JP4537239B2 - Substrate recognition method, substrate recognition device, surface mounter, substrate inspection device, and printing machine - Google Patents

Description

  The present invention relates to a substrate recognition method, a substrate recognition device, and a surface mounter, a substrate inspection device, and a printing machine that include the substrate recognition device.

  2. Description of the Related Art Conventionally, a surface mounting machine is known in which an electronic component such as an IC is sucked from one position by a head that movably supports a component suction nozzle, and the electronic component is mounted at a predetermined position on a printed board. In such a surface mounter, as shown in FIG. 11, whether the printed circuit board P is transported from the outside to a predetermined position of the surface mounter by the transport device 300 such as a conveyor, and the printed circuit board P is transported to the predetermined position. Is detected by a sensor 310 provided below the predetermined position.

  Conventionally, an optical sensor is used as the sensor 310 (see, for example, Non-Patent Document 1). This optical sensor irradiates the printed board P with light from the light emitting element, and detects the presence or absence of the board based on the reflected light. Such an optical sensor is easy to use because it can easily detect a printed circuit board and has a simple apparatus configuration.

SUNX Co., Ltd., [online], [March 10, 2005 search], Internet <http://www.sunx.co.jp/japanese/productindex.jsp?productid=a000000>

  However, as shown in FIG. 12, in the optical sensor, when the opening H is present in the printed circuit board P, the light from the light emitting element is transmitted through the opening H, so that no reflected light is generated. As a result, there is a possibility that detection of the printed circuit board may fail. In order to prevent this, there are methods such as irradiating light from the light emitting element at an acute angle with respect to the plane of the printed circuit board, or providing a large number of light receiving elements that receive the light emitting element and the reflected light. However, in the former case, there is a possibility that the detection may fail when a slit-shaped opening exists on the printed circuit board. In the latter case, the configuration of the apparatus is complicated, the usability is deteriorated, and the cost is increased.

  Accordingly, the present invention has been made to solve the above-described problems, and includes a substrate recognition method, a substrate recognition device, a surface mounter, a substrate inspection device, and a printing machine that can recognize a substrate more reliably. The purpose is to provide.

In order to solve the problems as described above, a substrate recognition method according to the present invention includes an imaging step of capturing an image of a substrate and generating an image signal, and first determining whether or not a substrate is present based on a frequency component of the image signal. of it possesses the determination step, first determination step, a first transmission step of transmitting the frequency components in a predetermined band of the image signal, and the signal intensity of the image signal generated by the first transmitting step , characterized in that it have a second judgment step of judging whether the substrate by comparing a predetermined threshold.

In addition, another substrate recognition method according to the present invention includes an imaging step of capturing a substrate and generating an image signal, a first determination step of determining presence / absence of a substrate based on a frequency component of the image signal, and an image signal based on the frequency components, you; and a third determination step of determining the type of substrate.

  The substrate recognition method may further include a third determination step for determining the type of the substrate based on the frequency component of the image signal. The third determination step is based on a second transmission step for transmitting a plurality of predetermined band frequency components from the image signal, and a frequency component having the highest signal intensity among the plurality of predetermined band frequency components. And a fourth determination step for determining the type of the substrate.

The substrate recognition apparatus according to the present invention includes an imaging unit that captures an image of the substrate and generates an image signal, and a first determination unit that determines the presence or absence of the substrate based on a frequency component of the image signal . The determination means includes a first transmission means for transmitting a frequency in a predetermined band of the image signal, a storage means for storing a threshold value, a signal intensity of the image signal transmitted through the first transmission means, and a threshold. Comparing means for comparing the values to determine the presence / absence of the substrate is characterized.

  Another substrate recognition apparatus according to the present invention includes an imaging unit that images a substrate and generates an image signal, a first determination unit that determines the presence or absence of the substrate based on a frequency component of the image signal, And a second determination unit that determines the type of the substrate based on the frequency component of the image signal.

  The substrate recognition apparatus may further include a second determination unit that determines the type of the substrate based on the frequency component of the image signal. The second determination means is based on a second transmission means for transmitting a plurality of predetermined band frequency components from the image signal, and a frequency component having the highest signal intensity among the plurality of predetermined band frequency components. The third determining means for determining the type of the substrate may be used.

  Further, a surface mounting machine according to the present invention includes a conveying unit that conveys a substrate to a predetermined position, a substrate recognition device that images the predetermined position and recognizes the substrate, a head unit that is movably supported, In a surface mounter that includes a head that is supported by a head unit and that has a component suction nozzle and mounts a component on a substrate by the head unit, the substrate recognition device is the substrate recognition device.

  Further, the substrate inspection apparatus according to the present invention includes a transport unit that transports a substrate to a predetermined position, a substrate recognition device that captures an image of the predetermined position and recognizes the substrate, and a state of the substrate transported to the predetermined position. In the board inspection apparatus provided with the inspection means for inspecting, the board recognition apparatus is the board recognition apparatus.

  In addition, the printing machine according to the present invention includes a conveyance unit that conveys a substrate to a printing position and an inspection position, a substrate recognition device that captures an image of the printing position or the inspection position, recognizes the substrate, and a substrate conveyed to the printing position. In a printing machine comprising: a printing unit that prints a predetermined printing material through an opening formed in a screen mask; and an inspection unit that inspects a substrate printed by the printing unit and transported to an inspection position. The substrate recognition device is the substrate recognition device described above.

  According to the present invention, it is possible to more reliably recognize a substrate by imaging the substrate and recognizing the substrate based on the frequency characteristics of the image signal.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing the configuration of the surface mounter according to the present embodiment, and FIG. 2 is a side view of FIG.

  The surface mounter shown in FIGS. 1 and 2 is disposed on the base 1 along the longitudinal direction (X-axis direction) of the base 1 having a substantially rectangular shape in plan view, and conveys the printed circuit board P. A plurality of conveyors 2 provided on the bases 1 on both sides of the conveyor 2 and supplying electronic parts, and a plurality of parts provided above the base 1 and mounted with nozzles 46 for sucking parts. The head unit 44 that supports the head 45 is supported so as to be movable in the X and Y axis directions, and the head unit 4 moves the electronic components of the component supply unit 3 onto the printed circuit board P on the conveyor 2 by the head unit 44. The operation of the substrate recognition unit 5 that recognizes the printed circuit board P by the imaging device 51 provided below the conveyor 2 and the surface mounter disposed in the base 1 or at a position separated from the base 1 is controlled. And a control device 6.

Here, the board recognition unit 5, as shown in FIG. 3 (a), consisting of a digital camera or a line sensor using a solid-state image pickup element such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) imaging A device 51, a presence / absence detecting unit 52 that detects the presence / absence of a printed circuit board based on the frequency characteristics of the image signal of the imaging device 51, and a type for determining the type of the printed circuit board based on the frequency characteristics of the image signal of the imaging device 51 And a determination unit 53.

As shown in FIG. 4A, the presence / absence detection unit 52 includes an HPF (High Pass Filter) 52a that transmits a high frequency component of the image signal from the imaging device 51, and a preset output voltage of the image signal. A reference value storage unit 52b that stores a reference value, and a comparison unit 52c that compares the output voltage from the HPF 52a with the reference value stored in the reference value storage unit 52b to detect the presence or absence of a substrate.

  As shown in FIG. 5A, the type determining unit 53 includes a BPF (Band Pass Filter) 53a that passes a frequency component of a predetermined band in the image signal from the imaging device 51, and the maximum output voltage from the BPF 53a. A maximum value detection unit 53b for detecting a value and a frequency that is a center of a predetermined band extracted by the BPF 53a by inputting a shift voltage to the BPF 53a (hereinafter referred to as a center frequency) are shifted, and the output voltage from the BPF 53a is maximized. A center frequency shift unit 53c that detects a shift voltage when the output voltage from the BPF 53a becomes maximum, a characteristic storage unit 53d that stores a shift voltage for each printed circuit board, and a center frequency shift unit It is comprised from the discrimination | determination part 53e which discriminate | determines the kind of printed circuit board based on the deviation voltage which 53c detected, and the deviation voltage memorize | stored in the characteristic memory | storage part 53d.

  The control device 6 includes an axis control unit (driver) that controls driving of the servo motors of the conveyor 2 and the head mechanism 4, a storage unit that stores an operation program and various data of the surface mounter, and the transported printed circuit board P. It includes at least a main arithmetic unit that controls driving of the head mechanism 4 and the board recognition unit 5 when recognizing and mounting an electronic component on the printed circuit board P. Such a control device 6 includes an arithmetic device such as a CPU, a storage device such as a memory and an HDD (Hard Disc Drive), and an input that detects input of information from the outside such as a keyboard, a mouse, a pointing device, a button, and a touch panel. A computer or controller equipped with a display device such as a CRT (Cathode Ray Tube), LCD (Liquid Crystal Display), or FED (Field Emission Display); And programs installed on the computer or controller. That is, the hardware device and software cooperate to control the hardware resources by a program, thereby realizing an axis control unit, a storage unit, and a main calculation unit.

  Such a surface mounter operates as follows. First, the control device 6 conveys the printed circuit board from the outside to a predetermined position by the conveyor 2. At this time, the board recognition unit 5 takes an image of the predetermined position by the imaging device 51 and recognizes the presence or type of the printed board based on the image signal of the imaging device 51.

  When the substrate recognition unit 5 recognizes that the printed circuit board has been conveyed to a predetermined position of the surface mounter, the control device 6 picks up the electronic component from the component supply unit 3 by the nozzle 46 of the head unit 44, and The components are conveyed to the printed circuit board P, and the electronic components are mounted at predetermined positions on the printed circuit board P.

  Next, among the operations of the surface mounter described above, the printed circuit board presence / absence detection operation and type determination operation by the substrate recognition unit 5 will be described with reference to FIGS.

[Presence detection operation]
In the present embodiment, the imaging device 51 is set so that the focal point matches the position of the printed circuit board. Therefore, when the printed circuit board is not at a predetermined position of the surface mounter, the imaging device 51 projects farther beyond the position where the printed circuit board should be, so that the image based on the image signal of the imaging device 51 is in focus. It will not match. At this time, the image signal of the imaging device 51 has a voltage value relatively higher in the low frequency component than in the high frequency component, as shown by the dotted line in FIG. On the other hand, when the printed circuit board is at a predetermined position of the surface mounter, the imaging device 51 clearly displays the printed circuit board pattern, parts, characters, and the like. For this reason, as shown by the solid line in FIG. 3B, the image signal of the imaging device 51 is relatively higher in the higher frequency component than in the lower frequency component due to edge components such as patterns, parts, and characters. The voltage value increases. As described above, the presence / absence detection unit 52 of the substrate recognition unit 5 detects the presence / absence of the printed circuit board by utilizing the fact that the frequency characteristic of the image signal of the imaging device 51 changes depending on the presence / absence of the printed circuit board.

  First, when the imaging device 51 captures an image of the printed board based on an instruction from the control device 6, the HPF 52 a transmits a high-frequency component in the image signal of the imaging device 51 and removes a low-frequency component. Here, as shown in FIG. 4B, the HPF 52a has an output peak when a printed circuit board is present (solid line in FIG. 4B) and no printed circuit board (dotted line in FIG. 4B). Is set so as to remove a frequency component lower than the frequency f in the middle of the output peak from the image signal. Thereby, when there is a printed circuit board, a relatively large voltage value can be obtained from the HPF 52a, and when there is no printed circuit board, only a small voltage value can be obtained from the HPF 52a.

  Next, the comparison unit 52c detects the presence or absence of the printed circuit board by comparing the image signal from which the low-frequency component has been removed by the HPF 52a with the reference value stored in the reference value storage unit 52b. As described above, from the HPF 52a, a large voltage value is obtained when there is a printed circuit board, and a small voltage value is obtained when there is no printed circuit board. For this reason, the comparison unit 52c uses the reference value of the reference value storage unit 52b as a threshold value, and determines that there is a printed circuit board when the output of the HPF 52a exceeds the reference value, and when the output of the HPF 52a falls below the reference value It is determined that there is no printed circuit board. This determination result is sent to the control device 6.

  As described above, according to the present embodiment, by recognizing the printed circuit board based on the frequency component of the image signal of the imaging device 51, the presence or absence of the printed circuit board is reliably detected even when the printed circuit board has an opening or the like. It becomes possible to do.

  The setting of the high frequency component removed by the HPF 52a and the setting of the reference value are performed in advance before the operation of the surface mounter. For example, before the operation of the surface mounter, imaging may be performed by the imaging device 51 with and without the printed circuit board, and the setting may be made based on the frequency component of the image signal at this time.

  Further, an LPF (Law Pass Filter) may be used instead of the HPF 52a. In this case, when the output of the LPF exceeds the reference value, it is determined that there is no printed circuit board, and when the output of the LPF is lower than the reference value, it is determined that there is a printed circuit board.

[Type judgment operation]
The frequency component of the image signal of the imaging device 51 changes depending on the pattern, characters, components, and the like of the printed circuit board as well as the presence or absence of the printed circuit board. For this reason, in this embodiment, the type of the printed circuit board is determined by finely analyzing the frequency component of the image signal of the imaging device 51.

  First, when a printed circuit board is imaged by the imaging device 51 based on an instruction from the control device 6, the BPF 53a is centered on a frequency (center frequency) based on the shift voltage input from the center frequency shift unit 53c. A frequency component in a predetermined band is extracted from the image signal of the imaging device 51. The BPF 53a is composed of a switched capacitor or the like, and the center frequency changes based on the shift voltage input from the center frequency shift unit 53c, as shown in FIG. 5 (b).

  Next, the maximum value detection unit 53b detects the maximum value (peak) of the output voltage of the image signal from which the predetermined frequency band is extracted by the BPF 53a. This peak is sent to the center frequency shift part 53c.

  Next, when the peak of the output of the image signal is received from the maximum value detection unit 53b, the center frequency shift unit 53c changes the shift voltage input to the BPF 53a and shifts the center frequency of the BPF 53a. The BPF 53a whose center frequency has shifted again extracts a frequency component of a predetermined band based on the center frequency from the image signal. Thus, the center frequency shift unit 53c repeatedly changes the shift voltage input to the BPF 53a, thereby changing the center frequency of the BPF 53a for each predetermined frequency (for example, every 1 kHz) within a predetermined range (for example, 1 kHz to 1 MHz). The peak of the image signal at each center frequency is acquired from the maximum value detection unit 53b, and the shift voltage corresponding to the center frequency when this peak is maximum is detected. This deviation voltage is sent to the determination unit 53e.

  Next, the determination unit 53e determines the type of the printed circuit board by comparing the shift voltage acquired from the center frequency shift unit 53c with the characteristic value stored in the characteristic storage unit 53d.

  As described above, the frequency characteristic of the image signal differs in the center frequency at which the output voltage peaks for each printed circuit board due to differences in mounted components and patterns. For example, the printed circuit board A and the printed circuit board B having a more complex pattern than the printed circuit board A have the frequency characteristics of the image signal of the printed circuit board A indicated by the solid line in FIG. The characteristic is the dotted line in FIG. For this reason, the transmission range (transmission frequency range) of the BPF 53a at which the output voltage reaches a peak is the center frequency of the transmission range at which the center frequency at which the output voltage reaches a peak is a in FIG. In the transmission range indicated by the solid line in (b), in the case of the printed circuit board B in which the center frequency at which the output voltage peaks is b, the transmission range indicated by the broken line in FIG. 6B where the center frequency of the transmission range is b. It becomes. In this way, the center frequency at which the output voltage of the image signal peaks for each printed circuit board, and the type of the printed circuit board can be distinguished based on the peak center frequency. By setting the transmission range of a plurality of BPFs 53a corresponding to the type of the printed circuit board, and determining which transmission range the transmission range of the BPF 53a at which the output voltage of the image signal reaches a peak can be determined. .

  Therefore, the characteristic storage unit 53d stores in advance a shift voltage corresponding to the center frequency at which the output voltage peaks for each printed circuit board. The determination unit 53e extracts a printed circuit board having a deviation voltage that matches or approximates the deviation voltage acquired from the center frequency deviation unit 53c from the characteristic storage unit 53d, and the image pickup device 51 captures the extracted printed circuit board. The printed circuit board is determined. This determination result is sent to the control device 6.

  Thus, according to the present embodiment, since the printed circuit board is recognized based on the frequency component of the image signal of the imaging device 51, even when the printed circuit board has an opening or the like, not only the presence or absence of the printed circuit board, It is possible to determine the type of printed circuit board.

Note that the shift voltage for each printed circuit board is stored in the characteristic storage unit 53d in advance before the operation of the surface mounter. For example, before the operation of the surface mounter, all the printed circuit boards on which electronic components are mounted by this surface mounter are imaged by the imaging device 51, and the center frequency at which the output voltage peaks from the frequency component of this image signal is supported The deviation voltage to be detected may be detected.
The image signal from the imaging device 51 is stored in a storage device (not shown), and the image signal extracted from the storage device is input to the BPF 53b every time the center frequency of the BPF 53b is shifted. When a plurality of BPFs 53b having different center frequencies are arranged, the image signals from the imaging device 51 are simultaneously input to the respective BPFs 53b, and the BPFs 53b having the maximum output voltage of the image signals after passing through the respective BPFs 53b are detected. Thus, the type of the printed circuit board is determined.

  In the present embodiment, the image signal from the imaging device 51 is directly input from the imaging device 51 to the presence / absence detection unit 52 and the type determination unit 53, but via the differentiation circuit 54 shown in FIG. The presence / absence detection unit 52 and the type determination unit 53 may be input.

  When the image signal from the imaging device 51 is differentiated by the differentiating circuit 54a, the edge component in the image is enhanced, and the high frequency component is further enhanced. For example, in FIG. 7B, when the image signals indicated by the symbols a and b are differentiated by the differentiating circuit 54, the frequency characteristics indicated by the symbols c and d, respectively, are obtained. Here, since the image signal of code a originally has few high frequency components, even if differentiated, the high frequency components are not emphasized as shown by code c. On the other hand, since the image signal of the symbol b has many high frequency components, when differentiated by the differentiation circuit 54, the high frequency components are emphasized as indicated by the symbol d. Thus, by differentiating the image signal of the imaging device 51 by the differentiation circuit 54a, it becomes possible to clarify the difference in frequency components. Therefore, in particular, the presence / absence detection unit 52 can more reliably detect the presence / absence of a printed circuit board.

  Further, in the present embodiment, the image signal from the imaging device 51 is directly input from the imaging device 51 to the presence / absence detection unit 52 and the type determination unit 53, but via the analysis circuit 55 shown in FIG. The presence / absence detection unit 52 and the type determination unit 53 may be input. This case will be described below.

  The analysis circuit 55 shown in FIG. 8A includes a differentiation circuit 55a, a clipper circuit 55b, and an integration circuit 55c. Such an analysis circuit 55 differentiates the image signal of the imaging device 51 by the differentiation circuit 55a to emphasize the high frequency component, amplifies and clips the output of the differentiation circuit 55a by the clipper circuit 55b, and the integration circuit 55c. To integrate the output of the clipper circuit 55b. Thereby, the image signal of the imaging device 51 is converted into a voltage value corresponding to a high frequency component.

  For example, since the image signal indicated by the symbol a in FIG. 8B originally has few high-frequency components, even if it is differentiated by the differentiating circuit 55a, the high-frequency components are not emphasized as indicated by the symbol b. Therefore, even if the differentiated image signal of the code b is amplified and clipped by the clipper circuit 55b, a rectangular signal is hardly output as shown by the code c.

  On the other hand, since the image signal indicated by the symbol a in FIG. 8C has many high frequency components, when differentiated by the differentiating circuit 55a, the high frequency components are emphasized as indicated by the symbol b. Therefore, when the differentiated image signal of the code b is amplified and clipped by the clipper circuit 55b, a plurality of rectangular signals are output as indicated by the code c. Based on the voltage value obtained by integrating this signal by the integration circuit 55c, the presence / absence detection unit 52 and the type determination unit 53 detect the presence / absence of the printed circuit board or determine the type of the printed circuit board.

  Specifically, in the case of the presence / absence detection unit 52, the comparison unit 52c compares the DC voltage of the image signal by the analysis circuit 55 with the reference value stored in the reference value storage unit 52, thereby determining the presence / absence of the printed circuit board. Is detected.

  On the other hand, in the case of the type determination unit 53, before the operation of the surface mounter, all the printed boards on which electronic components are mounted by the surface mounter are imaged by the imaging device 51, and the above voltage is calculated from the frequency component of the image signal. A value is detected, and this voltage value is stored in the characteristic storage unit 53d instead of the shift voltage. The type determination unit 53 determines the type of the printed circuit board by the determination unit 53e comparing the voltage value stored in the characteristic storage unit 53d with the voltage value from the analysis circuit 55.

  As described above, even if the analysis circuit 55 recognizes the printed circuit board based on the DC voltage generated from the image signal of the imaging device 51, even if the printed circuit board has an opening or the like, Presence / absence and type of printed circuit board can be determined.

  Instead of the integration circuit 55c, an average value circuit for calculating the average value of the output of the clipper circuit 55b may be provided. Even in this case, the printed circuit board can be recognized from the image signal of the imaging device 51.

  In the present embodiment, as shown in FIGS. 1 and 2, the imaging device 51 images the printed circuit board P from below the printed circuit board P. However, the imaging device 51 images the printed circuit board P from above the printed circuit board P. You may make it do. In this case, if the head unit 44 is already provided with a camera for imaging an electronic component or a camera for imaging a fiducial mark of a printed circuit board, the printed circuit board P may be captured by these cameras. Further, when the head unit 44 is not provided with a camera, it can be realized by providing the imaging device 51 in the head unit 44.

  Moreover, the board | substrate recognition part 5 mentioned above can be used not only for the surface mount machine demonstrated in this Embodiment but for various apparatuses. For example, a mounting board inspection machine that inspects parts by transferring electronic parts along a predetermined path in an inspection area, an adhesive or solder printed on a printed board after moving away from the printed board It can be used for a printed circuit board inspection machine or the like for inspecting the coating state. An example of such an inspection apparatus is shown in FIG.

An inspection apparatus 100 shown in FIG. 9 is provided so as to be supported above the substrate support device 110, a substrate support device 110 that is supported so as to be movable in the Z direction, supports the printed circuit board P, a conveyor 120 that conveys the substrate support device 110, and A substrate recognition unit 5 (not shown) including an imaging device 51 supported so as to be movable in the direction and the Y direction, and a control device 6 (not shown) that controls the operation of the inspection apparatus 100.

  Such an inspection apparatus 100 conveys the printed circuit board P to be inspected from the outside to a predetermined position, and performs the inspection operation of the printed circuit board P at the predetermined position. At this time, the board recognition unit 5 of the inspection apparatus 100 images the predetermined position by the imaging apparatus 51 and recognizes the printed board P based on the image signal. When the presence / absence or type of the printed circuit board is recognized by the board recognition unit 5, the inspection apparatus 100 performs the above inspection operation. In such an inspection apparatus 100 as well, since the printed circuit board is recognized based on the frequency component of the image signal of the imaging device 51, even if the printed circuit board has an opening or the like, not only the presence of the printed circuit board but also the printed circuit board. The type can be determined.

  In the inspection apparatus 100, the imaging device 51 may be provided below the substrate support device 110.

The board recognition unit 5 described above is, for example, a print that moves a position away from the printed board, applies a printing material such as an adhesive or solder to a predetermined position of the printed board, and inspects the printed printed board. It can also be used for a printer with a substrate inspection function. The printed circuit board inspection function printing machine shown in FIG. 1 0.

Printing machine 200 shown in FIG. 1 0 includes a substrate supporting device 110 for supporting the printed circuit board P is supported movably in the Z-direction, a conveyor 120 for transporting the substrate supporting device 110 to the inspection position from the printing position, the printed circuit board The mask 130 provided above the P printing position, the squeegee 140 supported so as to be movable in the X and Z directions, and provided above the printing position and inspection position of the printed circuit board P and movable in the X and Y directions. The substrate recognition unit 5 (not shown) including the imaging device 51 supported by the printer and the control device 6 (not shown) that controls the operation of the printing press 200 are provided.

  Such a printing machine 200 conveys the printed circuit board P to be printed from the outside to a printing position, and places a mask 130 having a predetermined mask pattern opening on the printed circuit board P at the printing position. The adhesive or solder is supplied onto the mask from a nozzle (not shown), and the supplied adhesive or solder is applied to the pattern of the mask 130 with the squeegee 140, thereby printing the adhesive or solder on the printed circuit board P. To do. At this time, the board recognition unit 5 of the printing machine 200 images the printing position by the imaging device 51, and recognizes the printed board P based on the image signal. When the presence / absence or type of the printed circuit board is recognized by the board recognition unit 5, the printing machine 200 performs the printing operation as described above.

  Further, when printing is performed on the printed circuit board P, the printing machine 200 transports the printed circuit board P to the inspection position and inspects the printing state and the like. At this time, the board recognition unit 5 of the printing machine 200 images the inspection position by the imaging device 51 and recognizes the printed board P based on the image signal. When the presence / absence or type of the printed board is recognized by the board recognition unit 5, the printing machine 200 performs the above-described inspection operation.

  Also in such a printing machine 200, the printed circuit board is recognized based on the frequency component of the image signal of the imaging device 51. Therefore, even when the printed circuit board has an opening or the like, not only the presence of the printed circuit board but also the printed circuit board. The type can be determined.

  In the printing machine 200, the imaging device 51 may be provided below the substrate support device 110.

It is a top view of the surface mounting machine of the present invention. It is a side view of the surface mounting machine of this invention. (A) It is a block diagram which shows the structure of the board | substrate recognition part concerning this invention, (b) It is a figure explaining the frequency characteristic of an image signal. (A) It is a block diagram which shows the structure of a presence detection part, (b) It is a figure explaining the frequency characteristic of the image signal by the presence or absence of a printed circuit board. (A) It is a block diagram which shows the structure of a kind determination part, (b) It is a figure explaining the relationship between a center frequency and a deviation voltage. (A) It is a figure explaining the frequency characteristic of the image signal by the kind of printed circuit board, (b) It is a figure explaining the permeation | transmission range of BPF. It is a block diagram which shows the structure of the board | substrate recognition part which has a differentiation circuit, (b) It is a figure explaining the frequency characteristic of the differentiated image signal. (A) A block diagram showing a configuration of an analysis circuit, (b) a diagram for explaining a processing result by an analysis circuit for an image signal with few high frequency components, (c) an analysis circuit for an image signal with many high frequency components It is a figure explaining the processing result by. It is a schematic diagram which shows the structure of an inspection apparatus. It is a schematic diagram which shows the structure of a printing machine. It is a figure explaining the detection operation of the printed circuit board by the conventional surface mounter. It is a figure explaining the detection operation of the printed circuit board P by an optical sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Conveyor, 3 ... Component supply part, 4 ... Head mechanism, 5 ... Board | substrate recognition part, 6 ... Control apparatus, 44 ... Head unit, 45 ... Head, 46 ... Nozzle, 51 ... Imaging apparatus, 52 ... Presence / absence detection unit, 52a ... HPF, 52b ... reference value storage unit, 52c ... comparison unit, 53 ... type determination unit, 53a ... BPF, 53b ... maximum value detection unit, 53c ... center frequency shift unit, 53d ... characteristic storage 53e ... discriminator 54 ... differentiation circuit 55 ... analysis circuit 55a ... differentiation circuit 55b ... clipper circuit 55c ... integration circuit 100 ... inspection device 110 ... substrate support device 120 ... conveyor 130 ... mask 140 ... squeegee, 200 ... printing machine.

Claims (11)

An imaging step of imaging a substrate and generating an image signal;
Based on the frequency component of the image signal, it possesses a first judgment step of judging whether the substrate,
The first determination step includes
A first transmission step for transmitting a frequency component of a predetermined band of the image signal;
A second determination step of determining the presence or absence of the substrate by comparing the signal intensity of the image signal generated by the first transmission step with a preset threshold value;
Substrate recognition method, characterized by have a. An imaging step of imaging a substrate and generating an image signal;
A first determination step of determining the presence or absence of the substrate based on the frequency component of the image signal;
On the basis of the frequency component of the image signal, the third determination step and the board recognition how to, comprising determining a type of the substrate. On the basis of the frequency component of the image signal, the substrate recognition method of claim 1 Symbol placement, characterized by further comprising a third determination step of determining the type of the substrate. The third determination step includes
A second transmission step of transmitting a plurality of predetermined frequency components from the image signal;
Among the frequency components of said plurality of predetermined bandwidth, highest signal strength based on the high frequency components, according to claim 2 or 3, wherein further comprising a fourth determination step of determining a type of the substrate Substrate recognition method. Imaging means for imaging a substrate and generating an image signal;
First determination means for determining the presence or absence of the substrate based on the frequency component of the image signal ,
The first determination means includes
First transmission means for transmitting a frequency of a predetermined band of the image signal;
Storage means for storing the threshold value;
Comparing means for comparing the signal intensity of the image signal transmitted through the first transmitting means and the threshold value to determine the presence or absence of the substrate;
Substrate recognition apparatus according to claim Rukoto consists. Imaging means for imaging a substrate and generating an image signal;
First determination means for determining the presence or absence of the substrate based on the frequency component of the image signal;
Second determination means for determining a type of the substrate based on a frequency component of the image signal;
Board recognition device comprising the. On the basis of the frequency component of the image signal, further claim 5 Symbol mounting substrate recognition apparatus characterized by comprising a second judging means for judging a type of the substrate. The second determination means includes
A second transmission means for transmitting a plurality of frequency components of a predetermined band from the image signal;
Wherein the plurality of frequency components in a predetermined band, based on the highest signal strength is high frequency components, according to claim 6 or 7, characterized in that it is composed of a third determination means for determining a type of the substrate The board | substrate recognition apparatus of description. Transport means for transporting the substrate to a predetermined position;
A substrate recognition device that images the predetermined position and recognizes the substrate;
A head unit movably supported;
In a surface mounter that is supported by the head unit and has a nozzle having a component suction nozzle, and mounts the component on the substrate by the head unit.
The surface mounter, wherein the substrate recognition device is the substrate recognition device according to any one of claims 5 to 8. Transport means for transporting the substrate to a predetermined position;
A substrate recognition device that images the predetermined position and recognizes the substrate;
A substrate inspection apparatus comprising: inspection means for inspecting a state of the substrate transported to the predetermined position;
The substrate recognition apparatus according to claim 5, wherein the substrate recognition apparatus is the substrate recognition apparatus according to claim 5. Conveying means for conveying the substrate to the printing position and the inspection position;
A board recognition device that images the printing position or the inspection position and recognizes the board;
Printing means for printing a predetermined printing material on the substrate transported to the printing position through an opening formed in a screen mask;
In a printing machine comprising: inspection means for inspecting the substrate printed by the printing means and transported to the inspection position;
The printing machine, wherein the substrate recognition device is the substrate recognition device according to any one of claims 5 to 8.

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