JP4570719B2 - Semiconductor sorting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wafer prober, and more particularly to a technique for grasping and sorting potential defects in advance, and is effective in, for example, sorting non-defective products and defective products for pellet groups in a wafer in a semiconductor device manufacturing process. Technology.
[0002]
[Prior art]
In the semiconductor device manufacturing process, as a semiconductor sorting device that sorts and inspects non-defective and defective products for wafer pellets, probing wafer probers, probe needle pellets, and test communications between integrated circuits built in pellets and testers In addition, the calculation and printing of the total number of non-defective and defective products as test results and the printing thereof, and the interruption of the inspection and the alarm when defective products occur continuously in the probe are automatically performed. There are some which perform marking with a non-defective / defective marker that is configured and a test result.
[0003]
An example of a wafer prober is “Electronic Materials Separate Volume 1984 VLSI Manufacturing / Test Equipment Guidebook” published on November 15, 1983, P195-P198, published by Industrial Research Institute, Inc.
[0004]
[Problems to be solved by the invention]
In such a semiconductor sorting apparatus, when defective products occur frequently on the wafer surface or when a local defect distribution occurs, potential defects are inherent in the peripheral pellets of defective products. Alternatively, there is a problem that the sorting result is very limited and the sorting result may be a non-defective product.
[0005]
An object of the present invention is to provide a semiconductor sorting apparatus capable of sorting out potential defects (including pellets that are just the limit of sorting standards and later become defective).
[0006]
[Means for solving the problems]
In order to solve the above-described problems and achieve the object, the first sorting result pellet and the first sorting result are obtained from the position coordinate data of the pellet in the wafer and the sorting result data of the pellet corresponding to the position coordinate data. Mark the pellet of the second sorting result around the resulting pellet.
[0007]
According to this, the first sorting results by marking the pellets of the second sorting result of the peripheral portion of the pellet with said first sorting result pellets potential is bad in the second sorting results The pellet can be marked.
[0008]
Further, from the position coordinate data of the pellets in the wafer and the sorting result data of the pellets corresponding to the position coordinate data, the pellets in which the pellets of the first sorting result exist in an island shape, and the pellets of the first sorting result Is marked on the pellets of the second sorting result adjacent to the pellets present in the form of islands.
[0009]
According to this, by the first sorting result pellets marking pellets of the second sorting result adjacent to the pellets present in an island shape, the pellets of the second sorting result is a potential failure Can be marked.
[0010]
Further, the second sorting surrounded by the first sorting result pellet and the first sorting result pellet from the position coordinate data of the pellet in the wafer and the sorting result data of the pellet corresponding to the position coordinate data. Mark the resulting pellet.
[0011]
According to this, by marking the first sorting result pellet and the second sorting result pellet surrounded by the first sorting result pellet, the potential first sorting result pellet is marked. be able to.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Exemplary embodiments of a semiconductor sorting apparatus according to the present invention will be explained below in detail with reference to the accompanying drawings.
[0013]
【Example】
The present invention stores pellet coordinate information and non-defective / defective product information as information on each pellet in the wafer surface in an electrical storage device such as a floppy disk or a hard disk of another computer via a network during inspection of electrical characteristics of a semiconductor device. Further, marking is performed at the end of measurement of one wafer or at the end of lot measurement.
[0014]
In FIG. 4, a wafer 6 is set on the stage unit 7 of the prober apparatus, and each pellet in the wafer 6 is subjected to a sorting inspection by the IC inspection apparatus 2 using a probe card provided with contacts 4, 5. A data file 9 is obtained in which the coordinates corresponding to and the sorting inspection result are acquired, and a file is generated by converting the data so that the periphery of the defective pellet becomes defective according to a certain rule. The marking device 12 including the Y coordinate control unit 16 and the mark unit 13 is configured to mark a defective peripheral pellet on the wafer 14 based on a certain rule. Then, the wafer 6 is placed on the stage unit 7, and the pellets are measured in order by the connected IC inspection device 2, and data obtained as a result of measurement corresponding to the wafer pellet coordinates (X, Y) is created.
[0015]
FIG. 1 is a view showing a wafer map by a semiconductor sorting apparatus according to an embodiment of the present invention. For example, the measurement result P is the pellet 20 at the coordinates (B, e) on the wafer, the measurement result P is the pellet 21 at the coordinates (C, c) , and the measurement result 2 is the pellet 22 at the coordinates (C, d ). to get the data to the measurement order, to create a data file 9 of contents Unaryo of Figure 3.
[0016]
The data file 9 describes types of sorting results such as non-defective and defective with respect to the X and Y coordinates of the pellet. Next, a method for making a pellet around a defective pellet defective will be described. When a particular defective items in electrical characteristic test of the wafer occurs, (24 in Fig. 1) coordinates (D, j) focused on defective pellets 23, the defective item pellet near coordinate +1 pellets or bad The coordinate data of the data file 9 is converted so that the pellet of the peripheral coordinates +2 of the pellet (25 in FIG. 1) becomes defective. Marking data is created by using a program that automatically converts the coordinates of all the specific defective item pellets. The number of defects plus the defect coordinates can be changed according to the degree of defect distribution.
[0017]
In addition, as shown in FIG. 2, the data file is marked by the marking device 12 to mark the periphery of the defect uniformly regardless of the shape of the defect distribution 27 , such as the pellet 26 marking the periphery of the continuous defective pellet. I can do it.
[0018]
【The invention's effect】
In the present invention, after a wafer electrical characteristic test, when a defect distribution is generated in the wafer surface, a defective product on the wafer is marked as defective on the wafer for defective peripheral pellets of specific measurement failure items. Reduction is possible.
[Brief description of the drawings]
FIG. 1 is a diagram of a wafer map by a semiconductor sorting apparatus according to an embodiment of the present invention.
FIG. 2 is a wafer map in which a defect mark is formed around a defective pellet by the semiconductor sorting apparatus according to the embodiment of the present invention.
FIG. 3 is a table showing a data structure of marking data by the semiconductor sorting apparatus according to the embodiment of the present invention.
FIG. 4 is a first schematic diagram of a semiconductor sorting apparatus according to an embodiment of the present invention.
FIG. 5 is a second schematic diagram of the semiconductor sorting apparatus according to the embodiment of the present invention.
FIG. 6 is a schematic view of a conventional semiconductor sorting apparatus.
[Explanation of symbols]
1, 28 Prober device 2, 29 IC inspection device 3, 30 Probe card 4, 5, 31, 32 Contactor 6, 14, 33 Wafer 7, 15, 35 Stage unit 8 XY coordinate control unit 9, 17 Data file
10, 18 XY coordinate data
11 Measurement result data
12 Marking equipment
13 Marking part
16 XY coordinate control unit,
19 Pellet measurement result data
20 Measurement result P (B, e) Coordinated non- defective pellet
21 measurements Ru P der (C, c) the coordinates of the non-defective pellets
22 Defective product pellet of (C, d) coordinates that is measurement result 2
23 (D, j) Coordinate defective pellet
24 Pellet with defective coordinates around the defective pellet (+1)
25 Pellet with defective coordinates around defective pellet (+2)
26 Pellet with marking around the continuous defective pellet
27 Distribution of defective continuous defects
34 Ink mark section

Claims (3)

A semiconductor sorting apparatus for marking pellets in the surface of a semiconductor wafer, wherein a pellet located around a first defective pellet having a specific defective item selected by an electrical property inspection is a defect of the first defective pellet. Based on the item information, there is provided means for automatically converting the measurement result by the electrical characteristic inspection so as to be regarded as the second defective pellet on the data file and using the result as marking data. A semiconductor sorting apparatus characterized by that. The pellet located around the first defective pellets, on the basis of the first defect entry information of the defective pellet, the electrical characteristics test measurement result by the even on the data file to a non-defective of the second defective 2. The semiconductor sorting apparatus according to claim 1, wherein the size of the region to be converted so as to be regarded as a pellet is variable in units of pellets. 3. The semiconductor sorting apparatus according to claim 1, wherein defective marking is performed on the second defective pellet. 4.

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