JP4530497B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an imaging apparatus used for an endoscope or the like.
[0002]
[Prior art]
In recent years, an objective optical system and an imaging device including a solid-state imaging device such as a CCD and a circuit board are disposed in a distal end portion of an endoscope insertion portion, and an endoscope observation image is obtained as an electrical image signal. Electronic endoscopes are widely used.
[0003]
The electronic endoscope includes a signal cable connected to an image processing apparatus in which an electric signal obtained by forming an observation image of a portion to be observed on the imaging surface of the solid-state imaging device by the objective optical system is installed outside the endoscope. The image is converted into an image signal, and an image of the observation target part is displayed on the monitor for observation.
[0004]
An imaging device incorporated in a small space such as the distal end of the insertion portion of an electronic endoscope has an electronic component for driving a solid-state imaging device as described in, for example, Japanese Patent Application Laid-Open No. 11-478084. A circuit board to be mounted is arranged in parallel to the solid-state image sensor, and the solid-state image sensor and a signal cable connected to the solid-state image sensor are connected via the circuit board to provide an imaging unit for an endoscope. What has been configured as is proposed.
[0005]
[Problems to be solved by the invention]
However, the image pickup apparatus (endoscope image pickup unit) described in JP-A-11-478084 is provided with a plurality of external terminals (external leads) extending from the solid-state image pickup device on the circuit board. It was necessary to connect according to the distance between the solder lands, and the assemblability was poor.
[0006]
In addition, when a very thin external terminal is bent behind the solid-state imaging device (CCD bare chip), the solid-state imaging device (CCD bare chip) has a joint with the external terminal on the imaging surface side. The external terminals may be damaged due to contact with the edge of the element, and the assemblability is deteriorated.
[0007]
Furthermore, in recent years, tape carrier type packages in which elements are mounted on a film-like flexible substrate may be used. This means that the substrate must be handled carefully during assembly because the substrate is flexible. Was bad.
[0008]
The present invention has been made in view of these circumstances, and it is easy to handle the solid-state imaging device during assembly, and can be easily folded without damaging the external terminals, and can be easily and reliably assembled. An object is to provide an imaging device.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, an image pickup apparatus according to the present invention includes a solid-state image pickup device having an electrical connection portion in a peripheral portion of an image area provided on a front surface, a circuit board on which electronic components are mounted, and an electric connection of the solid-state image pickup device. One end to the part But Connection Is And the other end But Connected to the circuit board Was Input / output of electrical signals between the solid-state imaging device and the circuit board I do An external terminal, and the external terminal Is Of the solid-state image sensor Said Connect to electrical connection Is Extend horizontally in the image area And then bent along the side surface of the solid-state image sensor so as to extend to the rear side of the solid-state image sensor, and the circuit board is formed with a thin portion at least partially, The circuit board is connected to the external terminal behind the solid-state image sensor so that the thin-walled portion is in close contact with the side surface of the solid-state image sensor between the side surface of the image sensor and the external terminal. ing It is characterized by that.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)
1 to 13 relate to a first embodiment of the present invention, and FIG. 1 is an explanatory view showing the overall configuration of an endoscope apparatus provided with an image pickup apparatus of the first embodiment of the present invention, FIG. 1 is a cross-sectional view of the distal end side of the insertion portion in FIG. 1, FIG. 3 is a cross-sectional view showing the image pickup apparatus according to the first embodiment of the present invention, FIG. 4 is a front view of the vicinity of the solid-state image pickup device before assembly, and FIG. FIG. 6 is a front view of the vicinity of the solid-state image sensor during assembly, FIG. 7 is a cross-sectional view of the vicinity of the solid-state image sensor of FIG. 6, and FIG. 8 is a diagram when joining the element mask to the glass lid. FIG. 9 is a front view of the vicinity of the solid-state imaging device of FIG. 8, FIG. 10 is a sectional view of the vicinity of the solid-state imaging device when the element mask is inserted into the element frame from the state of FIG. 11 is a cross-sectional view of the vicinity of the solid-state imaging device when sealing between the solid-state imaging device and the glass lid, and FIGS. 12 and 13 are diagrams. FIG. 12 is an explanatory diagram when sealing between a solid-state image sensor different from 1 and a glass lid, FIG. 12 is a front view of the vicinity of the solid-state image sensor, and FIG. 13 is a cross-sectional view of the vicinity of the solid-state image sensor of FIG. is there.
[0011]
As shown in FIG. 1, an endoscope apparatus 1 of the present embodiment includes, for example, an endoscope 2 for obtaining an observation image of a region to be examined, a light source device 3 that supplies illumination light to the endoscope 2, A video processor 4 that performs control of the endoscope 2 and signal processing of an image signal obtained by the endoscope 2, and a monitor 5 that receives the video signal output from the video processor 4 and displays an observation image. It is mainly composed.
The endoscope 2 includes a distal end portion 6 on which an illumination optical system, an observation optical system, and the like are disposed, a curved portion 7 that is connected to the distal end portion 6 and can be bent in the vertical and horizontal directions, and the curved portion 7. And a flexible insertion portion 9 composed of a flexible flexible portion 8 having flexibility, and an operation portion 10 is provided on the proximal end side of the insertion portion 9, and the operation portion 10 side is provided. A universal cord 11 having a light guide inserted therein is extended from the portion. The endoscope 2 is detachably connected to the light source device 3 via a light guide connector 11a provided at the end of the universal cord 11, and from the side of the light guide connector 11a. The video processor 4 is detachably connected via an electrical connector 12a provided at the end of the signal cable 12 that extends.
[0012]
As shown in FIG. 2, the distal end of the light guide 13 inserted into the insertion portion 9 is soldered to a through hole forming an illumination window of the rigid distal end main body 14 constituting the distal end portion 6 via a base 15. The illumination lens 16 is hermetically fixed to an illumination window that is fixed by attachment or an adhesive and has an enlarged diameter so as to face the front end surface thereof. The light guide 13 is composed of a fiber bundle in which flexible fibers are bundled, and the fiber bundle is covered with a flexible tube 17.
[0013]
The distal end main body 14 is provided with a through hole having an imaging window adjacent to the illumination window, and an imaging device 20 having a function of imaging is fixed with a screw or the like (not shown).
A signal cable (or an imaging cable) 21 that transmits a captured image (as an electrical image transmission body) 21 extends from the rear end of the imaging device 20. A plurality of the signal cables 21 are bundled and covered with a flexible protective tube 22. The signal cable 21 is inserted into the universal cord 11 from the operation unit 10 through the insertion unit 9 and connected to the electrical connector 12a.
[0014]
A first bending piece 23 is fixed to the rear end of the tip body 14 by soldering or the like, and a second bending piece 23 is rotatable to the rear end of the first bending piece 23 such as a rivet. A large number of bending pieces 23 are connected to each other in such a manner as to be connected to each other via the connecting member to form the bending portion 7. The outer peripheries of these bending pieces 23 are covered with a flexible outer skin 24 such as a rubber tube, and the front end of the outer skin 24 is also airtightly fixed to the tip end body 14.
[0015]
Illumination light emitted from a lamp (not shown) provided in the light source device 3 is inserted into the light guide connector 11a, the universal cord 11, and the operation unit 10 and the insertion unit 9 of the endoscope 2 and the light guide 13. Then, the transmitted illumination light is further emitted from the distal end surface via the illumination lens 16 to illuminate the subject side such as the affected area in front. The image of the examination site obtained by irradiation with the illumination light is captured by the imaging device 20 provided at the tip 6 and converted into an electrical signal, and then the electrical signal is transmitted to the video processor 4. After the video processor 4 generates a video signal, the video signal is transmitted to the monitor 5 to display an observation image on the monitor screen.
[0016]
Next, a detailed configuration of the imaging device 20 built in the endoscope 2 will be described with reference to FIG.
As shown in FIG. 3, the imaging device 20 includes an objective optical unit 31 that is an objective lens system and an imaging unit 32. The objective optical unit 31 includes objective lenses 33a to 33d and the objective lenses 33a to 33d. The lens frame 34 is configured to fix the 33d at a predetermined position. Between the objective lens 33c and the objective lens 33d, an optical diaphragm 36 is similarly held by the lens frame 34 with an optical position determined by annular rings 35a and 35b.
[0017]
The base end side of the outer peripheral surface of the lens frame 34 holding the objective lenses 33 a to 33 d is fitted into an element frame 38 in which a glass lid 37 constituting the image pickup unit 32 is arranged at the base end, and the element frame 38 is inserted into the element frame 38. Focus adjustment is performed while adjusting the relative position of a solid-state image pickup element 42 to be held, which will be described later, with an image area 41.
[0018]
An element mask 39 is fitted in the element frame 38, and the element mask 39 is bonded to the glass lid 37 by a bonding method described later.
[0019]
The imaging unit 32 includes a solid-state imaging element 42 provided with an image area (light receiving unit) 41 at a substantially central portion on the distal end surface side that is the objective optical unit 31 side, and a connection described later on the base end surface side of the solid-state imaging element 42. It is mainly composed of two circuit boards 44 that are bonded and fixed by a method and formed of a hard material such as ceramic on which electronic components 43a and 43b are arranged. The electronic component 43a is a bare chip IC and is electrically connected to the circuit board 44 by a ball grid array. The electronic component 43b is a chip resistor, and is an impedance matching resistor for an output signal from the solid-state image sensor 42. The electronic component 43 b is connected to the circuit board 44 together with the signal cable 21. The electronic component 43c is a chip capacitor.
[0020]
An insulating sheet 45 is sandwiched between the two circuit boards 44 to prevent contact between the electronic component 43a and the electronic components 43b and 43c. A cable connection land (not shown) is provided on the rear end surface of the same circuit board 44 on which the electronic components 43a, 43b, and 43c are mounted, and the core wires 21a of the plurality of signal cables 21 are connected thereto.
[0021]
The periphery of the solid-state imaging device 42 and the circuit board 44 is filled with a sealing agent 46 having electrical insulation and high moisture resistance, and is sealed from the outside. The outer periphery of the sealant 46 is covered with a heat-shrinkable shield tube 47. The shield tube 47 is formed by molding and shrinking the shield tube 47 after the sealing agent 46 forms and seals the periphery of the solid-state imaging device 42 and the circuit board 44, and then forms a film of a metal such as aluminum or gold on its outer surface. In addition to enhancing the electrical shielding effect, the moisture resistance inside the imaging device 20 is enhanced.
[0022]
The electrical connection part 48 of the solid-state image sensor 42 is provided in the periphery of the image area 41 of the solid-state image sensor 42, and one end of an external terminal 49 such as a flexible lead is thermocompression-bonded or attached to the electrical connection part 48. It is ultrasonically bonded and electrically connected. The glass lid 37 is bonded and fixed around the crimping portion while being sandwiched by the solid-state imaging element 42. The external terminal 49 is formed of a thin copper foil having a surface plated with gold, and is held by a tape carrier 51 such as polyimide formed so as to cover the external terminal 49 from both sides.
[0023]
In the present embodiment, the external terminal 49 is connected to the electrical connection portion 48 of the solid-state imaging device 42 and extends in the lateral direction of the image area 41, and the circuit board 44 is connected to the external terminal 49 with the solid-state imaging. The circuit board 44 is connected toward the rear side of the element 42, and the external terminal 49 is bent along the side surface of the solid-state image sensor 42 toward the rear side of the solid-state image sensor 42 so as to face the rear surface of the solid-state image sensor 42. Is configured.
[0024]
As shown in FIGS. 4 and 5, the external terminal 49 before assembling the solid-state image sensor 42 extends to a device hole 52 formed in the tape carrier 51, and the external terminal 49 is connected to the solid-state image sensor 42. It is connected to the electrical connection part 48.
[0025]
A plurality of the electrical connection portions 48 are arranged around the image area 41 of the solid-state imaging device 42, and the corresponding external terminals 49 are connected thereto.
[0026]
The glass lid 37 is placed on the front side surface of the external terminal 49 and covers the front surface of the image area 41.
The external terminal 49 connected to the electrical connection portion 48 extends in the lateral direction of the image area 41 of the solid-state image sensor 42 and is formed by removing a part of the tape carrier 51 for external connection. 53 is extended.
[0027]
6 and 7, during the assembly of the solid-state imaging device 42, when the external terminal 49 is bent to the rear side of the solid-state imaging device 42 in a later step, the circuit board 44 is accurately positioned. The circuit board 44 is connected to the external terminal 49 toward the rear side of the solid-state image sensor 42 so as to be positioned in the back direction of the solid-state image sensor 42 while being positioned.
[0028]
On the circuit board 44, when the external terminal 49 is bent to the rear side of the solid-state image sensor 42, a step portion 44 a that abuts against the side surface of the solid-state image sensor 42 is formed, and on the side surface of the solid-state image sensor 42. A thin portion 44b is provided.
[0029]
In this embodiment, in order to accurately position the circuit board 44, a positioning index 54 is printed on the tape carrier 51 on which the solid-state image sensor 42 is mounted. As the positioning index, an index may be printed on the end of the circuit board 44 so that it can be positioned together with the index 54, or a protrusion or the like is provided on a part of the external terminal 49. It may be used as an index for positioning.
[0030]
The thin portion 44b of the circuit board 44 is positioned on the side surface of the solid-state image sensor 42, so that the external terminals 49 can be prevented from contacting the solid-state image sensor 42. At this time, the circuit board 44 facing each of the external terminals 49 is provided with connection lands 55 for connecting the electric circuit mounted on the circuit board 44 and the external terminals 49.
[0031]
The plurality of external terminals 49 are collectively connected to the connection lands 55 of the circuit board 44 by ultrasonic pressure bonding or soldering. At this time, in order to facilitate the mounting of the electronic components 43a to 43b, the electronic components 43a to 43b are mounted after the circuit board 44 is connected to the external terminals 49.
[0032]
Subsequently, the tape carrier 51 and the external terminal 49 at unnecessary portions are cut off, and the circuit board 44 is connected so that the stepped portion 44a of the circuit board 44 abuts against the solid-state image sensor 42 as shown in FIG. The external terminal 49 is bent along the side surface of the solid-state image sensor 42 to the rear side (in the direction of the arrow in FIG. 7) of the solid-state image sensor 42 to position the circuit board 44 in the back direction of the solid-state image sensor 42. At this time, if the signal cable 21 is connected before the circuit board 44 is fixed, the connection work is facilitated.
[0033]
Next, the element mask 39 is bonded to the glass lid 37.
As shown in FIGS. 8 and 9, the outer shape of the glass lid 37 is a rectangle, the outer shape of the element mask 39 is a circle, and an octagonal opening 61 is formed therein. Of the light rays that pass through the objective lenses 33 a to 33 d, unnecessary light rays that cause flare and the like are blocked by the element mask 39 other than the opening 61. The element mask 39 is bonded and fixed to the image area 41 of the solid-state image sensor 42 seen through the glass lid 37 by positioning the outer shape or octagonal opening 61 of the element mask 39. That is, the solid-state image sensor 42 and the element mask 39 are fixed in an optically aligned state.
[0034]
Then, as shown in FIG. 10, the element mask 39 is fitted into the element frame 38 which is a holding member of the solid-state imaging element 42, the glass lid 37 is abutted against the rear wall portion 62 of the element frame 38, and the shaft The solid-state image sensor 42 and the element frame 38 are bonded and sealed by the sealant 46 while being locked in the direction. That is, the element mask 39 serves as a centering member between the solid-state imaging element 42 and the element frame 38.
[0035]
Conventionally, the objective lens is bonded to the glass lid 37 with an optical adhesive, but the bonded surface peels off due to moisture intrusion into the bonded surface or stress in the shear direction, and the peeled portion is reflected in the observation image of the endoscope. There was sometimes. In the present embodiment, since the objective lens is not bonded to the front surface of the glass lid 37, separation of the joint surface does not occur.
[0036]
Further, for the same reason, the joint surface between the solid-state imaging element 42 and the glass lid 37 may be peeled off. Therefore, in the present embodiment, as shown in FIG. 11, an elastic spacer 63 formed of a rubber material is sandwiched between the solid-state image sensor 42 and the glass lid 37, and then the solid-state image sensor 42 and the glass The side periphery with the lid 37 is sealed with the sealing agent 46. At this time, the sealing agent 46 is cured while pressing in the direction in which the solid-state imaging element 42 and the glass lid 37 approach each other, but an air layer corresponding to the pressure of the elastic spacer 63 exists. The pressing and sealing between the solid-state image sensor 42 and the glass lid 37 are performed by pressing a thin caulking metal fitting 64 from the side surfaces of the solid-state image sensor 42 and the glass lid 37 as shown in FIGS. It may be done by tightening.
As a result, a joint surface between the solid-state imaging element 42 and the glass lid 37 that is simply airtight and has high shear strength can be obtained.
[0037]
As described above, the electronic sheet 43a to 43c is mounted on the circuit board 44 by sandwiching the insulating sheet 45 between the two circuit boards 44, and the core wire 21a of the signal cable 21 is also formed on the circuit board 44. To the cable connection land (not shown). Then, the periphery of the solid-state image pickup element 42 and the circuit board 44 is filled with the sealing agent 46 and molded and sealed, and then covered with the shield tube 47. Next, as described above, the shield tube 47 is molded and contracted, and then a metal such as aluminum or gold is vapor deposited on the outer surface thereof.
[0038]
Even if the solid-state imaging device 42 is packaged in a tape carrier type that is difficult to handle by configuring the imaging device 20 as described above, the rigid circuit board 44 is first electrically connected and then the flexible Since the external terminal 49 is bent, the handling of the solid-state imaging device 42 in the assembling process is facilitated, the bending operation of the external terminal 49 is facilitated, and the assembly can be reliably and simplified without damaging the external terminal 49. it can. Further, since the external terminals 49 can be connected to the circuit board 44 at once, the assembly can be further simplified.
[0039]
(Second Embodiment)
14 to 19 relate to a second embodiment of the present invention, FIG. 14 is a cross-sectional view showing an image pickup apparatus of the second embodiment of the present invention, and FIG. 15 is a front view in the vicinity of a solid-state image pickup device before assembly. 16 is a cross-sectional view of the vicinity of the solid-state image sensor of FIG. 15, FIG. 17 is a cross-sectional view of the vicinity of the solid-state image sensor during assembly, and FIGS. 18 and 19 are diagrams for reinforcing the bent portion of the external terminal with a composite film. 18 is a cross-sectional view of the vicinity of the solid-state imaging device when the composite film is attached to the side surface of the bent portion of the external terminal, and FIG. 19 is a solid-state imaging when the composite film is heated from the state of FIG. It is sectional drawing of an element vicinity.
[0040]
In the second embodiment, in order to further reduce the size of the imaging apparatus, a solid-state imaging device smaller than that in the first embodiment is used, and a thin flexible circuit board is used instead of the hard circuit board 44. Use to configure. Since other configurations are the same as those of the first embodiment, description thereof will be omitted, and the same components will be described with the same reference numerals.
[0041]
That is, as shown in FIG. 14, the imaging apparatus 100 according to the second embodiment is bonded and fixed to the solid-state imaging element 101 that is smaller than the first embodiment and the base end face side of the solid-state imaging element 101. The flexible circuit board 102 is configured.
[0042]
As shown in FIGS. 15 and 16, the external terminals 49 before assembling the solid-state imaging device 101 extend into the device holes 52 of the tape carrier 51 formed from a thin polyimide or the like as in the first embodiment. One end of the external terminal 49 is connected to the electrical connection portion 48 of the solid-state image sensor 101.
[0043]
A plurality of the electrical connection portions 48 are arranged around the image area 41 of the solid-state imaging device 101, and corresponding external terminals 49 are connected to each other. In the present embodiment, all the electrical connection portions 48 are solder bumps formed at the same height.
[0044]
The glass lid 37 is placed on the front side surface of the external terminal 49 and covers the front surface of the image area 41. The external terminal 49 connected to the electrical connection portion 48 extends in the lateral direction of the image area 41 of the solid-state image sensor 101 and is formed by removing a part of the tape carrier 51 for external connection. 53 is extended.
[0045]
Then, when the external terminal 49 is bent in a later process, the rear end portion of the flexible circuit board 102 abuts against the projection-shaped index 103 provided on the external terminal 49 and is accurately positioned while being positioned. The circuit board 102 is connected to the external terminal 49 toward the rear side of the solid-state image sensor 42 so as to be positioned on the side surface of the solid-state image sensor 101 in the back direction of the element 101.
[0046]
Since a part of the flexible circuit board 102 is positioned on the side surface in the back direction of the solid-state image sensor 101, the contact of the external terminal 49 with the solid-state image sensor 101 can be prevented. At this time, the flexible circuit board 102 facing each external terminal 49 is provided with a connection land 55 for connecting the electric circuit mounted on the flexible circuit board 102 and the external terminal 49.
[0047]
In the present embodiment, the other ends of the plurality of external terminals 49 are collectively connected to the connection lands 55 of the flexible circuit board 102 by reflowing cream solder. At this time, in order to facilitate mounting of electronic components, the electronic components 43a to 43c are mounted after the flexible circuit board 102 is connected to the external terminals 49. Subsequently, unnecessary portions of the tape carrier 51 and the external terminals 49 are cut off, and the flexible circuit board 102 is positioned so that a part of the flexible circuit board 102 is located on the side surface in the back direction of the solid-state imaging device 101 as shown in FIG. The external terminal 49 connected to 102 is bent along the side surface of the solid-state image sensor 101 to the rear side (in the direction of the arrow in FIG. 16) of the solid-state image sensor 101, and to the side surface in the back direction of the solid-state image sensor 101. The circuit board 102 is positioned.
[0048]
Then, as described in the first embodiment, the element mask 39 is joined to the glass lid 37, and the core wire 21a of the signal cable 21 is directly connected to the electrodes of the electronic components 43b and 43c as shown in FIG. The electronic component 43b is a chip resistor, and the electronic component 43c is a chip capacitor.
[0049]
In the present embodiment, in order to prevent damage due to exposure of the bent portion of the thin external terminal 49, the vicinity of the external terminal 49 is covered with a composite film 110, and the external terminal 49 is bent. The part is mechanically reinforced.
[0050]
As shown in FIG. 18, after the composite film 110 formed of the thermoplastic resin film 111 and the thermosetting resin film 112 is attached to the side surface of the bent portion of the external terminal 49, the composite film 110 is heated.
[0051]
When the composite film 110 is heated, as shown in FIG. 19, the thermoplastic resin film 111 in the inner layer is melted to cover the vicinity of the external terminal 49, and the thermosetting resin film 112 in the outer package is It hardens along the terminal 49. As a result, the bent portion of the external terminal 49 is mechanically reinforced, and the joint between the glass lid 37 and the solid-state imaging device 101 is sealed. Further, the surface of the external terminal 49 is electrically insulated from the outside.
[0052]
After reinforcing the bent portion of the external terminal 49 in this way, as described in the first embodiment, the periphery of the solid-state imaging device 101 and the flexible circuit board 102 is filled with the sealing agent 46, and after molding and sealing After covering with the shield tube 47 and molding and shrinking the shield tube 47, a metal such as aluminum or gold is deposited on the outer surface in a film form.
As a result, in addition to obtaining the same effects as those of the first embodiment, the image pickup apparatus can be further downsized.
[0053]
Note that the imaging apparatus of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
[0054]
By the way, in recent years, the solid-state image sensor has been miniaturized and the number of pixels has been increased, and it has become possible to obtain a high-resolution image even with an image pickup apparatus using a very small solid-state image sensor. Since such an imaging device can obtain a high resolution image on a full screen without an electrical enlargement means such as expansion processing, it is mounted on an endoscope or the like having an elongated insertion portion. It is possible to use.
[0055]
FIG. 20 is a monitor display example of an observation image obtained by an electronic endoscope equipped with such a conventional imaging device. Conventionally, a video processor connected to the electronic endoscope displays, for example, character information 152 such as an examination date / time and a patient name along with an observation image 151 on a monitor 150 as shown in FIGS. 20 (a) and 20 (b). The However, character information 152 such as examination date / time and patient name may be displayed on the full-screen observation image 151a.
[0056]
In such a case, conventionally, the video processor has a function of outputting only the observation image 151a to the monitor without outputting the character information 152 at all. In that case, for example, if the character information 152 is not displayed at all when the observation image 151a is output to a video printer or the like, it is difficult to identify individual output images from the video printer, and the arrangement of the output images becomes complicated. It was. In the case of full screen, the observation image 151a is horizontally long, and there is a difference in the visual field range between the vertical direction and the horizontal direction of the observation image 151a, and the observation image 151a is inserted while observing a lumen like a colonoscopy. The time required for insertion may increase due to the difference in visual field range.
[0057]
Therefore, in this embodiment, a part of the image output signal obtained from the imaging device mounted on the endoscope is read by the video processor, or after reading the entire image output signal, the observation image is obtained by electrical mask processing. Processes such as partially hiding. As a result, as shown in FIGS. 21A and 21B, the character information 152 can be displayed next to the observation image 151b so as not to cover the observation image 151b. At this time, since the observation image 151b is close to a square, it is possible to display the observation image 151b so that there is no difference in the visual field range between the vertical direction and the horizontal direction.
[0058]
Alternatively, the image output signal output from the imaging device is electrically reduced and interpolated by a video processor, so that the observation image 151c is not placed beside the observation image 151c as shown in FIGS. 22 (a) and 22 (b). Thus, a display space for the character information 152 may be secured.
[0059]
[Appendix]
(Additional Item 1) A solid-state imaging device having an electrical connection part in the periphery of the image area provided on the front surface;
A circuit board on which electronic components are mounted;
One end connected to the electrical connection portion of the solid-state imaging device, and the other end connected to the circuit board, an external terminal capable of inputting and outputting electrical signals between the solid-state imaging device and the circuit board,
The external terminal is connected to the electrical connection portion of the solid-state image sensor and extends in the lateral direction of the image area, and the circuit board is connected to the external terminal toward the rear side of the solid-state image sensor. Then, the external terminal is bent along the side surface of the solid-state image sensor to the rear side of the solid-state image sensor, and the circuit board is positioned in the back direction of the solid-state image sensor.
[0060]
(Additional Item 2) The imaging apparatus according to Additional Item 1, wherein a plurality of the external terminals are collectively connected to the circuit board.
[0061]
(Additional Item 3) The external terminal is extended in the lateral direction of the image area provided on the front surface of the solid-state imaging device before the external terminal is bent to the rear side of the solid-state imaging device. Item 2. The imaging device according to Item 1.
[0062]
(Additional Item 4) The imaging device according to Additional Item 1, wherein the circuit board is a hard substrate.
[0063]
(Additional Item 5) The electronic component mounted on the circuit board is opposed when the external terminal is bent toward the rear side of the solid-state image sensor and the circuit board is positioned in the back direction of the solid-state image sensor. The imaging apparatus according to additional item 1, wherein the imaging apparatus is mounted on a surface.
[0064]
(Additional Item 6) The imaging apparatus according to Additional Item 1, wherein a thin portion is provided on at least a part of the circuit board, and the thin portion is brought into close contact with a side surface of the solid-state imaging element.
[0065]
(Additional Item 7) The imaging apparatus according to Additional Item 1, wherein a positioning index for connecting an external terminal to a part of the circuit board is provided.
[0066]
(Additional Item 8) The imaging apparatus according to Additional Item 1, wherein a positioning index for connecting the circuit board to a part of the solid-state imaging device or the external terminal is provided.
[0067]
(Additional Item 9) A centering member other than a lens element is fixed to a solid-state image sensor or a glass lid bonded to the solid-state image sensor, and the solid-state image sensor is fixed to a solid-state image sensor holding member via the centering member. An imaging device characterized by being configured as described above.
[0068]
(Additional Item 10) The imaging apparatus according to Additional Item 9, wherein the centering member is formed of a mask member that blocks unnecessary light.
[0069]
【The invention's effect】
As described above, according to the present invention, it is possible to realize an imaging apparatus that can easily handle a solid-state imaging device during assembly, can be easily folded without damaging external terminals, and can be easily and reliably assembled. .
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing an overall configuration of an endoscope apparatus including an imaging apparatus according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the distal end side of the insertion portion in FIG.
FIG. 3 is a cross-sectional view showing the imaging apparatus according to the first embodiment of the present invention.
FIG. 4 is a front view of the vicinity of a solid-state image sensor before assembly.
5 is a cross-sectional view of the vicinity of the solid-state imaging device in FIG.
FIG. 6 is a front view of the vicinity of a solid-state image sensor during assembly.
7 is a cross-sectional view of the vicinity of the solid-state imaging device in FIG.
FIG. 8 is a cross-sectional view of the vicinity of a solid-state imaging device when an element mask is bonded to a glass lid
9 is a front view of the vicinity of the solid-state imaging device in FIG.
10 is a cross-sectional view of the vicinity of a solid-state image sensor when an element mask is inserted into an element frame from the state of FIG.
FIG. 11 is a cross-sectional view of the vicinity of the solid-state image sensor when sealing between the solid-state image sensor and the glass lid;
12 and FIG. 13 are explanatory diagrams when sealing between a solid-state image sensor different from FIG. 11 and a glass lid, and FIG. 12 is a front view of the vicinity of the solid-state image sensor.
13 is a cross-sectional view of the vicinity of the solid-state imaging device in FIG.
FIG. 14 is a cross-sectional view showing an imaging apparatus according to a second embodiment of the present invention.
FIG. 15 is a front view of the vicinity of a solid-state image sensor before assembly.
16 is a cross-sectional view of the vicinity of the solid-state imaging device in FIG.
FIG. 17 is a cross-sectional view of the vicinity of a solid-state image sensor during assembly.
FIG. 18 is a cross-sectional view of the vicinity of a solid-state image sensor when a composite film is attached to a side surface of a bent portion of an external terminal.
FIG. 19 is a cross-sectional view of the vicinity of a solid-state imaging device when the composite film is heated from the state of FIG.
FIG. 20 is a monitor display example of an observation image obtained by an electronic endoscope equipped with a conventional imaging device.
FIG. 21 is a monitor display example when character information is displayed beside an observation image;
FIG. 22 is a monitor display example when a character information display space is secured beside the observation image.
[Explanation of symbols]
1 ... Endoscopic device
2 ... Endoscope
20: Imaging device
37… Glass lid
38 ... Element frame
39 ... Element mask
41 ... Image area
42 Solid-state image sensor
43a-43c ... Electronic components
44 ... Circuit board
44a ... Step
44b ... Thin part
48 ... Electric connection
49… External terminal
51 ... Tape carrier
55 ... Connection land

Claims (1)

A solid-state imaging device having an electrical connection portion in the periphery of the image area provided on the front surface;
A circuit board on which electronic components are mounted;
An external terminal for inputting and outputting electrical signals to and from said solid-state imaging device of the electric connection portion having one end connected to Rutotomoni, the other end being connected to said circuit board, said circuit board and the solid-state imaging device,
Comprising
The external terminal, said after extending in the transverse direction of the image area is connected to the electrical connecting portion of the solid-state imaging device, extends to the rear side of the solid-state imaging device along the side of the solid-state imaging device Is folded to
A thin portion is formed at least in part on the circuit board, and the thin portion is sandwiched between a side surface of the solid-state image sensor and the external terminal so that the thin-wall portion is in close contact with the side surface of the solid-state image sensor. The image pickup apparatus, wherein the circuit board is connected to the external terminal behind the solid-state image sensor .

Images