JP4530024B2 - Resistor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a resistor and a manufacturing method thereof, and more particularly to a minute resistor and a manufacturing method thereof.

  As a conventional resistor of this type, a resistor as shown in FIG. 30 is known.

  The resistor shown in FIG. 30 is provided with a resistance layer 3 so as to straddle a pair of upper surface electrode films 2 provided at both ends of the upper surface of the substrate 1 and on the inner side of the end surface of the substrate 1, and the end surface of the substrate 1. Are provided with a pair of U-shaped end surface electrodes 4 electrically connected to the pair of upper surface electrode films 2, and the structure of the end surface electrodes 4 is a NiCr thin film electrically connected to the upper surface electrode film 2, Ti A U-shaped first metal thin film 5 made of a thin film or a Cr thin film, a second metal thin film 6 made of a low-resistance Cu thin film superimposed on the first metal thin film 5, and the second metal thin film 6 A four-layer structure of a first metal plating film 7 made of Ni plating film superimposed on the first metal plating film and a second metal plating film 8 made of Pb—Sn plating film or Sn plating film superimposed on the first metal plating film 7 It was.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 3-80501

  In the above-described conventional resistor, the end face electrode 4 is formed in a U-shape so as to be electrically connected to the pair of upper surface electrode films 2 by thin film technology such as sputtering, ion plating, P-CVD and the like. However, the method of forming the end face electrode 4 by this thin film technology is unclear as to how it is formed in a U shape, and the electrical connection reliability between the pair of top face electrode films 2 and the end face electrodes 4 is unknown. However, it was unclear whether or not it was sufficient.

  The present invention solves the above-described conventional problems, and can easily and reliably form an end face electrode by thin film technology, and can provide a reliable electrical connection reliability between the end face electrode and the upper face electrode. It is an object to provide a container and a method for manufacturing the same.

  In order to achieve the above object, the present invention has the following configuration.

According to the first aspect of the present invention, a substrate, an upper surface electrode and a resistor formed on the upper surface side of the substrate and electrically connected to each other, an end portion of the back surface of the substrate, A substantially U-shaped end face electrode provided on the end face and the upper face of the upper face electrode and electrically connected to the upper face electrode, the end face electrode comprising: an upper face of the upper face electrode; an end face of the upper face electrode; Formed on a first end face electrode made of a substantially L-shaped metal thin film formed on the end face of the substrate, an end portion of the back face of the substrate, and a portion formed on the end face of the substrate in the first end face electrode. The second end face electrode made of a substantially L-shaped metal thin film is formed. According to this configuration, the end face electrode is formed from the back surface side of the substrate and from the upper surface side of the substrate. Will be done from two directions, With the formation of the end surface electrodes can be easily performed by membrane technology, and has a effect that what certainly can be obtained in the qualitative.

According to a second aspect of the present invention, there is provided a substrate, an upper surface electrode and a resistor formed on the upper surface side of the substrate and electrically connected to each other, an end of the back surface of the substrate, A substantially U-shaped end surface electrode provided on the upper surface of the end surface and the upper surface electrode and electrically connected to the upper surface electrode;
The end surface electrode includes a first end surface electrode made of a substantially L-shaped metal thin film formed on an end portion of the back surface of the substrate, an end surface of the substrate, and an end surface of the upper surface electrode, and the first end surface electrode. A portion formed on the end surface of the substrate and a second end surface electrode made of a substantially L-shaped metal thin film formed on the upper surface of the upper surface electrode. The electrodes are formed from two directions from the upper surface side of the substrate and from the back surface side of the substrate. This makes it possible to easily form the end surface electrodes by thin film technology and ensure the quality. Is obtained .

  In the invention according to claim 3 of the present invention, in particular, the first end face electrode is a first thin film made of any one of a Cr thin film, a Ti thin film, a Cr-based alloy thin film, and a Ti-based alloy thin film, and the first thin film. And a second end face electrode made of a Cr thin film, a Ti thin film, a Cr based alloy thin film, or a Ti based alloy thin film. 1 thin film and a second thin film made of a Cu-based alloy thin film electrically connected to the first thin film. According to this structure, a Cr thin film, a Ti thin film, a Cr-based alloy thin film, Since the first thin film made of any one of the Ti-based alloy thin films and the second thin film made of the Cu-based alloy thin film electrically connected to the first thin film, the first thin film and the first thin film 2 at the interface with the thin film 2 The metal and the constituent metal of the first thin film constitute a complete solid solution, thereby improving the adhesion between the first thin film and the second thin film and improving the reliability. It has an effect.

  According to a fourth aspect of the present invention, there are provided a plurality of pairs of upper surface electrodes and a plurality of resistors electrically connected to each other on an upper surface of a sheet-like substrate, and the plurality of pairs of the plurality of resistors. Trimming to correct the resistance value between the upper surface electrodes of the first and second slit-shaped substrates for separating the plurality of pairs of upper surface electrodes into a plurality of strip-shaped substrates on the sheet-like substrate. And a plurality of slits from the back surface of the sheet-like substrate using thin film technology on the back surface side of the sheet-like substrate in a state where the plurality of slit-like first divided portions are formed. Forming a substantially L-shaped first end face electrode over the end face of the substrate and the end face of the upper surface electrode on the inner surface of the first split section having a shape, and a plurality of the first slit-shaped split sections being formed Top surface of sheet-like substrate in state And forming a substantially L-shaped second end face electrode from the upper surface of the upper surface electrode to the first end face electrode so as to be electrically connected to the first end face electrode using thin film technology; A plurality of strip-shaped substrates in the sheet-shaped substrate, a plurality of resistors in a direction orthogonal to the slit-shaped first divided portion so that the plurality of resistors are individually separated and divided into pieces. And forming a second divided portion. According to this manufacturing method, thin film technology is applied to the back side of the sheet-like substrate in which a plurality of slit-shaped first divided portions are formed. A step of forming a substantially L-shaped first end surface electrode from the back surface of the sheet-shaped substrate to the end surface of the substrate and the end surface of the upper surface electrode on the inner surface of the plurality of slit-shaped first divided portions; In a state in which a plurality of first divided portions are formed A substantially L-shaped second electrode from the upper surface of the upper surface electrode to the first end surface electrode so as to be electrically connected to the first end surface electrode using thin film technology on the upper surface side of the substrate. Since the step of forming the end face electrode is provided, the electrical connection between the top face electrode and the end face electrode can be ensured by the formation of the first end face electrode and the formation of the second end face electrode. This has the effect of improving the reliability of electrical connection between the electrode and the end face electrode.

  The invention according to claim 5 of the present invention is the step of providing a plurality of pairs of upper surface electrodes and a plurality of resistors electrically connected to each other on the upper surface of the sheet-like substrate, and the plurality of pairs of the plurality of resistors. Trimming to correct the resistance value between the upper surface electrodes of the first and second slit-shaped substrates for separating the plurality of pairs of upper surface electrodes into a plurality of strip-shaped substrates on the sheet-like substrate. And a top surface provided on the top surface of the sheet-like substrate using thin film technology on the upper surface side of the sheet-like substrate in a state where the plurality of slit-like first divided portions are formed. Forming a substantially L-shaped first end face electrode from the upper surface of the electrode to the end face of the substrate on the inner surface of the plurality of slit-like first division parts, and a plurality of the slit-like first division parts are formed. Back side of sheet-like substrate Forming a substantially L-shaped second end face electrode from the back surface of the sheet-like substrate to the first end face electrode so as to be electrically connected to the first end face electrode using thin film technology; A plurality of strip-shaped substrates in the sheet-shaped substrate, a plurality of resistors in a direction orthogonal to the slit-shaped first divided portion so that the plurality of resistors are individually separated and divided into pieces. Forming a second divided portion. According to this manufacturing method, thin film technology is applied to the upper surface side of a sheet-like substrate in which a plurality of slit-shaped first divided portions are formed. Using the upper surface of the upper surface electrode provided on the upper surface of the sheet-like substrate to form the substantially L-shaped first end surface electrode from the upper surface of the plurality of slit-shaped first divided portions to the end surface of the substrate; In a state where a plurality of slit-shaped first divided portions are formed. A substantially L-shaped second surface extending from the back surface of the sheet-shaped substrate to the first end surface electrode so as to be electrically connected to the first end surface electrode using thin film technology on the back surface side of the G-shaped substrate. Since the step of forming the end face electrode is provided, the electrical connection between the top face electrode and the end face electrode can be ensured by the formation of the first end face electrode and the formation of the second end face electrode. This has the effect of improving the reliability of electrical connection between the electrode and the end face electrode.

As described above, in the resistor according to the present invention, the end face electrode is a substantially L-shaped metal thin film formed on the end face of the substrate from the upper surface electrode, and the end face side of the substrate from the end of the back face of the substrate. The end face electrode is formed from two main directions from one main surface side of the substrate and from the other main surface side of the substrate. As a result, the end face electrode can be easily formed by thin film technology, and an excellent effect is obtained in that a reliable product can be obtained in terms of quality.

(Embodiment 1)
Hereinafter, the resistor and the manufacturing method thereof according to Embodiment 1 of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a resistor according to Embodiment 1 of the present invention.

  In FIG. 1, reference numeral 11 denotes a sheet-like substrate made of baked 96% purity alumina, which is divided into a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. It is the board | substrate separated into pieces by. Reference numeral 12 denotes a pair of first upper surface electrode layers formed on one main surface (upper surface) of the substrate 11. The first upper surface electrode layer 12 is made of an Au-based conductive paste, and at least resistance value correction (laser trimming). ) To increase the meter reading contact area at the time. Reference numeral 13 denotes a pair of second upper surface electrode layers mainly composed of silver provided so as to at least partially overlap the pair of first upper surface electrode layers 12, and the second upper surface electrode layer 13 is a substrate 11. It is provided on the inner side of the edge. Reference numeral 14 denotes a ruthenium oxide resistor formed on the upper surface of the substrate 11 so as to partially overlap the pair of second upper surface electrode layers 13, that is, to be electrically connected. Reference numeral 15 denotes a first protective layer mainly composed of glass formed on the upper surface of the resistor 14. Reference numeral 16 denotes a trimming groove provided for correcting the resistance value of the resistor 14 between the pair of second upper surface electrode layers 13. Reference numeral 17 denotes a pair of adhesive layers made of a silver-based conductive resin provided so as to overlap a part of the pair of first upper surface electrode layers 12 and a part of the second upper surface electrode layer 13. The adhesion layer 17 and the pair of first upper surface electrode layers 12 and the second upper surface electrode layer 13 constitute a pair of upper surface electrodes 18. The first upper surface electrode layer 12 and the adhesion layer 17 are configured to be flush with each other at the edge of the substrate 11. The adhesion layer 17 is configured such that the maximum height in the thickness direction is higher than the maximum height in the thickness direction of the first upper surface electrode layer 12. Reference numeral 19 denotes a second protective layer mainly composed of a resin, which covers the first protective layer 15 mainly composed of glass and is formed so as to overlap a part of the second upper surface electrode layer 13. Reference numeral 20 denotes a pair of end face electrodes which are provided on the edge of the substrate 11 and are electrically connected to the pair of upper face electrodes 18. The pair of end face electrodes 20 are a first end face electrode 21 and a second end face electrode. 22 is formed in a substantially U-shape. The first end surface electrode 21 is formed from the back surface side of the substrate 11, is located on the edge side of the substrate 11, covers the end portion of the back surface of the substrate 11, and also includes the end surface of the substrate 11, the first end surface of the substrate 11. A first thin film 23 formed in a substantially L shape so as to overlap the end face of the upper electrode layer 12 and the end face of the adhesion layer 17, and a first thin film formed so as to overlap the first thin film 23. The second thin film 24 is substantially L-shaped and electrically connected to the second thin film 24. The second end face electrode 22 is formed from the upper surface side of the substrate 11, is formed so as to overlap the substantially thin L-shaped first thin film 25, and the first thin film 25, and the first end electrode 22. The thin film 25 is electrically connected to the substantially thin L-shaped second thin film 26. The first thin film 25 is formed in a substantially L shape so as to cover the upper surface of the adhesion layer 17 and to overlap a part of the second thin film 24 in the first end face electrode 21. 27 denotes a part of the second thin film 24 in the first end face electrode 21 and the second thin film 26 in the second end face electrode 22, and the exposed end face of the adhesion layer 17 and the second upper face electrode. A first plating film made of nickel plating formed so as to cover the upper surface of the layer 13, and a second plating film made of tin plating formed so as to cover the first plating film 27.

  In the above-described configuration, the pair of upper surface electrodes 18 includes the first upper surface electrode layer 12, the second upper surface electrode layer 13 provided so as to at least partially overlap the first upper surface electrode layer 12, Since it has a multi-layer structure of the adhesion layer 17 that overlaps the first upper surface electrode layer 12 and the second upper surface electrode layer 13, it is provided at the edge of the substrate 11 and electrically connected to the pair of upper surface electrodes 18. In the case where the first end face electrode 21 in the pair of end face electrodes 20 to be connected is formed as a thin film, the pair of upper face electrodes 18, the first upper face electrode layer 12, the second upper face electrode layer 13, and the adhesion layer 17. With this multi-layer structure, the connection area between the pair of end surface electrodes 20 and the pair of upper surface electrodes 18 can be increased, and as a result, the electrical connection reliability between the upper surface electrode 18 and the end surface electrodes 20 can be increased. Things that can enhance sex A.

  Of the first upper surface electrode layer 12, the second upper surface electrode layer 13 and the adhesion layer 17 constituting the upper surface electrode 18, the first upper surface electrode layer 12 and the adhesion layer 17 are flush with each other at the edge of the substrate 11. In the case where the first end face electrode 21 in the pair of end face electrodes 20 provided on the edge of the substrate 11 and electrically connected to the pair of upper face electrodes 18 is formed of a thin film. The first end surface electrode 21 made of a thin film can be continuously formed in a stable state on the edge of the substrate 11 and on the substrate upper edge side of the first upper surface electrode layer 12 and the adhesion layer 17.

  In the first upper electrode layer 12, the second upper electrode layer 13, and the adhesion layer 17 constituting the upper electrode 18, only the second upper electrode layer 13 is electrically connected to the resistor 14. Therefore, even if the adhesion layer 17 is formed, the resistance value does not change, so that the ohmic contact can be kept good, so that the resistance value does not change after the resistance value is corrected and has high reliability. A vessel is obtained.

  Further, among the first upper surface electrode layer 12, the second upper surface electrode layer 13, and the adhesion layer 17 constituting the upper surface electrode 18, the maximum height in the thickness direction of the adhesion layer 17 is set to the thickness of the first upper surface electrode layer 12. The first end face electrode in the pair of end face electrodes 20 provided on the edge of the substrate 11 and electrically connected to the pair of upper face electrodes 18 is configured to be higher than the maximum height in the direction. In the case of forming the thin film 21 with a thin film, the presence of the adhesion layer 17 can increase the contact area between the top electrode 18 and the first end face electrode 21 in the end face electrode 20 made of a thin film. The electrical connection reliability of the first end face electrode 21 in the electrode 20 can be increased.

  Next, a manufacturing method of the resistor according to the first embodiment of the present invention configured as described above will be described with reference to the drawings.

  FIG. 2 is a top view showing a state in which an unnecessary region is formed at the end of the entire periphery of the sheet-like substrate used when manufacturing the resistor according to the first embodiment of the present invention, and FIGS. ), FIG. 5 (a) (b), FIG. 7 (a) (b), FIG. 9 (a) (b), FIG. 11 (a) (b), FIG. 13, FIG. FIGS. 17A, 17B and 19A, 19B are cross-sectional views showing the manufacturing process of the resistor according to the first embodiment of the present invention. FIGS. 4A, 4B, 6A. (B), FIG. 8 (a) (b), FIG. 10 (a) (b), FIG. 12 (a) (b), FIG. 14, FIG. 16 (a) (b), FIG. ) And FIGS. 20A and 20B are top views showing the manufacturing process of the resistor according to the first embodiment of the present invention.

  First, as shown in FIG. 2, FIG. 3 (a), and FIG. 4 (a), a sheet-like substrate 31 having a thickness of 0.2 mm made of baked 96% purity alumina is prepared. In this case, as shown in FIG. 2, the sheet-like substrate 31 has an unnecessary region portion 31 a that does not eventually become a product at the end of the entire periphery. And this unnecessary area | region part 31a is comprised by the substantially square shape.

  Next, as shown in FIG. 2, FIG. 3 (b), and FIG. 4 (b), a plurality of pairs of first upper surface electrodes made of an Au-based conductive paste on the upper surface of the sheet-like substrate 31 by a screen printing method. The layer 32 was formed and fired with a firing profile having a peak temperature of 850 ° C., whereby the first upper surface electrode layer 32 was made a stable film.

  Next, as shown in FIGS. 2, 5A and 6A, a screen printing method is applied to the upper surface of the sheet-like substrate 31 so as to at least partially overlap the first upper surface electrode layer 32. Thus, a plurality of pairs of second upper surface electrode layers 33 mainly composed of silver were formed, and fired with a firing profile having a peak temperature of 850 ° C., whereby the second upper surface electrode layer 33 was made a stable film.

  Next, as shown in FIG. 2, FIG. 5B, and FIG. 6B, a plurality of ruthenium oxide-based resistors 34 are formed by screen printing so as to straddle a plurality of pairs of second upper surface electrode layers 33. The resistor 34 was made into a stable film by firing with a firing profile having a peak temperature of 850 ° C.

  Next, as shown in FIGS. 7A and 8A, a plurality of first protective layers 35 mainly composed of glass are formed by screen printing so as to cover a part of the plurality of resistors 34. The first protective layer 35 containing glass as a main component was made into a stable film by firing with a firing profile having a peak temperature of 600 ° C.

  Next, as shown in FIGS. 7B and 8B, in order to correct the resistance value of the resistor 34 between the plurality of pairs of second upper surface electrode layers 33 to a constant value, a laser trimming method is performed. Trimming was performed to form a plurality of trimming grooves 36.

  Next, as shown in FIG. 9A and FIG. 10A, screen printing is performed so as to overlap a part of the plurality of pairs of first upper surface electrode layers 32 and a part of the second upper surface electrode layer 33. A plurality of pairs of adhesion layers 37 made of a silver-based conductive resin were formed by a construction method, and cured with a curing profile having a peak temperature of 200 ° C., thereby making the adhesion layer 37 a stable film.

  Next, as shown in FIGS. 9B and 10B, all of the plurality of first protective layers 35 mainly composed of glass arranged in the vertical direction on the drawing are covered, and the resistor 34 is formed. A plurality of second protective layers 38 mainly composed of a resin are formed by a screen printing method so as to cover a part and a part of the second upper surface electrode layer 33, and cured with a curing profile having a peak temperature of 200 ° C. Thus, the second protective layer 38 was made a stable film.

  Next, as shown in FIGS. 2, 11A, and 12A, an unnecessary region portion 31a formed at the end of the entire periphery of the sheet-like substrate 31 on which the second protective layer 38 is formed. A plurality of slit-shaped first dividing portions 39 for separating the plurality of pairs of first upper surface electrode layers 32 and the adhesion layers 37 into a plurality of strip-shaped substrates 31b are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 39 are formed at a pitch of 700 μm, and the width of the slit-shaped first divided portions 39 is 120 μm. The plurality of slit-shaped first divided portions 39 are formed by through holes that penetrate the sheet-like substrate 31 in the vertical direction. And since the sheet-like substrate 31 is formed with a plurality of slit-shaped first divided portions 39 by the dicing method except for the unnecessary region portion 31a, the slit-shaped first divided portions 39 are formed. Since the plurality of strip-shaped substrates 31b are connected to the unnecessary region portion 31a, the sheet state is exhibited.

  Next, as shown in FIGS. 11B and 12B, a part of the back surface of the substrate 31 is formed from the back surface side of the sheet-like substrate 31 by a sputtering method using a mask (not shown). The substrate 31 constituting a part of the first end face electrode 40 on the end face of the substrate 31, the end face of the first upper surface electrode layer 32, and the end face of the adhesion layer 37 on the inner surfaces of the plurality of slit-shaped first division portions 39. A plurality of pairs of first thin films 41 made of a Cr thin film having good adhesion to the film are formed in a substantially L shape.

  Next, as shown in FIGS. 13 and 14, the first thin film 41 is overlapped with the plurality of pairs of first thin films 41 from the back side of the sheet-like substrate 31 by a sputtering method using a mask (not shown). A plurality of pairs of second thin films 42 made of a Cu—Ni alloy thin film constituting a part of one end face electrode 40 are formed in a substantially L shape. The second end face electrode 40 is constituted by the second thin film 42 and the first thin film 41.

  Next, as shown in FIGS. 15A and 16A, the upper surface of the adhesive layer 37 is covered from the upper surface side of the sheet-like substrate 31 by a sputtering method using a mask (not shown). A plurality of pairs of first thin films 44 made of a Cr thin film constituting a part of the second end face electrode 43 are substantially L-shaped so as to overlap a part of the second thin film 42 in the first end face electrode 40. Form into a mold.

  Next, as shown in FIGS. 15B and 16B, a plurality of pairs of first thin films 44 are formed from the upper surface side of the sheet-like substrate 31 by a sputtering method using a mask (not shown). A plurality of pairs of second thin films 45 made of a Cu—Ni alloy thin film constituting a part of the second end face electrode 43 are formed in a substantially L shape so as to overlap with each other. The second end face electrode 43 is constituted by the second thin film 45 and the first thin film 44.

  Thus, the substantially L-shaped first end face electrode 40 is formed from the back surface side of the substrate 31 and the substantially L-shaped second end face electrode 43 is formed from the upper surface side of the substrate 31, so A letter-shaped end face electrode 46 is formed.

  Next, as shown in FIGS. 2, 17A, 18B, 18A, and 18B, the unnecessary region portion 31a formed at the end of the entire periphery of the sheet-like substrate 31 is excluded. A direction orthogonal to the slit-shaped first dividing portion 39 so that the plurality of resistors 34 are individually separated into the plurality of strip-shaped substrates 31b in the sheet-shaped substrate 31 and divided into the piece-shaped substrates 31c. A plurality of second divided portions 47 are formed in the first. In this case, since the plurality of second divided portions 47 are formed at a pitch of 400 μm, the width of the second divided portion 47 is 100 μm. The plurality of second divided portions 47 are formed by laser scribing. First, as shown in FIG. 2, FIG. 17 (a) and FIG. 18 (a), divided grooves are formed by laser, and thereafter As shown in FIGS. 17B and 18B, the division groove portion is divided by a general division facility so as to be divided into individual substrates 31c. In other words, this dividing method has the effect that it is not divided into pieces every time the second divided portion 47 is formed, but is divided into two stages. Further, since the plurality of second divided portions 47 are formed by laser scribing on the plurality of strip-shaped substrates 31b except for the unnecessary region portion 31a, each time the plurality of second divided portions 47 are formed. The substrate is divided into individual substrates 31c, and the individual substrates 31c are separated from the unnecessary region portion 31a.

  Next, as shown in FIGS. 19A and 20A, a part of the second thin film 42 in the first end face electrode 40 and the second end face electrode 43 in the second end face electrode 43 are formed by using an electroplating method. 2 and a thickness of about 2 to 6 μm so as to cover the exposed end surface of the adhesion layer 37 and the upper surface of the second upper surface electrode layer 33, and is excellent in prevention of solder diffusion or heat resistance. A first plating film 48 made of nickel plating is formed.

  Finally, as shown in FIGS. 19B and 20B, the thickness is about 3 to 8 μm so as to cover the first plating film 48 made of nickel plating by using an electroplating method, and A second plating film 49 made of tin plating with good solder adhesion is formed.

  The resistor in the first embodiment of the present invention is manufactured by the above manufacturing process.

  In the above manufacturing process, the second plating film 49 is composed of tin plating. However, the present invention is not limited to this, and may be a plating made of a tin alloy material, for example, solder, etc. In the case of using the material, stable soldering can be performed during reflow soldering.

  In the above manufacturing process, a protective layer covering the resistor 34 and the like is formed. The first protective layer 35 mainly composed of glass covering the resistor 34, the first protective layer 35 and the trimming groove 36 are formed. Since it is composed of two layers of the second protective layer 38 mainly composed of the resin to be covered, the first protective layer 35 can prevent generation of cracks during laser trimming and reduce current noise. Since the entire resistor 34 is covered with the second protective layer 38 containing a resin as a main component, it is possible to ensure resistance characteristics with excellent moisture resistance.

  In the resistor manufactured by the above manufacturing process, the distance between the slit-shaped first divided portion 39 formed by the dicing method and the second divided portion 47 formed by the laser scribe is accurate (within ± 0.005 mm). And the thicknesses of the first end face electrode 40 and the second end face electrode 43 constituting the end face electrode 46 and the thicknesses of the first plating film 48 and the second plating film 49 are also accurate. The total length and width of a resistor is exactly 0.6 mm long × 0.3 mm wide. In addition, the pattern accuracy of the first upper surface electrode layer 32 and the resistor 34 is not required to be classified into the dimension ranks of the individual substrate, and it is not necessary to consider the variation in dimensions within the dimension rank of the same individual substrate. The effective area of the resistor 34 can be made larger than that of the conventional product. That is, the resistor in the conventional product has a length of about 0.20 mm × width of 0.19 mm, whereas the resistor 34 of the resistor in the first embodiment of the present invention has a length of about 0.25 mm × width 0. .24 mm and the area is about 1.6 times or more.

  Furthermore, in the above manufacturing process, since the plurality of slit-shaped first divided portions 39 are formed by using a dicing method, and the sheet-like substrate 31 that does not require dimensional classification of the individual substrate is used, Thus, the size classification of the individual substrate is not necessary, thereby eliminating the complexity of the process, and dicing can be easily performed using a general dicing equipment such as a semiconductor. .

  Furthermore, in the above manufacturing process, the sheet-like substrate 31 forms an unnecessary region 31a that does not eventually become a product at the end of the entire periphery, and the plurality of slit-shaped first divided portions 39 include a plurality of slits. Since the strip-shaped substrate 31b is formed on the sheet-shaped substrate 31 so as to be connected to the unnecessary region portion 31a, a plurality of strip-shaped substrates are formed even after the plurality of slit-shaped first divided portions 39 are formed. The substrate 31b is connected to the unnecessary region portion 31a. Therefore, the sheet-like substrate 31 is not finely divided into a plurality of strip-like substrates 31b. Therefore, the plurality of slit-shaped first division portions 39 are not provided. Even after the formation, the post-process can be performed in the state of the sheet-like substrate 31 having the unnecessary region portion 31a, so that the design of the construction method can be simplified.

  In the manufacturing process, of the first upper surface electrode layer 32, the second upper surface electrode layer 33 and the adhesion layer 37 constituting the upper surface electrode, the first upper surface electrode layer 32 is composed of an Au-based conductive paste. Therefore, when the multi-sheet sheet-like substrate 31 is divided into strips or pieces, the first upper surface electrode layer 32 can be easily divided, and thus the first upper surface electrode layer 32 is peeled off. And the occurrence of burrs and the like can be prevented.

  In the above manufacturing process, a plurality of slits are formed from the back surface of the sheet-like substrate 31 on the back surface side of the sheet-like substrate 31 in a state where a plurality of slit-shaped first division portions 39 are formed using a thin film technique. Forming a substantially L-shaped first end face electrode 40 over the end face of the substrate 31 on the inner face of the first split portion 39 having a shape, the end face of the first upper surface electrode layer 32 and the end face of the adhesion layer 37; A substantially L-shape is formed on the upper surface side of the sheet-like substrate 31 in a state where a plurality of slit-shaped first division portions 39 are formed so as to be electrically connected to the first end face electrode 40 using thin film technology. Since the step of forming the second end face electrode 43 of the mold is provided, the electrical connection between the upper face electrode and the end face electrode is ensured by the formation of the first end face electrode 40 and the formation of the second end face electrode 43. This gives the top electrode and end It is capable of enhancing the reliability of the electrical connection between the electrodes.

  Further, in the above manufacturing process, the first thin film 41 and the second thin film 42 constituting the first end face electrode 40 are formed by the sputtering method using a mask (not shown), but the present invention is not limited to this. Instead of using the mask (not shown), a thin film is formed on the entire back surface of the sheet-like substrate by sputtering, and then an unnecessary portion of the thin film formed on the entire back surface, that is, the back surface. The back surface portion of the first end face electrode 40 may be formed by peeling and removing the substantially central portion of the first end surface electrode 40 by laser irradiation.

  Next, the second thin film 42 constituting a part of the first end face electrode 40 and the second thin film 45 constituting a part of the second end face electrode 43 will be described in detail.

  The material of the second thin films 42 and 45 is preferably a Cu-Ni alloy thin film among Cu-based alloy thin films.

  The Cu—Ni alloy thin film is an “all-solid solution” in which Ni is uniformly dissolved in the total composition ratio (range) of the additive material Ni with respect to the alloy thin film main element Cu and the first thin films 41 and 44. Constitute. Therefore, Ni diffuses at the interface between the second thin films 42 and 45 made of the Cu—Ni alloy thin film and the first thin films 41 and 44, thereby forming a strong adhesion portion. The adhesion can be improved. Further, Ni present on the outermost surface of the second thin film 45 is an effect of enhancing the corrosion resistance with respect to the surface of the second thin film 45 in the plating bath for forming the nickel plating used for the first plating film 48. Therefore, the adhesion at the interface between the first plating film 48 and the second thin film 45 can also be improved.

  Here, the “full solid solution” in the first embodiment of the present invention is as shown in the equilibrium diagram of the Cu—Ni alloy thin film constituting the second thin film shown in FIG. In FIG. 21, when the amount of Ni metal added is plotted on the horizontal axis and the temperature is plotted on the vertical axis, it is in a liquid phase at a temperature higher than the solid phase indicated by the solid line and is solid at a temperature lower than the solid phase indicated by the dotted line. The region surrounded by the solid line and the dotted line is a state in which the solid phase and the liquid phase are mixed, that is, the “total solid solution”. That is, the second thin films 42 and 45 made of the Cu—Ni alloy thin film in Embodiment 1 of the present invention have the same face-centered cubic lattice crystal structure in the Cu metal of the face-centered cubic lattice that is the base metal. A substitutional solid solution having a face-centered cubic lattice structure, which is one phase, in which Ni metal atoms are dissolved is formed over the entire composition range.

  FIG. 22 shows the result of SIMS composition analysis of the first thin films 41 and 44 made of a Cr thin film and the second thin films 42 and 45 made of a Cu—Ni alloy thin film. The amount of Ni added to the second thin films 42 and 45 at this time is 6.2 wt%. In FIG. 22, the horizontal axis indicates the film thickness from the surface of the Cu—Ni alloy thin film in terms of sputtering time, and the vertical axis indicates the number of atoms of Cu, Ni, Cr, etc. in each layer. As is apparent from FIG. 22, although there is a diffusion layer in which Cu, Ni and Cr are present at the interface between the Cu—Ni alloy thin film layer and the Cr thin film layer, the Cr thin film is formed from the surface of the Cu—Ni alloy thin film layer. The Ni metal is uniformly present in the Cu metal up to the interface with the layer. This indicates that the second thin films 42 and 45 made of a Cu—Ni alloy thin film are “full solid solutions” in which Ni metal is completely dissolved in Cu metal to form one phase. is there. In FIG. 22, the Ni addition amount is set to 6.2 wt%. However, the Ni addition amount provides the same result as that shown in FIG. 22 in the entire composition range.

  Next, the characteristics using the Cu—Ni alloy thin film as the second thin films 42 and 45 in the resistor according to the first embodiment of the present invention configured as described above will be described.

  As a test method for explaining the characteristics, the test was carried out by the method prescribed in “Plating adhesion test method / JIS H8504C”. As shown in FIGS. An adhesive tape 50 having a width of 18 mm defined in “Tape / JIS Z 1522” was used. At this time, the peeling direction of the adhesive tape 50 was set to a direction perpendicular to or inclined from the alumina substrate 51, as shown in FIGS. 23 (a) and 23 (b) described in “JIS H 8504”.

  That is, in this test method, an alumina substrate 51 is used as a test piece, a Cu thin film is formed as a first thin film 41, 44 on the side surface portion of the alumina substrate 51 by a sputtering method, and then the first thin film 41 is formed. , 44, a Cu—Ni alloy thin film is formed as a second thin film 42, 45 by a sputtering method in the same manner as the first thin films 41, 44. Thereafter, a pattern having a pattern width of 0.3 mm is formed using a laser.

  Thereafter, an acceleration test is performed at a temperature of 65 ° C. and a humidity of 95%. Next, the adhesive tape 50 is brought into close contact with the surfaces of the second thin films 42 and 45, and then the adhesive tape 50 is peeled off at a stroke. The ratio of the number of patterns from which the second thin films 42 and 45 were peeled to the number was obtained, and the adhesion was evaluated.

  For the test piece for evaluating the adhesion at the interface between the first plating film 48 and the second thin film 45, after the second thin film 45 is formed, nickel plating is performed as the first plating film 48, and second As the plating film 49, a film formed by electrolytic plating of solder plating was used.

  Evaluation was performed for the case where the amount of Ni added in the Cu—Ni alloy thin film was “1.6 wt%”, “6.2 wt%”, and “12.6 wt%” and the case where the Ni addition amount was “0 wt%”. It was.

  (Table 1) shows the evaluation results of the peeling rate at the interface between the second thin films 42 and 45 and the first thin films 41 and 44 after 500 hours of the acceleration test.

  As is clear from Table 1, by adding Ni to the Cu thin film, the adhesion at the interface between the second thin films 42 and 45 and the first thin films 41 and 44 is greatly improved.

  Table 2 shows the evaluation results of the peeling rate at the interface between the first plating film 48 and the second thin film 45 after 500 hours of the acceleration test.

  As is clear from Table 2, the adhesion at the interface between the first plating film 48 and the second thin film 45 is greatly improved by adding Ni to the Cu thin film.

  In the first embodiment of the present invention described above, the first thin film 41, 44 and the second thin film 42, 45 are formed by using the sputtering method. However, the present invention is limited to this sputtering method. In addition, even when the first thin films 41 and 44 and the second thin films 42 and 45 are formed by thin film techniques such as vacuum deposition, ion plating, and P-CVD, which are other construction methods, The same effect as in the first embodiment can be obtained.

  In the first embodiment of the present invention, the first thin film 41, 44 is formed of a Cr thin film. However, the first thin film 41, 44 is not limited to the Cr thin film, and has good adhesion to the substrate. Even when the first thin films 41 and 44 are formed of a material such as a Cr—Si alloy thin film, a Ni—Cr alloy thin film, a Ti thin film, or a Ti alloy thin film, the same effects as those of the first embodiment of the present invention can be obtained. It is obtained.

  In the first embodiment of the present invention, an unnecessary region portion 31a that will not eventually become a product is formed at the end of the entire periphery of the sheet-like substrate 31 and is configured in a substantially square shape. However, the unnecessary region portion 31a is not necessarily formed at the end portion of the entire periphery of the sheet-like substrate 31. For example, the unnecessary region portion 31d is provided at one end portion of the sheet-like substrate 31 as shown in FIG. When formed, when unnecessary regions 31e are formed at both ends of the sheet-like substrate 31 as shown in FIG. 25, unnecessary regions 31f are formed at the three ends of the sheet-like substrate 31 as shown in FIG. Even when formed, the same effects as those of the first embodiment of the present invention can be obtained.

  In the first embodiment of the present invention, the plurality of second divided portions 47 are formed by laser scribing. However, the second divided portion 47 is a slit-shaped first divided portion 39. It may be formed using a dicing method in the same manner as described above. In this case, dicing can be easily performed using a general dicing equipment such as a semiconductor.

(Embodiment 2)
Hereinafter, the resistor in Embodiment 2 of this invention is demonstrated, referring drawings.

  FIG. 27 is a cross-sectional view of the resistor according to the second embodiment of the present invention.

  In FIG. 27, reference numeral 61 denotes a sheet-like substrate made of baked 96% purity alumina, which is divided into a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. It is the board | substrate separated into pieces by. Reference numeral 62 denotes a pair of first upper surface electrode layers mainly composed of silver and formed on one main surface (upper surface) of the substrate 61. A ruthenium oxide resistor 63 is formed on the upper surface of the substrate 61 so as to partially overlap the pair of first upper surface electrode layers 62, that is, to be electrically connected. Reference numeral 64 denotes a first protective layer mainly composed of glass formed on the upper surface of the resistor 63. Reference numeral 65 denotes a trimming groove provided for correcting the resistance value of the resistor 63 between the pair of first upper surface electrode layers 62. Reference numeral 66 denotes a second protective layer mainly composed of a resin which covers the first protective layer 64 mainly composed of glass and is formed so as to overlap a part of the pair of first upper surface electrode layers 62. . Reference numeral 67 denotes a pair of adhesion layers made of a silver-based conductive resin provided so as to overlap a part of the pair of first upper surface electrode layers 62. The pair of adhesion layers 67 and the pair of first upper surface electrodes. The layer 62 constitutes a pair of upper surface electrodes 68. The first upper surface electrode layer 62 and the adhesion layer 67 are configured to be flush with each other at the edge of the substrate 61. The adhesion layer 67 is configured such that the maximum height in the thickness direction is higher than the maximum height in the thickness direction of the first upper surface electrode layer 62.

  Reference numeral 69 denotes a pair of end face electrodes provided on the edge of the substrate 61 and electrically connected to the pair of upper face electrodes 68. The pair of end face electrodes 69 are a first end face electrode 70 and a second end face electrode. 71 is formed into a substantially U-shape. The first end surface electrode 70 is formed from the back surface side of the substrate 61, is located on the edge side of the substrate 61, covers the end portion of the back surface of the substrate 61, the end surface of the substrate 61, A first thin film 72 formed in a substantially L-shape so as to overlap the end face of the upper electrode layer 62 and the end face of the adhesion layer 67, and the first thin film formed so as to overlap the first thin film 72. The second thin film 73 is substantially L-shaped and is electrically connected to the second thin film 73. The second end face electrode 71 is formed from the upper surface side of the substrate 61, is formed so as to overlap the substantially thin L-shaped first thin film 74, the first thin film 74, and the first It is comprised by the substantially L-shaped 2nd thin film 75 electrically connected with the thin film 74 of this. The first thin film 74 is formed in a substantially L shape so as to cover the upper surface of the adhesion layer 67 and to overlap a part of the second thin film 73 in the first end face electrode 70. 76 covers a part of the second thin film 73 in the first end face electrode 70 and the second thin film 75 in the second end face electrode 71, and the exposed end face of the adhesion layer 67 and the first upper face electrode. A first plating film 77 made of nickel plating formed so as to cover the upper surface of the layer 62, and a second plating film 77 made of tin plating formed so as to cover the first plating film 76.

  In the above configuration, the pair of upper surface electrodes 68 are configured by the first upper surface electrode layer 62 and the adhesion layer 67 that overlaps the first upper surface electrode layer 62, so the first end surface electrode 70 and the first surface electrode 70 It is possible to increase the connection area between the pair of end surface electrodes 69 constituted by the two end surface electrodes 71 and the pair of upper surface electrodes 68, thereby improving the electrical connection reliability between the upper surface electrode 68 and the end surface electrode 69. It can be raised.

  Further, since the first upper surface electrode layer 62 and the adhesion layer 67 constituting the upper surface electrode 68 are configured to be flush with each other at the edge of the substrate 61, the first upper surface electrode layer 62 and the adhesion layer 67 are provided at the edge of the substrate 61. In the case where the first end face electrode 70 in the end face electrode 69 electrically connected to the thin film is formed of a thin film, the first edge electrode 70 made of a thin film is formed on the edge of the substrate 61 and the first edge electrode layer 62 and the substrate edge side of the adhesion layer 67. One end face electrode 70 can be continuously formed in a stable state.

  In the first upper surface electrode layer 62 and the adhesion layer 67 constituting the upper surface electrode 68, only the first upper surface electrode layer 62 is electrically connected to the resistor 63. Even if formed, the resistance value does not change, and as a result, the ohmic contact can be maintained satisfactorily. Therefore, a highly reliable resistor with no change in resistance value after the resistance value is corrected can be obtained.

  Further, of the first upper surface electrode layer 62 and the adhesion layer 67 constituting the upper surface electrode 68, the maximum height in the thickness direction of the adhesion layer 67 is higher than the maximum height in the thickness direction of the first upper surface electrode layer 62. Therefore, when the first end face electrode 70 in the end face electrode 69 provided on the edge of the substrate 61 and electrically connected to the upper face electrode 68 is formed as a thin film, Due to the presence, the connection area of the first end face electrode 70 between the upper face electrode 68 and the end face electrode 69 can be increased. Connection reliability can be improved.

  Furthermore, the first upper surface electrode layer 62 constituting the upper surface electrode 68 is made of a silver-based material, and the adhesion layer 67 is made of a silver-based conductive resin. 1, the formation temperature of the upper surface electrode layer 62 is in the vicinity of 850 ° C., and the formation temperature of the adhesion layer 67 is in the vicinity of 200 ° C., so that the change in the resistance value after the resistance value is corrected does not occur. .

  The difference between the resistor according to the second embodiment of the present invention and the resistor according to the first embodiment of the present invention is that the resistor according to the first embodiment of the present invention uses the upper surface electrode 18 as the first upper surface. In contrast to the electrode layer 12, the second upper surface electrode layer 13, and the adhesion layer 17, the resistor according to the second embodiment of the present invention uses the upper surface electrode 68 as the first upper surface electrode layer. 62 and the adhesion layer 67 are the same except for the difference in configuration and manufacturing method. Therefore, the resistor according to the second embodiment of the present invention is the same as the embodiment of the present invention. 1 has substantially the same function and effect as the resistor 1.

(Embodiment 3)
Hereinafter, the resistor in Embodiment 3 of this invention is demonstrated, referring drawings.

  FIG. 28 is a cross-sectional view of a resistor according to Embodiment 3 of the present invention.

  In FIG. 28, reference numeral 81 denotes a sheet-like substrate made of baked 96% purity alumina, which is divided into a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. It is the board | substrate separated into pieces by. Reference numeral 82 denotes a pair of first upper surface electrode layers formed on one main surface (upper surface) of the substrate 81. The first upper surface electrode layer 82 is made of an Au-based conductive paste, and at least resistance value correction (laser trimming). ) To increase the meter reading contact area at the time. Reference numeral 83 denotes a pair of second upper surface electrode layers mainly composed of silver provided so as to at least partially overlap the pair of first upper surface electrode layers 82, and the second upper surface electrode layer 83 is a substrate 81. It is provided on the inner side of the edge. Reference numeral 84 denotes a ruthenium oxide resistor formed on the upper surface of the substrate 81 so as to partially overlap the pair of second upper surface electrode layers 83, that is, to be electrically connected. Reference numeral 85 denotes a first protective layer mainly composed of glass formed on the upper surface of the resistor 84. Reference numeral 86 denotes a trimming groove provided for correcting the resistance value of the resistor 84 between the pair of second upper surface electrode layers 83. Reference numeral 87 denotes a pair of adhesion layers made of a silver-based conductive resin provided so as to overlap a part of the pair of first upper surface electrode layers 82 and a part of the second upper surface electrode layer 83. The adhesion layer 87 and the pair of first upper surface electrode layers 82 and the second upper surface electrode layer 83 constitute a pair of upper surface electrodes 88. The first upper surface electrode layer 82 and the adhesion layer 87 are configured to be flush with each other at the edge of the substrate 81. The adhesion layer 87 is configured such that the maximum height in the thickness direction is higher than the maximum height in the thickness direction of the first upper surface electrode layer 82. Reference numeral 89 denotes a second protective layer mainly composed of a resin that covers the first protective layer 85 mainly composed of the glass and is overlapped with a part of the second upper surface electrode layer 83. Reference numeral 90 denotes a pair of end face electrodes provided on the edge of the substrate 81 and electrically connected to the pair of upper face electrodes 88. The pair of end face electrodes 90 are a first end face electrode 91 and a second end face electrode. 92 is configured in a substantially U-shape. The first end face electrode 91 is formed from the upper surface side of the substrate 81 using thin film technology, and is positioned on the edge side of the substrate 81 to cover the upper surface of the adhesion layer 87 and A first thin film 93 formed in a substantially L shape so as to overlap the end face, the end face of the first upper surface electrode layer 82 and the end face of the substrate 81; and a first thin film 93 formed so as to overlap the first thin film 93; The second thin film 94 is substantially L-shaped and is electrically connected to the first thin film 93. The second end face electrode 92 is formed from the back side of the substrate 81 after forming the first end face electrode 91 using thin film technology. The first thin film 95 is formed so as to overlap with the first thin film 95 and is constituted by a substantially L-shaped second thin film 96 electrically connected to the first thin film 95. The first thin film 95 is formed in a substantially L shape so as to cover the end of the back surface of the substrate 81 and to overlap a part of the second thin film 94 in the first end face electrode 91. 97 covers the second thin film 96 in the second end face electrode 92 and a part of the second thin film 94 in the first end face electrode 91, and the exposed end face of the adhesion layer 87 and the second upper face electrode. A first plating film made of nickel plating formed so as to cover the upper surface of the layer 83, and a second plating film made of tin plating formed so as to cover the first plating film 97.

  The difference between the resistor according to the third embodiment of the present invention and the resistor according to the first embodiment of the present invention is that the resistor according to the first embodiment of the present invention is different from the first end face electrode 40 and the first resistor. In the case of forming the two end face electrodes 43, first, a substantially L-shaped first electrode is formed on the back surface side of the sheet-like substrate 31 in a state where a plurality of slit-like first division portions 39 are formed using a thin film technique. The end face electrode 40 is formed, and then the first end face electrode 40 is electrically connected to the first end face electrode 40 using a thin film technique on the upper surface side of the sheet-like substrate 31 on which a plurality of slit-like first division portions 39 are formed. The second end face electrode 43 having a substantially L shape is formed so as to be connected to each other, whereas the resistor according to the third embodiment of the present invention has the first end face electrode 91 and the second end face. When forming the electrode 92, first, the upper surface side of the substrate 81 is approximately formed by using thin film technology. The first end electrode 91 having a letter shape is formed, and then a second L having a substantially L shape is formed on the back side of the substrate 81 so as to be electrically connected to the first end face electrode 91 using a thin film technique. The other configuration and manufacturing method are the same except that the end face electrode 92 is formed. Therefore, the resistor according to the third embodiment of the present invention is the same as the resistor according to the first embodiment of the present invention. It has substantially the same function and effect as the vessel.

(Embodiment 4)
Hereinafter, the resistor in Embodiment 4 of this invention is demonstrated, referring drawings.

  In FIG. 29, 101 is a sheet-like substrate made of baked 96% purity alumina and divided into a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. It is the board | substrate separated into pieces by. Reference numeral 102 denotes a pair of first upper surface electrode layers mainly composed of silver and formed on one main surface (upper surface) of the substrate 101. Reference numeral 103 denotes a ruthenium oxide resistor formed on the upper surface of the substrate 101 so as to partially overlap the pair of first upper electrode layers 102, that is, to be electrically connected. Reference numeral 104 denotes a first protective layer mainly composed of glass formed on the upper surface of the resistor 103. A trimming groove 105 is provided to correct the resistance value of the resistor 103 between the pair of first upper surface electrode layers 102. Reference numeral 106 denotes a second protective layer mainly composed of a resin, which covers the first protective layer 104 mainly composed of glass and is formed so as to overlap a part of the pair of first upper surface electrode layers 102. . Reference numeral 107 denotes a pair of adhesion layers made of a silver-based conductive resin provided so as to overlap a part of the pair of first upper surface electrode layers 102. The pair of adhesion layers 107 and the pair of first upper surface electrodes. The layer 102 forms a pair of upper surface electrodes 108. The first upper electrode layer 102 and the adhesion layer 107 are configured to be flush with each other at the edge of the substrate 101. The adhesion layer 107 is configured such that the maximum height in the thickness direction is higher than the maximum height in the thickness direction of the first upper surface electrode layer 102.

  Reference numeral 109 denotes a pair of end face electrodes provided on the edge of the substrate 101 and electrically connected to the pair of upper face electrodes 108. The pair of end face electrodes 109 are a first end face electrode 110 and a second end face electrode 111. And is formed into a substantially U-shape. The first end face electrode 110 is formed from the upper surface side of the substrate 101 using thin film technology, and is positioned on the edge side of the substrate 101 to cover the upper surface of the adhesion layer 107 and A first thin film 112 formed in a substantially L shape so as to overlap the end face, the end face of the first upper surface electrode layer 102 and the end face of the substrate 101; and the first thin film 112 so as to overlap the first thin film 112; The second thin film 113 is substantially L-shaped and is electrically connected to the first thin film 112. The second end face electrode 111 is formed from the back side of the substrate 101 after forming the first end face electrode 110 using thin film technology. The first thin film 114 is formed so as to overlap with the first thin film 114 and is constituted by a substantially L-shaped second thin film 115 electrically connected to the first thin film 114. The first thin film 114 is formed in a substantially L shape so as to cover the end of the back surface of the substrate 101 and to overlap a part of the second thin film 113 in the first end face electrode 110. Reference numeral 116 covers a part of the second thin film 115 in the second end face electrode 111 and the second thin film 113 in the first end face electrode 110, and the exposed end face of the adhesion layer 107 and the first upper face electrode. A first plating film made of nickel plating formed so as to cover the upper surface of the layer 102, and a second plating film 117 made of tin plating formed so as to cover the first plating film 116.

  The difference between the resistor according to the fourth embodiment of the present invention and the resistor according to the third embodiment of the present invention is that the resistor according to the third embodiment of the present invention uses the upper surface electrode 88 as the first upper surface. Whereas the resistor in the fourth embodiment of the present invention comprises the electrode layer 82, the second upper surface electrode layer 83 and the adhesion layer 87, the upper surface electrode 108 is replaced with the first upper surface electrode layer. 102 and the adhesion layer 107 are the same except for the difference in the configuration and the manufacturing method. Therefore, the resistor according to the fourth embodiment of the present invention is the same as the embodiment of the present invention. 3 has substantially the same function and effect as the resistor 3.

  In the third and fourth embodiments of the present invention, the manufacturing process diagram is not shown, but the slit-shaped first dividing portion 39 in the resistor manufacturing process shown in the first embodiment of the present invention is provided. A plurality of slit-shaped first dividing portions 39 are formed on the upper surface side of the plurality of sheet-like substrates 31 from the upper surfaces of the upper surface electrodes 88 and 108 provided on the upper surface of the sheet-like substrate 31 using thin film technology. A step of forming substantially L-shaped first end face electrodes 91 and 110 over the end face of the substrate 31 on the inner surface of the sheet, and a sheet-like substrate 31 in a state where a plurality of the slit-like first divided portions 39 are formed. On the back surface side, approximately L-shaped from the back surface of the sheet-like substrate 31 to a part of the first end surface electrodes 91 and 110 so as to be electrically connected to the first end surface electrodes 91 and 110 using thin film technology. Mold second end face electrodes 92,1 1 is formed, the electrical connection between the upper surface electrodes 88 and 108 and the end surface electrodes 90 and 109 is achieved by forming the first end surface electrodes 91 and 110 and forming the second end surface electrodes 92 and 111. A certain thing is obtained, and it has the effect that the electrical connection reliability of the upper surface electrodes 88 and 108 and the end surface electrodes 90 and 109 can be improved.

  The resistor and the manufacturing method thereof according to the present invention can easily form an end face electrode by a thin film technique and can provide a reliable quality, and are particularly useful in a minute resistor. is there.

Sectional drawing of the resistor in Embodiment 1 of this invention The top view which shows the state which formed the unnecessary area | region part in the edge part of the perimeter of the sheet-like board | substrate used when manufacturing the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor Sectional drawing which shows the manufacturing process of the resistor Plan view showing the manufacturing process of the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor (A) (b) Sectional drawing which shows the manufacturing process of the resistor (A) (b) The top view which shows the manufacturing process of the resistor Equilibrium diagram of Cu-Ni alloy thin film constituting the second thin film of the resistor Explanatory drawing of the composition analysis result by SIMS of the 1st thin film and 2nd thin film of the resistor (A) (b) The figure which shows the test method explaining a characteristic The top view which shows the state which formed the unnecessary area | region part in the one end part of the sheet-like board | substrate used when manufacturing the resistor The top view which shows the state which formed the unnecessary area | region part in the both ends of the sheet-like board | substrate used when manufacturing the resistor The top view which shows the state which formed the unnecessary area | region part in three edge parts of the sheet-like board | substrate used when manufacturing the resistor Sectional drawing of the resistor in Embodiment 2 of this invention Sectional drawing of the resistor in Embodiment 3 of this invention Sectional drawing of the resistor in Embodiment 4 of this invention Cross section of conventional resistor

Explanation of symbols

11, 61, 81, 101 Substrate 12, 62, 82, 102 First upper surface electrode layer 13, 83 Second upper surface electrode layer 14, 63, 84, 103 Resistor 15, 64, 85, 104 First protection Layer 16, 65, 86, 105 Trimming groove 17, 67, 87, 107 Adhesion layer 18, 68, 88, 108 Upper surface electrode 19, 66, 89, 106 Second protective layer 20, 69, 90, 109 End surface electrode 21 , 70, 91, 110 First end face electrode 22, 71, 92, 111 Second end face electrode 23, 72, 93, 112 First thin film 24, 73, 94, 113 of the first end face electrode Second thin film at end face electrode 25, 74, 95, 114 First thin film at second end face electrode 26, 75, 96, 115 Second thin film at second end face electrode 31 Sheet-like substrate 31a, 31d to 31f Unnecessary region portion 31b Strip substrate 31c Single substrate 32 First upper surface electrode layer 33 Second upper surface electrode layer 34 Resistor 35 First protective layer 36 Trimming groove 37 Adhesion layer 38 Second Protective layer 39 First divided portion 40 First end face electrode 41 First thin film in first end face electrode 42 Second thin film in first end face electrode 43 Second end face electrode 44 Second end face electrode in second end face electrode 1 thin film 45 second thin film in second end face electrode 46 end face electrode 47 second divided portion

Claims (5)

A substrate, an upper surface electrode and a resistor formed on the upper surface side of the substrate and electrically connected to each other; an end portion of the back surface of the substrate; an end surface of the substrate; and an upper surface of the upper surface electrode. A substantially U-shaped end face electrode electrically connected to the upper face electrode;
The end face electrode includes a first end face electrode made of a substantially L-shaped metal thin film formed on an upper face of the upper face electrode, an end face of the upper face electrode, and an end face of the substrate; A resistor having a second end face electrode made of a substantially L-shaped metal thin film formed on a portion of the first end face electrode formed on the end face of the substrate . A substrate, an upper surface electrode and a resistor formed on the upper surface side of the substrate and electrically connected to each other; an end portion of the back surface of the substrate; an end surface of the substrate; and an upper surface of the upper surface electrode. A substantially U-shaped end face electrode electrically connected to the upper face electrode;
The end surface electrode includes a first end surface electrode made of a substantially L-shaped metal thin film formed on an end portion of the back surface of the substrate, an end surface of the substrate, and an end surface of the upper surface electrode, and the first end surface electrode. A resistor having a portion formed on an end surface of the substrate and a second end surface electrode made of a substantially L-shaped metal thin film formed on the upper surface of the upper surface electrode . The first end face electrode is composed of a first thin film made of any one of a Cr thin film, a Ti thin film, a Cr-based alloy thin film, and a Ti-based alloy thin film, and a Cu-based alloy thin film electrically connected to the first thin film. The second thin film is composed of a first thin film made of any one of a Cr thin film, a Ti thin film, a Cr alloy thin film, and a Ti alloy thin film, and is electrically connected to the first thin film. The resistor according to claim 1 or 2, comprising a second thin film made of a Cu-based alloy thin film. A step of providing a plurality of pairs of upper surface electrodes and a plurality of resistors electrically connected to each other on the upper surface of the sheet-like substrate, and correcting a resistance value between the plurality of pairs of upper surface electrodes in the plurality of resistors Trimming, forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper surface electrodes into a plurality of strip-shaped substrates on the sheet-like substrate, and the slits Of the substrate on the inner surface of the plurality of slit-shaped first divided portions from the back surface of the sheet-shaped substrate using the thin film technology on the back surface side of the sheet-shaped substrate in a state where a plurality of first-shaped divided portions are formed. Forming a substantially L-shaped first end face electrode over the end face and the end face of the upper face electrode, and forming a thin film on the upper face side of the sheet-like substrate in a state where a plurality of slit-like first divided portions are formed. Said first using technology Forming a substantially L-shaped second end surface electrode from the upper surface of the upper surface electrode to the first end surface electrode so as to be electrically connected to the surface electrode, and a plurality of strip-shaped substrates in the sheet-like substrate And forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistors are individually separated and divided into piece-like substrates. A method of manufacturing a provided resistor. A step of providing a plurality of pairs of upper surface electrodes and a plurality of resistors electrically connected to each other on the upper surface of the sheet-like substrate, and correcting a resistance value between the plurality of pairs of upper surface electrodes in the plurality of resistors Trimming, forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper surface electrodes into a plurality of strip-shaped substrates on the sheet-like substrate, and the slits On the upper surface side of the sheet-like substrate in a state where a plurality of first divided portions are formed, a plurality of slit-shaped firsts are formed from the upper surface of the upper surface electrode provided on the upper surface of the sheet-like substrate using thin film technology. A step of forming a substantially L-shaped first end face electrode over the end face of the substrate on the inner surface of the divided portion, and a back surface side of the sheet-like substrate in a state where a plurality of the slit-shaped first divided portions are formed, The first end using thin film technology Forming a substantially L-shaped second end surface electrode from the back surface of the sheet-like substrate to the first end surface electrode so as to be electrically connected to the electrode, and a plurality of strip-like substrates in the sheet-like substrate And forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistors are individually separated and divided into piece-like substrates. A method of manufacturing a provided resistor.

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