a conventional multilayer electronic component.
FIG. 4 is a perspective view of a conventional multilayer electronic component.
[Explanation of symbols]
11A to 11G Insulator layers 12A to 12E Coil conductor pattern

Claims (5)

In a laminated electronic component in which an insulator layer and a coil conductor pattern are laminated, and a coil conductor pattern between the insulator layers is connected to form a coil in the laminate.
An insulator having a higher thermal conductivity than the insulator layer is formed through the insulator layer at the coil winding portion of the insulator layer, and the insulator layer is formed on the coil winding portion of the laminated body. Forming an insulator having a thermal conductivity higher than that of the insulator layer extending in the laminating direction and having both ends exposed on the upper and lower surfaces of the laminate,
Laminate having high thermal conductivity insulation than the insulator layer is heat dissipating member on the upper surface exposed is formed in the multilayer electronic component, characterized in that said insulator and heat dissipating body is connected. In a laminated electronic component in which an insulator layer and a coil conductor pattern are laminated, and a coil conductor pattern between the insulator layers is connected to form a coil in the laminate.
A metal having higher thermal conductivity than the insulator layer is formed through the insulator layer in the coil winding portion of the insulator layer, and the insulator layer is formed on the winding axis of the coil in the laminate. Forming a metal having a higher thermal conductivity than the insulator layer extending in the stacking direction and having both ends exposed on the upper and lower surfaces of the stack;
A multilayer electronic component, wherein a heat radiator is formed on an upper surface of a metal layer having a higher thermal conductivity than the insulator layer of the multilayer body, and the metal and the heat radiator are connected. The multilayer electronic component according to claim 1, wherein the heat radiating body is formed on the entire top surface of the multilayer body. The multilayer electronic component according to claim 1, wherein the heat radiator is a metal. The multilayer electronic component according to claim 1, wherein the radiator is an insulator having higher thermal conductivity than the insulator layer.

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